WO2021026829A1 - Light transmitting module, light receiving module, depth camera, and electronic device - Google Patents

Light transmitting module, light receiving module, depth camera, and electronic device Download PDF

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Publication number
WO2021026829A1
WO2021026829A1 PCT/CN2019/100633 CN2019100633W WO2021026829A1 WO 2021026829 A1 WO2021026829 A1 WO 2021026829A1 CN 2019100633 W CN2019100633 W CN 2019100633W WO 2021026829 A1 WO2021026829 A1 WO 2021026829A1
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WO
WIPO (PCT)
Prior art keywords
light
diffuser
light source
signal
depth camera
Prior art date
Application number
PCT/CN2019/100633
Other languages
French (fr)
Chinese (zh)
Inventor
刘福
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Priority to CN201980097964.3A priority Critical patent/CN114096884A/en
Priority to PCT/CN2019/100633 priority patent/WO2021026829A1/en
Publication of WO2021026829A1 publication Critical patent/WO2021026829A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/88Lidar systems specially adapted for specific applications
    • G01S17/89Lidar systems specially adapted for specific applications for mapping or imaging
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00Projectors or projection-type viewers; Accessories therefor
    • G03B21/14Details

Definitions

  • This application relates to the field of three-dimensional imaging technology, in particular to a light emitting module, a light receiving module, a depth camera and an electronic device.
  • Time of Flight (TOF) depth cameras have been widely used in electronic devices such as mobile phones, so that the electronic devices have the function of acquiring three-dimensional information of objects.
  • the time-of-flight depth camera can calculate the depth information of the measured object by calculating the time difference between the time when the light emitting module emits the light signal and the time when the light receiving module receives the light signal.
  • the embodiments of the present application provide a light emitting module, a light receiving module, a depth camera, and electronic equipment.
  • the light emitting module of the embodiment of the present application includes a light source and a diffuser.
  • the light source is used to emit an optical signal, and the wavelength of the optical signal is 1350 nm to 1550 nm.
  • the diffuser is used to diffuse the optical signal.
  • the light receiving module of the embodiment of the present application includes a lens assembly and a photosensitive element.
  • the photosensitive element is used to receive only the optical signal passing through the lens assembly and having a wavelength range of 1350 nm to 1550 nm.
  • the depth camera of the embodiment of the present application includes a light emitting module and a light receiving module.
  • the light emitting module includes a light source and a diffuser.
  • the light source is used to emit an optical signal, and the wavelength of the optical signal is 1350 nm to 1550 nm.
  • the diffuser is used to diffuse the optical signal.
  • the light receiving module includes a lens assembly and a photosensitive element. The photosensitive element is used to receive only the optical signal passing through the lens assembly and having a wavelength range of 1350 nm to 1550 nm.
  • the electronic device of the embodiment of the present application includes a casing and a depth camera.
  • the depth camera includes a light emitting module and a light receiving module.
  • the light emitting module includes a light source and a diffuser.
  • the light source is used to emit an optical signal, and the wavelength of the optical signal is 1350 nm to 1550 nm.
  • the diffuser is used to diffuse the optical signal.
  • the light receiving module includes a lens assembly and a photosensitive element.
  • the photosensitive element is used to receive only the optical signal passing through the lens assembly and having a wavelength range of 1350 nm to 1550 nm.
  • the light emitting module, light receiving module, depth camera, and electronic device of the embodiments of the present application use a light source that can emit light signals with a wavelength of 1350 nm to 1550 nm, and a photosensitive element that can only receive light signals with a wavelength of 1350 nm to 1550 nm. Since there is almost no background light signal with a wavelength of 1350nm-1550nm in the ambient light, the influence of the background light signal on the calculation of the moment when the light receiving module receives the light signal is avoided, and the acquisition accuracy of depth information can be further improved.
  • FIG. 1 is a schematic diagram of a plan structure of an electronic device according to an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a three-dimensional assembly of a depth camera according to an embodiment of the present application
  • FIG. 3 is a schematic diagram of a plane assembly of a depth camera according to an embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of the depth camera shown in FIG. 3 along the line IV-IV;
  • FIG. 5 is a schematic diagram of a plane assembly of a depth camera according to an embodiment of the present application.
  • 6 and 7 are three-dimensional exploded schematic diagrams of the depth camera according to the embodiment of the present application.
  • FIGS. 8 and 9 are three-dimensional exploded schematic diagrams of the cushion assembly and the light emitting module of the depth camera according to the embodiment of the present application;
  • FIG. 10 is a schematic diagram of a planar structure of a light receiving module according to some embodiments of the present application.
  • FIG. 11 is a schematic structural diagram of a diffuser of a light receiving module according to some embodiments of the present application.
  • FIG. 12 is a schematic diagram of the power of the optical signal output by the light emitting module according to some embodiments of the present application.
  • Electronic device 1000 case 200, front 201, back 202, visible light camera 300, display 400, depth camera 100, substrate 10, flexible circuit board 11, reinforcing plate 12, spacer component 20, spacer 21, first Surface 211, second surface 212, conductive hole 213, thermal hole 214, conductive member 22, heat conductive member 23, light emitting module 30, light source 31, bracket 32, installation space 321, light outlet 322, diffuser 33, light incident Surface 331, light-emitting surface 332, non-coated area 333, coated area 334, light detector 34, glue 35, high reflective film 36, filter film 37, light receiving module 40, lens barrel 41, light entrance 411, photosensitive Element 42, lens assembly 43, filter 44, housing 50, first housing cavity 51, second housing cavity 52, mounting groove 53, first sub-housing 54, light opening 541, second sub-housing 55 , Connector 60, Processor 70.
  • the “on” or “under” of the first feature on the second feature may be in direct contact with the first and second features, or indirectly through an intermediary. contact.
  • the "above”, “above” and “above” of the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or it only means that the level of the first feature is higher than the second feature.
  • the “below”, “below” and “below” of the second feature of the first feature may mean that the first feature is directly below or obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
  • the light emitting module 30 includes a light source 31 and a diffuser 33.
  • the light source 31 is used to emit an optical signal, wherein the wavelength of the optical signal is 1350 nm to 1550 nm.
  • the diffuser 33 is used to diffuse the light signal emitted by the light source 31.
  • the light receiving module 40 includes a lens assembly 43 and a photosensitive element 42.
  • the photosensitive element 42 is used for receiving only the optical signal passing through the lens assembly 43 and having a wavelength range of 1350 nm to 1550 nm.
  • the depth camera 100 includes a light emitting module 30 and a light receiving module 40.
  • the light emitting module 30 includes a light source 31 and a diffuser 33.
  • the light source 31 is used to emit an optical signal, wherein the wavelength of the optical signal is 1350 nm to 1550 nm.
  • the diffuser 33 is used to diffuse the light signal emitted by the light source 31.
  • the light receiving module 40 includes a lens assembly 43 and a photosensitive element 42.
  • the photosensitive element 42 is used for receiving only the optical signal passing through the lens assembly 43 and having a wavelength range of 1350 nm to 1550 nm.
  • the present application also provides an electronic device 1000.
  • the electronic device 1000 includes a housing 200 and a depth camera 100.
  • the depth camera 100 includes a light emitting module 30 and a light receiving module 40.
  • the light emitting module 30 includes a light source 31 and a diffuser 33.
  • the light source 31 is used to emit an optical signal, wherein the wavelength of the optical signal is 1350 nm to 1550 nm.
  • the diffuser 33 is used to diffuse the light signal emitted by the light source 31.
  • the light receiving module 40 includes a lens assembly 43 and a photosensitive element 42.
  • the photosensitive element 42 is used for receiving only the optical signal passing through the lens assembly 43 and having a wavelength range of 1350 nm to 1550 nm.
  • the wavelength band of the light signal emitted by the light emitting module is usually 850 nm or 940 nm. In the ambient light, there are more light with wavelengths of 850nm or 940nm.
  • the light receiving module will also receive light with a wavelength of 850nm or 940nm in the ambient light (ie, background light signal). This part of the background light signal will affect the calculation of the time when the light receiving module receives the light signal, and an error in the calculation of the time when the light receiving module receives the light signal will affect the accuracy of depth information acquisition.
  • the light emitting module 30, the light receiving module 40, the depth camera 100, and the electronic device 1000 of the embodiment of the present application use a light source 31 that can emit light signals with a wavelength of 1350 nm to 1550 nm, and use light sources that can only receive light with a wavelength of 1350 nm to 1550 nm.
  • Signal photosensitive element 42 used to detect light signals with a wavelength of 1350 nm to 1550 nm.
  • the background light signal Since there is almost no light with a wavelength of 1350nm ⁇ 1550nm (ie, background light signal) in the ambient light, even in an outdoor strong light environment, the background light signal with a wavelength of 1350nm ⁇ 1550nm is very small, and a very small amount of background light The signal has little effect on the calculation of the time when the light receiving module 40 receives the light signal, and the depth information calculated based on the more accurate time when the light receiving module 40 receives the light signal has a higher accuracy.
  • the optical signal with a wavelength band of 1350nm-1550nm means that the wavelength of the optical signal can be 1350nm, 1360nm, 1370nm, 1385nm, 1394nm, 1400nm, 1410nm, 1425nm, 1450nm, 1480nm, 1490nm, 1500nm, 1520nm, 1535nm, Any one of 1540nm, 1550nm and any value between any two values.
  • the electronic device 1000 of the embodiment of the present application includes a casing 200 and a depth camera 100.
  • the electronic device 1000 can be a mobile phone, a tablet computer, a smart watch, a smart bracelet, a smart helmet, a smart glasses, a head-mounted display device, a game console, a notebook computer, etc.
  • This application uses the electronic device 1000 as a mobile phone as an example for description.
  • the specific form of the electronic device 1000 is not limited to a mobile phone.
  • the case 200 can be used as a mounting carrier for the functional elements of the electronic device 1000.
  • the case 200 can provide protection against dust, water, and drop resistance for the functional elements.
  • the functional elements can be the display screen 400 of the electronic device 1000, the visible light camera 300, Depth camera 100, motherboard, power module and other components.
  • the casing 200 may include a front 201 and a back 202, the front 201 and the back 202 are opposite to each other, and functional elements may be installed on the front 201 or the back 202.
  • the display screen 400 is installed on the front 201
  • the visible light camera 300 is installed on the back 202
  • the depth camera 100 is installed on the back 202.
  • the visible light camera 300 can be used as a rear camera, and the depth camera 100 It can also be used as a rear depth camera.
  • the visible light camera 300 may include one or more of a telephoto camera, a wide-angle camera, a periscope camera, a black-and-white camera, etc.;
  • the display screen 400 may be a display screen 400 such as a liquid crystal display, an OLED display, or a Microled display. .
  • the installation positions of the display screen 400, the visible light camera 300, and the depth camera 100 on the housing 200 can be arranged in other ways.
  • the display screen 400 can be set on the front 201 and the back 202 at the same time, and the visible light camera 300 can also be installed on the front 201 as a front camera, and the depth camera 100 can also be installed on the front 201 as a front depth camera.
  • the visible light camera 300 can also be installed below the display screen 400, that is, a visible light camera. 300 receives light passing through the display screen 400 for imaging.
  • the depth camera 100 can also be arranged under the display screen 400. The light signal emitted by the depth camera 100 enters the outside of the electronic device 1000 after passing through the display screen 400, and the depth camera 100 receives The light signal after passing through the display screen 400 from the outside of the electronic device 1000 obtains depth information.
  • the depth camera 100 includes a substrate 10, a housing 50, a spacer assembly 20, a light emitting module 30, a light receiving module 40, and a processor 70.
  • the depth camera 100 may be a time-of-flight depth camera that uses the principle of time-of-flight ranging to obtain depth information.
  • the substrate 10 can be used to carry the housing 50, the spacer assembly 20, the light emitting module 30 and the light receiving module 40.
  • the substrate 10 can be used to electrically connect the main board of the electronic device 1000 with the spacer assembly 20, the light emitting module 30 and the light receiving module 40.
  • the substrate 10 includes a flexible circuit board 11 and a reinforcement board 12. A circuit is laid on the flexible circuit board 11.
  • the spacer assembly 20 and the light receiving module 40 can be arranged on one side of the flexible circuit board 11.
  • the circuit and the spacer assembly 20, the light emitting module 30 and the light receiving module 40 are all Electrical connection.
  • the reinforcing plate 12 can be arranged on the other side of the flexible circuit board 11, and the reinforcing plate 12 can be made of a material with greater hardness such as steel, so as to improve the overall strength of the substrate 10 and facilitate the assembly of the circuit and the spacer. 20 and the light receiving module 40 are electrically connected.
  • the housing 50 is disposed on the substrate 10, and the housing 50 can be connected to the substrate 10, for example, the housing 50 is bonded to the substrate 10 by glue.
  • the housing 50 may be used to form a part of the housing of the depth camera 100, and the cushion assembly 20, the light emitting module 30 and the light receiving module 40 may be at least partially housed in the housing 50.
  • the housing 50 may be an integrally formed whole.
  • the housing 50 may be provided with a plurality of cavities, and different cavities may be used to accommodate different components in the aforementioned cushion assembly 20, the light emitting module 30, and the light receiving module 40.
  • the housing 50 and the substrate 10 enclose a first accommodating cavity 51 and a second accommodating cavity 52.
  • the first accommodating cavity 51 may be spaced from the second accommodating cavity 52, and the first accommodating cavity 51 may also communicate with the second accommodating cavity 52.
  • the housing 50 includes a first sub-housing 54 and a second sub-housing 55.
  • the first sub-housing 54 and the second sub-housing 55 can be manufactured by an integral molding process, for example, The first sub-housing 54 and the second sub-housing 55 are formed by a single casting, or the first and the second sub-housing 54 and 55 are formed by a single cutting process.
  • the first sub-housing 54 and the substrate 10 jointly enclose a first accommodating cavity 51, the first sub-housing 54 is formed with a light-passing port 541, the light-passing port 541 communicates with the first accommodating cavity 51, and the second sub-housing 55 and The substrate 10 collectively encloses a second receiving cavity 52.
  • the housing 50 includes a plurality of separate sub-housings, and each of the sub-housings can be individually connected to the substrate 10, for example, one sub-housing is used to house the light emitting module 30 and the other sub-housing.
  • the two sub-shells can be glued on the substrate 10 respectively.
  • the spacer assembly 20 is disposed on the substrate 10.
  • the spacer assembly 20 is electrically connected to the substrate 10.
  • the spacer assembly 20 includes a spacer 21 and a conductive element 22.
  • the spacer 21 is disposed on the substrate 10, and the relative position of the spacer 21 and the substrate 10 may be fixed, for example, the spacer 21 is bonded to the substrate 10.
  • the cushion block 21 may be accommodated in the first accommodating cavity 51 to prevent the cushion block 21 from falling off the substrate 10 and falling out. Of course, the cushion block 21 may not be accommodated in the housing 50.
  • the spacer 21 may be insulated, for example, the spacer 21 may be a PCB board, a ceramic block, or the like.
  • the spacer 21 includes a first surface 211 and a second surface 212, wherein the first surface 211 and the second surface 212 are opposite to each other.
  • the spacer 21 When the spacer 21 is arranged on the substrate 10, the first surface 211 is carried on the substrate 10, and the second surface 212 forms a certain height difference with the substrate 10, so that the components arranged on the second surface 212 are different from those directly arranged on the substrate 10. Compared with the components, the components arranged on the second surface 212 are padded with respect to the substrate 10. By selecting the spacers 21 of different heights, the height arrangement requirements of different components can be adapted.
  • a conductive hole 213 is defined in the spacer 21, and the conductive hole 213 penetrates the first surface 211 and the second surface 212.
  • the conductive hole 213 can be opened at a position spaced from the outer peripheral wall of the spacer block 21, and the conductive hole 213 can also be opened on the outer peripheral wall of the spacer block 21.
  • the conductive member 22 is disposed in the conductive hole 213.
  • the conductive member 22 may be any conductive material such as conductive silver paste, conductive ceramic, etc.
  • the conductive member 22 may be filled in the conductive hole 213 and exposed from the first surface 211 and the second surface 212.
  • the part of the conductive member 22 exposed from the first surface 211 can be used to electrically connect with the substrate 10, and the part of the conductive member 22 exposed from the second surface 212 can be used to communicate with elements (such as a light source) provided on the second surface 212. 31 and/or the photodetector 34) are electrically connected, so that the conductive member 22 is used to electrically connect the element and the substrate 10.
  • the number of conductive holes 213 and the positions of the conductive holes 213 can be set arbitrarily, and are not limited to the examples in the embodiments shown in the drawings of this application.
  • the light emitting module 30 is disposed on the second surface 212, the light emitting module 30 is electrically connected to the substrate 10 through the conductive member 22, and the light receiving module 40 is disposed on the substrate 10.
  • the height of the light receiving module 40 and the first surface 211 relative to the substrate 10 is basically the same, while the second pad The block 21 has a certain thickness, that is, the second surface 212 and the first surface 211 have a certain height difference. Therefore, the installation height of the light emitting module 30 (relative to the substrate 10, the same below) is higher than that of the light receiving module 40 Set the height (relative to the substrate 10, the same below).
  • the height of the light emitting module 30 is smaller than the height of the light receiving module 40, the height of the light emitting module 30 is higher than that of the light receiving module 40, which can prevent the light receiving module 40 from blocking the light emitting
  • the module 30 emits a light signal, so that the light emitting end of the light emitting module 30 is closer to the light incident end of the light receiving module 40, so that the depth information obtained by the depth camera 100 is relatively complete.
  • the light emitting module 30 is disposed on the second surface 212.
  • both the light emitting module 30 and the cushion block 21 are accommodated in the first receiving cavity 51.
  • the light emitting module 30 includes a light source 31, a bracket 32, a diffuser 33 (diffuser), a light detector 34, a high reflection film 36, and a filter film 37.
  • the bracket 32 is disposed on the second surface 212.
  • the bracket 32 may be adhered to the second surface 212 by glue 35.
  • the bracket 32 and the second surface 212 jointly enclose an installation space 321, and the installation space 321 can be used for installing the light source 31.
  • the bracket 32 may also be provided with a light outlet 322, the light outlet 322 communicates with the installation space 321, and the light outlet 322 can be used for light emitted by the light source 31 to pass through.
  • the light source 31 is contained in the installation space 321, and the light source 31 may be a vertical cavity surface emitting laser (VCSEL) or an edge emitting laser (EEL).
  • VCSEL vertical cavity surface emitting laser
  • EEL edge emitting laser
  • the light source 31 can send out a light signal with a uniform light spot, and the wavelength of the light signal is 1350 nm to 1550 nm, and the light signal can reach the diffuser 33 after passing through the light exit 322.
  • the light source 31 can be arranged on the second surface 212, the light source 31 can be electrically connected to the conductive member 22, and the light source 31 is electrically connected to the substrate 10 through the conductive member 22, so as to avoid using too long or too complicated connection lines to connect the light source 31 and The substrate 10 reduces the parasitic inductance of the connection line, which is beneficial for the light source 31 to output an ideal optical signal, and improves the accuracy of the depth information finally obtained.
  • the pins of the light source 31 may be directly electrically connected to the conductive member 22 exposed from the second surface 212.
  • the light source 31 and the conductive member 22 may be electrically connected by wire bonding. connection.
  • the diffuser 33 is disposed on the bracket 32. Specifically, the diffuser 33 may be bonded to the bracket 32 by glue 35.
  • the diffuser 33 includes a light incident surface 331 and a light output surface 332 opposite to each other, and the light incident surface 331 is opposite to the light source 31.
  • the diffuser 33 may be made of materials such as transparent glass or resin.
  • the diffuser 33 may be located outside the installation space 321. For example, the diffuser 33 may completely cover the light outlet 322, and the light incident surface 331 of the diffuser 33 may conflict with the bracket 32.
  • the light signal emitted from the light source 31 passes through the light outlet 322 and then reaches the diffuser 33.
  • the diffuser 33 can increase the viewing angle range of the light signal, so that the light signal emitted by the light emitting module 30 illuminates a larger range.
  • the light signal passing through the diffuser 33 may further pass through the light opening 541, and after passing through the light opening 541, the light signal exits the depth camera 100.
  • the light emitting module 30 is heightened to reduce the light emitting module 30 and the casing.
  • the impact on the appearance of the electronic device 1000 is smaller, and on the other hand, the screen-to-body ratio of the electronic device 1000 can be enlarged.
  • the light detector 34 is disposed on the second surface 212 and located in the installation space 321.
  • the conductive hole 213 is used for allowing the conductive member 22 to pass through to electrically connect the photodetector 34 and the substrate 10.
  • the number of photodetectors 34 can be one or more. When the number of photodetectors 34 is one, one photodetector 34 corresponds to one conductive hole 213; when the number of photodetectors 34 is more than one, each photodetector 34 corresponds to a conductive hole 213.
  • the light detector 34 can be used to receive the light signal reflected by the diffuser 33 to form a detection electrical signal.
  • the detection electrical signal can be a current signal, a voltage signal, a power signal calculated from a current signal or a voltage signal, a resistance signal, etc., There is no restriction here.
  • the detected electrical signal can be used as a basis for determining whether the light source 31 is in a constant power working state, or as a basis for determining whether the diffuser 33 is in a normal working state, or as a basis for determining whether the light source 31 is in a constant power working state.
  • the basis for determining whether the diffuser 33 is in a normal working state where the light source 31 is in a constant power working state, it means that the output power of the light source 31 is stable at a target power (the target power can be a value or a range.
  • the power output by the light source 31 is equal to Target power, when the target power is within a power range, the power output by the light source 31 is within the power range). If the power output by the light source 31 is not stabilized at a target power, the light source 31 is not in a constant power working state.
  • different application scenarios may have different requirements for the output power of the light source 31. For example, some application scenarios (such as the application scenario where the depth camera 100 is used as a rear depth camera) require the output power of the light source 31 to stabilize at a higher power ( A value or a range), for example, the output power of the light source 31 is required to stabilize at 10W.
  • Some application scenarios require that the output power of the light source 31 be stabilized at a lower power (a value or a range), for example, the output power of the light source 31 is required to be stabilized at 5W -6W.
  • the target power may be inconsistent.
  • the diffuser 33 When the diffuser 33 is in a normal working state, it means that the diffuser 33 is not damaged (such as ruptured) nor detached. When the diffuser 33 is damaged and/or detached, the diffuser 33 is in an abnormal working state.
  • the light source 31 when the light source 31 is in a constant power working state and the diffuser 33 is in a normal working state, the light source 31 outputs a light signal with stable power, the diffuser 33 is intact, and the light detector 34 can receive all the reflected light from the diffuser 33.
  • the detected electrical signal output by the photodetector 34 will be equal to the first electrical signal (ie a value) or be within the range of the first electrical signal. Since different application scenarios have different requirements for the output power of the light source 31, the first electrical signal (or the first electrical signal range) is determined according to the target power in different application scenarios.
  • the first electrical signal When the target power is larger, the first electrical signal The signal (or the value in the first electrical signal range) is also larger; when the target power is smaller, the first electrical signal (or the value in the first electrical signal range) is also smaller.
  • the detection electrical signal When the light source 31 is not in a constant power working state and the diffuser 33 is in a normal working state, the detection electrical signal will be equal to the second electrical signal (ie a value) or within the range of the second electrical signal, wherein, when the detection electrical signal is equal to the first For the second electrical signal, the second electrical signal is smaller than the first electrical signal or smaller than the minimum value of the first electrical signal range; when the detection electrical signal is within the second electrical signal range, the maximum value of the second electrical signal range is less than the first electrical signal The signal may be less than the minimum value of the first electrical signal range.
  • the light source 31 is not in a constant power working state may be caused by the temperature change of the light source 31.
  • the output power of the light source 31 cannot be stabilized at the target power required by the current application scenario.
  • the output power will be reduced, the amount of the light signal reflected by the diffuser 33 received by the photodetector 34 will be reduced, and the output detection electrical signal will also be reduced.
  • the detection electrical signal will be equal to the third electrical signal (ie a value) or within the range of the third electrical signal.
  • the third electrical signal is less than the second electrical signal or less than the minimum value of the second electrical signal range; when the detected electrical signal is within the third electrical signal range, the third electrical signal range is the largest The value is smaller than the second electrical signal or smaller than the minimum value of the second electrical signal range.
  • the high reflection film 36 is provided on the diffuser 33.
  • the diffuser 33 includes a coating area 334 and a non-coating area 333 connected to the coating area 334.
  • the highly reflective film 36 is formed in the coating area 334, and the coating area 334 corresponds to the light receiving area of the photodetector 34; the non-coating area 334 corresponds to the optical signal area where the light source 31 emits optical signals.
  • the coating area 334 corresponds to the light-receiving area of one photodetector 34; when the number of photodetectors 34 is multiple, the coating area 334 and the light-receiving area of multiple photodetectors 34
  • the light area corresponds, for example, the coated area 334 may surround the non-coated area 333, so that the coated area 334 can correspond to the light-receiving areas of the multiple photodetectors 34.
  • the highly reflective film 36 is used to reflect light signals with a wavelength of 1350 to 1550 nm. It can be understood that when the intensity of the outdoor ambient light is strong, there may be a small amount of 1350-1550nm light in the ambient light.
  • the high reflection film 36 has high reflectivity. The high reflection film 36 is used to reflect the light of 1350 to 1550 nm in the ambient light, which can prevent the light of 1350 to 1550 nm in the ambient light from interfering with the photodetector 34.
  • the filter film 37 is provided on the light detector 34.
  • the number of photodetectors 34 is one, there is also one filter film 37, and the one filter film 37 is arranged on the one photodetector 34; when the number of photodetectors 34 is more than one, the filter There are also multiple light films 37, and each light detector 34 is provided with a filter film 37.
  • the filter film 37 can be used to transmit only light signals with a wavelength of 1350 nm to 1550 nm. It can be understood that although the highly reflective film 36 is provided, light with a wavelength outside of 1350 nm to 1550 nm in the ambient light may pass through the diffuser 33 and be incident on the photodetector 34.
  • a filter film 37 is provided on the photodetector 34, which can block the ambient light with wavelengths other than 1350nm-1550nm from being incident on the photodetector 34, and the photodetector 34 can only receive the light signal reflected by the diffuser 33
  • the accuracy of the detection electrical signal is higher, and the working state of the light source 31 and/or the working state of the diffuser 33 determined based on the more accurate detection electrical signal is more accurate.
  • the light receiving module 40 is arranged on the substrate 10, the light receiving module 40 is formed with a light entrance 411, external light signals enter through the light entrance 411 Light receiving module 40.
  • the plane forming the light opening 541 can be flush with the plane forming the light entrance 411, so that the light signal entering the outside through the light opening 541 will not be blocked by the light receiving module 40, and from The light signal passing through the light entrance 411 from outside will not be blocked by the light emitting module 30.
  • the light receiving module 40 and the light emitting module 30 are disposed on the same substrate 10, so that the positions of the light receiving module 40 and the light emitting module 30 are relatively fixed, and there is no need to use additional brackets for the light receiving module 40 and the light The transmitting module 30 is fixed.
  • the depth camera 100 When the depth camera 100 is installed, the depth camera 100 can be installed in the housing 200 as a whole, without the need to separately install the light receiving module 40 and the light emitting module 30 before performing calibration.
  • the depth camera 100 may further include a connector 60 connected to the substrate 10, and the connector 60 is electrically connected to the main board of the electronic device 1000.
  • the number of the connector 60 can be a single one, and a single connector 60 can be electrically connected to the light emitting module 30 and the light receiving module 40 at the same time through wire routing, and there is no need to provide multiple connectors 60.
  • the light receiving module 40 includes a photosensitive element 42, a filter 44, a lens barrel 41 and a lens assembly 43.
  • the photosensitive element 42 may be disposed on the substrate 10 and electrically connected to the substrate 10, and the photosensitive element 42 is accommodated in the second receiving cavity 52.
  • the photosensitive element 42 is used for receiving only the optical signal passing through the lens assembly 43 and having a wavelength range of 1350 nm to 1550 nm.
  • the material of the photosensitive element 42 may include silicon and germanium, wherein the proportion of germanium is less than or equal to 10%, for example, the proportion of germanium may be 0.1%, 1%, 2.5%, 3.8%, 5%, 7%, 8. %, 9%, 10%, etc.
  • the material of the photosensitive element 42 may also include silicon and indium gallium arsenide.
  • the photosensitive element made of silicon can only respond to light signals in the wavelength range of 350nm-1064nm, and cannot respond to light signals in the wavelength range of 1350nm to 1550nm, while the photosensitive element 42 made of silicon and germanium is either made of silicon and indium gallium
  • the photosensitive element 42 made of arsenic can respond to light signals with longer wavelengths, such as 1350 nm to 1550 nm. Therefore, the photosensitive element 42 can be made of silicon and germanium or the photosensitive element 42 can be made of silicon and indium gallium arsenide. After the photosensitive element 42 receives the optical signal, the photosensitive element 42 converts the optical signal into an electrical signal, and the electrical signal can be used for calculating depth information.
  • the filter 44 is disposed above the photosensitive element 42 and is received in the second receiving cavity 52.
  • the filter 44 is used to only transmit light signals with a wavelength of 1350 nm to 1550 nm, so the photosensitive element 42 can only receive light signals with a wavelength of 1350 nm to 1550 nm.
  • the lens assembly 43 may be installed in the lens barrel 41.
  • the lens assembly 43 may be composed of multiple (for example, 4) lenses.
  • the aforementioned light entrance 411 is opened on the lens barrel 41. After the optical signal enters from the light entrance 411, it first passes through the lens assembly 43 and is incident on the filter 44.
  • the filter 44 filters out the optical signals with wavelengths outside of 1350nm-1550nm, and finally only the optical signals with 1350nm-1550nm It can be focused on the photosensitive element 42.
  • the lens barrel 41 may be detachably installed with the housing 50, specifically, the lens barrel 41 may be detachably installed with the second sub-housing 55.
  • the housing 50 is further provided with an installation groove 53, and the installation groove 53 can be used for installing the lens barrel 41.
  • the position of the installation groove 53 may correspond to the position of the second receiving cavity 52.
  • the outer wall of the lens barrel 41 is formed with an external thread, and the inner wall of the installation groove 53 is formed with an internal thread.
  • the lens barrel 41 and the housing 50 are detachably connected with the external thread and the internal thread. For example, the lens barrel 41 is screwed into the installation groove 53. Or the lens barrel 41 is screwed out of the installation groove 53.
  • the spacer assembly 20 and the photosensitive element 42 can be fixed on the substrate 10 first, and at the same time the conductive member 22 and the substrate 10, and the photosensitive element 42 and the substrate 10 are electrically connected; then the light emitting module 30 is installed On the second surface 212 of the cushion block 21, the light source 31 and the conductive member 22 are electrically connected at the same time; then the housing 50 is fixed on the substrate 10, so that the light emitting module 30 and the cushion block assembly 20 are received in the first receiving cavity 51 Inside, the photosensitive element 42 is accommodated in the second receiving cavity 52; finally, the lens barrel 41 with the lens assembly 43 can be screwed into the mounting groove 53 to complete the assembly of the entire depth camera 100.
  • the lens barrel 41 with the lens assembly 43 can also be screwed into the mounting groove 53 first, and then the housing 50 with the lens barrel 41 is fixed on the substrate 10.
  • the lens barrel 41 can be separated from the housing 50 separately, without the need to separate the housing 50 from the substrate 10 first.
  • the processor 70 may be provided outside the depth camera 100, for example, on the main board of the electronic device 1000 and electrically connected to the connector 60 of the depth camera 100.
  • the processor 70 may also be arranged in the depth camera 100, for example, in the light emitting module 30 or in the light receiving module 40.
  • the processor 70 may calculate the depth information according to the time when the light transmitting module 30 transmits the light signal and the time when the light receiving module 40 receives the light signal.
  • the processor 70 may also receive the detection electrical signal output by the photodetector 34, and determine whether the light source 31 is in a constant power working state and/or whether the diffuser 33 is in a normal working state according to the detection electrical signal. The specific determination process is as described above , I won’t repeat it here.
  • the processor 70 may also control the light source 31 according to whether the light source 31 is in a constant power working state and/or whether the diffuser 33 is in a normal working state.
  • the processor 70 is used to control the driving circuit for driving the light source 31 to emit light and still drive the light source 31 to emit light with the current operating current.
  • the processor 70 may control the driving circuit to increase the operating current to drive the light source 31 to emit light, so that the power output by the light source 31 is maintained at the target power.
  • the value of the increased operating current can be selected with the help of a temperature detector.
  • the light emitting module 30 may also include a temperature detector (not shown), and the temperature detector may be arranged on the second surface 212 Above and adjacent to the light source 31, a temperature detector is used to detect the temperature of the light source 31.
  • the processor 70 controls the temperature detector to detect the temperature of the light source 31, and the processor 70 then changes the operating current-power-temperature curve based on the temperature and the target power. (Different temperatures correspond to different operating current-power curves) find the target operating current, and at the current temperature of the light source 31, the power corresponding to the target operating current is at the target power.
  • the processor 70 may control the driving circuit to drive the light source 31 to emit light with a target operating current, so that the light source 31 outputs an optical signal with a constant power.
  • the photodetector 34 can continue to receive the light reflected by the diffuser 33 and output a detection electrical signal.
  • the processor 70 continues to control the drive circuit to drive the light source 31 to emit light with the increased target operating current; if the detected electrical signal is equal to the second electrical signal or is within the second range , The processor 70 again controls the temperature detector to detect the temperature of the light source 31, and updates the target operating current according to the temperature (the updated target operating current is higher than the target operating current before the update), and the processor 70 controls the updated target operating current The current drives the light source 31 to emit light.
  • the processor 70 gradually increases the operating current for driving the light source 31 to emit light according to the feedback of the photodetector 34, so that the software design ensures that the light source 31 can always output a light signal with a constant power, realizing automatic power control of the light emitting module 30 (Automatic Power Control, APC) adjustment function (shown in Figure 12).
  • APC Automatic Power Control
  • the processor 70 can control the driving circuit to stop supplying operating current to the light source 31 to turn off Light source 31. It can be understood that when the diffuser 33 is damaged or falls off, the diffuser 33 cannot diffuse the light signal emitted by the light source 31 into a uniform surface light, which will cause the depth camera 100 to fail to be used normally. When the diffuser 33 is damaged or falls off, the processor 70 turns off the light source 31 to prevent the depth camera 100 from continuously emitting light signals when it cannot be used normally, thereby saving energy consumption of the electronic device 1000.
  • the light emitting module 30 emits light signals with a wavelength of 1350 nm to 1550 nm, and the light receiving module 40 receives a wavelength It is an optical signal from 1350nm to 1550nm, and there is almost no background light signal with a wavelength of 1350nm to 1550nm in the ambient light, thereby avoiding the influence of the background light signal on the calculation of the time when the light receiving module 40 receives the optical signal, and further improving the depth information The acquisition accuracy.
  • light signals with longer wavelengths have lower energy, and according to the characteristics of the human eye, light signals with longer wavelengths will not converge on the retina. Therefore, the use of light signals with a wavelength of 1350nm to 1550nm can avoid harm to human eyes .
  • the light emitting module 30 is also provided with a light detector 34 to detect the working state of the light source 31 and the working state of the diffuser 33, so that the working state of the light source 31 and the working state of the diffuser 33 can be detected according to the light detector 34.
  • the state better controls the light source 31.
  • the diffuser 33 is working normally but the light source 31 is not in a constant power working state, the working current of the light source 31 is increased to ensure that the light emitting module 30 can output a light signal with stable power, which can further improve the acquisition accuracy of depth information.
  • the diffuser 33 fails to work normally, turning off the light source 31 can reduce the power consumption of the electronic device 1000.
  • the light emitting module 30 is disposed on the second surface 212 of the cushion block 21, and the light emitting module 30 is electrically connected to the substrate 10 through the conductive member 22, and the cushion block 21 cushions the height of the high light emitting module 30.
  • the height difference between the light emitting module 30 and the light receiving module 40 is reduced, and the light receiving module 40 is prevented from being blocked by the light emitting module 30 to emit light signals, and the light signals emitted by the light emitting module 30 have greater coverage Range, the depth camera 100 can obtain depth information of more objects in the scene, and the obtained depth information is highly complete.
  • the spacer 21 is further provided with a thermally conductive hole 214, and the thermally conductive hole 214 penetrates the first surface 211 and the second surface 212.
  • the spacer assembly 20 further includes a heat conducting member 23 which is filled in the heat conducting hole 214.
  • the light source 31 is arranged on the heat conducting member 23. The light source 31 generates heat during operation, and if the heat cannot be dissipated in time, it may affect the intensity and frequency of the optical signal emitted by the light source 31 and make the light source 31 unable to maintain a constant power working state.
  • the heat-conducting member 23 can quickly conduct the heat generated by the light source 31 to the substrate 10, and further conduct the heat to the outside through the substrate 10, so that the hardware design can be used
  • the light source 31 is kept in a constant power working state.
  • the heat-conducting member 23 is filled in the heat-conducting hole 214, and the heat-conducting member 23 may be made of a material with better thermal conductivity such as copper and silver.
  • the heat-conducting element 23 is exposed from the first surface 211 and the second surface 212 so that one end of the heat-conducting element 23 is in contact with the light source 31 and the other end is in contact with the substrate 10.
  • the orthographic projection of the light source 31 on the second surface 212 can completely fall onto the heat-conducting member 23, so that the contact area between the light source 31 and the heat-conducting member 23 is larger, and the heat conduction efficiency is improved.
  • the number of heat conducting holes 214 is multiple, and the plurality of heat conducting holes are arranged at intervals, and the heat conducting member 23 arranged in each heat conducting hole 214 is in contact with the light source 31; in another example, the number of heat conducting holes 214 is Single, the hollow volume of a single heat conduction hole 214 can be set to be larger, for example, greater than the sum of the hollow volumes of the plurality of heat conduction holes 214 when multiple heat conduction holes 214 are opened, so that the single heat conduction hole 214 can be set A larger number of heat-conducting parts 23 improves heat-conducting efficiency.
  • the heat conducting hole 214 can also be opened in a small top and big bottom shape, that is, the size of the end of the heat conducting hole 214 close to the second surface 212 can be substantially the same as the area of the orthographic projection of the light source 31 on the second surface 212, close to The size of one end of the first surface 211 can be set to be larger than the area of the orthographic projection of the light source 31 on the second surface 212, so as to increase the contact area between the heat conducting member 23 and the substrate 10 and improve the heat conduction efficiency.
  • the conductive hole 213 can be used for the conductive member 22 to pass through to electrically connect the photodetector 34 and the substrate 10.
  • the photodetector 34 and the conductive member 22 may be electrically connected by wire bonding, or the pins of the photodetector 34 may directly contact the conductive member 22.
  • the position aligned with the photodetector 34 can also be provided with the above-mentioned thermally conductive hole 214, and the thermally conductive member 23 in the thermally conductive hole 214 can be used to quickly conduct the heat generated by the photodetector 34 to the substrate 10 to Ensure that the light detector 34 is working properly.
  • the filter film 37 may not be provided in the light emitting module 30.
  • the photodetector 37 can be set as an element that can only receive light signals from 1350 nm to 1550 nm.
  • the working waveband of the photodetector 34 can be changed by changing the material composition of the photodetector 34, so that the photodetector 34 only works in the waveband of 1350nm-1550nm.
  • the light receiving module 40 may not be provided with the filter 44.
  • the photosensitive element 42 may be a photosensitive element that only receives light signals from 1350 nm to 1550 nm.
  • the working wavelength band of the photosensitive element 42 can also be changed by changing the material composition of the photosensitive element 42 so that the photosensitive element 42 only operates in the wavelength band of 1350 nm to 1550 nm.
  • the light emitting module 30 and the light receiving module 40 can also be placed on two independent substrates 10 and connected to the main board of the electronic device 1000 through two connectors 60 respectively.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present application, “plurality” means at least two, such as two or three, unless otherwise specifically defined.

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Abstract

A light transmitting module (30), a light receiving module (40), a depth camera (100), and an electronic device (1000). The light transmitting module (30) comprises a light source (31) and a diffuser (33). The light source (31) is configured to transmit a light signal, the wavelength of the light signal being 1350 nm-1550 nm. The diffuser (33) is configured to diffuse the light signal.

Description

光发射模组、光接收模组、深度相机和电子设备Light emitting module, light receiving module, depth camera and electronic equipment 技术领域Technical field
本申请涉及三维成像技术领域,特别涉及一种光发射模组、光接收模组、深度相机和电子设备。This application relates to the field of three-dimensional imaging technology, in particular to a light emitting module, a light receiving module, a depth camera and an electronic device.
背景技术Background technique
飞行时间(Time of Flight,TOF)深度相机已广泛应用于手机等电子设备中,以使电子设备具备获取物体的三维信息的功能。飞行时间深度相机可通过计算光发射模组发射光信号的时刻,与光接收模组接收到光信号的时刻之间的时间差来计算被测物体的深度信息。Time of Flight (TOF) depth cameras have been widely used in electronic devices such as mobile phones, so that the electronic devices have the function of acquiring three-dimensional information of objects. The time-of-flight depth camera can calculate the depth information of the measured object by calculating the time difference between the time when the light emitting module emits the light signal and the time when the light receiving module receives the light signal.
发明内容Summary of the invention
本申请实施方式提供一种光发射模组、光接收模组、深度相机和电子设备。The embodiments of the present application provide a light emitting module, a light receiving module, a depth camera, and electronic equipment.
本申请实施方式的光发射模组包括光源和扩散器。所述光源用于发射光信号,所述光信号的波长为1350nm~1550nm。所述扩散器用于扩散所述光信号。The light emitting module of the embodiment of the present application includes a light source and a diffuser. The light source is used to emit an optical signal, and the wavelength of the optical signal is 1350 nm to 1550 nm. The diffuser is used to diffuse the optical signal.
本申请实施方式的光接收模组包括镜头组件和感光元件。所述感光元件用于仅接收经过所述镜头组件且波段为1350nm~1550nm的光信号。The light receiving module of the embodiment of the present application includes a lens assembly and a photosensitive element. The photosensitive element is used to receive only the optical signal passing through the lens assembly and having a wavelength range of 1350 nm to 1550 nm.
本申请实施方式的深度相机包括光发射模组和光接收模组。光发射模组包括光源和扩散器。所述光源用于发射光信号,所述光信号的波长为1350nm~1550nm。所述扩散器用于扩散所述光信号。光接收模组包括镜头组件和感光元件。所述感光元件用于仅接收经过所述镜头组件且波段为1350nm~1550nm的光信号。The depth camera of the embodiment of the present application includes a light emitting module and a light receiving module. The light emitting module includes a light source and a diffuser. The light source is used to emit an optical signal, and the wavelength of the optical signal is 1350 nm to 1550 nm. The diffuser is used to diffuse the optical signal. The light receiving module includes a lens assembly and a photosensitive element. The photosensitive element is used to receive only the optical signal passing through the lens assembly and having a wavelength range of 1350 nm to 1550 nm.
本申请实施方式的电子设备包括机壳和深度相机。深度相机包括光发射模组和光接收模组。光发射模组包括光源和扩散器。所述光源用于发射光信号,所述光信号的波长为1350nm~1550nm。所述扩散器用于扩散所述光信号。光接收模组包括镜头组件和感光元件。所述感光元件用于仅接收经过所述镜头组件且波段为1350nm~1550nm的光信号。The electronic device of the embodiment of the present application includes a casing and a depth camera. The depth camera includes a light emitting module and a light receiving module. The light emitting module includes a light source and a diffuser. The light source is used to emit an optical signal, and the wavelength of the optical signal is 1350 nm to 1550 nm. The diffuser is used to diffuse the optical signal. The light receiving module includes a lens assembly and a photosensitive element. The photosensitive element is used to receive only the optical signal passing through the lens assembly and having a wavelength range of 1350 nm to 1550 nm.
本申请实施方式的光发射模组、光接收模组、深度相机和电子设备使用可以发射波长为1350nm~1550nm光信号的光源,以及使用可以仅接收波段为1350nm~1550nm的光信号的感光元件。由于环境光线中几乎不存在波长为1350nm~1550nm的背景光信号,从而避免背景光信号对光接收模组接收光信号的时刻的计算的影响,进一步地可以提升深度信息的获取精度。The light emitting module, light receiving module, depth camera, and electronic device of the embodiments of the present application use a light source that can emit light signals with a wavelength of 1350 nm to 1550 nm, and a photosensitive element that can only receive light signals with a wavelength of 1350 nm to 1550 nm. Since there is almost no background light signal with a wavelength of 1350nm-1550nm in the ambient light, the influence of the background light signal on the calculation of the moment when the light receiving module receives the light signal is avoided, and the acquisition accuracy of depth information can be further improved.
本申请实施方式的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本申请的实践了解到。The additional aspects and advantages of the embodiments of the present application will be partially given in the following description, and some will become obvious from the following description, or be understood through the practice of the present application.
附图说明Description of the drawings
本申请的上述和/或附加的方面和优点可以从结合下面附图对实施方式的描述中将变得明显和容易理解,其中:The above-mentioned and/or additional aspects and advantages of the present application will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, in which:
图1是本申请实施方式的电子设备的平面结构示意图;FIG. 1 is a schematic diagram of a plan structure of an electronic device according to an embodiment of the present application;
图2是本申请实施方式的深度相机的立体装配示意图;2 is a schematic diagram of a three-dimensional assembly of a depth camera according to an embodiment of the present application;
图3是本申请实施方式的深度相机的平面装配示意图;3 is a schematic diagram of a plane assembly of a depth camera according to an embodiment of the present application;
图4是图3所示的深度相机沿IV-IV线的截面示意图;4 is a schematic cross-sectional view of the depth camera shown in FIG. 3 along the line IV-IV;
图5是本申请实施方式的深度相机的平面装配示意图;5 is a schematic diagram of a plane assembly of a depth camera according to an embodiment of the present application;
图6及图7是本申请实施方式的深度相机的立体分解示意图;6 and 7 are three-dimensional exploded schematic diagrams of the depth camera according to the embodiment of the present application;
图8及图9是本申请实施方式的深度相机的垫块组件及光发射模组的立体分解示意图;8 and 9 are three-dimensional exploded schematic diagrams of the cushion assembly and the light emitting module of the depth camera according to the embodiment of the present application;
图10是本申请某些实施方式的光接收模组的平面结构示意图;FIG. 10 is a schematic diagram of a planar structure of a light receiving module according to some embodiments of the present application;
图11是本申请某些实施方式的光接收模组的扩散器的结构示意图;FIG. 11 is a schematic structural diagram of a diffuser of a light receiving module according to some embodiments of the present application;
图12是本申请某些实施方式的光发射模组输出的光信号的功率的示意图。FIG. 12 is a schematic diagram of the power of the optical signal output by the light emitting module according to some embodiments of the present application.
主要元件及符号说明:Description of main components and symbols:
电子设备1000、机壳200、正面201、背面202、可见光相机300、显示屏400、深度相机100、基板10、柔性电路板11、补强板12、垫块组件20、垫块21、第一面211、第二面212、导电孔213、导热孔214、导电件22、导热件23、光发射模组30、光源31、支架32、安装空间321、出光口322、扩散器33、入光面331、出光面332、非镀膜区域333、镀膜区域334、光检测器34、胶35、高反射膜36、滤光膜37、光接收模组40、镜筒41、入光口411、感光元件42、镜头组件43、滤光片44、壳体50、第一收容腔51、第二收容腔52、安装槽53、第一子壳体54、通光口541、第二子壳体55、连接器60、处理器70。 Electronic device 1000, case 200, front 201, back 202, visible light camera 300, display 400, depth camera 100, substrate 10, flexible circuit board 11, reinforcing plate 12, spacer component 20, spacer 21, first Surface 211, second surface 212, conductive hole 213, thermal hole 214, conductive member 22, heat conductive member 23, light emitting module 30, light source 31, bracket 32, installation space 321, light outlet 322, diffuser 33, light incident Surface 331, light-emitting surface 332, non-coated area 333, coated area 334, light detector 34, glue 35, high reflective film 36, filter film 37, light receiving module 40, lens barrel 41, light entrance 411, photosensitive Element 42, lens assembly 43, filter 44, housing 50, first housing cavity 51, second housing cavity 52, mounting groove 53, first sub-housing 54, light opening 541, second sub-housing 55 , Connector 60, Processor 70.
具体实施方式detailed description
下面详细描述本申请的实施方式,实施方式的示例在附图中示出,其中,相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的,仅用于解释本申请,而不能理解为对本申请的限制。The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements with the same or similar functions throughout. The following embodiments described with reference to the accompanying drawings are exemplary, and are only used to explain the present application, and cannot be understood as a limitation to the present application.
在本申请中,除非另有明确的规定和限定,第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触,或第一和第二特征通过中间媒介间接接触。而且,第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方,或仅 仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方,或仅仅表示第一特征水平高度小于第二特征。In this application, unless expressly stipulated and defined otherwise, the “on” or “under” of the first feature on the second feature may be in direct contact with the first and second features, or indirectly through an intermediary. contact. Moreover, the "above", "above" and "above" of the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or it only means that the level of the first feature is higher than the second feature. The “below”, “below” and “below” of the second feature of the first feature may mean that the first feature is directly below or obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
请参阅图3和图4,本申请提供一种光发射模组30。光发射模组30包括光源31和扩散器33。光源31用于发射光信号,其中,光信号的波长为1350nm~1550nm。扩散器33用于扩散光源31发射的光信号。Please refer to FIG. 3 and FIG. 4, this application provides a light emitting module 30. The light emitting module 30 includes a light source 31 and a diffuser 33. The light source 31 is used to emit an optical signal, wherein the wavelength of the optical signal is 1350 nm to 1550 nm. The diffuser 33 is used to diffuse the light signal emitted by the light source 31.
请继续参阅图3和图4,本申请还提供一种光接收模组40。光接收模组40包括镜头组件43和感光元件42。感光元件42用于仅接收经过镜头组件43且波段为1350nm~1550nm的光信号。Please continue to refer to FIG. 3 and FIG. 4, this application also provides a light receiving module 40. The light receiving module 40 includes a lens assembly 43 and a photosensitive element 42. The photosensitive element 42 is used for receiving only the optical signal passing through the lens assembly 43 and having a wavelength range of 1350 nm to 1550 nm.
请还参阅图3和图4,本申请还提供一种深度相机100。深度相机100包括光发射模组30和光接收模组40。光发射模组30包括光源31和扩散器33。光源31用于发射光信号,其中,光信号的波长为1350nm~1550nm。扩散器33用于扩散光源31发射的光信号。光接收模组40包括镜头组件43和感光元件42。感光元件42用于仅接收经过镜头组件43且波段为1350nm~1550nm的光信号。Please also refer to FIG. 3 and FIG. 4, this application also provides a depth camera 100. The depth camera 100 includes a light emitting module 30 and a light receiving module 40. The light emitting module 30 includes a light source 31 and a diffuser 33. The light source 31 is used to emit an optical signal, wherein the wavelength of the optical signal is 1350 nm to 1550 nm. The diffuser 33 is used to diffuse the light signal emitted by the light source 31. The light receiving module 40 includes a lens assembly 43 and a photosensitive element 42. The photosensitive element 42 is used for receiving only the optical signal passing through the lens assembly 43 and having a wavelength range of 1350 nm to 1550 nm.
请参阅图1和图4,本申请还提供一种电子设备1000。电子设备1000包括机壳200和深度相机100。深度相机100包括光发射模组30和光接收模组40。光发射模组30包括光源31和扩散器33。光源31用于发射光信号,其中,光信号的波长为1350nm~1550nm。扩散器33用于扩散光源31发射的光信号。光接收模组40包括镜头组件43和感光元件42。感光元件42用于仅接收经过镜头组件43且波段为1350nm~1550nm的光信号。Referring to FIG. 1 and FIG. 4, the present application also provides an electronic device 1000. The electronic device 1000 includes a housing 200 and a depth camera 100. The depth camera 100 includes a light emitting module 30 and a light receiving module 40. The light emitting module 30 includes a light source 31 and a diffuser 33. The light source 31 is used to emit an optical signal, wherein the wavelength of the optical signal is 1350 nm to 1550 nm. The diffuser 33 is used to diffuse the light signal emitted by the light source 31. The light receiving module 40 includes a lens assembly 43 and a photosensitive element 42. The photosensitive element 42 is used for receiving only the optical signal passing through the lens assembly 43 and having a wavelength range of 1350 nm to 1550 nm.
基于飞行时间(Time of Flight,TOF)技术来获取被测物体的深度信息的深度相机中,光发射模组发射的光信号的波段通常为850nm或940nm。环境光线中也存在有较多波段为850nm或940nm的光线。当深度相机在户外环境下工作时,光接收模组除了接收到光发射模组发射的光信号以外,还会接收到环境光线中的波段为850nm或940nm的光线(即背景光信号),而这部分背景光信号会影响光接收模组接收光信号的时刻的计算,光接收模组接收光信号的时刻计算出错会影响深度信息的获取精度。In a depth camera that acquires depth information of a measured object based on Time of Flight (TOF) technology, the wavelength band of the light signal emitted by the light emitting module is usually 850 nm or 940 nm. In the ambient light, there are more light with wavelengths of 850nm or 940nm. When the depth camera is working in an outdoor environment, in addition to receiving the light signal emitted by the light emitting module, the light receiving module will also receive light with a wavelength of 850nm or 940nm in the ambient light (ie, background light signal). This part of the background light signal will affect the calculation of the time when the light receiving module receives the light signal, and an error in the calculation of the time when the light receiving module receives the light signal will affect the accuracy of depth information acquisition.
本申请实施方式的光发射模组30、光接收模组40、深度相机100和电子设备1000使用可以发射波长为1350nm~1550nm光信号的光源31,以及使用可以仅接收波段为1350nm~1550nm的光信号的感光元件42。由于环境光线中几乎不存在波长为1350nm~1550nm的光线(即背景光信号),即使是在户外强光环境下,波段为1350nm~1550nm的背景光信号也是极少量的,而极少量的背景光信号对光接收模组40接收光信号的时刻的计算的影响很小,根据较为准确的光接收模组40接收光信号的时刻计算出来的深度信息的精度较高。需要说明的是:波段为1350nm~1550nm的光信号是指:光信号的波长可以是1350nm、1360nm、1370nm、1385nm、1394nm、1400nm、1410nm、1425nm、 1450nm、1480nm、1490nm、1500nm、1520nm、1535nm、1540nm、1550nm中的任意一个值及任意两个值中间的任何值。The light emitting module 30, the light receiving module 40, the depth camera 100, and the electronic device 1000 of the embodiment of the present application use a light source 31 that can emit light signals with a wavelength of 1350 nm to 1550 nm, and use light sources that can only receive light with a wavelength of 1350 nm to 1550 nm. Signal photosensitive element 42. Since there is almost no light with a wavelength of 1350nm~1550nm (ie, background light signal) in the ambient light, even in an outdoor strong light environment, the background light signal with a wavelength of 1350nm~1550nm is very small, and a very small amount of background light The signal has little effect on the calculation of the time when the light receiving module 40 receives the light signal, and the depth information calculated based on the more accurate time when the light receiving module 40 receives the light signal has a higher accuracy. It should be noted that: the optical signal with a wavelength band of 1350nm-1550nm means that the wavelength of the optical signal can be 1350nm, 1360nm, 1370nm, 1385nm, 1394nm, 1400nm, 1410nm, 1425nm, 1450nm, 1480nm, 1490nm, 1500nm, 1520nm, 1535nm, Any one of 1540nm, 1550nm and any value between any two values.
请参阅图1,本申请实施方式的电子设备1000包括机壳200及深度相机100。电子设备1000可以是手机、平板电脑、智能手表、智能手环、智能头盔、智能眼镜、头显设备、游戏机、笔记本电脑等,本申请以电子设备1000是手机作为示例进行说明,可以理解,电子设备1000的具体形式不限于手机。Please refer to FIG. 1, the electronic device 1000 of the embodiment of the present application includes a casing 200 and a depth camera 100. The electronic device 1000 can be a mobile phone, a tablet computer, a smart watch, a smart bracelet, a smart helmet, a smart glasses, a head-mounted display device, a game console, a notebook computer, etc. This application uses the electronic device 1000 as a mobile phone as an example for description. The specific form of the electronic device 1000 is not limited to a mobile phone.
机壳200可以作为电子设备1000的功能元件的安装载体,机壳200可以为功能元件提供防尘、防水、防摔等的保护,功能元件可以是电子设备1000的显示屏400、可见光相机300、深度相机100、主板、电源模块等元件。机壳200可以包括正面201及背面202,正面201与背面202相背,功能元件可以安装在正面201或者背面202。例如如图1所示的例子中,显示屏400安装在正面201,可见光相机300安装在背面202,深度相机100安装在背面202,此时,可见光相机300可作为后置相机使用,深度相机100也可作为后置深度相机使用。其中,可见光相机300可以包括长焦相机、广角相机、潜望式相机、黑白相机等中的一个或多个;显示屏400可以是液晶显示屏、OLED显示屏、Micro led显示屏等显示屏400。The case 200 can be used as a mounting carrier for the functional elements of the electronic device 1000. The case 200 can provide protection against dust, water, and drop resistance for the functional elements. The functional elements can be the display screen 400 of the electronic device 1000, the visible light camera 300, Depth camera 100, motherboard, power module and other components. The casing 200 may include a front 201 and a back 202, the front 201 and the back 202 are opposite to each other, and functional elements may be installed on the front 201 or the back 202. For example, in the example shown in FIG. 1, the display screen 400 is installed on the front 201, the visible light camera 300 is installed on the back 202, and the depth camera 100 is installed on the back 202. At this time, the visible light camera 300 can be used as a rear camera, and the depth camera 100 It can also be used as a rear depth camera. Among them, the visible light camera 300 may include one or more of a telephoto camera, a wide-angle camera, a periscope camera, a black-and-white camera, etc.; the display screen 400 may be a display screen 400 such as a liquid crystal display, an OLED display, or a Microled display. .
当然,在其他实施例中,显示屏400、可见光相机300及深度相机100在机壳200上的安装位置可以有其他设置方式,例如,显示屏400可以同时设置在正面201及背面202,可见光相机300还可以设置在正面201以作为前置相机使用,深度相机100也可以安装在正面201以作为前置深度相机使用,另外,可见光相机300还可以设置在显示屏400的下方,即,可见光相机300接收穿过显示屏400的光线以用于成像,深度相机100还可以设置在显示屏400的下方,深度相机100发射的光信号穿过显示屏400后进入电子设备1000外界,深度相机100接收从电子设备1000的外界穿过显示屏400后的光信号以获取深度信息。Of course, in other embodiments, the installation positions of the display screen 400, the visible light camera 300, and the depth camera 100 on the housing 200 can be arranged in other ways. For example, the display screen 400 can be set on the front 201 and the back 202 at the same time, and the visible light camera 300 can also be installed on the front 201 as a front camera, and the depth camera 100 can also be installed on the front 201 as a front depth camera. In addition, the visible light camera 300 can also be installed below the display screen 400, that is, a visible light camera. 300 receives light passing through the display screen 400 for imaging. The depth camera 100 can also be arranged under the display screen 400. The light signal emitted by the depth camera 100 enters the outside of the electronic device 1000 after passing through the display screen 400, and the depth camera 100 receives The light signal after passing through the display screen 400 from the outside of the electronic device 1000 obtains depth information.
请参阅图1至图4,深度相机100包括基板10、壳体50、垫块组件20、光发射模组30、光接收模组40、及处理器70。其中,深度相机100可以是利用飞行时间测距的原理获取深度信息的飞行时间深度相机。1 to 4, the depth camera 100 includes a substrate 10, a housing 50, a spacer assembly 20, a light emitting module 30, a light receiving module 40, and a processor 70. Wherein, the depth camera 100 may be a time-of-flight depth camera that uses the principle of time-of-flight ranging to obtain depth information.
请参阅图2至图4,基板10可以用于承载壳体50、垫块组件20、光发射模组30及光接收模组40。基板10可以用于电连接电子设备1000的主板与垫块组件20、光发射模组30及光接收模组40。基板10包括柔性电路板11及补强板12。柔性电路板11上铺设有线路,垫块组件20及光接收模组40可以设置在柔性电路板11的一侧上,线路与垫块组件20、光发射模组30及光接收模组40均电性连接。补强板12可以设置在柔性电路板11的另一侧上,补强板12可以由钢等具有较大的硬度的材料制成,以提 高基板10的整体强度,且便于线路与垫块组件20及光接收模组40电连接。Please refer to FIGS. 2 to 4, the substrate 10 can be used to carry the housing 50, the spacer assembly 20, the light emitting module 30 and the light receiving module 40. The substrate 10 can be used to electrically connect the main board of the electronic device 1000 with the spacer assembly 20, the light emitting module 30 and the light receiving module 40. The substrate 10 includes a flexible circuit board 11 and a reinforcement board 12. A circuit is laid on the flexible circuit board 11. The spacer assembly 20 and the light receiving module 40 can be arranged on one side of the flexible circuit board 11. The circuit and the spacer assembly 20, the light emitting module 30 and the light receiving module 40 are all Electrical connection. The reinforcing plate 12 can be arranged on the other side of the flexible circuit board 11, and the reinforcing plate 12 can be made of a material with greater hardness such as steel, so as to improve the overall strength of the substrate 10 and facilitate the assembly of the circuit and the spacer. 20 and the light receiving module 40 are electrically connected.
请参阅图3及图4,壳体50设置在基板10上,壳体50可以连接在基板10上,例如壳体50通过胶粘接在基板10上。壳体50可以用于形成深度相机100的外壳的一部分,垫块组件20、光发射模组30及光接收模组40可以至少部分收容在壳体50内。3 and 4, the housing 50 is disposed on the substrate 10, and the housing 50 can be connected to the substrate 10, for example, the housing 50 is bonded to the substrate 10 by glue. The housing 50 may be used to form a part of the housing of the depth camera 100, and the cushion assembly 20, the light emitting module 30 and the light receiving module 40 may be at least partially housed in the housing 50.
壳体50可以是一个一体成型的整体。壳体50上可以开设有多个腔体,不同的腔体可以用于收容上述的垫块组件20、光发射模组30及光接收模组40中的不同的元件。壳体50与基板10围成第一收容腔51及第二收容腔52,第一收容腔51可以与第二收容腔52间隔,第一收容腔51也可以与第二收容腔52连通。The housing 50 may be an integrally formed whole. The housing 50 may be provided with a plurality of cavities, and different cavities may be used to accommodate different components in the aforementioned cushion assembly 20, the light emitting module 30, and the light receiving module 40. The housing 50 and the substrate 10 enclose a first accommodating cavity 51 and a second accommodating cavity 52. The first accommodating cavity 51 may be spaced from the second accommodating cavity 52, and the first accommodating cavity 51 may also communicate with the second accommodating cavity 52.
在本申请实施例中,壳体50包括第一子壳体54及第二子壳体55,第一子壳体54与第二子壳体55可以由一体成型的工艺制造而成,例如通过一次铸造形成第一子壳体54及第二子壳体55,或者通过一次切削加工形成第一子壳体54及第二子壳体55。第一子壳体54与基板10共同围成第一收容腔51,第一子壳体54上形成通光口541,通光口541与第一收容腔51相通,第二子壳体55与基板10共同围成第二收容腔52。In the embodiment of the present application, the housing 50 includes a first sub-housing 54 and a second sub-housing 55. The first sub-housing 54 and the second sub-housing 55 can be manufactured by an integral molding process, for example, The first sub-housing 54 and the second sub-housing 55 are formed by a single casting, or the first and the second sub-housing 54 and 55 are formed by a single cutting process. The first sub-housing 54 and the substrate 10 jointly enclose a first accommodating cavity 51, the first sub-housing 54 is formed with a light-passing port 541, the light-passing port 541 communicates with the first accommodating cavity 51, and the second sub-housing 55 and The substrate 10 collectively encloses a second receiving cavity 52.
在另外的例子中,壳体50包括多个分体设置的子壳体,每个子壳体可以单独与基板10连接,例如一个子壳体用于收容光发射模组30、另一个子壳体用于收容光接收模组40,两个子壳体可以分别通过胶粘接在基板10上,在需要维修或更换其中一个器件(可以是光发射模组30或光接收模组40)时,可以拆开其中一个子壳体,而不影响另一个子壳体及另一个器件。In another example, the housing 50 includes a plurality of separate sub-housings, and each of the sub-housings can be individually connected to the substrate 10, for example, one sub-housing is used to house the light emitting module 30 and the other sub-housing. For accommodating the light receiving module 40, the two sub-shells can be glued on the substrate 10 respectively. When one of the components (which can be the light emitting module 30 or the light receiving module 40) needs to be repaired or replaced, Disassemble one of the sub-housings without affecting the other sub-housing and other components.
请参阅图4、图8及图9,垫块组件20设置在基板10上。垫块组件20与基板10电性连接。垫块组件20包括垫块21及导电件22。Please refer to FIG. 4, FIG. 8 and FIG. 9, the spacer assembly 20 is disposed on the substrate 10. The spacer assembly 20 is electrically connected to the substrate 10. The spacer assembly 20 includes a spacer 21 and a conductive element 22.
垫块21设置在基板10上,垫块21与基板10的相对位置可以是固定的,例如将垫块21粘接在基板10上。垫块21可以收容在第一收容腔51内,以避免垫块21从基板10上脱落后掉出,当然,垫块21也可以不是收容在壳体50内。垫块21可以是绝缘的,例如垫块21可以是PCB板、陶瓷块等。垫块21包括第一面211及第二面212,其中,第一面211与第二面212相背。垫块21设置在基板10上时,第一面211承载在基板10上,第二面212与基板10形成一定的高度差,使得设置在第二面212上的元件与直接设置在基板10上的元件相比,设置在第二面212上的元件相对于基板10被垫高,通过选用不同高度的垫块21,可以适应不同元件在高度上的布置需求。垫块21上开设导电孔213,导电孔213贯穿第一面211及第二面212。导电孔213可以在垫块21的与外周壁相间隔的位置上开设,导电孔213也可以在垫块21的外周壁上开设。The spacer 21 is disposed on the substrate 10, and the relative position of the spacer 21 and the substrate 10 may be fixed, for example, the spacer 21 is bonded to the substrate 10. The cushion block 21 may be accommodated in the first accommodating cavity 51 to prevent the cushion block 21 from falling off the substrate 10 and falling out. Of course, the cushion block 21 may not be accommodated in the housing 50. The spacer 21 may be insulated, for example, the spacer 21 may be a PCB board, a ceramic block, or the like. The spacer 21 includes a first surface 211 and a second surface 212, wherein the first surface 211 and the second surface 212 are opposite to each other. When the spacer 21 is arranged on the substrate 10, the first surface 211 is carried on the substrate 10, and the second surface 212 forms a certain height difference with the substrate 10, so that the components arranged on the second surface 212 are different from those directly arranged on the substrate 10. Compared with the components, the components arranged on the second surface 212 are padded with respect to the substrate 10. By selecting the spacers 21 of different heights, the height arrangement requirements of different components can be adapted. A conductive hole 213 is defined in the spacer 21, and the conductive hole 213 penetrates the first surface 211 and the second surface 212. The conductive hole 213 can be opened at a position spaced from the outer peripheral wall of the spacer block 21, and the conductive hole 213 can also be opened on the outer peripheral wall of the spacer block 21.
导电件22设置在导电孔213内。导电件22具体可以是导电银浆、导电陶瓷等任意可以导电的材料,导电件22可以填充在导电孔213内并从第一面211及第二面212 露出。导电件22的从第一面211露出的部分可以用于与基板10电性连接,导电件22的从第二面212露出的部分可以用于与设置在第二面212上的元件(例如光源31和/或光检测器34)电性连接,以使导电件22用于将该元件与基板10电性连接。依据设置在第二面212上的元件的布线需求,导电孔213的数量及导电孔213的位置可以任意设置,而不限于本申请附图所示的实施例中的举例。The conductive member 22 is disposed in the conductive hole 213. The conductive member 22 may be any conductive material such as conductive silver paste, conductive ceramic, etc. The conductive member 22 may be filled in the conductive hole 213 and exposed from the first surface 211 and the second surface 212. The part of the conductive member 22 exposed from the first surface 211 can be used to electrically connect with the substrate 10, and the part of the conductive member 22 exposed from the second surface 212 can be used to communicate with elements (such as a light source) provided on the second surface 212. 31 and/or the photodetector 34) are electrically connected, so that the conductive member 22 is used to electrically connect the element and the substrate 10. According to the wiring requirements of the components arranged on the second surface 212, the number of conductive holes 213 and the positions of the conductive holes 213 can be set arbitrarily, and are not limited to the examples in the embodiments shown in the drawings of this application.
请参阅图2及图4,光发射模组30设置在第二面212上,光发射模组30通过导电件22与基板10电性连接,光接收模组40设置在基板10上。可以理解,由于第一面211与基板10结合,光接收模组40设置在基板10上,故光接收模组40与第一面211相对于基板10的设置高度基本相同,而同时第二垫块21具有一定的厚度,即,第二面212与第一面211具有一定的高度差,因此,光发射模组30的设置高度(相对于基板10,下同)要高于光接收模组40的设置高度(相对于基板10,下同)。由于光发射模组30的自身高度要小于光接收模组40的自身高度,光发射模组30的设置高度比光接收模组40的设置高度高,可以避免光接收模组40遮挡到光发射模组30发射光信号,使得光发射模组30的光出射端与光接收模组40的光入射端较为接近,从而使得深度相机100的获得的深度信息较完整。2 and 4, the light emitting module 30 is disposed on the second surface 212, the light emitting module 30 is electrically connected to the substrate 10 through the conductive member 22, and the light receiving module 40 is disposed on the substrate 10. It can be understood that since the first surface 211 is combined with the substrate 10 and the light receiving module 40 is disposed on the substrate 10, the height of the light receiving module 40 and the first surface 211 relative to the substrate 10 is basically the same, while the second pad The block 21 has a certain thickness, that is, the second surface 212 and the first surface 211 have a certain height difference. Therefore, the installation height of the light emitting module 30 (relative to the substrate 10, the same below) is higher than that of the light receiving module 40 Set the height (relative to the substrate 10, the same below). Since the height of the light emitting module 30 is smaller than the height of the light receiving module 40, the height of the light emitting module 30 is higher than that of the light receiving module 40, which can prevent the light receiving module 40 from blocking the light emitting The module 30 emits a light signal, so that the light emitting end of the light emitting module 30 is closer to the light incident end of the light receiving module 40, so that the depth information obtained by the depth camera 100 is relatively complete.
请参阅图4、图8至图10,光发射模组30设置在第二面212上。在本申请实施例中,光发射模组30与垫块21均收容在第一收容腔51内。光发射模组30包括光源31、支架32、扩散器33(diffuser)、光检测器34、高反射膜36、及滤光膜37。Please refer to FIG. 4 and FIG. 8 to FIG. 10, the light emitting module 30 is disposed on the second surface 212. In the embodiment of the present application, both the light emitting module 30 and the cushion block 21 are accommodated in the first receiving cavity 51. The light emitting module 30 includes a light source 31, a bracket 32, a diffuser 33 (diffuser), a light detector 34, a high reflection film 36, and a filter film 37.
支架32设置在第二面212上。支架32可以通过胶35粘接在第二面212上,支架32与第二面212共同围成安装空间321,安装空间321内可以用于设置光源31。支架32上还可以开设有出光口322,出光口322与安装空间321连通,出光口322可用于供光源31发出的光穿过。The bracket 32 is disposed on the second surface 212. The bracket 32 may be adhered to the second surface 212 by glue 35. The bracket 32 and the second surface 212 jointly enclose an installation space 321, and the installation space 321 can be used for installing the light source 31. The bracket 32 may also be provided with a light outlet 322, the light outlet 322 communicates with the installation space 321, and the light outlet 322 can be used for light emitted by the light source 31 to pass through.
光源31收容在安装空间321内,光源31可以是垂直腔面发射激光器(Vertical Cavity Surface Emitting Laser,VCSEL),也可以是边发射激光器(Edge Emitting Laser,EEL)。光源31可以向外发出带有均匀光斑的光信号,光信号的波长为1350nm~1550nm,光信号穿过出光口322后可以到达扩散器33。光源31可以设置在第二面212上,光源31可以与导电件22电连接,并通过导电件22使得光源31与基板10电连接,以避免使用过于长或过于复杂的连接线路连接光源31与基板10,减少连接线路的寄生电感,有利于光源31打出理想的光信号,提升最终获取的深度信息的精度。在一个例子中,光源31的引脚可以直接与从第二面212露出的导电件22电连接,在另一个例子中,可以通过打线(Wire Bonding)的方式将光源31与导电件22电连接。The light source 31 is contained in the installation space 321, and the light source 31 may be a vertical cavity surface emitting laser (VCSEL) or an edge emitting laser (EEL). The light source 31 can send out a light signal with a uniform light spot, and the wavelength of the light signal is 1350 nm to 1550 nm, and the light signal can reach the diffuser 33 after passing through the light exit 322. The light source 31 can be arranged on the second surface 212, the light source 31 can be electrically connected to the conductive member 22, and the light source 31 is electrically connected to the substrate 10 through the conductive member 22, so as to avoid using too long or too complicated connection lines to connect the light source 31 and The substrate 10 reduces the parasitic inductance of the connection line, which is beneficial for the light source 31 to output an ideal optical signal, and improves the accuracy of the depth information finally obtained. In one example, the pins of the light source 31 may be directly electrically connected to the conductive member 22 exposed from the second surface 212. In another example, the light source 31 and the conductive member 22 may be electrically connected by wire bonding. connection.
扩散器33设置在支架32上,具体地,扩散器33可以通过胶35粘结在支架32上。 扩散器33包括相背的入光面331和出光面332,入光面331与光源31相对。扩散器33可以由透明的玻璃或者树脂等材料制成。扩散器33可以位于安装空间321外,例如,扩散器33可以完全覆盖出光口322,扩散器33的入光面331与支架32相抵触。从光源31发出的光信号穿过出光口322后到达扩散器33,扩散器33可以将光信号的视角范围增大,以使光发射模组30发出的光信号照射到更大的范围。穿过扩散器33的光信号可以进一步穿过通光口541,穿过通光口541后,光信号出射到深度相机100外。The diffuser 33 is disposed on the bracket 32. Specifically, the diffuser 33 may be bonded to the bracket 32 by glue 35. The diffuser 33 includes a light incident surface 331 and a light output surface 332 opposite to each other, and the light incident surface 331 is opposite to the light source 31. The diffuser 33 may be made of materials such as transparent glass or resin. The diffuser 33 may be located outside the installation space 321. For example, the diffuser 33 may completely cover the light outlet 322, and the light incident surface 331 of the diffuser 33 may conflict with the bracket 32. The light signal emitted from the light source 31 passes through the light outlet 322 and then reaches the diffuser 33. The diffuser 33 can increase the viewing angle range of the light signal, so that the light signal emitted by the light emitting module 30 illuminates a larger range. The light signal passing through the diffuser 33 may further pass through the light opening 541, and after passing through the light opening 541, the light signal exits the depth camera 100.
需要提到的是,若需要在机壳200上开孔以供光发射模组30发出的光信号穿出时,将光发射模组30垫高,可以减小光发射模组30与机壳200上的开孔的距离,由于光发射模组30发出的光信号为发散的光信号,故在出射光线的光通量相同的前提下,光发射模组30与机壳200上的开孔的距离越小,开孔的尺寸可以越小,开孔越小,一方面对电子设备1000的外观的影响较小,另一方面也能扩大电子设备1000的屏占比。It should be mentioned that if a hole needs to be opened on the casing 200 for the light signal emitted by the light emitting module 30 to pass through, the light emitting module 30 is heightened to reduce the light emitting module 30 and the casing. The distance between the openings on the 200. Since the light signal emitted by the light emitting module 30 is a divergent light signal, the distance between the light emitting module 30 and the opening on the casing 200 is the same under the premise that the luminous flux of the emitted light is the same The smaller the size, the smaller the size of the opening, and the smaller the opening. On the one hand, the impact on the appearance of the electronic device 1000 is smaller, and on the other hand, the screen-to-body ratio of the electronic device 1000 can be enlarged.
光检测器34设置在第二面212上,并位于安装空间321内。导电孔213用于供导电件22穿过以电连接光检测器34与基板10。光检测器34的数量可为一个或多个,光检测器34的数量为一个时,一个光检测器34对应一个导电孔213;光检测器34的数量为多个时,每个光检测器34对应一个导电孔213。光检测器34可以用于接收被扩散器33反射回的光信号以形成检测电信号,检测电信号可以是电流信号、电压信号、根据电流信号或电压信号计算出的功率信号、电阻信号等,在此不作限制。检测电信号可以作为确定光源31是否处于恒功率工作状态的依据,也可以作为确定扩散器33是否处于正常工作状态的依据,还可以在作为确定光源31是否处于恒功率工作状态的依据的同时作为确定扩散器33是否处于正常工作状态的依据。其中,光源31处于恒功率工作状态表示的是光源31输出的功率稳定在一个目标功率上(该目标功率可以是一个值或者是一个范围,当目标功率为一个值时,光源31输出的功率等于目标功率,当目标功率为一个功率范围时,光源31输出的功率位于该功率范围内),若光源31输出的功率未稳定在一个目标功率上,则说明光源31未处于恒功率工作状态。当然,不同的应用场景对光源31输出的功率的需求可能不一致,比如有些应用场景(例如深度相机100作为后置深度相机使用的应用场景)要求光源31输出的功率稳定在一个较高的功率(一个值或者是一个范围),例如要求光源31输出的功率稳定在10W。有些应用场景(例如深度相机100作为前置深度相机使用的应用场景)要求光源31输出的功率稳定在一个较低的功率(一个值或者是一个范围),例如要求光源31输出的功率稳定在5W-6W。其中,对于不同的应用场景,目标功率可以是不一致的。扩散器33处于正常工作状态表示的是扩散器33未损坏(如破裂)也未脱落,当扩散器33损坏和/或脱落时,扩散器33处于非正常工作状态。The light detector 34 is disposed on the second surface 212 and located in the installation space 321. The conductive hole 213 is used for allowing the conductive member 22 to pass through to electrically connect the photodetector 34 and the substrate 10. The number of photodetectors 34 can be one or more. When the number of photodetectors 34 is one, one photodetector 34 corresponds to one conductive hole 213; when the number of photodetectors 34 is more than one, each photodetector 34 corresponds to a conductive hole 213. The light detector 34 can be used to receive the light signal reflected by the diffuser 33 to form a detection electrical signal. The detection electrical signal can be a current signal, a voltage signal, a power signal calculated from a current signal or a voltage signal, a resistance signal, etc., There is no restriction here. The detected electrical signal can be used as a basis for determining whether the light source 31 is in a constant power working state, or as a basis for determining whether the diffuser 33 is in a normal working state, or as a basis for determining whether the light source 31 is in a constant power working state. The basis for determining whether the diffuser 33 is in a normal working state. Where the light source 31 is in a constant power working state, it means that the output power of the light source 31 is stable at a target power (the target power can be a value or a range. When the target power is a value, the power output by the light source 31 is equal to Target power, when the target power is within a power range, the power output by the light source 31 is within the power range). If the power output by the light source 31 is not stabilized at a target power, the light source 31 is not in a constant power working state. Of course, different application scenarios may have different requirements for the output power of the light source 31. For example, some application scenarios (such as the application scenario where the depth camera 100 is used as a rear depth camera) require the output power of the light source 31 to stabilize at a higher power ( A value or a range), for example, the output power of the light source 31 is required to stabilize at 10W. Some application scenarios (such as the application scenario where the depth camera 100 is used as a front depth camera) require that the output power of the light source 31 be stabilized at a lower power (a value or a range), for example, the output power of the light source 31 is required to be stabilized at 5W -6W. Among them, for different application scenarios, the target power may be inconsistent. When the diffuser 33 is in a normal working state, it means that the diffuser 33 is not damaged (such as ruptured) nor detached. When the diffuser 33 is damaged and/or detached, the diffuser 33 is in an abnormal working state.
具体地,当光源31处于恒功率工作状态并且扩散器33处于正常工作状态时,光源31输出功率稳定的光信号,扩散器33完好,光检测器34可以接收到由扩散器33反射回的全部光信号,光检测器34输出的检测电信号会等于第一电信号(即一个值)或者是位于第一电信号范围内。由于不同应用场景对光源31输出的功率的要求不同,因此,第一电信号(或第一电信号范围)是根据不同应用场景下的目标功率来决定的,当目标功率较大,第一电信号(或第一电信号范围中的值)也较大;当目标功率较小,第一电信号(或第一电信号范围中的值)也较小。当光源31未处于恒功率工作状态并且扩散器33处于正常工作状态时,检测电信号会等于第二电信号(即一个值)或位于第二电信号范围内,其中,当检测电信号等于第二电信号时,第二电信号小于第一电信号或小于第一电信号范围的最小值;当检测电信号位于第二电信号范围内时,第二电信号范围的最大值小于第一电信号或小于第一电信号范围的最小值。光源31未处于恒功率工作状态可能是由于光源31的温度变化导致,一般地,光源31的温度变升高时,光源31输出的功率无法稳定在当前的应用场景要求的目标功率上,光源31输出的功率会降低,光检测器34接收到的由扩散器33反射回的光信号的量减少,输出的检测电信号也减小。当扩散器33未处于正常工作状态时,此时无论光源31是否处于恒功率工作状态,检测电信号均会等于第三电信号(即一个值)或位于第三电信号范围内,其中,当检测电信号等于第三电信号时,第三电信号小于第二电信号或小于第二电信号范围的最小值;当检测电信号位于第三电信号范围内时,第三电信号范围的最大值小于第二电信号或小于第二电信号范围的最小值。可以理解,当扩散器33损坏和/或脱落时,无论光源31输出的光信号的功率是否稳定在目标功率上,扩散器33反射回来的光信号都将大大减少,光检测器34能接收到的被反射回的光信号也大大减少,输出的检测电信号会大幅降低。Specifically, when the light source 31 is in a constant power working state and the diffuser 33 is in a normal working state, the light source 31 outputs a light signal with stable power, the diffuser 33 is intact, and the light detector 34 can receive all the reflected light from the diffuser 33. For the optical signal, the detected electrical signal output by the photodetector 34 will be equal to the first electrical signal (ie a value) or be within the range of the first electrical signal. Since different application scenarios have different requirements for the output power of the light source 31, the first electrical signal (or the first electrical signal range) is determined according to the target power in different application scenarios. When the target power is larger, the first electrical signal The signal (or the value in the first electrical signal range) is also larger; when the target power is smaller, the first electrical signal (or the value in the first electrical signal range) is also smaller. When the light source 31 is not in a constant power working state and the diffuser 33 is in a normal working state, the detection electrical signal will be equal to the second electrical signal (ie a value) or within the range of the second electrical signal, wherein, when the detection electrical signal is equal to the first For the second electrical signal, the second electrical signal is smaller than the first electrical signal or smaller than the minimum value of the first electrical signal range; when the detection electrical signal is within the second electrical signal range, the maximum value of the second electrical signal range is less than the first electrical signal The signal may be less than the minimum value of the first electrical signal range. The light source 31 is not in a constant power working state may be caused by the temperature change of the light source 31. Generally, when the temperature of the light source 31 increases, the output power of the light source 31 cannot be stabilized at the target power required by the current application scenario. The output power will be reduced, the amount of the light signal reflected by the diffuser 33 received by the photodetector 34 will be reduced, and the output detection electrical signal will also be reduced. When the diffuser 33 is not in a normal working state, no matter whether the light source 31 is in a constant power working state, the detection electrical signal will be equal to the third electrical signal (ie a value) or within the range of the third electrical signal. When the detected electrical signal is equal to the third electrical signal, the third electrical signal is less than the second electrical signal or less than the minimum value of the second electrical signal range; when the detected electrical signal is within the third electrical signal range, the third electrical signal range is the largest The value is smaller than the second electrical signal or smaller than the minimum value of the second electrical signal range. It can be understood that when the diffuser 33 is damaged and/or falls off, regardless of whether the power of the optical signal output by the light source 31 is stable at the target power, the optical signal reflected by the diffuser 33 will be greatly reduced, and the photodetector 34 can receive The reflected light signal is also greatly reduced, and the output detection electrical signal will be greatly reduced.
请参阅图10和图11,高反射膜36设置在扩散器33上。扩散器33包括镀膜区域334和与镀膜区域334相接的非镀膜区域333。高反射膜36形成在镀膜区域334,镀膜区域334与光检测器34的收光区域对应;非镀膜区域334与光源31发射光信号的光信号区域对应。当光检测器34的数量为一个时,镀膜区域334与一个光检测器34的收光区域对应;当光检测器34的数量为多个时,镀膜区域334与多个光检测器34的收光区域对应,示例地,镀膜区域334可以环绕非镀膜区域333,以使镀膜区域334可以对应多个光检测器34的收光区域。高反射膜36用于反射波长为1350~1550nm的光信号。可以理解,当户外的环境光线的强度较强时,环境光线中可能会存在少量的1350~1550nm的光线,这部分光线可能穿过扩散器33入射到光检测器34上,那么光检测器34除了能接收到被扩散器33反射回的光信号之外,还可能接收到环境光线中 的1350~1550nm的光线。高反射膜36具有高反射率,利用高反射膜36反射环境光线中的1350~1550nm的光线,可以避免环境光线中的1350~1550nm的光线对光检测器34产生干扰。Referring to FIG. 10 and FIG. 11, the high reflection film 36 is provided on the diffuser 33. The diffuser 33 includes a coating area 334 and a non-coating area 333 connected to the coating area 334. The highly reflective film 36 is formed in the coating area 334, and the coating area 334 corresponds to the light receiving area of the photodetector 34; the non-coating area 334 corresponds to the optical signal area where the light source 31 emits optical signals. When the number of photodetectors 34 is one, the coating area 334 corresponds to the light-receiving area of one photodetector 34; when the number of photodetectors 34 is multiple, the coating area 334 and the light-receiving area of multiple photodetectors 34 The light area corresponds, for example, the coated area 334 may surround the non-coated area 333, so that the coated area 334 can correspond to the light-receiving areas of the multiple photodetectors 34. The highly reflective film 36 is used to reflect light signals with a wavelength of 1350 to 1550 nm. It can be understood that when the intensity of the outdoor ambient light is strong, there may be a small amount of 1350-1550nm light in the ambient light. This part of the light may pass through the diffuser 33 and be incident on the light detector 34, then the light detector 34 In addition to receiving the light signal reflected back by the diffuser 33, it is also possible to receive light of 1350 to 1550 nm in the ambient light. The high reflection film 36 has high reflectivity. The high reflection film 36 is used to reflect the light of 1350 to 1550 nm in the ambient light, which can prevent the light of 1350 to 1550 nm in the ambient light from interfering with the photodetector 34.
滤光膜37设置在光检测器34上。当光检测器34的个数为一个时,滤光膜37也为一个,该一个滤光膜37设置在该一个光检测器34上;当光检测器34的个数为多个时,滤光膜37也为多个,每个光检测器34上均设置有一个滤光膜37。滤光膜37可以用于仅透过波长1350nm~1550nm的光信号。可以理解,虽然设置了高反射膜36,但环境光线中的波长位于1350nm~1550nm以外的光线可能穿过扩散器33入射到光检测器34上。在光检测器34上设置滤光膜37,可以阻挡环境光线中的波长位于1350nm~1550nm以外的光线入射到光检测器34上,光检测器34可以仅接收到被扩散器33反射的光信号以输出检测电信号,该检测电信号的准确度更高,基于准确度更高的检测电信号确定出来的光源31的工作状态和/或扩散器33的工作状态更为准确。The filter film 37 is provided on the light detector 34. When the number of photodetectors 34 is one, there is also one filter film 37, and the one filter film 37 is arranged on the one photodetector 34; when the number of photodetectors 34 is more than one, the filter There are also multiple light films 37, and each light detector 34 is provided with a filter film 37. The filter film 37 can be used to transmit only light signals with a wavelength of 1350 nm to 1550 nm. It can be understood that although the highly reflective film 36 is provided, light with a wavelength outside of 1350 nm to 1550 nm in the ambient light may pass through the diffuser 33 and be incident on the photodetector 34. A filter film 37 is provided on the photodetector 34, which can block the ambient light with wavelengths other than 1350nm-1550nm from being incident on the photodetector 34, and the photodetector 34 can only receive the light signal reflected by the diffuser 33 In order to output the detection electrical signal, the accuracy of the detection electrical signal is higher, and the working state of the light source 31 and/or the working state of the diffuser 33 determined based on the more accurate detection electrical signal is more accurate.
请参阅图2、图4、图6及图7,光接收模组40设置在基板10上,光接收模组40上形成有入光口411,外界的光信号穿过入光口411后进入光接收模组40。在本申请实施例中,形成通光口541的平面可以与形成入光口411的平面齐平,使得穿过通光口541进入外界的光信号不会被光接收模组40遮挡,以及从外界穿入入光口411的光信号不会被光发射模组30遮挡。Please refer to Figure 2, Figure 4, Figure 6 and Figure 7, the light receiving module 40 is arranged on the substrate 10, the light receiving module 40 is formed with a light entrance 411, external light signals enter through the light entrance 411 Light receiving module 40. In the embodiment of the present application, the plane forming the light opening 541 can be flush with the plane forming the light entrance 411, so that the light signal entering the outside through the light opening 541 will not be blocked by the light receiving module 40, and from The light signal passing through the light entrance 411 from outside will not be blocked by the light emitting module 30.
光接收模组40与光发射模组30设置在同一个基板10上,使得光接收模组40与光发射模组30的位置相对固定,不需要额外再使用支架对光接收模组40及光发射模组30进行固定。在安装深度相机100时,可以将深度相机100整体安装在机壳200内,而不需要分别安装光接收模组40及光发射模组30后再进行标定。另外,深度相机100还可包括连接器60,连接器60连接在基板10上,连接器60与电子设备1000的主板电连接。连接器60的数量可以是单个,单个连接器60可通过线路走线同时与光发射模组30及光接收模组40电性连接,不需要设置多个连接器60。光接收模组40包括感光元件42、滤光片44、镜筒41及镜头组件43。The light receiving module 40 and the light emitting module 30 are disposed on the same substrate 10, so that the positions of the light receiving module 40 and the light emitting module 30 are relatively fixed, and there is no need to use additional brackets for the light receiving module 40 and the light The transmitting module 30 is fixed. When the depth camera 100 is installed, the depth camera 100 can be installed in the housing 200 as a whole, without the need to separately install the light receiving module 40 and the light emitting module 30 before performing calibration. In addition, the depth camera 100 may further include a connector 60 connected to the substrate 10, and the connector 60 is electrically connected to the main board of the electronic device 1000. The number of the connector 60 can be a single one, and a single connector 60 can be electrically connected to the light emitting module 30 and the light receiving module 40 at the same time through wire routing, and there is no need to provide multiple connectors 60. The light receiving module 40 includes a photosensitive element 42, a filter 44, a lens barrel 41 and a lens assembly 43.
感光元件42可以设置在基板10上并与基板10电连接,感光元件42收容在第二收容腔52内。感光元件42用于仅接收经过镜头组件43且波段为1350nm~1550nm的光信号。感光元件42的材料可以包括硅和锗,其中,锗的占比小于或等于10%,比如,锗的占比可以是0.1%、1%、2.5%、3.8%、5%、7%、8%、9%、10%等等。感光元件42的材料还可以包括硅和铟镓砷。可以理解,由硅制成的感光元件只能响应波段为350nm-1064nm的光信号,无法响应波段为1350nm~1550nm的光信号,而由硅和锗制成的感光元件42或者由硅和铟镓砷制成的感光元件42可以响应波长较长的光信号,如1350nm~1550nm的光 信号,因此,可以使用硅和锗制作感光元件42或者使用硅和铟镓砷来制作感光元件42。感光元件42接收到光信号后,感光元件42将光信号转化为电信号,该电信号可以用于深度信息的计算。The photosensitive element 42 may be disposed on the substrate 10 and electrically connected to the substrate 10, and the photosensitive element 42 is accommodated in the second receiving cavity 52. The photosensitive element 42 is used for receiving only the optical signal passing through the lens assembly 43 and having a wavelength range of 1350 nm to 1550 nm. The material of the photosensitive element 42 may include silicon and germanium, wherein the proportion of germanium is less than or equal to 10%, for example, the proportion of germanium may be 0.1%, 1%, 2.5%, 3.8%, 5%, 7%, 8. %, 9%, 10%, etc. The material of the photosensitive element 42 may also include silicon and indium gallium arsenide. It can be understood that the photosensitive element made of silicon can only respond to light signals in the wavelength range of 350nm-1064nm, and cannot respond to light signals in the wavelength range of 1350nm to 1550nm, while the photosensitive element 42 made of silicon and germanium is either made of silicon and indium gallium The photosensitive element 42 made of arsenic can respond to light signals with longer wavelengths, such as 1350 nm to 1550 nm. Therefore, the photosensitive element 42 can be made of silicon and germanium or the photosensitive element 42 can be made of silicon and indium gallium arsenide. After the photosensitive element 42 receives the optical signal, the photosensitive element 42 converts the optical signal into an electrical signal, and the electrical signal can be used for calculating depth information.
滤光片44设置在感光元件42上方,并收容在第二收容腔52内。滤光片44用于仅透过波长为1350nm~1550nm的光信号,如此感光元件42仅能接收到波长为1350nm~1550nm的光信号。镜头组件43可以安装在镜筒41内。镜头组件43可以由多个(如4个)镜片组成。上述的入光口411开设在镜筒41上。光信号从入光口411进入后,首先穿过镜头组件43并入射到滤光片44上,滤光片44过滤掉波长位于1350nm~1550nm之外的光信号,最终仅1350nm~1550nm的光信号可以汇聚到感光元件42上。镜筒41可以与壳体50可拆卸地安装,具体地,镜筒41可以与第二子壳体55可拆卸地安装。在本申请实施例中,壳体50还开设有安装槽53,安装槽53可以用于安装镜筒41。安装槽53的位置可以与第二收容腔52的位置对应。镜筒41的外壁形成有外螺纹,安装槽53的内壁形成有内螺纹,镜筒41与壳体50通过外螺纹与内螺纹可拆卸地连接,例如将镜筒41旋入安装槽53内,或者将镜筒41从安装槽53内旋出。The filter 44 is disposed above the photosensitive element 42 and is received in the second receiving cavity 52. The filter 44 is used to only transmit light signals with a wavelength of 1350 nm to 1550 nm, so the photosensitive element 42 can only receive light signals with a wavelength of 1350 nm to 1550 nm. The lens assembly 43 may be installed in the lens barrel 41. The lens assembly 43 may be composed of multiple (for example, 4) lenses. The aforementioned light entrance 411 is opened on the lens barrel 41. After the optical signal enters from the light entrance 411, it first passes through the lens assembly 43 and is incident on the filter 44. The filter 44 filters out the optical signals with wavelengths outside of 1350nm-1550nm, and finally only the optical signals with 1350nm-1550nm It can be focused on the photosensitive element 42. The lens barrel 41 may be detachably installed with the housing 50, specifically, the lens barrel 41 may be detachably installed with the second sub-housing 55. In the embodiment of the present application, the housing 50 is further provided with an installation groove 53, and the installation groove 53 can be used for installing the lens barrel 41. The position of the installation groove 53 may correspond to the position of the second receiving cavity 52. The outer wall of the lens barrel 41 is formed with an external thread, and the inner wall of the installation groove 53 is formed with an internal thread. The lens barrel 41 and the housing 50 are detachably connected with the external thread and the internal thread. For example, the lens barrel 41 is screwed into the installation groove 53. Or the lens barrel 41 is screwed out of the installation groove 53.
在安装深度相机100时,可以先将垫块组件20及感光元件42先固定在基板10上,同时电连接导电件22与基板10、感光元件42与基板10;然后将光发射模组30安装在垫块21的第二面212上,同时电连接光源31与导电件22;然后将壳体50固定在基板10上,使得光发射模组30与垫块组件20收容在第一收容腔51内,感光元件42收容在第二收容腔52内;最后可将装有镜头组件43的镜筒41旋入安装槽53内,以完成整个深度相机100的组装。当然,装有镜头组件43的镜筒41也可以先旋入安装槽53内,再将安装有镜筒41的壳体50固定在基板10上。在需要时(比如更换镜头组件43时),可以单独将镜筒41与壳体50分离,而不需要先将壳体50与基板10分离。When installing the depth camera 100, the spacer assembly 20 and the photosensitive element 42 can be fixed on the substrate 10 first, and at the same time the conductive member 22 and the substrate 10, and the photosensitive element 42 and the substrate 10 are electrically connected; then the light emitting module 30 is installed On the second surface 212 of the cushion block 21, the light source 31 and the conductive member 22 are electrically connected at the same time; then the housing 50 is fixed on the substrate 10, so that the light emitting module 30 and the cushion block assembly 20 are received in the first receiving cavity 51 Inside, the photosensitive element 42 is accommodated in the second receiving cavity 52; finally, the lens barrel 41 with the lens assembly 43 can be screwed into the mounting groove 53 to complete the assembly of the entire depth camera 100. Of course, the lens barrel 41 with the lens assembly 43 can also be screwed into the mounting groove 53 first, and then the housing 50 with the lens barrel 41 is fixed on the substrate 10. When necessary (for example, when replacing the lens assembly 43), the lens barrel 41 can be separated from the housing 50 separately, without the need to separate the housing 50 from the substrate 10 first.
请参阅图1、图4及图6,处理器70可以设置在深度相机100外,例如,设置在电子设备1000的主板上,并与深度相机100的连接器60电连接。处理器70也可以设置在深度相机100内,例如设置在光发射模组30内或设置在光接收模组40内等。处理器70可以根据光发射模组30发射光信号的时刻以及光接收模组40接收光信号的时刻来计算深度信息。处理器70还可以接收光检测器34输出的检测电信号,并根据检测电信号确定光源31是否处于恒功率工作状态和/或确定扩散器33是否处于正常工作状态,具体确定过程如前所述,在此不再赘述。处理器70还可以根据光源31是否处于恒功率工作状态和/或扩散器33是否处于正常工作状态来控制光源31。Referring to FIGS. 1, 4 and 6, the processor 70 may be provided outside the depth camera 100, for example, on the main board of the electronic device 1000 and electrically connected to the connector 60 of the depth camera 100. The processor 70 may also be arranged in the depth camera 100, for example, in the light emitting module 30 or in the light receiving module 40. The processor 70 may calculate the depth information according to the time when the light transmitting module 30 transmits the light signal and the time when the light receiving module 40 receives the light signal. The processor 70 may also receive the detection electrical signal output by the photodetector 34, and determine whether the light source 31 is in a constant power working state and/or whether the diffuser 33 is in a normal working state according to the detection electrical signal. The specific determination process is as described above , I won’t repeat it here. The processor 70 may also control the light source 31 according to whether the light source 31 is in a constant power working state and/or whether the diffuser 33 is in a normal working state.
具体地,当检测电信号等于第一电信号或位于第一电信号范围内时,处理器70用于控制驱动光源31发光的驱动电路仍旧以当前的工作电流来驱动光源31发光。Specifically, when the detected electrical signal is equal to the first electrical signal or is within the range of the first electrical signal, the processor 70 is used to control the driving circuit for driving the light source 31 to emit light and still drive the light source 31 to emit light with the current operating current.
当检测电信号等于第二电信号或位于第二电信号范围内时,处理器70可以控制驱动电路提高工作电流来驱动光源31发光,以使光源31输出的功率保持在目标功率。在一个例子中,工作电流提高后的值可以借助温度检测器来选定,具体地,光发射模组30还可以包括温度检测器(图未示),温度检测器可以设置在第二面212上且与光源31邻近,温度检测器用于检测光源31的温度。在检测电信号等于第二电信号或位于第二电信号范围内时,处理器70控制温度检测器检测光源31的温度,处理器70再根据该温度及目标功率从工作电流-功率-温度曲线(不同温度对应不同的工作电流-功率曲线)中找出目标工作电流,在当前光源31的温度下,目标工作电流对应的功率处于目标功率。处理器70可以控制驱动电路以目标工作电流来驱动光源31发光,以使得光源31输出功率恒定的光信号。在处理器70控制驱动电路以升高后的目标工作电流驱动光源31发光后,光检测器34还可以继续接收被扩散器33反射回的光线并输出检测电信号,此时,若检测电信号等于第一电信号或位于第一电信号范围内,则处理器70继续控制驱动电路以升高后的目标工作电流来驱动光源31发光;若检测电信号等于第二电信号或位于第二范围内,则处理器70再次控制温度检测器检测光源31的温度,并根据温度更新目标工作电流(更新后的目标工作电流高于更新前的目标工作电流),处理器70控制更新后的目标工作电流来驱动光源31发光。如此循环往复,处理器70根据光检测器34的反馈逐步提升驱动光源31发光的工作电流,如此通过软件设计保证光源31始终能够输出功率恒定的光信号,实现光发射模组30的自动功率控制(Automatic Power Control,APC)调节功能(图12所示)。When the detected electrical signal is equal to the second electrical signal or within the range of the second electrical signal, the processor 70 may control the driving circuit to increase the operating current to drive the light source 31 to emit light, so that the power output by the light source 31 is maintained at the target power. In an example, the value of the increased operating current can be selected with the help of a temperature detector. Specifically, the light emitting module 30 may also include a temperature detector (not shown), and the temperature detector may be arranged on the second surface 212 Above and adjacent to the light source 31, a temperature detector is used to detect the temperature of the light source 31. When the detected electrical signal is equal to the second electrical signal or within the range of the second electrical signal, the processor 70 controls the temperature detector to detect the temperature of the light source 31, and the processor 70 then changes the operating current-power-temperature curve based on the temperature and the target power. (Different temperatures correspond to different operating current-power curves) find the target operating current, and at the current temperature of the light source 31, the power corresponding to the target operating current is at the target power. The processor 70 may control the driving circuit to drive the light source 31 to emit light with a target operating current, so that the light source 31 outputs an optical signal with a constant power. After the processor 70 controls the drive circuit to drive the light source 31 to emit light with the increased target operating current, the photodetector 34 can continue to receive the light reflected by the diffuser 33 and output a detection electrical signal. At this time, if the electrical signal is detected Equal to the first electrical signal or within the range of the first electrical signal, the processor 70 continues to control the drive circuit to drive the light source 31 to emit light with the increased target operating current; if the detected electrical signal is equal to the second electrical signal or is within the second range , The processor 70 again controls the temperature detector to detect the temperature of the light source 31, and updates the target operating current according to the temperature (the updated target operating current is higher than the target operating current before the update), and the processor 70 controls the updated target operating current The current drives the light source 31 to emit light. In this cycle, the processor 70 gradually increases the operating current for driving the light source 31 to emit light according to the feedback of the photodetector 34, so that the software design ensures that the light source 31 can always output a light signal with a constant power, realizing automatic power control of the light emitting module 30 (Automatic Power Control, APC) adjustment function (shown in Figure 12).
当检测电信号位于第三电信号范围内时,表明扩散器33未处于正常工作状态,即扩散器33损坏或脱落,此时,处理器70可以控制驱动电路停止向光源31提供工作电流以关闭光源31。可以理解,当扩散器33损坏或脱落时,扩散器33无法将光源31发射的光信号扩散成均匀的面光,这将导致深度相机100无法正常使用。在扩散器33损坏或脱落时,处理器70关闭光源31可以避免深度相机100在无法正常使用的情况下持续发射光信号,从而可以节省电子设备1000的能耗。When the detected electrical signal is within the range of the third electrical signal, it indicates that the diffuser 33 is not in a normal working state, that is, the diffuser 33 is damaged or falls off. At this time, the processor 70 can control the driving circuit to stop supplying operating current to the light source 31 to turn off Light source 31. It can be understood that when the diffuser 33 is damaged or falls off, the diffuser 33 cannot diffuse the light signal emitted by the light source 31 into a uniform surface light, which will cause the depth camera 100 to fail to be used normally. When the diffuser 33 is damaged or falls off, the processor 70 turns off the light source 31 to prevent the depth camera 100 from continuously emitting light signals when it cannot be used normally, thereby saving energy consumption of the electronic device 1000.
综上,本申请实施方式的光发射模组30、光接收模组40、深度相机100及电子设备1000中,光发射模组30发射波长为1350nm~1550nm光信号,光接收模组40接收波长为1350nm~1550nm光信号,环境光线中几乎不存在波长为1350nm~1550nm的背景光信号,从而避免背景光信号对光接收模组40接收光信号的时刻的计算的影响,进一步地可以提升深度信息的获取精度。此外,波长较长的光信号的能量较低,且根据人眼的特性,波长较长的光信号不会汇聚在视网膜上,因此,使用波长为1350nm~1550nm光信号可以避免对人眼造成伤害。In summary, in the light emitting module 30, the light receiving module 40, the depth camera 100, and the electronic device 1000 of the embodiment of the present application, the light emitting module 30 emits light signals with a wavelength of 1350 nm to 1550 nm, and the light receiving module 40 receives a wavelength It is an optical signal from 1350nm to 1550nm, and there is almost no background light signal with a wavelength of 1350nm to 1550nm in the ambient light, thereby avoiding the influence of the background light signal on the calculation of the time when the light receiving module 40 receives the optical signal, and further improving the depth information The acquisition accuracy. In addition, light signals with longer wavelengths have lower energy, and according to the characteristics of the human eye, light signals with longer wavelengths will not converge on the retina. Therefore, the use of light signals with a wavelength of 1350nm to 1550nm can avoid harm to human eyes .
另外,光发射模组30中还设置了光检测器34来检测光源31的工作状态以及扩散器33的工作状态,从而可以根据光检测器34来检测光源31的工作状态以及扩散器33的工作状态更好地控制光源31。在扩散器33正常工作但光源31未处于恒功率工作状态时,提升光源31的工作电流从而保障光发射模组30可以输出功率稳定的光信号,进一步可以提升深度信息的获取精度。在扩散器33未能正常工作时,关闭光源31可以减小电子设备1000的功耗。In addition, the light emitting module 30 is also provided with a light detector 34 to detect the working state of the light source 31 and the working state of the diffuser 33, so that the working state of the light source 31 and the working state of the diffuser 33 can be detected according to the light detector 34. The state better controls the light source 31. When the diffuser 33 is working normally but the light source 31 is not in a constant power working state, the working current of the light source 31 is increased to ensure that the light emitting module 30 can output a light signal with stable power, which can further improve the acquisition accuracy of depth information. When the diffuser 33 fails to work normally, turning off the light source 31 can reduce the power consumption of the electronic device 1000.
再者,光发射模组30设置在垫块21的第二面212上,并通过导电件22将光发射模组30与基板10电性连接,垫块21垫高光发射模组30的高度,减小光发射模组30与光接收模组40之间的高度差,避免光接收模组40遮挡到光发射模组30发射光信号,光发射模组30发出的光信号具有更大的覆盖范围,深度相机100可以获得场景中更多物体的深度信息,获得的深度信息完整度高。Furthermore, the light emitting module 30 is disposed on the second surface 212 of the cushion block 21, and the light emitting module 30 is electrically connected to the substrate 10 through the conductive member 22, and the cushion block 21 cushions the height of the high light emitting module 30. The height difference between the light emitting module 30 and the light receiving module 40 is reduced, and the light receiving module 40 is prevented from being blocked by the light emitting module 30 to emit light signals, and the light signals emitted by the light emitting module 30 have greater coverage Range, the depth camera 100 can obtain depth information of more objects in the scene, and the obtained depth information is highly complete.
请参阅图4、图8及图9,在某些实施方式中,垫块21还开设有导热孔214,导热孔214贯穿第一面211及第二面212。垫块组件20还包括导热件23,导热件23填充在导热孔214内。光源31设置在导热件23上。光源31在工作时会产生热量,而如果热量不能及时地散去,可能会影响光源31发射的光信号的强度、频率等参数使得光源31无法保持在恒功率工作状态。此时,若将光源31设置在导热件23上,导热件23可以较快速地将光源31产生的热量传导到基板10上,并进一步通过基板10将热量传导至外界,从而能够通过硬件设计使光源31保持在恒功率工作状态。Please refer to FIGS. 4, 8 and 9, in some embodiments, the spacer 21 is further provided with a thermally conductive hole 214, and the thermally conductive hole 214 penetrates the first surface 211 and the second surface 212. The spacer assembly 20 further includes a heat conducting member 23 which is filled in the heat conducting hole 214. The light source 31 is arranged on the heat conducting member 23. The light source 31 generates heat during operation, and if the heat cannot be dissipated in time, it may affect the intensity and frequency of the optical signal emitted by the light source 31 and make the light source 31 unable to maintain a constant power working state. At this time, if the light source 31 is arranged on the heat-conducting member 23, the heat-conducting member 23 can quickly conduct the heat generated by the light source 31 to the substrate 10, and further conduct the heat to the outside through the substrate 10, so that the hardware design can be used The light source 31 is kept in a constant power working state.
具体地,导热件23填充在导热孔214内,导热件23具体可以由铜、银等导热性能较佳的材料制成。导热件23从第一面211及第二面212露出,以便于导热件23的一端与光源31接触,另一端与基板10接触。光源31在第二面212的正投影可以完全落入至导热件23上,以使光源31与导热件23的接触面积较大,提高导热效率。在一个例子中,导热孔214的数量为多个,多个导热相互间隔设置,每个导热孔214内设置的导热件23均与光源31接触;在另一个例子中,导热孔214的数量为单个,单个导热孔214的中空的体积可以设置得较大,例如大于上述开设多个导热孔214时,多个导热孔214的中空的体积的总和,如此,以使单个导热孔214内可以设置更大量的导热件23,提高导热效率。Specifically, the heat-conducting member 23 is filled in the heat-conducting hole 214, and the heat-conducting member 23 may be made of a material with better thermal conductivity such as copper and silver. The heat-conducting element 23 is exposed from the first surface 211 and the second surface 212 so that one end of the heat-conducting element 23 is in contact with the light source 31 and the other end is in contact with the substrate 10. The orthographic projection of the light source 31 on the second surface 212 can completely fall onto the heat-conducting member 23, so that the contact area between the light source 31 and the heat-conducting member 23 is larger, and the heat conduction efficiency is improved. In one example, the number of heat conducting holes 214 is multiple, and the plurality of heat conducting holes are arranged at intervals, and the heat conducting member 23 arranged in each heat conducting hole 214 is in contact with the light source 31; in another example, the number of heat conducting holes 214 is Single, the hollow volume of a single heat conduction hole 214 can be set to be larger, for example, greater than the sum of the hollow volumes of the plurality of heat conduction holes 214 when multiple heat conduction holes 214 are opened, so that the single heat conduction hole 214 can be set A larger number of heat-conducting parts 23 improves heat-conducting efficiency.
进一步地,导热孔214还可以开设成上小下大的形状,即,导热孔214的靠近第二面212的一端的大小可以与光源31在第二面212的正投影的面积基本相同,靠近第一面211的一端的大小可以设置得较光源31在第二面212的正投影的面积更大,以加大导热件23与基板10的接触面积,提高导热效率。Further, the heat conducting hole 214 can also be opened in a small top and big bottom shape, that is, the size of the end of the heat conducting hole 214 close to the second surface 212 can be substantially the same as the area of the orthographic projection of the light source 31 on the second surface 212, close to The size of one end of the first surface 211 can be set to be larger than the area of the orthographic projection of the light source 31 on the second surface 212, so as to increase the contact area between the heat conducting member 23 and the substrate 10 and improve the heat conduction efficiency.
请参阅图4,在某些实施方式中,光检测器34设置在第二面212上时,导电孔213 可以用于供导电件22穿过以电连接光检测器34与基板10。光检测器34与导电件22可以通过打线的方式电连接,或者光检测器34的引脚与导电件22直接接触。另外,与光检测器34对准的位置还可以开设有上述的导热孔214,导热孔214内的导热件23可以用于将光检测器34工作产生的热量迅速地传导至基板10上,以确保光检测器34正常工作。Referring to FIG. 4, in some embodiments, when the photodetector 34 is disposed on the second surface 212, the conductive hole 213 can be used for the conductive member 22 to pass through to electrically connect the photodetector 34 and the substrate 10. The photodetector 34 and the conductive member 22 may be electrically connected by wire bonding, or the pins of the photodetector 34 may directly contact the conductive member 22. In addition, the position aligned with the photodetector 34 can also be provided with the above-mentioned thermally conductive hole 214, and the thermally conductive member 23 in the thermally conductive hole 214 can be used to quickly conduct the heat generated by the photodetector 34 to the substrate 10 to Ensure that the light detector 34 is working properly.
在某些实施方式中,光发射模组30中也可以不设置滤光膜37。此时,光检测器37可以设置为仅能接收1350nm~1550nm的光信号的元件。具体地,可以通过改变光检测器34中的材料构成来改变光检测器34的工作波段,使得光检测器34仅工作在1350nm~1550nm这一波段中。In some embodiments, the filter film 37 may not be provided in the light emitting module 30. At this time, the photodetector 37 can be set as an element that can only receive light signals from 1350 nm to 1550 nm. Specifically, the working waveband of the photodetector 34 can be changed by changing the material composition of the photodetector 34, so that the photodetector 34 only works in the waveband of 1350nm-1550nm.
在某些实施方式中,光接收模组40可以不设置滤光片44,此时,感光元件42可为仅接收1350nm~1550nm的光信号的感光元件。具体地,也可以通过改变感光元件42中的材料构成来改变感光元件42的工作波段,使得感光元件42仅工作在1350nm~1550nm这一波段中。In some embodiments, the light receiving module 40 may not be provided with the filter 44. In this case, the photosensitive element 42 may be a photosensitive element that only receives light signals from 1350 nm to 1550 nm. Specifically, the working wavelength band of the photosensitive element 42 can also be changed by changing the material composition of the photosensitive element 42 so that the photosensitive element 42 only operates in the wavelength band of 1350 nm to 1550 nm.
在某些实施方式中,光发射模组30和光接收模组40也可以放置在两个独立的基板10上,并通过两个连接器60分别与电子设备1000的主板连接。In some embodiments, the light emitting module 30 and the light receiving module 40 can also be placed on two independent substrates 10 and connected to the main board of the electronic device 1000 through two connectors 60 respectively.
在本说明书的描述中,参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。In the description of this specification, reference is made to the terms “certain embodiments”, “one embodiment”, “some embodiments”, “exemplary embodiments”, “examples”, “specific examples”, or “some examples”. The description means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above-mentioned terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials, or characteristics can be combined in any one or more embodiments or examples in an appropriate manner.
此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个所述特征。在本申请的描述中,“多个”的含义是至少两个,例如两个,三个,除非另有明确具体的限定。In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present application, "plurality" means at least two, such as two or three, unless otherwise specifically defined.
尽管上面已经示出和描述了本申请的实施例,可以理解的是,上述实施例是示例性的,不能理解为对本申请的限制,本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型,本申请的范围由权利要求及其等同物限定。Although the embodiments of the present application have been shown and described above, it can be understood that the above-mentioned embodiments are exemplary and should not be construed as limiting the present application. A person of ordinary skill in the art can comment on the foregoing within the scope of the present application. The embodiments undergo changes, modifications, substitutions and modifications, and the scope of this application is defined by the claims and their equivalents.

Claims (25)

  1. 一种光发射模组,其特征在于,所述光发射模组包括:A light emitting module, characterized in that the light emitting module includes:
    光源,所述光源用于发射光信号,所述光信号的波长为1350nm~1550nm;和A light source, the light source is used to emit a light signal, and the wavelength of the light signal is 1350nm-1550nm; and
    扩散器,所述扩散器用于扩散所述光信号。A diffuser, which is used to diffuse the optical signal.
  2. 根据权利要求1所述的光发射模组,其特征在于,所述光发射模组还包括光检测器,所述光检测器用于接收被所述扩散器反射回的光信号以形成检测电信号,所述检测电信号作为确定所述光源是否处于恒功率工作状态的依据和/或作为确定所述扩散器是否处于正常工作状态的依据。The light emitting module according to claim 1, wherein the light emitting module further comprises a light detector, and the light detector is used to receive the light signal reflected by the diffuser to form a detection electric signal The detected electrical signal is used as a basis for determining whether the light source is in a constant power working state and/or as a basis for determining whether the diffuser is in a normal working state.
  3. 根据权利要求2所述的光发射模组,其特征在于,所述扩散器包括相背的入光面和出光面,所述入光面与所述光源相对,所述出光面上设置有高反射膜,所述高反射膜用于反射波长为1350nm~1550nm的光线。The light emitting module according to claim 2, wherein the diffuser includes a light incident surface and a light output surface opposite to each other, the light incident surface is opposite to the light source, and the light output surface is provided with a high The reflective film, the highly reflective film is used to reflect light with a wavelength of 1350 nm to 1550 nm.
  4. 根据权利要求3所述的光发射模组,其特征在于,所述扩散器包括镀膜区域和与所述镀膜区域相接的非镀膜区域,所述高反射膜形成在所述镀膜区域,所述非镀膜区域与所述光源发射的光信号区域对应,所述镀膜区域与所述光检测器的收光区域对应。The light emitting module according to claim 3, wherein the diffuser comprises a coated area and a non-coated area connected to the coated area, the high reflective film is formed in the coated area, and The non-coated area corresponds to the light signal area emitted by the light source, and the coated area corresponds to the light receiving area of the photodetector.
  5. 根据权利要求3所述的光发射模组,其特征在于,所述光检测器的工作波段为1350nm~1550nm。3. The light emitting module of claim 3, wherein the working wavelength band of the light detector is 1350 nm to 1550 nm.
  6. 根据权利要求3所述的光发射模组,其特征在于,所述光检测器上设置有滤光膜,所述滤光膜用于透过波长为1350nm~1550nm的光信号。The light emitting module according to claim 3, wherein a filter film is provided on the photodetector, and the filter film is used to transmit optical signals with a wavelength of 1350 nm to 1550 nm.
  7. 一种光接收模组,其特征在于,所述光接收模组包括:A light receiving module, characterized in that the light receiving module includes:
    镜头组件;和Lens assembly; and
    感光元件,所述感光元件用于仅接收经过所述镜头组件且波段为1350nm~1550nm的光信号。The photosensitive element, the photosensitive element is used to receive only the optical signal passing through the lens assembly and having a wavelength range of 1350 nm to 1550 nm.
  8. 根据权利要求7所述的光接收模组,其特征在于,所述光接收模组还包括滤光片,所述滤光片用于仅透过波长为1350nm~1550nm的光信号。7. The light receiving module according to claim 7, wherein the light receiving module further comprises a filter, and the filter is used to transmit only optical signals with a wavelength of 1350 nm to 1550 nm.
  9. 根据权利要求7所述的光接收模组,其特征在于,所述感光元件的材料包括硅和锗;或The light receiving module according to claim 7, wherein the material of the photosensitive element includes silicon and germanium; or
    所述感光元件的材料包括硅和铟镓砷。The material of the photosensitive element includes silicon and indium gallium arsenide.
  10. 一种深度相机,其特征在于,所述深度相机包括:A depth camera, characterized in that the depth camera comprises:
    光发射模组,所述光发射模组包括:A light emitting module, the light emitting module includes:
    光源,所述光源用于发射光信号,所述光信号的波长为1350nm~1550nm;和A light source, the light source is used to emit a light signal, and the wavelength of the light signal is 1350nm-1550nm; and
    扩散器,所述扩散器用于扩散所述光信号;和A diffuser, the diffuser used to diffuse the optical signal; and
    光接收模组,所述光接收模组包括:The light receiving module includes:
    镜头组件;和Lens assembly; and
    感光元件,所述感光元件用于仅接收经过所述镜头组件且波段为1350nm~1550nm的光信号。The photosensitive element, the photosensitive element is used to receive only the optical signal passing through the lens assembly and having a wavelength range of 1350 nm to 1550 nm.
  11. 根据权利要求10所述的深度相机,其特征在于,所述光发射模组还包括光检测器,所述光检测器用于接收被所述扩散器反射回的光信号以形成检测电信号;The depth camera according to claim 10, wherein the light emitting module further comprises a light detector, and the light detector is configured to receive the light signal reflected by the diffuser to form a detection electric signal;
    所述深度相机还包括处理器,所述处理器用于:The depth camera further includes a processor, and the processor is configured to:
    根据所述检测电信号确定所述光源是否处于恒功率工作状态和/或确定所述扩散器是否处于正常工作状态;和Determining whether the light source is in a constant power working state and/or determining whether the diffuser is in a normal working state according to the detected electrical signal; and
    根据所述光源是否处于恒功率工作状态和/或所述扩散器是否处于正常工作状态控制所述光源。The light source is controlled according to whether the light source is in a constant power working state and/or whether the diffuser is in a normal working state.
  12. 根据权利要求11所述的深度相机,其特征在于,所述扩散器包括相背的入光面和出光面,所述入光面与所述光源相对,所述出光面上设置有高反射膜,所述高反射膜用于反射波长为1350nm~1550nm的光线。The depth camera according to claim 11, wherein the diffuser comprises a light-incident surface and a light-exit surface opposite to each other, the light-incident surface is opposite to the light source, and a high reflective film is provided on the light-emitting surface The high reflection film is used to reflect light with a wavelength of 1350 nm to 1550 nm.
  13. 根据权利要求12所述的深度相机,其特征在于,所述扩散器包括镀膜区域和与所述镀膜区域相接的非镀膜区域,所述高反射膜形成在所述镀膜区域,所述非镀膜区域与所述光源发射的光信号区域对应,所述镀膜区域与所述光检测器的收光区域对应。The depth camera according to claim 12, wherein the diffuser comprises a coated area and a non-coated area connected to the coated area, the high-reflective film is formed in the coated area, and the non-coated area The area corresponds to the light signal area emitted by the light source, and the coating area corresponds to the light receiving area of the photodetector.
  14. 根据权利要求12所述的深度相机,其特征在于,所述光检测器的工作波段为1350nm~1550nm。The depth camera of claim 12, wherein the working wavelength band of the photodetector is 1350 nm to 1550 nm.
  15. 根据权利要求12所述的深度相机,其特征在于,所述光检测器上设置有滤光膜,所述滤光膜用于透过波长为1350nm~1550nm的光信号。The depth camera of claim 12, wherein a filter film is provided on the photodetector, and the filter film is used to transmit light signals with a wavelength of 1350 nm to 1550 nm.
  16. 根据权利要求10所述的深度相机,其特征在于,所述光接收模组还包括滤光片,所述滤光片用于仅透过波长为1350nm~1550nm的光信号。The depth camera according to claim 10, wherein the light receiving module further comprises a filter, and the filter is used to transmit only light signals with a wavelength of 1350 nm to 1550 nm.
  17. 根据权利要求10所述的深度相机,其特征在于,所述感光元件的材料包括硅和锗;或The depth camera of claim 10, wherein the material of the photosensitive element includes silicon and germanium; or
    所述感光元件的材料包括硅和铟镓砷。The material of the photosensitive element includes silicon and indium gallium arsenide.
  18. 一种电子设备,其特征在于,所述电子设备包括:An electronic device, characterized in that, the electronic device includes:
    机壳;和Chassis; and
    深度相机,所述深度相机与所述机壳结合;A depth camera, the depth camera is combined with the housing;
    所述深度相机包括:The depth camera includes:
    光发射模组,所述光发射模组包括:A light emitting module, the light emitting module includes:
    光源,所述光源用于发射光信号,所述光信号的波长为1350nm~1550nm;和A light source, the light source is used to emit a light signal, and the wavelength of the light signal is 1350nm-1550nm; and
    扩散器,所述扩散器用于扩散所述光信号;和A diffuser, the diffuser used to diffuse the optical signal; and
    光接收模组,所述光接收模组包括:The light receiving module includes:
    镜头组件;和Lens assembly; and
    感光元件,所述感光元件用于仅接收经过所述镜头组件且波段为1350nm~1550nm的光信号。The photosensitive element, the photosensitive element is used to receive only the optical signal passing through the lens assembly and having a wavelength range of 1350 nm to 1550 nm.
  19. 根据权利要求18所述的电子设备,其特征在于,所述光发射模组还包括光检测器,所述光检测器用于接收被所述扩散器反射回的光信号以形成检测电信号;The electronic device according to claim 18, wherein the light emitting module further comprises a light detector, and the light detector is used to receive the light signal reflected by the diffuser to form a detection electric signal;
    所述深度相机还包括处理器,所述处理器用于:The depth camera further includes a processor, and the processor is configured to:
    根据所述检测电信号确定所述光源是否处于恒功率工作状态和/或确定所述扩散器是否处于正常工作状态;和Determining whether the light source is in a constant power working state and/or determining whether the diffuser is in a normal working state according to the detected electrical signal; and
    根据所述光源是否处于恒功率工作状态和/或所述扩散器是否处于正常工作状态控制所述光源。The light source is controlled according to whether the light source is in a constant power working state and/or whether the diffuser is in a normal working state.
  20. 根据权利要求19所述的电子设备,其特征在于,所述扩散器包括相背的入光面和出光面,所述入光面与所述光源相对,所述出光面上设置有高反射膜,所述高反射膜用于反射波长为1350nm~1550nm的光线。The electronic device according to claim 19, wherein the diffuser comprises a light-incident surface and a light-exit surface opposite to each other, the light-incident surface is opposite to the light source, and a high reflective film is provided on the light-emitting surface The high reflection film is used to reflect light with a wavelength of 1350 nm to 1550 nm.
  21. 根据权利要求20所述的电子设备,其特征在于,所述扩散器包括镀膜区域和与所述镀膜区域相接的非镀膜区域,所述高反射膜形成在所述镀膜区域,所述非镀膜区域与所述光源发射的光信号区域对应,所述镀膜区域与所述光检测器的收光区域对应。The electronic device according to claim 20, wherein the diffuser comprises a coated area and a non-coated area connected to the coated area, the high reflective film is formed in the coated area, and the non-coated area The area corresponds to the light signal area emitted by the light source, and the coating area corresponds to the light receiving area of the photodetector.
  22. 根据权利要求20所述的电子设备,其特征在于,所述光检测器的工作波段为1350nm~1550nm。The electronic device according to claim 20, wherein the working wavelength band of the photodetector is 1350nm-1550nm.
  23. 根据权利要求20所述的电子设备,其特征在于,所述光检测器上设置有滤光膜,所述滤光膜用于透过波长为1350nm~1550nm的光信号。22. The electronic device according to claim 20, wherein a filter film is provided on the photodetector, and the filter film is used to transmit light signals with a wavelength of 1350 nm to 1550 nm.
  24. 根据权利要求18所述的电子设备,其特征在于,所述光接收模组还包括滤光片,所述滤光片用于仅透过波长为1350nm~1550nm的光信号。18. The electronic device of claim 18, wherein the light receiving module further comprises a filter, and the filter is used to transmit only optical signals with a wavelength of 1350 nm to 1550 nm.
  25. 根据权利要求18所述的电子设备,其特征在于,所述感光元件的材料包括硅和锗;或The electronic device according to claim 18, wherein the material of the photosensitive element comprises silicon and germanium; or
    所述感光元件的材料包括硅和铟镓砷。The material of the photosensitive element includes silicon and indium gallium arsenide.
PCT/CN2019/100633 2019-08-14 2019-08-14 Light transmitting module, light receiving module, depth camera, and electronic device WO2021026829A1 (en)

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