CN107390461A - 3D is imaged submodule group and its electronic equipment - Google Patents
3D is imaged submodule group and its electronic equipment Download PDFInfo
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- CN107390461A CN107390461A CN201710468721.9A CN201710468721A CN107390461A CN 107390461 A CN107390461 A CN 107390461A CN 201710468721 A CN201710468721 A CN 201710468721A CN 107390461 A CN107390461 A CN 107390461A
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- mainboard
- light beam
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/142—Adjusting of projection optics
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/48—Details of cameras or camera bodies; Accessories therefor adapted for combination with other photographic or optical apparatus
- G03B17/54—Details of cameras or camera bodies; Accessories therefor adapted for combination with other photographic or optical apparatus with projector
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The present embodiments relate to field of photoelectric technology, there is provided a kind of 3D imaging submodule groups and its manufacture method and the electronic equipment based on 3D imaging submodule groups.3D imagings submodule group includes：For cloth circuits and it is provided with the mainboard of perforate；It is connected with the mainboard and covers the base of the perforate；For launching or receiving the light beam correlator of light beam, the light beam correlator is installed on the base；The microscope base of optical element is provided with, is connected with the mainboard and covers the perforate.The 3D is imaged submodule group by directly connecting different devices on mainboard, compact-sized, and 3D imaging electronicses small volume, integrated level based on this 3D imaging submodule groups are high.
Description
Technical field
The invention belongs to field of photoelectric technology, is to be related to a kind of 3D imaging submodule groups and manufacture method more specifically, with
And the electronic equipment based on 3D imaging submodule groups.
Background technology
The depth information that depth camera can obtain target realizes 3D scannings, scene modeling, gesture interaction whereby, and current
The RGB camera being widely used is compared, and depth camera is just progressively paid attention to by all trades and professions.Such as utilize depth camera and electricity
Somatic sensation television game can be realized depending on combinations such as, computers to reach the two-in-one effect of game and body-building, light in the KINECT of Microsoft, ratio difficult to understand
ASTRA be representative therein.In addition, the tango projects of Google are directed to bringing depth camera into mobile device, as flat board,
Mobile phone, the usage experience overturned completely is brought with this, for example very real AR game experiencings can be realized, can entered using it
The functions such as row indoor map creates, navigation.
Intelligent electronic device such as mobile phone, flat board etc. have increasingly urgent demand to the built-in 3D depth cameras being imaged, with
Depth camera at present just quickly towards the direction that volume is less and less, power consumption is increasingly lower developing, built in depth camera conduct
Component is increasingly becoming possibility so as to be embedded into other electronic equipments.However, due to electronic equipment to outward appearance, volume it is continuous
Pursue, design, installation to its built-in component etc. also bring huge challenge, and not requiring nothing more than component has small body
Product, while also require to be laid out between each component rationally optimal to realize enough.
The content of the invention
The present invention proposes the 3D imaging electronicses of a kind of compact-sized module and the basic module.
To achieve the above object, a kind of 3D imagings submodule group is provided according to one embodiment of present invention, including for cloth
Circuits and the mainboard for being provided with perforate；It is connected with the mainboard and covers the base of the perforate；For launching or receiving light
The light beam correlator of beam, the light beam correlator are installed on the base；And it is connected with the mainboard and described in covering
The microscope base of perforate, optical element is provided with the microscope base.
In certain embodiments, the base includes semi-conducting material base.
In certain embodiments, the light beam correlator includes imaging sensor or light source, and described image sensor is used for
Light beam is received, the light source is used to launch light beam.When the light beam correlator is imaging sensor, the optical element includes
Lens；When the light beam correlator is light source, the optical element includes DOE.
According to one embodiment of present invention, a kind of manufacture method of 3D imagings submodule group is additionally provided, including：Master is provided
Plate, the mainboard are used for cloth circuits and are provided with perforate；Base is provided and light beam correlator, the light beam correlator are mounted
On the base, for launching or receiving light beam；Microscope base is provided, optical element is provided with the microscope base；By the base
It is connected with the mainboard and covers the perforate；The microscope base is connected with the mainboard and covers the perforate.
According to one embodiment of present invention, a kind of 3D imaging electronicses are additionally provided, including：Project module and extremely
The structure of few imaging modules, at least one projection module and imaging modules and the 3D described in claim 1 ~ 4 into
As sub- modular structure is identical.
In certain embodiments, the projection module shares same mainboard with the imaging modules.
3D imaging submodule groups provided in an embodiment of the present invention and its electronic equipment have following beneficial compared with prior art
Effect：
The 3D imaging electronicses by mainboard perforate, and by the equipment in module with mainboard by being directly connected, so as to reduce mould
The volume of group.In addition in the electronic device carry out module it is integrated when, module directly be connected with the mainboard in electronic equipment, collection
Into degree height, small volume.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
In the required accompanying drawing used be briefly described, it should be apparent that, drawings in the following description be only the present invention some
Embodiment, for those of ordinary skill in the art, without having to pay creative labor, can also be according to these
Accompanying drawing obtains other accompanying drawings.
Fig. 1 is depth camera front schematic view.
Fig. 2 is depth camera structural section schematic diagram.
Fig. 3 is the depth camera structural section schematic diagram according to one embodiment of the invention.
Fig. 4 is the depth camera structural section schematic diagram according to one embodiment of the invention.
Fig. 5 is the depth camera structural section schematic diagram according to another embodiment of the invention.
Fig. 6 is the mobile phone schematic diagram with depth camera.
Fig. 7 is the front schematic view according to the mobile phone build-in depths camera of one embodiment of the present of invention.
Embodiment
In order that technical problem to be solved of the embodiment of the present invention, technical scheme and beneficial effect are more clearly understood,
Below in conjunction with drawings and Examples, the present invention will be described in further detail.It should be appreciated that specific implementation described herein
Example is not intended to limit the present invention only to explain the present invention.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or it is connected on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.In addition, connection can be used to fix
Effect can also be used to circuit communication act on.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System, it is for only for ease of and describes the embodiment of the present invention and simplify description, rather than the device or element of instruction or hint meaning must
There must be specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the embodiment of the present invention, " multiple " are meant that two or two
More than individual, unless otherwise specifically defined.
The present invention is directed to the depth camera for being used for 3D imagings or the electronic equipment that embedded in depth camera module, it is proposed that
Overall compact organization plan and structure installation method.Organization plan and method proposed by the invention has been applicable all types of
Depth camera or electronic equipment, it will be set with the electronics of the depth camera based on structured light technique and its correlation in discussion below
It is standby to be illustrated inventive concept.
The depth camera front schematic view based on structure light shown in Fig. 1.Depth camera 1 includes being used for the projection of 3D imagings
Module 13 and corresponding imaging modules 11, wherein projection module 13 is used for projective structure light pattern, imaging modules 11 into space
Then it is used to gather by the structured light patterns after target modulation, acquisition target is calculated by the way that the structured light patterns of modulation are carried out with analysis
Depth image, here analysis calculate typically by the application specific processor in depth camera（Not shown in figure）To complete.Typically
Ground, projection module 13 are used to project black light pattern, such as infrared light, and accordingly, imaging modules 11 should also be infrared phase
Machine, in certain embodiments, structured light patterns can also be the light of other any wavelength, such as ultraviolet, visible ray etc..
There are certain spacing, referred to herein as baseline between imaging modules 11 and projection module 13.For structure optical depth phase
For machine, the measurement range and precision of the length meeting influence depth camera of baseline, usually baseline is longer, and measurement range is bigger；
In addition, for same measurement distance, baseline is longer, and measurement accuracy is then higher.But when base length, it is desirable to the chi of depth camera
It is very little also bigger, cause to be difficult to be embedded into some miniature electronic equipments, therefore the selection of baseline should be to depth camera chi
Very little, measurement range, precision etc. are many to be considered.For consumer level depth camera, the distance of baseline is suitable
It is between the 1cm ~ 10cm of section.
In order to allow depth camera 1 to possess more functions, usually, color camera mould is also configured with depth camera 1
Group, such as RGB camera module 12, illustrated by taking RGB camera module as an example in explanation later.It is configured with RGB camera
The depth camera 1 of module 12 then has the synchronous ability for obtaining target depth image and RGB image.Due to imaging modules 11
A certain distance between RGB camera module 12 be present, therefore certainly existed between the depth image and RGB image obtained respectively
Certain parallax.In some applications, it may be desirable to what is utilized is the depth image and RGB image of no parallax, i.e. RGBD images.For
This, generally requires to demarcate imaging modules 11 and RGB camera module 12 to obtain relative position relation therebetween, root
Parallax can be then eliminated according to calibration result, this process is often also referred to as registering.Imaging modules 11 and RGB camera module 12 it
Between distance it is smaller, parallax also just it is smaller, registering difficulty can reduce, therefore, often RGB camera module 12 can it is relatively close into
As module 11 some, as shown in Figure 1.
In other embodiments, other modules in addition to RGB modules can also be configured, such as in the another of projection module 13
Side is equally also provided with one and the identical module of imaging modules 11, i.e. three is on same baseline, but two imaging modules difference
Positioned at both sides, the 3D imaging devices of active binocular structure light principle are thus constituted.In one embodiment, two imaging moulds
Parallax range between group 11 and projection module 13 is different, it is possible thereby to meet the needs of applying of different measurement ranges, such as when
During far measuring distance, it can be measured using the longer imaging modules 11 of baseline with projection module 13；Or open simultaneously
Two imaging modules 11, but depth survey is carried out respectively, finally give two depth images are merged to be measured
The bigger depth image of scope, resolution ratio.It is understood that when measurement distance difference, lens in imaging modules 11
Focal length also differs.
Depth camera structural section schematic diagram shown in Fig. 2.When depth camera is as independent electronics, typically also gather around
There is shell（Not shown in figure）, part exposed in depth camera is packaged, and when depth camera is as embedded equipment
When, shell can not be needed in certain embodiments.From figure 2 it can be seen that depth camera includes imaging modules 11, RGB phases
Machine module 12, projection module 13, support 21, mainboard 22 and other components 23.Imaging modules 11（RGB camera module 12）One
As include base 117（127）, imaging sensor 112（122）, microscope base 111（121）, lens 114（124）And window 115
（126）, typically also have cutoff filter 123 in RGB camera module in addition, for preventing the infrared composition in light 126
Image quality is adversely affected.Had any different between imaging sensor 112 and imaging sensor 122, wherein imaging modules 11
Imaging sensor 112 in each Pixel surface there is the limitation of corresponding wavelength to pass through optical filter, such as infrared imaging module
Imaging sensor possess infrared by optical filter, only allow the infrared light 116 of specific wavelength to pass through；And RGB camera module
The Pixel surface of imaging sensor 122 then typically have Baeyer optical filter, after white light 126 shines in, by Baeyer optical filter
It will be received after the light filtering of three kinds of colors of red, green, blue in white light by imaging sensor.
Projection module 13 generally comprises base 137, light source 132, lens 134, diffraction optical element DOE135 and microscope base
131, its operation principle is, light source 132, which is sent, to pass through after light beam is collimated by lens 134 from DOE135 to external diffusion, wherein DOE135
Effect be that the light beam that light source 132 is sent is become into structure light light beam 136, be single laser light in a kind of embodiment light source 132
Source, such as edge emitting LASER Light Source, the single beam that DOE135 sends single source are expanded, and become thousands of individual sub-lights
Beam, and beamlet forms random speckle pattern, light beam corresponding to random speckle pattern here is structure light.Another real
Apply in example, light source can also be multiple light courcess, for example VCSEL light source array, DOE are expanded the multiple beam of VCSEL light source array
Beam, the pattern ultimately formed can regard as corresponding to multiple VCSEL light source arrays pattern as and replicate and be filled into whole through multiple
In the individual visual field.
Base 117 in module（127、137）It can be made up of materials such as circuit board, metals, or by circuit board, metal
Formed Deng combination of materials.In certain embodiments, base can also be made up of semi-conducting material.
Support 21 is used to fix each module, to ensure that each module physically has relatively stable position relationship,
Other support 21 can also play a part of radiating.Support 21 can be made up of materials such as plastics, metal, ceramics.Only show in figure
Provide to meaning property the shape of support, actual upper bracket 21 should have multiple answers the hole of module, for radiating and connecting for stationary phase
The structure connect.
Mainboard 22 is typically connected with support, arranges other components 23 on mainboard 22, for example, application specific processor, resistance,
The electronic components such as electric capacity, circuit is also arranged in mainboard 22 and is used to connect module and component, to ensure depth camera
To realize its function.Mainboard 22 is generally printing board PCB, or flexible PCB FPC, or be soft or hard combination
Plate etc..Connection between component 23 and mainboard 22 is generally welded to connect, general in succession between mainboard 22, module and support
Connected for glue or bolt etc..
Knowable to depth camera structure as shown in Figure 2, in a thickness direction（Refer to longitudinal direction in Fig. 2）Have respectively module,
Support, mainboard, component etc. so that depth camera possesses larger thickness, slim so as to cause depth camera to be difficult to integrate into
In electronic equipment.
Shown in Fig. 3 is depth camera structural section schematic diagram according to an embodiment of the invention, each module and member
Device is connected with mainboard, and compared with the structure in Fig. 2, mainboard 22 is applied not only to circuit and connects fixed effect of also having got up.
The opening position mainboard 22 of module is placed in hole by perforate, module, and also has the support member for being used for supporting module in the other end
31, support member 31 is also connected with mainboard 22 simultaneously.Support member 31 can be made up of materials such as plastics, metal, ceramics.Support member 31
Connection with module and mainboard includes the connection such as glue, welding, bolt.In one embodiment, support member 31 is metal material,
Also act the thermolysis to module；In one embodiment, support member 31 is radome, for shielding the electromagnetism to module
Interference；In one embodiment, support member 31 can be other structures part, for example be set when depth camera is presented to other electronics
When standby middle, support member 31 can be the miscellaneous part in electronic equipment.Compared with Fig. 2, other components 23 in Fig. 3 can divide
Cloth can also be distributed in opposite side compared with Fig. 2 in the both sides of mainboard.
In structure shown in Fig. 3, due to each module being fixed with mainboard 22, and the shape by perforating in the motherboard
Formula, therefore reduce the thickness of depth camera；On the other hand, by setting support member that module is fixed, speckle or electromagnetism
Shielding so that still have the performance for preferably radiating and consolidating while depth camera possesses smaller volume.
Depth camera shown in Fig. 3 is during fabrication, it is necessary first to provides the mainboard, projection module and imaging mould of perforate
Group, then projection module and imaging modules are placed into perforate and are connected with mainboard；Finally by support member and mainboard and mould
Group connection.It is understood that the order of connection can be adjusted according to the technique of reality.
Fig. 4 is depth camera structural section schematic diagram in accordance with another embodiment of the present invention.With the structure phase shown in Fig. 3
Form a module, such as current double cameras than, imaging modules 11 and RGB camera module 12, double cameras relative to
Two independent modules, volume is smaller, and is easier to install, and the distance between two modules are smaller in double cameras in addition, match somebody with somebody
Brigadier is more accurate.
Fig. 5 is the depth camera structural section schematic diagram according to another embodiment of the invention.Compared with Fig. 3,4, this
Depth camera integrated level in scheme is higher.Each module is no longer to be connected in the form of independent component with mainboard 22, but
Become one with mainboard 22.From structure, the base 117 of module（127、137）Directly it is connected with mainboard, microscope base 111
（121、131）It is attached thereto in the other end of mainboard.Here structure is in addition to compacter in structure, its preparation method
It is otherwise varied with foregoing several structures.The making of depth camera mainly has following steps in the present embodiment.
S1：Mainboard with mounting hole site is provided.I.e. according to the module installation site of design and the size of module, in master
Perforate is carried out on plate, is needed that some mechanisms can also be set according to follow-up connection around hole, such as threaded connection
Bolt hole and locating dowel for positioning etc..
S2：Base and light source are provided（Or imaging sensor）.Base and light source or imaging sensor are connected in this step
One is connected into order to subsequent installation.
S3：Microscope base and lens are provided.Lens, DOE, window etc. are installed in microscope base in this step.A kind of embodiment
In, the connection between lens and microscope base is is threadedly coupled, in order to subsequently be focused.
S4：Base and microscope base are connected with mainboard successively, to complete the manufacture to depth camera.
Only it is the manufacture to single module and mainboard in the step of above, it is similar actually due to each modular structure
Property, it can synchronously carry out each step of the above when multiple modules and mainboard are installed.It is understood that in depth camera
It is the structure in the present embodiment that can also only have indivedual modules, and other modules can also be Fig. 3, the structure shown in 4.This is main
Product maturity depending on different modules.Such as imaging modules 11 and RGB camera module 12, due to both products
Through highly developed, its thickness is also smaller, thus in order to improve manufacture efficiency, can be pacified with the structure shown in Fig. 3 or Fig. 4
Dress；And for projecting module 13, due to product and immature, and volume is larger, thus the structure shown in Fig. 5 can be taken to carry out
Make.
In embodiment above illustrated with the structure of depth camera, in fact, depth camera will be increasingly
More turns into electronic equipment, such as the component of mobile phone, computer, flat board, TV etc., and actually depth camera is also a kind of in itself
Electronic equipment, to cause electronic equipment that there is 3D imaging capabilities.Structure and manufacture method in the various embodiments described above can also be by
In integrated morphology with depth camera in the electronic device.Illustrated below by taking mobile phone as an example.
Fig. 6 is the mobile phone schematic diagram with depth camera.Mobile phone 5 includes shell 51, screen 52, each module of depth camera
11st, 12,13, also include battery 54 and mainboard 53 in interior of mobile phone in addition.Here, depth camera, which is arranged on, is obtaining mobile phone just
The image of Area Objects, therefore preposition depth camera is, in some embodiments, it is also possible to be rearmounted form.In this structure,
Each module of depth camera is separated with the mainboard in mobile phone, and depth camera is integrated in mobile phone as independent component
In, depth camera here can be the structure in the embodiment shown in Fig. 2 ~ Fig. 5.But this structure is unsatisfactory, works as depth
When degree camera is placed in mobile phone as independent component, then need specially to set fixing device that it is fixed, this
It is due to that requirement of the depth camera to stability is higher than general camera, and mobile phone then belongs to and easily falls article.When mobile phone is fallen
When, if depth camera is not fixed well, relative position between module be present and deviate, then can influence depth measurement essence
Degree.
Shown in Fig. 7 is the front schematic view of mobile phone build-in depths camera according to an embodiment of the invention.This knot
Structure is similar with the structure shown in Fig. 3 ~ Fig. 5, and only mainboard 53 is cell phone mainboard, and the mainboard shown in Fig. 3 ~ Fig. 5 is depth phase
Mainboard 22.In the present embodiment, each module of one side depth camera is fixed on mainboard, and structure is compacter firm；
On the other hand, each component 23 on depth camera, such as application specific processor can also be placed directly on cell phone mainboard, even
The function of application specific processor can be performed by the processor of other on cell phone mainboard, it is possible thereby to the quantity of component is reduced,
So that overall electronic equipment is more integrated, power consumption can also reduce.It is understood that illustrated here by taking mobile phone as an example,
This scheme can be used in any other electronic equipment.
Claims (10)
1.3D is imaged submodule group, it is characterised in that including：
Mainboard, for cloth circuits, and it is provided with perforate；
Base, it is connected with the mainboard, and covers the perforate；
Light beam correlator, the light beam correlator is installed on the base, for launching or receiving light beam；
Microscope base, it is connected with the mainboard, and covers the perforate, optical element is provided with the microscope base.
2. 3D as claimed in claim 1 is imaged submodule group, it is characterised in that the base includes semi-conducting material base.
3. 3D as claimed in claim 1 is imaged submodule group, it is characterised in that the light beam correlator include imaging sensor or
Light source, described image sensor are used to receive light beam, and the light source is used to launch light beam.
4. 3D as claimed in claim 3 is imaged submodule group, it is characterised in that when the light beam correlator is imaging sensor
When, the optical element includes lens；When the light beam correlator is light source, the optical element includes DOE.
5. a kind of manufacture method of 3D imagings submodule group, it is characterised in that methods described includes：
Mainboard is provided, the mainboard is used for cloth circuits and is provided with perforate；
Base and light beam correlator are provided, the light beam correlator is installed on the base, for launching or receiving light beam；
Microscope base is provided, optical element is provided with the microscope base；
The base is connected with the mainboard and covers the perforate；
The microscope base is connected with the mainboard and covers the perforate.
6. manufacture method as claimed in claim 5, it is characterised in that the base includes semi-conducting material base.
7. manufacture method as claimed in claim 5, it is characterised in that the light beam correlator includes imaging sensor or light
Source, described image sensor are used to receive light beam, and the light source is used to launch light beam.
8. manufacture method as claimed in claim 7, it is characterised in that when the light beam correlator is imaging sensor, institute
Stating optical element includes lens；When the light beam correlator is light source, the optical element includes DOE.
A kind of 9. 3D imaging electronicses, it is characterised in that including：
Project the structure and right of module and at least one imaging modules, at least one projection module and imaging modules
It is required that the sub- modular structure of 3D imagings described in 1 ~ 4 is identical.
10. equipment as claimed in claim 9, it is characterised in that the projection module shares same with the imaging modules
Mainboard.
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| CN201710468721.9A CN107390461A (en) | 2017-06-20 | 2017-06-20 | 3D is imaged submodule group and its electronic equipment |
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| CN108319034A (en) * | 2018-02-27 | 2018-07-24 | 广东欧珀移动通信有限公司 | Laser projection module, depth camera and electronic device |
| CN108681094A (en) * | 2018-03-12 | 2018-10-19 | 广东欧珀移动通信有限公司 | Laser projection module, depth camera and electronic device |
| CN108681726A (en) * | 2018-06-26 | 2018-10-19 | 深圳阜时科技有限公司 | 3D chip modules, identity recognition device and electronic equipment |
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| CN109714507A (en) * | 2018-12-27 | 2019-05-03 | 深圳阜时科技有限公司 | A kind of imaging device and equipment |
| CN109756722A (en) * | 2018-12-27 | 2019-05-14 | 深圳阜时科技有限公司 | A kind of imaging device and equipment |
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| CN110519421A (en) * | 2019-08-09 | 2019-11-29 | Oppo广东移动通信有限公司 | Terminal |
| WO2021026829A1 (en) * | 2019-08-14 | 2021-02-18 | Oppo广东移动通信有限公司 | Light transmitting module, light receiving module, depth camera, and electronic device |
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| CN108319034A (en) * | 2018-02-27 | 2018-07-24 | 广东欧珀移动通信有限公司 | Laser projection module, depth camera and electronic device |
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| CN108681726B (en) * | 2018-06-26 | 2024-01-02 | 深圳阜时科技有限公司 | 3D chip module, identity recognition device and electronic equipment |
| CN109547767A (en) * | 2018-12-27 | 2019-03-29 | 深圳阜时科技有限公司 | A kind of imaging device and equipment |
| CN109714507A (en) * | 2018-12-27 | 2019-05-03 | 深圳阜时科技有限公司 | A kind of imaging device and equipment |
| CN109756722A (en) * | 2018-12-27 | 2019-05-14 | 深圳阜时科技有限公司 | A kind of imaging device and equipment |
| CN110519421A (en) * | 2019-08-09 | 2019-11-29 | Oppo广东移动通信有限公司 | Terminal |
| WO2021026829A1 (en) * | 2019-08-14 | 2021-02-18 | Oppo广东移动通信有限公司 | Light transmitting module, light receiving module, depth camera, and electronic device |
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