WO2020052288A1

WO2020052288A1 - Depth collection module and mobile terminal

Info

Publication number: WO2020052288A1
Application number: PCT/CN2019/090258
Authority: WO
Inventors: 张学勇
Original assignee: Oppo广东移动通信有限公司
Priority date: 2018-09-11
Filing date: 2019-06-06
Publication date: 2020-03-19
Also published as: CN109286806A

Abstract

A depth collection module (20). The depth collection module (20) comprises a first substrate assembly (21), a first optical device (23) and a second optical device (24). The first substrate assembly (21) comprises a first substrate (211), the first substrate (211) being provided with an accommodating groove (2112). The first optical device (23) is provided on the first substrate (211). The second optical device (24) is provided on the first substrate assembly (21), and at least part of the second optical device (24) is accommodated in the accommodating groove (2112).

Description

Deep acquisition module and mobile terminal

Priority information

This application claims the priority and rights of the patent application filed with the State Intellectual Property Office of China on September 11, 2018, with a patent application number of 201811058757.0, which is hereby incorporated by reference in its entirety.

Technical field

The present application relates to the field of three-dimensional imaging technology, and more particularly, to a depth acquisition module and a mobile terminal.

Background technique

Time of flight (TOF) imaging system can calculate the depth information of the measured object by calculating the time difference between the time when the light transmitting device emits the optical signal and the time when the light receiving device receives the optical signal. In order to reduce the flight The overall size of the time imaging system can be set close to the light emitting device and the light receiving device.

Summary of the Invention

The embodiments of the present application provide a depth acquisition module and a mobile terminal.

The depth acquisition module according to the embodiment of the present application includes a first substrate assembly, a first optical device, and a second optical device. The first substrate assembly includes a first substrate, and the first substrate is provided with an accommodation groove. The first optical device is disposed on the first substrate. The second optical device is disposed on the first substrate assembly, and the second optical device is at least partially housed in the accommodation slot.

The mobile terminal according to the embodiment of the present application includes a casing and a depth acquisition module, the depth acquisition module is installed on the casing, and the depth acquisition module includes a first substrate component, a first optical device, and a second optical Device. The first substrate assembly includes a first substrate, and the first substrate is provided with an accommodation groove. The first optical device is disposed on the first substrate. The second optical device is disposed on the first substrate assembly, and the second optical device is at least partially housed in the accommodation slot.

Additional aspects and advantages of the embodiments of the present application will be partially given in the following description, and part of them will become apparent from the following description, or be learned through the practice of the embodiments of the present application.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

FIG. 1 is a schematic perspective structural diagram of a state of a mobile terminal according to some embodiments of the present application; FIG.

2 is a schematic perspective structural diagram of another state of a mobile terminal according to some embodiments of the present application;

FIG. 3 is a perspective structural diagram of a depth acquisition module according to some embodiments of the present application; FIG.

4 is a schematic top view of a depth acquisition module according to some embodiments of the present application;

5 is a schematic bottom view of a depth acquisition module according to some embodiments of the present application;

6 is a schematic side view of a depth acquisition module according to some embodiments of the present application;

7 is a schematic cross-sectional view of the depth acquisition module shown in FIG. 3 along the line VII-VII;

8 is a schematic cross-sectional view of the depth acquisition module shown in FIG. 4 along the line VIII-VIII;

FIG. 9 is an enlarged schematic view of part IX in the depth acquisition module shown in FIG. 8; FIG.

10 is a schematic diagram of a front structure of a depth acquisition module according to some embodiments of the present application when the flexible circuit board is not bent;

11 to 14 are schematic structural diagrams of a light emitter according to some embodiments of the present application.

detailed description

The embodiments of the present application are further described below with reference to the accompanying drawings. The same or similar reference numerals in the drawings represent the same or similar elements or elements having the same or similar functions throughout.

In addition, the embodiments of the present application described below with reference to the drawings are exemplary, and are only used to explain the embodiments of the present application, and should not be construed as limiting the present application.

The depth acquisition module 20 according to the embodiment of the present application includes a first substrate assembly 21, a first optical device 23, and a second optical device 24. The first substrate assembly 21 includes a first substrate 211, and a receiving groove 2112 is defined in the first substrate 211. The first optical device 23 is disposed on the first substrate 211. The second optical device 24 is disposed on the first substrate assembly 21, and the second optical device 24 is at least partially housed in the accommodation groove 2112.

In some embodiments, the receiving groove 2112 penetrates the first substrate 211; or, the receiving groove 2112 partially penetrates the first substrate 211.

In some embodiments, the first optical device 23 is a light transmitter 23, and the light transmitter 23 is used to emit optical signals outward; the second optical device 24 is a light receiver 24, and the light receiver 24 is used to receive the reflected light. The optical signal emitted by the returned optical transmitter 23.

In some embodiments, the depth acquisition module 20 includes a pad 22, the pad 22 is disposed on the first substrate 211, the first optical device 23 is disposed on the first substrate 211, and the first substrate assembly 21 includes a flexible circuit. One end of the board 212 and the flexible circuit board 212 is connected to the first substrate 211 and the other end is connected to the first optical device 23.

In some embodiments, the second optical device 24 includes a casing 241 and an optical element 242 disposed in the casing 241. The casing 241 and the cushion block 22 are an integrally formed structure.

In some embodiments, the light emitter 23 includes a second substrate assembly 231, a light source assembly 232, and a housing 233.

The second substrate assembly 231 is disposed on the pad 22, and the second substrate assembly 231 is connected to the flexible circuit board 212. The light source assembly 232 is disposed on the second substrate assembly 231, and the light source assembly 232 is configured to emit a light signal. The casing 233 is disposed on the second substrate assembly 231. The casing 233 is formed with a receiving space 2331, and the receiving space 2331 is used for receiving the light source module 232.

In some embodiments, the second substrate assembly 231 includes a second substrate 2311 and a reinforcing member 2312. The second substrate 2311 is connected to the flexible circuit board 212. The light source assembly 232 and the reinforcing member 2312 are disposed on opposite sides of the second substrate 2311.

In some embodiments, a first positioning member 2313 is formed on the reinforcing member 2312. The cushion block 22 includes a body 221 and a second positioning member 222. The second positioning member 222 is formed on the body 221. When the second substrate assembly 231 is disposed on the cushion block 22, the first positioning member 2313 cooperates with the second positioning member 222.

In some embodiments, a receiving cavity 223 is defined on a side where the cushion block 22 is combined with the first substrate 211. The depth acquisition module 20 further includes an electronic component 25 disposed on the first substrate 211, and the electronic component 25 is contained in the receiving cavity 223.

In some embodiments, the cushion block 22 is provided with an avoiding through hole 224 communicating with the at least one receiving cavity 223, and at least one electronic component 25 extends into the avoiding through hole 224.

In some embodiments, the cushion block 22 includes a protruding portion 225 protruding from the side edge 2111 of the first substrate 211, and the flexible circuit board 212 is bent around the protruding portion 225.

In some embodiments, the depth acquisition module 20 further includes a connector 26 connected to the first substrate 211. The connector 26 is used to connect the first substrate assembly 21 and an external device. The connector 26 and the flexible circuit board 212 are respectively connected to opposite ends of the first substrate 211.

In some embodiments, the light transmitter 23 and the light receiver 24 are arranged along a straight line L, and the connector 26 and the flexible circuit board 212 are located on opposite sides of the straight line L, respectively.

The mobile terminal 100 according to the embodiment of the present application includes a casing 10 and the depth acquisition module 20 of any one of the foregoing embodiments. The depth acquisition module 20 is mounted on the casing 10.

Please refer to FIGS. 1 and 2. A mobile terminal 100 according to an embodiment of the present application includes a casing 10 and a depth acquisition module 20. The mobile terminal 100 may be a mobile phone, a tablet computer, a game console, a smart watch, a headset device, a drone, etc. The embodiment of the present application is described using the mobile terminal 100 as a mobile phone as an example. It can be understood that the specific form of the mobile terminal 100 is Not limited to mobile phones.

The casing 10 can be used as a mounting carrier for the functional elements of the mobile terminal 100. The casing 10 can provide protection for the functional elements from dust, water, and drop. The functional elements can be the display screen 30, the visible light camera 40, the receiver 50, and the like. .

In the embodiment of the present application, the cabinet 10 includes a main body 11 and a movable support 12. The movable support 12 can move relative to the main body 11 under the driving of a driving device. For example, the movable support 12 can slide relative to the main body 11 to slide. Enter into the main body 11 (as shown in FIG. 1) or slide out from the main body 11 (as shown in FIG. 2). Some functional elements (such as the display 30) can be installed on the main body 11, and other functional elements (such as the depth acquisition module 20, the visible light camera 40, and the receiver 50) can be installed on the movable bracket 12, and the movable bracket 12 can be moved. The other part of the functional element is driven to retract into or protrude from the main body 11. The depth acquisition module 20 is mounted on the casing 10.

Specifically, the casing 10 may be provided with an acquisition window, and the depth acquisition module 20 is installed in alignment with the acquisition window so that the depth acquisition module 20 acquires depth information.

In the embodiment of the present application, the depth acquisition module 20 is installed on the movable bracket 12. When the user needs to use the depth acquisition module 20, the user can trigger the movable bracket 12 to slide out from the main body 11 to drive the depth acquisition module 20. Extending from the main body 11, when the depth acquisition module 20 is not needed, the movable bracket 12 can be triggered to slide into the main body 11 to drive the depth acquisition module 20 to retract into the main body 11.

Of course, FIG. 1 and FIG. 2 are only examples of a specific form of the casing 10, and cannot be understood as a limitation on the casing 10 of the present application. For example, in another example, the acquisition window opened on the casing 10 The depth acquisition module 20 may be fixed and aligned with the acquisition window. In another example, the depth acquisition module 20 is fixed below the display screen 30.

Referring to FIGS. 3 to 6, the depth acquisition module 20 includes a first substrate assembly 21, a first optical device 23 and a second optical device 24. The first substrate assembly 21 includes a first substrate 211, and a receiving groove 2112 is defined in the first substrate 211. The first optical device 23 is disposed on the first substrate 211. The second optical device 24 is disposed on the first substrate assembly 21, and the second optical device 24 is at least partially housed in the accommodation groove 2112.

In the prior art, when the light-emitting device and the light-receiving device are close to each other, since the height difference between the light-emitting device and the light-receiving device may be large, the light emitted by the light-emitting device may be directly irradiated on the housing of the light-receiving device. In this way, the light emitted by the light emitting device cannot be completely irradiated on the measured object, or the external light may be blocked by the light emitting device before entering the light receiving device.

In the mobile terminal 100 according to the embodiment of the present application, since the second optical device 24 is disposed in the accommodation groove 2112, the accommodation groove 2112 can reduce the height of the second optical device 24 relative to the first optical device 23, thereby making the first optical device The height difference between the 23 and the second optical device 24 is reduced to prevent one of the two (the first optical device 23 or the second optical device 24) from being blocked by the other when transmitting or receiving an optical signal.

Specifically, when the first optical device 23 is a light transmitter 23 and the second optical device 24 is a light receiver 24, the light signal emitted by the light transmitter 23 is not easily blocked by the light receiver 24, so that the light signal can be completely illuminated. On the object under test; when the first optical device 23 is a light receiver and the second optical device 24 is a light transmitter, external light signals will not be blocked by the light transmitter before entering the light receiver.

The following description will be made by taking the first optical device 23 as the light transmitter 23 and the second optical device 24 as the light receiver 24 as an example. It can be understood that, in other embodiments, the first optical device 23 may be a light receiver, and the second optical device 24 may be a light transmitter.

Specifically, the depth of the receiving groove 2112 in the first substrate 211 is set according to the height difference between the first optical device 23 and the second optical device 24. When the height difference is large, when the height of the incident surface of the second optical device 24 is high, the receiving groove 2112 can penetrate the first substrate 211, the receiving groove 2112 is hole-shaped, and the depth of the receiving groove 2112 is the same as that of the first substrate 211. Thickness, at this time the second optical device 24 also penetrates the first substrate 211, so that the second optical device 24 is more accommodated in the first substrate 211, and the height between the first optical device 23 and the second optical device 24 is reduced ;

Or the receiving groove 2112 partially passes through the first substrate 211 (as shown in FIG. 7). The receiving groove 2112 is in the shape of a groove. The second optical device 24 may be embedded in the receiving groove 2112, and the receiving groove 2112 is on the first substrate. The depth of 211 is the height at which the second optical device 24 is lowered relative to the first optical device 23. The cross-sectional size of the second optical device 24 may be equal to or slightly smaller than the cross-sectional size of the accommodating groove 2112, so that the second optical device 24 and the accommodating groove 2112 may be stably received in the accommodating groove 2112. Adhesive to each other.

In some embodiments, the depth acquisition module 20 includes a spacer 22, the spacer 22 is disposed on the first substrate 211, the first optical device 23 is disposed on the first substrate, and the first substrate assembly 21 includes a flexible circuit board. 212. The first substrate 211 may be a printed circuit board or a flexible circuit board, and the control circuit of the depth acquisition module 20 may be laid on the first substrate 211. One end of the flexible circuit board 212 can be connected to the first substrate 211, and the flexible circuit board 212 can be bent at a certain angle, so that the relative positions of the devices connected at both ends of the flexible circuit board 212 can be selected.

Please refer to FIG. 3 and FIG. 8. In one example, the pad 22 is in contact with the first substrate 211 and is carried on the first substrate 211. Specifically, the pad 22 may be combined with the first substrate 211 by means of adhesion or the like. The material of the spacer 22 may be metal, plastic, or the like.

In the embodiment of the present application, a surface where the pad 22 is combined with the first substrate 211 may be a flat surface, and a surface opposite to the combined surface of the pad 22 may also be a flat surface, so that when the light emitter 23 is disposed on the pad 22 Has better stability.

Since the light transmitter 23 is disposed on the pad 22, the pad 22 can raise the height of the light transmitter 23, thereby increasing the height of the light emitting surface of the light transmitter 23, and the light signal emitted by the light transmitter 23 cannot be easily received by the light receiver 24. Blocking allows the light signal to be completely irradiated on the object to be measured, so that the light transmitter 23 better cooperates with the light receiver 24 and further reduces the relative height between the light transmitter 23 and the light receiver 24.

The light transmitter 23 is configured to emit an optical signal outwards. Specifically, the light signal may be infrared light, and the light signal may be a lattice spot emitted to the object to be measured. The light signal is emitted from the light transmitter 23 at a certain divergence angle. . The light transmitter 23 is disposed on the spacer 22. In the embodiment of the present application, the light transmitter 23 is disposed on the side of the spacer 22 opposite to the first substrate 211, or in other words, the spacer 22 connects the first substrate 211. The light emitter 23 is spaced apart from the light emitter 23 so that a height difference is formed between the light emitter 23 and the first substrate 211.

The light transmitter 23 is also connected to the flexible circuit board 212. The flexible circuit board 212 is bent, one end of the flexible circuit board 212 is connected to the first substrate 211, and the other end is connected to the light transmitter 23, so that the control signal of the light transmitter 23 is switched from The first substrate 211 is transmitted to the light transmitter 23, or a feedback signal of the light transmitter 23 (for example, time information, frequency information of the light signal emitted by the light transmitter 23, temperature information of the light transmitter 23, etc.) is transmitted to the first Substrate 211.

Please refer to FIG. 3, FIG. 4 and FIG. 6. The optical receiver 24 is configured to receive an optical signal emitted by the reflected optical transmitter 23. The light receiver 24 is disposed in the receiving groove 2112 of the first substrate 211.

Specifically, the light receiver 24 includes a housing 241 and an optical element 242. The housing 241 is disposed on the first substrate 211, and the second optical device 24 is at least partially accommodated in the accommodation groove 2112. It can be understood that the housing 241 is at least partially accommodated in the accommodation groove 2112, and when the accommodation groove 2112 partially passes through For the first substrate 211, the casing 241 may be embedded in the first substrate 211; or when the accommodation groove 2112 penetrates the first substrate 211, the casing 241 may be embedded in or penetrated through the first substrate 211. The optical element 242 is disposed on the casing 241. The casing 241 may be a lens holder and a lens barrel of the light receiver 24, and the optical element 242 may be an element such as a lens disposed in the casing 241.

Further, the light receiver 24 may further include a photosensitive chip (not shown). The optical signal reflected by the measured object is irradiated into the photosensitive chip through the optical element 242, and the photosensitive chip responds to the optical signal. The depth acquisition module 20 calculates the time difference between the light signal emitted by the light transmitter 23 and the light sensor receiving the light signal reflected by the measured object, and further obtains the depth information of the measured object. The depth information can be used for ranging, For generating depth images or for 3D modeling.

In the embodiment of the present application, the housing 241 and the cushion block 22 are integrally connected.

Specifically, the casing 241 and the cushion block 22 may be integrally formed, and the casing 241 and the cushion block 22 may be mounted on the first substrate 211 together. For example, the material of the housing 241 and the spacer 22 are integrally formed by injection molding, cutting, or the like; or the materials of the housing 241 and the spacer 22 are different, and the two are integrally formed by two-color injection molding. This facilitates installation and improves the integrity of the depth acquisition module 20 and the stability and compactness of the structure.

In addition, the casing 241 and the cushion block 22 may be separately formed, and the two form a matching structure. When assembling the depth acquisition module 20, the casing 241 and the cushion block 22 may be connected into a whole, and then jointly disposed in On the first substrate 211, one of the housing 241 and the pad 22 may be disposed on the first substrate 211, and then the other is disposed on the first substrate 211 and connected together.

In the mobile terminal 100 according to the embodiment of the present application, since the light emitter 23 is disposed on the pad 22, the pad 22 can raise the height of the light emitter 23, thereby increasing the height of the light emitting surface of the light emitter 23, and the light emitter 23 The emitted light signal is not easily blocked by the light receiver 24, so that the light signal can be completely irradiated on the measured object. The exit surface of the light transmitter 23 may be flush with the entrance surface of the light receiver 24, or the exit surface of the light transmitter 23 may be slightly lower than the entrance surface of the light receiver 24, or it may be the exit surface of the light transmitter 23 Slightly higher than the incident surface of the light receiver 24.

Specifically, the height of the exit surface of the light emitter 23 and the height of the incident surface of the light receiver 24 can be adjusted by adjusting the height of the spacer 22 and the depth of the receiving groove 2112 on the first substrate 211, respectively.

For example, if the height of the pad 22 is raised or lowered, the exit surface of the light emitter 23 is raised or lowered accordingly. When the receiving groove 2112 partially penetrates the substrate 211, receiving grooves 2112 of different depths are opened. At this time, the light receiving The height of the device 24 relative to the first substrate 211 changes with the depth;

When the accommodation groove 2112 completely penetrates the first substrate 211, the depth of the accommodation groove 2112 relative to the first substrate 211 is fixed at this time, which is the thickness of the first substrate 211. The light receiver 24 accommodated in the accommodation groove 2112 is also The first substrate 211 may be inserted. At this time, the relative height between the light emitter 23 and the light receiver 24 is affected by how much the light receiver 24 penetrates the first substrate 211.

Please refer to FIG. 5 and FIG. 8. In some embodiments, the first substrate assembly 21 further includes a reinforcing plate 213. The reinforcing plate 213 is coupled to a side of the first substrate 211 opposite to the pad 22. The reinforcing plate 213 may cover one side of the first substrate 211, and the reinforcing plate 213 may be used to increase the strength of the first substrate 211 and prevent deformation of the first substrate 211.

In addition, the reinforcing plate 213 may be made of a conductive material, such as a metal or an alloy. When the depth acquisition module 20 is installed on the mobile terminal 100, the reinforcing plate 213 may be electrically connected to the casing 10 to make the reinforcing plate 213. Grounding and effectively reducing the interference of the static electricity of external components on the depth acquisition module 20.

Referring to FIGS. 8 to 10, in some embodiments, the cushion block 22 includes a protruding portion 225 protruding from the side edge 2111 of the first substrate 211, and the flexible circuit board 212 is bent around the protruding portion 225.

Specifically, a part of the cushion block 22 is directly carried on the first substrate 211, and another part is not in direct contact with the first substrate 211, and protrudes from the side edge 2111 of the first substrate 211 to form a protruding portion 225. The flexible circuit board 212 may be connected to the side edge 2111, and the flexible circuit board 212 is bent around the protrusion 225, or the flexible circuit board 212 is bent so that the protrusion 225 is located in a space surrounded by the flexible circuit board 212. Inside, when the flexible circuit board 212 is subjected to an external force, the flexible circuit board 212 will not collapse inward and cause excessive bending, which will cause damage to the flexible circuit board 212.

Further, as shown in FIG. 9, in some embodiments, the outer surface 2251 of the protruding portion 225 is a smooth curved surface (such as the outer surface of a cylinder, etc.), that is, the outer surface 2251 of the protruding portion 225 does not form a curvature. Suddenly, even if the flexible circuit board 212 is bent over the outer side 2251 of the protruding portion 225, the degree of bending of the flexible circuit board 212 will not be too large, which further ensures the integrity of the flexible circuit board 212.

Please refer to FIGS. 3 to 5. In some embodiments, the depth acquisition module 20 further includes a connector 26 connected to the first substrate 211.

The connector 26 is used to connect the first substrate assembly 21 and an external device. The connector 26 and the flexible circuit board 212 are respectively connected to opposite ends of the first substrate 211. The connector 26 may be a connection base or a connector. When the depth acquisition module 20 is installed in the casing 10, the connector 26 may be connected to the motherboard of the mobile terminal 100 so that the depth acquisition module 20 is electrically connected to the motherboard. The connector 26 and the flexible circuit board 212 are respectively connected to opposite ends of the first substrate 211. For example, the connectors 26 and the flexible circuit board 212 may be respectively connected to the left and right ends of the first substrate 211, or respectively connected to the front and rear ends of the first substrate 211.

Please refer to FIGS. 4 and 5. In some embodiments, the light transmitter 23 and the light receiver 24 are arranged along a straight line L, and the connector 26 and the flexible circuit board 212 are located on opposite sides of the straight line L, respectively.

It can be understood that, since the light transmitter 23 and the light receiver 24 are arranged in an array, the size of the depth acquisition module 20 may be larger in the direction of the straight line L. The connector 26 and the flexible circuit board 212 are respectively disposed on opposite sides of the straight line L, which will not increase the size of the depth acquisition module 20 in the direction of the straight line L, thereby facilitating the installation of the depth acquisition module 20 on the mobile terminal 100. On the chassis 10.

Referring to FIGS. 8 and 9, in some embodiments, a receiving cavity 223 is defined on a side where the cushion block 22 is combined with the first substrate 211. The depth acquisition module 20 further includes an electronic component 25 disposed on the first substrate 211, and the electronic component 25 is contained in the receiving cavity 223.

Specifically, the electronic component 25 may be a capacitor, an inductor, a transistor, a resistor, or the like. The electronic component 25 may be electrically connected to a control line laid on the first substrate 211 and used to drive or control the light transmitter 23 or the light receiver 24. jobs. The electronic component 25 is contained in the containing cavity 223, and the space in the pad 22 is used reasonably. It is not necessary to increase the width of the first substrate 211 to set the electronic component 25, which is beneficial to reducing the overall size of the depth acquisition module 20.

The number of the receiving cavities 223 may be one or more, and the plurality of receiving cavities 223 may be spaced apart from each other. When the pad 22 is installed, the positions of the receiving cavity 223 and the electronic component 25 may be aligned and the pad 22 may be disposed at On the first substrate 211.

Referring to FIG. 8 and FIG. 10, in some embodiments, the cushion block 22 is provided with an avoiding through hole 224 communicating with at least one receiving cavity 223, and at least one electronic component 25 extends into the avoiding through hole 224.

It can be understood that when the electronic component 25 needs to be contained in the containing cavity 223, the height of the electronic component 25 is required to be not higher than the height of the containing cavity 223. For the electronic component 25 having a height higher than the receiving cavity 223, an avoiding through hole 224 corresponding to the receiving cavity 223 may be provided, and the electronic component 25 may partially extend into the avoiding through hole 224, so as not to increase the height of the spacer 22 The electronic component 25 is arranged.

Referring to FIG. 8, in some embodiments, the light emitter 23 includes a second substrate assembly 231, a light source assembly 232, and a housing 233.

The second substrate assembly 231 is disposed on the pad 22, and the second substrate assembly 231 is connected to the flexible circuit board 212. The light source assembly 232 is disposed on the second substrate assembly 231, and the light source assembly 232 is configured to emit a light signal. The casing 233 is disposed on the second substrate assembly 231. The casing 233 is formed with a receiving space 2331. The receiving space 2331 can be used for receiving the light source module 232. The flexible circuit board 212 may be detachably connected to the second substrate assembly 231. The light source assembly 232 is electrically connected to the second substrate assembly 231. The casing 233 may be bowl-shaped as a whole, and the opening of the casing 233 is disposed on the second substrate assembly 231 downwardly, so as to receive the light source assembly 232 in the accommodation space 2331.

In the embodiment of the present application, a light outlet 2332 corresponding to the light source component 232 is provided on the housing 233. The optical signal emitted from the light source component 232 passes through the light outlet 2332 and is emitted. The light signal can pass directly through the light outlet 2332. It can also pass through the optical outlet 2332 after changing the optical path through other optical devices.

Please continue to refer to FIG. 8. In some embodiments, the second substrate assembly 231 includes a second substrate 2311 and a reinforcing member 2312. The second substrate 2311 is connected to the flexible circuit board 212. The light source assembly 232 and the reinforcing member 2312 are disposed on opposite sides of the second substrate 2311.

Specifically, the specific type of the second substrate 2311 may be a printed circuit board or a flexible circuit board, and a control circuit may be laid on the second substrate 2311. The reinforcing member 2312 may be fixedly connected to the second substrate 2311 by means of gluing, riveting, or the like. The reinforcing member 2312 may increase the overall strength of the second substrate assembly 231. When the light emitter 23 is disposed on the spacer 22, the reinforcing member 2312 can directly contact the spacer 22, the second substrate 2311 is not exposed to the outside, and does not need to be in direct contact with the spacer 22, and the second substrate 2311 is not easily affected. Contamination by dust, etc.

In the embodiment shown in FIG. 8, the reinforcing member 2312 and the cushion block 22 are formed separately.

When assembling the depth acquisition module 20, the spacer 22 may be first mounted on the first substrate 211. At this time, the two ends of the flexible circuit board 212 are respectively connected to the first substrate 211 and the second substrate 2311, and the flexible circuit board 212 may Do not bend first (state shown in Fig. 10). The flexible circuit board 212 is then bent, so that the reinforcing member 2312 is disposed on the cushion block 22.

Of course, in other embodiments, the reinforcing member 2312 and the spacer 22 may be integrally formed, for example, integrally formed by a process such as injection molding. When assembling the depth acquisition module 20, the spacer 22 and the light emitter 23 may be installed together. On the first substrate 211.

Referring to FIG. 10, in some embodiments, a first positioning member 2313 is formed on the reinforcing member 2312. The cushion block 22 includes a body 221 and a second positioning member 222. The second positioning member 222 is formed on the body 221. When the second substrate assembly 231 is disposed on the cushion block 22, the first positioning member 2313 cooperates with the second positioning member 222.

Specifically, after the first positioning member 2313 cooperates with the second positioning member 222, the relative movement between the second substrate assembly 231 and the cushion block 22 can be effectively restricted. The specific types of the first positioning member 2313 and the second positioning member 222 can be selected according to needs. For example, the first positioning member 2313 is a positioning hole formed in the reinforcing member 2312, and the second positioning member 222 is a positioning column. Extend into the positioning hole so that the first positioning member 2313 and the second positioning member 222 cooperate with each other;

Alternatively, the first positioning member 2313 is a positioning post formed on the reinforcing member 2312, the second positioning member 222 is a positioning hole, and the positioning post extends into the positioning hole so that the first positioning member 2313 and the second positioning member 222 cooperate with each other;

Or the number of the first positioning member 2313 and the second positioning member 222 are multiple, part of the first positioning member 2313 is a positioning hole, part of the second positioning member 222 is a positioning column, part of the first positioning member 2313 is a positioning column, part The second positioning member 222 is a positioning hole, and the positioning post projects into the positioning hole so that the first positioning member 2313 and the second positioning member 222 cooperate with each other.

The structure of the light source component 232 will be described as an example below:

Referring to FIG. 11, the light source assembly 232 includes a light source 60, a lens barrel 70, a diffuser 80 and a protective cover 90. The light source 60 is connected to the second substrate assembly 231. The lens barrel 70 includes a first surface 71 and a second surface 72 opposite to each other. The lens barrel 11 defines a storage cavity 75 penetrating the first surface 71 and the second surface 72. The first surface 71 is recessed toward the second surface 72 to form a mounting groove 76 communicating with the storage cavity 75. The diffuser 80 is installed in the mounting groove 76. The protective cover 90 is mounted on the side where the first surface 71 of the lens barrel 70 is located, and the diffuser 80 is sandwiched between the protective cover 90 and the bottom surface 77 of the mounting groove 76.

The protective cover 90 can be mounted on the lens barrel 70 by means of screw connection, engagement, and fastener connection. For example, referring to FIG. 11, when the protective cover 90 includes a top wall 91 and a protective side wall 92, the protective cover 90 (protective side wall 92) is provided with internal threads and the lens barrel 70 is provided with external threads. At this time, the protective cover The internal thread of 90 is screwed with the external thread of the lens barrel 70 to mount the protective cover 90 on the lens barrel 70;

Alternatively, please refer to FIG. 12, when the protective cover 90 includes a top wall 91, the protective cover 90 (top wall 91) is provided with a locking hole 95, an end of the lens barrel 70 is provided with a hook 73, and when the protective cover 90 is provided on the mirror When the tube 70 is on, the hook 73 is inserted into the hole 95 so that the protective cover 90 is mounted on the lens barrel 70;

Alternatively, please refer to FIG. 13, when the protective cover 90 includes a top wall 91 and a protective side wall 92, the protective cover 90 (protective side wall 92) is provided with a locking hole 95, and the lens barrel 70 is provided with a hook 73. When 90 is disposed on the lens barrel 70, the hook 73 is inserted into the hole 95 so that the protective cover 90 is mounted on the lens barrel 70;

Alternatively, referring to FIG. 14, when the protective cover 90 includes the top wall 91, the end of the lens barrel 70 is provided with a first positioning hole 74, and the protective cover 90 (top wall 91) is provided with a corresponding positioning hole 74. The second positioning hole 93 and the fastener 94 pass through the second positioning hole 93 and are locked in the first positioning hole 74 to mount the protective cover 90 on the lens barrel 70. When the protective cover 90 is mounted on the lens barrel 70, the protective cover 90 is in contact with the diffuser 80 and the diffuser 80 is in contact with the bottom surface 77, so that the diffuser 80 is sandwiched between the protective cover 90 and the bottom surface 77.

The light source assembly 232 is provided with a mounting groove 76 on the lens barrel 70 and the diffuser 80 is installed in the mounting groove 76, and is mounted on the lens barrel 70 through a protective cover 90 to clamp the diffuser 80 between the protective cover 90 and the installation. Between the bottom surfaces 77 of the grooves 76, the diffuser 80 is actually fixed to the lens barrel 70. Furthermore, the glue is not used to fix the diffuser 80 on the lens barrel 70, so that the glue can be solidified on the surface of the diffuser 80 and the microstructure of the diffuser 80 can be avoided after the glue volatilizes. When too much, the diffuser 80 falls off the lens barrel 70.

In the description of this specification, reference is made to the terms "certain embodiments", "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" The description means that a specific feature, structure, material, or characteristic described in combination with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same implementation or example. Moreover, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more implementations or examples.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "plurality" is at least two, for example, two, three, unless specifically defined otherwise.

Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limitations on the present application. Those skilled in the art can interpret the above within the scope of the present application. The embodiments are subject to change, modification, replacement, and modification, and the scope of the present application is defined by the claims and their equivalents.

Claims

A deep acquisition module is characterized in that it includes:

A first substrate assembly, the first substrate assembly including a first substrate, and the first substrate is provided with an accommodation slot;

A first optical device, the first optical device being disposed on the first substrate; and

A second optical device, the second optical device is disposed on the first substrate assembly, and the second optical device is at least partially housed in the accommodation slot.
The depth acquisition module according to claim 1, wherein the accommodation groove penetrates the first substrate; or the accommodation groove partially penetrates the first substrate.
The depth acquisition module according to claim 1, wherein the first optical device is a light transmitter, and the light transmitter is configured to emit an optical signal outward; and the second optical device is a light receiver, The optical receiver is configured to receive an optical signal emitted by the optical transmitter which is reflected back.
The depth acquisition module according to claim 3, wherein the depth acquisition module further comprises a pad, the pad is disposed on the first substrate, and the first optical device is disposed on the first substrate. On the pad, the first substrate assembly further includes a flexible circuit board, one end of the flexible circuit board is connected to the first substrate, and the other end is connected to the first optical device.
The depth acquisition module according to claim 4, wherein the second optical device comprises a housing and an optical element disposed in the housing, and the housing and the pad are an integrally formed structure.
The depth acquisition module according to claim 4, wherein the first optical device comprises:

A second substrate assembly, the second substrate assembly is disposed on a pad, and the second substrate assembly is connected to the flexible circuit board;

A light source assembly disposed on the second substrate assembly, the light source assembly being configured to emit the optical signal; and

A casing provided on the second substrate assembly, and the casing is formed with a receiving space to receive the light source assembly.
The depth acquisition module according to claim 6, wherein the second substrate assembly includes a second substrate and a reinforcing member, the second substrate is connected to the flexible circuit board, the light source assembly and the The reinforcing members are disposed on opposite sides of the second substrate.
The depth acquisition module according to claim 7, wherein a first positioning member is formed on the reinforcing member, and the pad includes a main body and a second positioning member formed on the main body, wherein When the second substrate assembly is disposed on the pad, the first positioning member cooperates with the second positioning member.
The depth acquisition module according to claim 4, wherein a receiving cavity is provided on a side where the pad is combined with the first substrate, and the depth acquisition module further comprises a first substrate The electronic components are housed in the receiving cavity.
The depth acquisition module according to claim 9, wherein the cushion block is provided with an avoidance through-hole communicating with at least one of the receiving cavities, and at least one of the electronic components extends into the avoidance through-hole.
The depth acquisition module according to claim 4, wherein the pad includes a protruding portion protruding from a side edge of the first substrate, and the flexible circuit board is bent and disposed around the protruding portion .
The depth acquisition module according to claim 4, wherein the depth acquisition module further comprises a connector connected to the first substrate and used to connect the first substrate component and an external Equipment, the connector and the flexible circuit board are respectively connected at opposite ends of the first substrate.
The depth acquisition module according to claim 12, wherein the light emitter and the light receiver are arranged along a straight line, and the connector and the flexible circuit board are located at opposite sides of the straight line, respectively. On both sides.
A mobile terminal is characterized by comprising a casing and a depth acquisition module, wherein the depth acquisition module is installed on the casing; the depth acquisition module includes:

A first substrate assembly, the first substrate assembly including a first substrate, and the first substrate is provided with an accommodation slot;

A first optical device, the first optical device being disposed on the first substrate; and

A second optical device, the second optical device is disposed on the first substrate assembly, and the second optical device is at least partially housed in the accommodation slot.
The mobile terminal according to claim 14, wherein the accommodation groove penetrates the first substrate; or the accommodation groove partially penetrates the first substrate.
The mobile terminal according to claim 14, wherein the first optical device is a light transmitter, and the light transmitter is used to emit an optical signal outward; the second optical device is a light receiver, and the The light receiver is used for receiving an optical signal emitted by the light transmitter which is reflected back.
The mobile terminal according to claim 16, wherein the depth acquisition module further comprises a pad, the pad is disposed on the first substrate, and the first optical device is disposed on the pad Preferably, the first substrate assembly further includes a flexible circuit board, one end of the flexible circuit board is connected to the first substrate, and the other end is connected to the first optical device.
The mobile terminal according to claim 17, wherein the second optical device comprises a housing and an optical element disposed in the housing, and the housing and the pad are an integrally formed structure.
The mobile terminal according to claim 17, wherein the first optical device comprises:

A second substrate assembly, the second substrate assembly is disposed on a pad, and the second substrate assembly is connected to the flexible circuit board;

A light source assembly disposed on the second substrate assembly, the light source assembly being configured to emit the optical signal; and

A casing provided on the second substrate assembly, and the casing is formed with a receiving space to receive the light source assembly.
The mobile terminal according to claim 19, wherein the second substrate assembly comprises a second substrate and a reinforcing member, the second substrate is connected to the flexible circuit board, the light source assembly and the reinforcement The strong members are disposed on opposite sides of the second substrate.
The mobile terminal according to claim 20, wherein a first positioning member is formed on the reinforcing member, the pad includes a main body and a second positioning member formed on the main body, and the second When the substrate assembly is disposed on the pad, the first positioning member cooperates with the second positioning member.
The mobile terminal according to claim 17, wherein a receiving cavity is provided on a side where the pad is combined with the first substrate, and the depth acquisition module further comprises a An electronic component is contained in the containing cavity.
The mobile terminal according to claim 22, wherein the cushion block is provided with an avoidance through-hole communicating with at least one of the receiving cavities, and at least one of the electronic components extends into the avoidance through-hole.
The mobile terminal according to claim 17, wherein the pad includes a protruding portion protruding from a side edge of the first substrate, and the flexible circuit board is bent around the protruding portion.
The depth acquisition module according to claim 17, wherein the depth acquisition module further comprises a connector connected to the first substrate and used to connect the first substrate component and an external Equipment, the connector and the flexible circuit board are respectively connected at opposite ends of the first substrate.
The mobile terminal according to claim 25, wherein the light transmitter and the light receiver are arranged along a straight line, and the connector and the flexible circuit board are respectively located on two opposite sides of the straight line. side.