CN210923959U

CN210923959U - Time-of-flight projector, time-of-flight depth module and electronic equipment

Info

Publication number: CN210923959U
Application number: CN201921780879.0U
Authority: CN
Inventors: 刘福
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-10-21
Filing date: 2019-10-21
Publication date: 2020-07-03
Anticipated expiration: 2029-10-21

Abstract

The application discloses time of flight projecting apparatus, time of flight degree of depth module and electronic equipment. The time-of-flight projector includes a laser emitting element, a collimating element, and a diffractive optical element. The laser emitting element comprises a plurality of point light sources, the plurality of point light sources are used for projecting a plurality of laser beams to form dot matrix laser, and the dot matrix laser comprises a first divergence angle; the collimating element is used for collimating the lattice laser to form collimated laser, the collimated laser comprises a second divergence angle, and the first divergence angle is larger than the second divergence angle; a diffractive optical element is used to diffract the collimated laser light to form a laser light pattern. The time-of-flight projector, the time-of-flight degree of depth module and the electronic equipment of this application embodiment adopt pointolite transmission laser, because the laser energy density that the pointolite throws is higher, consequently the laser energy that the laser emission component that forms by a plurality of pointolite throws is concentrated relatively to can effectively promote the detection distance of time-of-flight projector, and can reduce the consumption of time-of-flight projector.

Description

Time-of-flight projector, time-of-flight depth module and electronic equipment

Technical Field

The application relates to the technical field of imaging, in particular to a time of flight (TOF) projector, a TOF depth module and electronic equipment.

Background

Because the prior flight time projector mostly adopts an area array light source, light emitted by the area array light source is shaped by a diffuser and then the whole area array light distributed according to the pre-designed energy is output, so that the emergent light energy of the flight time projector is dispersed. As the test distance increases, the larger the laser area is projected, the smaller the energy density per unit area is, and the smaller the energy received by the time-of-flight receiver is. Thus, a more powerful laser is required for distance measurement, resulting in higher power consumption of the time-of-flight projector.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a time-of-flight projector, a time-of-flight depth module and electronic equipment.

The present embodiments provide a time of flight projector comprising a laser emitting element, a collimating element and a diffractive optical element; the laser emitting element comprises a plurality of point light sources for projecting a plurality of laser beams to form a dot matrix laser, wherein the dot matrix laser comprises a first divergence angle; the collimating element is used for collimating the lattice laser to form collimated laser, the collimated laser comprises a second divergence angle, and the first divergence angle is larger than the second divergence angle; the diffractive optical element is for diffracting the collimated laser light to form a laser light pattern.

In certain embodiments, the second divergence angle is less than or equal to 8 degrees.

In some embodiments, the plurality of point light sources are arranged in an array or randomly.

In some embodiments, the time-of-flight projector further includes a light detection element, where the light detection element is configured to detect the laser light reflected by the diffractive optical element to form a detection electrical signal, the diffractive optical element includes a light incident surface and a light exit surface opposite to each other, the light incident surface is opposite to the collimating element, and the light exit surface is provided with a high-reflection film.

In some embodiments, the diffractive optical element includes a coated region and an uncoated region connected to the coated region, the high reflection film is formed on the coated region, and the uncoated region corresponds to a region of the collimating element emitting the laser light.

In some embodiments, the operating wavelength band of the light detecting element is a predetermined wavelength band, and the high reflective film is used for reflecting light in the predetermined wavelength band.

In some embodiments, the light detection element is provided with a filter film, the point light source is configured to emit laser light with a predetermined wavelength band, and the filter film is configured to transmit the laser light with the predetermined wavelength band.

The embodiment of the application provides a time of flight degree of depth module, time of flight degree of depth module includes above-mentioned arbitrary embodiment time of flight projector and time of flight receiver, the time of flight receiver is used for receiving after the target object reflection the laser pattern is in order to acquire the depth information of target object.

In some embodiments, the time-of-flight depth module further comprises a circuit board assembly and a pad assembly, the pad assembly is disposed between the circuit board assembly and the time-of-flight projector, the pad assembly is provided with a conductive hole, a conductive member is disposed in the conductive hole, and the conductive member is used for electrically connecting the circuit board assembly and the time-of-flight projector.

The embodiment of the application provides an electronic device, including casing and above-mentioned any one embodiment the time of flight degree of depth module, the time of flight degree of depth module with the casing combines.

The application embodiment's time of flight projecting apparatus, time of flight degree of depth module and electronic equipment adopt pointolite transmission laser, because the laser energy density that the pointolite throws is higher, consequently the laser energy ratio that the laser emission component that forms by a plurality of pointolite sources throws is concentrated, and the laser becomes little through collimation back divergence angle of collimating element, and the energy is more concentrated, thereby can effectively promote the detection distance of time of flight projecting apparatus, and can reduce the consumption of time of flight projecting apparatus.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a perspective view of a state of an electronic device according to some embodiments of the present application;

FIG. 2 is a schematic perspective view of another state of an electronic device according to some embodiments of the present application;

FIG. 3 is a schematic perspective view of a time-of-flight depth module according to some embodiments of the present disclosure;

FIG. 4 is a schematic diagram of a plan view of a time-of-flight depth module according to some embodiments of the present disclosure;

FIG. 5 is a schematic cross-sectional view of the time-of-flight depth module of FIG. 4 taken along line V-V;

FIG. 6 is a schematic plan view of an assembled time of flight depth module according to certain embodiments of the present application;

FIGS. 7 and 8 are exploded views of a time-of-flight depth module according to some embodiments of the present disclosure;

FIGS. 9 and 10 are exploded isometric views of a pad assembly and a time-of-flight projector of a time-of-flight depth module according to certain embodiments of the present application;

FIG. 11 is a schematic plan view of an array of point sources in a laser emitting element according to some embodiments of the present disclosure;

FIG. 12 is a schematic plan view of a random arrangement of point sources in a laser emitting element according to certain embodiments of the present application;

FIG. 13 is a schematic plan view of a portion of the components of FIG. 5 in accordance with certain embodiments of the present application;

FIG. 14 is a schematic plan view of a diffractive optical element of a time-of-flight projector according to certain embodiments of the present application;

FIG. 15 is a schematic plan view of a diffractive optical element of a time-of-flight projector according to certain embodiments of the present application;

FIG. 16 is a graph showing the relationship between the electrical detection signal of the light detecting element and the operating current of the point light source under different damage conditions of the diffractive optical element according to some embodiments of the present application;

FIG. 17 is a graph showing the relationship between the detected electrical signal of the photodetector and the operating current of the point light source at different temperatures according to certain embodiments of the present application;

FIG. 18 is a schematic representation of the conditioned detected electrical signal of the photodetector element of certain embodiments of the present application

FIG. 19 is a schematic diagram illustrating an exploded view of a time-of-flight receiver according to certain embodiments of the present application;

fig. 20 is a schematic plan view of the time-of-flight receiver of fig. 19.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the embodiments of the present application.

Referring to fig. 1 and fig. 2, an electronic device 1000 according to an embodiment of the present disclosure includes a housing 100 and a time-of-flight depth module 200. The electronic device 1000 may be a mobile phone, a tablet computer, a game console, a smart watch, a smart bracelet, a head display device, an unmanned aerial vehicle, etc. In the embodiment of the present application, the electronic device 1000 is a mobile phone as an example, and it is understood that the specific form of the electronic device 1000 is not limited to the mobile phone.

The housing 100 may serve as a mounting carrier for functional elements of the electronic device 1000. The housing 100 may provide protection against dust, falling, water, etc. for functional elements, such as the display screen 102, the visible light camera 300, the processing chip 104, the receiver, etc. In the embodiment of the present application, the housing 100 includes a main body 106 and a movable bracket 108, the movable bracket 108 can move relative to the main body 106 under the driving of the driving device, for example, the movable bracket 108 can slide relative to the main body 106 to slide into the main body 106 (as shown in fig. 1) or slide out of the main body 106 (as shown in fig. 2). Some functional components (e.g., the display screen 102) may be mounted on the main body 106, and some other functional components (e.g., the time-of-flight depth module 200, the visible light camera 300, and the receiver) may be mounted on the movable support 108, and the movement of the movable support 108 may cause the other functional components to retract into the main body 106 or extend out of the main body 106. Of course, the illustrations of fig. 1 and 2 are merely exemplary of one particular form of the housing 100 and are not to be construed as limiting the housing 100 of the present application.

The time-of-flight depth module 200 is integrated with the housing 100, i.e., the time-of-flight depth module 200 is mounted on the housing 100. Specifically, time-of-flight depth module 200 is mounted on movable support 108. When the user needs to use the time-of-flight depth module 200, the user can trigger the movable bracket 108 to slide out of the main body 106 to drive the time-of-flight depth module 200 to extend out of the main body 106; when the time-of-flight depth module 200 is not needed, the movable bracket 108 may be triggered to slide into the body 106 to retract the time-of-flight depth module 200 into the body 106. In other embodiments, the housing 100 may be provided with a light hole, and the time-of-flight depth module 200 is immovably disposed in the housing 100 and corresponds to the light hole to collect depth information; or, the display screen 102 may be provided with a light through hole, and the time-of-flight depth module 200 is disposed below the display screen 102 and corresponds to the light through hole to collect depth information.

Referring to fig. 3 to 6, the time-of-flight depth module 200 includes a circuit board assembly 210, a pad assembly 220, a time-of-flight projector 230, and a time-of-flight receiver 240. The time-of-flight projector 230 is used for emitting laser to a subject target object, and the time-of-flight receiver 240 is used for receiving the laser pattern reflected by the target object to acquire depth information of the target object.

Referring to fig. 3 to 5, the circuit board assembly 210 may be used to carry a chassis 250, a pad assembly 220, a time-of-flight projector 230 and a time-of-flight receiver 240. The circuit board assembly 210 may be used to electrically connect the motherboard of the electronic device 1000 with the pad assembly 220, the time-of-flight projector 230, and the time-of-flight receiver 240. The circuit board assembly 210 includes a flexible circuit board 211 and a stiffener 212. The flexible circuit board 211 is laid with a circuit, the pad assembly 220 and the time-of-flight receiver 240 can be disposed on one side of the flexible circuit board 211, and the circuit is electrically connected to the pad assembly 220, the time-of-flight projector 230 and the time-of-flight receiver 240. The reinforcing plate 212 may be disposed on the other side of the flexible circuit board 211, and the reinforcing plate 212 may be made of a material having a relatively high hardness, such as steel, to improve the overall strength of the circuit board assembly 210 and facilitate the electrical connection of the circuit with the pad assembly 220 and the time-of-flight receiver 240.

Referring to fig. 4 and 5, the chassis 250 is disposed on the circuit board assembly 210, and the chassis 250 may be connected to the circuit board assembly 210, for example, the chassis 250 is adhered to the circuit board assembly 210 by glue. The housing 250 may be used to form a portion of the housing of the time-of-flight depth module 200, and the pad assembly 220, the time-of-flight projector 230, and the time-of-flight receiver 240 may be at least partially housed within the housing 250.

The housing 250 may be a unitary body that is integrally formed. The housing 250 may have a plurality of cavities, and different cavities may be used to accommodate different components of the pad assembly 220, the time-of-flight projector 230, and the time-of-flight receiver 240. The housing 250 and the circuit board assembly 210 define a first receiving cavity 251 and a second receiving cavity 252, the first receiving cavity 251 may be spaced apart from the second receiving cavity 252, and the first receiving cavity 251 may also be communicated with the second receiving cavity 252.

In the embodiment of the present invention, the housing 250 includes the first sub-housing 254 and the second sub-housing 255, and the first sub-housing 254 and the second sub-housing 255 can be manufactured by an integral molding process, for example, by forming the first sub-housing 254 and the second sub-housing 255 through one-step casting, or forming the first sub-housing 254 and the second sub-housing 255 through one-step cutting. The first sub-housing 254 and the circuit board assembly 210 together enclose a first receiving cavity 251, the first sub-housing 254 has a light opening 256 formed thereon, the light opening 256 is communicated with the first receiving cavity 251, and the second sub-housing 255 and the circuit board assembly 210 together enclose a second receiving cavity 252.

In another example, the housing 250 includes a plurality of sub-housings separately arranged, each of which can be individually connected to the circuit board assembly 210, such as one sub-housing for receiving the time-of-flight projector 230 and another sub-housing for receiving the time-of-flight receiver 240, and the two sub-housings can be respectively attached to the circuit board assembly 210 by gluing, and when it is desired to repair or replace the time-of-flight projector 230, one of the sub-housings can be disassembled without affecting the other sub-housing and the time-of-flight receiver 240.

Referring to fig. 5, 9 and 10, the pad assembly 220 is disposed on the flexible circuit board 211. The pad assembly 220 is electrically connected to the flexible circuit board 211. The pad assembly 220 includes a pad 221 and a conductive member 222.

The spacer 221 is disposed on the flexible circuit board 211, and the relative position of the spacer 221 and the flexible circuit board 211 may be fixed, for example, by bonding the spacer 221 to the flexible circuit board 211. The pad 221 may be accommodated in the first accommodating cavity 251 to prevent the pad 221 from falling out of the flexible circuit board 211, and of course, the pad 221 may not be accommodated in the housing 250. The spacers 221 may be insulative, for example, the spacers 221 may be PCB boards, ceramic blocks, or the like. Pad 221 includes a first face 2211 and a second face 2212, where first face 2211 is opposite second face 2212. When the spacer block 221 is disposed on the flexible circuit board 211, the first surface 2211 is disposed on the flexible circuit board 211, and the second surface 2212 and the flexible circuit board 211 form a certain height difference, so that the component disposed on the second surface 2212 is higher than the component directly disposed on the flexible circuit board 211, and the component disposed on the second surface 2212 is higher than the flexible circuit board 211. Conductive holes 213 are formed in the pad 221, and the conductive holes 213 penetrate the first surface 2211 and the second surface 2212. The conductive hole 213 may be formed in a position of the spacer 221 spaced apart from the outer peripheral wall, and the conductive hole 213 may be formed in the outer peripheral wall of the spacer 221.

The conductive member 222 is disposed in the conductive hole 213. The conductive element 222 may be any conductive material, such as conductive silver paste, conductive ceramic, etc., and the conductive element 222 may be filled in the conductive hole 213 and exposed from the first surface 2211 and the second surface 2212. The portion of the conductive member 222 exposed from the first surface 2211 may be used for electrically connecting with the flexible circuit board 211, and the portion of the conductive member 222 exposed from the second surface 2212 may be used for electrically connecting with a component disposed on the second surface 2212, so that the conductive member 222 is used for electrically connecting the component with the flexible circuit board 211. The number of the conductive holes 213 and the positions of the conductive holes 213 may be arbitrarily set according to the wiring requirements of the components disposed on the second surface 2212, and are not limited to the examples shown in the drawings of the present application.

Referring to fig. 3 and 5, the time-of-flight projector 230 is disposed on the second surface 2212, the time-of-flight projector 230 is electrically connected to the circuit board assembly 210 through the conductive member 222, and the time-of-flight receiver 240 is disposed on the flexible circuit board 211. It will be appreciated that since the first face 2211 is coupled to the flexible circuit board 211 and the time-of-flight receiver 240 is disposed on the flexible circuit board 211, the height of the time-of-flight receiver 240 is substantially the same as the height of the first face 2211 disposed on the flexible circuit board 211, while the spacer block 221 has a certain thickness, i.e., the second face 2212 has a certain height difference from the first face 2211, and thus the height at which the time-of-flight projector 230 is disposed is higher than the height at which the time-of-flight receiver 240 is disposed. In a specific setting, the smaller of the time-of-flight projector 230 and the time-of-flight receiver 240 may be disposed on the second surface 2212, and the larger thereof is disposed on the flexible circuit board 211, so as to reduce the height difference between the time-of-flight projector 230 and the time-of-flight receiver 240 relative to the flexible circuit board 211, avoid the time-of-flight receiver 240 from blocking the time-of-flight projector 230 from emitting or receiving optical signals, that is, avoid the absence of optical signals emitted from the time-of-flight projector 230 to the outside or the absence of received optical signals reflected back from the outside, and finally make the depth information obtained by the time-of-flight depth module 200 more complete.

Referring to fig. 5, 9, 10 and 13, the time-of-flight projector 230 is disposed on the second face 2212. In the present embodiment, the time-of-flight projector 230 and the pad 221 are both housed in the first housing cavity 251. The time-of-flight projector 230 includes a support 231, a laser emitting element 232, a collimating element 233, a diffractive optical element 234, and a processor 235.

The bracket 231 is disposed on the second face 2212. The bracket 231 may be adhered to the second surface 2212 by the adhesive 205, the bracket 231 and the second surface 2212 together define a mounting space 236, and the mounting space 236 may be used for disposing the laser emitting element 232. The holder 231 may further have a light exit 237, the light exit 237 is communicated with the mounting space 236, and the light exit 237 may be used for light emitted by the laser emitting element 232 to pass through. The bracket 231 includes a first connection surface 2311, a second connection surface 2312 opposite to the first connection surface 2311, a first side surface 2313, and a second side surface 2314 opposite to the first side surface 2313. The first connection surface 2311 is used for connecting the diffractive optical element 234, and the second connection surface 2312 is used for connecting the spacer 221.

The Laser emitting element 232 is accommodated in the installation space 236, the Laser emitting element 232 may be a Vertical Cavity Surface Emitting Laser (VCSEL), the Laser emitting element 232 may emit an optical signal of infrared Laser with a uniform light spot in a square wave form, and the optical signal may reach the diffractive optical element 234 after passing through the light exit 237. The laser emitting element 232 may be disposed on the second surface 2212, the laser emitting element 232 may be electrically connected to the conductive member 222, and the laser emitting element 232 is electrically connected to the flexible circuit board 211 through the conductive member 222, so as to avoid using an excessively long or excessively complicated connection line to connect the laser emitting element 232 and the flexible circuit board 211, reduce parasitic inductance of the connection line, facilitate the laser emitting element 232 to make an ideal square wave, and improve accuracy of finally obtained depth information. In one example, the leads of the laser emitting element 232 may be directly electrically connected to the conductive member 222 exposed from the second surface 2212, and in another example, the laser emitting element 232 may be electrically connected to the conductive member 222 by Wire Bonding.

Referring to fig. 11 or 12, the laser emitting device 232 includes a plurality of point light sources 2321, and the plurality of point light sources 2321 are used for projecting a plurality of laser beams to form a dot matrix laser. Specifically, when the dot laser is formed by projecting the plurality of dot light sources 2321, the number of on or off dot light sources 2321 may be adjusted according to the detection distance between the object to be shot and the laser emitting element 232, for example, if the detection distance is longer, a larger number of dot light sources 2321 may be turned on, so that the formed dot laser energy is stronger, which is helpful to more accurately acquire the detection data (i.e., the depth information of the object to be shot). The detection distance between the object to be shot and the laser emitting element 232 may be obtained by a binocular vision camera, determined by a user and then input, or by turning on a preset number of point light sources 2321 to calculate according to the principle of flight time (the detection distance obtained at this time may not be accurate enough). In one embodiment, if the detection distance is 3m and the total number of point light sources 2321 is 400, the laser emitting component 232 may adjust the number of opening point light sources 2321 to be 300 or more to ensure the accuracy of the detection data when the detection distance is 3 m. If the detection distance is short, a small number of point light sources 2321 may be opened, so that the point light sources 2321 can reduce the energy consumption of the laser emitting element 232 on the premise of ensuring the accuracy of the detection data. For example, if the detection distance is 0.2m and the total number of point light sources 2321 is 400, the number of point light sources 2321 adjusted and turned on by the laser emitting element 232 may be 50 or more to reduce the energy consumption of the laser emitting element 232 on the premise of ensuring the accuracy of the detection data. In addition, since the energy density of the point light sources 2321 is higher, compared to the area array light source, the time-of-flight depth module 200 can obtain a longer detection distance under the condition that the same optical power is input for the plurality of point light sources 2321 of the laser emitting element 232, that is, compared to the area array light source, under the condition that the same distance is detected for the plurality of point light sources 2321, the energy consumption required by the plurality of point light sources 2321 is lower, which is beneficial to reducing the power consumption of the time-of-flight projector 230 while detecting a remote object. The time-of-flight projector 230 of the present application is suitable for applications in technologies with high detection distance requirements, such as skeleton extraction, motion tracking, and AR measurements.

The plurality of point light sources 2321 may be arranged in an array (as shown in fig. 11) or randomly (as shown in fig. 12). Specifically, the plurality of point light sources 2321 are arranged in an array as shown in fig. 11, which is beneficial to regularly arrange the laser emitted to the object to be detected, so that the object to be detected can be detected comprehensively, and the detection data is more accurate. In addition, the array arrangement of the point light sources 2321 as shown in fig. 11 is also beneficial to the manufacture of the laser emitting element 232 and the installation of the point light sources 2321. The array arrangement may be a circular array or the like, not shown in fig. 11, but a matrix array. The point light sources 2321 may also be randomly arranged, and as shown in fig. 12, the point light sources 2321 are randomly arranged to facilitate the random emission of the dot matrix laser emitted by the laser emitting element 232 and to randomly project the dot matrix laser onto the object to be shot, which is beneficial to ensuring the randomness of the detection data, so that the detection data is more accurate.

The lattice laser has a first divergence angle α. the first divergence angle α of the lattice laser emitted by the laser emitting element 232 may be in a range of 9 degrees to 24 degrees, that is, the first divergence angle α may be greater than or equal to 9 degrees and less than or equal to 24 degrees, for example, the first divergence angle α may be 9 degrees, 11 degrees, 13 degrees, 14.5 degrees, 15 degrees, 16 degrees, 17.1 degrees, 18 degrees, 20 degrees, 24 degrees, etc. controlling the first divergence angle α of the lattice laser within 9 degrees to 24 degrees may cause almost all of the lattice laser converged by the plurality of point light sources 2321 to enter the lattice laser 233, ensure that the lattice laser is not scattered onto the inner wall of the support 231 to be reflected to generate stray light, which is beneficial for the accuracy of the data detection by the flight time detection module 200.

The collimating element 233 is used for collimating the dot matrix laser light to form collimated laser light, the collimated laser light has a second divergence angle β, the first divergence angle α is larger than the second divergence angle β. specifically, the collimating element 233 is a convex lens, and has a converging effect on the dot matrix laser light emitted by the laser emitting element 232, so the second divergence angle β of the collimated laser light is smaller than the first divergence angle α of the dot matrix laser light, so that the energy of the collimated laser light is more concentrated.

The collimating element 233 may be an optical lens. Referring to fig. 13, the alignment member 233 is received in the installation space 236, and the alignment member 233 can be assembled into the installation space 236 along the direction of the second connection surface 2312 toward the first connection surface 2311. Specifically, the collimating element 233 includes mounting portions 2331 and an optical portion 2332, the mounting portions 2331 for engaging the bracket 231 to secure the collimating element 233 within the mounting space 236. The collimating element 233 includes an engaging surface 2333, and when the engaging surface 2333 is engaged with the first side 2313, the collimating element 233 can be considered to be mounted in place. In the present embodiment, the bonding surface 2333 is an end surface of the mounting portion 2331 and the optical portion 2332 includes two curved surfaces on opposite sides of the collimating element 233. One of the curved surfaces of the collimating element 233 protrudes into the light exit 237.

Referring to fig. 5 and 9, the diffractive optical element 234 is used for diffracting the collimated laser light to form a laser pattern. The diffuser (diffuser) diffuses the lattice light into an area lattice light, and the diffractive optical element 234 replicates the lattice light output by the plurality of point light sources to form a lattice light with a larger area, so that the lattice light output by the plurality of point light sources is still the lattice light after being diffracted by the diffractive optical element 234, and the energy is more concentrated relative to the area lattice light, thereby effectively increasing the detection distance of the time-of-flight projector 230 and reducing the power consumption of the time-of-flight projector 230.

The diffractive optical element 234 is disposed on the holder 231, and specifically, the diffractive optical element 234 may be bonded on the holder 231 by the glue 205. The diffractive optical element 234 may be made of a material such as transparent glass or resin. The diffractive optical element 234 may be located outside the installation space 236, for example, the diffractive optical element 234 may completely cover the light exit 237. The light signal emitted from the laser emitting element 232 reaches the diffractive optical element 234 after passing through the light exit 237, and the diffractive optical element 234 can increase the range of the angle of view of the light signal so that the light signal emitted from the time-of-flight projector 230 is irradiated to a larger range. The optical signal passing through the diffractive optical element 234 may further pass through the light passing port 256, and after passing through the light passing port 256, the optical signal enters the time-of-flight depth module 200.

It should be noted that when an opening is required to be formed in the housing 250 for the light signal emitted by the time-of-flight projector 230 to pass out, the time-of-flight projector 230 is lifted up to reduce the distance between the time-of-flight projector 230 and the opening in the housing 250, and since the light signal emitted by the time-of-flight projector 230 is a divergent light signal, the size of the opening is allowed to be smaller after the distance between the time-of-flight projector 230 and the opening in the housing 250 is reduced, and the influence on the appearance of the electronic device 1000 is small.

Referring to fig. 5, 7, 9 and 10, the time-of-flight receiver 240 is disposed on the circuit board assembly 210, an optical inlet 244 is formed on the time-of-flight receiver 240, and an external optical signal passes through the optical inlet 244 and then enters the time-of-flight receiver 240. In the present embodiment, the plane forming the light passing port 256 may be flush with the plane forming the light inlet 244, so that the light signal passing through the light passing port 256 into the outside is not blocked by the time-of-flight receiver 240, and the light signal passing from the outside into the light inlet 244 is not blocked by the time-of-flight projector 230.

The time-of-flight receiver 240 and the time-of-flight projector 230 are disposed on the same flexible circuit board 211, so that the positions of the time-of-flight receiver 240 and the time-of-flight projector 230 are relatively fixed, and no additional fixing bracket is required to fix the time-of-flight receiver 240 and the time-of-flight projector 230. When the time-of-flight depth module 200 is installed, the time-of-flight depth module 200 may be installed entirely within the housing 100 without having to separately install the time-of-flight receiver 240 and the time-of-flight projector 230 and then calibrate them. In addition, the time-of-flight depth module 200 may further include a connector 260, wherein the connector 260 is connected to the circuit board assembly 210, and the connector 260 is electrically connected to the main board of the electronic device 1000. The number of connectors 260 may be single, and a single connector 260 may be electrically connected to both the time of flight projector 230 and the time of flight receiver 240, without requiring multiple connectors 260. The time-of-flight receiver 240 includes a light-sensing member 242, a lens barrel 241, and a lens 243.

The light sensing member 242 may be disposed on the flexible circuit board 211 and electrically connected to the flexible circuit board 211, and the light sensing member 242 is received in the second receiving cavity 252. The light-sensing element 242 may be a photoelectric sensor, and when the light-sensing element 242 receives the light signal, the light-sensing element 242 converts the light signal into an electrical signal, so as to further calculate the depth information through the electrical signal.

The lens 243 may be mounted inside the lens barrel 241. The light entrance 244 is opened in the lens barrel 241. After entering from the light inlet 244, the optical signal may further pass through the lens 243 to be focused on the photosensitive element 242. The lens barrel 241 may be detachably mounted with the chassis 250, and particularly, the lens barrel 241 may be detachably mounted with the second sub-housing 255. In the embodiment of the present application, the housing 250 further has a mounting groove 253, and the mounting groove 253 can be used for mounting the lens barrel 241. The position of the mounting groove 253 may correspond to the position of the second receiving cavity 252. An external thread is formed on an outer wall of the lens barrel 241, an internal thread is formed on an inner wall of the mounting groove 253, and the lens barrel 241 and the housing 250 are detachably connected through the external thread and the internal thread, for example, the lens barrel 241 is screwed into the mounting groove 253 or the lens barrel 241 is unscrewed from the mounting groove 253.

When the time-of-flight depth module 200 is installed, the pad assembly 220 and the photosensitive element 242 may be first fixed on the flexible circuit board 211 of the circuit board assembly 210, and the conductive element 222 and the flexible circuit board 211, and the photosensitive element 242 and the flexible circuit board 211 are electrically connected; then, the time-of-flight projector 230 is mounted on the second surface 2212 of the pad 221, and the laser emitting element 232 and the conductive member 222 are electrically connected; then, the housing 250 is fixed on the circuit board assembly 210, such that the time-of-flight projector 230 and the pad assembly 220 are received in the first receiving cavity 251 and the light-sensing member 242 is received in the second receiving cavity 252; finally, the lens barrel 241 with the lens 243 can be screwed into the mounting groove 253 to complete the assembly of the whole time-of-flight depth module 200. Of course, the lens barrel 241 with the lens 243 may be screwed into the mounting groove 253, and then the housing 250 with the lens barrel 241 mounted thereon may be fixed on the flexible circuit board 211 of the circuit board assembly 210. When necessary, the lens barrel 241 may be separated from the housing 250 alone without first separating the housing 250 from the circuit board assembly 210.

In summary, in the electronic device 1000 according to the embodiment of the present invention, since the time-of-flight projector 230 is disposed on the second surface 2212 of the pad 221, and the time-of-flight projector 230 is electrically connected to the circuit board assembly 210 through the conductive member 222, the height of the time-of-flight projector 230 is raised by the pad 221, so as to reduce the height difference between the time-of-flight projector 230 and the time-of-flight receiver 240, and prevent the time-of-flight receiver 240 from blocking the time-of-flight projector 230 to transmit or receive the optical signal, and the depth information obtained by the time-of-flight depth module 200 is relatively complete.

Referring to fig. 5, 9 and 10, in some embodiments, the pad 221 further has a heat conduction hole 214, and the heat conduction hole 214 penetrates through the first surface 2211 and the second surface 2212. The pad assembly 220 further includes a heat conduction member 223, and the heat conduction member 223 is filled in the heat conduction hole 214. The laser emitting element 232 is disposed on the heat conductive member 223. The laser emitting element 232 generates heat during operation, and if the heat cannot be dissipated in time, parameters such as intensity and frequency of an optical signal emitted by the laser emitting element 232 may be affected, and the laser emitting element 232 is disposed on the heat conducting member 223, so that the heat conducting member 223 can rapidly conduct the heat generated by the laser emitting element 232 to the circuit board assembly 210, and further conduct the heat to the outside through the circuit board assembly 210.

Specifically, the heat conduction member 223 is filled in the heat conduction hole 214, and the heat conduction member 223 may be made of a material with better heat conduction performance, such as copper, silver, and the like. The thermal conductive member 223 is exposed from the first and

second surfaces

2211 and 2212 such that one end of the thermal conductive member 223 contacts the laser emitting element 232 and the other end contacts the circuit board assembly 210. The orthographic projection of the laser emitting element 232 on the second surface 2212 can completely fall onto the heat conducting member 223, so that the contact area between the laser emitting element 232 and the heat conducting member 223 is large, and the heat conducting efficiency is improved. In one example, the number of the heat conduction holes 214 is plural, the plural heat conduction holes 214 are arranged at intervals, and the heat conduction member 223 arranged in each heat conduction hole 214 is in contact with the laser emitting element 232; in another example, the number of the heat conduction holes 214 is single, and the hollow volume of the single heat conduction hole 214 can be set to be larger than, for example, the sum of the hollow volumes of the plurality of heat conduction holes 214 when the plurality of heat conduction holes 214 are opened, so that a larger number of the heat conduction members 223 can be set in the single heat conduction hole 214 to improve the heat conduction efficiency.

Further, the heat conduction hole 214 may be formed in a shape with a smaller top and a larger bottom, that is, the size of the end of the heat conduction hole 214 close to the second surface 2212 may be substantially the same as the area of the orthographic projection of the laser emitting element 232 on the second surface 2212, and the size of the end close to the first surface 2211 may be larger, so as to increase the contact area between the heat conduction member 223 and the circuit board assembly 210, and improve the heat conduction efficiency.

Referring to fig. 13, the time-of-flight projector 200 may further include a light detecting element 270, and the light detecting element 270 is used for detecting the laser light reflected by the diffractive optical element 234 to form a detection electrical signal. The number of the light detecting elements 270 is one or more. The light detection element 270 may be a photodetector, photodiode, or the like. The diffractive optical element 234 includes a light incident surface 2341 and a light emitting surface 2342 opposite to each other, the light incident surface 2341 is opposite to the collimating element 233, and the light emitting surface 2342 is provided with a high-reflection film 2343. The photodetector 270 is disposed on the side of the light incident surface 2341. Referring to fig. 14 and 15, the diffractive optical element 234 includes a plated area 2344 and an uncoated area 2345 connected to the plated area 2344, the highly reflective film 2343 is formed on the plated area 2344, and the uncoated area 2345 corresponds to an area (the optical portion 2332) from which the collimated element 233 emits laser light. The light detecting element 270 has an operating wavelength band of a predetermined wavelength band, and the highly reflective film 2343 is used for reflecting light of the predetermined wavelength band, for example, the operating wavelength band of the light detecting element 270 may be 350nm to 1100nm, and the highly reflective film 2343 is used for reflecting light of 350nm to 1100 nm. The plating region 2344 corresponds to the photodetector 270. It can be understood that, be provided with high-reflection film 2343 in coating film area 2344, high-reflection film 2343 has the high reflectivity, can effectively reflect ambient light, avoid ambient light to produce the interference to light detection element 270, make the signal of telecommunication that light detection element 270 detected to be correct, avoid because diffraction optical element 234 drops, the signal of telecommunication mistake that light detection element 270 detected, treater 235 is unable in time to drive control and closes some light sources 2321, thereby it is thus dangerous people's eye safety directly to lead to the laser of some light sources 2321 transmission to penetrate into people's eyes.

The light detecting element 270 may be provided with a filter film 271. The point light source 2321 is configured to emit laser light of a predetermined wavelength band, and the filter film 271 is configured to transmit the laser light of the predetermined wavelength band. For example, the point light source 2321 is used to emit laser light in a wavelength band of 940 nm. The filter film 271 is used for transmitting laser light with a wavelength of about 940nm, and laser light with other wavelengths is reflected by the filter film 271, so that interference of ambient light to the light detection element 270 can be further reduced, and it is ensured that the laser light received by the light detection element 270 is laser light emitted by the point light source 2321 or laser light emitted by the point light source 2321 and reflected by the light incident surface 2341 of the diffractive optical element 234.

The predetermined band may be located within a predetermined band, for example, the predetermined band is 350nm to 1100nm, and the predetermined band may be 910nm, 940nm, 950nm, and the like, and of course, the predetermined band may also be a band range, for example, 890nm to 940nm, and the like, and is not limited herein.

Processor 235 is configured to control point light source 2321 according to the electrical detection signal fed back by light detection element 270. For example, the required number of point light sources 2321 are controlled to be turned on or off, the operating current of the point light sources 2321 is increased, the operating current of the point light sources 2321 is controlled to be decreased, or the power supply is controlled to be turned off according to the detection electrical signal. The detection electrical signal may be a current signal, a voltage signal, or other signals, and the embodiment of the present application takes the detection electrical signal as a current signal as an example.

In one embodiment, the processor 235 is configured to determine a damage condition of the diffractive optical element 234 according to the detection electrical signal and the predetermined electrical signal, and control the point light source 2321 according to the damage condition, and more specifically, the processor 235 is configured to determine a damage condition of the diffractive optical element 234 according to a magnitude relationship between the detection electrical signal and the predetermined electrical signal, and control the point light source 2321 according to the damage condition, and specifically, the damage condition of the diffractive optical element 234 may be roughly classified into ① that the diffractive optical element 234 is normal (i.e., no damage occurs), ② that the diffractive optical element 234 is not completely dropped or slightly damaged, and ③ that the diffractive optical element 234 is completely dropped or severely damaged₀The predetermined current valueMay also be I₀I ± Δ I (Δ I may be 0.1mA, 0.2mA, 0.3mA, etc.), i.e., the predetermined current value is within a predetermined range (i.e., curve 1 in fig. 16); when the diffractive optical element 234 is not completely detached or slightly broken, the light detection element 270 receives the laser light emitted from the point light source 2321 and reflected by the diffractive optical element 234 to the light detection element 270, but since the diffractive optical element 234 is not completely detached or slightly broken, the light detection element 270 cannot receive all the laser light reflected by the diffractive optical element 234, and at this time, the current value fed back by the light detection element 270 decreases to be lower than a first predetermined ratio (for example, the first predetermined ratio is 90%) of the predetermined current value and to be higher than a second predetermined ratio (for example, the second predetermined ratio is 10%) of the predetermined current value, that is, the current value is lower than the I₀× 90% or (I)₀Δ I) × 90% (i.e., curve 2 in FIG. 16) and is greater than I₀× 10% or (I)₀Δ I) × 10%, when the diffractive optical element 234 is completely dropped or seriously damaged, the light emitted from the point light source 2321 is totally emitted into the scene without being reflected by the diffractive optical element 234 (when the diffractive optical element 234 is dropped), or the part of the light emitted from the point light source 2321 reflected by the diffractive optical element 234 does not reach the light detecting element 270 at all (when the diffractive optical element 234 is seriously damaged), the current value fed back by the light detecting element 270 is attenuated to the minimum current value, which is lower than the third predetermined proportion (for example, the third predetermined proportion is 5%) of the predetermined current value, and is almost 0mA, that is, the current value is lower than I₀× 5% or (I)₀+. DELTA.I) × 5% (i.e., Curve 3 in FIG. 16). The second predetermined ratio is smaller than the first predetermined ratio, and the third predetermined ratio may be the same as or different from the second predetermined ratio. in one example, assuming that the diffractive optical element 234 is in a normal condition, the predetermined current value fed back from the photodetecting element 270 ranges from 0.2mA to 0.5mA, and when the diffractive optical element 234 is not completely removed or slightly broken, the current value fed back from the photodetecting element 270 decreases to less than 30% of the predetermined value, i.e., to less than 0.06mA (at this time, the predetermined current value is 0.2mA), the processor 235 may determine that the diffractive optical element 234 is not completely removed or slightly broken according to the difference between the fed-back current value and the predetermined current value of 0.2mA as 0.14mA, and may determine that the diffractive optical element 234Micro-breakage, in which case, the processor 235 may control to reduce the current of the point light sources 2321 or control to turn off some or all of the point light sources 2321; when the diffractive optical element 234 falls off or is seriously damaged, if the current value fed back by the light detection element 270 is 0.01mA, the processor 235 may determine that the diffractive optical element 234 falls off or is seriously damaged according to a large difference between the fed-back current value 0.01mA and the predetermined current value 0.2mA, and at this time, the processor 235 may control to turn off all the point light sources 2321.

That is, the processor 235 may determine the damage condition of the diffractive optical element 234 according to the difference between the current value fed back by the light detection element 270 and the predetermined current value, and control the point light source 2321 according to the damage condition. Under the condition that the operating current of the point light source 2321 is the same, when the current value fed back by the light detection element 270 is a predetermined current value, the processor 235 determines that the diffractive optical element 234 is normal and is not damaged; when the current value fed back by the light detection element 270 is lower than the minimum value of the predetermined current value, and the current value fed back by the light detection element 270 is lower than the first predetermined proportion of the predetermined current value and is greater than the second predetermined proportion of the predetermined current value, the processor 235 determines that the diffractive optical element 234 is not completely detached or slightly damaged, and at this time, the processor 235 may control to reduce the current of the point light source 2321 or control to turn off the point light source 2321; when the current value fed back by the light detecting element 270 is lower than the minimum value of the predetermined current value and the current value fed back by the light detecting element 270 is lower than a third predetermined proportion of the predetermined current value, the processor 235 determines that the diffractive optical element 234 is completely detached or seriously damaged, and at this time, the processor 235 may control to turn off the point light source 2321.

In one embodiment, the processor 235 is configured to determine a damage condition of the diffractive optical element 234 according to an average value of the detected electrical signals of the plurality of light detecting elements 270 and a predetermined electrical signal, and control the point light source 2321 according to the damage condition. More specifically, the processor 235 is configured to determine a damage condition of the diffractive optical element 234 according to a difference value between an average value of the detected electrical signals of the plurality of light detecting elements 270 and a predetermined electrical signal, and control the point light source 2321 according to the damage condition. Specifically, the number of the light detecting elements 270 may be plural, for example, the number of the light detecting elements 270 is 2, 3, 4, 5 or more, and accordingly, each light detecting element 270 is provided with a filter film 271 thereon, and the plural light detecting elements 270 are used for receiving laser light to form plural detecting electric signals. Taking the number of the photo detectors 270 as 2 as an example, referring to fig. 13, two photo detectors 270 are respectively disposed on two sides of the laser emitting element 232, namely, the photo detector 2701 and the photo detector 2702, and the processor 235 determines the damage condition of the diffractive optical element 234 according to the difference between the average value of the current signals detected by the two photo detectors 270 and the predetermined electrical signal, so as to control the point light source 2321 according to the damage condition. Under normal conditions, the predetermined current value of the light detecting elements 270 of the diffractive optical element 234 is 0.2mA to 0.5mA, and the predetermined difference value between the average value of the currents detected by the plurality of light detecting elements 270 and the predetermined current value is 0mA to 0.01 mA. Assuming that the current value detected by light detecting element 2701 is 0.01mA, the current value detected by light detecting element 2702 is 0.25mA, 0.01mA is not in the range of predetermined current value 0.2mA to 0.5mA, 0.25mA is in the range of predetermined current value 0.2mA to 0.5mA, and the average value of the detected currents of light detecting element 2701 and light detecting element 2702 is 0.13mA, that is, the difference value between the average value of the detected currents of light detecting element 2701 and light detecting element 2702 and the predetermined current value is 0.07mA to 0.37mA, and 0.07mA to 0.37mA is greater than the maximum value of the predetermined difference value 0.01mA, at this time, processor 235 may determine that diffractive optical element 234 is not completely dropped or slightly damaged, and processor 235 may control to reduce the current of point light source 2321 or control to close all or part of point light source 2321; assuming that the current value detected by the light detection element 2701 is 0.1mA, the current value detected by the light detection element 2702 is 0.15mA, and both 0.1mA and 0.15mA are not within the range of 0.2mA to 0.5mA of the predetermined current value, at this time, the processor 235 may determine that the diffractive optical element 234 completely falls off or is seriously damaged, thereby controlling and closing all the point light sources 2321, preventing the laser emitted by the point light sources 2321 from directly emitting into human eyes, and timely protecting the safety of human eyes.

That is, the processor 235 may determine the damage condition of the diffractive optical element 234 according to the difference between the average value of the plurality of detected current signals and the predetermined current signal, and thus control the point light source 2321 according to the damage condition. If the current value detected by one or more of the light detection elements 270 in the plurality of light detection elements 270 is not within the range of the predetermined current value and the difference between the average current value detected by the plurality of light detection elements 270 and the predetermined current value is higher than the maximum value of the predetermined difference, at this time, the processor 235 may determine that the diffractive optical element 234 determines that the diffractive optical element 234 is not completely detached or slightly damaged, and may control to reduce the current of the point light source 2321 or control to turn off the point light source 2321; if the current values detected by the light detection elements 270 are not within the predetermined current value range, the processor 235 may determine that the diffractive optical element 234 completely falls off or is seriously damaged, so as to control to turn off the point light source 2321, prevent the laser emitted by the point light source 2321 from being directly emitted into human eyes, and protect the human eyes in time.

In one embodiment, processor 235 is configured to determine a damage condition of diffractive optical element 234 according to a difference between the detected electrical signals of the plurality of light detecting elements 270, and control point light source 2321 according to the damage condition. Specifically, the number of the light detecting elements 270 may be plural, for example, the number of the light detecting elements 270 may be 2, 3, 4, 5 or more, and accordingly, each light detecting element 270 is provided with a filter film 271, and the plural light detecting elements 270 are configured to receive laser light to form plural detecting electrical signals. Taking the number of the photo detectors 270 as 2 as an example, please refer to fig. 13 again, one photo detector 270, namely the photo detector 2701 and the photo detector 2702, is disposed on each side of the point light source 2321, and the processor 235 determines the damage condition of the diffractive optical element 234 according to the difference between the current signals detected by the two photo detectors 270, so as to control the point light source 2321 according to the damage condition. It is assumed that the predetermined current value fed back by the photodetection element 270 is 0.2mA to 0.5mA and the predetermined difference value between the photodetection element 2701 and the photodetection element 2702 is 0mA to 0.1mA under normal conditions of the diffractive optical element 234. If the detected current value fed back by the photodetection element 2701 is 0.28mA, the detected current value fed back by the photodetection element 2702 is 0.31mA, and both 0.28mA and 0.31mA are in the range of the predetermined current value 0.2mA to 0.5mA, and the difference value of the detected currents fed back by the photodetection element 2701 and the photodetection element 2702 is 0.03mA, and 0.03mA is less than 0.1mA, it can be determined that the diffractive optical element 234 is in the normal operating state; if the detected current value fed back by the light detecting element 2701 is 0.05mA, the detected current value fed back by the light detecting element 2702 is 0.3mA, at this time, 0.3mA is in the range of 0.2mA to 0.5mA of the predetermined current value, 0.05mA is not in the range of 0.2mA to 0.5mA of the predetermined current value, and the current difference value between the light detecting element 2701 and the light detecting element 2702 is 0.25mA, and 0.25mA is greater than 0.1mA, it can be determined that the diffractive optical element 234 is not completely dropped or slightly damaged, and the processor 235 can reduce the operating current of the point light source 2321 or turn off the point light source 2321 at this time; if the detected current value fed back by the light detecting element 2701 is 0.5mA, the detected current value fed back by the light detecting element 2702 is 1.0mA, at this time, 0.5mA is in the range of 0.2mA to 0.5mA of the predetermined current value, 1.0mA is not in the range of 0.2mA to 0.5mA of the predetermined current value, and the current difference between the light detecting element 2701 and the light detecting element 2702 is 0.5mA, 0.5mA > 0.1mA, and the difference is large, it can be determined that one side of the diffractive optical element 234 close to the light detecting element 2702 is detached or slightly damaged, and the processor 235 can reduce the operating current of the point light source 2321 or turn off the point light source 2321 at this time. If the detected current value fed back by the light detecting element 2701 is 0.01mA, the detected current value fed back by the light detecting element 2702 is 0.03mA, and at this time, neither 0.01mA nor 0.03mA is within the range of the predetermined current value of 0.2mA to 0.5mA, it can be determined that the diffractive optical element 234 completely falls off or is seriously damaged, and the processor 235 can turn off the point light source 2321 at this time.

That is, the processor 235 may determine the damage condition of the diffractive optical element 234 according to the difference between the plurality of detection current signals, and control the point light source 2321 according to the damage condition. If one or a part of the detected current values are not within the range of the predetermined current value, and the difference between the detected current values is larger and lower than the first predetermined value, the processor 235 may determine that the diffractive optical element 234 is not completely detached or slightly damaged, and the processor 235 may reduce the working current of the point light source 2321 or turn off all or part of the point light source 2321 at this time; if the detected current values fed back by the light detecting elements 270 are all lower than the predetermined current value, the processor 235 may determine that the diffractive optical element 234 completely falls off or is seriously damaged, and the processor 235 may turn off all the light sources 2321 at this time.

The processor 235 is further configured to reduce the operating current of the point light source 2321 or turn off the point light source 2321 when the diffractive optical element 234 is damaged (i.e., the diffractive optical element 234 is not completely detached or is slightly damaged and the diffractive optical element 234 is completely detached or is severely damaged). For example, in the diffractive optical element 234, under normal conditions, the predetermined current value fed back by the light detection element 270 is 0.2mA to 0.5 mA; if the detected current value fed back by the light detecting element 270 is 0.55mA, and the 0.55mA is slightly larger than 0.5mA, the processor 235 determines that the diffractive optical element 234 is not completely dropped or slightly damaged at this time, and may control to reduce the working current of the point light source 2321, or close all or part of the point light sources 2321; if the detected current value fed back by the light detecting element 270 is 0.01mA, 0.01mA is smaller than 0.5mA, and the difference is very large, the processor 235 determines that the diffractive optical element 234 is completely dropped or seriously damaged at this time, and can control to turn off all the point light sources 2321.

When the diffractive optical element 234 is normal (no damage occurs), for example, (1) the current value (electric signal) fed back by the light detecting element 270 is between predetermined ranges, for example, the current value fed back is 90% I₀～I₀To (c) to (d); or, (2) the difference between the current value detected by the plurality of photodetecting elements 270 and the predetermined current value is in a predetermined difference range, for example, the difference is between 0 to 0.01 mA; as the temperature of time-of-flight depth module 200 increases, the electrical detection signal of light detecting element 270 decreases relative to the predetermined electrical signal as the temperature of time-of-flight depth module 200 increases, and processor 235 may be further configured to increase the operating current of point light source 2321 when the electrical detection signal decreases. It can be understood that as the service time of the time-of-flight depth module 200 is longer, the temperature of the whole time-of-flight depth module 200 is higher, and the light emitting efficiency of the point light source 2321 is affected by the temperature. At this time, although the diffractive optical element 234 is not damaged, the laser emitted from the point light source 2321 becomes weaker and weaker as the temperature rises, and accordingly, the light detection element 270 receives the laser reflected by the diffractive optical element 234, referring to fig. 17, under the same currentThe optical signal will be weakened, so that the detected current value fed back by the optical detection element 270 is weakened relative to the predetermined electrical signal (determined when the optical detection element is shipped from factory), and after receiving the feedback from the optical detection element 270, the processor 235 controls to gradually increase the operating current of the point light source 2321 until the detected current value fed back by the optical detection element 270 is consistent with the predetermined current value, so that the time-of-flight projector 230 can always ensure that the output optical power is constant. This process is the Automatic Power Control (APC) regulation function of the time-of-flight projector 230 (as shown in fig. 18).

In addition, referring again to fig. 5 and 13, the time of flight projector 230 may also include a temperature detector 280. The temperature detector 280 is used to detect the temperature value of the time-of-flight projector 230 or the point light source 2321. When the value of the current fed back from the photodetection element 270 becomes weak with respect to a predetermined current value, the degree of the weakening is determined, for example, (1) the value of the current (electric signal) fed back from the photodetection element 270 is within a predetermined range, for example, the value of the current fed back is 90% I₀～I₀To (c) to (d); alternatively, (2) the difference between the current values detected by the plurality of photodetecting elements 270 and the predetermined current value is within a predetermined difference range, for example, the difference is between 0 to 0.01mA, it can be determined that the diffractive optical element 234 is normal first. Then, if the temperature of the time-of-flight projector 230 detected by the temperature detector 280 is increased relative to the normal temperature when operating under the same current conditions as before, it can be determined that the value of the current fed back by the light detecting element 270 is weakened relative to a predetermined current value due to the increase in the temperature of the time-of-flight projector 230. When the value of the current fed back by the light detecting element 270 becomes weak, if the temperature of the time-of-flight projector 230 detected by the temperature detector 280 is normal, it can be determined that the value of the detected current fed back by the light detecting element 270 becomes weak due to the fact that the diffractive optical element 234 is detached or seriously damaged. That is, as the operating time becomes longer, the temperature detector 280 detects that the temperature of the time-of-flight projector 230 becomes higher, the luminous efficiency of the point light source 2321 is affected by the temperature due to the temperature rise of the time-of-flight projector 230, and although the diffractive optical element 234 is not normally damaged, the detection electrical signal of the light detecting element 270 is also affected by the temperature rise of the time-of-flight projector 230And decreases. Specifically, under the same current, as the temperature detected by the temperature detector 280 increases, the laser light emitted by the point light source 2321 may be weakened, and then the intensity of the laser light energy received by the light detection element 270 may be weakened, and the detected current value fed back by the light detection element 270 may be correspondingly reduced, at this time, the processor 235 may control to increase the operating current of the point light source 2321 according to the detected current value fed back by the light detection element 270 until the detected current value fed back by the light detection element 270 is consistent with the predetermined current value, so that the time-of-flight projector 230 may always ensure that the output optical power is constant.

Referring to fig. 19 and 20, time-of-flight receiver 240 may further include an infrared image sensor 244, a 940nm narrowband filter 245, and a lens 246. The laser emitted by the time-of-flight projector 230 is near-infrared light, the near-infrared light is reflected after encountering a target object, the infrared image sensor 244 receives the reflected near-infrared light, and the infrared image sensor 244 can obtain the specific position of the target object through calculating and receiving the obtained image information, that is, the Z-axis coordinate position of the target object in the three-dimensional space shown in fig. 19 can be determined; in addition, referring to fig. 2, the electronic device 1000 includes a visible light camera 300, and the visible light camera 300 includes a visible light image sensor. The visible light image sensor may receive the reflected visible light and collect two-dimensional plane information of the target object, i.e., may determine the X-axis and Y-axis coordinate positions of the target object in the three-dimensional space as shown in fig. 19. Finally, the infrared image sensor 244 and the visible light image sensor gather the collected information into the processing chip 104, thereby obtaining the three-dimensional data of the target object.

Specifically, the subject target object may be a human hand or a human face, and for example, the target object is a human hand, the time-of-flight projector 230 emits near-infrared light, and the near-infrared light is reflected by the human hand and received by the infrared image sensor 244. The image information acquired by the infrared image sensor 244 may calculate the position of the human hand, that is, the Z-axis coordinate value of the human hand in the three-dimensional space, as shown in fig. 19, if the infrared image sensor 244 is taken as the O-point coordinate in the three-dimensional space, the detected Z-axis coordinate value of the human hand may be a positive value, such as positions +1, +2, +3, etc., which indicates that the distance between the human hand and the infrared image sensor 244 is far and near, the distance at +3 is greater than the distance at +2, the distance at +2 is greater than the distance at +1, and so on; the visible light image sensor can acquire two-dimensional plane information of a human hand, namely coordinate values of an X axis and a Y axis of the human hand in a three-dimensional space, and if the visible light image sensor is used as an O point coordinate in the three-dimensional space, the detected coordinate values of the X axis and the Y axis of the human hand can be positive values, such as positions of +1, +2, +3 and the like, or negative values, such as positions of-1, -2, -3 and the like. The processing chip 104 processes the collected information of the infrared image sensor 244 and the visible light image sensor to obtain three-dimensional data of the human hand, i.e. coordinate values of the X axis, the Y axis and the Z axis, so as to obtain accurate depth information of the human hand.

In the description herein, reference to the description of the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art within the scope of the present application, which is defined by the claims and their equivalents.

Claims

1. A time-of-flight projector comprising a laser emitting element, a collimating element and a diffractive optical element;

the laser emitting element comprises a plurality of point light sources for projecting a plurality of laser beams to form a dot matrix laser, wherein the dot matrix laser comprises a first divergence angle;

the collimating element is used for collimating the lattice laser to form collimated laser, the collimated laser comprises a second divergence angle, and the first divergence angle is larger than the second divergence angle;

the diffractive optical element is for diffracting the collimated laser light to form a laser light pattern.

2. The time of flight projector of claim 1, wherein the second divergence angle is less than or equal to 8 degrees.

3. The time of flight projector of claim 1, wherein the plurality of point light sources are arranged in an array or randomly.

4. The time of flight projector of claim 1, further comprising a light detection element for detecting the laser light reflected back from the diffractive optical element to form a detection electrical signal, the diffractive optical element including opposing entrance and exit faces, the entrance face opposing the collimating element, the exit face having a highly reflective film disposed thereon.

5. The time of flight projector of claim 4, wherein the diffractive optical element includes a coated area and an uncoated area contiguous with the coated area, the highly reflective film being formed in the coated area, the uncoated area corresponding to an area of the collimating element from which the laser light exits.

6. The time of flight projector of claim 4, wherein the light detection element has a predetermined wavelength band of operation, and the highly reflective film is configured to reflect light in the predetermined wavelength band.

7. The time of flight projector of claim 4, wherein the light detecting element has a light filter disposed thereon, the point light source emitting laser light of a predetermined wavelength band, and the light filter transmitting the laser light of the predetermined wavelength band.

8. A time-of-flight depth module comprising a time-of-flight projector according to any one of claims 1 to 7 and a time-of-flight receiver for receiving the laser light pattern reflected by a target object to obtain depth information of the target object.

9. The time of flight depth module of claim 8, further comprising a circuit board assembly and a pad assembly disposed between the circuit board assembly and the time of flight projector, the pad assembly defining a conductive aperture, a conductive member disposed within the conductive aperture, the conductive member electrically connecting the circuit board assembly and the time of flight projector.

10. An electronic device, comprising:

a housing; and

the time of flight depth module of claim 9, in combination with the housing.