CN108390970B - Support, input/output assembly and terminal - Google Patents

Support, input/output assembly and terminal Download PDF

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Publication number
CN108390970B
CN108390970B CN201810317232.8A CN201810317232A CN108390970B CN 108390970 B CN108390970 B CN 108390970B CN 201810317232 A CN201810317232 A CN 201810317232A CN 108390970 B CN108390970 B CN 108390970B
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CN
China
Prior art keywords
input
cavity
output module
bracket
output
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Active
Application number
CN201810317232.8A
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Chinese (zh)
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CN108390970A (en
Inventor
许海平
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201810317232.8A priority Critical patent/CN108390970B/en
Publication of CN108390970A publication Critical patent/CN108390970A/en
Priority to US16/493,286 priority patent/US11330090B2/en
Priority to EP19773330.6A priority patent/EP3609168B1/en
Priority to PCT/CN2019/081325 priority patent/WO2019196726A1/en
Application granted granted Critical
Publication of CN108390970B publication Critical patent/CN108390970B/en
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Casings For Electric Apparatus (AREA)
  • Semiconductor Lasers (AREA)

Abstract

The invention discloses a terminal, an input/output assembly and a support. The support is the integrated into one piece structure and includes the body, and the body includes first face and the second face of carrying on the back mutually, and the second face has been seted up at least one and has been acceptd the chamber, and the inner wall of accepting at least one in the chamber is formed with the internal thread, and at least one through-hole that corresponds with at least one and accept the chamber is seted up to the first face, and at least one is acceptd the chamber and is used for fixed mounting input output module and makes input output module expose from the second face, and at least one through-hole is used for exposing input output module from. Because support integrated into one piece, when a plurality of input/output module were installed and are acceptd the intracavity, the relative position of input/output module is difficult for changing, and a plurality of input/output module can the work of cooperateing better. Furthermore, the inner wall of at least one of the accommodating cavities is provided with an internal thread, so that the input and output module with the external thread formed on the outer wall can be conveniently installed in the accommodating cavity with the internal thread formed on the inner wall.

Description

Support, input/output assembly and terminal
Technical Field
The invention relates to the technical field of consumer electronics, in particular to a support, an input and output assembly and a terminal.
Background
The mobile phone can be configured with a plurality of functional modules, and the functional modules usually need to be matched with each other to work normally, however, when the mobile phone is impacted in use, the relative positions of the functional modules are easy to change, and the functional modules cannot be well matched with each other.
Disclosure of Invention
The embodiment of the invention provides a support, an input and output assembly and a terminal.
The support in the embodiment of the invention is an integrally formed structure and comprises a body, wherein the body comprises a first surface and a second surface which are opposite, the second surface is provided with at least one accommodating cavity, an internal thread is formed on the inner wall of at least one accommodating cavity in the accommodating cavities, the first surface is provided with at least one through hole corresponding to the at least one accommodating cavity, the at least one accommodating cavity is used for fixedly mounting an input/output module and exposing the input/output module from the second surface, and the at least one through hole is used for exposing the input/output module from the first surface.
In some embodiments, the input/output module includes a visible light imaging module and/or an infrared imaging module.
In some embodiments, the input/output module further comprises a laser projection module and/or a receiver.
In some embodiments, the opening size of the through hole is smaller than the size of the corresponding accommodating cavity to form a limiting ring, and the accommodating cavity is formed by the limiting ring and an inner wall extending around the limiting ring.
In some embodiments, the body includes a sidewall connecting the first face and the second face, and the bracket further includes a fixing protrusion protruding outward from the sidewall for fixing the bracket.
In some embodiments, at least one of the receiving cavities includes a first cavity, a second cavity, a third cavity and a fourth cavity, the body includes a side wall, the side wall connects the first surface and the second surface, the side wall includes a top side wall and a bottom side wall that are opposite to each other, the first cavity, the second cavity, the third cavity and the fourth cavity are arranged in sequence, centers of the first cavity, the second cavity and the fourth cavity are located on a same straight line, and a center of the third cavity is located between the straight line and the bottom side wall.
In some embodiments, the stent further comprises a stent positioning block protruding from the second face, the stent positioning block corresponding to the position of the third lumen.
The input/output module of the embodiment of the invention comprises:
the stent of any one of the above embodiments; and
and the outer wall of at least one input/output module in the input/output modules is provided with an external thread, and the external thread is combined with the internal thread so that the input/output module is arranged in the corresponding accommodating cavity.
The terminal of the embodiment of the invention comprises a shell and the input and output assembly, wherein the input and output assembly is arranged in the shell.
In some embodiments, the terminal further includes a main board fixed in the housing, the input/output module is electrically connected to the main board, the main board is formed with a mounting opening, the support penetrates through the mounting opening, and the support penetrates through the mounting opening and is fixedly connected to the main board.
In some embodiments, the housing includes a front shell and a rear shell that respectively abut the first face and the second face to clamp the bracket.
According to the terminal, the input/output assembly and the support, due to the fact that the support is integrally formed, when the input/output modules are installed in the accommodating cavity, the relative positions of the input/output modules are not prone to change, and the input/output modules can be matched with one another well. Specifically, the positions of the plurality of accommodating cavities are not changed, and the relative positions of the input and output modules are not changed as long as the input and output modules are fixed in the accommodating cavities. Simultaneously, because a plurality of input/output module can be installed on a support simultaneously, and need not set up a plurality of mounting brackets for a plurality of input/output module, simplified the structure at terminal, practiced thrift the installation space in the terminal. Furthermore, the inner wall of at least one of the accommodating cavities is provided with an internal thread, so that the input and output module with the external thread formed on the outer wall can be conveniently installed in the accommodating cavity with the internal thread formed on the inner wall.
Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a perspective exploded view of a terminal according to an embodiment of the present invention;
FIG. 2 is a plan view assembly schematic of an input-output assembly of an embodiment of the present invention;
FIG. 3 is a plan view assembly schematic of an input-output assembly of an embodiment of the present invention;
FIG. 4 is an exploded perspective view of an input-output assembly in accordance with an embodiment of the present invention;
FIG. 5 is an exploded perspective view of an input-output assembly in accordance with an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a support of an input-output assembly in accordance with an embodiment of the present invention;
FIG. 7 is a cross-sectional view of an input-output assembly of an embodiment of the present invention;
FIG. 8 is a schematic structural view of a support for an input-output assembly in accordance with certain embodiments of the present invention;
fig. 9 to 12 are schematic partial structural views of a laser projection module of an input/output device according to an embodiment of the invention.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.
In addition, the embodiments of the present invention described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the embodiments of the present invention, and are not to be construed as limiting the present invention.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1, a terminal 100 according to an embodiment of the present invention includes a housing 10, a main board 20, and an input/output assembly 30. The terminal 100 may be a mobile phone, a tablet computer, a laptop computer, a game machine, a head display device, an access control system, a teller machine, etc., and the embodiment of the present invention is described by taking the terminal 100 as a mobile phone, it is understood that the specific form of the terminal 100 may be other, and is not limited herein.
Referring to fig. 1, the housing 10 may be used as a mounting carrier for the motherboard 20 and the input/output module 30, the housing 10 may provide protection against dust, water and falling for the motherboard 20 and the input/output module 30, and the housing 10 may further be mounted with components such as a display screen and a battery. The housing 10 includes a front case 11 and a rear case 12, the front case 11 and the rear case 12 are combined with each other and house the main board 20 and the input/output assembly 30 between the front case 11 and the rear case 12, and the front case 11 and the rear case 12 may be made of stainless steel, aluminum alloy, plastic, or other materials.
Referring to fig. 1, the main board 20 is fixed in the housing 10, and specifically, the main board 20 may be fixed on the front housing 11 or the rear housing 12 by screwing, clipping, or the like. The motherboard 20 can be connected to each input/output module 31 (as shown in fig. 3) of the input/output module 30, a processing chip, a control chip, etc. of the terminal 100 can be connected to the motherboard 20, and the circuit laid on the motherboard 20 can be used for transmitting electrical signals. The main board 20 is formed with a mounting opening for the input/output module 30 to pass through, so as to reduce the space occupied by the main board 20 and the input/output module 30 when they are installed in the housing 10.
Referring to fig. 1 to 3, the input/output module 30 is mounted in the housing 10, the input/output module 30 includes an input/output module 31 and a bracket 32, and the input/output module 31 is mounted on the bracket 32.
The input/output module 31 may send or receive signals to or from the outside, or has both functions of sending and receiving signals to and from the outside, where the signals may be light signals, sound signals, touch signals, and the like. It is understood that the specific type of the input/output module 31 and the number of each type of input/output module 31 may vary according to different functional requirements of the terminal 100.
Referring to fig. 4 and fig. 5, in the embodiment of the present invention, the input/output module 31 includes a laser projection module 311, an infrared imaging module 313, a visible light imaging module 312, and a receiver 314. The laser projection module 311 may be configured to project a laser pattern to a target object outside the terminal 100, the laser may be infrared light, the infrared imaging module 313 may be configured to receive an external infrared light signal to generate an infrared image, in an example, the infrared imaging module 313 may receive the laser pattern reflected by the target object, and the laser projection module 311 and the infrared imaging module 313 are jointly used to obtain depth information of the target object. The visible light imaging module 312 can receive an external visible light signal to generate a color image, the visible light imaging module 312, the infrared imaging module 313 and the laser projection module 311 can be used together to obtain a depth image of a target user, and the receiver 314 sends out sound waves under the action of the driving signal to realize functions of conversation and the like. The input/output module 31 may be provided with a connector 33, the connector 33 may be inserted into a specific connecting seat on the motherboard 20 to connect the input/output module 31 and the motherboard 20, and the input/output module 31 may be separated from the motherboard 20 by pulling out the connector 33 from the connecting seat. The outer wall 310 of at least one of the input-output modules 31 is formed with external threads. The outer wall 310 of the infrared imaging module 313 in this embodiment is formed with external threads. In other embodiments, the outer wall 310 of any one, two, three, or four of the laser projection module 311, the visible light imaging module 312, the infrared imaging module 313, and the receiver 314 is formed with external threads. In other embodiments, the number of the input/output modules 31 in the input/output assembly 30 may also be one, two, three, four or any number.
Referring to fig. 1 to 3, the bracket 32 is an integrally formed structure, and the bracket 32 includes a body 321. The bracket 32 is fixed in the housing 10 and is used for mounting the input/output module 31. The body 321 includes a first surface 3211, a second surface 3212 and a sidewall 3213, the first surface 3211 and the second surface 3212 are opposite to each other, the sidewall 3213 connects the first surface 3211 and the second surface 3212, and the sidewall 3213 includes a top sidewall 3214 and a bottom sidewall 3215 which are opposite to each other. When the input/output module 30 is installed in the housing 10, the front housing 11 can abut against the first surface 3211, the rear housing 12 can abut against the second surface 3212 to clamp the bracket 32, so as to prevent the bracket 32 and the input/output module 31 from moving in the thickness direction (such as the Z direction in fig. 1) of the terminal 100, meanwhile, the bracket 32 is installed corresponding to the position of the mounting opening of the motherboard 20, and the side wall 3213 of the bracket 32 can abut against the inner wall of the mounting opening, so that the bracket 32 is clamped in the mounting opening, and only by fixing the position of the motherboard 20, the bracket 32 and the input/output module 31 can be prevented from moving in the width direction (perpendicular to the Z direction in fig. 1) of the terminal 100.
Referring to fig. 4 to 6, the second surface 3212 is provided with at least one receiving cavity 322, the first surface 3211 is provided with at least one through hole 323 corresponding to the at least one receiving cavity 322, and the receiving cavities 322 are located between the top sidewall 3214 and the bottom sidewall 3215. An inner wall 3220 of at least one of the receiving cavities 322 is formed with an internal thread. The inner wall 3220 of a portion of the receiving cavity 322 may not have internal threads. The at least one receiving cavity 322 is used for fixedly mounting the input/output module 31, when the input/output module 31 is mounted on the bracket 32, the input/output module 31 is exposed from the second surface 3212, and the input/output module 31 is also exposed from the first surface 3211 through the through hole 323. In the embodiment of the present invention, the term "exposed" means that the input/output module 31 can be seen from the first surface 3211 or the second surface 3212, for example, the input/output module 31 may be exposed from the first surface 3211 through the through hole 323 of the first surface 3211, or the input/output module 31 may not pass through the through hole 323 but the input/output module 31 can be seen through the through hole 323.
The retainer ring 324 is formed on the bracket 32, and specifically, the opening size of the through hole 323 is smaller than the size of the corresponding receiving cavity 322 to form the retainer ring 324, and the receiving cavity 322 is formed by the retainer ring 324 and the inner wall extending around the retainer ring 324. When the input/output module 31 having the external thread formed on the outer wall 310 is mounted in the housing cavity 322 having the internal thread formed on the inner wall 3220, the internal thread is screwed (coupled) with the external thread so that the input/output module 31 is mounted in the housing cavity 322 (see fig. 7). When the input/output module 31 is mounted in the receiving cavity 322 with the inner wall 3220 without an internal thread, the input/output module 31 may be mounted in the receiving cavity 322 along the direction that the second surface 3212 points to the first surface 3211 until the input/output module 31 abuts against the limiting ring 324, which indicates that the input/output module 31 is mounted in place, at this time, glue may be dispensed into the receiving cavity 322, specifically, glue may be dispensed into a gap between the input/output module 31 and the inner wall of the receiving cavity 322, and after the glue is cured, the input/output module 31 is fixedly mounted in the receiving cavity 322.
It can be understood that the specific shape of the receiving cavity 322 corresponds to the shape of the corresponding input/output module 31, the cavity of the receiving cavity 322 may be slightly larger than the input/output module 31 to facilitate dispensing in the receiving cavity 322, and the cavity of the receiving cavity 322 may also be slightly smaller than the input/output module 31 to enable the input/output module 31 to be installed in the receiving cavity 322 by interference fit. The specific number of the receiving cavities 322 may also be equal to the specific number of the input/output modules 31. The number of the receiving cavities 322 having the inner wall 3220 formed with the female screw is equal to the number of the input/output modules 31 having the outer wall 310 formed with the male screw.
Referring to fig. 4 to fig. 6, in the embodiment of the present invention, the accommodating cavity 322 includes a first cavity 3221, a second cavity 3222, a third cavity 3223, and a fourth cavity 3224. First cavity 3221, second cavity 3222, third cavity 3223, and fourth cavity 3224 are arranged in this order, and through hole 323 includes first hole 3231, second hole 3232, third hole 3233, and fourth hole 3234, first hole 3231 corresponds to first cavity 3221, second hole 3232 corresponds to second cavity 3222, third hole 3233 corresponds to third cavity 3223, and fourth hole 3234 corresponds to fourth cavity 3224. The plurality of receiving cavities 322 may be spaced apart from each other, or any two, three, or four receiving cavities 322 may be in communication with each other. The first cavity 3221 may be used to mount the laser projection module 311, the second cavity 3222 may be used to mount the visible light imaging module 312, the third cavity 3223 may be used to mount the receiver 314, and the fourth cavity 3224 may be used to mount the infrared imaging module 313. Specifically, the inner walls 3220 of the first cavity 3221, the second cavity 3222 and the third cavity 3223 do not have internal threads, the laser projection module 311 is bonded in the first cavity 3221 through glue, the visible light imaging module 312 is bonded in the second cavity 3222 through glue, and the receiver 314 is bonded in the third cavity 3223 through glue; an inner thread is formed on the inner wall 3220 of the fourth cavity 3224, and the external thread of the outer wall 310 of the infrared imaging module 313 is screwed (combined) with the internal thread of the inner wall 3220 of the fourth cavity 3224, so that the infrared imaging module 313 is installed in the fourth cavity 3224 (see fig. 7). The centers of the first cavity 3221, the second cavity 3222, and the fourth cavity 3224 are located on the same straight line L (as shown in fig. 2), and after the laser projection module 311, the visible light imaging module 312, and the infrared imaging module 313 are installed, optical axes of the three are located in the same plane, so that the three are easily matched with each other, specifically, the laser projection module 311 penetrates out from the first hole 3231, the visible light imaging module 312 penetrates out from the second hole 3232, and the infrared imaging module 312 penetrates out from the fourth hole 3234, and more specifically, the light emitting surface of the laser projection module 311, the light incident surface of the visible light imaging module 312, and the light incident surface of the infrared imaging module 313 may be located in the same plane. The center of the third cavity 3223 is located between the straight line L and the bottom sidewall 3215, the receiver 314 is installed in the fourth cavity 3224, the receiver 314 may not pass through the fourth hole 3234, and the sound wave emitted from the receiver 314 may pass through the fourth hole 3234 and enter the outside.
In summary, in the terminal 100 according to the embodiment of the invention, since the bracket 32 is integrally formed, when the plurality of input/output modules 31 are installed in the accommodating cavity 322, the relative positions of the input/output modules 31 are not easily changed, and the plurality of input/output modules 31 can better cooperate with each other. Specifically, the positions of the plurality of housing cavities 322 do not change, and the relative positions of the input/output modules 31 do not change as long as the input/output modules 31 are fixed in the housing cavities 322. Meanwhile, since the plurality of input/output modules 31 may be simultaneously mounted on one support 32 without providing a plurality of mounting brackets for the plurality of input/output modules 31, the structure of the terminal 100 is simplified, and the mounting space in the terminal 100 is saved. Furthermore, at least one of the receiving cavities 322 has an inner wall 3220 with an internal thread formed therein, so that the input/output module 31 having an outer wall 310 with an external thread can be easily installed in the receiving cavity 322 having an inner wall 3220 with an internal thread.
Referring to fig. 2 and 4, in some embodiments, the first surface 3211 is provided with a bracket positioning hole 325, and the bracket positioning hole 325 is used for positioning the mounting position of the bracket 32. Specifically, the number of the bracket positioning holes 325 may be one or more, and in the embodiment of the present invention, the number of the bracket positioning holes 325 is two, and two bracket positioning holes 325 are opened at diagonal positions of the body 321. Correspondingly, referring to fig. 1, a front housing positioning post 111 may be formed on the front housing 11 in a protruding manner, when the first surface 3211 abuts against the front housing 11, the front housing positioning post 111 extends into the bracket positioning hole 325 and is matched with the bracket positioning hole 325, the mounting position of the bracket 32 can be quickly positioned by matching the front housing positioning post 111 with the bracket positioning hole 325, and the bracket 32 is further prevented from shaking in the housing 10.
Referring to fig. 4 and 5, in some embodiments, the input/output assembly 30 further includes a flexible circuit board 34, the receiver 314 includes a connection elastic sheet 3141, the connection elastic sheet 3141 protrudes along the first surface 3211 toward the second surface 3212, and the connection elastic sheet 3141 abuts against the flexible circuit board 34 to electrically connect the receiver 314 and the flexible circuit board 34. Specifically, one end of the flexible circuit board 34 may be connected to the main board 20, and the flexible circuit board 34 may have a contact 345, and the connecting spring 3141 abuts against the contact 345 to electrically connect the receiver 314 and the flexible circuit board 34. In one example, there may be multiple sets of contacts 345 on the flexible circuit board 34, and the connecting elastic sheet 3141 may abut against any set of contacts 345 to electrically connect the receiver 314 and the motherboard 20, so that as long as the sound outlet of the receiver 314 corresponds to the third hole 3233, the receiver 314 may be installed in the third cavity 3223 at multiple angles, and the connecting elastic sheet 3141 may abut against the contacts 345.
Referring to fig. 2-4, in some embodiments, the flexible circuit board 34 includes a first section 341 and a second section 342. The first section 341 is attached to the first surface 3211, and the second section 342 is attached to the second surface 3212. The connecting elastic sheet 3141 abuts against the second section 342. The input/output module 30 further includes an infrared fill-in light lamp 35, a proximity sensor 36 and a light sensor 37, and the infrared fill-in light lamp 35, the proximity sensor 36 and the light sensor 37 are all connected to the first segment 341.
In the embodiment of the present invention, the flexible circuit board 34 further includes a connecting section 343 connecting the first section 341 and the second section 342, and the connecting section 343 may be attached to the top sidewall 3214. The infrared light supplement lamp 35 is used for emitting infrared light outwards, the proximity sensor 36 is used for detecting the distance from a target object to the terminal 100, and the light sensor 37 is used for detecting the intensity of ambient light, wherein the proximity sensor 36 and the light sensor 37 can be integrated into a module. Therefore, the infrared fill light 35, the proximity sensor 36, the light sensor 37 and the receiver 314 can be connected through one flexible circuit board 34, and the overall structure of the input and output assembly 30 is simple and compact.
Referring to fig. 2 and 4, in some embodiments, the bracket 32 further includes a bracket positioning post 326 protruding from the first surface 3211, the bracket positioning post 326 corresponds to the third cavity 3223, and the bracket positioning post 326 is located between the straight line L and the top side wall 3214. The bracket positioning posts 326 can be used to position the components mounted on the bracket 32, such as the flexible circuit board 34, the infrared light supplement lamp 35, the proximity sensor 36, or the optical sensor 37, to prevent the components from shaking. More specifically, the bracket positioning post 326 penetrates through and fixes the first section 341 of the flexible circuit board 34, so that the infrared light supplement lamp 35, the proximity sensor 36 and the light sensor 37 disposed on the first section 341 are also fixed, and the center of the third cavity 3223 and the bracket positioning post 326 may be respectively located at two sides of the straight line L.
Referring to fig. 3, 5 and 6, in some embodiments, the bracket 32 further includes a bracket positioning block 327, the bracket positioning block 327 protrudes from the second side 3212, and the position of the bracket positioning block 327 corresponds to the position of the third cavity 3223. The bracket positioning block 327 may be used to position the flexible circuit board 34 mounted on the bracket 32, so as to prevent the flexible circuit board 34 from shaking, and specifically, the bracket positioning block 327 penetrates through and fixes the second section 342 of the flexible circuit board 34.
Referring to fig. 4 and 5, in some embodiments, the flexible circuit board 34 is provided with a flexible board positioning hole 344, and the flexible board positioning hole 344 is used for positioning the mounting position of the flexible circuit board 34 on the bracket 32. Specifically, the flexible board positioning hole 344 may be disposed on any one or more of the first section 341, the second section 342, or the connecting section 343, in the embodiment shown in fig. 4 and 5, the flexible board positioning hole 344 is disposed on both the first section 341 and the second section 342, the position of the flexible board positioning hole 344 may correspond to the positions of the bracket positioning column 326 and the bracket positioning block 327, when the flexible circuit board 34 is mounted, the first section 341 is attached to the first surface 3211, the flexible board positioning hole 344 is fitted to the bracket positioning column 326, the second section 342 is attached to the second surface 3212, and the flexible board positioning hole 344 is fitted to the bracket positioning block 327, so that the position of the flexible circuit board 34 is not prone to swing.
Referring to fig. 8, in some embodiments, the bracket 32 further includes a fixing protrusion 328, the fixing protrusion 328 protrudes outward from the side wall 3213, and the fixing protrusion 328 is used for fixing the bracket 32. The number of the fixing protrusions 328 may be one or more, and when the number of the fixing protrusions 328 is plural, the plural fixing protrusions 328 may protrude from opposite sides of the side wall 3213. The fixing protrusion 328 is used for fixing the bracket 32, and specifically, the fixing protrusion 328 may be directly fixed to the housing 10 by a fastener, or the bracket 32 and the main board 20 may be jointly fixed to the housing 10 by a fastener. Referring to fig. 1, the fixing protrusion 328 is formed with a fixing hole 3282, and the main board 20 and the front case 11 are formed with a mounting hole at a position corresponding to the fixing hole 3282, so that a fastening member (e.g., a screw) can pass through the fixing hole 3282 and the mounting hole to fix the bracket 32 and the main board 20 on the front case 11. The stability of the mounting of the bracket 32 in the housing 10 is further improved by fixing the bracket 32 by the fixing protrusion 328.
Referring to fig. 9, in some embodiments, the laser projection module 311 includes a substrate assembly 3111, a lens barrel 3112, a light source 3113, a collimating element 3114, a Diffractive Optical Elements (DOE) 3115, and a protective cover 3116.
The substrate assembly 3111 includes a substrate 31111 and a circuit board 31112. A circuit board 31112 is disposed on the substrate 31111, the circuit board 31112 is used for connecting the light source 3113 and the main board 20 of the terminal 100, and the circuit board 31112 may be a hard board, a soft board, or a rigid-flex board.
Lens-barrel 3112 and base plate subassembly 3111 fixed connection, lens-barrel 3112 is formed with holding chamber 31121, and lens-barrel 3112 includes roof 31122 and the annular perisporium 31124 that extends from roof 31122, and perisporium 31124 sets up on base plate subassembly 3111, and roof 31122 offers the logical unthreaded hole 31125 with holding chamber 31121 intercommunication. The peripheral wall 31124 may be connected to the circuit board 31112 by adhesive.
A protective cover 3116 is disposed on the top wall 31122. The protective cover 3116 includes a baffle 31162 with a light exit through hole 31160 and an annular sidewall 31164 extending from the baffle 31162.
The light source 3113 and the collimating element 3114 are both disposed in the accommodating cavity 31121, the diffractive optical element 3115 is mounted on the lens barrel 3112, and the collimating element 3114 and the diffractive optical element 3115 are sequentially disposed on a light emitting path of the light source 3113. The collimating element 3114 collimates the laser light emitted from the light source 3113, and the laser light passes through the collimating element 3114 and then through the diffractive optical element 3115 to form a laser light pattern.
The light source 3113 may be a Vertical Cavity Surface Emitting Laser (VCSEL) or an edge-emitting Laser (EEL), and in the embodiment shown in fig. 9, the light source 3113 is an edge-emitting Laser, and specifically, the light source 3113 may be a distributed feedback Laser (DFB). The light source 3113 is used for emitting laser into the accommodating cavity 31121. Referring to fig. 10, the light source 3113 is columnar as a whole, and a light emitting surface 31131 is formed on one end surface of the light source 3113 away from the substrate assembly 3111, and the laser light is emitted from the light emitting surface 31131, and the light emitting surface 31131 faces the collimating element 3114. The light source 3113 is fixed on the substrate assembly 3111, and specifically, the light source 3113 may be adhered on the substrate assembly 3111 by an adhesive 3117, for example, a surface of the light source 3113 opposite to the light emitting surface 31131 is adhered on the substrate assembly 3111. Referring to fig. 9 and 11, the side surface 31132 of the light source 3113 may be adhered to the substrate assembly 3111, and the sealant 3117 may cover the side surface 31132, or only one surface of the side surface 31132 may be adhered to the substrate assembly 3111 or some surfaces may be adhered to the substrate assembly 3111. The sealant 3117 may be a heat conductive sealant to conduct heat generated by the operation of the light source 3113 to the substrate assembly 3111.
Referring to fig. 9, a diffractive optical element 3115 is carried on the top wall 31122 and housed in a protective cover 3116. Opposite sides of the diffractive optical element 3115 are abutted against the protective cover 3116 and the top wall 31122, respectively, the baffle 31162 includes an abutting surface 31163 adjacent to the light-passing hole 31125, and the diffractive optical element 3115 abuts against the abutting surface 31163.
Specifically, the diffractive optical element 3115 includes opposing diffractive entrance face 31152 and diffractive exit face 31154. The diffractive optical element 3115 is supported on the ceiling wall 31122, the diffractive exit surface 31154 abuts against the surface (abutting surface 31163) of the baffle 31162 near the light-passing hole 31125, and the diffractive entrance surface 31152 abuts against the ceiling wall 362. The light-passing hole 31125 is aligned with the accommodating cavity 31121, and the light-emitting through hole 31160 is aligned with the light-passing hole 31125. The top wall 31122, the annular side wall 31164, and the baffle 31162 interfere with the diffractive optical element 3115, thereby preventing the diffractive optical element 3115 from falling off from the protective cover 3116 in the light exit direction. In some embodiments, the protective cover 3116 is affixed to the top wall 31122 by glue.
The light source 3113 of the laser projection module 311 is a side emitting laser, which has a smaller temperature drift than the VCSEL array, and the side emitting laser is a single-point light emitting structure, so that the array structure is not required to be designed, the manufacturing is simple, and the light source cost of the laser projection module 311 is low.
When the laser of the distributed feedback laser propagates, the gain of power is obtained through the feedback of the grating structure. To improve the power of the distributed feedback laser, the injection current needs to be increased and/or the length of the distributed feedback laser needs to be increased, which may increase the power consumption of the distributed feedback laser and cause serious heat generation. When the light emitting surface 31131 of limit transmission laser instrument was towards collimation component 3114, the limit transmission laser instrument was vertical placing, because the limit transmission laser instrument is the elongated structure, the limit transmission laser instrument appears falling easily, the aversion or rock the scheduling accident, consequently seals through the setting and glues 3117 and can fix the limit transmission laser instrument, prevents that the limit transmission laser instrument from taking place to fall, the displacement or rock the scheduling accident.
Referring to fig. 9 and 12, in some embodiments, the light source 3113 can also be fixed on the substrate assembly 3111 by a fixing method as shown in fig. 12. Specifically, the laser projection module 311 includes a plurality of support blocks 3118, the support blocks 3118 can be fixed on the substrate assembly 3111, the plurality of support blocks 3118 jointly surround the light source 3113, and the light source 3113 can be directly installed between the plurality of support blocks 3118 during installation. In one example, a plurality of support blocks 3118 collectively grip light source 3113 to further prevent light source 3113 from wobbling.
In some embodiments, the protective cover 3116 may be omitted, and the diffractive optical element 3115 may be disposed in the accommodating cavity 31121, and the diffractive exit surface 31154 of the diffractive optical element 3115 may abut against the top wall 31122, so that the laser passes through the diffractive optical element 3115 and then out of the light-passing hole 31125. Thus, the diffractive optical element 3115 is less likely to fall off.
In some embodiments, the substrate 31111 may be omitted and the light source 3113 may be directly fixed on the circuit board 31112 to reduce the overall thickness of the laser projection module 311. In the description of the specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention, which is defined by the claims and their equivalents.

Claims (11)

1. A support is characterized in that the support is of an integrally formed structure and comprises a body, the body comprises a first surface and a second surface which are opposite to each other, the second surface is provided with at least one accommodating cavity, an inner thread is formed on the inner wall of at least one of the accommodating cavities, the first surface is provided with at least one through hole corresponding to at least one of the accommodating cavities, at least one of the accommodating cavities is used for fixedly mounting an input-output module and enabling the input-output module to be exposed from the second surface, the shape of the accommodating cavity corresponds to the shape of the corresponding input-output module, the number of the accommodating cavities is equal to the number of the input-output modules, at least one of the through holes is used for exposing the input-output module from the first surface, and an outer thread is formed on the outer wall of at least one of the input-output modules, the internal thread is used for being combined with the external thread so that the input and output module is installed in the corresponding accommodating cavity.
2. The cradle of claim 1, wherein the input-output module comprises a visible light imaging module and/or an infrared imaging module.
3. The stand of claim 1, wherein the input-output module further comprises a laser projection module and/or a receiver.
4. The carrier in accordance with claim 1, wherein the opening of the through hole is smaller than the corresponding receiving cavity to form a retaining ring, the receiving cavity being formed by the retaining ring and an inner wall extending around the retaining ring.
5. The bracket of claim 1, wherein the body includes a sidewall connecting the first face and the second face, the bracket further including a securing tab projecting outwardly from the sidewall, the securing tab for securing the bracket.
6. The stent of claim 1, wherein the at least one receiving cavity comprises a first cavity, a second cavity, a third cavity and a fourth cavity, the body comprises a side wall, the side wall connects the first surface and the second surface, the side wall comprises a top side wall and a bottom side wall which are opposite to each other, the first cavity, the second cavity, the third cavity and the fourth cavity are arranged in sequence, centers of the first cavity, the second cavity and the fourth cavity are located on a same straight line, and a center of the third cavity is located between the straight line and the bottom side wall.
7. The bracket of claim 6, further comprising a bracket locating block protruding from the second face, the bracket locating block corresponding to a location of the third cavity.
8. An input-output assembly, comprising:
the scaffold of any one of claims 1-7; and
and the outer wall of at least one input/output module in the input/output modules is provided with an external thread, and the external thread is combined with the internal thread so that the input/output module is arranged in the corresponding accommodating cavity.
9. A terminal, comprising:
a housing; and
the input-output assembly of claim 8 mounted within the housing.
10. The terminal according to claim 9, further comprising a main board fixed in the housing, wherein the input/output module is electrically connected to the main board, the main board is formed with a mounting opening, the bracket penetrates through the mounting opening, and the bracket penetrates through the mounting opening and is fixedly connected to the main board.
11. A terminal according to claim 10, wherein the housing comprises a front shell and a rear shell, the front and rear shells abutting the first and second faces respectively to retain the bracket.
CN201810317232.8A 2018-04-10 2018-04-10 Support, input/output assembly and terminal Active CN108390970B (en)

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CN201810317232.8A CN108390970B (en) 2018-04-10 2018-04-10 Support, input/output assembly and terminal
US16/493,286 US11330090B2 (en) 2018-04-10 2019-04-03 Bracket, input/output assembly and terminal
EP19773330.6A EP3609168B1 (en) 2018-04-10 2019-04-03 Support, input/output assembly and terminal
PCT/CN2019/081325 WO2019196726A1 (en) 2018-04-10 2019-04-03 Support, input/output assembly and terminal

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EP3609168B1 (en) 2018-04-10 2023-08-23 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Support, input/output assembly and terminal
CN108600436B (en) * 2018-04-10 2020-02-18 Oppo广东移动通信有限公司 Input/output assembly and terminal
CN109194781B (en) * 2018-08-22 2021-03-09 Oppo广东移动通信有限公司 Support, input/output assembly and mobile device
CN108989507B (en) * 2018-08-22 2020-12-04 Oppo广东移动通信有限公司 Input/output assembly and mobile device
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