WO2020038067A1 - Laser projection module and control method therefor, and depth image acquisition apparatus and electronic device - Google Patents

Laser projection module and control method therefor, and depth image acquisition apparatus and electronic device Download PDF

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Publication number
WO2020038067A1
WO2020038067A1 PCT/CN2019/090082 CN2019090082W WO2020038067A1 WO 2020038067 A1 WO2020038067 A1 WO 2020038067A1 CN 2019090082 W CN2019090082 W CN 2019090082W WO 2020038067 A1 WO2020038067 A1 WO 2020038067A1
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WO
WIPO (PCT)
Prior art keywords
light
diffuser
conductive
detection
projection module
Prior art date
Application number
PCT/CN2019/090082
Other languages
French (fr)
Chinese (zh)
Inventor
张学勇
Original Assignee
Oppo广东移动通信有限公司
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Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2020038067A1 publication Critical patent/WO2020038067A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481Constructional features, e.g. arrangements of optical elements
    • G01S7/4814Constructional features, e.g. arrangements of optical elements of transmitters alone

Definitions

  • the present application relates to the field of three-dimensional imaging technology, and in particular, to a laser projection module, a method for controlling a laser projection module, a depth image acquisition device, and an electronic device.
  • Time of flight (TOF) imaging system can calculate the depth information of the measured object by calculating the time difference between the time when the laser projection module emits the optical signal and the time when the optical receiver receives the optical signal.
  • Laser projection modules typically include a light source and a diffuser. The light from the light source is diffused by the diffuser and then casts a uniform surface light into the scene.
  • Embodiments of the present application provide a laser projection module, a method for controlling the laser projection module, a depth image acquisition device, and an electronic device.
  • the laser projection module includes a light source, a diffuser, and a light detector.
  • the light source is used for emitting laser light.
  • the diffuser is used to diffuse the laser light.
  • the photodetector is configured to receive the laser light reflected by the diffuser to form a photodetection electrical signal, and a driving current of the light source is adjusted based on the photodetection electrical signal.
  • the laser projection module includes a light source, a diffuser, and a light detector.
  • the light source is used to emit laser light.
  • the diffuser is used to diffuse the laser light.
  • the receiver is used for receiving the laser light reflected by the diffuser to form a light detection electric signal.
  • the control method includes: acquiring the photo detection electric signal output by the photo detector; and adjusting a driving current of the light source according to the photo detection electric signal.
  • the depth image acquisition device includes a laser projection module and a light receiver.
  • the light receiver is configured to receive laser light emitted by the laser projection module.
  • the laser projection module includes a light source, a diffuser, and a light detector.
  • the light source is used for emitting laser light.
  • the diffuser is used to diffuse the laser light.
  • the photodetector is configured to receive the laser light reflected by the diffuser to form a photodetection electrical signal, and a driving current of the light source is adjusted based on the photodetection electrical signal.
  • An electronic device includes a housing and a depth image acquisition device.
  • the depth image acquisition device is disposed on the casing.
  • the depth image acquisition device includes a laser projection module and a light receiver.
  • the light receiver is configured to receive laser light emitted by the laser projection module.
  • the laser projection module includes a light source, a diffuser, and a light detector.
  • the light source is used for emitting laser light.
  • the diffuser is used to diffuse the laser light.
  • the photodetector is configured to receive the laser light reflected by the diffuser to form a photodetection electrical signal, and a driving current of the light source is adjusted based on the photodetection electrical signal.
  • FIG. 1 and FIG. 2 are three-dimensional structural diagrams of an electronic device according to some embodiments of the present application.
  • FIG. 3 is a schematic diagram of a three-dimensional structure of a depth image acquisition device according to some embodiments of the present application.
  • FIG. 4 is a schematic plan view of a depth image acquisition device according to some embodiments of the present application.
  • FIG. 5 is a schematic cross-sectional view of the depth image acquisition device in FIG. 4 along the V-V line.
  • FIG. 6 is a schematic structural diagram of a laser projection module according to some embodiments of the present application.
  • FIG. 7 is a schematic diagram of an arrangement of photodetectors in some embodiments of the present application.
  • 8 to 15 are schematic diagrams of arrangement of conductive electrodes in some embodiments of the present application.
  • 16 is a cross-sectional view of a diffuser of a laser projection module according to some embodiments of the present application.
  • FIG. 17 is a schematic diagram of an arrangement of conductive electrodes in some embodiments of the present application.
  • FIG. 18 is a schematic structural diagram of a laser projection module according to some embodiments of the present application.
  • FIG. 19 is a schematic diagram of an arrangement of conductive electrodes in some embodiments of the present application.
  • 20 is a cross-sectional view of a diffuser of a laser projection module according to some embodiments of the present application.
  • 21 to 24 are schematic diagrams of the arrangement of conductive paths in some embodiments of the present application.
  • 25 is a cross-sectional view of a diffuser of a laser projection module according to some embodiments of the present application.
  • 26 to 29 are schematic diagrams of arrangement of conductive paths in some embodiments of the present application.
  • FIG. 30 is a cross-sectional view of a diffuser of a laser projection module according to some embodiments of the present application.
  • FIG. 31 is a schematic diagram of an arrangement of conductive paths in some embodiments of the present application.
  • 32 is a cross-sectional view of a diffuser of a laser projection module according to some embodiments of the present application.
  • 33 and 34 are schematic flowcharts of a method for controlling a laser projection module according to some embodiments of the present application.
  • the present application provides a laser projection module 100.
  • the laser projection module 100 includes a light source 10, a diffuser 20 and a light detector 63.
  • the light source 10 is used to emit laser light.
  • the diffuser 20 is used to diffuse laser light.
  • the photodetector 63 is used to receive the laser light reflected by the diffuser 20 to form a photodetection electrical signal.
  • the driving current of the light source 10 is adjusted based on the light detection electric signal.
  • the laser projection module 100 further includes a rupture detection component.
  • the rupture detection component is used to output the rupture detection electrical signal, and the rupture detection The electrical signal is used to detect whether the diffuser 20 is broken.
  • the diffuser 20 includes an incident surface 201 and an exit surface 202 opposite to each other, and the crack detection component includes a light-transmitting conductive film 21.
  • the light-transmitting conductive film 21 is disposed on the incident surface 201 and / or the emission surface 202.
  • the light-transmitting conductive film 21 includes a conductive electrode 210 including an input terminal 211 and an output terminal 212, and the input terminal 211 and the output terminal 212 are connected to the processor 805 to form a conductive circuit.
  • the crack detection component includes conductive particles 220 doped in the diffuser 20.
  • the conductive particles 220 form a conductive path 22.
  • the conductive path 22 includes an input terminal 221 and an output terminal 222, and the input terminal 221 and the output terminal 222 are connected to the processor 805 to form a conductive circuit.
  • the light detector 63 includes a plurality of light detectors 63, and the plurality of light detectors 63 are arranged symmetrically around the light source 10.
  • the laser projection module 100 further includes a lens barrel 30.
  • the lens barrel 30 includes a lens barrel sidewall 33, which surrounds a receiving cavity 62.
  • the side wall 33 of the lens barrel includes a first surface 31 and a second surface 32 opposite to each other.
  • the first surface 31 is recessed toward the second surface 32 to form a mounting groove 34 communicating with the receiving cavity 62.
  • the diffuser 20 is mounted in the mounting groove 34.
  • the present application also provides a method for controlling the laser projection module 100.
  • the laser projection module 100 includes a light source 10, a diffuser 20 and a light detector 63.
  • the light source 10 is used to emit laser light.
  • the diffuser 20 is used to diffuse laser light.
  • the photodetector 63 is used to receive the laser light reflected by the diffuser 20 to form a photodetection electrical signal.
  • the control method includes: acquiring a light detection electric signal output by the light detector 63; and adjusting a driving current of the light source 10 according to the light detection electric signal.
  • the laser projection module 100 further includes a rupture detection component, and the rupture detection component is configured to output an electrical signal for rupture detection.
  • the rupture detection electric signal is used to detect whether the diffuser 20 is ruptured.
  • the control method after the step of obtaining the photodetection electrical signal output by the photodetector 63, further comprises: judging whether the photodetection electrical signal is less than a preset photodetection value; and when the photodetection electrical signal is less than the preset photodetection value, obtaining a crack detection electrical signal.
  • the step of adjusting the driving current of the light source 10 according to the light detection electric signal includes: determining whether the fracture detection electric signal is within a preset fracture detection range; and when the fracture detection electric signal is within a preset fracture detection range, The driving current of the light source 10 is increased; when the electrical signal of the fracture detection is not within a preset fracture detection range, the driving current of the light source 10 is decreased.
  • the present application further provides a depth image acquisition device 300.
  • the depth image acquisition device 300 includes a laser projection module 100 and a light receiver 200.
  • the laser projection module 100 includes a light source 10, a diffuser 20 and a light detector 63.
  • the light source 10 is used to emit laser light.
  • the diffuser 20 is used to diffuse laser light.
  • the photodetector 63 is used to receive the laser light reflected by the diffuser 20 to form a photodetection electrical signal.
  • the driving current of the light source 10 is adjusted based on the light detection electric signal.
  • the light receiver 200 is configured to receive laser light emitted by the laser projection module 100.
  • the present application further provides an electronic device 800.
  • the electronic device 800 includes a housing 801 and a depth image acquisition apparatus 300.
  • the depth image acquisition device 300 is provided on the casing 801.
  • the depth image acquisition device 300 includes: a laser projection module 100 and a light receiver 200.
  • the laser projection module 100 includes a light source 10, a diffuser 20 and a light detector 63.
  • the light source 10 is used to emit laser light.
  • the diffuser 20 is used to diffuse laser light.
  • the photodetector 63 is used to receive the laser light reflected by the diffuser 20 to form a photodetection electrical signal.
  • the driving current of the light source 10 is adjusted based on the light detection electric signal.
  • the light receiver 200 is configured to receive laser light emitted by the laser projection module 100.
  • the electronic device 800 includes a casing 801 and a depth image acquisition device 300.
  • the electronic device 800 may be a mobile phone, a tablet computer, a game console, a smart watch, a smart bracelet, a headset device, a drone, and the like.
  • the embodiment of the present application uses the electronic device 800 as a mobile phone as an example for description. It can be understood that the specific form of the electronic device 800 is not limited to a mobile phone.
  • the housing 801 may serve as a mounting carrier for the functional elements of the electronic device 800.
  • the housing 801 can provide protection for the functional elements from dust, drop, and water.
  • the functional elements can be a display screen 802, a visible light camera 400, a receiver, and the like.
  • the housing 801 includes a main body 803 and a movable bracket 804.
  • the movable bracket 804 can be moved relative to the main body 803 under the driving of a driving device. Move into the main body 803 (as shown in FIG. 1) or slide out from the main body 803 (as shown in FIG. 2).
  • Some functional elements can be installed on the main body 803, and other functional elements (such as the depth image acquisition device 300, the visible light camera 400, and the receiver) can be installed on the movable bracket 804, and the movement of the movable bracket 804 can be driven
  • the other functional element is retracted into or protruded from the main body 803.
  • the embodiment shown in FIG. 1 and FIG. 2 is only an example of a specific form of the casing 801, and cannot be understood as a limitation on the casing 801 of the present application.
  • the depth image acquisition apparatus 300 is mounted on a casing 801.
  • the housing 801 may be provided with an acquisition window, and the depth image acquisition device 300 is installed in alignment with the acquisition window so that the depth image acquisition device 300 acquires depth information.
  • the depth image acquisition device 300 is mounted on a movable bracket 804.
  • the user needs to use the depth image acquisition device 300, he can trigger the movable bracket 804 to slide out from the main body 803 to drive the depth image acquisition device 300 to protrude from the main body 803; when the depth image acquisition device 300 is not needed, he can trigger The movable bracket 804 slides into the main body 803 to drive the depth image acquisition device 300 to retract into the main body.
  • the depth image acquisition device 300 is a time-of-flight (TOF) depth camera.
  • TOF time-of-flight
  • the depth image acquisition device 300 includes a first substrate assembly 71, a spacer 72, a laser projection module 100 and a light receiver 200.
  • the first substrate assembly 71 includes a first substrate 711 and a flexible circuit board 712 connected to each other.
  • the spacer 72 is disposed on the first substrate 711.
  • the laser projection module 100 is configured to project laser light outward, and the laser projection module 100 is disposed on the pad 72.
  • the flexible circuit board 712 is bent and one end of the flexible circuit board 712 is connected to the first substrate 711 and the other end is connected to the laser projection module 100.
  • the light receiver 200 is disposed on the first substrate 711.
  • the light receiver 200 is configured to receive laser light reflected by a person or an object in the target space.
  • the light receiver 200 includes a housing 741 and an optical element 742 provided on the housing 741.
  • the housing 741 is integrally connected with the pad 72.
  • the first substrate assembly 71 includes a first substrate 711 and a flexible circuit board 712.
  • the first substrate 711 may be a printed wiring board or a flexible wiring board.
  • the first substrate 711 may be laid with a control circuit or the like of the depth image acquisition device 300.
  • One end of the flexible circuit board 712 may be connected to the first substrate 711, and the other end of the flexible circuit board 712 is connected to the circuit board 50 (shown in FIG. 5).
  • the flexible circuit board 712 can be bent at a certain angle, so that the relative positions of the devices connected at both ends of the flexible circuit board 712 can be selected.
  • the spacer 72 is disposed on the first substrate 711.
  • the spacer 72 is in contact with the first substrate 711 and is carried on the first substrate 711.
  • the spacer 72 may be combined with the first substrate 711 by means of adhesion or the like.
  • the material of the spacer 72 may be metal, plastic, or the like.
  • a surface where the pad 72 is combined with the first substrate 711 may be a flat surface, and a surface opposite to the combined surface of the pad 72 may be a flat surface, so that the laser projection module 100 is disposed on the pad 72. It has better smoothness.
  • the light receiver 200 is disposed on the first substrate 711, and the contact surface between the light receiver 200 and the first substrate 711 is substantially flush with the contact surface between the pad 72 and the first substrate 711 (that is, the installation starting point of the two is at On the same plane).
  • the light receiver 200 includes a housing 741 and an optical element 742.
  • the casing 741 is disposed on the first substrate 711, and the optical element 742 is disposed on the casing 741.
  • the casing 741 may be a lens holder and a lens barrel of the light receiver 200, and the optical element 742 may be an element such as a lens disposed in the casing 741.
  • the light receiver 200 further includes a photosensitive chip (not shown), and the laser light reflected by a person or an object in the target space passes through the optical element 742 and is irradiated into the photosensitive chip, and the photosensitive chip responds to the laser.
  • the housing 741 and the cushion block 72 are integrally connected.
  • the housing 741 and the spacer 72 may be integrally formed; or the materials of the housing 741 and the spacer 72 are different, and the two are integrally formed by two-color injection molding or the like.
  • the housing 741 and the spacer 72 may also be separately formed, and the two form a matching structure.
  • one of the housing 741 and the spacer 72 may be set on the first substrate 711, and then the other One is disposed on the first substrate 711 and connected integrally.
  • the laser projection module 100 is disposed on the cushion block 72.
  • the cushion block 72 can raise the height of the laser projection module 100, thereby increasing the height of the surface on which the laser projection module 100 emits laser light.
  • the laser light is not easily blocked by the light receiver 200, so that the laser light can be completely irradiated on the measured object in the target space.
  • the laser projection module 100 includes a light source 10, a diffuser 20, a lens barrel 30, a protective cover 40, a circuit board 50, a driver 61, and a light detector 63.
  • the lens barrel 30 includes a ring-shaped lens barrel sidewall 33, and the ring-shaped lens barrel sidewall 33 surrounds a receiving cavity 62.
  • the side wall 33 of the lens barrel includes an inner surface 331 located in the receiving cavity 62 and an outer surface 332 opposite to the inner surface.
  • the side wall 33 of the lens barrel includes a first surface 31 and a second surface 32 opposite to each other.
  • the receiving cavity 62 penetrates the first surface 31 and the second surface 32.
  • the first surface 31 is recessed toward the second surface 32 to form a mounting groove 34 communicating with the receiving cavity 62.
  • the bottom surface 35 of the mounting groove 34 is located on a side of the mounting groove 34 remote from the first surface 31.
  • the outer surface 332 of the side wall 33 of the lens barrel is circular at one end of the first surface 31, and the outer surface 332 of the side wall 33 of the lens barrel is formed with an external thread at one end of the first surface 31.
  • the circuit board 50 is disposed on the second surface 32 of the lens barrel 30 and closes one end of the receiving cavity 62.
  • the circuit board 50 may be a flexible circuit board or a printed circuit board.
  • the light source 10 is carried on the circuit board 50 and received in the receiving cavity 62.
  • the light source 10 is configured to emit laser light toward the first surface 31 (the mounting groove 34) side of the lens barrel 30.
  • the light source 10 may be a single-point light source or a multi-point light source.
  • the light source 10 may specifically be an edge-emitting laser, for example, a distributed feedback laser (Distributed Feedback Laser, DFB), etc .; when the light source 10 is a multi-point light source, the light source 10 may specifically be vertical A cavity-surface emitter (Vertical-Cavity Surface Laser, VCSEL), or the light source 10 may also be a multi-point light source composed of multiple edge-emitting lasers.
  • DFB distributed Feedback Laser
  • VCSEL Vertical A cavity-surface emitter
  • VCSEL Vertical-Cavity Surface Laser
  • the height of the vertical cavity surface emitting laser is small, and the use of the vertical cavity surface emitter as the light source 10 is beneficial to reduce the height of the laser projection module 100, and it is convenient to integrate the laser projection module 100 into a mobile phone, etc., which has a high thickness of the fuselage.
  • the driver 61 is carried on the circuit board 50 and is electrically connected to the light source 10. Specifically, the driver 61 may receive an input signal modulated by the processor 805, and convert the input signal into a constant current source and transmit it to the light source 10, so that the light source 10 is directed toward the first position of the lens barrel 30 under the action of the constant current source.
  • the one side 31 emits laser light.
  • the driver 61 of this embodiment is provided outside the lens barrel 30. In other embodiments, the driver 61 may be disposed in the lens barrel 30 and carried on the circuit board 50.
  • the diffuser 20 is mounted (supported) in the mounting groove 34 and abuts the mounting groove 34.
  • the diffuser 20 is used to diffuse the laser light passing through the diffuser 20. That is, when the light source 10 emits laser light toward the first surface 31 side of the lens barrel 30, the laser light passes through the diffuser 20 and is diffused or projected outside the lens barrel 30 by the diffuser 20.
  • the protective cover 40 includes a top wall 41 and a protective sidewall 42 extending from one side of the top wall 41.
  • a light through hole 401 is defined in the center of the top wall 41.
  • the protective side wall 42 is disposed around the top wall 41 and the light through hole 401.
  • the top wall 41 and the protection side wall 42 together form a mounting cavity 43, and the light-passing hole 401 communicates with the mounting cavity 43.
  • the cross-section of the inner surface of the protective sidewall 42 is circular, and an inner thread is formed on the inner surface of the protective sidewall 42.
  • the internal thread of the protective sidewall 42 is screwed with the external thread of the lens barrel 30 to mount the protective cover 40 on the lens barrel 30.
  • the interference between the top wall 41 and the diffuser 20 causes the diffuser 40 to be sandwiched between the top wall 41 and the bottom surface 35 of the mounting groove 34.
  • the opening 20 is installed in the lens barrel 30, and the diffuser 20 is installed in the installation groove 34, and the protective cover 40 is installed on the lens barrel 30 to clamp the diffuser 20 between the protective cover 40 and the installation groove.
  • the diffuser 20 is fixed on the lens barrel 30.
  • glue which can prevent the gas glue from diffusing and solidifying on the surface of the diffuser 20 after the glue is volatilized to affect the microstructure of the diffuser 20, and can avoid diffusion
  • the diffuser 20 falls off from the lens barrel 30 when the glue of the device 20 and the lens barrel 30 decreases due to aging.
  • the photodetector 63 is disposed on the circuit board 50 and is housed in the receiving cavity 62.
  • the light transmittance of the diffuser 20 usually cannot reach 100%. Most of the laser light emitted by the light source 10 will be diffused out by the diffuser 20, but a small part of the laser light will be reflected by the diffuser 20.
  • the light detector 63 can be used for receiving the laser light reflected by the diffuser 20. After receiving the laser light reflected from the diffuser 20, the photodetector 63 forms a photodetection electrical signal output.
  • the depth image acquisition device 300 further includes a processor 805.
  • the electronic device 800 also includes a processor.
  • the processor of the electronic device 800 and the processor 805 of the depth image acquisition device 300 may be the same processor, or may be two independent processors. In a specific embodiment of the present application, the processor of the electronic device 800 and the processor of the depth image acquisition device 300 are the same processor.
  • the processor 805 may receive the light detection electric signal output by the light detector 63 and adjust the driving current of the light source 10 according to the light detection electric signal.
  • the diffuser 20 further includes a rupture detection component.
  • the rupture detection component is configured to output a rupture detection electrical signal, and the rupture detection electrical signal is used to reflect whether the diffuser 20 is ruptured.
  • the processor 805 After receiving the light detection electric signal, the processor 805 first compares the size of the light detection electric signal with the preset light detection value. If the light detection electric signal is smaller than the preset light detection value, it means that the laser light received by the light detector 63 is less. The reason for this phenomenon may be that the emitted laser light is increased due to the rupture of the diffuser 20, and the laser light reflected back to the photodetector 63 is reduced.
  • the reduction of the electro-optical conversion efficiency of the light source 10 causes the total amount of laser light emitted by the light source 10 to decrease, further causing reflection The laser light to the photodetector 63 is reduced. Then, when the processor 805 detects that the light detection electric signal is less than a preset light detection value, the processor 805 controls the rupture detection component to output a rupture detection electric signal.
  • the reason for the decrease in the laser light received by the photodetector 63 is the rupture of the diffuser 20; if the rupture detection electrical signal is within the preset rupture detection range, the diffusion is indicated The detector 20 is not broken, and the reason why the laser light received by the photodetector 63 is reduced is that the photoelectric conversion efficiency of the light source 10 becomes low. If the light detection electric signal is greater than or equal to the preset light detection value, it indicates that both the diffuser 20 and the light source 10 work normally, and the processor 805 does not perform an action at this time.
  • the processor 805 detects that the decrease in the laser light received by the photodetector 63 is due to the rupture of the diffuser 20, then the processor 805 should reduce the driving current of the light source 10 or directly turn off the light source 10 to avoid emission.
  • the laser energy is too high, causing damage to the user's eyes.
  • the processor 805 detects that the decrease in the laser light received by the photodetector 63 is due to the low photoelectric conversion efficiency of the light source 10, the processor 805 should be appropriately adjusted higher at this time.
  • the driving current of the light source 10 meets the current target space's demand for the light emitting power of the light source 10 and ensures the accuracy of obtaining the depth information.
  • the laser projection module 100, the depth image acquisition device 300, and the electronic device 800 are provided with a light detector 63 on the laser projection module 100, and based on the light detection electric signal output by the light detector 63, The driving current of the light source 10 is adjusted. In this way, by autonomously adjusting the driving current of the light source 10 to ensure that the light source 10 has sufficient luminous power, it is beneficial to improve the accuracy of acquiring depth information.
  • the number of the light detectors 63 is multiple, and the plurality of light detectors 63 are arranged symmetrically around the light source 10 in the center. In this way, the multiple photodetectors 63 can receive more laser light reflected by the diffuser 20.
  • the processor 805 After the processor 805 receives a plurality of light detection electric signals, it first sums and averages the plurality of light detection electric signals to obtain an average value of the plurality of light detection electric signals, and then compares the average value of the light detection electric signals with a preset light detection.
  • the processor 805 does nothing.
  • the use of multiple photodetectors 63 arranged at different positions to receive the laser light reflected by the diffuser 20 can more accurately detect the amount of laser light reflected by the diffuser 20, and furthermore, the light source 10 can be more accurately detected.
  • the actual luminous power is helpful for the processor 805 to accurately adjust the driving current.
  • the value of the preset light detection value is determined by the driving current before being adjusted. Specifically, different driving currents correspond to different preset photodetection values. Each time the photodetection electrical signal output by the photodetector 63 should be compared with a preset photodetection value corresponding to a driving current that has not yet been adjusted. For example, if the current drive current is A1, the preset photodetection value should be B1, and the photodetection electrical signal is compared with B1; if the current drive current is A2 (A2> A1), the preset photodetection value should be B2 (B2> B1). The photodetection electrical signal is compared with B2.
  • the driving current of the light source 10 may be different in different scenarios. If the driving current is large, more laser light is emitted from the light source 10, and more laser light is reflected back to the photodetector 63. If the driving current is small, less laser light is emitted from the light source 10, and laser light is reflected back to the photodetector 63. And less. Therefore, the photo-detection electric signal output by the photo-detector 63 should be compared with a preset photo-detection value corresponding to the driving current used in the current scene, in order to more accurately detect whether the actual luminous power of the light source 10 is greater than or less than the theoretical value. The power that should be transmitted further adjusts the driving current, so that the actual luminous power meets the demand for the power that should be transmitted in theory.
  • the diffuser 20 includes an incident surface 201 near the light source 10 and an exit surface 202 opposite to the incident surface 201.
  • the diffuser 20 is an optical element for diffusing the laser light emitted from the light source 10 into a plurality of light beams for emission, so that the laser light finally emitted into the target space is surface light with a substantially uniform light intensity distribution.
  • the diffuser 20 is provided with a rupture detection element.
  • the rupture detection element can output a rupture detection electrical signal.
  • the processor 805 may receive a fracture detection electric signal output by the fracture detection element, and determine whether the diffuser 20 is fractured based on the fracture detection electric signal.
  • the crack detection element may be a light-transmitting conductive film 21.
  • a conductive electrode 210 is provided on the light-transmitting conductive film 21.
  • the conductive electrode 210 includes an input terminal 211 and an output terminal 212.
  • the input terminal 211 and the output terminal 212 are all connected to the processor 805, and the input terminal 211, the processor 805, and the output terminal 212 form a conductive loop.
  • the light-transmitting conductive film 21 can be formed on the surface of the diffuser 20 by electroplating.
  • the material of the light-transmitting conductive film 21 can be any one of indium tin oxide (ITO), nano-silver wire, and metal silver wire. .
  • Indium tin oxide, nano-silver wire, and metallic silver wire all have good light transmittance and electrical conductivity, and can realize the output of the electrical signal for crack detection after being energized without blocking the light path of the diffuser 20.
  • the light-transmitting conductive film 21 is formed on the diffuser 20, if the diffuser 20 is in an intact state, the resistance of the light-transmitting conductive film 21 is small. In this state, the conductive electrode 210 on the light-transmitting conductive film 21 is energized.
  • the processor 805 may compare the preset rupture detection range with the current rupture detection electrical signal (ie, current), where the preset rupture detection range is a value range of the current detected when the diffuser 20 is not ruptured.
  • the value range of the current is determined by both the voltage applied to the conductive electrode 210 and the resistance of the conductive electrode 210 itself. If the rupture detection electrical signal is within the preset rupture detection range, it means that the transparent conductive film 21 is not ruptured, and it is judged that the diffuser 20 is not ruptured. If the rupture detection electrical signal is not within the preset rupture detection range, it means that the light transmission is conductive The film 21 is broken, and it is further judged that the diffuser 20 is broken. When the diffuser 20 is broken, the processor 805 can reduce the driving current of the light source 10 or directly turn off the light source 10.
  • the light-transmitting conductive film 21 may be a single layer, and the single-layer light-transmitting conductive film 21 may be disposed on the incident surface 201 of the diffuser 20 (as shown in FIG. 6), or A single-layer light-transmitting conductive film 21 may also be disposed on the emission surface 202 (not shown) of the diffuser 20.
  • one conductive electrode 210 provided on the transparent conductive film 21 may be provided.
  • the input terminal 211 and the output terminal 212 of the single conductive electrode 210 are connected to the processor 805 and form a conductive loop.
  • the connection direction of the input terminal 211 and the output terminal 212 is the length direction of the transparent conductive film 21 (as shown in FIG. 8).
  • the length direction here is the first radial direction of the light-transmitting conductive film 21, and the "length direction" of the light-transmitting conductive film 21 is interpreted the same below); or, the input terminal 211
  • the direction of the connection with the output terminal 212 is the width direction of the light-transmitting conductive film 21 (as shown in FIG. 9; if the light-transmitting conductive film 21 is circular, the width direction here is the first direction perpendicular to the light-transmitting conductive film 21.
  • the conductive electrodes 210 can span the entire light-transmitting conductive film 21, which can more accurately detect whether the light-transmitting conductive film 21 is broken, and further can accurately judge the diffuser. 20 Whether it is cracked.
  • Each conductive electrode 210 may be disjoint from each other and are insulated from each other.
  • Each conductive electrode 210 includes an input terminal 211 and an output terminal 212.
  • Each input terminal 211 and each output terminal 212 are connected to the processor 805 to form a conductive loop.
  • the input terminals 211 and output terminals 212 of the plurality of conductive electrodes 210 are respectively connected to the processor 805 to form a plurality of conductive loops. .
  • the connection direction of each input terminal 211 and each output terminal 212 (that is, the extending direction of each conductive electrode 210) is the same as that of the transparent conductive film 21.
  • a plurality of conductive electrodes 210 are arranged in parallel at intervals along the length direction of the light-transmitting conductive film 21 (as shown in FIG. 12); or, the direction of the line connecting each input terminal 211 and each output terminal 212 is a light-transmitting conductive film.
  • the width direction of 21 a plurality of conductive electrodes 210 are arranged at parallel intervals along the width direction of the light-transmitting conductive film 21 (as shown in FIG.
  • the direction of the line connecting each input terminal 211 and each output terminal 212 is transparent.
  • a plurality of conductive electrodes 210 are arranged at parallel intervals along the diagonal direction of the light-transmitting conductive film 21 (as shown in FIGS. 14 and 15). Regardless of the arrangement of the conductive electrodes 210, the multiple conductive electrodes 210 can make the entire layer of the light-transmitting conductive film 21 occupy a larger area of the diffuser 20 compared to the single conductive electrode 210. Correspondingly more rupture detection electric signals can be output.
  • the plurality of conductive electrodes 210 occupy more area of the light-transmitting conductive film 21, and correspondingly can output more electrical signals for crack detection.
  • the processor 805 can be more accurate based on more electrical signals for crack detection. Judging whether the light-transmitting conductive film 21 is broken, and further determining whether the diffuser 20 is broken, improves the accuracy of the diffuser 20 crack detection.
  • the light-transmitting conductive film 21 is a single-layer bridge structure.
  • the light-transmitting conductive film 21 with a single-layer bridge structure may be disposed on the incident surface 201 or the exit surface 202 of the diffuser 20.
  • the light-transmitting conductive film 21 includes a plurality of conductive electrodes 210.
  • the plurality of conductive electrodes 210 include a plurality of first conductive electrodes 213 disposed in parallel and insulated from each other, a plurality of second conductive electrodes 214 disposed in parallel and insulated from each other, and a plurality of bridge conductive electrodes 215.
  • the plurality of first conductive electrodes 213 and the plurality of second conductive electrodes 214 are criss-crossed. Each of the first conductive electrodes 213 is continuous and uninterrupted, and each of the second conductive electrodes 214 is disconnected at the intersection with the corresponding plurality of first conductive electrodes 213 and is not conductive with the plurality of first conductive electrodes 213. Each bridge conductive electrode 215 conducts a break of the corresponding second conductive electrode 214.
  • An insulator 216 is provided at the staggered position of the bridge conductive electrode 215 and the first conductive electrode 213. The insulator 216 can be produced by a silk screen or a yellow light process.
  • each first conductive electrode 213 are connected to the processor 805 to form a conductive loop
  • the two ends of each second conductive electrode 214 are connected to the processor 805 to form a conductive loop.
  • a plurality of first conductive electrodes The two ends of the electrode 213 are respectively connected to the processor 805 to form a plurality of conductive loops
  • the two ends of the plurality of second conductive electrodes 214 are respectively connected to the processor 805 to form a plurality of conductive loops.
  • the plurality of first conductive electrodes 213 and the plurality of second conductive electrodes 214 mean that the plurality of first conductive electrodes 213 and the plurality of second conductive electrodes 214 are vertically staggered with each other, that is, the plurality of first conductive electrodes 213 and the plurality of The included angle of the second conductive electrode 214 is 90 degrees.
  • the plurality of first conductive electrodes 213 and the plurality of second conductive electrodes 214 may be criss-crossed, and the plurality of first conductive electrodes 213 and the plurality of second conductive electrodes 214 may be staggered with each other.
  • the processor 805 can simultaneously energize the plurality of first conductive electrodes 213 and the plurality of second conductive electrodes 214 to obtain multiple crack detection electrical signals; or, the processor 805 can sequentially energize the plurality of first conductive electrodes 213 and The plurality of second conductive electrodes 214 are energized to obtain a plurality of crack detection electrical signals. Subsequently, the processor 805 judges whether the light-transmitting conductive film 21 is broken or not, and further determines whether the diffuser 20 is broken or not according to the break detection electric signal.
  • the electrical signal of the rupture detection output by the first conductive electrode 213 with the number 1 is not within the preset rupture detection range
  • the electrical signal of the rupture detection output by the second conductive electrode 214 with the number 3 is not within the preset range.
  • the crack detection range it is explained that the transparent conductive film 21 is broken at the intersection A of the first conductive electrode 213 with the number 1 and the second conductive electrode 214 with the number 3, and the diffuser 20 and the transparent conductive film 21 are broken. The position corresponding to the rupture position is also ruptured. In this way, through the single-layer bridging structure of the light-transmitting conductive film 21, it is possible to more accurately detect whether the diffuser 20 is broken and the specific position where the diffuser 20 is broken.
  • the light-transmitting conductive film 21 may also have a multilayer structure.
  • the light-transmitting conductive film 21 includes a first light-transmitting conductive film 217 and a second light-transmitting conductive film 218.
  • the first light-transmitting conductive film 217 is disposed on the incident surface 201 of the diffuser 20, and the second light-transmitting conductive film 218 is disposed on the exit surface 202 of the diffuser 20.
  • the first light-transmitting conductive film 217 is provided with a plurality of first conductive electrodes 2171 disposed in parallel and insulated from each other
  • the second light-transmissive conductive film 218 is provided with a plurality of second conductive electrodes 2181 disposed in parallel and insulated from each other.
  • the projections of the plurality of first conductive electrodes 2171 on the exit surface 202 and the plurality of second conductive electrodes 2181 are criss-crossed.
  • the two ends of each first conductive electrode 2171 are connected to the processor 805 to form a conductive loop
  • the two ends of each second conductive electrode 2181 are connected to the processor 805 to form a conductive loop.
  • a plurality of first conductive electrodes 2171 The two ends of each are respectively connected to the processor 805 to form a plurality of conductive loops, and the two ends of the plurality of second conductive electrodes 2181 are respectively connected to the processor 805 to form a plurality of conductive loops.
  • the plurality of first conductive electrodes 2171 and the plurality of second conductive electrodes 2181 are criss-crossed, which means that the plurality of first conductive electrodes 2171 and the plurality of second conductive electrodes 2181 are vertically staggered with each other, that is, the plurality of first conductive electrodes 2171 and the plurality of The included angle of the second conductive electrode 2181 is 90 degrees.
  • the plurality of first conductive electrodes 2171 and the plurality of second conductive electrodes 2181 may be criss-crossed, and the plurality of first conductive electrodes 2171 and the plurality of second conductive electrodes 2181 may be staggered with each other.
  • the processor 805 can simultaneously power on the plurality of first conductive electrodes 2171 and the plurality of second conductive electrodes 2181 to obtain multiple crack detection electrical signals; or, the processor 805 can sequentially turn on the plurality of first conductive electrodes 2171 and The plurality of second conductive electrodes 2181 are energized to obtain a plurality of crack detection electrical signals.
  • the processor 805 judges whether the light-transmitting conductive film 21 is broken or not, and further determines whether the diffuser 20 is broken or not according to the break detection electric signal. Specifically, if the rupture detection electric signal output by any one of the first conductive electrodes 2171 is not within the preset rupture detection range, it indicates that the first transparent conductive film 217 is ruptured, and the diffuser 20 is further considered to be ruptured; The fracture detection electric signal output by the conductive electrode 2181 is not within the preset fracture detection range, it indicates that the second light-transmitting conductive film 218 is fractured, and the diffuser 20 is further considered to be fractured.
  • the processor 805 can accurately detect whether the diffuser 20 is broken and the specific position of the diffuser 20 according to the burst detection electrical signals output by the plurality of first conductive electrodes 2171 and the plurality of second conductive electrodes 2181.
  • the rupture detection element may be conductive particles 220 doped in the diffuser 20.
  • the conductive particles 220 may form a conductive path 22.
  • the diffuser 20 is in an intact state, the adjacent conductive particles 220 are bonded. At this time, the resistance of the entire conductive path 22 is small. In this state, the conductive path 22 is energized, that is, a certain amount of voltage is applied. At this time, the current output by the conductive path 22 obtained by the processor 805 is relatively large.
  • the diffuser 20 is broken, the junction between the conductive particles 220 doped in the diffuser 20 is disconnected. At this time, the resistance value of the entire conductive path 22 is close to infinity.
  • the processor 805 may compare the preset rupture detection range with the current rupture detection electrical signal (ie, current), where the preset rupture detection range is a value range of the current detected when the diffuser 20 is not ruptured.
  • the value range of the current is determined by both the voltage applied to the conductive path 22 and the resistance of the conductive path 22 itself. If the rupture detection electrical signal is within the preset rupture detection range, the conductive path 22 is not disconnected, and it is determined that the diffuser 20 is not ruptured. If the rupture detection electrical signal is not within the preset rupture detection range, the conductive path 22 is disconnected. On, it is judged that the diffuser 20 is broken. When the diffuser 20 is broken, the processor 805 can reduce the driving current of the light source 10 or directly turn off the light source 10.
  • the diffuser 20 is doped with a plurality of conductive particles 220, and the plurality of conductive particles 220 form a conductive path 22.
  • the conductive path 22 includes an input terminal 221 and an output terminal 222.
  • the input terminal 221 and the output terminal 222 are connected to the processor 805.
  • the input terminal 221, the processor 805, and the output terminal 222 form a conductive loop.
  • the conductive paths 22 for example, the extending direction of the conductive paths 22 is the length direction of the diffuser 20 (as shown in FIG.
  • the extending direction of the conductive path 22 is the width direction of the diffuser 20 (as shown in FIG. 22; if the diffuser 20 is circular Shape, then the width direction here is perpendicular to the first radial direction of the diffuser 20 and the second radial direction, and the “width direction” of the diffuser 20 is the same below); or, the extending direction of the conductive path 22 is the diffuser 20 Diagonal direction (as shown in Figures 23 and 24). Regardless of the above-mentioned arrangement of the conductive paths 22, the conductive paths 22 can span the entire diffuser 20, and it can be more accurately detected whether the diffuser 20 is broken.
  • the diffuser 20 is doped with a plurality of conductive particles 220, and the plurality of conductive particles 220 form a plurality of conductive paths 22.
  • the plurality of conductive paths 22 are disjoint from each other and are insulated from each other.
  • Each conductive path 22 includes an input terminal 221 and an output terminal 222.
  • Each input terminal 221 and each output terminal 222 are connected to the processor 805 to form a conductive circuit.
  • the input terminals 221 and output terminals 222 of the plurality of conductive paths 22 are respectively connected to the processor 805 to form a plurality of conductive circuits. .
  • the extension direction of each conductive path 22 is the length direction of the diffuser 20 (as shown in FIG. 26), and the plurality of conductive paths 22 are arranged along the diffuser 20
  • the longitudinal direction is arranged at parallel intervals. Since the diffuser 20 has a certain thickness, after the plurality of conductive paths 22 are arranged at parallel intervals along the longitudinal direction of the diffuser 20, it can also be arranged at stacked intervals along the thickness direction of the diffuser 20 ( (As shown in FIG. 25); or, the extending direction of each conductive path 22 is the width direction of the diffuser 20 (as shown in FIG.
  • the diffuser 20 has a certain thickness. Therefore, after a plurality of conductive paths 22 are arranged in parallel and spaced apart along the width direction of the diffuser 20, they can also be arranged in a stacked interval along the thickness direction of the diffuser 20 (not shown); or The extending direction of the conductive path 22 is the diagonal direction of the incident surface 201 (shown in FIG. 6) of the diffuser 20 (as shown in FIGS. 28 and 29).
  • a plurality of conductive paths 22 at the diffuser 20 After the diagonal directions of the incident surface 201 are arranged at parallel intervals, they can also be arranged in a stacking interval along the thickness direction of the diffuser 20 (not shown); or, the extension direction of each conductive path 22 is the incident surface of the diffuser 20 201 and a diagonal direction (not shown) of the exit surface 202 (shown in FIG. 6), and a plurality of conductive paths 22 are disposed at parallel intervals along the diagonal direction of the incident surface 201 and the exit surface 202 of the diffuser 20; or, The extension direction of each conductive path 22 is arranged at parallel intervals in the thickness direction of the diffuser 20 (not shown).
  • the diffuser 20 Since the diffuser 20 has a certain width, multiple conductive paths are arranged in parallel at intervals in the thickness direction of the diffuser 20 Later, it can also be arranged at a stacking interval along the width direction of the diffuser 20 (not shown). No matter which of the conductive paths 22 is arranged in the manner described above, compared with a single conductive path 22, a plurality of conductive paths 22 can occupy more volume of the diffuser 20, and accordingly can output more rupture detection. electric signal. When only a single conductive path 22 is provided, there may be a location where the diffuser 20 ruptures is far from the position of the single conductive path 22, and the influence on the single conductive path 22 is not large.
  • the rupture detection voltage output by the single conductive path 22 The signal is still within the preset rupture detection range, and the detection accuracy is not high.
  • the multiple conductive paths 22 occupy more volume of the diffuser 20 and correspondingly output more electric signals for rupture detection.
  • the processor 805 can more accurately judge based on the more electric signals for rupture detection. Whether the diffuser 20 is ruptured improves the accuracy of the diffuser 20 rupture detection.
  • the diffuser 20 is doped with a plurality of conductive particles 220, and the plurality of conductive particles 220 form a plurality of conductive paths 22.
  • the plurality of conductive paths 22 include a plurality of first conductive paths 223 and a plurality of second conductive paths 224.
  • a plurality of first conductive paths 223 are arranged in parallel and spaced apart from each other, and a plurality of second conductive paths 224 are arranged in parallel and spaced apart from each other.
  • the plurality of first conductive paths 223 and the plurality of second conductive paths 224 are criss-crossed in space.
  • each first conductive path 223 are connected to the processor 805 to form a conductive loop
  • the two ends of each second conductive path 224 are connected to the processor 805 to form a conductive loop.
  • a plurality of first conductive paths 223 The two ends of each are respectively connected to the processor 805 to form a plurality of conductive loops
  • the two ends of the plurality of second conductive paths 224 are respectively connected to the processor 805 to form a plurality of conductive loops.
  • the plurality of first conductive paths 223 and the plurality of second conductive paths 224 are spatially criss-crossed, which means that the plurality of first conductive paths 223 and the plurality of second conductive paths 224 are vertically staggered with each other in space, that is, a plurality of An included angle between the first conductive path 223 and the plurality of second conductive paths 224 is 90 degrees.
  • the extending direction of the plurality of first conductive paths 223 may be the length direction of the diffuser 20, and the extending direction of the plurality of second conductive paths 224 is the width direction of the diffuser 20; or, the plurality of first conductive paths 223
  • the direction of extension of the diffuser 20 is the length direction of the diffuser 20, and the direction of extension of the plurality of second conductive paths 224 is the thickness direction of the diffuser 20; or, the direction of extension of the plurality of first conductive paths 223 may be the width direction of the diffuser 20
  • the extending direction of the plurality of second conductive paths 224 is the thickness direction of the diffuser 20.
  • the plurality of first conductive paths 223 and the plurality of second conductive paths 224 are spatially criss-crossed.
  • the plurality of first conductive paths 223 and the plurality of second conductive paths 224 may be staggered with each other.
  • the processor 805 can simultaneously power on the plurality of first conductive paths 223 and the plurality of second conductive paths 224 to obtain multiple crack detection electrical signals; or, the processor 805 can sequentially apply power to the plurality of first conductive paths 223 and The plurality of second conductive paths 224 are energized to obtain a plurality of crack detection electrical signals. Subsequently, the processor 805 determines whether the diffuser 20 is ruptured based on the rupture detection electric signal.
  • FIG. 30 For example, when it is detected that the electrical signal for the rupture detection output by the first conductive path 223 with the number 2 is not within the preset rupture detection range, and the electrical signal with the rupture detection output from the second conductive path 224 with the number 4 When neither is within the preset rupture detection range, it is explained that the intersection C of the first conductive path 223 with the number 2 and the second conductive path 224 with the number 4 is broken, and the position corresponding to the diffuser 20 is also broken. In this way, by arranging the first conductive paths 223 and the second conductive paths 224 in a crisscross pattern, it is possible to more accurately detect whether the diffuser 20 is broken and the specific position of the diffuser 20 is broken.
  • a plurality of first conductive paths 223 and a plurality of second conductive paths 224 are spatially criss-crossed to form a pair of mutually-intersecting conductive path pairs 225. It is also possible to form a plurality of pairs of the aforementioned conductive path pairs 225 in the width direction or the thickness direction of the diffuser 20.
  • the processor 805 may determine whether the diffuser 20 is ruptured and a specific position of the diffuser 20 based on a plurality of rupture detection electrical signals.
  • the diffuser 20 ruptures When only one pair of conductive path pairs 225 is provided, there may be a location where the diffuser 20 ruptures is far from the position of a single pair of conductive path pairs 225, and the effect of a single pair of conductive path pairs 225 is not significant.
  • the single pair In the case where the plurality of first conductive paths 223 and the plurality of second conductive paths 224 in the conductive path pair 225 output rupture detection electrical signals within a preset rupture detection range, the detection accuracy is not high. Multiple pairs of conductive path pairs 225 can occupy more volume of the diffuser 20 and can output more electrical signals for rupture detection.
  • the processor 805 can more accurately determine whether the diffuser 20 ruptures based on more electrical signals for rupture detection The specific position of the diffuser 20 rupture improves the accuracy of the diffuser 20 rupture detection.
  • the conductive path 22 is formed by doping the conductive particles 220 in the diffuser, and the break detection of the diffuser 20 can also be realized by using the electrical signal of the break detection output by the conductive path 22.
  • the way in which the conductive particles 220 are doped in the diffuser 20 to form the conductive path 22 as the detection element can reduce the thickness of the laser projection module 100, which is further beneficial to reducing the depth image
  • the thickness of the acquisition device 300 is beneficial for integrating the depth image acquisition device 300 into an electronic device 800, such as a mobile phone, which requires a high thickness of the fuselage.
  • the side where the cushion block 72 is combined with the first substrate 711 is provided with a receiving cavity 723.
  • the depth image acquisition apparatus 300 further includes an electronic component 77 provided on the first substrate 711.
  • the electronic component 77 is housed in the receiving cavity 723.
  • the electronic component 77 may be an element such as a capacitor, an inductor, a transistor, or a resistor.
  • the electronic component 77 may be electrically connected to a control line laid on the first substrate 711 and used for or controlling the operation of the laser projection module 100 or the light receiver 200.
  • the electronic component 77 is housed in the receiving cavity 723, and the space in the pad 72 is used reasonably.
  • the number of the receiving cavities 723 may be one or more, and the receiving cavities 723 may be spaced apart from each other. When mounting the pad 72, the receiving cavity 723 and the electronic component 77 may be aligned and the pad 72 may be disposed on the first substrate 711.
  • the cushion block 72 is provided with an escape through hole 724 connected to at least one receiving cavity 723, and at least one electronic component 77 extends into the escape through hole 724. It can be understood that when the electronic component 77 needs to be accommodated in the avoiding through hole, the height of the electronic component 77 is required to be not higher than the height of the receiving cavity 723. For electronic components having a height higher than the receiving cavity 723, an avoiding through hole 724 corresponding to the receiving cavity 723 may be provided, and the electronic component 77 may partially extend into the avoiding through hole 724 so as not to increase the height of the cushion 72. Arranges the electronic component 77.
  • the first substrate assembly 711 further includes a reinforcing plate 713, and the reinforcing plate 713 is coupled to a side of the first substrate 711 opposite to the pad 72.
  • the reinforcing plate 713 may cover one side of the first substrate 711, and the reinforcing plate 713 may be used to increase the strength of the first substrate 711 and prevent deformation of the first substrate 711.
  • the reinforcing plate 713 may be made of a conductive material, such as a metal or an alloy.
  • the reinforcing plate 713 and the housing 801 may be electrically connected to make the reinforcing plate 713. Grounding and effectively reducing the interference of the static electricity of external components on the depth image acquisition device 300.
  • the depth image acquisition device 300 further includes a connector 76 connected to the first substrate assembly 71 and used to electrically communicate with electronic components external to the depth image acquisition device 300. Sexual connection.
  • the present application further provides a control method of the laser projection module 100.
  • the laser projection module 100 is the laser projection module 100 according to any one of the above embodiments. Control methods include:
  • control method after step 01 further includes:
  • Step 03 Adjusting the driving current of the light source 10 according to the light detection electric signal includes:
  • step 01, step 021, step 022, step 03, step 031, step 032, and step 033 can all be implemented by the processor 805. That is to say, the processor 805 may be configured to obtain a photodetection electrical signal output by the photodetector 63 and adjust a driving current of the light source 10 according to the photodetection electrical signal.
  • the processor 805 may be further configured to determine whether the light detection electrical signal is less than a preset light detection value, and when the light detection electrical signal is less than a preset light detection value, obtain a fracture detection electrical signal, and determine whether the fracture detection electrical signal is within a preset Within the rupture detection range, when the rupture detection electrical signal is within the preset rupture detection range, the drive current of the light source 10 is increased, and when the rupture detection electrical signal is not within the preset rupture detection range, the drive current of the light source 10 is decreased. .
  • the light transmittance of the diffuser 20 usually cannot reach 100%. Most of the laser light emitted by the light source 10 will be diffused out by the diffuser 20, but a small part of the laser light will be reflected by the diffuser 20.
  • the light detector 63 can be used for receiving the laser light reflected by the diffuser 20. After receiving the laser light reflected from the diffuser 20, the photodetector 63 forms a photodetection electrical signal output.
  • the processor 805 receives the photodetection electrical signal output by the photodetector 63, and compares the magnitude of the photodetection electrical signal with a preset photodetection value.
  • the photodetection electrical signal is less than the preset photodetection value, It indicates that the laser light received by the photodetector 63 is less.
  • the reason for this phenomenon may be that the emitted laser light is increased due to the rupture of the diffuser 20, the laser light reflected back to the photodetector 63 is reduced, or the electro-optical conversion efficiency of the light source 10 is reduced The total amount of laser light emitted from the light source 10 is reduced, which further reduces the amount of laser light reflected to the photodetector 63.
  • the processor 805 detects that the light detection electric signal is less than a preset light detection value, the processor 805 controls the rupture detection component to output a rupture detection electric signal.
  • the reason for the decrease in the laser light received by the photodetector 63 is the rupture of the diffuser 20; if the rupture detection electrical signal is within the preset rupture detection range, the diffusion is indicated The detector 20 is not broken, and the reason why the laser light received by the photodetector 63 is reduced is that the photoelectric conversion efficiency of the light source 10 becomes low. If the light detection electric signal is greater than or equal to the preset light detection value, it indicates that both the diffuser 20 and the light source 10 work normally, and the processor 805 does not perform an action at this time.
  • the processor 805 detects that the decrease in the laser light received by the photodetector 63 is due to the rupture of the diffuser 20, then the processor 805 should reduce the driving current of the light source 10 or directly turn off the light source 10 to avoid emission The laser energy is too high, causing damage to the user's eyes. If the processor 805 detects that the decrease in the laser light received by the photodetector 63 is due to the low photoelectric conversion efficiency of the light source 10, the processor 805 should be appropriately adjusted higher at this time.
  • the driving current of the light source 10 meets the current target space's demand for the light emitting power of the light source 10 and ensures the accuracy of obtaining the depth information.
  • the control method of the laser projection module 100 adjusts the driving current of the light source 10 based on the light detection electric signal output by the light detector 63. In this way, by autonomously adjusting the driving current of the light source 10 to ensure that the light source 10 has sufficient luminous power, it is beneficial to improve the accuracy of acquiring depth information.
  • the processor 805 can receive a plurality of light detection electrical signals. After the processor 805 receives a plurality of light detection electric signals, it first sums and averages the plurality of light detection electric signals to obtain an average value of the plurality of light detection electric signals, and then compares the average value of the light detection electric signals with a preset light detection.
  • the processor 805 does nothing.
  • the use of multiple photodetectors 63 arranged at different positions to receive the laser light reflected by the diffuser 20 can more accurately detect the amount of laser light reflected by the diffuser 20, and furthermore, the light source 10 can be more accurately detected.
  • the actual luminous power is helpful for the processor 805 to accurately adjust the driving current.
  • the value of the preset light detection value is determined by the driving current before being adjusted.
  • different driving currents correspond to different preset photodetection values, and each time the photodetection electrical signal output by the photodetector 63 should be compared with a preset photodetection value corresponding to the current unadjusted drive current. For example, if the current drive current is A1, the preset photodetection value should be B1, and the photodetection electrical signal is compared with B1; if the current drive current is A2 (A2> A1), the preset photodetection value should be B2 (B2> B1). The photodetection electrical signal is compared with B2.
  • the driving current of the light source 10 may be different in different scenarios. If the driving current is large, more laser light is emitted from the light source 10, and more laser light is reflected back to the photo detector 63. If the driving current is small, less laser light is emitted from the light source 10, and laser light is reflected back to the photo detector 63 And less. Therefore, the photo-detection electric signal output by the photo-detector 63 should be compared with a preset photo-detection value corresponding to the driving current used in the current scene, in order to more accurately detect whether the actual luminous power of the light source 10 is greater than or less than the theoretical value. The power that should be transmitted further adjusts the driving current, so that the actual luminous power meets the demand for the power that should be transmitted in theory.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "plurality” is at least two, for example, two, three, unless specifically defined otherwise.

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Abstract

A laser projection module (100) and a control method therefor, and a depth image acquisition apparatus (300) and an electronic device (800). The laser projection module (100) comprises a light source (10), a diffuser (20), and a photodetector (63). The light source (10) is used to emit laser. The diffuser (20) is used to diffuse the laser. The photodetector (63) is used to receive the laser reflected back by the diffuser (20) to form a photodetection electrical signal, and the driving current of the light source (10) is adjusted based on the photodetection electrical signal.

Description

激光投射模组及控制方法、深度图像获取设备和电子装置Laser projection module and control method, depth image acquisition device and electronic device
优先权信息Priority information
本申请请求2018年8月22日向中国国家知识产权局提交的、专利申请号为201810962460.0的专利申请的优先权和权益,并且通过参照将其全文并入此处。This application claims the priority and rights of a patent application filed with the State Intellectual Property Office of China on August 22, 2018, with a patent application number of 201810962460.0, and the entirety of which is incorporated herein by reference.
技术领域Technical field
本申请涉及三维成像技术领域,特别涉及一种激光投射模组、激光投射模组的控制方法、深度图像获取设备和电子装置。The present application relates to the field of three-dimensional imaging technology, and in particular, to a laser projection module, a method for controlling a laser projection module, a depth image acquisition device, and an electronic device.
背景技术Background technique
飞行时间(Time of Flight,TOF)成像系统可通过计算激光投射模组发射光信号的时刻,与光接收器接收到光信号的时刻之间的时间差来计算被测物体的深度信息。激光投射模组通常包括光源和扩散器。光源发出的光经扩散器的扩散作用后向场景中投射均匀的面光。Time of flight (TOF) imaging system can calculate the depth information of the measured object by calculating the time difference between the time when the laser projection module emits the optical signal and the time when the optical receiver receives the optical signal. Laser projection modules typically include a light source and a diffuser. The light from the light source is diffused by the diffuser and then casts a uniform surface light into the scene.
发明内容Summary of the Invention
本申请的实施例提供了一种激光投射模组、激光投射模组的控制方法、深度图像获取设备和电子装置。Embodiments of the present application provide a laser projection module, a method for controlling the laser projection module, a depth image acquisition device, and an electronic device.
本申请实施方式的激光投射模组包括光源、扩散器和光检测器。所述光源用于发射激光。所述扩散器用于扩散所述激光。所述光检测器用于接收由所述扩散器反射回的激光以形成光检测电信号,所述光源的驱动电流基于所述光检测电信号进行调整。The laser projection module according to the embodiment of the present application includes a light source, a diffuser, and a light detector. The light source is used for emitting laser light. The diffuser is used to diffuse the laser light. The photodetector is configured to receive the laser light reflected by the diffuser to form a photodetection electrical signal, and a driving current of the light source is adjusted based on the photodetection electrical signal.
本申请实施方式的激光投射模组的控制方法,所述激光投射模组包括光源、扩散器和光检测器,所述光源用于发射激光,所述扩散器用于扩散所述激光,所述光检测器用于接收由所述扩散器反射回的激光以形成光检测电信号。所述控制方法包括:获取所述光检测器输出的所述光检测电信号;根据所述光检测电信号调整所述光源的驱动电流。A method for controlling a laser projection module according to an embodiment of the present application. The laser projection module includes a light source, a diffuser, and a light detector. The light source is used to emit laser light. The diffuser is used to diffuse the laser light. The receiver is used for receiving the laser light reflected by the diffuser to form a light detection electric signal. The control method includes: acquiring the photo detection electric signal output by the photo detector; and adjusting a driving current of the light source according to the photo detection electric signal.
本申请实施方式的深度图像获取设备包括激光投射模组和光接收器。所述光接收器用于接收由所述激光投射模组发射的激光。所述激光投射模组包括光源、扩散器和光检测器。所述光源用于发射激光。所述扩散器用于扩散所述激光。所述光检测器用于接收由所述扩散器反射回的激光以形成光检测电信号,所述光源的驱动电流基于所述光检测电信号进行调整。The depth image acquisition device according to the embodiment of the present application includes a laser projection module and a light receiver. The light receiver is configured to receive laser light emitted by the laser projection module. The laser projection module includes a light source, a diffuser, and a light detector. The light source is used for emitting laser light. The diffuser is used to diffuse the laser light. The photodetector is configured to receive the laser light reflected by the diffuser to form a photodetection electrical signal, and a driving current of the light source is adjusted based on the photodetection electrical signal.
本申请实施方式的电子装置包括壳体和深度图像获取设备。所述深度图像获取设备设置在所述壳体上。所述深度图像获取设备包括激光投射模组和光接收器。所述光接收器用于接收由所述激光投射模组发射的激光。所述激光投射模组包括光源、扩散器和光检测器。所述光源用于发射激光。所述扩散器用于扩散所述激光。所述光检测器用于接收由所述扩散器反射回的激光以形成光检测电信号,所述光源的驱动电流基于所述光检测电信号进行调整。An electronic device according to an embodiment of the present application includes a housing and a depth image acquisition device. The depth image acquisition device is disposed on the casing. The depth image acquisition device includes a laser projection module and a light receiver. The light receiver is configured to receive laser light emitted by the laser projection module. The laser projection module includes a light source, a diffuser, and a light detector. The light source is used for emitting laser light. The diffuser is used to diffuse the laser light. The photodetector is configured to receive the laser light reflected by the diffuser to form a photodetection electrical signal, and a driving current of the light source is adjusted based on the photodetection electrical signal.
本申请的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本申请的实践了解到。Additional aspects and advantages of the present application will be given in part in the following description, part of which will become apparent from the following description, or be learned through practice of the present application.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
本申请上述的和/或附加的方面和优点从下面结合附图对实施例的描述中将变得明显和容易理解,其中:The above and / or additional aspects and advantages of this application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:
图1和图2是本申请某些实施方式的电子装置的立体结构示意图。FIG. 1 and FIG. 2 are three-dimensional structural diagrams of an electronic device according to some embodiments of the present application.
图3是本申请某些实施方式的深度图像获取设备的立体结构示意图。FIG. 3 is a schematic diagram of a three-dimensional structure of a depth image acquisition device according to some embodiments of the present application.
图4是本申请某些实施方式的深度图像获取设备的平面结构示意图。FIG. 4 is a schematic plan view of a depth image acquisition device according to some embodiments of the present application.
图5是图4中的深度图像获取设备沿V-V线的截面示意图。FIG. 5 is a schematic cross-sectional view of the depth image acquisition device in FIG. 4 along the V-V line.
图6是本申请某些实施方式的激光投射模组的结构示意图。FIG. 6 is a schematic structural diagram of a laser projection module according to some embodiments of the present application.
图7是本申请某些实施方式的光检测器的排布示意图。FIG. 7 is a schematic diagram of an arrangement of photodetectors in some embodiments of the present application.
图8至图15是本申请某些实施方式的导电电极的排布示意图。8 to 15 are schematic diagrams of arrangement of conductive electrodes in some embodiments of the present application.
图16是本申请某些实施方式的激光投射模组的扩散器的剖面图。16 is a cross-sectional view of a diffuser of a laser projection module according to some embodiments of the present application.
图17是本申请某些实施方式的导电电极的排布示意图。FIG. 17 is a schematic diagram of an arrangement of conductive electrodes in some embodiments of the present application.
图18是本申请某些实施方式的激光投射模组的结构示意图。FIG. 18 is a schematic structural diagram of a laser projection module according to some embodiments of the present application.
图19是本申请某些实施方式的导电电极的排布示意图。FIG. 19 is a schematic diagram of an arrangement of conductive electrodes in some embodiments of the present application.
图20是本申请某些实施方式的激光投射模组的扩散器的剖面图。20 is a cross-sectional view of a diffuser of a laser projection module according to some embodiments of the present application.
图21至图24是本申请某些实施方式的导电通路的排布示意图。21 to 24 are schematic diagrams of the arrangement of conductive paths in some embodiments of the present application.
图25是本申请某些实施方式的激光投射模组的扩散器的剖面图。25 is a cross-sectional view of a diffuser of a laser projection module according to some embodiments of the present application.
图26至图29是本申请某些实施方式的导电通路的排布示意图。26 to 29 are schematic diagrams of arrangement of conductive paths in some embodiments of the present application.
图30是本申请某些实施方式的激光投射模组的扩散器的剖面图。FIG. 30 is a cross-sectional view of a diffuser of a laser projection module according to some embodiments of the present application.
图31是本申请某些实施方式的导电通路的排布示意图。FIG. 31 is a schematic diagram of an arrangement of conductive paths in some embodiments of the present application.
图32是本申请某些实施方式的激光投射模组的扩散器的剖面图。32 is a cross-sectional view of a diffuser of a laser projection module according to some embodiments of the present application.
图33和图34是本申请某些实施方式的激光投射模组的控制方法的流程示意图。33 and 34 are schematic flowcharts of a method for controlling a laser projection module according to some embodiments of the present application.
具体实施方式detailed description
以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。另外,下面结合附图描述的本申请的实施方式是示例性的,仅用于解释本申请的实施方式,而不能理解为对本申请的限制。The embodiments of the present application are further described below with reference to the accompanying drawings. The same or similar reference numerals in the drawings represent the same or similar elements or elements having the same or similar functions throughout. In addition, the embodiments of the present application described below with reference to the drawings are exemplary, and are only used to explain the embodiments of the present application, and should not be construed as limiting the present application.
请参阅图6,本申请提供一种激光投射模组100。激光投射模组100包括光源10、扩散器20及光检测器63。光源10用于发射激光。扩散器20用于扩散激光。光检测器63用于接收由扩散器20反射回的激光以形成光检测电信号。光源10的驱动电流基于光检测电信号进行调整。Please refer to FIG. 6, the present application provides a laser projection module 100. The laser projection module 100 includes a light source 10, a diffuser 20 and a light detector 63. The light source 10 is used to emit laser light. The diffuser 20 is used to diffuse laser light. The photodetector 63 is used to receive the laser light reflected by the diffuser 20 to form a photodetection electrical signal. The driving current of the light source 10 is adjusted based on the light detection electric signal.
请再参阅图6,在某些实施方式中,激光投射模组100还包括破裂检测组件,在光检测电信号小于预设光检测值时,破裂检测组件用于输出破裂检测电信号,破裂检测电信号用于检测扩散器20是否破裂。Please refer to FIG. 6 again. In some embodiments, the laser projection module 100 further includes a rupture detection component. When the light detection electrical signal is less than a preset light detection value, the rupture detection component is used to output the rupture detection electrical signal, and the rupture detection The electrical signal is used to detect whether the diffuser 20 is broken.
请再参阅图6和图8,在某些实施方式中,扩散器20包括相背的入射面201和出射面202,破裂检测组件包括透光导电膜21。透光导电膜21设置在入射面201和/或出射面202上。透光导电膜21包括导电电极210,导电电极210包括输入端211和输出端212,输入端211和输出端212与处理器805连接以形成导电回路。Please refer to FIGS. 6 and 8 again. In some embodiments, the diffuser 20 includes an incident surface 201 and an exit surface 202 opposite to each other, and the crack detection component includes a light-transmitting conductive film 21. The light-transmitting conductive film 21 is disposed on the incident surface 201 and / or the emission surface 202. The light-transmitting conductive film 21 includes a conductive electrode 210 including an input terminal 211 and an output terminal 212, and the input terminal 211 and the output terminal 212 are connected to the processor 805 to form a conductive circuit.
请参阅图6、图20和图21,在某些实施方式中,破裂检测组件包括掺杂在扩散器20中的导电粒子220。导电粒子220形成导电通路22。导电通路22包括输入端221和输出端222,输入端221和输出端222与处理器805连接以形成导电回路。Please refer to FIG. 6, FIG. 20, and FIG. 21. In some embodiments, the crack detection component includes conductive particles 220 doped in the diffuser 20. The conductive particles 220 form a conductive path 22. The conductive path 22 includes an input terminal 221 and an output terminal 222, and the input terminal 221 and the output terminal 222 are connected to the processor 805 to form a conductive circuit.
请参阅图7,在某些实施方式中,光检测器63包括多个,多个光检测器63环绕光源10呈中心对称设置。Referring to FIG. 7, in some embodiments, the light detector 63 includes a plurality of light detectors 63, and the plurality of light detectors 63 are arranged symmetrically around the light source 10.
请再参阅图6,在某些实施方式中,激光投射模组100还包括镜筒30。镜筒30包括镜筒侧壁33,镜筒侧壁33围成收容腔62。镜筒侧壁33包括相背的第一面31及第二面32。第一面31朝第二面32凹陷形成与收容腔62连通的安装槽34。扩散器20安装在安装槽34内。Please refer to FIG. 6 again. In some embodiments, the laser projection module 100 further includes a lens barrel 30. The lens barrel 30 includes a lens barrel sidewall 33, which surrounds a receiving cavity 62. The side wall 33 of the lens barrel includes a first surface 31 and a second surface 32 opposite to each other. The first surface 31 is recessed toward the second surface 32 to form a mounting groove 34 communicating with the receiving cavity 62. The diffuser 20 is mounted in the mounting groove 34.
本申请还提供一种激光投射模组100的控制方法。激光投射模组100包括光源10、扩散器20和光检测器63。光源10用于发射激光。扩散器20用于扩散激光。光检测器63用于接收由扩散器20反射回的激光以形成光检测电信号。控制方法包括:获取光检测器63输出的光检测电信号;根据光检测电信号调整光源10的驱动电流。The present application also provides a method for controlling the laser projection module 100. The laser projection module 100 includes a light source 10, a diffuser 20 and a light detector 63. The light source 10 is used to emit laser light. The diffuser 20 is used to diffuse laser light. The photodetector 63 is used to receive the laser light reflected by the diffuser 20 to form a photodetection electrical signal. The control method includes: acquiring a light detection electric signal output by the light detector 63; and adjusting a driving current of the light source 10 according to the light detection electric signal.
在某些实施方式中,激光投射模组100还包括破裂检测组件,破裂检测组件用于输出破裂检测的电信号。破裂检测电信号用于检测扩散器20是否破裂。控制方法在获取光检测器63输出的光检测电信号的步骤后还包括:判断光检测电信号是否小于预设光检测值;在光检测电信号小于预设光检测值时,获取破裂检测电信号。In some embodiments, the laser projection module 100 further includes a rupture detection component, and the rupture detection component is configured to output an electrical signal for rupture detection. The rupture detection electric signal is used to detect whether the diffuser 20 is ruptured. The control method, after the step of obtaining the photodetection electrical signal output by the photodetector 63, further comprises: judging whether the photodetection electrical signal is less than a preset photodetection value; and when the photodetection electrical signal is less than the preset photodetection value, obtaining a crack detection electrical signal.
在某些实施方式中,根据光检测电信号调整光源10的驱动电流的步骤包括:判断破裂检测电信号是否处于预设破裂检测范围内;在破裂检测电信号处于预设破裂检测范围内时,调高光源10的驱动电流;在破裂检测电信号不处于预设破裂检测范围内时,调低光源10的驱动电流。In some embodiments, the step of adjusting the driving current of the light source 10 according to the light detection electric signal includes: determining whether the fracture detection electric signal is within a preset fracture detection range; and when the fracture detection electric signal is within a preset fracture detection range, The driving current of the light source 10 is increased; when the electrical signal of the fracture detection is not within a preset fracture detection range, the driving current of the light source 10 is decreased.
请参阅图3和图6,本申请还提供一种深度图像获取设备300。深度图像获取设备300包括:激光 投射模组100和光接收器200。激光投射模组100包括光源10、扩散器20及光检测器63。光源10用于发射激光。扩散器20用于扩散激光。光检测器63用于接收由扩散器20反射回的激光以形成光检测电信号。光源10的驱动电流基于光检测电信号进行调整。光接收器200用于接收由激光投射模组100发射的激光。Referring to FIG. 3 and FIG. 6, the present application further provides a depth image acquisition device 300. The depth image acquisition device 300 includes a laser projection module 100 and a light receiver 200. The laser projection module 100 includes a light source 10, a diffuser 20 and a light detector 63. The light source 10 is used to emit laser light. The diffuser 20 is used to diffuse laser light. The photodetector 63 is used to receive the laser light reflected by the diffuser 20 to form a photodetection electrical signal. The driving current of the light source 10 is adjusted based on the light detection electric signal. The light receiver 200 is configured to receive laser light emitted by the laser projection module 100.
请参阅图2、图3和图6,本申请还提供一种电子装置800。电子装置800包括壳体801和深度图像获取设备300。深度图像获取设备300设置在壳体801上。深度图像获取设备300包括:激光投射模组100和光接收器200。激光投射模组100包括光源10、扩散器20及光检测器63。光源10用于发射激光。扩散器20用于扩散激光。光检测器63用于接收由扩散器20反射回的激光以形成光检测电信号。光源10的驱动电流基于光检测电信号进行调整。光接收器200用于接收由激光投射模组100发射的激光。Please refer to FIG. 2, FIG. 3 and FIG. 6. The present application further provides an electronic device 800. The electronic device 800 includes a housing 801 and a depth image acquisition apparatus 300. The depth image acquisition device 300 is provided on the casing 801. The depth image acquisition device 300 includes: a laser projection module 100 and a light receiver 200. The laser projection module 100 includes a light source 10, a diffuser 20 and a light detector 63. The light source 10 is used to emit laser light. The diffuser 20 is used to diffuse laser light. The photodetector 63 is used to receive the laser light reflected by the diffuser 20 to form a photodetection electrical signal. The driving current of the light source 10 is adjusted based on the light detection electric signal. The light receiver 200 is configured to receive laser light emitted by the laser projection module 100.
请一并参阅图1和图2,本申请实施方式的电子装置800包括壳体801及深度图像获取设备300。电子装置800可以是手机、平板电脑、游戏机、智能手表、智能手环、头显设备、无人机等。本申请实施方式以电子装置800为手机为例进行说明,可以理解,电子装置800的具体形式不限于手机。Please refer to FIG. 1 and FIG. 2 together. The electronic device 800 according to the embodiment of the present application includes a casing 801 and a depth image acquisition device 300. The electronic device 800 may be a mobile phone, a tablet computer, a game console, a smart watch, a smart bracelet, a headset device, a drone, and the like. The embodiment of the present application uses the electronic device 800 as a mobile phone as an example for description. It can be understood that the specific form of the electronic device 800 is not limited to a mobile phone.
壳体801可以作为电子装置800的功能元件的安装载体。壳体801可以为功能元件提供防尘、防摔、防水等保护,功能元件可以是显示屏802、可见光摄像头400、受话器等。在本申请实施例中,壳体801包括主体803及可动支架804,可动支架804在驱动装置的驱动下可以相对于主体803运动,例如可动支架804可以相对于主体803滑动,以滑入主体803(如图1所示)或从主体803滑出(如图2所示)。部分功能元件(例如显示屏802)可以安装在主体803上,另一部分功能元件(例如深度图像获取设备300、可见光摄像头400、受话器)可以安装在可动支架804上,可动支架804运动可带动该另一部分功能元件缩回主体803内或从主体803中伸出。当然,图1和图2所示的实施例仅仅是对壳体801的一种具体形式举例,不能理解为对本申请的壳体801的限制。The housing 801 may serve as a mounting carrier for the functional elements of the electronic device 800. The housing 801 can provide protection for the functional elements from dust, drop, and water. The functional elements can be a display screen 802, a visible light camera 400, a receiver, and the like. In the embodiment of the present application, the housing 801 includes a main body 803 and a movable bracket 804. The movable bracket 804 can be moved relative to the main body 803 under the driving of a driving device. Move into the main body 803 (as shown in FIG. 1) or slide out from the main body 803 (as shown in FIG. 2). Some functional elements (such as the display 802) can be installed on the main body 803, and other functional elements (such as the depth image acquisition device 300, the visible light camera 400, and the receiver) can be installed on the movable bracket 804, and the movement of the movable bracket 804 can be driven The other functional element is retracted into or protruded from the main body 803. Of course, the embodiment shown in FIG. 1 and FIG. 2 is only an example of a specific form of the casing 801, and cannot be understood as a limitation on the casing 801 of the present application.
深度图像获取设备300安装在壳体801上。具体地,壳体801上可以开设有采集窗口,深度图像获取设备300与采集窗口对准安装以使深度图像获取设备300采集深度信息。在本申请的具体实施例中,深度图像获取设备300安装在可动支架804上。用户在需要使用深度图像获取设备300时,可以触发可动支架804从主体803中滑出以带动深度图像获取设备300从主体803中伸出;在不需要使用深度图像获取设备300时,可以触发可动支架804滑入主体803以带动深度图像获取设备300缩回主体中。本申请实施例中,深度图像获取设备300为飞行时间(Time of Flight,TOF)深度相机。The depth image acquisition apparatus 300 is mounted on a casing 801. Specifically, the housing 801 may be provided with an acquisition window, and the depth image acquisition device 300 is installed in alignment with the acquisition window so that the depth image acquisition device 300 acquires depth information. In a specific embodiment of the present application, the depth image acquisition device 300 is mounted on a movable bracket 804. When the user needs to use the depth image acquisition device 300, he can trigger the movable bracket 804 to slide out from the main body 803 to drive the depth image acquisition device 300 to protrude from the main body 803; when the depth image acquisition device 300 is not needed, he can trigger The movable bracket 804 slides into the main body 803 to drive the depth image acquisition device 300 to retract into the main body. In the embodiment of the present application, the depth image acquisition device 300 is a time-of-flight (TOF) depth camera.
请一并参阅图3至图5,深度图像获取设备300包括第一基板组件71、垫块72、激光投射模组100及光接收器200。第一基板组件71包括互相连接的第一基板711及柔性电路板712。垫块72设置在第一基板711上。激光投射模组100用于向外投射激光,激光投射模组100设置在垫块72上。柔性电路板712弯折且柔性电路板712的一端连接第一基板711,另一端连接激光投射模组100。光接收器200设置在第一基板711上,光接收器200用于接收被目标空间中的人或物反射回的激光。光接收器200包括外壳741及设置在外壳741上的光学元件742。外壳741与垫块72连接成一体。Please refer to FIGS. 3 to 5 together. The depth image acquisition device 300 includes a first substrate assembly 71, a spacer 72, a laser projection module 100 and a light receiver 200. The first substrate assembly 71 includes a first substrate 711 and a flexible circuit board 712 connected to each other. The spacer 72 is disposed on the first substrate 711. The laser projection module 100 is configured to project laser light outward, and the laser projection module 100 is disposed on the pad 72. The flexible circuit board 712 is bent and one end of the flexible circuit board 712 is connected to the first substrate 711 and the other end is connected to the laser projection module 100. The light receiver 200 is disposed on the first substrate 711. The light receiver 200 is configured to receive laser light reflected by a person or an object in the target space. The light receiver 200 includes a housing 741 and an optical element 742 provided on the housing 741. The housing 741 is integrally connected with the pad 72.
具体地,第一基板组件71包括第一基板711及柔性电路板712。第一基板711可以是印刷线路板或柔性线路板。第一基板711上可以铺设有深度图像获取设备300的控制线路等。柔性电路板712的一端可以连接在第一基板711上,柔性电路板712的另一端连接在电路板50(图5所示)上。柔性电路板712可以发生一定角度的弯折,使得柔性电路板712的两端连接的器件的相对位置可以有较多选择。Specifically, the first substrate assembly 71 includes a first substrate 711 and a flexible circuit board 712. The first substrate 711 may be a printed wiring board or a flexible wiring board. The first substrate 711 may be laid with a control circuit or the like of the depth image acquisition device 300. One end of the flexible circuit board 712 may be connected to the first substrate 711, and the other end of the flexible circuit board 712 is connected to the circuit board 50 (shown in FIG. 5). The flexible circuit board 712 can be bent at a certain angle, so that the relative positions of the devices connected at both ends of the flexible circuit board 712 can be selected.
垫块72设置在第一基板711上。在一个例子中,垫块72与第一基板711接触且承载在第一基板711上,具体地,垫块72可以通过胶粘等方式与第一基板711结合。垫块72的材料可以是金属、塑料等。在本申请的实施例中,垫块72与第一基板711结合的面可以是平面,垫块72与该结合的面相背的面也可以是平面,使得激光投射模组100设置在垫块72上时具有较好的平稳性。The spacer 72 is disposed on the first substrate 711. In one example, the spacer 72 is in contact with the first substrate 711 and is carried on the first substrate 711. Specifically, the spacer 72 may be combined with the first substrate 711 by means of adhesion or the like. The material of the spacer 72 may be metal, plastic, or the like. In the embodiment of the present application, a surface where the pad 72 is combined with the first substrate 711 may be a flat surface, and a surface opposite to the combined surface of the pad 72 may be a flat surface, so that the laser projection module 100 is disposed on the pad 72. It has better smoothness.
光接收器200设置在第一基板711上,且光接收器200和第一基板711的接触面与垫块72和第一基板711的接触面基本齐平设置(即,二者的安装起点在同一平面上)。具体地,光接收器200包括外壳741及光学元件742。外壳741设置在第一基板711上,光学元件742设置在外壳741上,外壳741可以是光接收器200的镜座及镜筒,光学元件742可以是设置在外壳741内的透镜等元件。进一步地,光接收器200还包括感光芯片(图未示),由目标空间中的人或物反射回的激光通过光学元件742后照射到感光芯片中,感光芯片对该激光产生响应。在本申请的实施例中,外壳741与垫块72连接成一体。具体地,外壳741与垫块72可以是一体成型;或者外壳741与垫块72的材料不同,二者通过双色注塑 等方式一体成型。外壳741与垫块72也可以是分别成型,二者形成配合结构,在组装深度图像获取设备300时,可以先将外壳741与垫块72中的一个设置在第一基板711上,再将另一个设置在第一基板711上且连接成一体。The light receiver 200 is disposed on the first substrate 711, and the contact surface between the light receiver 200 and the first substrate 711 is substantially flush with the contact surface between the pad 72 and the first substrate 711 (that is, the installation starting point of the two is at On the same plane). Specifically, the light receiver 200 includes a housing 741 and an optical element 742. The casing 741 is disposed on the first substrate 711, and the optical element 742 is disposed on the casing 741. The casing 741 may be a lens holder and a lens barrel of the light receiver 200, and the optical element 742 may be an element such as a lens disposed in the casing 741. Further, the light receiver 200 further includes a photosensitive chip (not shown), and the laser light reflected by a person or an object in the target space passes through the optical element 742 and is irradiated into the photosensitive chip, and the photosensitive chip responds to the laser. In the embodiment of the present application, the housing 741 and the cushion block 72 are integrally connected. Specifically, the housing 741 and the spacer 72 may be integrally formed; or the materials of the housing 741 and the spacer 72 are different, and the two are integrally formed by two-color injection molding or the like. The housing 741 and the spacer 72 may also be separately formed, and the two form a matching structure. When assembling the depth image acquisition device 300, one of the housing 741 and the spacer 72 may be set on the first substrate 711, and then the other One is disposed on the first substrate 711 and connected integrally.
如此,将激光投射模组100设置在垫块72上,垫块72可以垫高激光投射模组100的高度,进而提高激光投射模组100出射激光的面的高度,激光投射模组100发射的激光不易被光接收器200遮挡,使得激光能够完全照射到目标空间中的被测物体上。In this way, the laser projection module 100 is disposed on the cushion block 72. The cushion block 72 can raise the height of the laser projection module 100, thereby increasing the height of the surface on which the laser projection module 100 emits laser light. The laser light is not easily blocked by the light receiver 200, so that the laser light can be completely irradiated on the measured object in the target space.
请结合图6,激光投射模组100包括光源10、扩散器20、镜筒30、保护罩40、电路板50、驱动器61及光检测器63。With reference to FIG. 6, the laser projection module 100 includes a light source 10, a diffuser 20, a lens barrel 30, a protective cover 40, a circuit board 50, a driver 61, and a light detector 63.
镜筒30包括呈环状的镜筒侧壁33,环状的镜筒侧壁33围成收容腔62。镜筒侧壁33包括位于收容腔62内的内表面331及与内表面相背的外表面332。镜筒侧壁33包括相背的第一面31及第二面32。收容腔62贯穿第一面31及第二面32。第一面31朝第二面32凹陷形成与收容腔62连通的安装槽34。安装槽34的底面35位于安装槽34的远离第一面31的一侧。镜筒侧壁33的外表面332在第一面31的一端的横截面呈圆形,镜筒侧壁33的外表面332在第一面31的一端形成有外螺纹。The lens barrel 30 includes a ring-shaped lens barrel sidewall 33, and the ring-shaped lens barrel sidewall 33 surrounds a receiving cavity 62. The side wall 33 of the lens barrel includes an inner surface 331 located in the receiving cavity 62 and an outer surface 332 opposite to the inner surface. The side wall 33 of the lens barrel includes a first surface 31 and a second surface 32 opposite to each other. The receiving cavity 62 penetrates the first surface 31 and the second surface 32. The first surface 31 is recessed toward the second surface 32 to form a mounting groove 34 communicating with the receiving cavity 62. The bottom surface 35 of the mounting groove 34 is located on a side of the mounting groove 34 remote from the first surface 31. The outer surface 332 of the side wall 33 of the lens barrel is circular at one end of the first surface 31, and the outer surface 332 of the side wall 33 of the lens barrel is formed with an external thread at one end of the first surface 31.
电路板50设置在镜筒30的第二面32上并封闭收容腔62的一端。电路板50可以为柔性电路板或印刷电路板。The circuit board 50 is disposed on the second surface 32 of the lens barrel 30 and closes one end of the receiving cavity 62. The circuit board 50 may be a flexible circuit board or a printed circuit board.
光源10承载在电路板50上并收容在收容腔62内。光源10用于朝镜筒30的第一面31(安装槽34)一侧发射激光。光源10可以是单点光源,也可是多点光源。在光源10为单点光源时,光源10具体可以为边发射型激光器,例如可以为分布反馈式激光器(Distributed Feedback Laser,DFB)等;在光源10为多点光源时,光源10具体可以为垂直腔面发射器(Vertical-Cavity Surface Laser,VCSEL),或者光源10也可为由多个边发射型激光器组成的多点光源。垂直腔面发射激光器的高度较小,采用垂直腔面发射器作为光源10,有利于减小激光投射模组100的高度,便于将激光投射模组100集成到手机等对机身厚度有较高的要求的电子装置800中。与垂直腔面发射器相比,边发射型激光器的温漂较小,可以减小温度对光源10的投射激光的效果的影响。The light source 10 is carried on the circuit board 50 and received in the receiving cavity 62. The light source 10 is configured to emit laser light toward the first surface 31 (the mounting groove 34) side of the lens barrel 30. The light source 10 may be a single-point light source or a multi-point light source. When the light source 10 is a single-point light source, the light source 10 may specifically be an edge-emitting laser, for example, a distributed feedback laser (Distributed Feedback Laser, DFB), etc .; when the light source 10 is a multi-point light source, the light source 10 may specifically be vertical A cavity-surface emitter (Vertical-Cavity Surface Laser, VCSEL), or the light source 10 may also be a multi-point light source composed of multiple edge-emitting lasers. The height of the vertical cavity surface emitting laser is small, and the use of the vertical cavity surface emitter as the light source 10 is beneficial to reduce the height of the laser projection module 100, and it is convenient to integrate the laser projection module 100 into a mobile phone, etc., which has a high thickness of the fuselage. The requirements of the electronic device 800. Compared with the vertical cavity surface emitter, the temperature drift of the side-emitting laser is smaller, and the influence of the temperature on the effect of the projected laser light from the light source 10 can be reduced.
驱动器61承载在电路板50上并与光源10电性连接。具体地,驱动器61可以接收经过处理器805调制的输入信号,并将输入信号转化为恒定的电流源后传输给光源10,以使光源10在恒定的电流源的作用下朝镜筒30的第一面31一侧发射激光。本实施方式的驱动器61设置在镜筒30外。在其他实施方式中,驱动器61可以设置在镜筒30内并承载在电路板50上。The driver 61 is carried on the circuit board 50 and is electrically connected to the light source 10. Specifically, the driver 61 may receive an input signal modulated by the processor 805, and convert the input signal into a constant current source and transmit it to the light source 10, so that the light source 10 is directed toward the first position of the lens barrel 30 under the action of the constant current source. The one side 31 emits laser light. The driver 61 of this embodiment is provided outside the lens barrel 30. In other embodiments, the driver 61 may be disposed in the lens barrel 30 and carried on the circuit board 50.
扩散器20安装(承载)在安装槽34内并与安装槽34相抵触。扩散器20用于扩散穿过扩散器20的激光。也即是,光源10朝镜筒30的第一面31一侧发射激光时,激光会经过扩散器20并被扩散器20扩散或投射到镜筒30外。The diffuser 20 is mounted (supported) in the mounting groove 34 and abuts the mounting groove 34. The diffuser 20 is used to diffuse the laser light passing through the diffuser 20. That is, when the light source 10 emits laser light toward the first surface 31 side of the lens barrel 30, the laser light passes through the diffuser 20 and is diffused or projected outside the lens barrel 30 by the diffuser 20.
保护罩40包括顶壁41及自顶壁41的一侧延伸形成的保护侧壁42。顶壁41的中心开设有通光孔401。保护侧壁42环绕顶壁41及通光孔401设置。顶壁41与保护侧壁42共同围成安装腔43,通光孔401与安装腔43连通。保护侧壁42的内表面的横截面呈圆形,保护侧壁42的内表面上形成有内螺纹。保护侧壁42的内螺纹与镜筒30的外螺纹螺合以将保护罩40安装在镜筒30上。顶壁41与扩散器20的抵触使得扩散器40被夹持在顶壁41与安装槽34的底面35之间。The protective cover 40 includes a top wall 41 and a protective sidewall 42 extending from one side of the top wall 41. A light through hole 401 is defined in the center of the top wall 41. The protective side wall 42 is disposed around the top wall 41 and the light through hole 401. The top wall 41 and the protection side wall 42 together form a mounting cavity 43, and the light-passing hole 401 communicates with the mounting cavity 43. The cross-section of the inner surface of the protective sidewall 42 is circular, and an inner thread is formed on the inner surface of the protective sidewall 42. The internal thread of the protective sidewall 42 is screwed with the external thread of the lens barrel 30 to mount the protective cover 40 on the lens barrel 30. The interference between the top wall 41 and the diffuser 20 causes the diffuser 40 to be sandwiched between the top wall 41 and the bottom surface 35 of the mounting groove 34.
如此,通过在镜筒30上开设安装槽34,并将扩散器20安装在安装槽34内,以及通过保护罩40安装在镜筒30上以将扩散器20夹持在保护罩40与安装槽34的底面35之间,从而实现将扩散器20固定在镜筒30上。此种方式无需使用胶水将扩散器20固定在镜筒30上,能够避免胶水挥发成气态后,气态的胶水扩散并凝固在扩散器20的表面而影响扩散器20的微观结构,并能够避免扩散器20和镜筒30的胶水因老化而使粘着力下降时扩散器20从镜筒30脱落。In this way, the opening 20 is installed in the lens barrel 30, and the diffuser 20 is installed in the installation groove 34, and the protective cover 40 is installed on the lens barrel 30 to clamp the diffuser 20 between the protective cover 40 and the installation groove. Between the bottom surfaces 35 of 34, the diffuser 20 is fixed on the lens barrel 30. In this way, it is not necessary to fix the diffuser 20 to the lens barrel 30 by using glue, which can prevent the gas glue from diffusing and solidifying on the surface of the diffuser 20 after the glue is volatilized to affect the microstructure of the diffuser 20, and can avoid diffusion The diffuser 20 falls off from the lens barrel 30 when the glue of the device 20 and the lens barrel 30 decreases due to aging.
请再结合图6,光检测器63设置在电路板50上,并收容在收容腔62内。扩散器20的透光率通常不能达到100%,光源10发射的激光绝大部分会经过扩散器20扩散出去,但小部分激光会被扩散器20反射。光检测器63可用于接收扩散器20反射回的激光。光检测器63接收到扩散器20反射回的激光后会形成光检测电信号输出。深度图像获取设备300还包括处理器805。电子装置800也包括处理器。电子装置800的处理器与深度图像获取设备300的处理器805可为同一个处理器,也可以是两个独立的处理器。在本申请的具体实施例中,电子装置800的处理器与深度图像获取设备300的处理器为同一个处理器。处理器805可以接收光检测器63输出的光检测电信号并根据光检测电信号来调整光源10的驱动 电流。With reference to FIG. 6 again, the photodetector 63 is disposed on the circuit board 50 and is housed in the receiving cavity 62. The light transmittance of the diffuser 20 usually cannot reach 100%. Most of the laser light emitted by the light source 10 will be diffused out by the diffuser 20, but a small part of the laser light will be reflected by the diffuser 20. The light detector 63 can be used for receiving the laser light reflected by the diffuser 20. After receiving the laser light reflected from the diffuser 20, the photodetector 63 forms a photodetection electrical signal output. The depth image acquisition device 300 further includes a processor 805. The electronic device 800 also includes a processor. The processor of the electronic device 800 and the processor 805 of the depth image acquisition device 300 may be the same processor, or may be two independent processors. In a specific embodiment of the present application, the processor of the electronic device 800 and the processor of the depth image acquisition device 300 are the same processor. The processor 805 may receive the light detection electric signal output by the light detector 63 and adjust the driving current of the light source 10 according to the light detection electric signal.
具体地,扩散器20还包括破裂检测组件,破裂检测组件用于输出破裂检测电信号,破裂检测电信号用于反映扩散器20是否破裂。处理器805接收到光检测电信号后,首先比较光检测电信号与预设光检测值的大小,若光检测电信号小于预设光检测值,说明光检测器63接收到的激光较少,出现这个现象的原因可能是扩散器20破裂导致出射的激光增多,反射回光检测器63的激光减少,也可能是光源10的电光转换效率降低导致光源10发出的激光总量减少,进一步导致反射到光检测器63的激光减少。则在处理器805检测到光检测电信号小于预设光检测值时,处理器805控制破裂检测组件输出破裂检测电信号。若破裂检测电信号未处于预设破裂检测范围内,则说明导致光检测器63接收的激光减少的原因是扩散器20出现破裂;若破裂检测电信号处于预设破裂检测范围内,则说明扩散器20未破裂,导致光检测器63接收的激光减少的原因是光源10的光电转换效率变低。若光检测电信号大于或等于预设光检测值,说明扩散器20和光源10均正常工作,此时处理器805不做动作。Specifically, the diffuser 20 further includes a rupture detection component. The rupture detection component is configured to output a rupture detection electrical signal, and the rupture detection electrical signal is used to reflect whether the diffuser 20 is ruptured. After receiving the light detection electric signal, the processor 805 first compares the size of the light detection electric signal with the preset light detection value. If the light detection electric signal is smaller than the preset light detection value, it means that the laser light received by the light detector 63 is less. The reason for this phenomenon may be that the emitted laser light is increased due to the rupture of the diffuser 20, and the laser light reflected back to the photodetector 63 is reduced. It may also be that the reduction of the electro-optical conversion efficiency of the light source 10 causes the total amount of laser light emitted by the light source 10 to decrease, further causing reflection The laser light to the photodetector 63 is reduced. Then, when the processor 805 detects that the light detection electric signal is less than a preset light detection value, the processor 805 controls the rupture detection component to output a rupture detection electric signal. If the rupture detection electrical signal is not within the preset rupture detection range, the reason for the decrease in the laser light received by the photodetector 63 is the rupture of the diffuser 20; if the rupture detection electrical signal is within the preset rupture detection range, the diffusion is indicated The detector 20 is not broken, and the reason why the laser light received by the photodetector 63 is reduced is that the photoelectric conversion efficiency of the light source 10 becomes low. If the light detection electric signal is greater than or equal to the preset light detection value, it indicates that both the diffuser 20 and the light source 10 work normally, and the processor 805 does not perform an action at this time.
进一步地,若处理器805检测到光检测器63接收的激光减少的原因是扩散器20出现破裂,则此时处理器805应该调低光源10的驱动电流,或者直接关闭光源10,避免出射的激光能量过高,对用户的人眼造成伤害;若处理器805检测到光检测器63接收的激光减少的原因是光源10的光电转换效率变低,则此时处理器805应适当地调高光源10的驱动电流,以满足当前的目标空间对光源10的发光功率的需求,保障深度信息的获取精度。Further, if the processor 805 detects that the decrease in the laser light received by the photodetector 63 is due to the rupture of the diffuser 20, then the processor 805 should reduce the driving current of the light source 10 or directly turn off the light source 10 to avoid emission. The laser energy is too high, causing damage to the user's eyes. If the processor 805 detects that the decrease in the laser light received by the photodetector 63 is due to the low photoelectric conversion efficiency of the light source 10, the processor 805 should be appropriately adjusted higher at this time. The driving current of the light source 10 meets the current target space's demand for the light emitting power of the light source 10 and ensures the accuracy of obtaining the depth information.
综上,本申请实施方式的激光投射模组100、深度图像获取设备300和电子装置800通过在激光投射模组100上设置光检测器63,并基于光检测器63输出的光检测电信号来调节光源10的驱动电流。如此,通过光源10的驱动电流的自主调节来保证光源10具有足够的发光功率,有利于提升深度信息的获取精度。In summary, the laser projection module 100, the depth image acquisition device 300, and the electronic device 800 according to the embodiments of the present application are provided with a light detector 63 on the laser projection module 100, and based on the light detection electric signal output by the light detector 63, The driving current of the light source 10 is adjusted. In this way, by autonomously adjusting the driving current of the light source 10 to ensure that the light source 10 has sufficient luminous power, it is beneficial to improve the accuracy of acquiring depth information.
请参阅图7,在某些实施方式中,光检测器63的数量为多个,多个光检测器63环绕光源10呈中心对称设置。如此,多个光检测器63可以接收到扩散器20反射回的更多的激光。处理器805接收到多个光检测电信号后,先对多个光检测电信号求和取平均得到多个光检测电信号的平均值,再将光检测电信号的平均值与预设光检测值作比较,若光检测电信号的平均值小于预设光检测值,则进一步控制破裂检测组件做扩散器20的破裂检测;若光检测电信号的平均值大于或等于预设光检测值,则处理器805不做动作。采用多个设置在不同位置处的光检测器63来接收扩散器20反射回激光可以更加准确地检测经扩散器20反射回的激光的量的大小,进一步地可以更加准确地检测出光源10的实际发光功率,有利于处理器805对驱动电流的准确调节。Please refer to FIG. 7. In some embodiments, the number of the light detectors 63 is multiple, and the plurality of light detectors 63 are arranged symmetrically around the light source 10 in the center. In this way, the multiple photodetectors 63 can receive more laser light reflected by the diffuser 20. After the processor 805 receives a plurality of light detection electric signals, it first sums and averages the plurality of light detection electric signals to obtain an average value of the plurality of light detection electric signals, and then compares the average value of the light detection electric signals with a preset light detection. Value comparison, if the average value of the light detection electrical signal is less than the preset light detection value, further control the rupture detection component to perform the break detection of the diffuser 20; if the average value of the light detection electrical signal is greater than or equal to the preset light detection value, Then the processor 805 does nothing. The use of multiple photodetectors 63 arranged at different positions to receive the laser light reflected by the diffuser 20 can more accurately detect the amount of laser light reflected by the diffuser 20, and furthermore, the light source 10 can be more accurately detected. The actual luminous power is helpful for the processor 805 to accurately adjust the driving current.
在某些实施方式中,预设光检测值的取值由未调节前的驱动电流来决定。具体地,不同的驱动电流对应不同的预设光检测值,每一次光检测器63输出的光检测电信号应该与当下还未调节的驱动电流对应的预设光检测值来作比较。例如,若当前的驱动电流为A1,则预设光检测值应为B1,光检测电信号与B1作比较;若当前的驱动电流为A2(A2>A1),则预设光检测值应为B2(B2>B1),光检测电信号与B2作比较。可以理解的是,在不同的场景下光源10的驱动电流可能是不一样的。若驱动电流较大,则光源10发射的激光较多,反射回光检测器63的激光也较多;若驱动电流较小,则光源10发射的激光较少,反射回光检测器63的激光也较少。因此,光检测器63输出的光检测电信号应与当前场景下使用的驱动电流对应的预设光检测值作比较,才能更为准确地检测出光源10的实际发光功率是大于或者小于理论上应该发射的功率,进一步地对驱动电流做调节,使得实际发光功率满足理论上应该发射的功率的需求。In some embodiments, the value of the preset light detection value is determined by the driving current before being adjusted. Specifically, different driving currents correspond to different preset photodetection values. Each time the photodetection electrical signal output by the photodetector 63 should be compared with a preset photodetection value corresponding to a driving current that has not yet been adjusted. For example, if the current drive current is A1, the preset photodetection value should be B1, and the photodetection electrical signal is compared with B1; if the current drive current is A2 (A2> A1), the preset photodetection value should be B2 (B2> B1). The photodetection electrical signal is compared with B2. It can be understood that the driving current of the light source 10 may be different in different scenarios. If the driving current is large, more laser light is emitted from the light source 10, and more laser light is reflected back to the photodetector 63. If the driving current is small, less laser light is emitted from the light source 10, and laser light is reflected back to the photodetector 63. And less. Therefore, the photo-detection electric signal output by the photo-detector 63 should be compared with a preset photo-detection value corresponding to the driving current used in the current scene, in order to more accurately detect whether the actual luminous power of the light source 10 is greater than or less than the theoretical value. The power that should be transmitted further adjusts the driving current, so that the actual luminous power meets the demand for the power that should be transmitted in theory.
请再结合图6,扩散器20包括靠近光源10的入射面201及与入射面201相背的出射面202。扩散器20为一个光学元件,用于将光源10发射的激光扩散成多束光束出射,使得最终出射到目标空间中的激光为光强分布基本均匀的面光。扩散器20上设置有破裂检测元件。破裂检测元件可以输出破裂检测电信号。处理器805可以接收破裂检测元件输出的破裂检测电信号,并基于破裂检测电信号来判断扩散器20是否破裂。With reference to FIG. 6 again, the diffuser 20 includes an incident surface 201 near the light source 10 and an exit surface 202 opposite to the incident surface 201. The diffuser 20 is an optical element for diffusing the laser light emitted from the light source 10 into a plurality of light beams for emission, so that the laser light finally emitted into the target space is surface light with a substantially uniform light intensity distribution. The diffuser 20 is provided with a rupture detection element. The rupture detection element can output a rupture detection electrical signal. The processor 805 may receive a fracture detection electric signal output by the fracture detection element, and determine whether the diffuser 20 is fractured based on the fracture detection electric signal.
具体地,请一并参阅图6和图8,破裂检测元件可以是透光导电膜21。透光导电膜21上设置有导电电极210。导电电极210包括输入端211和输出端212。输入端211、输出端212均和处理器805连接,输入端211、处理器805、以及输出端212形成一条导电回路。透光导电膜21可以通过电镀等方式形成在扩散器20的表面,透光导电膜21的材质可以是氧化铟锡(Indium tin oxide,ITO)、纳米银丝、金属 银线中的任意一种。氧化铟锡、纳米银丝、金属银线均具有良好的透光率及导电性能,可实现通电后的破裂检测电信号输出,同时不会对扩散器20的出光光路产生遮挡。当扩散器20上形成有透光导电膜21时,若扩散器20处于完好状态,则透光导电膜21的电阻较小,在此状态下给透光导电膜21上的导电电极210通电,即施加一定大小的电压,此时处理器805获取到的导电电极210输出的电流较大;若扩散器20破裂,形成在扩散器20上的透光导电膜21也会碎裂,此时碎裂位置处的透光导电膜21的电阻阻值接近无穷大,在此状态下给透光导电膜21上的导电电极210通电,处理器805获取到的导电电极输出的电流较小。因此,处理器805可以根据当前的破裂检测电信号(即电流)与预设破裂检测范围相比较,其中预设破裂检测范围是在扩散器20未破裂状态下检测到的电流的取值范围,该电流的取值范围由施加在导电电极210上的电压及导电电极210自身的电阻二者共同决定。若破裂检测电信号处于预设破裂检测范围内,则说明透光导电膜21未破裂,进而判断扩散器20未破裂,若破裂检测电信号不处于预设破裂检测范围内,则说明透光导电膜21破裂,进而判断扩散器20破裂。在扩散器20破裂时,处理器805可以调小光源10的驱动电流或者直接关闭光源10。Specifically, referring to FIG. 6 and FIG. 8 together, the crack detection element may be a light-transmitting conductive film 21. A conductive electrode 210 is provided on the light-transmitting conductive film 21. The conductive electrode 210 includes an input terminal 211 and an output terminal 212. The input terminal 211 and the output terminal 212 are all connected to the processor 805, and the input terminal 211, the processor 805, and the output terminal 212 form a conductive loop. The light-transmitting conductive film 21 can be formed on the surface of the diffuser 20 by electroplating. The material of the light-transmitting conductive film 21 can be any one of indium tin oxide (ITO), nano-silver wire, and metal silver wire. . Indium tin oxide, nano-silver wire, and metallic silver wire all have good light transmittance and electrical conductivity, and can realize the output of the electrical signal for crack detection after being energized without blocking the light path of the diffuser 20. When the light-transmitting conductive film 21 is formed on the diffuser 20, if the diffuser 20 is in an intact state, the resistance of the light-transmitting conductive film 21 is small. In this state, the conductive electrode 210 on the light-transmitting conductive film 21 is energized. That is, when a certain amount of voltage is applied, the current output by the conductive electrode 210 obtained by the processor 805 is relatively large; if the diffuser 20 is broken, the light-transmitting conductive film 21 formed on the diffuser 20 will also be broken. The resistance value of the light-transmitting conductive film 21 at the crack position is close to infinity. In this state, the conductive electrode 210 on the light-transmitting conductive film 21 is energized, and the current output by the conductive electrode obtained by the processor 805 is small. Therefore, the processor 805 may compare the preset rupture detection range with the current rupture detection electrical signal (ie, current), where the preset rupture detection range is a value range of the current detected when the diffuser 20 is not ruptured. The value range of the current is determined by both the voltage applied to the conductive electrode 210 and the resistance of the conductive electrode 210 itself. If the rupture detection electrical signal is within the preset rupture detection range, it means that the transparent conductive film 21 is not ruptured, and it is judged that the diffuser 20 is not ruptured. If the rupture detection electrical signal is not within the preset rupture detection range, it means that the light transmission is conductive The film 21 is broken, and it is further judged that the diffuser 20 is broken. When the diffuser 20 is broken, the processor 805 can reduce the driving current of the light source 10 or directly turn off the light source 10.
请再结合图6,在一个实施例中,透光导电膜21可以为单层,单层的透光导电膜21可以设置在扩散器20的入射面201上(如图6所示),或者单层的透光导电膜21也可以设置在扩散器20的出射面202上(图未示)。Please refer to FIG. 6 again. In one embodiment, the light-transmitting conductive film 21 may be a single layer, and the single-layer light-transmitting conductive film 21 may be disposed on the incident surface 201 of the diffuser 20 (as shown in FIG. 6), or A single-layer light-transmitting conductive film 21 may also be disposed on the emission surface 202 (not shown) of the diffuser 20.
具体地,请一并参阅图6、及图8至图11,透光导电膜21上设置的导电电极210可以为一条。单条导电电极210的输入端211和输出端212与处理器805连接并形成一条导电回路。其中,单条导电电极210的排布方式有多种:例如,输入端211和输出端212的连线方向(即导电电极210的延伸方向)为透光导电膜21的长度方向(如图8所示;若透光导电膜21为圆形,则此处的长度方向为透光导电膜21的第一径向,透光导电膜21的“长度方向”解释下同);或者,输入端211和输出端212的连线方向为透光导电膜21的宽度方向(如图9所示;若透光导电膜21为圆形,则此处的宽度方向为垂直于透光导电膜21的第一径向的第二径向,透光导电膜21的“宽度方向”解释下同);或者,输入端211和输出端212的连线方向为透光导电膜21的对角线方向(如图10和图11所示)。无论导电电极210的排布方式是上述的哪种方式,导电电极210都能跨越整个透光导电膜21,可以较为准确地检测透光导电膜21是否破裂,进一步地可以较为准确地判断扩散器20是否破裂。Specifically, referring to FIG. 6 and FIGS. 8 to 11 together, one conductive electrode 210 provided on the transparent conductive film 21 may be provided. The input terminal 211 and the output terminal 212 of the single conductive electrode 210 are connected to the processor 805 and form a conductive loop. Among them, there are various ways of arranging a single conductive electrode 210: for example, the connection direction of the input terminal 211 and the output terminal 212 (that is, the extending direction of the conductive electrode 210) is the length direction of the transparent conductive film 21 (as shown in FIG. 8). If the light-transmitting conductive film 21 is circular, the length direction here is the first radial direction of the light-transmitting conductive film 21, and the "length direction" of the light-transmitting conductive film 21 is interpreted the same below); or, the input terminal 211 The direction of the connection with the output terminal 212 is the width direction of the light-transmitting conductive film 21 (as shown in FIG. 9; if the light-transmitting conductive film 21 is circular, the width direction here is the first direction perpendicular to the light-transmitting conductive film 21. A radial second radial direction, the "width direction" of the light-transmitting conductive film 21 is the same; or, the direction of the connection between the input end 211 and the output end 212 is the diagonal direction of the light-transmitting conductive film 21 (such as Figures 10 and 11). Regardless of the above-mentioned arrangement of the conductive electrodes 210, the conductive electrodes 210 can span the entire light-transmitting conductive film 21, which can more accurately detect whether the light-transmitting conductive film 21 is broken, and further can accurately judge the diffuser. 20 Whether it is cracked.
或者,请一并参阅图6、图12至图15,透光导电膜21上设置的导电电极210也可以为多条。多条导电电极210互不相交且相互绝缘。每条导电电极210均包括一个输入端211和一个输出端212。每个输入端211和每个输出端212与处理器805连接以形成一条导电回路,由此,多条导电电极210的输入端211及输出端212分别与处理器805连接以形成多条导电回路。其中,多条导电电极210的排布方式有多种:例如,每个输入端211和每个输出端212的连线方向(即每条导电电极210的延伸方向)为透光导电膜21的长度方向,多条导电电极210沿透光导电膜21的长度方向平行间隔设置(如图12所示);或者,每个输入端211和每个输出端212的连线方向为透光导电膜21的宽度方向,多条导电电极210沿透光导电膜21的宽度方向平行间隔设置(如图13所示);或者,每个输入端211和每个输出端212的连线方向为透光导电膜21的对角线方向,多条导电电极210沿透光导电膜21的对角线方向平行间隔设置(如图14和图15所示)。无论导电电极210的排布方式是上述的哪种方式,相较于设置单条导电电极210而言,多条导电电极210能够使得整层透光导电膜21占据扩散器20较多的面积,相对应地可以输出更多的破裂检测电信号。由于仅设置单条导电电极210时,有可能存在扩散器20破裂的位置与单条导电电极210的位置相隔甚远,而对单条导电电极210的影响不大,该单条导电电极210输出的破裂检测电信号仍旧处于预设破裂检测范围内,检测准确度不高。而本实施方式中,多条导电电极210占据透光导电膜21较多的面积,相对应地可以输出更多的破裂检测电信号,处理器805可根据较多的破裂检测电信号更为精确地判断透光导电膜21是否破裂,进一步地判断扩散器20是否破裂,提升扩散器20破裂检测的准确性。Alternatively, please refer to FIG. 6 and FIG. 12 to FIG. 15 together. There may be multiple conductive electrodes 210 provided on the light-transmitting conductive film 21. The plurality of conductive electrodes 210 are disjoint from each other and are insulated from each other. Each conductive electrode 210 includes an input terminal 211 and an output terminal 212. Each input terminal 211 and each output terminal 212 are connected to the processor 805 to form a conductive loop. Thus, the input terminals 211 and output terminals 212 of the plurality of conductive electrodes 210 are respectively connected to the processor 805 to form a plurality of conductive loops. . Among them, there are various arrangements of the plurality of conductive electrodes 210: for example, the connection direction of each input terminal 211 and each output terminal 212 (that is, the extending direction of each conductive electrode 210) is the same as that of the transparent conductive film 21. In the length direction, a plurality of conductive electrodes 210 are arranged in parallel at intervals along the length direction of the light-transmitting conductive film 21 (as shown in FIG. 12); or, the direction of the line connecting each input terminal 211 and each output terminal 212 is a light-transmitting conductive film. In the width direction of 21, a plurality of conductive electrodes 210 are arranged at parallel intervals along the width direction of the light-transmitting conductive film 21 (as shown in FIG. 13); or, the direction of the line connecting each input terminal 211 and each output terminal 212 is transparent. In the diagonal direction of the conductive film 21, a plurality of conductive electrodes 210 are arranged at parallel intervals along the diagonal direction of the light-transmitting conductive film 21 (as shown in FIGS. 14 and 15). Regardless of the arrangement of the conductive electrodes 210, the multiple conductive electrodes 210 can make the entire layer of the light-transmitting conductive film 21 occupy a larger area of the diffuser 20 compared to the single conductive electrode 210. Correspondingly more rupture detection electric signals can be output. When only a single conductive electrode 210 is provided, there may be a location where the diffuser 20 ruptures is far from the position of the single conductive electrode 210, and the influence on the single conductive electrode 210 is not large. The signal is still within the preset rupture detection range, and the detection accuracy is not high. In this embodiment, the plurality of conductive electrodes 210 occupy more area of the light-transmitting conductive film 21, and correspondingly can output more electrical signals for crack detection. The processor 805 can be more accurate based on more electrical signals for crack detection. Judging whether the light-transmitting conductive film 21 is broken, and further determining whether the diffuser 20 is broken, improves the accuracy of the diffuser 20 crack detection.
如图16和图17所示,在一个实施例中,透光导电膜21为单层的架桥结构。单层架桥结构的透光导电膜21可以设置在扩散器20的入射面201或者出射面202上。具体地,透光导电膜21包括多条导电电极210。多条导电电极210包括多条平行设置且相互绝缘的第一导电电极213、多条平行设置且相互绝缘的第二导电电极214、及多条架桥导电电极215。多条第一导电电极213与多条第二导电电极214纵横交错。每条第一导电电极213连续不间断,每条第二导电电极214在与对应的多条第一导电电极213 的交错处断开并与多条第一导电电极213不导通。每条架桥导电电极215将对应的第二导电电极214的断开处导通。架桥导电电极215与第一导电电极213的交错位置设有绝缘体216,其中,绝缘体216可采用丝印或黄光制程等方式进行制作。每条第一导电电极213的两端与处理器805连接以形成一条导电回路,每条第二导电电极214的两端与处理器805连接以形成一条导电回路,由此,多条第一导电电极213的两端与处理器805均分别连接以形成多条导电回路,多条第二导电电极214的两端与处理器805均分别连接以形成多条导电回路。多条第一导电电极213与多条第二导电电极214纵横交错指的是多条第一导电电极213与多条第二导电电极214相互垂直交错,即多条第一导电电极213与多条第二导电电极214的夹角为90度。当然,在其他实施方式中,多条第一导电电极213与多条第二导电电极214纵横交错还可以是多条第一导电电极213与多条第二导电电极214相互倾斜交错。使用时,处理器805可以同时对多条第一导电电极213和多条第二导电电极214通电以得到多个破裂检测电信号;或者,处理器805可依次对多条第一导电电极213和多条第二导电电极214通电以得到多个破裂检测电信号。随后,处理器805再根据破裂检测电信号来判断透光导电膜21是否破裂,进一步地判断扩散器20是否破裂。请结合17,例如,当检测到编号为①的第一导电电极213输出的破裂检测电信号不在预设破裂检测范围内,编号为③的第二导电电极214输出的破裂检测电信号也不在预设破裂检测范围内时,说明透光导电膜21在编号为①的第一导电电极213与编号为③的第二导电电极214的交错处A破裂,则扩散器20与透光导电膜21的破裂位置对应的位置也破裂。如此,通过单层架桥结构的透光导电膜21可以更为精确地检测扩散器20是否破裂以及扩散器20破裂的具体位置。As shown in FIGS. 16 and 17, in one embodiment, the light-transmitting conductive film 21 is a single-layer bridge structure. The light-transmitting conductive film 21 with a single-layer bridge structure may be disposed on the incident surface 201 or the exit surface 202 of the diffuser 20. Specifically, the light-transmitting conductive film 21 includes a plurality of conductive electrodes 210. The plurality of conductive electrodes 210 include a plurality of first conductive electrodes 213 disposed in parallel and insulated from each other, a plurality of second conductive electrodes 214 disposed in parallel and insulated from each other, and a plurality of bridge conductive electrodes 215. The plurality of first conductive electrodes 213 and the plurality of second conductive electrodes 214 are criss-crossed. Each of the first conductive electrodes 213 is continuous and uninterrupted, and each of the second conductive electrodes 214 is disconnected at the intersection with the corresponding plurality of first conductive electrodes 213 and is not conductive with the plurality of first conductive electrodes 213. Each bridge conductive electrode 215 conducts a break of the corresponding second conductive electrode 214. An insulator 216 is provided at the staggered position of the bridge conductive electrode 215 and the first conductive electrode 213. The insulator 216 can be produced by a silk screen or a yellow light process. The two ends of each first conductive electrode 213 are connected to the processor 805 to form a conductive loop, and the two ends of each second conductive electrode 214 are connected to the processor 805 to form a conductive loop. Thus, a plurality of first conductive electrodes The two ends of the electrode 213 are respectively connected to the processor 805 to form a plurality of conductive loops, and the two ends of the plurality of second conductive electrodes 214 are respectively connected to the processor 805 to form a plurality of conductive loops. The plurality of first conductive electrodes 213 and the plurality of second conductive electrodes 214 mean that the plurality of first conductive electrodes 213 and the plurality of second conductive electrodes 214 are vertically staggered with each other, that is, the plurality of first conductive electrodes 213 and the plurality of The included angle of the second conductive electrode 214 is 90 degrees. Of course, in other implementation manners, the plurality of first conductive electrodes 213 and the plurality of second conductive electrodes 214 may be criss-crossed, and the plurality of first conductive electrodes 213 and the plurality of second conductive electrodes 214 may be staggered with each other. When in use, the processor 805 can simultaneously energize the plurality of first conductive electrodes 213 and the plurality of second conductive electrodes 214 to obtain multiple crack detection electrical signals; or, the processor 805 can sequentially energize the plurality of first conductive electrodes 213 and The plurality of second conductive electrodes 214 are energized to obtain a plurality of crack detection electrical signals. Subsequently, the processor 805 judges whether the light-transmitting conductive film 21 is broken or not, and further determines whether the diffuser 20 is broken or not according to the break detection electric signal. Combining with 17, for example, when it is detected that the electrical signal of the rupture detection output by the first conductive electrode 213 with the number ① is not within the preset rupture detection range, the electrical signal of the rupture detection output by the second conductive electrode 214 with the number ③ is not within the preset range. When the crack detection range is set, it is explained that the transparent conductive film 21 is broken at the intersection A of the first conductive electrode 213 with the number ① and the second conductive electrode 214 with the number ③, and the diffuser 20 and the transparent conductive film 21 are broken. The position corresponding to the rupture position is also ruptured. In this way, through the single-layer bridging structure of the light-transmitting conductive film 21, it is possible to more accurately detect whether the diffuser 20 is broken and the specific position where the diffuser 20 is broken.
如图18和图19所示,在一个实施例中,透光导电膜21也可为多层结构。具体地,透光导电膜21包括第一透光导电膜217和第二透光导电膜218。第一透光导电膜217设置在扩散器20的入射面201上,第二透光导电膜218设置在扩散器20的出射面202上。第一透光导电膜217上设置有多条平行设置且相互绝缘的第一导电电极2171,第二透光导电膜218上设置有多条平行设置且相互绝缘的第二导电电极2181。多条第一导电电极2171在出射面202上的投影与多条第二导电电极2181纵横交错。每条第一导电电极2171的两端与处理器805连接以形成导电回路,每条第二导电电极2181的两端与处理器805连接以形成导电回路,由此,多条第一导电电极2171的两端与处理器805均分别连接以形成多条导电回路,多条第二导电电极2181的两端与处理器805均分别连接以形成多条导电回路。多条第一导电电极2171与多条第二导电电极2181纵横交错指的是多条第一导电电极2171与多条第二导电电极2181相互垂直交错,即多条第一导电电极2171与多条第二导电电极2181的夹角为90度。当然,在其他实施方式中,多条第一导电电极2171与多条第二导电电极2181纵横交错还可以是多条第一导电电极2171与多条第二导电电极2181相互倾斜交错。使用时,处理器805可以同时对多条第一导电电极2171和多条第二导电电极2181通电以得到多个破裂检测电信号;或者,处理器805可依次对多条第一导电电极2171和多条第二导电电极2181通电以得到多个破裂检测电信号。随后,处理器805再根据破裂检测电信号来判断透光导电膜21是否破裂,进一步地判断扩散器20是否破裂。具体地,若任意一条第一导电电极2171输出的破裂检测电信号未处于预设破裂检测范围内,则说明第一透光导电膜217破裂,进一步地认为扩散器20破裂;若任意一条第二导电电极2181输出的破裂检测电信号未处于预设破裂检测范围内,则说明第二透光导电膜218破裂,进一步地认为扩散器20破裂。若第一导电电极2171破裂且第二导电电极2181输出的破裂检测电信号均未处于预设破裂检测范围内,例如,编号为①的第一导电电极2171与编号为③的第二导电电极2181输出的电信号均未处于预设破裂检测范围内,则说明编号为①的第一导电电极2171与编号为③的第二导电电极2181的交错位置处B破裂。如此,处理器805可以根据多条第一导电电极2171和多条第二导电电极2181输出的破裂检测电信号来精确地检测扩散器20是否破裂以及扩散器20破裂的具体位置。As shown in FIGS. 18 and 19, in one embodiment, the light-transmitting conductive film 21 may also have a multilayer structure. Specifically, the light-transmitting conductive film 21 includes a first light-transmitting conductive film 217 and a second light-transmitting conductive film 218. The first light-transmitting conductive film 217 is disposed on the incident surface 201 of the diffuser 20, and the second light-transmitting conductive film 218 is disposed on the exit surface 202 of the diffuser 20. The first light-transmitting conductive film 217 is provided with a plurality of first conductive electrodes 2171 disposed in parallel and insulated from each other, and the second light-transmissive conductive film 218 is provided with a plurality of second conductive electrodes 2181 disposed in parallel and insulated from each other. The projections of the plurality of first conductive electrodes 2171 on the exit surface 202 and the plurality of second conductive electrodes 2181 are criss-crossed. The two ends of each first conductive electrode 2171 are connected to the processor 805 to form a conductive loop, and the two ends of each second conductive electrode 2181 are connected to the processor 805 to form a conductive loop. Thus, a plurality of first conductive electrodes 2171 The two ends of each are respectively connected to the processor 805 to form a plurality of conductive loops, and the two ends of the plurality of second conductive electrodes 2181 are respectively connected to the processor 805 to form a plurality of conductive loops. The plurality of first conductive electrodes 2171 and the plurality of second conductive electrodes 2181 are criss-crossed, which means that the plurality of first conductive electrodes 2171 and the plurality of second conductive electrodes 2181 are vertically staggered with each other, that is, the plurality of first conductive electrodes 2171 and the plurality of The included angle of the second conductive electrode 2181 is 90 degrees. Of course, in other embodiments, the plurality of first conductive electrodes 2171 and the plurality of second conductive electrodes 2181 may be criss-crossed, and the plurality of first conductive electrodes 2171 and the plurality of second conductive electrodes 2181 may be staggered with each other. In use, the processor 805 can simultaneously power on the plurality of first conductive electrodes 2171 and the plurality of second conductive electrodes 2181 to obtain multiple crack detection electrical signals; or, the processor 805 can sequentially turn on the plurality of first conductive electrodes 2171 and The plurality of second conductive electrodes 2181 are energized to obtain a plurality of crack detection electrical signals. Subsequently, the processor 805 judges whether the light-transmitting conductive film 21 is broken or not, and further determines whether the diffuser 20 is broken or not according to the break detection electric signal. Specifically, if the rupture detection electric signal output by any one of the first conductive electrodes 2171 is not within the preset rupture detection range, it indicates that the first transparent conductive film 217 is ruptured, and the diffuser 20 is further considered to be ruptured; The fracture detection electric signal output by the conductive electrode 2181 is not within the preset fracture detection range, it indicates that the second light-transmitting conductive film 218 is fractured, and the diffuser 20 is further considered to be fractured. If the first conductive electrode 2171 is ruptured and the rupture detection electrical signal output by the second conductive electrode 2181 is not within the preset rupture detection range, for example, the first conductive electrode 2171 with the number ① and the second conductive electrode 2181 with the number ③ If none of the output electrical signals are within the preset fracture detection range, it means that the staggered position of the first conductive electrode 2171 with the number ① and the second conductive electrode 2181 with the number ③ is broken. In this way, the processor 805 can accurately detect whether the diffuser 20 is broken and the specific position of the diffuser 20 according to the burst detection electrical signals output by the plurality of first conductive electrodes 2171 and the plurality of second conductive electrodes 2181.
请参阅图20,在某些实施方式中,破裂检测元件也可以是掺杂在扩散器20中的导电粒子220。导电粒子220可以形成导电通路22。当扩散器20处于完好状态时,相邻的导电粒子220之间是接合的,此时整个导电通路22的电阻较小,在此状态下给导电通路22通电,即施加一定大小的电压,则此时处理器805获取到的导电通路22输出的电流较大。而当扩散器20破裂时,掺杂在扩散器20中的导电粒子220之间的接合点断开,此时整个导电通路22的电阻阻值接近无穷大,在此状态下给导电通路22通电,处理器805获取到的导电通路22输出的电流较小。因此,处理器805可以根据当前的破裂检测电信号(即电流)与预设破裂检测范围相比较,其中预设破裂检测范围是在扩散器20未破裂状态下检测 到的电流的取值范围,该电流的取值范围由施加在导电通路22上的电压及导电通路22自身的电阻二者共同决定。若破裂检测电信号处于预设破裂检测范围内,则说明导电通路22未断开,进而判断扩散器20未破裂,若破裂检测电信号不处于预设破裂检测范围内,则说明导电通路22断开,进而判断扩散器20破裂。在扩散器20破裂时,处理器805可以调小光源10的驱动电流或者直接关闭光源10。Referring to FIG. 20, in some embodiments, the rupture detection element may be conductive particles 220 doped in the diffuser 20. The conductive particles 220 may form a conductive path 22. When the diffuser 20 is in an intact state, the adjacent conductive particles 220 are bonded. At this time, the resistance of the entire conductive path 22 is small. In this state, the conductive path 22 is energized, that is, a certain amount of voltage is applied. At this time, the current output by the conductive path 22 obtained by the processor 805 is relatively large. When the diffuser 20 is broken, the junction between the conductive particles 220 doped in the diffuser 20 is disconnected. At this time, the resistance value of the entire conductive path 22 is close to infinity. In this state, the conductive path 22 is energized. The current output by the conductive path 22 obtained by the processor 805 is small. Therefore, the processor 805 may compare the preset rupture detection range with the current rupture detection electrical signal (ie, current), where the preset rupture detection range is a value range of the current detected when the diffuser 20 is not ruptured. The value range of the current is determined by both the voltage applied to the conductive path 22 and the resistance of the conductive path 22 itself. If the rupture detection electrical signal is within the preset rupture detection range, the conductive path 22 is not disconnected, and it is determined that the diffuser 20 is not ruptured. If the rupture detection electrical signal is not within the preset rupture detection range, the conductive path 22 is disconnected. On, it is judged that the diffuser 20 is broken. When the diffuser 20 is broken, the processor 805 can reduce the driving current of the light source 10 or directly turn off the light source 10.
具体地,如图20至图24所示,在一个实施例中,扩散器20中掺杂了多个导电粒子220,多个导电粒子220形成一条导电通路22。导电通路22包括输入端221和输出端222。输入端221和输出端222与处理器805连接。输入端221、处理器805、输出端222形成一条导电回路。其中,导电通路22的排布方式有多种:例如,导电通路22的延伸方向为扩散器20的长度方向(如图21所示;若扩散器20为圆形,则此处的长度方向为扩散器20的第一径向,扩散器20的“长度方向”解释下同);或者,导电通路22的延伸方向为扩散器20的宽度方向(如图22所示;若扩散器20为圆形,则此处的宽度方向为垂直于扩散器20的第一径向的第二径向,扩散器20的“宽度方向”解释下同);或者,导电通路22的延伸方向为扩散器20的对角线方向(如图23和图24所示)。无论导电通路22的排布方式是上述的哪种方式,导电通路22都能跨越整个扩散器20,可以较为准确地检测扩散器20是否破裂。Specifically, as shown in FIGS. 20 to 24, in one embodiment, the diffuser 20 is doped with a plurality of conductive particles 220, and the plurality of conductive particles 220 form a conductive path 22. The conductive path 22 includes an input terminal 221 and an output terminal 222. The input terminal 221 and the output terminal 222 are connected to the processor 805. The input terminal 221, the processor 805, and the output terminal 222 form a conductive loop. There are various ways to arrange the conductive paths 22: for example, the extending direction of the conductive paths 22 is the length direction of the diffuser 20 (as shown in FIG. 21; if the diffuser 20 is circular, the length direction here is The first radial direction of the diffuser 20 is the same as the "length direction" of the diffuser 20; or, the extending direction of the conductive path 22 is the width direction of the diffuser 20 (as shown in FIG. 22; if the diffuser 20 is circular Shape, then the width direction here is perpendicular to the first radial direction of the diffuser 20 and the second radial direction, and the “width direction” of the diffuser 20 is the same below); or, the extending direction of the conductive path 22 is the diffuser 20 Diagonal direction (as shown in Figures 23 and 24). Regardless of the above-mentioned arrangement of the conductive paths 22, the conductive paths 22 can span the entire diffuser 20, and it can be more accurately detected whether the diffuser 20 is broken.
如图25至图29所示,在一个实施例中,扩散器20掺杂了多个导电粒子220,多个导电粒子220形成多条导电通路22。多条导电通路22互不相交且相互绝缘。每条导电通路22包括输入端221和输出端222。每个输入端221和每个输出端222与处理器805连接以形成一条导电回路,由此,多条导电通路22的输入端221及输出端222分别与处理器805连接以形成多条导电回路。其中,多条导电通路22的排布方式有多种:例如,每条导电通路22的延伸方向为扩散器20的长度方向(如图26所示),多条导电通路22沿扩散器20的长度方向平行间隔设置,由于扩散器20具有一定的厚度,因此,在多条导电通路22在沿扩散器20的长度方向平行间隔设置后,还可以沿扩散器20的厚度方向呈层叠间隔设置(如图25所示);或者,每条导电通路22的延伸方向为扩散器20的宽度方向(如图27所示),多条导电通路22沿扩散器20的宽度方向平行间隔设置,由于扩散器20具有一定的厚度,因此,在多条导电通路22沿扩散器20的宽度方向平行间隔设置后,还可以沿扩散器20的厚度方向呈层叠间隔设置(图未示);或者,每条导电通路22的延伸方向为扩散器20的入射面201(图6所示)的对角线方向(如图28和29所示),由于扩散器20具有一定的厚度,因此,多条导电通路22在沿扩散器20的入射面201的对角线方向平行间隔设置后,还可以沿扩散器20的厚度方向呈层叠间隔设置(图未示);或者,每条导电通路22的延伸方向为扩散器20的入射面201与出射面202(图6所示)的对角线方向(图未示),多条导电通路22沿扩散器20的入射面201与出射面202的对角线方向平行间隔设置;或者,每条导电通路22的延伸方向为扩散器20的厚度方向平行间隔设置(图未示),由于扩散器20具有一定的宽度,因此,在多条导电通路沿扩散器20的厚度方向平行间隔设置后,还可以沿扩散器20的宽度方向呈层叠间隔设置(图未示)。无论导电通路22的排布方式是上述的哪种方式,相较于设置单条导电通路22而言,多条导电通路22可以占据扩散器20较多的体积,相应地可以输出更多的破裂检测电信号。由于仅设置单条导电通路22时,有可能存在扩散器20破裂的位置与单条导电通路22的位置相隔甚远,而对单条导电通路22的影响不大,该单条导电通路22输出的破裂检测电信号仍旧处于预设破裂检测范围内,检测准确度不高。而本实施方式中,多条导电通路22占据扩散器20较多的体积,并相对应地输出更多的破裂检测电信号,处理器805可根据较多的破裂检测电信号更为精确地判断扩散器20是否破裂,提升扩散器20破裂检测的准确性。As shown in FIGS. 25 to 29, in one embodiment, the diffuser 20 is doped with a plurality of conductive particles 220, and the plurality of conductive particles 220 form a plurality of conductive paths 22. The plurality of conductive paths 22 are disjoint from each other and are insulated from each other. Each conductive path 22 includes an input terminal 221 and an output terminal 222. Each input terminal 221 and each output terminal 222 are connected to the processor 805 to form a conductive circuit. Thus, the input terminals 221 and output terminals 222 of the plurality of conductive paths 22 are respectively connected to the processor 805 to form a plurality of conductive circuits. . Among them, there are various arrangements of the plurality of conductive paths 22: for example, the extension direction of each conductive path 22 is the length direction of the diffuser 20 (as shown in FIG. 26), and the plurality of conductive paths 22 are arranged along the diffuser 20 The longitudinal direction is arranged at parallel intervals. Since the diffuser 20 has a certain thickness, after the plurality of conductive paths 22 are arranged at parallel intervals along the longitudinal direction of the diffuser 20, it can also be arranged at stacked intervals along the thickness direction of the diffuser 20 ( (As shown in FIG. 25); or, the extending direction of each conductive path 22 is the width direction of the diffuser 20 (as shown in FIG. 27), and a plurality of conductive paths 22 are arranged at parallel intervals along the width direction of the diffuser 20, due to the diffusion The diffuser 20 has a certain thickness. Therefore, after a plurality of conductive paths 22 are arranged in parallel and spaced apart along the width direction of the diffuser 20, they can also be arranged in a stacked interval along the thickness direction of the diffuser 20 (not shown); or The extending direction of the conductive path 22 is the diagonal direction of the incident surface 201 (shown in FIG. 6) of the diffuser 20 (as shown in FIGS. 28 and 29). Since the diffuser 20 has a certain thickness, a plurality of conductive paths 22 at the diffuser 20 After the diagonal directions of the incident surface 201 are arranged at parallel intervals, they can also be arranged in a stacking interval along the thickness direction of the diffuser 20 (not shown); or, the extension direction of each conductive path 22 is the incident surface of the diffuser 20 201 and a diagonal direction (not shown) of the exit surface 202 (shown in FIG. 6), and a plurality of conductive paths 22 are disposed at parallel intervals along the diagonal direction of the incident surface 201 and the exit surface 202 of the diffuser 20; or, The extension direction of each conductive path 22 is arranged at parallel intervals in the thickness direction of the diffuser 20 (not shown). Since the diffuser 20 has a certain width, multiple conductive paths are arranged in parallel at intervals in the thickness direction of the diffuser 20 Later, it can also be arranged at a stacking interval along the width direction of the diffuser 20 (not shown). No matter which of the conductive paths 22 is arranged in the manner described above, compared with a single conductive path 22, a plurality of conductive paths 22 can occupy more volume of the diffuser 20, and accordingly can output more rupture detection. electric signal. When only a single conductive path 22 is provided, there may be a location where the diffuser 20 ruptures is far from the position of the single conductive path 22, and the influence on the single conductive path 22 is not large. The rupture detection voltage output by the single conductive path 22 The signal is still within the preset rupture detection range, and the detection accuracy is not high. In this embodiment, the multiple conductive paths 22 occupy more volume of the diffuser 20 and correspondingly output more electric signals for rupture detection. The processor 805 can more accurately judge based on the more electric signals for rupture detection. Whether the diffuser 20 is ruptured improves the accuracy of the diffuser 20 rupture detection.
如图30和图31所示,在一个实施例中,扩散器20掺杂了多个导电粒子220,多个导电粒子220形成多条导电通路22。多条导电通路22包括多条第一导电通路223和多条第二导电通路224。多条第一导电通路223平行间隔设置且相互绝缘,多条第二导电通路224平行间隔设置且相互绝缘。多条第一导电通路223和多条第二导电通路224在空间上纵横交错。每条第一导电通路223的两端与处理器805连接形成一条导电回路,每条第二导电通路224的两端与处理器805连接形成一条导电回路,由此,多条第一导电通路223的两端与均处理器805分别连接以形成多条导电回路,多条第二导电通路224的两端均与处理器805分别连接以形成多条导电回路。其中,多条第一导电通路223和多条第二导电通路224在空间上纵横交错指的是多条第一导电通路223与多条第二导电通路224在空间上相互垂直交错,即多条第一导电通路223与多条第二导电通路224的夹角为90度。此时,多条第一导电通路223的延伸方向可以为扩散器20的长度方向,且多条第二导电通路224的延伸方向为扩散器20的宽度方向;或者, 多条第一导电通路223的延伸方向为扩散器20的长度方向,且多条第二导电通路224的延伸方向为扩散器20的厚度方向;或者,多条第一导电通路223的延伸方向可以为扩散器20的宽度方向,且多条第二导电通路224的延伸方向为扩散器20的厚度方向。当然,在其他实施方式中,多条第一导电通路223与多条第二导电通路224在空间上纵横交错还可以是多条第一导电通路223与多条第二导电通路224相互倾斜交错。使用时,处理器805可以同时对多条第一导电通路223和多条第二导电通路224通电以得到多个破裂检测电信号;或者,处理器805可依次对多条第一导电通路223和多条第二导电通路224通电以得到多个破裂检测电信号。随后,处理器805再根据破裂检测电信号来判断扩散器20是否破裂。请结合图30,例如,当检测到编号为②的第一导电通路223输出的破裂检测电信号不处于预设破裂检测范围内,且编号为④的第二导电通路224输出的破裂检测电信号也不处于预设破裂检测范围内时,说明编号为②的第一导电通路223和编号为④的第二导电通路224的交错处C破裂,则扩散器20对应的位置也破裂。如此,通过多条第一导电通路223和多条第二导电通路224纵横交错排布的方式可以更为精确地检测扩散器20是否破裂以及扩散器20破裂的具体位置。As shown in FIGS. 30 and 31, in one embodiment, the diffuser 20 is doped with a plurality of conductive particles 220, and the plurality of conductive particles 220 form a plurality of conductive paths 22. The plurality of conductive paths 22 include a plurality of first conductive paths 223 and a plurality of second conductive paths 224. A plurality of first conductive paths 223 are arranged in parallel and spaced apart from each other, and a plurality of second conductive paths 224 are arranged in parallel and spaced apart from each other. The plurality of first conductive paths 223 and the plurality of second conductive paths 224 are criss-crossed in space. The two ends of each first conductive path 223 are connected to the processor 805 to form a conductive loop, and the two ends of each second conductive path 224 are connected to the processor 805 to form a conductive loop. Thus, a plurality of first conductive paths 223 The two ends of each are respectively connected to the processor 805 to form a plurality of conductive loops, and the two ends of the plurality of second conductive paths 224 are respectively connected to the processor 805 to form a plurality of conductive loops. Wherein, the plurality of first conductive paths 223 and the plurality of second conductive paths 224 are spatially criss-crossed, which means that the plurality of first conductive paths 223 and the plurality of second conductive paths 224 are vertically staggered with each other in space, that is, a plurality of An included angle between the first conductive path 223 and the plurality of second conductive paths 224 is 90 degrees. At this time, the extending direction of the plurality of first conductive paths 223 may be the length direction of the diffuser 20, and the extending direction of the plurality of second conductive paths 224 is the width direction of the diffuser 20; or, the plurality of first conductive paths 223 The direction of extension of the diffuser 20 is the length direction of the diffuser 20, and the direction of extension of the plurality of second conductive paths 224 is the thickness direction of the diffuser 20; or, the direction of extension of the plurality of first conductive paths 223 may be the width direction of the diffuser 20 The extending direction of the plurality of second conductive paths 224 is the thickness direction of the diffuser 20. Of course, in other embodiments, the plurality of first conductive paths 223 and the plurality of second conductive paths 224 are spatially criss-crossed. The plurality of first conductive paths 223 and the plurality of second conductive paths 224 may be staggered with each other. When in use, the processor 805 can simultaneously power on the plurality of first conductive paths 223 and the plurality of second conductive paths 224 to obtain multiple crack detection electrical signals; or, the processor 805 can sequentially apply power to the plurality of first conductive paths 223 and The plurality of second conductive paths 224 are energized to obtain a plurality of crack detection electrical signals. Subsequently, the processor 805 determines whether the diffuser 20 is ruptured based on the rupture detection electric signal. Please refer to FIG. 30. For example, when it is detected that the electrical signal for the rupture detection output by the first conductive path 223 with the number ② is not within the preset rupture detection range, and the electrical signal with the rupture detection output from the second conductive path 224 with the number ④ When neither is within the preset rupture detection range, it is explained that the intersection C of the first conductive path 223 with the number ② and the second conductive path 224 with the number ④ is broken, and the position corresponding to the diffuser 20 is also broken. In this way, by arranging the first conductive paths 223 and the second conductive paths 224 in a crisscross pattern, it is possible to more accurately detect whether the diffuser 20 is broken and the specific position of the diffuser 20 is broken.
请结合图32,由于扩散器20具有一定的宽度和厚度,因此,在多条第一导电通路223和多条第二导电通路224在空间上纵横交错形成一对相互交错的导电通路对225后,还可以在扩散器20的宽度方向或厚度方向上形成多对上述的导电通路对225。同样地,处理器805可以基于多个破裂检测电信号来判断扩散器20是否破裂及扩散器20破裂的具体位置。由于仅设置一对导电通路对225时,有可能存在扩散器20破裂的位置与单对的导电通路对225的位置相隔甚远,而对单对的导电通路对225影响不大,该单对导电通路对225中的多条第一导电通路223和多条第二导电通路224输出的破裂检测电信号均处于预设破裂检测范围内的情况,检测准确度不高。多对的导电通路对225可以占据扩散器20更多的体积,并可以输出更多的破裂检测电信号,处理器805可根据较多的破裂检测电信号更为精确地判断扩散器20是否破裂以及扩散器20破裂的具体位置,提升扩散器20破裂检测的准确性。Referring to FIG. 32, since the diffuser 20 has a certain width and thickness, a plurality of first conductive paths 223 and a plurality of second conductive paths 224 are spatially criss-crossed to form a pair of mutually-intersecting conductive path pairs 225. It is also possible to form a plurality of pairs of the aforementioned conductive path pairs 225 in the width direction or the thickness direction of the diffuser 20. Similarly, the processor 805 may determine whether the diffuser 20 is ruptured and a specific position of the diffuser 20 based on a plurality of rupture detection electrical signals. When only one pair of conductive path pairs 225 is provided, there may be a location where the diffuser 20 ruptures is far from the position of a single pair of conductive path pairs 225, and the effect of a single pair of conductive path pairs 225 is not significant. The single pair In the case where the plurality of first conductive paths 223 and the plurality of second conductive paths 224 in the conductive path pair 225 output rupture detection electrical signals within a preset rupture detection range, the detection accuracy is not high. Multiple pairs of conductive path pairs 225 can occupy more volume of the diffuser 20 and can output more electrical signals for rupture detection. The processor 805 can more accurately determine whether the diffuser 20 ruptures based on more electrical signals for rupture detection The specific position of the diffuser 20 rupture improves the accuracy of the diffuser 20 rupture detection.
如此,通过在扩散器中掺杂导电粒子220形成导电通路22,利用导电通路22输出的破裂检测电信号也可实现扩散器20的破裂检测。相比较与设置透光导电膜21作为检测元件,扩散器20中掺杂导电粒子220形成导电通路22作为检测元件的方式可以减小激光投射模组100的厚度,进一步地有利于减小深度图像获取设备300的厚度,有利于将深度图像获取设备300集成到对机身厚度要求较高的电子装置800,如手机中。In this way, the conductive path 22 is formed by doping the conductive particles 220 in the diffuser, and the break detection of the diffuser 20 can also be realized by using the electrical signal of the break detection output by the conductive path 22. Compared with the arrangement of the transmissive conductive film 21 as the detection element, the way in which the conductive particles 220 are doped in the diffuser 20 to form the conductive path 22 as the detection element can reduce the thickness of the laser projection module 100, which is further beneficial to reducing the depth image The thickness of the acquisition device 300 is beneficial for integrating the depth image acquisition device 300 into an electronic device 800, such as a mobile phone, which requires a high thickness of the fuselage.
请再一并参阅图2至图5,在某些实施方式中,垫块72与第一基板711结合的一侧开设有容纳腔723。深度图像获取设备300还包括设置在第一基板711上的电子元件77。电子元件77收容在容纳腔723内。电子元件77可以是电容、电感、晶体管、电阻等元件。电子元件77可以与铺设在第一基板711上的控制线路电连接,并用于或控制激光投射模组100或光接收器200工作。电子元件77收容在容纳腔723内,合理利用了垫块72内的空间,不需要增加第一基板711的宽度来设置电子元件77,有利于减小深度图像获取设备300的整体尺寸。容纳腔723的数量可以是一个或多个,容纳腔723可以是互相间隔的。在安装垫块72时,可以将容纳腔723与电子元件77的位置对准并将垫块72设置在第一基板711上。Please refer to FIG. 2 to FIG. 5 together. In some embodiments, the side where the cushion block 72 is combined with the first substrate 711 is provided with a receiving cavity 723. The depth image acquisition apparatus 300 further includes an electronic component 77 provided on the first substrate 711. The electronic component 77 is housed in the receiving cavity 723. The electronic component 77 may be an element such as a capacitor, an inductor, a transistor, or a resistor. The electronic component 77 may be electrically connected to a control line laid on the first substrate 711 and used for or controlling the operation of the laser projection module 100 or the light receiver 200. The electronic component 77 is housed in the receiving cavity 723, and the space in the pad 72 is used reasonably. It is not necessary to increase the width of the first substrate 711 to set the electronic component 77, which is beneficial to reducing the overall size of the depth image acquisition device 300. The number of the receiving cavities 723 may be one or more, and the receiving cavities 723 may be spaced apart from each other. When mounting the pad 72, the receiving cavity 723 and the electronic component 77 may be aligned and the pad 72 may be disposed on the first substrate 711.
请继续参阅图2至图5,在某些实施方式中,垫块72开设有与至少一个容纳腔723连接的避让通孔724,至少一个电子元件77伸入避让通孔724内。可以理解,需要将电子元件77收容在避让通孔内时,要求电子元件77的高度不高于容纳腔723的高度。而对于高度高于容纳腔723的电子元件,可以开设与容纳腔723对应的避让通孔724,电子元件77可以部分伸入避让通孔724内,以在不提高垫块72的高度的前提下布置电子元件77。Please continue to refer to FIG. 2 to FIG. 5. In some embodiments, the cushion block 72 is provided with an escape through hole 724 connected to at least one receiving cavity 723, and at least one electronic component 77 extends into the escape through hole 724. It can be understood that when the electronic component 77 needs to be accommodated in the avoiding through hole, the height of the electronic component 77 is required to be not higher than the height of the receiving cavity 723. For electronic components having a height higher than the receiving cavity 723, an avoiding through hole 724 corresponding to the receiving cavity 723 may be provided, and the electronic component 77 may partially extend into the avoiding through hole 724 so as not to increase the height of the cushion 72. Arranges the electronic component 77.
请还参阅图2至图5,在某些实施方式中,第一基板组件711还包括加强板713,加强板713结合在第一基板711的与垫块72相背的一侧。加强板713可以覆盖第一基板711的一个侧面,加强板713可以用于增加第一基板711的强度,避免第一基板711发生形变。另外,加强板713可以由导电的材料制成,例如金属或合金等,当深度图像获取设备300安装在电子设备800上时,可以将加强板713与壳体801电连接,以使加强板713接地,并有效地减少外部元件的静电对深度图像获取设备300的干扰。Please also refer to FIGS. 2 to 5. In some embodiments, the first substrate assembly 711 further includes a reinforcing plate 713, and the reinforcing plate 713 is coupled to a side of the first substrate 711 opposite to the pad 72. The reinforcing plate 713 may cover one side of the first substrate 711, and the reinforcing plate 713 may be used to increase the strength of the first substrate 711 and prevent deformation of the first substrate 711. In addition, the reinforcing plate 713 may be made of a conductive material, such as a metal or an alloy. When the depth image acquisition device 300 is installed on the electronic device 800, the reinforcing plate 713 and the housing 801 may be electrically connected to make the reinforcing plate 713. Grounding and effectively reducing the interference of the static electricity of external components on the depth image acquisition device 300.
请再参阅图2至图5,在其他实施方式中,深度图像获取设备300还包括连接器76,连接器76连接在第一基板组件71上并用于与深度图像获取设备300外部的电子元件电性连接。Please refer to FIG. 2 to FIG. 5 again. In other embodiments, the depth image acquisition device 300 further includes a connector 76 connected to the first substrate assembly 71 and used to electrically communicate with electronic components external to the depth image acquisition device 300. Sexual connection.
请一并参阅图6、图33和图34,本申请还提供了一种激光投射模组100的控制方法。激光投射模 组100为上述任意一实施方式所述的激光投射模组100。控制方法包括:Please refer to FIG. 6, FIG. 33 and FIG. 34 together. The present application further provides a control method of the laser projection module 100. The laser projection module 100 is the laser projection module 100 according to any one of the above embodiments. Control methods include:
01:获取光检测器63输出的光检测电信号;和01: Obtaining the light detection electric signal output by the light detector 63; and
03:根据光检测电信号调整光源10的驱动电流。03: Adjust the driving current of the light source 10 according to the light detection electric signal.
其中,控制方法在步骤01后还包括:The control method after step 01 further includes:
021:判断光检测电信号是否小于预设光检测值;和021: determine whether the light detection electric signal is less than a preset light detection value; and
022:在光检测电信号小于预设光检测值时,获取破裂检测电信号。022: Obtain a fracture detection electrical signal when the light detection electrical signal is less than a preset light detection value.
步骤03根据光检测电信号调整光源10的驱动电流包括:Step 03: Adjusting the driving current of the light source 10 according to the light detection electric signal includes:
031:判断破裂检测电信号是否处于预设破裂检测范围内;031: Determine whether the electrical signal for rupture detection is within a preset rupture detection range;
032:在破裂检测电信号处于预设破裂检测范围内时,调高光源10的驱动电流;032: increase the driving current of the light source 10 when the electrical signal of the fracture detection is within the preset fracture detection range;
033:在破裂检测电信号不处于预设破裂检测范围内时,调低光源10的驱动电流。033: When the fracture detection electric signal is not within the preset fracture detection range, the driving current of the light source 10 is reduced.
请结合图6及图8,步骤01、步骤021、步骤022、步骤03、步骤031、步骤032和步骤033均可以由处理器805实现。也即是说,处理器805可用于获取光检测器63输出的光检测电信号、以及根据光检测电信号调整光源10的驱动电流。进一步地,处理器805还可用于判断光检测电信号是否小于预设光检测值、在光检测电信号小于预设光检测值时,获取破裂检测电信号、判断破裂检测电信号是否处于预设破裂检测范围内、在破裂检测电信号处于预设破裂检测范围内时,调高光源10的驱动电流、以及在破裂检测电信号不处于预设破裂检测范围内时,调低光源10的驱动电流。With reference to FIG. 6 and FIG. 8, step 01, step 021, step 022, step 03, step 031, step 032, and step 033 can all be implemented by the processor 805. That is to say, the processor 805 may be configured to obtain a photodetection electrical signal output by the photodetector 63 and adjust a driving current of the light source 10 according to the photodetection electrical signal. Further, the processor 805 may be further configured to determine whether the light detection electrical signal is less than a preset light detection value, and when the light detection electrical signal is less than a preset light detection value, obtain a fracture detection electrical signal, and determine whether the fracture detection electrical signal is within a preset Within the rupture detection range, when the rupture detection electrical signal is within the preset rupture detection range, the drive current of the light source 10 is increased, and when the rupture detection electrical signal is not within the preset rupture detection range, the drive current of the light source 10 is decreased. .
可以理解,扩散器20的透光率通常不能达到100%,光源10发射的激光绝大部分会经过扩散器20扩散出去,但小部分激光会被扩散器20反射。光检测器63可用于接收扩散器20反射回的激光。光检测器63接收到扩散器20反射回的激光后会形成光检测电信号输出。在驱动电流一定的情况下,处理器805接收光检测器63输出的光检测电信号,并比较光检测电信号与预设光检测值的大小,若光检测电信号小于预设光检测值,说明光检测器63接收到的激光较少,出现这个现象的原因可能是扩散器20破裂导致出射的激光增多,反射回光检测器63的激光减少,也可能是光源10的电光转换效率降低导致光源10发出的激光总量减少,进一步导致反射到光检测器63的激光减少。则在处理器805检测到光检测电信号小于预设光检测值时,处理器805控制破裂检测组件输出破裂检测电信号。若破裂检测电信号未处于预设破裂检测范围内,则说明导致光检测器63接收的激光减少的原因是扩散器20出现破裂;若破裂检测电信号处于预设破裂检测范围内,则说明扩散器20未破裂,导致光检测器63接收的激光减少的原因是光源10的光电转换效率变低。若光检测电信号大于或等于预设光检测值,说明扩散器20和光源10均正常工作,此时处理器805不做动作。It can be understood that the light transmittance of the diffuser 20 usually cannot reach 100%. Most of the laser light emitted by the light source 10 will be diffused out by the diffuser 20, but a small part of the laser light will be reflected by the diffuser 20. The light detector 63 can be used for receiving the laser light reflected by the diffuser 20. After receiving the laser light reflected from the diffuser 20, the photodetector 63 forms a photodetection electrical signal output. When the driving current is constant, the processor 805 receives the photodetection electrical signal output by the photodetector 63, and compares the magnitude of the photodetection electrical signal with a preset photodetection value. If the photodetection electrical signal is less than the preset photodetection value, It indicates that the laser light received by the photodetector 63 is less. The reason for this phenomenon may be that the emitted laser light is increased due to the rupture of the diffuser 20, the laser light reflected back to the photodetector 63 is reduced, or the electro-optical conversion efficiency of the light source 10 is reduced The total amount of laser light emitted from the light source 10 is reduced, which further reduces the amount of laser light reflected to the photodetector 63. Then, when the processor 805 detects that the light detection electric signal is less than a preset light detection value, the processor 805 controls the rupture detection component to output a rupture detection electric signal. If the rupture detection electrical signal is not within the preset rupture detection range, the reason for the decrease in the laser light received by the photodetector 63 is the rupture of the diffuser 20; if the rupture detection electrical signal is within the preset rupture detection range, the diffusion is indicated The detector 20 is not broken, and the reason why the laser light received by the photodetector 63 is reduced is that the photoelectric conversion efficiency of the light source 10 becomes low. If the light detection electric signal is greater than or equal to the preset light detection value, it indicates that both the diffuser 20 and the light source 10 work normally, and the processor 805 does not perform an action at this time.
进一步地,若处理器805检测到光检测器63接收的激光减少的原因是扩散器20出现破裂,则此时处理器805应该调低光源10的驱动电流,或者直接关闭光源10,避免出射的激光能量过高,对用户的人眼造成伤害;若处理器805检测到光检测器63接收的激光减少的原因是光源10的光电转换效率变低,则此时处理器805应适当地调高光源10的驱动电流,以满足当前的目标空间对光源10的发光功率的需求,保障深度信息的获取精度。Further, if the processor 805 detects that the decrease in the laser light received by the photodetector 63 is due to the rupture of the diffuser 20, then the processor 805 should reduce the driving current of the light source 10 or directly turn off the light source 10 to avoid emission The laser energy is too high, causing damage to the user's eyes. If the processor 805 detects that the decrease in the laser light received by the photodetector 63 is due to the low photoelectric conversion efficiency of the light source 10, the processor 805 should be appropriately adjusted higher at this time. The driving current of the light source 10 meets the current target space's demand for the light emitting power of the light source 10 and ensures the accuracy of obtaining the depth information.
本申请实施方式的激光投射模组100的控制方法基于光检测器63输出的光检测电信号来调节光源10的驱动电流。如此,通过光源10的驱动电流的自主调节来保证光源10具有足够的发光功率,有利于提升深度信息的获取精度。The control method of the laser projection module 100 according to the embodiment of the present application adjusts the driving current of the light source 10 based on the light detection electric signal output by the light detector 63. In this way, by autonomously adjusting the driving current of the light source 10 to ensure that the light source 10 has sufficient luminous power, it is beneficial to improve the accuracy of acquiring depth information.
请结合图6和图7,在某些实施方式中,光检测器63为多个且环绕光源10呈中心对称设置,此时处理器805可以接收到多个光检测电信号。处理器805接收到多个光检测电信号后,先对多个光检测电信号求和取平均得到多个光检测电信号的平均值,再将光检测电信号的平均值与预设光检测值作比较,若光检测电信号的平均值小于预设光检测值,则进一步控制破裂检测组件做扩散器20的破裂检测;若光检测电信号的平均值大于或等于预设光检测值,则处理器805不做动作。采用多个设置在不同位置处的光检测器63来接收扩散器20反射回激光可以更加准确地检测经扩散器20反射回的激光的量的大小,进一步地可以更加准确地检测出光源10的实际发光功率,有利于处理器805对驱动电流的准确调节。Please refer to FIG. 6 and FIG. 7. In some embodiments, there are a plurality of light detectors 63 and are arranged symmetrically around the light source 10. At this time, the processor 805 can receive a plurality of light detection electrical signals. After the processor 805 receives a plurality of light detection electric signals, it first sums and averages the plurality of light detection electric signals to obtain an average value of the plurality of light detection electric signals, and then compares the average value of the light detection electric signals with a preset light detection. Value comparison, if the average value of the light detection electrical signal is less than the preset light detection value, further control the rupture detection component to perform the break detection of the diffuser 20; if the average value of the light detection electrical signal is greater than or equal to the preset light detection value, Then the processor 805 does nothing. The use of multiple photodetectors 63 arranged at different positions to receive the laser light reflected by the diffuser 20 can more accurately detect the amount of laser light reflected by the diffuser 20, and furthermore, the light source 10 can be more accurately detected. The actual luminous power is helpful for the processor 805 to accurately adjust the driving current.
在某些实施方式中,预设光检测值的取值由未调节前的驱动电流来决定。具体地,不同的驱动电流对应不同的预设光检测值,每一次光检测器63输出的光检测电信号应该与当下未调节的驱动电流对应的预设光检测值来作比较。例如,若当前的驱动电流为A1,则预设光检测值应为B1,光检测电信号与B1作比较;若当前的驱动电流为A2(A2>A1),则预设光检测值应为B2(B2>B1),光检测电信号与 B2作比较。可以理解的是,在不同的场景下,光源10的驱动电流可能是不一样的。若驱动电流较大,则光源10发射的激光较多,反射回光检测器63的激光也较多;若驱动电流较小,则光源10发射的激光较少,反射回光检测器63的激光也较少。因此,光检测器63输出的光检测电信号应与当前场景下使用的驱动电流对应的预设光检测值作比较,才能更为准确地检测出光源10的实际发光功率是大于或者小于理论上应该发射的功率,进一步地对驱动电流做调节,使得实际发光功率满足理论上应该发射的功率的需求。In some embodiments, the value of the preset light detection value is determined by the driving current before being adjusted. Specifically, different driving currents correspond to different preset photodetection values, and each time the photodetection electrical signal output by the photodetector 63 should be compared with a preset photodetection value corresponding to the current unadjusted drive current. For example, if the current drive current is A1, the preset photodetection value should be B1, and the photodetection electrical signal is compared with B1; if the current drive current is A2 (A2> A1), the preset photodetection value should be B2 (B2> B1). The photodetection electrical signal is compared with B2. It can be understood that the driving current of the light source 10 may be different in different scenarios. If the driving current is large, more laser light is emitted from the light source 10, and more laser light is reflected back to the photo detector 63. If the driving current is small, less laser light is emitted from the light source 10, and laser light is reflected back to the photo detector 63 And less. Therefore, the photo-detection electric signal output by the photo-detector 63 should be compared with a preset photo-detection value corresponding to the driving current used in the current scene, in order to more accurately detect whether the actual luminous power of the light source 10 is greater than or less than the theoretical value. The power that should be transmitted further adjusts the driving current, so that the actual luminous power meets the demand for the power that should be transmitted in theory.
在本说明书的描述中,参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。In the description of this specification, reference is made to the terms "certain embodiments", "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" The description means that a specific feature, structure, material, or characteristic described in combination with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same implementation or example. Moreover, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more implementations or examples.
此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个所述特征。在本申请的描述中,“多个”的含义是至少两个,例如两个,三个,除非另有明确具体的限定。In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "plurality" is at least two, for example, two, three, unless specifically defined otherwise.
尽管上面已经示出和描述了本申请的实施例,可以理解的是,上述实施例是示例性的,不能理解为对本申请的限制,本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型,本申请的范围由权利要求及其等同物限定。Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limitations on the present application. Those skilled in the art may, within the scope of the present application, understand the above. The embodiments are subject to change, modification, replacement, and modification, and the scope of the present application is defined by the claims and their equivalents.

Claims (21)

  1. 一种激光投射模组,其特征在于,所述激光投射模组包括:A laser projection module, characterized in that the laser projection module includes:
    光源,所述光源用于发射激光;A light source for emitting laser light;
    扩散器,所述扩散器用于扩散所述激光;及A diffuser for diffusing the laser light; and
    光检测器,所述光检测器用于接收由所述扩散器反射回的激光以形成光检测电信号,所述光源的驱动电流基于所述光检测电信号进行调整。A light detector configured to receive laser light reflected by the diffuser to form a light detection electric signal, and a driving current of the light source is adjusted based on the light detection electric signal.
  2. 根据权利要求1所述的激光投射模组,其特征在于,所述激光投射模组还包括破裂检测组件,在所述光检测电信号小于预设光检测值时,所述破裂检测组件用于输出破裂检测电信号,所述破裂检测电信号用于检测所述扩散器是否破裂。The laser projection module according to claim 1, wherein the laser projection module further comprises a rupture detection component, and the rupture detection component is used when the light detection electrical signal is less than a preset light detection value. A rupture detection electric signal is output, and the rupture detection electric signal is used to detect whether the diffuser is ruptured.
  3. 根据权利要求2所述的激光投射模组,其特征在于,所述扩散器包括相背的入射面和出射面,所述破裂检测组件包括透光导电膜,所述透光导电膜设置在所述入射面和/或所述出射面上,所述透光导电膜包括导电电极,所述导电电极包括输入端和输出端,所述输入端和所述输出端与处理器连接以形成导电回路。The laser projection module according to claim 2, wherein the diffuser includes opposite incident surfaces and outgoing surfaces, and the rupture detection component includes a light-transmitting conductive film, and the light-transmitting conductive film is disposed at On the incident surface and / or the exit surface, the transparent conductive film includes a conductive electrode, the conductive electrode includes an input terminal and an output terminal, and the input terminal and the output terminal are connected to a processor to form a conductive circuit. .
  4. 根据权利要求2所述的激光投射模组,其特征在于,所述破裂检测组件包括掺杂在所述扩散器中的导电粒子,所述导电粒子形成导电通路,所述导电通路包括输入端和输出端,所述输入端和所述输出端与处理器连接以形成导电回路。The laser projection module according to claim 2, wherein the fracture detection component comprises conductive particles doped in the diffuser, the conductive particles forming a conductive path, and the conductive path includes an input terminal and An output terminal, the input terminal and the output terminal are connected to a processor to form a conductive loop.
  5. 根据权利要求1所述的激光投射模组,其特征在于,所述光检测器包括多个,多个所述光检测器环绕所述光源呈中心对称设置。The laser projection module according to claim 1, wherein the light detector comprises a plurality of light detectors, and the plurality of light detectors are arranged symmetrically around the light source.
  6. 根据权利要求1所述的激光投射模组,其特征在于,所述激光投射模组还包括镜筒,所述镜筒包括镜筒侧壁,所述镜筒侧壁围成收容腔,所述镜筒侧壁包括相背的第一面及第二面,所述第一面朝所述第二面凹陷形成与所述收容腔连通的安装槽,所述扩散器安装在所述安装槽内。The laser projection module according to claim 1, wherein the laser projection module further comprises a lens barrel, the lens barrel includes a sidewall of the lens barrel, and the sidewall of the lens barrel surrounds a receiving cavity, The side wall of the lens barrel includes a first surface and a second surface opposite to each other. The first surface is recessed toward the second surface to form a mounting groove communicating with the receiving cavity. The diffuser is installed in the mounting groove. .
  7. 一种激光投射模组的控制方法,其特征在于,所述激光投射模组包括光源、扩散器和光检测器,所述光源用于发射激光,所述扩散器用于扩散所述激光,所述光检测器用于接收由所述扩散器反射回的激光以形成光检测电信号;所述控制方法包括:A method for controlling a laser projection module, characterized in that the laser projection module includes a light source, a diffuser, and a light detector, the light source is used to emit laser light, the diffuser is used to diffuse the laser light, and the light The detector is configured to receive laser light reflected by the diffuser to form a light detection electrical signal; the control method includes:
    获取所述光检测器输出的所述光检测电信号;和Acquiring the light detection electric signal output by the light detector; and
    根据所述光检测电信号调整所述光源的驱动电流。A driving current of the light source is adjusted according to the light detection electric signal.
  8. 根据权利要求7所述的控制方法,其特征在于,所述激光投射模组还包括破裂检测组件,所述破裂检测组件用于输出破裂检测的电信号,所述破裂检测电信号用于检测所述扩散器是否破裂;所述控制方法在获取所述光检测器输出的所述光检测电信号的步骤后还包括:The control method according to claim 7, wherein the laser projection module further comprises a rupture detection component, the rupture detection component is configured to output an electrical signal for rupture detection, and the electrical signal for rupture detection is used to detect all Whether the diffuser is broken; after the step of obtaining the photo-detection electrical signal output by the photo-detector, the control method further includes:
    判断所述光检测电信号是否小于预设光检测值;和Determining whether the light detection electric signal is less than a preset light detection value; and
    在所述光检测电信号小于所述预设光检测值时,获取所述破裂检测电信号。When the light detection electric signal is smaller than the preset light detection value, the fracture detection electric signal is acquired.
  9. 根据权利要求8所述的控制方法,其特征在于,所述根据所述光检测电信号调整所述光源的驱动电流的步骤包括:The control method according to claim 8, wherein the step of adjusting the driving current of the light source according to the light detection electric signal comprises:
    判断所述破裂检测电信号是否处于预设破裂检测范围内;Judging whether the rupture detection electric signal is within a preset rupture detection range;
    在所述破裂检测电信号处于所述预设破裂检测范围内时,调高所述光源的驱动电流;Increasing the drive current of the light source when the burst detection electrical signal is within the preset burst detection range;
    在所述破裂检测电信号不处于所述预设破裂检测范围内时,调低所述光源的驱动电流。When the burst detection electric signal is not within the preset burst detection range, the driving current of the light source is reduced.
  10. 一种深度图像获取设备,其特征在于,包括:A depth image acquisition device, comprising:
    激光投射模组,所述激光投射模组包括:Laser projection module, the laser projection module includes:
    光源,所述光源用于发射激光;A light source for emitting laser light;
    扩散器,所述扩散器用于扩散所述激光;及A diffuser for diffusing the laser light; and
    光检测器,所述光检测器用于接收由所述扩散器反射回的激光以形成光检测电信号,所述光源的驱动电流基于所述光检测电信号进行调整;及A light detector configured to receive laser light reflected by the diffuser to form a light detection electric signal, and a driving current of the light source is adjusted based on the light detection electric signal; and
    光接收器,所述光接收器用于接收由所述激光投射模组发射的激光。A light receiver for receiving laser light emitted by the laser projection module.
  11. 根据权利要求10所述的深度图像获取设备,其特征在于,所述激光投射模组还包括破裂检测组件,在所述光检测电信号小于预设光检测值时,所述破裂检测组件用于输出破裂检测电信号,所述破裂检测电信号用于检测所述扩散器是否破裂。The depth image acquisition device according to claim 10, wherein the laser projection module further comprises a rupture detection component, and the rupture detection component is used when the light detection electrical signal is less than a preset light detection value. A rupture detection electric signal is output, and the rupture detection electric signal is used to detect whether the diffuser is ruptured.
  12. 根据权利要求11所述的深度图像获取设备,其特征在于,所述扩散器包括相背的入射面和出射面,所述破裂检测组件包括透光导电膜,所述透光导电膜设置在所述入射面和/或所述出射面上,所述透光导电膜包括导电电极,所述导电电极包括输入端和输出端,所述输入端和所述输出端与处理器连接以形成导电回路。The depth image acquisition device according to claim 11, wherein the diffuser includes an incident surface and an exit surface opposite to each other, and the crack detection component includes a light-transmitting conductive film, and the light-transmitting conductive film is disposed at On the incident surface and / or the exit surface, the transparent conductive film includes a conductive electrode, the conductive electrode includes an input terminal and an output terminal, and the input terminal and the output terminal are connected to a processor to form a conductive circuit. .
  13. 根据权利要求11所述的深度图像获取设备,其特征在于,所述破裂检测组件包括掺杂在所述扩散器中的导电粒子,所述导电粒子形成导电通路,所述导电通路包括输入端和输出端,所述输入端和所述输出端与处理器连接以形成导电回路。The depth image acquisition device according to claim 11, wherein the fracture detection component includes conductive particles doped in the diffuser, the conductive particles forming a conductive path, and the conductive path includes an input terminal and An output terminal, the input terminal and the output terminal are connected to a processor to form a conductive loop.
  14. 根据权利要求10所述的深度图像获取设备,其特征在于,所述光检测器包括多个,多个所述光检测器环绕所述光源呈中心对称设置。The depth image acquisition device according to claim 10, wherein the light detector comprises a plurality of light detectors, and the plurality of light detectors are arranged symmetrically around the light source.
  15. 根据权利要求10所述的深度图像获取设备,其特征在于,所述激光投射模组还包括镜筒,所述镜筒包括镜筒侧壁,所述镜筒侧壁围成收容腔,所述镜筒侧壁包括相背的第一面及第二面,所述第一面朝所述第二面凹陷形成与所述收容腔连通的安装槽,所述扩散器安装在所述安装槽内。The depth image acquisition device according to claim 10, wherein the laser projection module further comprises a lens barrel, the lens barrel includes a sidewall of the lens barrel, and the sidewall of the lens barrel surrounds a receiving cavity, The side wall of the lens barrel includes a first surface and a second surface opposite to each other. The first surface is recessed toward the second surface to form a mounting groove communicating with the receiving cavity. The diffuser is installed in the mounting groove. .
  16. 一种电子装置,其特征在于,包括:An electronic device, comprising:
    壳体;和Shell; and
    深度图像获取设备,所述深度图像获取设备设置在所述壳体上;A depth image acquisition device, which is disposed on the casing;
    所述深度图像获取设备包括:The depth image acquisition device includes:
    激光投射模组,所述激光投射模组包括:Laser projection module, the laser projection module includes:
    光源,所述光源用于发射激光;A light source for emitting laser light;
    扩散器,所述扩散器用于扩散所述激光;及A diffuser for diffusing the laser light; and
    光检测器,所述光检测器用于接收由所述扩散器反射回的激光以形成光检测电信号,所述光源的驱动电流基于所述光检测电信号进行调整;及A light detector configured to receive laser light reflected by the diffuser to form a light detection electric signal, and a driving current of the light source is adjusted based on the light detection electric signal; and
    光接收器,所述光接收器用于接收由所述激光投射模组发射的激光。A light receiver for receiving laser light emitted by the laser projection module.
  17. 根据权利要求16所述的电子装置,其特征在于,所述激光投射模组还包括破裂检测组件,在所述光检测电信号小于预设光检测值时,所述破裂检测组件用于输出破裂检测电信号,所述破裂检测电信号用于检测所述扩散器是否破裂。The electronic device according to claim 16, wherein the laser projection module further comprises a rupture detection component, and the rupture detection component is configured to output a rupture when the light detection electrical signal is less than a preset light detection value. An electrical signal is detected, and the rupture detection electrical signal is used to detect whether the diffuser is ruptured.
  18. 根据权利要求17所述的电子装置,其特征在于,所述扩散器包括相背的入射面和出射面,所述破裂检测组件包括透光导电膜,所述透光导电膜设置在所述入射面和/或所述出射面上,所述透光导电膜包括导电电极,所述导电电极包括输入端和输出端,所述输入端和所述输出端与处理器连接以形成导电回路。The electronic device according to claim 17, wherein the diffuser comprises an incident surface and an exit surface opposite to each other, and the rupture detection component comprises a light-transmitting conductive film, and the light-transmitting conductive film is disposed on the incidence Surface and / or the exit surface, the light-transmitting conductive film includes a conductive electrode, the conductive electrode includes an input terminal and an output terminal, and the input terminal and the output terminal are connected to a processor to form a conductive circuit.
  19. 根据权利要求17所述的电子装置,其特征在于,所述破裂检测组件包括掺杂在所述扩散器中的导电粒子,所述导电粒子形成导电通路,所述导电通路包括输入端和输出端,所述输入端和所述输出端与处理器连接以形成导电回路。The electronic device according to claim 17, wherein the crack detection component comprises conductive particles doped in the diffuser, the conductive particles forming a conductive path, and the conductive path includes an input terminal and an output terminal The input terminal and the output terminal are connected to a processor to form a conductive loop.
  20. 根据权利要求16所述的电子装置,其特征在于,所述光检测器包括多个,多个所述光检测器环绕所述光源呈中心对称设置。The electronic device according to claim 16, wherein the light detector comprises a plurality of light detectors, and the plurality of light detectors are arranged symmetrically around the light source.
  21. 根据权利要求16所述的电子装置,其特征在于,所述激光投射模组还包括镜筒,所述镜筒包括镜筒侧壁,所述镜筒侧壁围成收容腔,所述镜筒侧壁包括相背的第一面及第二面,所述第一面朝所述第二面凹陷形成与所述收容腔连通的安装槽,所述扩散器安装在所述安装槽内。The electronic device according to claim 16, wherein the laser projection module further comprises a lens barrel, the lens barrel includes a sidewall of the lens barrel, the sidewall of the lens barrel surrounds a receiving cavity, and the lens barrel The side wall includes a first surface and a second surface opposite to each other. The first surface is recessed toward the second surface to form a mounting groove communicating with the receiving cavity. The diffuser is installed in the mounting groove.
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