CN109039461A - Depth acquires mould group and electronic equipment - Google Patents
Depth acquires mould group and electronic equipment Download PDFInfo
- Publication number
- CN109039461A CN109039461A CN201810962803.3A CN201810962803A CN109039461A CN 109039461 A CN109039461 A CN 109039461A CN 201810962803 A CN201810962803 A CN 201810962803A CN 109039461 A CN109039461 A CN 109039461A
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- Prior art keywords
- substrate
- mould group
- cushion block
- optical
- depth
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/11—Arrangements specific to free-space transmission, i.e. transmission through air or vacuum
- H04B10/114—Indoor or close-range type systems
- H04B10/116—Visible light communication
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Optical Couplings Of Light Guides (AREA)
- Endoscopes (AREA)
Abstract
The invention discloses a kind of depth to acquire mould group.It includes first substrate component, cushion block, the first optical device and the second optical device that depth, which acquires mould group,.First substrate component includes the first substrate and flexible circuit board interconnected.Cushion block is arranged on the first substrate, and cushion block includes the protrusion for stretching out the side edge of first substrate.First optical device is arranged on cushion block.Flexible circuit board is bent around protrusion to be arranged, and one end of flexible circuit board connects first substrate, and the other end connects the first optical device.Second optical device is arranged on the first substrate.The invention also discloses a kind of electronic equipment.Since the first optical device is arranged on cushion block, cushion block, so that the difference in height of the first optical device and the second optical device reduces, can be avoided in the two transmitting or blocked when receiving optical signal by another with the height of padded first optical device.
Description
Technical field
The present invention relates to 3 dimension imaging technology fields, more specifically, are related to a kind of depth acquisition mould group and electronic equipment.
Background technique
Flight time (time of flight, TOF) imaging system can emit optical signal by calculating light emitting devices
Moment, at the time of receiving optical signal with optical receiver apparatus between time difference calculate the depth information of testee, in order to
The overall dimensions for reducing flight time imaging system, light emitting devices and optical receiver apparatus can be arranged close to, however, working as light
When emitter and optical receiver apparatus are leaned on closer, since the difference in height of light emitting devices and optical receiver apparatus may larger, light
Emitter transmitting light may direct irradiation on the shell of optical receiver apparatus, cause light emitting devices emit light cannot
It is irradiated on testee completely, or extraneous light may be stopped before entering optical receiver apparatus by light emitting devices.
Summary of the invention
Embodiment of the present invention provides a kind of depth acquisition mould group and electronic equipment.
The depth acquisition mould group of embodiment of the present invention includes first substrate component, cushion block, the first optical device and second
Optical device.The first substrate component includes the first substrate and flexible circuit board interconnected.The cushion block is arranged in institute
It states on first substrate, the cushion block includes the protrusion for stretching out the side edge of the first substrate.First optical device is set
It sets on the cushion block, the flexible circuit board is bent around the protrusion to be arranged, and one end connection of the flexible circuit board
The first substrate, the other end connect first optical device.The second optical device setting is on the first substrate.
In some embodiments, the lateral surface of the protrusion is smooth curved surface.
In some embodiments, first optical device is optical transmitting set, and the optical transmitting set is for launching outward
Optical signal, second optical device are optical receiver, and the optical receiver is for receiving the optical transmitting set being reflected back toward
The optical signal of transmitting.
In some embodiments, the optical transmitting set includes the second substrate component, light source assembly and shell.Described second
Board unit is arranged on the cushion block, and the second substrate component is connect with the flexible circuit board.The light source assembly is set
It sets on the second substrate component, the light source assembly is for emitting the optical signal.The shell is arranged described second
On board unit, the shell is formed with accommodating space to accommodate the light source assembly.
In some embodiments, the second substrate component includes the second substrate and reinforcing member, the second substrate with
The opposite two sides of the second substrate are arranged in the flexible circuit board connection, the light source assembly and the reinforcing member.
In some embodiments, the reinforcing member and the cushion block are integrally formed；Or the reinforcing member and the cushion block
Fission molding.
In some embodiments, the first locating piece is formed on the reinforcing member, the cushion block includes ontology and formation
The second locating piece on the body, the second substrate component are arranged when on the cushion block, first locating piece with
The second locating piece cooperation.
In some embodiments, side of the cushion block in conjunction with the first substrate offers accommodating chamber, the depth
Degree acquisition mould group further includes the electronic component of setting on the first substrate, and the electronic component is housed in the accommodating chamber
It is interior.
In some embodiments, the cushion block offers the evacuation through-hole being connected to accommodating chamber described at least one, until
A few electronic component protrudes into the evacuation through-hole.
In some embodiments, the first substrate component further includes stiffening plate, and the stiffening plate is incorporated in described
The side opposite with the cushion block of one substrate.
In some embodiments, depth acquisition mould group further includes connector, and the connector is connected to described the
On one substrate, and for connecting the first substrate component and external equipment, the connector is located at the protrusion
The opposite both ends of the first substrate.
In some embodiments, the optical transmitting set arranges along a straight line with the optical receiver, the connector with
Protrusion is located at the opposite two sides of the straight line.
The electronic equipment of embodiment of the present invention includes the acquisition mould group of depth described in casing and any of the above-described embodiment.
The depth acquisition mould group installation is on the housing.
In the depth acquisition mould group and electronic equipment of embodiment of the present invention, since the first optical device is arranged in cushion block
On, cushion block can be with the height of padded first optical device, so that the difference in height of the first optical device and the second optical device
Reduce, avoid in the two transmitting or is blocked when receiving optical signal by another.In addition, since flexible circuit board is around protrusion
Portion's bending setting, when effect of the flexible circuit board by external force, flexible circuit board will not inwardly collapse and cause the journey of bending
It spends greatly, flexible circuit board is caused to damage.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partially will be from following
Description in become obvious, or the practice of embodiment through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect and advantage of the invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the schematic perspective view of a state of the electronic equipment of certain embodiments of the present invention；
Fig. 2 is the schematic perspective view of another state of the electronic equipment of certain embodiments of the present invention；
Fig. 3 is the schematic perspective view of the depth acquisition mould group of certain embodiments of the present invention；
Fig. 4 is the schematic top plan view of the depth acquisition mould group of certain embodiments of the present invention；
Fig. 5 is the elevational schematic view of the depth acquisition mould group of certain embodiments of the present invention；
Fig. 6 is the schematic side view of the depth acquisition mould group of certain embodiments of the present invention；
Fig. 7 is schematic cross-section of the depth acquisition mould group shown in Fig. 4 along VII-VII line；
Fig. 8 is the enlarged diagram of the part VIII in depth acquisition mould group shown in Fig. 7；
Fig. 9 is that Facad structure of the depth acquisition mould group of certain embodiments of the present invention when flexible circuit board is not bent shows
It is intended to；
Figure 10 to Figure 13 is the structural schematic diagram of the optical transmitting set of certain embodiments of the present invention.
Specific embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the same or similar element of expression or element with the same or similar functions eventually.
In addition, the embodiments of the present invention described with reference to the accompanying drawing are exemplary, for explaining only the invention
Embodiment, and be not considered as limiting the invention.
Fig. 1 and Fig. 2 is please referred to, the electronic equipment 100 of embodiment of the present invention includes that casing 10 and depth acquire mould group 20.
Electronic equipment 100 can be mobile phone, tablet computer, game machine, smartwatch, head and show equipment, unmanned plane etc., embodiment party of the present invention
Formula is illustrated so that electronic equipment 100 is mobile phone as an example, it will be understood that the concrete form of electronic equipment 100 is not limited to mobile phone.
Casing 10 can be used as the installation carrier of the function element of electronic equipment 100, and casing 10 can mention for function element
For the protection of dust-proof, waterproof, shatter-resistant etc., function element can be display screen 30 or visible image capturing head 40, receiver 50 etc..
In embodiments of the present invention, casing 10 includes main body 11 and movable support 12, and movable support 12 under the drive of the drive may be used
To move relative to main body 11, such as movable support 12 can be slided relative to main body 11, to slide into main body 11 (as shown in Figure 1)
Inside skids off (as shown in Figure 2) from main body 11.Partial function element (such as display screen 30) may be mounted in main body 11,
Another part function element (such as depth acquires mould group 20, visible image capturing head 40, receiver 50) may be mounted at movable branch
On frame 12, the movement of movable support 12 can drive another part function element to retract in main body 11 or stretch out from main body 11.
Depth acquisition mould group 20 is mounted on casing 10.Specifically, acquisition window can be offered on casing 10, depth is adopted
Collection mould group 20 is aligned with acquisition window to be installed so that depth acquires 20 sampling depth information of mould group.In embodiments of the present invention, deep
Degree acquisition mould group 20 is mounted on movable support 12, and user can trigger movable branch when needing to acquire mould group 20 using depth
Frame 12 drives depth acquisition mould group 20 to stretch out from main body 11 from skidding off in main body 11, is not needing to acquire mould group using depth
When 20, movable support 12 can be triggered and slide into main body 11 to drive depth acquisition mould group 20 to be retracted into main body 11.Certainly, Fig. 1
And be only citing to a kind of concrete form of casing 10 shown in Fig. 2, it should not be understood as the limitation to casing 10 of the invention, example
Such as in another example, the acquisition window opened up on casing 10 can be fixed, and the depth acquisition fixation of mould group 20 is set
It sets and is aligned with acquisition window；In another example, depth acquisition mould group 20 is fixed at the lower section of display screen 30.
Fig. 3 to Fig. 6 is please referred to, it includes first substrate component 21, cushion block 22, the first optical device 23 that depth, which acquires mould group 20,
And second optical device 24.First substrate component 21 includes the first substrate 211 and flexible circuit board 212 interconnected.Cushion block
22 are arranged on first substrate 211, and cushion block 22 includes the protrusion for stretching out the side edge 2111 (such as Fig. 8) of first substrate 211
225.First optical device 23 is arranged on cushion block 22.Flexible circuit board 212 is bent around protrusion 225 to be arranged, and flexible circuit
One end of plate 212 connects first substrate 211, and the other end connects the first optical device 23.Second optical device 24 is arranged first
On substrate 211.
In the electronic equipment 100 of embodiment of the present invention, since the first optical device 23 is arranged on cushion block 22, cushion block 22
It can be with the height of padded first optical device 23, so that the height subtractive of the first optical device 23 and the second optical device 24
It is small, by another when avoiding a transmitting in the two (the first optical device 23 and the second optical device 24) or receiving optical signal
It blocks.When the first optical device 23 is optical transmitting set 23, and the second optical device 24 is optical receiver 24, optical transmitting set 23 emits
Optical signal be not easy to be blocked by optical receiver 24, optical signal is irradiated on testee completely；When the first optics device
Part 23 is optical receiver, and when the second optical device 24 is optical transmitting set, extraneous optical signal, will not be by before entering optical receiver
Optical transmitting set stops.In addition, being arranged since flexible circuit board 212 is bent around protrusion 225, when flexible circuit board 212 is by outer
When the effect of power, flexible circuit board 212 will not be collapsed inwardly and cause the degree of bending excessive, and flexible circuit board 212 is caused to damage
It is bad.
Below will with the first optical device 23 be optical transmitting set 23, the second optical device 24 be optical receiver 24 for carry out
It illustrates.It is appreciated that in other embodiments, the first optical device 23 can be optical receiver, the second optical device
24 can be optical transmitting set.Due to optical transmitting set 23 be arranged on cushion block 22, cushion block 22 can with the height of padded optical transmitting set 23,
And then the height of the exit facet of optical transmitting set 23 is improved, the optical signal that optical transmitting set 23 emits is not easy to be blocked by optical receiver 24,
Optical signal is irradiated on testee completely.
Specifically, first substrate component 21 includes first substrate 211 and flexible circuit board 212.First substrate 211 can be
Printed wiring board or flexible circuit board can be equipped with the control route etc. of depth acquisition mould group 20 on first substrate 211.It is flexible
One end of circuit board 212 can connect on first substrate 211, and the bending of certain angle can occur for flexible circuit board 212, make
The relative position for obtaining the device of 212 both ends of flexible circuit board connection can have compared with more options.
Fig. 3 and Fig. 7 is please referred to, cushion block 22 is arranged on first substrate 211.In one example, cushion block 22 and the first base
Plate 211 is contacted and is carried on first substrate 211, and specifically, cushion block 22 can pass through the modes such as gluing and 211 knot of first substrate
It closes.The material of cushion block 22 can be metal, plastics etc..In embodiments of the present invention, the face that cushion block 22 is combined with first substrate 211
It can be plane, the opposite face in face of the cushion block 22 in conjunction with this is also possible to plane, so that optical transmitting set 23 is arranged in cushion block 22
There is preferable stationarity when upper.
Please refer to Fig. 7 and Fig. 8, a part of cushion block 22 is directly carried on first substrate 211, and another part is not with first
Substrate 211 directly contacts, and the stretching of side edge 2111 of opposite first substrate 211 forms protrusion 225.Flexible circuit board 212
It can connect in the side edge 2111, flexible circuit board 212 is bent around protrusion 225, and in other words, flexible circuit board 212 is bent
So that protrusion 225 is located at flexible circuit board 212 and bends in the space surrounded, when effect of the flexible circuit board 212 by external force
When, flexible circuit board 212 will not be collapsed inwardly and cause the degree of bending excessive, and flexible circuit board 212 is caused to damage.
Fig. 3 and Fig. 7 is please referred to, optical transmitting set 23 is for launching outward optical signal, and specifically, optical signal can be infrared
Light, optical signal can be the dot matrix hot spot emitted to testee, and optical signal is penetrated from optical transmitting set 23 with certain angle of divergence
Out.Optical transmitting set 23 is arranged on cushion block 22, in embodiments of the present invention, optical transmitting set 23 cushion block 22 is set with the first base
The opposite side of plate 211, in other words, first substrate 211 and optical transmitting set 23 are spaced apart by cushion block 22 so that optical transmitting set 23 with
Difference in height is formed between first substrate 211.Optical transmitting set 23 is also connect with flexible circuit board 212, and flexible circuit board 212 is around protrusion
The bending setting of portion 225, one end of flexible circuit board 212 connect first substrate 211, and the other end connects optical transmitting set 23, by light
The control signal of transmitter 23 is transferred to optical transmitting set 23 from first substrate 211, or by the feedback signal of optical transmitting set 23 (such as
The temporal information of the transmitting optical signal of optical transmitting set 23, frequency information, the temperature information etc. of optical transmitting set 23) it is transferred to the first base
Plate 211.
Fig. 3, Fig. 4 and Fig. 6 are please referred to, optical receiver 24 is used to receive the light letter that the optical transmitting set 23 being reflected back toward emits
Number.Optical receiver 24 is arranged on first substrate 211, and the contact surface of optical receiver 24 and first substrate 211 and cushion block 22 and
The contact surface of first substrate 211 is substantially flush setting (that is, the start of installation of the two is in the same plane).Specifically, light connects
Receiving device 24 includes shell 241 and optical element 242.Shell 241 is arranged on first substrate 211, and optical element 242 is arranged in shell
On body 241, shell 241 can be the microscope base and lens barrel of optical receiver 24, and optical element 242, which can be, to be arranged in shell 241
The elements such as lens.Further, optical receiver 24 can also include sensitive chip (not shown), be reflected back by testee
Optical signal is irradiated in sensitive chip after being acted on by optical element 242, and sensitive chip generates response to the optical signal.Depth is adopted
Collection mould group 20 calculate optical transmitting set 23 issue optical signal and sensitive chip receive through testee reflect between the optical signal when
Between it is poor, and further obtain testee depth information, the depth information can be used for ranging, for generate depth image or
For three-dimensional modeling etc..In one example, shell 241 and cushion block 22 can connect integrally.Specifically, shell 241 and pad
Block 22 can be integrated molding, and shell 241 and cushion block 22 can be mounted on together on first substrate 211, be easily installed, such as shell
Body 241 is identical as the material of cushion block 22 and is integrally formed by the modes such as being molded, cutting；Or the material of shell 241 and cushion block 22
Material is different, and the two is integrally formed by modes such as double-shot mouldings.Shell 241 is also possible to be separately formed with cushion block 22, and two
Person forms fit structure, when assembling depth acquisition mould group 20, first shell 241 and cushion block 22 can link into an integrated entity, then altogether
With setting on first substrate 211；First one in shell 241 and cushion block 22 can also be arranged on first substrate 211, then
Another is arranged on first substrate 211 and is linked into an integrated entity.
In the electronic equipment 100 of embodiment of the present invention, since optical transmitting set 23 is arranged on cushion block 22, cushion block 22 can be with
The height of padded optical transmitting set 23, and then the height of the exit facet of optical transmitting set 23 is improved, the optical signal that optical transmitting set 23 emits
It is not easy to be blocked by optical receiver 24, optical signal is irradiated on testee completely.The exit facet of optical transmitting set 23 can
To flush with the plane of incidence of optical receiver 24, the exit facet for being also possible to optical transmitting set 23 is slightly below the incidence of optical receiver 24
Face can also be that the exit facet of optical transmitting set 23 is slightly above the plane of incidence of optical receiver 24.In addition, due to flexible circuit board 212
It bends and is arranged around protrusion 225, when effect of the flexible circuit board 212 by external force, flexible circuit board 212 will not be collapsed inwardly
And cause the degree of bending excessive, cause flexible circuit board 212 to damage.
Referring to Fig. 8, in some embodiments, the lateral surface 2251 of protrusion 225 is smooth curved surface (such as cylinder
Lateral surface etc.), i.e. the lateral surface 2251 of protrusion 225 not will form curvature mutation, though flexible circuit board 212 paste it is convex
The lateral surface 2251 in portion 225 is bent out, and the bending degree of flexible circuit board 212 will not be excessive, further ensures that flexible circuit
Plate 212 it is intact.
Fig. 5 and Fig. 7 is please referred to, in some embodiments, first substrate component 21 further includes stiffening plate 213, stiffening plate
213 are incorporated in the side opposite with cushion block 22 of first substrate 211.Stiffening plate 213 can cover a side of first substrate 211
Face, stiffening plate 213 can be used for increasing the intensity of first substrate 211, and avoiding first substrate 211, deformation occurs.In addition, stiffening plate
213 can be made of conductive material, such as metal or alloy etc., when depth acquisition mould group 20 is mounted on electronic equipment 100
When, stiffening plate 213 can be electrically connected with casing 10, so that stiffening plate 213 is grounded, and efficiently reduce the electrostatic of outer member
Interference to depth acquisition mould group 20.
3 to Fig. 5 are please referred to, in some embodiments, depth acquisition mould group 20 further includes connector 26, and connector 26 connects
It connects on first substrate 211.Connector 26 is for connecting first substrate component 21 and external equipment.Connector 26 and protrusion
225 are located at the opposite both ends of first substrate 211.Connector 26 can be attachment base or connector, when depth acquires mould
When group 20 is mounted in casing 10, connector 26 can be connect with the mainboard of electronic equipment 100, so that depth acquires mould group 20
It is electrically connected with mainboard.Connector 26 is located at the opposite both ends of first substrate 211 with protrusion 225, such as can be point
It is not connected to the left and right ends of first substrate 211, or is connected to the rear and front end of first substrate 211.
Fig. 4 and Fig. 5 is please referred to, in some embodiments, L is arranged along a straight line for optical transmitting set 23 and optical receiver 24,
Connector 26 is located at the opposite two sides of straight line L with protrusion 225.It is appreciated that due to optical transmitting set 23 and light-receiving
Device 24 is arranged, therefore along the direction of straight line L, and the size that depth acquires mould group 20 may be larger.Connector 26 with
Protrusion 225 is separately positioned on the opposite two sides of straight line L, will not be further added by depth acquisition mould group 20 along the direction straight line L
Size, and then convenient for depth acquisition mould group 20 to be mounted on the casing 10 of electronic equipment 100.
Fig. 7 and Fig. 8 is please referred to, in some embodiments, the side that cushion block 22 is combined with first substrate 211 offers receipts
Cavity 223.It further includes the electronic component 25 being arranged on first substrate 211 that depth, which acquires mould group 20, and electronic component 25 is housed in
In accommodating chamber 223.Electronic component 25 can be the elements such as capacitor, inductance, transistor, resistance, and electronic component 25 can be with laying
Control route electrical connection on first substrate 211, and work for driving or controlling optical transmitting set 23 or optical receiver 24.Electricity
Subcomponent 25 is housed in accommodating chamber 223, and the space in cushion block 22 is reasonably utilized, and does not need to increase first substrate 211
Electronic component 25 is arranged in width, conducive to the overall dimensions for reducing depth acquisition mould group 20.The quantity of accommodating chamber 223 can be one
It is a or multiple, multiple accommodating chambers 223 can be apart from one another by, when installing cushion block 22, can by accommodating chamber 223 and electronics member
Simultaneously cushion block 22 is arranged on first substrate 211 for the position alignment of part 25.
Fig. 7 and Fig. 9 is please referred to, in some embodiments, cushion block 22, which is offered, to be connected to at least one accommodating chamber 223
Through-hole 224 is avoided, at least one electronic component 25 protrudes into evacuation through-hole 224.It is appreciated that needing to accommodate in electronic component 25
When in accommodating chamber 223, it is desirable that the height of electronic component 25 is not higher than the height of accommodating chamber 223.And receiving is higher than for height
The electronic component 25 of chamber 223 can open up evacuation through-hole 224 corresponding with accommodating chamber 223, and electronic component 25 can partially protrude into
It avoids in through-hole 224, with the arranging electronic element 25 under the premise of not improving 22 height of cushion block.
Referring to Fig. 7, in some embodiments, optical transmitting set 23 includes the second substrate component 231, light source assembly 232
And shell 233.The second substrate component 231 is arranged on cushion block 22, and the second substrate component 231 is connect with flexible circuit board 212.Light
Source component 232 is arranged on the second substrate component 231, and light source assembly 232 is for emitting optical signal.Shell 233 is arranged second
On board unit 231, shell 233 is formed with accommodating space 2331, and accommodating space 2331 can be used for accommodating light source assembly 232.It is soft
Property circuit board 212, which can be, to be removably connected on the second substrate component 231.Light source assembly 232 and the second substrate component 231
Electrical connection.Shell 233 is whole can be in bowl-shape, and Open Side Down is located on the second substrate component 231 for shell 233, will
Light source assembly 232 is housed in accommodating space 2331.In embodiments of the present invention, it is offered on shell 233 and light source assembly 232
Corresponding light-emitting window 2332, the optical signal issued from light source assembly 232 are emitted to away after passing through light-emitting window 2332, and optical signal can
To be directly pierced by from light-emitting window 2332, can also be pierced by after other optical devices change optical path from light-emitting window 2332.
Please continue to refer to Fig. 7, in some embodiments, the second substrate component 231 includes the second substrate 2311 and reinforcement
Part 2312.The second substrate 2311 is connect with flexible circuit board 212.Light source assembly 232 and reinforcing member 2312 are arranged in the second substrate
2311 opposite two sides.The concrete type of the second substrate 2311 can be printed wiring board or flexible circuit board etc., the second base
Control route can be equipped on plate 2311.Reinforcing member 2312 can be solid by the modes such as gluing, riveting and the second substrate 2311
Fixed connection, reinforcing member 2312 can increase the whole intensity of the second substrate component 231.Optical transmitting set 23 is arranged on cushion block 22
When, reinforcing member 2312 can directly be contacted with cushion block 22, and the second substrate 2311 is not exposed to outside, and not needed and cushion block 22
It directly contacts, the second substrate 2311 is not easily susceptible to the pollution of dust etc..
In the embodiment as shown in figure 7, the molding seperated with cushion block 22 of reinforcing member 2312.Mould group 20 is acquired in assembling depth
When, first cushion block 22 can be mounted on first substrate 211, the both ends of flexible circuit board 212 are separately connected first substrate at this time
211 and the second substrate 2311, and flexible circuit board 212 can not bend (state as shown in Figure 9) first.Then again by flexible electrical
Road plate 212 is bent, so that reinforcing member 2312 is arranged on cushion block 22.
Certainly, in other embodiments, reinforcing member 2312 can be integrally formed with cushion block 22, such as pass through the techniques such as injection molding
It is integrally formed, when assembling depth acquisition mould group 20, cushion block 22 and optical transmitting set 23 can be mounted on first substrate 211 together
On.
Referring to Fig. 9, in some embodiments, the first locating piece 2313 is formed on reinforcing member 2312.Cushion block 22 wraps
Ontology 221 and the second locating piece 222 are included, the second locating piece 222 is formed on ontology 221.The setting of the second substrate component 231 is being padded
When on block 22, the first locating piece 2313 and the second locating piece 222 cooperate.Specifically, the first locating piece 2313 and the second locating piece
After 222 cooperations, the relative motion between the second substrate component 231 and cushion block 22 can be effectively limited.First locating piece 2313 and
The concrete type of second locating piece 222 can be according to being selected, such as the first locating piece 2313 is to be formed in reinforcing member
Location hole on 2312, while the second locating piece 222 is positioning column, positioning column protrudes into positioning hole so that the first locating piece 2313
It cooperates with the second locating piece 222；Or first locating piece 2313 be the positioning column being formed on reinforcing member 2312, second is fixed
Position part 222 is location hole, and positioning column protrudes into positioning hole so that the first locating piece 2313 and the second locating piece 222 cooperate；
Or first locating piece 2313 and the second locating piece 222 quantity be it is multiple, the first locating piece of part 2313 is location hole, portion
Dividing the second locating piece 222 is positioning column, and the first locating piece of part 2313 is positioning column, and the second locating piece of part 222 is location hole,
Positioning column protrudes into positioning hole so that the first locating piece 2313 and the second locating piece 222 cooperate.
The structure of light source assembly 232 will be illustrated below:
Referring to Fig. 10, light source assembly 232 includes light source 60, lens barrel 70, diffuser (diffuser) 80 and protective cover 90.
Light source 60 is connected on the second substrate component 231, and lens barrel 70 includes opposite the first face 71 and the second face 72, and lens barrel 11, which opens up, to be passed through
The accommodating chamber 75 in the first face 71 and the second face 72 is worn, the first face 71 forms the installation being connected to accommodating chamber 75 towards the second face 72 recess
Slot 76.Diffuser 80 is mounted in mounting groove 76.Protective cover 90 is mounted on the side where the first face 71 of lens barrel 70, diffuser
80 are folded between protective cover 90 and the bottom surface 77 of mounting groove 76.
Protective cover 90 can be connected through a screw thread, engage, the mode of fastener connection is mounted on lens barrel 70.For example, asking
Refering to fig. 10, when protective cover 90 includes roof 91 and protective side wall 92, interior spiral shell is provided on protective cover 90 (protective side wall 92)
Line is provided with external screw thread on lens barrel 70, and the external thread spiro fastening of the internal screw thread of protective cover 90 and lens barrel 70 is at this time with by protective cover 90
It is mounted on lens barrel 70；Alternatively, please referring to Figure 11, when protective cover 90 includes roof 91, protective cover 90 (roof 91) is offered
Card hole 95, the end of lens barrel 70 are provided with hook 73, and when protective cover 90 is arranged on lens barrel 70, hook 73 is threaded through card hole 95
It is interior so that protective cover 90 is mounted on lens barrel 70；Alternatively, Figure 12 is please referred to, when protective cover 90 includes roof 91 and protective side wall 92
When, protective cover 90 (protective side wall 92) offers card hole 95, hook 73 is provided on lens barrel 70, when protective cover 90 is arranged in lens barrel
When on 70, hook 73 is threaded through in card hole 95 so that protective cover 90 is mounted on lens barrel 70；Alternatively, please referring to Figure 13, work as protection
When cover 90 includes roof 91, the end of lens barrel 70 offers first positioning hole 74, offers on protective cover 90 (roof 91) and the
The corresponding second location hole 93 of a positioning hole 74, fastener 94 pass through second location hole 93 and be locked in first positioning hole 74 with
Protective cover 90 is mounted on lens barrel 70.When protective cover 90 is mounted on lens barrel 70, protective cover 90 and diffuser 80 are contradicted simultaneously
Contradict diffuser 80 and bottom surface 77, so that diffuser 80 be made to be folded between protective cover 90 and bottom surface 77.
Light source assembly 232 is mounted in mounting groove 76 by opening up mounting groove 76 on lens barrel 70, and by diffuser 80, with
And be mounted on by protective cover 90 diffuser 80 to be clamped between protective cover 90 and the bottom surface 77 of mounting groove 76 on lens barrel 70,
To which diffuser 80 is fixed on lens barrel 70 by reality.And avoid that diffuser 80 being fixed on lens barrel 70 using glue, thus
After glue be can be avoided into gaseous state, gaseous glue spreads and is set in the surface of diffuser 80 and influences the microcosmic of diffuser 80
Structure, and can be avoided connection diffuser 80 and when the glue of lens barrel 70 declines adhesion strength because of aging diffuser 80 from lens barrel
It falls off on 70.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means in conjunction with the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the invention.
In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one described feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant, and the scope of the present invention is defined by the claims and their equivalents.
Claims (13)
1. a kind of depth acquires mould group characterized by comprising
First substrate component, the first substrate component include the first substrate and flexible circuit board interconnected；
Cushion block, on the first substrate, the cushion block includes the side edge for stretching out the first substrate for the cushion block setting
Protrusion；
First optical device, first optical device are arranged on the cushion block, and the flexible circuit board is around the protrusion
Bending setting, and one end of the flexible circuit board connects the first substrate, the other end connects first optical device；And
Second optical device, the second optical device setting is on the first substrate.
2. depth according to claim 1 acquires mould group, which is characterized in that the lateral surface of the protrusion is smooth song
Face.
3. depth according to claim 1 or 2 acquires mould group, which is characterized in that first optical device is light emitting
Device, the optical transmitting set are optical receiver for launching outward optical signal, second optical device, and the optical receiver is used for
Receive the optical signal for the optical transmitting set transmitting being reflected back toward.
4. depth according to claim 3 acquires mould group, which is characterized in that the optical transmitting set includes:
The second substrate component, the second substrate component are arranged on the cushion block, the second substrate component and the flexibility
Circuit board connection；
Light source assembly on the second substrate component is set, and the light source assembly is for emitting the optical signal；And
Shell on the second substrate component is set, and the shell is formed with accommodating space to accommodate the light source assembly.
5. depth according to claim 4 acquires mould group, which is characterized in that the second substrate component includes the second substrate
And reinforcing member, the second substrate are connect with the flexible circuit board, the light source assembly and the reinforcing member are arranged described
The opposite two sides of the second substrate.
6. depth according to claim 5 acquires mould group, which is characterized in that the reinforcing member and cushion block one at
Type；Or reinforcing member molding seperated with the cushion block.
7. depth according to claim 5 acquires mould group, which is characterized in that be formed with the first positioning on the reinforcing member
Part, the cushion block include the second locating piece of ontology and formation on the body, and the second substrate component is arranged described
When on cushion block, first locating piece and second locating piece cooperate.
8. depth according to claim 1 or 2 acquires mould group, which is characterized in that the cushion block and the first substrate knot
The side of conjunction offers accommodating chamber, and the depth acquisition mould group further includes the electronic component of setting on the first substrate, institute
Electronic component is stated to be housed in the accommodating chamber.
9. depth according to claim 8 acquires mould group, which is characterized in that the cushion block offer with described at least one
The evacuation through-hole of accommodating chamber connection, at least one described electronic component protrude into the evacuation through-hole.
10. depth according to claim 1 or 2 acquires mould group, which is characterized in that the first substrate component further includes adding
Strong plate, the stiffening plate are incorporated in the side opposite with the cushion block of the first substrate.
11. depth acquires mould group according to claim 3, which is characterized in that the depth acquisition mould group further includes connector,
The connector connection on the first substrate, and is used to connect the first substrate component and external equipment, the connection
Device is located at the opposite both ends of the first substrate with the protrusion.
12. depth according to claim 11 acquires mould group, which is characterized in that the optical transmitting set and the optical receiver
It arranges along a straight line, the connector is located at the opposite two sides of the straight line with the protrusion.
13. a kind of electronic equipment characterized by comprising
Casing；And
Depth described in claim 1 to 12 any one acquires mould group, and the depth acquisition mould group installation is on the housing.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810962803.3A CN109039461A (en) | 2018-08-22 | 2018-08-22 | Depth acquires mould group and electronic equipment |
| PCT/CN2019/090070 WO2020038057A1 (en) | 2018-08-22 | 2019-06-05 | Depth collection module and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810962803.3A CN109039461A (en) | 2018-08-22 | 2018-08-22 | Depth acquires mould group and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109039461A true CN109039461A (en) | 2018-12-18 |
Family
ID=64627966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810962803.3A Pending CN109039461A (en) | 2018-08-22 | 2018-08-22 | Depth acquires mould group and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109039461A (en) |
| WO (1) | WO2020038057A1 (en) |
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| CN109737868A (en) * | 2018-12-21 | 2019-05-10 | 华为技术有限公司 | Flight time mould group and electronic equipment |
| WO2020038057A1 (en) * | 2018-08-22 | 2020-02-27 | Oppo广东移动通信有限公司 | Depth collection module and electronic device |
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Also Published As
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| WO2020038057A1 (en) | 2020-02-27 |
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Application publication date: 20181218 |