CN107121886A - 3D imaging electronicses - Google Patents
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- CN107121886A CN107121886A CN201710468846.1A CN201710468846A CN107121886A CN 107121886 A CN107121886 A CN 107121886A CN 201710468846 A CN201710468846 A CN 201710468846A CN 107121886 A CN107121886 A CN 107121886A
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- 238000003384 imaging method Methods 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 10
- 238000005259 measurement Methods 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 6
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- -1 circuit board Substances 0.000 description 2
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B35/00—Stereoscopic photography
- G03B35/08—Stereoscopic photography by simultaneous recording
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
- G03B15/02—Illuminating scene
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/56—Accessories
- G03B17/561—Support related camera accessories
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The present embodiments relate to field of photoelectric technology, there is provided a kind of 3D imaging electronicses and its manufacture method.3D imaging electronicses include：Module is projected, for objective emission light beam；First imaging modules, the image of lower target is irradiated for obtaining by the light beam；Mainboard, is provided with perforate, is respectively used to place the projection module and first imaging modules；Processor, is placed on the mainboard, and is connected with the projection module and the first imaging modules, the depth image for calculating target according to described image；Support member, is connected with the mainboard and covers the perforate, for supporting the projection module and first imaging modules.The 3D imaging electronicses are by way of perforate and install imaging modules and projection module, and the integrated level of equipment is higher, and volume is smaller.
Description
Technical field
It is to be related to a kind of 3D imaging electronicses and its manufacturer more specifically the invention belongs to field of photoelectric technology
Method.
Background technology
The depth information that depth camera can obtain target realizes 3D scannings, scene modeling, gesture interaction whereby, and current
The RGB camera being widely used is compared, and depth camera is just progressively paid attention to by all trades and professions.For example utilize depth camera and electricity
Somatic sensation television game can be realized depending on combinations such as, computers to reach light in effect that game and body-building is two-in-one, the KINECT of Microsoft, ratio difficult to understand
ASTRA be representative therein.In addition, the tango projects of Google are directed to bringing depth camera into mobile device, such as flat board,
Mobile phone, the usage experience overturned completely is brought with this, such as can realize very real AR game experiencings, it can be used to enter
The functions such as row indoor map is created, navigation.
Intelligent electronic device such as mobile phone, flat board etc. have increasingly urgent demand to the built-in 3D depth cameras being imaged, with
Depth camera it is just quick at present towards volume is less and less, power consumption increasingly lower direction develop, depth camera is as built-in
Component is increasingly becoming possibility so as to be embedded into other electronic equipments.However, due to electronic equipment to outward appearance, volume it is continuous
Pursue, design, installation to its built-in component etc. also bring huge challenge, and component is not required nothing more than has small body
Product, while being laid out between also requiring that each component rationally optimal to realize enough.
The content of the invention
The present invention will propose a kind of compact, small volume 3D imaging depths camera and 3D imaging electronicses.
To achieve the above object, a kind of 3D imaging electronicses are provided according to one embodiment of present invention, including for
To the projection module of objective emission light beam；The first imaging modules for obtaining the image that lower target is irradiated by the light beam；If
The mainboard of perforate is equipped with, the perforate is used to place the projection module and first imaging modules；For according to described
Image calculates the processor of the depth image of target, the processor be placed on the mainboard and with the projection module and the
One imaging modules are connected；And, the support member for supporting the projection module and first imaging modules, the support member
It is connected with the mainboard and covers the perforate.
In certain embodiments, the equipment also includes the second imaging modules, and second imaging modules are placed on institute
In the perforate for stating mainboard.First imaging modules can also be connected with second imaging modules, be placed on same
In perforate.
In certain embodiments, the support member is electro-magnetic shielding cover, or the device with heat sinking function.
According to one embodiment of present invention, a kind of manufacture method of 3D imaging electronicses is additionally provided, including：There is provided
The mainboard of perforate is provided with, projection module and the first imaging modules are placed individually into the corresponding aperture of the mainboard, will
Processor is placed on the mainboard, and support member is connected with the mainboard and the perforate is covered.Wherein, the projection module
For to objective emission light beam, first imaging modules to be used to obtain by the image of the target under light beam irradiation, described
Processor is used for the depth image that target is calculated according to described image, and the support member is used to support the projection module and described
First imaging modules.
3D imaging electronicses provided in an embodiment of the present invention have the advantages that compared with prior art：The 3D into
As electronic equipment by by the mainboard perforate in electronic equipment, will be placed into for the module that 3D is imaged in corresponding perforate, and
Support member is set in bottom, acted on for supporting, being electromagnetically shielded and radiate etc..Compared with the prior art, implementation of the invention
Example small volume and with higher electromagnetic shielding and heat dispersion.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
In required for the accompanying drawing that uses be briefly described, it should be apparent that, drawings in the following description are only some of the present invention
Embodiment, for those of ordinary skill in the art, without having to pay creative labor, can also be according to these
Accompanying drawing obtains other accompanying drawings.
Fig. 1 is depth camera front schematic view.
Fig. 2 is depth camera structural section schematic diagram.
Fig. 3 is the depth camera structural section schematic diagram according to one embodiment of the invention.
Fig. 4 is the depth camera structural section schematic diagram according to one embodiment of the invention.
Fig. 5 is the depth camera structural section schematic diagram according to another embodiment of the invention.
Fig. 6 is the mobile phone schematic diagram with depth camera.
Fig. 7 is the front schematic view of the mobile phone build-in depths camera according to one embodiment of the present of invention.
Embodiment
In order that technical problem to be solved of the embodiment of the present invention, technical scheme and beneficial effect are more clearly understood,
Below in conjunction with drawings and Examples, the present invention will be described in further detail.It should be appreciated that specific implementation described herein
Example is not intended to limit the present invention only to explain the present invention.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or it is connected on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.In addition, connection can be to be used to fix
Effect can also be used for circuit communication effect.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System, is for only for ease of the description embodiment of the present invention and simplifies description, rather than indicate or imply that the device or element of meaning must
There must be specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include one or more this feature.In the description of the embodiment of the present invention, " multiple " are meant that two or two
More than individual, unless otherwise specifically defined.
The present invention is directed to the depth camera for being used for 3D imagings or the electronic equipment that embedded in depth camera module, it is proposed that
Overall compact organization plan and structure installation method.Organization plan and method proposed by the invention has been applicable all types of
It will be set in depth camera or electronic equipment, discussion below with the electronics of the depth camera based on structured light technique and its correlation
It is standby to be illustrated inventive concept.
The depth camera front schematic view based on structure light shown in Fig. 1.Depth camera 1 includes being used for the projection that 3D is imaged
Module 13 and corresponding imaging modules 11, wherein projection module 13 is used for projective structure light pattern, imaging modules 11 into space
Then it is used to gather by the structured light patterns after target modulation, carrying out analysis calculating by the structured light patterns to modulation obtains target
Depth image, analysis here calculates general by the application specific processor in depth camera（Not shown in figure）To complete.Typically
Ground, projection module 13 is used to project black light pattern, such as infrared light, accordingly, imaging modules 11 should also be infrared phase
Machine, in certain embodiments, structured light patterns can also be the light of other any wavelength, such as ultraviolet, visible ray etc..
There are certain spacing, referred to herein as baseline between imaging modules 11 and projection module 13.For structure optical depth phase
For machine, the measurement range and precision of the length meeting influence depth camera of baseline, usually baseline is longer, and measurement range is bigger；
In addition, for same measurement distance, baseline is longer, and measurement accuracy is then higher.But when base length, it is desirable to the chi of depth camera
It is very little also bigger, cause to be difficult to be embedded into some miniature electronic equipments, therefore the selection of baseline should be to depth camera chi
Very little, measurement range, precision etc. are many to be considered.For consumer level depth camera, the distance of baseline is suitable
It is between interval 1cm ~ 10cm.
In order to allow depth camera 1 to possess more functions, usually, color camera mould is also configured with depth camera 1
Illustrated in group, such as RGB camera module 12, explanation later by taking RGB camera module as an example.It is configured with RGB camera
The depth camera 1 of module 12 then has the synchronous ability for obtaining target depth image and RGB image.Due to imaging modules 11
Exist between RGB camera module 12 and certainly existed between a certain distance, therefore the depth image and RGB image obtained respectively
Certain parallax.In some applications, it may be desirable to which what is utilized is depth image and RGB image without parallax, i.e. RGBD images.For
This, generally requires to demarcate imaging modules 11 and RGB camera module 12 to obtain relative position relation therebetween, root
Parallax can be then eliminated according to calibration result, this process is often also referred to as registering.Imaging modules 11 and RGB camera module 12 it
Between distance it is smaller, parallax also just it is smaller, registering difficulty can be reduced, therefore, often RGB camera module 12 can it is relatively close into
As module 11 some, as shown in Figure 1.
In other embodiments, other modules in addition to RGB modules can also be configured, such as in the another of projection module 13
Side is equally also provided with one and the identical module of imaging modules 11, i.e. three is on same baseline, but two imaging modules difference
Positioned at both sides, the 3D imaging devices of active binocular structure light principle are thus constituted.In one embodiment, two imaging moulds
Parallax range between group 11 and projection module 13 is different, it is possible thereby to meet the application needs of different measurement ranges, such as when
During far measuring distance, it can be measured using the longer imaging modules 11 of baseline with projection module 13；Or open simultaneously
Two imaging modules 11, but depth survey is carried out respectively, finally give two depth images are merged to be measured
The bigger depth image of scope, resolution ratio.It is understood that when measurement distance is different, lens in imaging modules 11
Focal length is also differed.
Depth camera structural section schematic diagram shown in Fig. 2.When depth camera is as independent electronics, typically also gather around
There is shell（Not shown in figure）, part exposed in depth camera is packaged, and when depth camera is used as embedded equipment
When, shell can not be needed in certain embodiments.From figure 2 it can be seen that depth camera includes imaging modules 11, RGB phases
Machine module 12, projection module 13, support 21, mainboard 22 and other components 23.Imaging modules 11（RGB camera module 12）One
As include base 117（127）, imaging sensor 112（122）, microscope base 111（121）, lens 114（124）And window 115
（126）, typically also have cutoff filter 123 in RGB camera module in addition, for preventing the infrared composition in light 126
Image quality is adversely affected.Had any different between imaging sensor 112 and imaging sensor 122, wherein imaging modules 11
Imaging sensor 112 in each Pixel surface there is the limitation of corresponding wavelength to pass through optical filter, such as infrared imaging module
Imaging sensor possess infrared by optical filter, only allow the infrared light 116 of specific wavelength to pass through；And RGB camera module
The Pixel surface of imaging sensor 122 then typically have Baeyer optical filter, after white light 126 shines in, by Baeyer optical filter
It will be received after the light filtering of three kinds of colors of red, green, blue in white light by imaging sensor.
Projection module 13 generally comprises base 137, light source 132, lens 134, diffraction optical element DOE135 and microscope base
131, its operation principle is, light source 132, which is sent, to pass through after light beam is collimated by lens 134 from DOE135 to external diffusion, wherein DOE135
Effect be that the light beam for sending light source 132 becomes structure light light beam 136, a kind of embodiment light source 132 be single laser light
Source, such as edge emitting LASER Light Source, DOE135 are expanded the single beam that single source is sent, and become thousands of sub-lights
Beam, and beamlet formation random speckle pattern, the corresponding light beam of random speckle pattern here is structure light.In another reality
Apply in example, light source can also be multiple light courcess, such as VCSEL light source array, DOE is expanded the multiple beam of VCSEL light source array
Beam, the pattern ultimately formed can regard as by the corresponding pattern of multiple VCSEL light source arrays through it is multiple replicate and be filled into whole
In the individual visual field.
Base 117 in module（127、137）It can be made up of materials such as circuit board, metals, or by circuit board, metal
Formed Deng combination of materials.In certain embodiments, base can also be made up of semi-conducting material.
Support 21 is used to fix each module, to ensure that each module physically has relatively stable position relationship,
Other support 21 can also play a part of radiating.Support 21 can be made up of materials such as plastics, metal, ceramics.Only show in figure
Provide to meaning property the shape of support, actual upper bracket 21 should have multiple answers the hole of module, for radiating and connecting for stationary phase
The structure connect.
Mainboard 22 is typically connected with support, arranges other components 23 on mainboard 22, such as application specific processor, resistance,
The electronic components such as electric capacity, circuit is also arranged in mainboard 22 to be used to connect module and component, to ensure depth camera
To realize its function.Mainboard 22 is generally printing board PCB, or flexible PCB FPC, or is soft or hard combination
Plate etc..Connection between component 23 and mainboard 22, which is generally, to be welded to connect, general in succession between mainboard 22, module and support
Connected for glue or bolt etc..
Knowable to depth camera structure as shown in Figure 2, in a thickness direction（Refer to longitudinal direction in Fig. 2）Have respectively module,
Support, mainboard, component etc. so that depth camera possesses larger thickness, so that it is slim to cause depth camera to be difficult to integrate into
In electronic equipment.
Shown in Fig. 3 is depth camera structural section schematic diagram according to an embodiment of the invention, each module and member
Device is connected with mainboard, compared with the structure in Fig. 2, and mainboard 22 is applied not only to circuit and connects fixed effect of also having got up.
Mainboard 22 is by perforate at the position of module, and module is placed in hole, and also has the support member for being used for supporting module in the other end
31, support member 31 is also connected with mainboard 22 simultaneously.Support member 31 can be made up of materials such as plastics, metal, ceramics.Support member 31
Connection with module and mainboard includes the connection such as glue, welding, bolt.In one embodiment, support member 31 is metal material,
Also act the thermolysis to module；In one embodiment, support member 31 is radome, for shielding the electromagnetism to module
Interference；In one embodiment, support member 31 can be other structures part, such as set when depth camera is presented to other electronics
When standby middle, support member 31 can be the miscellaneous part in electronic equipment.Compared with Fig. 2, other components 23 in Fig. 3 can divide
Cloth can also be distributed in opposite side compared with Fig. 2 in the both sides of mainboard.
In structure shown in Fig. 3, due to each module being fixed with mainboard 22, and the shape by perforating in the motherboard
Formula, therefore reduce the thickness of depth camera；On the other hand, by setting support member that module is fixed, speckle or electromagnetism
Shielding so that still have while depth camera possesses smaller volume and preferably radiate and firm performance.
Depth camera shown in Fig. 3 is during fabrication, it is necessary first to provide the mainboard, projection module and imaging mould of perforate
Projection module and imaging modules, are then placed into perforate and are connected with mainboard by group；Finally by support member and mainboard and mould
Group connection.It is understood that the order of connection can be adjusted according to actual technique.
Fig. 4 is depth camera structural section schematic diagram in accordance with another embodiment of the present invention.With the structure phase shown in Fig. 3
Form a module than, imaging modules 11 and RGB camera module 12, such as current double cameras, double cameras relative to
Two independent modules, volume is smaller, and is easier to install, and the distance between two modules are smaller in double cameras in addition, match somebody with somebody
Brigadier is more accurate.
Fig. 5 is the depth camera structural section schematic diagram according to another embodiment of the invention.Compared with Fig. 3,4, this
Depth camera integrated level in scheme is higher.Each module is no longer to be connected in independent component form with mainboard 22, but
Become one with mainboard 22.From structure, the base 117 of module（127、137）Directly it is connected with mainboard, microscope base 111
（121、131）It is attached thereto in the other end of mainboard.Here structure is in addition to compacter in structure, its preparation method
It is otherwise varied with foregoing several structures.The making of depth camera mainly has following steps in the present embodiment.
S1：Mainboard with mounting hole site is provided.I.e. according to the module installation site and the size of module of design, in master
Carry out around perforate, hole being needed that some mechanisms can also be set according to follow-up connection on plate, such as threaded connection
Bolt hole and locating dowel for positioning etc..
S2：Base and light source are provided（Or imaging sensor）.Base and light source or imaging sensor are connected in this step
One is connected into order to subsequent installation.
S3：Microscope base and lens are provided.Lens, DOE, window etc. are installed in microscope base in this step.A kind of embodiment
In, the connection between lens and microscope base is is threadedly coupled, in order to subsequently be focused.
S4：Base and microscope base are connected with mainboard successively, to complete the manufacture to depth camera.
Only it is the manufacture to single module and mainboard in the step of above, it is similar actually due to each modular structure
Property, when multiple modules are installed with mainboard can synchronously carry out each step of the above.It is understood that in depth camera
It is the structure in the present embodiment that can also only have indivedual modules, and other modules can also be Fig. 3, the structure shown in 4.This is main
Depending on the product maturity of different modules.Such as imaging modules 11 and RGB camera module 12, due to both products
Through highly developed, its thickness is also smaller, thus in order to improve manufacture efficiency, can be pacified with the structure shown in Fig. 3 or Fig. 4
Dress；And for projection module 13, due to product and immature, and volume is larger, thus the structure shown in Fig. 5 can be taken to carry out
Make.
In embodiment above illustrated with the structure of depth camera, in fact, depth camera will be increasingly
Many components as electronic equipment, such as mobile phone, computer, flat board, TV etc., actually depth camera are also a kind of in itself
Electronic equipment, to cause electronic equipment that there is 3D imaging capabilities.Structure and manufacture method in the various embodiments described above can also be by
In integrated morphology with depth camera in the electronic device.Illustrated below by taking mobile phone as an example.
Fig. 6 is the mobile phone schematic diagram with depth camera.Mobile phone 5 includes shell 51, screen 52, each module of depth camera
11st, 12,13, also include battery 54 and mainboard 53 in interior of mobile phone in addition.Here, depth camera is being arranged on acquisition mobile phone just
The image of Area Objects, therefore preposition depth camera is, in some embodiments, it is also possible to be rearmounted form.In this structure,
Each module of depth camera is separated with the mainboard in mobile phone, and depth camera is integrated in mobile phone as independent component
In, depth camera here can be the structure in the embodiment shown in Fig. 2 ~ Fig. 5.But this structure is unsatisfactory, works as depth
When degree camera is placed in mobile phone as independent component, then need specially to set fixing device that it is fixed, this
It is due to that requirement of the depth camera to stability is higher than general camera, and mobile phone then belongs to and easily falls article.When mobile phone is fallen
When, if depth camera is not fixed well, there is relative position between module and deviate, then can influence depth measurement essence
Degree.
Shown in Fig. 7 is the front schematic view of mobile phone build-in depths camera according to an embodiment of the invention.This knot
Structure is similar with the structure shown in Fig. 3 ~ Fig. 5, and only mainboard 53 is cell phone mainboard, and the mainboard shown in Fig. 3 ~ Fig. 5 is depth phase
Mainboard 22.In the present embodiment, each module of one side depth camera is fixed on mainboard, and structure is compacter firm；
On the other hand, each component 23 on depth camera, such as application specific processor can also be placed directly on cell phone mainboard, even
The function of application specific processor can be performed by the processor of other on cell phone mainboard, it is possible thereby to the quantity of component is reduced,
So that overall electronic equipment is more integrated, power consumption can also be reduced.It is understood that illustrated here by taking mobile phone as an example,
This scheme can be used in any other electronic equipment.
Claims (10)
1.3D imaging electronicses, it is characterised in that including：
Module is projected, for objective emission light beam；
First imaging modules, the image of lower target is irradiated for obtaining by the light beam；
Mainboard, is provided with perforate, for placing the projection module and first imaging modules；
Processor, is placed on the mainboard, and is connected with the projection module and the first imaging modules, for according to the figure
Depth image as calculating target；
Support member, is connected with the mainboard and covers the perforate, for supporting the projection module and the first imaging mould
Group.
2. 3D imaging electronicses as claimed in claim 1, it is characterised in that also including the second imaging modules, described second
Imaging modules are placed in the perforate of the mainboard.
3. 3D imaging electronicses as claimed in claim 2, it is characterised in that first imaging modules with it is described the second one-tenth
As module is connected, it is placed in same perforate.
4. 3D imaging electronicses as claimed in claim 1, the support member includes electro-magnetic shielding cover.
5. 3D imaging electronicses as claimed in claim 1, the support member is the device with heat sinking function.
The manufacture method of 6.3D imaging electronicses, it is characterised in that methods described includes：
Mainboard is provided, the mainboard is provided with perforate；
Projection module and the first imaging modules are placed individually into the corresponding aperture of the mainboard；
Processor is placed on the mainboard；
Support member is connected with the mainboard and the perforate is covered；
Wherein：
The projection module is used for objective emission light beam；
First imaging modules are used to obtain by the image of the target under light beam irradiation；
The processor is used for the depth image that target is calculated according to described image；
The support member is used to support the projection module and first imaging modules.
7. manufacture method as claimed in claim 6, it is characterised in that also include：
In the corresponding aperture that second imaging modules are placed into the mainboard.
8. manufacture method as claimed in claim 7, it is characterised in that first imaging modules and second imaging modules
It is connected, is placed in same perforate.
9. manufacture method as claimed in claim 6, it is characterised in that the support member is electro-magnetic shielding cover.
10. manufacture method as claimed in claim 6, the support member is the device with heat sinking function.
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| CN201710468846.1A CN107121886A (en) | 2017-06-20 | 2017-06-20 | 3D imaging electronicses |
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| CN201710468846.1A CN107121886A (en) | 2017-06-20 | 2017-06-20 | 3D imaging electronicses |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107682689A (en) * | 2017-09-29 | 2018-02-09 | 舜宇光学（浙江）研究院有限公司 | 3 D scanning system based on structure light |
| CN108614364A (en) * | 2018-04-10 | 2018-10-02 | Oppo广东移动通信有限公司 | Laser projection module, camera assembly and terminal |
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