WO2020052289A1

WO2020052289A1 - Depth acquisition module and electronic apparatus

Info

Publication number: WO2020052289A1
Application number: PCT/CN2019/090259
Authority: WO
Inventors: 张学勇
Original assignee: Oppo广东移动通信有限公司
Priority date: 2018-09-14
Filing date: 2019-06-06
Publication date: 2020-03-19
Also published as: CN109164432A

Abstract

A depth acquisition module (20) and an electronic apparatus (100). The depth acquisition module (20) comprises a first substrate assembly (21), a first optical device (23), and a second optical device (24). The first substrate assembly (21) comprises a first substrate (211). The first optical device (23) is disposed on the first substrate (211). The second optical device (24) is disposed on the first substrate (211), and comprises a casing (241) and an optical element (242) disposed in the casing (241). A top wall (2411) and a side wall (2412) are formed at the casing (241). A clearance bevel (243) is formed at a junction between the top wall (2411) and the side wall (2412), the side wall (2412) being adjacent to the first optical device (23).

Description

Deep acquisition module and electronic device

Priority information

This application claims the priority and rights of the patent application with the patent application number 201811075567.X, which was filed with the State Intellectual Property Office of China on September 14, 2018, and is incorporated herein by reference in its entirety.

Technical field

The present application relates to the field of three-dimensional imaging technology, and more particularly, to a depth acquisition module and an electronic device.

Background technique

Time of flight (TOF) imaging system includes a light emitting device and a light receiving device. The light transmitting device continuously sends optical signals to the predicted target, and the light receiving device receives the optical signal reflected from the predicted target, and calculates the optical signal. In order to reduce the space occupied by the time-of-flight imaging system when the time-of-flight imaging system is applied to a smart terminal, the light-emitting device and the light-receiving device can be set as close as possible.

Summary of the Invention

The embodiments of the present application provide a depth acquisition module and an electronic device.

The depth acquisition module according to the embodiment of the present application includes a first substrate assembly, a first optical device, and a second optical device. The first substrate assembly includes a first substrate. The first optical device is disposed on the first substrate. The second optical device is disposed on the first substrate. The second optical device includes a casing and an optical element disposed in the casing. The casing is formed with a top wall and a side wall, and the boundary between the top wall and the side wall near the first optical device. Avoidance gaps are formed everywhere.

The electronic device according to the embodiment of the present application includes a casing and a depth acquisition module, the depth acquisition module is installed on the casing, and the depth acquisition module includes a first substrate component, a first optical device, and a second optical Device. The first substrate assembly includes a first substrate. The first optical device is disposed on the first substrate. The second optical device is disposed on the first substrate. The second optical device includes a casing and an optical element disposed in the casing. The casing is formed with a top wall and a side wall, and the boundary between the top wall and the side wall near the first optical device. Avoidance gaps are formed everywhere.

Additional aspects and advantages of the embodiments of the present application will be partially given in the following description, and part of them will become apparent from the following description, or be learned through the practice of the embodiments of the present application.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

FIG. 1 is a schematic perspective structural diagram of a state of an electronic device according to some embodiments of the present application; FIG.

2 is a schematic perspective structural diagram of another state of an electronic device according to some embodiments of the present application;

FIG. 3 is a perspective structural diagram of a depth acquisition module according to some embodiments of the present application; FIG.

4 is a schematic top view of a depth acquisition module according to some embodiments of the present application;

5 is a schematic bottom view of a depth acquisition module according to some embodiments of the present application;

6 is a schematic side view of a depth acquisition module according to some embodiments of the present application;

7 is a schematic cross-sectional view of the depth acquisition module shown in FIG. 4 along the line VII-VII;

8 is an enlarged schematic view of a portion VIII in the depth acquisition module shown in FIG. 7;

9 is a schematic diagram of the front structure of the depth acquisition module in some embodiments of the present application when the flexible circuit board is not bent;

10 to 13 are schematic structural diagrams of a light emitter according to some embodiments of the present application;

14 is a schematic partial cross-sectional view of an electronic device according to an embodiment of the present application;

15 is a schematic partial cross-sectional view of an electronic device according to another embodiment of the present application.

detailed description

The embodiments of the present application are further described below with reference to the accompanying drawings. The same or similar reference numerals in the drawings represent the same or similar elements or elements having the same or similar functions throughout.

In addition, the embodiments of the present application described below with reference to the drawings are exemplary, and are only used to explain the embodiments of the present application, and should not be construed as limiting the present application.

The depth acquisition module 20 according to the embodiment of the present application includes a first substrate assembly 21, a first optical device 23, and a second optical device 24. The first substrate assembly 21 includes a first substrate 211. The first optical device 23 is disposed on the first substrate 211. The second optical device 24 is disposed on the first substrate 211. The second optical device 24 includes a casing 241 and an optical element 242 disposed in the casing 241. The casing 241 is formed with a top wall 2411 and a side wall 2412. The top wall 2411 An avoidance gap 243 is formed at a boundary with the side wall 2412 near the first optical device 23.

In some embodiments, the first optical device 23 is a light transmitter 23, which is used to transmit an optical signal to the outside world; the second optical device 24 is a light receiver 24, and the light receiver 24 is used to receive the reflected light. The optical signal emitted by the optical transmitter 23 is returned.

In some embodiments, the depth acquisition module 20 further includes a pad 22, the pad 22 is disposed on the first substrate 211, and the first optical device 23 is disposed on the pad 22. The first substrate assembly 21 includes a flexible circuit board 212, one end of the flexible circuit board 212 is connected to the first substrate 211, and the other end of the flexible circuit board 212 is connected to the first optical device 23.

In some embodiments, the housing 241 and the cushion block 22 are a one-piece structure.

In some embodiments, the first optical device 23 includes a second substrate assembly 231, a light source assembly 232, and a housing 233. The second substrate assembly 231 is disposed on the pad 22, and the second substrate assembly 231 is connected to the flexible circuit board 212. The light source assembly 232 is disposed on the second substrate assembly 231, and the light source assembly 232 is configured to emit a light signal. The casing 233 is disposed on the second substrate assembly 231. The casing 233 is formed with a receiving space 2331. The receiving space 2331 can be used for receiving the light source module 232.

In some embodiments, the second substrate assembly 231 includes a second substrate 2311 and a reinforcing member 2312. The second substrate 2311 is connected to the flexible circuit board 212. The light source assembly 232 and the reinforcing member 2312 are disposed on opposite sides of the second substrate 2311.

In some embodiments, a first positioning member 2313 is formed on the reinforcing member 2312. The cushion block 22 includes a body 221 and a second positioning member 222. The second positioning member 222 is formed on the body 221. When the second substrate assembly 231 is disposed on the cushion block 22, the first positioning member 2313 cooperates with the second positioning member 222.

In some embodiments, a receiving cavity 223 is defined on a side where the cushion block 22 is combined with the first substrate 211. The depth acquisition module 20 further includes an electronic component 25 disposed on the first substrate 211, and the electronic component 25 is contained in the receiving cavity 223.

In some embodiments, the cushion block 22 includes a protruding portion 225 protruding from the side edge 2111 of the first substrate 211, and the flexible circuit board 212 is bent around the protruding portion 225.

In some embodiments, the depth acquisition module 20 further includes a connector 26 connected to the first substrate 211. The connector 26 is used to connect the first substrate assembly 21 and an external device. The connector 26 and the flexible circuit board 212 are respectively connected to opposite ends of the first substrate 211.

The electronic device according to the embodiment of the present application includes a casing 10 and the depth acquisition module 20 according to any one of the above embodiments. The depth acquisition module 20 is mounted on the casing 10.

In some embodiments, the electronic device 100 further includes a cover body 200, a bracket 400 disposed on the cover body 200, and a lens group 500 mounted on the bracket 400. The bracket 400 includes a main body 401 and a spacer 402. The main body 401 is provided with a light emitting hole 4011 corresponding to the light emitter 23 and a light receiving hole 4012 corresponding to the light receiver 24. The lens group 500 includes a light emitting lens 501 and a light incident lens 502. The light emitting lens 501 covers the light emitting hole 4011, the light incident lens 502 covers the light incident hole 4012, and the spacer 402 separates the light emitting lens 501 and the light incident lens 502.

In some embodiments, the spacer 402 and the body 401 together form at least two receiving grooves 403. At least two receiving slots 403 are spaced from each other. The light-exiting lens 501 and the light-entering lens 502 are disposed in different receiving slots 403.

Please refer to FIGS. 1 and 2. The electronic device 100 according to the embodiment of the present application includes a casing 10 and a depth acquisition module 20. The electronic device 100 may be a mobile phone, a tablet computer, a game console, a smart watch, a headset device, a drone, etc. The embodiment of the present application is described using the electronic device 100 as a mobile phone. It can be understood that the specific form of the electronic device 100 is Not limited to mobile phones.

The casing 10 can be used as a mounting carrier for the functional components of the electronic device 100. The casing 10 can provide protection for the functional components from dust, water, and drops. The functional components can be the display screen 30, the visible light camera 40, and the receiver 50, etc. .

Further, in the embodiment of the present application, the casing 10 includes a main body 11 and a movable support 12. The movable support 12 can be moved relative to the main body 11 under the driving of a driving device. For example, the movable support 12 can be relative to the main body 11. Slide to slide in or out of the main body 11 (as shown in FIG. 1) (as shown in FIG. 2). Some functional elements (such as the display 30) can be installed on the main body 11, and other functional elements (such as the depth acquisition module 20, the visible light camera 40, and the receiver 50) can be installed on the movable bracket 12, and the movable bracket 12 can be moved. The other part of the functional element is driven to retract into or protrude from the main body 11.

The depth acquisition module 20 is mounted on the casing 10. Specifically, the casing 10 may be provided with an acquisition window, and the depth acquisition module 20 is aligned with the acquisition window so that the depth acquisition module 20 acquires depth information. In the embodiment of the present application, the depth acquisition module 20 is installed on the movable bracket 12. When the user needs to use the depth acquisition module 20, the user can trigger the movable bracket 12 to slide out from the main body 11 to drive the depth acquisition module 20. Extending from the main body 11, when the depth acquisition module 20 is not needed, the movable bracket 12 can be triggered to slide into the main body 11 to drive the depth acquisition module 20 to retract into the main body 11.

Of course, FIG. 1 and FIG. 2 are only examples of a specific form of the casing 10, and cannot be understood as a limitation on the casing 10 of the present application. For example, in another example, the acquisition window opened on the casing 10 The depth acquisition module 20 may be fixed and aligned with the acquisition window. In another example, the depth acquisition module 20 is fixed below the display screen 30.

Please refer to FIGS. 3 to 6. The depth acquisition module 20 includes a first substrate assembly 21, a first optical device 23 and a second optical device 24. The first substrate assembly 21 includes a first substrate 211. The first optical device 23 is disposed on the first substrate 211. The second optical device 24 is disposed on the first substrate 211. The second optical device 24 includes a casing 241 and an optical element 242 disposed in the casing 241. The casing 241 is formed with a top wall 2411 and a side wall 2412. The top wall 2411 An avoidance gap 243 is formed at a boundary with the side wall 2412 near the first optical device 23.

In the prior art, when the light emitting device and the light receiving device are close to each other, due to a certain height difference between the light emitting device and the light receiving device, when the height difference between the two is large, the light emitting device The emitted light signal may be irradiated on the housing of the light receiving device, resulting in that the light signal cannot be completely irradiated on the measured target, or the light signal is blocked by the light emitting device when it is reflected from the predicted target back to the light receiving device.

In the electronic device 100 according to the embodiment of the present application, the avoidance gap 243 is formed at the boundary between the top wall 2411 of the second optical device 24 and the side wall 2412 of the second optical device 24 near the first optical device 23, so that the first The optical signal emitted by the optical device 23 can pass through the avoidance gap 243 without being blocked by the housing 241 of the second optical device 24, ensuring that the first optical device 23 normally transmits or receives the optical signal.

When the first optical device 23 is a light transmitter 23 and the second optical device 24 is a light receiver 24, the light signal emitted by the light transmitter 23 is not easily blocked by the light receiver 24, so that the light signal can be completely irradiated to the measured object. When the first optical device 23 is a light receiver and the second optical device 24 is a light transmitter, external light signals will not be blocked by the light transmitter before entering the light receiver.

Specifically, the corner of the top wall 2411 of the housing 241 and the side wall 2412 of the housing 241 near the first optical device 23 is chamfered to form an avoidance notch 243, and the cut surface of the avoidance notch 243 is inclined toward the first optical device 23. Bevel. Further, the size of the avoidance gap 243 is specifically designed according to the height difference between the first optical device 23 and the second optical device 24 and the field of view (FOV) of the first optical device 23, such as the first optical The larger the height difference between the device 23 and the second optical device 24, the larger the size of the gap 243 is avoided; the smaller the height difference between the first optical device 23 and the second optical device 24, the size of the gap 243 is avoided The smaller. The size of the avoidance gap 243 and the inclination of the inclined surface can be determined by the number of the cut top wall 2411 and the side wall 2412.

The following description will be made by taking the first optical device 23 as the light transmitter 23 and the second optical device 24 as the light receiver 24 as an example. It can be understood that, in other embodiments, the first optical device 23 may be a light receiver, and the second optical device 24 may be a light transmitter.

Specifically, the depth acquisition module 20 further includes a spacer 22, which is disposed on the first substrate 211, and the first optical device 23 is disposed on the spacer 22. The first substrate assembly 21 includes a flexible circuit board 212, one end of the flexible circuit board 212 is connected to the first substrate 211, and the other end of the flexible circuit board 212 is connected to the first optical device 23. The first substrate 211 may be a printed circuit board or a flexible circuit board, and the control circuit of the depth acquisition module 20 and the like may be laid on the first substrate 211. The flexible circuit board 212 can be bent at a certain angle, so that the relative positions of the devices connected at both ends of the flexible circuit board 212 can be selected, for example, the first optical device 23 can be connected.

Referring to FIGS. 3 and 7, the pad 22 is disposed on the first substrate 211. In one example, the pad 22 is in contact with the first substrate 211 and is carried on the first substrate 211. Specifically, the pad 22 may be combined with the first substrate 211 by means of adhesion or the like. The material of the spacer 22 may be metal, plastic, or the like. In the embodiment of the present application, a surface where the pad 22 is combined with the first substrate 211 may be a flat surface, and a surface opposite to the combined surface of the pad 22 may also be a flat surface, so that when the light emitter 23 is disposed on the pad 22 Has better stability.

The light transmitter 23 is configured to emit an optical signal outwards. Specifically, the light signal may be infrared light, and the light signal may be a lattice spot emitted to the object to be measured. The light signal is emitted from the light transmitter 23 at a certain divergence angle. . The light transmitter 23 is disposed on the spacer 22. In the embodiment of the present application, the light transmitter 23 is disposed on the side of the spacer 22 opposite to the first substrate 211, or in other words, the spacer 22 connects the first substrate 211. The light emitter 23 is spaced apart from the light emitter 23 so that a height difference is formed between the light emitter 23 and the first substrate 211.

The light transmitter 23 is also connected to the flexible circuit board 212. The flexible circuit board 212 is bent, one end of the flexible circuit board 212 is connected to the first substrate 211, and the other end is connected to the light transmitter 23, so that the control signal of the light transmitter 23 is switched from The first substrate 211 is transmitted to the light transmitter 23, or a feedback signal of the light transmitter 23 (for example, time information, frequency information of the light signal emitted by the light transmitter 23, temperature information of the light transmitter 23, etc.) is transmitted to the first Substrate 211.

Please refer to FIG. 3, FIG. 4 and FIG. 6. The optical receiver 24 is configured to receive an optical signal emitted by the reflected optical transmitter 23. The light receiver 24 is disposed on the first substrate 211, and the contact surface between the light receiver 24 and the first substrate 211 is substantially flush with the contact surface between the pad 22 and the first substrate 211 (that is, the installation starting point of the two is On the same plane). Specifically, the light receiver 24 includes a housing 241 and an optical element 242. The casing 241 is disposed on the first substrate 211, and the optical element 242 is disposed on the casing 241. The casing 241 may be a housing of the lens holder and the lens barrel of the light receiver 24, and the optical element 242 may be disposed in the casing 241. Lens and other components.

Further, the light receiver 24 may further include a photosensitive chip (not shown). The optical signal reflected by the measured object is irradiated into the photosensitive chip through the optical element 242, and the photosensitive chip responds to the optical signal. The depth acquisition module 20 calculates the time difference between the light signal emitted by the light transmitter 23 and the light sensor receiving the light signal reflected by the measured object, and further obtains the depth information of the measured object, which can be used for ranging, For generating depth images or for 3D modeling.

In the embodiment of the present application, the housing 241 and the cushion block 22 are integrally connected. Specifically, the housing 241 and the spacer 22 may be integrally formed, and the housing 241 and the spacer 22 may be mounted on the first substrate 211 together for easy installation. For example, the housing 241 and the spacer 22 are made of the same material and are injection-molded. Integrated cutting, cutting, etc .; or the materials of the housing 241 and the pad 22 are different, and the two are integrated through two-color injection molding.

It can be understood that the casing 241 and the cushion block 22 may be separately formed, and the two form a mating structure. When assembling the depth acquisition module 20, the casing 241 and the cushion block 22 may be connected into one body first, and then jointly disposed at the first One substrate 211; one of the housing 241 and the pad 22 may be disposed on the first substrate 211, and then the other is disposed on the first substrate 211 and connected together.

In addition, since the light emitter 23 is disposed on the cushion block 22, the cushion block 22 can raise the height of the light emitter 23, thereby increasing the height of the light emitting surface of the light emitter 23, and the light signal emitted by the light emitter 23 is not easily detected. The light receiver 24 is blocked, so that the light transmitter 23 and the light receiver 24 better cooperate with each other. By providing the cushion block 22 and forming the avoidance gap 243 described above, the light emitted by the light transmitter 23 can be further prevented from being blocked by the light receiver 24, so that the light signal can be completely irradiated on the measured object. The exit surface of the light transmitter 23 may be flush with the entrance surface of the light receiver 24, or the exit surface of the light transmitter 23 may be slightly lower than the entrance surface of the light receiver 24, or it may be the exit surface of the light transmitter 23 Slightly higher than the incident surface of the light receiver 24.

Please refer to FIG. 5 and FIG. 7. In some embodiments, the first substrate assembly 21 further includes a reinforcing plate 213. The reinforcing plate 213 is coupled to a side of the first substrate 211 opposite to the pad 22. The reinforcing plate 213 may cover one side of the first substrate 211, and the reinforcing plate 213 may be used to increase the strength of the first substrate 211 and prevent deformation of the first substrate 211. In addition, the reinforcing plate 213 may be made of a conductive material, such as a metal or an alloy. When the depth acquisition module 20 is installed on the electronic device 100, the reinforcing plate 213 may be electrically connected to the casing 10 to make the reinforcing plate 213. Grounding and effectively reducing the interference of the static electricity of external components on the depth acquisition module 20.

Please refer to FIG. 7 to FIG. 9. In some embodiments, the cushion block 22 includes a protruding portion 225 protruding from the side edge 2111 of the first substrate 211, and the flexible circuit board 212 is bent around the protruding portion 225.

Specifically, a part of the cushion block 22 is directly carried on the first substrate 211, and another part is not in direct contact with the first substrate 211, and protrudes from the side edge 2111 of the first substrate 211 to form a protruding portion 225. The flexible circuit board 212 may be connected to the side edge 2111, and the flexible circuit board 212 is bent around the protrusion 225, or the flexible circuit board 212 is bent so that the protrusion 225 is located in a space surrounded by the flexible circuit board 212. Inside, when the flexible circuit board 212 is subjected to an external force, the flexible circuit board 212 will not collapse inward and cause excessive bending, which will cause damage to the flexible circuit board 212.

Further, as shown in FIG. 8, in some embodiments, the outer surface 2251 of the protruding portion 225 is a smooth curved surface (for example, the outer surface of a cylinder, etc.), that is, the outer surface 2251 of the protruding portion 225 does not form a curvature. Suddenly, even if the flexible circuit board 212 is bent over the outer side 2251 of the protruding portion 225, the degree of bending of the flexible circuit board 212 will not be too large, which further ensures the integrity of the flexible circuit board 212.

Please refer to FIG. 3 to FIG. 5. In some embodiments, the depth acquisition module 20 further includes a connector 26 connected to the first substrate 211. The connector 26 is used to connect the first substrate assembly 21 and an external device. The connector 26 and the flexible circuit board 212 are respectively connected to opposite ends of the first substrate 211. The connector 26 may be a connection base or a connector. When the depth acquisition module 20 is installed in the casing 10, the connector 26 may be connected to the motherboard of the electronic device 100 so that the depth acquisition module 20 is electrically connected to the motherboard. The connector 26 and the flexible circuit board 212 are respectively connected to opposite ends of the first substrate 211. For example, the connectors 26 and the flexible circuit board 212 may be respectively connected to the left and right ends of the first substrate 211, or respectively connected to the front and rear ends of the first substrate 211.

Please refer to FIGS. 4 and 5. In some embodiments, the light transmitter 23 and the light receiver 24 (that is, the first optical device 23 and the second optical device 24) are arranged along a straight line L, and the connector 26 and the flexible circuit The plates 212 are located on opposite sides of the straight line L, respectively. It can be understood that, since the light transmitter 23 and the light receiver 24 are arranged in an array, the size of the depth acquisition module 20 may be larger in the direction of the straight line L. The connector 26 and the flexible circuit board 212 are respectively disposed on opposite sides of the straight line L, which will not increase the size of the depth acquisition module 20 in the straight line L direction, thereby facilitating the installation of the depth acquisition module 20 in the electronic device 100. On the chassis 10.

Please refer to FIGS. 7 and 8. In some embodiments, a receiving cavity 223 is defined on a side where the cushion block 22 is combined with the first substrate 211. The depth acquisition module 20 further includes an electronic component 25 disposed on the first substrate 211, and the electronic component 25 is contained in the receiving cavity 223.

Specifically, the electronic component 25 may be a capacitor, an inductor, a transistor, a resistor, or the like. The electronic component 25 may be electrically connected to a control line laid on the first substrate 211 and used to drive or control the light transmitter 23 or the light receiver 24. jobs. The electronic component 25 is contained in the containing cavity 223, and the space in the cushion block 22 is reasonably used. It is not necessary to increase the width of the first substrate 211 to set the electronic component 25, which is beneficial to reducing the overall size of the depth acquisition module 20. The number of the receiving cavities 223 may be one or more, and the plurality of receiving cavities 223 may be spaced apart from each other. When the pad 22 is installed, the positions of the receiving cavity 223 and the electronic component 25 may be aligned and the pad 22 may be disposed at On the first substrate 211.

Please refer to FIG. 7 and FIG. 9. In some embodiments, the cushion block 22 is provided with an avoiding through hole 224 communicating with at least one receiving cavity 223, and at least one electronic component 25 extends into the avoiding through hole 224. It can be understood that when the electronic component 25 needs to be contained in the containing cavity 223, the height of the electronic component 25 is required to be not higher than the height of the containing cavity 223. For the electronic component 25 having a height higher than the receiving cavity 223, an avoiding through hole 224 corresponding to the receiving cavity 223 may be provided, and the electronic component 25 may partially extend into the avoiding through hole 224, so as not to increase the height of the spacer 22 The electronic component 25 is arranged.

Referring to FIG. 7, in some embodiments, the first optical device 23 (ie, the light emitter 23) includes a second substrate assembly 231, a light source assembly 232, and a housing 233. The second substrate assembly 231 is disposed on the pad 22, and the second substrate assembly 231 is connected to the flexible circuit board 212. The light source assembly 232 is disposed on the second substrate assembly 231, and the light source assembly 232 is configured to emit a light signal. The casing 233 is disposed on the second substrate assembly 231. The casing 233 is formed with a receiving space 2331. The receiving space 2331 can be used for receiving the light source module 232. The flexible circuit board 212 may be detachably connected to the second substrate assembly 231. The light source assembly 232 is electrically connected to the second substrate assembly 231.

Further, the casing 233 may be bowl-shaped as a whole, and the opening of the casing 233 is downwardly covered on the second substrate assembly 231 to receive the light source assembly 232 in the receiving space 2331. In the embodiment of the present application, a light outlet 2332 corresponding to the light source component 232 is provided on the housing 233. The optical signal emitted from the light source component 232 passes through the light outlet 2332 and is emitted. The light signal can pass directly through the light outlet 2332. It can also pass through the optical outlet 2332 after changing the optical path through other optical devices.

Please continue to refer to FIG. 7. In some embodiments, the second substrate assembly 231 includes a second substrate 2311 and a reinforcing member 2312. The second substrate 2311 is connected to the flexible circuit board 212. The light source assembly 232 and the reinforcing member 2312 are disposed on opposite sides of the second substrate 2311. A specific type of the second substrate 2311 may be a printed circuit board or a flexible circuit board, and a control circuit may be laid on the second substrate 2311. The reinforcing member 2312 may be fixedly connected to the second substrate 2311 by means of gluing, riveting, or the like. The reinforcing member 2312 may increase the overall strength of the second substrate assembly 231. When the light emitter 23 is disposed on the spacer 22, the reinforcing member 2312 can directly contact the spacer 22, the second substrate 2311 is not exposed to the outside, and does not need to be in direct contact with the spacer 22, and the second substrate 2311 is not easily affected. Contamination by dust, etc.

In the embodiment shown in FIG. 7, the reinforcing member 2312 and the cushion block 22 are formed separately. When assembling the depth acquisition module 20, the spacer 22 may be first mounted on the first substrate 211. At this time, the two ends of the flexible circuit board 212 are respectively connected to the first substrate 211 and the second substrate 2311, and the flexible circuit board 212 may Do not bend first (state shown in Figure 9). The flexible circuit board 212 is then bent, so that the reinforcing member 2312 is disposed on the cushion block 22.

Of course, in other embodiments, the reinforcing member 2312 and the spacer 22 may be integrally formed, for example, integrally formed by a process such as injection molding. When assembling the depth acquisition module 20, the spacer 22 and the light emitter 23 may be installed together. On the first substrate 211.

Referring to FIG. 9, in some embodiments, a first positioning member 2313 is formed on the reinforcing member 2312. The cushion block 22 includes a body 221 and a second positioning member 222. The second positioning member 222 is formed on the body 221. When the second substrate assembly 231 is disposed on the cushion block 22, the first positioning member 2313 cooperates with the second positioning member 222.

Specifically, after the first positioning member 2313 cooperates with the second positioning member 222, the relative movement between the second substrate assembly 231 and the cushion block 22 can be effectively restricted. The specific types of the first positioning member 2313 and the second positioning member 222 can be selected according to needs. For example, the first positioning member 2313 is a positioning hole formed in the reinforcing member 2312, and the second positioning member 222 is a positioning column. Protrude into the positioning hole so that the first positioning member 2313 and the second positioning member 222 cooperate with each other; or the first positioning member 2313 is a positioning column formed on the reinforcing member 2312, and the second positioning member 222 is a positioning hole and the positioning column Project into the positioning hole so that the first positioning member 2313 and the second positioning member 222 cooperate with each other; or the number of the first positioning member 2313 and the second positioning member 222 are multiple, and part of the first positioning member 2313 is a positioning hole, Part of the second positioning member 222 is a positioning column, part of the first positioning member 2313 is a positioning column, and part of the second positioning member 222 is a positioning hole. The positioning column projects into the positioning hole so that the first positioning member 2313 and the second positioning member 222 work cooperatively.

The structure of the light source component 232 will be described as an example below:

Referring to FIG. 10, the light source assembly 232 includes a light source 60, a lens barrel 70, a diffuser 80 and a protective cover 90. The light source 60 is connected to the second substrate assembly 231. The lens barrel 70 includes a first surface 71 and a second surface 72 opposite to each other. The lens barrel 11 defines a storage cavity 75 penetrating the first surface 71 and the second surface 72. The first surface 71 is recessed toward the second surface 72 to form a mounting groove 76 communicating with the storage cavity 75. The diffuser 80 is installed in the mounting groove 76. The protective cover 90 is mounted on the side where the first surface 71 of the lens barrel 70 is located, and the diffuser 80 is sandwiched between the protective cover 90 and the bottom surface 77 of the mounting groove 76.

The protective cover 90 can be mounted on the lens barrel 70 by means of screw connection, engagement, and fastener connection. For example, referring to FIG. 10, when the protective cover 90 includes a top wall 91 and a protective side wall 92, the protective cover 90 (protective side wall 92) is provided with internal threads and the lens barrel 70 is provided with external threads. At this time, the protective cover The internal thread of 90 is screwed with the external thread of the lens barrel 70 to mount the protective cover 90 on the lens barrel 70; or, referring to FIG. 11, when the protective cover 90 includes a top wall 91, the protective cover 90 (top wall 91) A locking hole 95 is opened, and a hook 73 is provided at an end of the lens barrel 70. When the protective cover 90 is provided on the lens barrel 70, the hook 73 is inserted into the locking hole 95 so that the protective cover 90 is mounted on the lens barrel 70. 12; when the protective cover 90 includes a top wall 91 and a protective side wall 92, the protective cover 90 (protective side wall 92) is provided with a locking hole 95, and the lens barrel 70 is provided with a hook 73. When the protective cover 90 is disposed on the lens barrel 70, the hook 73 is inserted into the card hole 95 so that the protective cover 90 is mounted on the lens barrel 70; or, referring to FIG. 13, when the protective cover 90 includes the top wall 91, The end of the lens barrel 70 is provided with a first positioning hole 74, the protective cover 90 (top wall 91) is provided with a second positioning hole 93 corresponding to the first positioning hole 74, and the fastener 94 passes through the second positioning hole 93 And locked A first positioning hole 74 to the protective cover 90 is mounted on the lens barrel 70. When the protective cover 90 is mounted on the lens barrel 70, the protective cover 90 is in contact with the diffuser 80 and the diffuser 80 is in contact with the bottom surface 77, so that the diffuser 80 is sandwiched between the protective cover 90 and the bottom surface 77.

The light source assembly 232 is provided with a mounting groove 76 on the lens barrel 70 and the diffuser 80 is installed in the mounting groove 76, and is mounted on the lens barrel 70 through a protective cover 90 to clamp the diffuser 80 between the protective cover 90 and the installation. Between the bottom surfaces 77 of the grooves 76, the diffuser 80 is actually fixed to the lens barrel 70. Furthermore, the glue is not used to fix the diffuser 80 on the lens barrel 70, so that the glue can be solidified on the surface of the diffuser 80 and the microstructure of the diffuser 80 can be avoided after the glue volatilizes, and the glue between the diffuser 80 and the lens barrel 70 can be prevented from volatilizing. When too much, the diffuser 80 falls off the lens barrel 70.

Please refer to FIGS. 14 and 15. In some embodiments, the electronic device 100 further includes a motherboard 300, and the motherboard 300 is mounted on the casing 10. Specifically, in the example shown in FIG. 14, the main board 300 is provided with a through hole 301, and the first substrate assembly 21 is mounted on the main board 300 and accommodated in the through hole 301. At this time, the depth acquisition module 20 may be installed in a frame (FIG. (Not shown), the depth acquisition module 20 and the frame are usually passed through the through hole 301 together, and the frame is fixed on the main board 300; in the example shown in FIG. 15, the first substrate 21 is carried on the main board 300.

Please refer to FIG. 14 and FIG. 15. In some embodiments, the electronic device 100 further includes a cover body 200, a bracket 400 disposed on the cover body 200, and a lens group 500 mounted on the bracket 400. The bracket 400 includes a main body 401 and a spacer 402. The main body 401 is provided with a light emitting hole 4011 corresponding to the light emitter 23 (the first optical device 23) and a light receiving hole corresponding to the light receiver 24 (the second optical device 24). 4012. The lens group 500 includes a light emitting lens 501 and a light incident lens 502. The light emitting lens 501 covers the light emitting hole 4011, the light incident lens 502 covers the light incident hole 4012, and the spacer 402 separates the light emitting lens 501 and the light incident lens 502.

It can be understood that the casing 10 includes opposite front and back surfaces, and the display screen 30 may be disposed on the front surface. The cover 200 can be used as a back cover of the electronic device 100 and combined with the casing 10. Of course, in other embodiments, the cover 200 may also be a front cover or a side cover of the electronic device 100. The housing 10 and the cover 200 are combined to form a storage space 13. The storage space 13 can be used to install components such as batteries and motherboards of the electronic device 100. The depth acquisition module 20 can also be installed in the storage space 13.

Specifically, one side of the body 401 may resist the depth acquisition module 20, and the other side may resist the cover 200. The light emitting hole 4011 can be aligned with the light emitter 23, and the optical signal emitted by the light transmitter 23 can pass through the light emitting hole 4011; the light entering hole 4012 can be aligned with the light receiver 24, and the external light signal can pass through the light entering hole After 4012 enter the light receiver 24.

Further, the spacer 402 may be made of an opaque material, and the surface of the spacer 402 may have a high reflectance or absorptivity to light to prevent light signals from passing through the spacer 402. The light emitting lens 501 and the light entering lens 502 are spaced apart. The optical signal emitted by the light transmitter 23 will not directly enter the light entering lens 502 from the light emitting lens 501 and reach the light receiver 24, so that the depth information detected by the depth acquisition module 20 is accurate. Higher.

In the example shown in FIGS. 14 and 15, the spacer 402 is connected to the body 401, and the spacer 402 and the depth acquisition module 20 are located on opposite sides of the body 401.

In one example, the spacer 402 and the body 401 may be an integrally formed structure. For example, the spacer 402 and the body 401 may be integrally formed by injection molding or the like, or the spacer 402 and the body 401 may be obtained by cutting from a blank material; in another In an example, the spacer 402 and the main body 401 may be a separate molded structure, and the spacer 402 is fixedly connected to the main body 401. For example, the spacer 402 and the main body 401 may be fixedly connected to the main body 401 by welding, gluing, or snapping.

Please continue to refer to FIG. 14, the lens group 500 is mounted on the bracket 400, and the lens group 500 and the depth acquisition module 20 may be located on opposite sides of the bracket 400. The lens group 500 includes a light emitting lens 501 and a light incident lens 502. The light emitting lens 501 covers the light emitting hole 4011, and the optical signal emitted by the light transmitter 23 passes through the light emitting lens 501 and then passes out of the electronic device 100. The light-entering lens 502 covers the light-entering hole 4012, and external light signals pass through the light-entering lens 502 and enter the electronic device 100. The materials of the light-exiting lens 501 and the light-entering lens 502 may be consistent or inconsistent.

The light-emitting lens 501 and the light-entering lens 502 are separated by a spacer 402. Since the spacer 402 is opaque, the light signal emitted from the side of the light-emitting lens 501 does not pass through the spacer 402, and it is not directly reflected by external objects. Reaching the light-entering lens 502 prevents crosstalk of the optical signals between the light-exiting lens 501 and the light-entering lens 502 and improves the accuracy of the depth information detected by the depth acquisition module 20.

In one example, the bracket 400 and the cover 200 are an integrally formed structure. When assembling the electronic device 100, the depth acquisition module 20 may be installed on the casing 10, and then the bracket 400 and the integrated structure of the cover 200 may be combined. Go to the chassis 10, and then install the light-exiting lens 501 and the light-entering lens 502 on the bracket 400 respectively; you can also first install the depth acquisition module 20 on the chassis 10, and simultaneously install the light-entering lens 502 and the light-exiting lens 501 respectively The bracket 400 is mounted on the bracket 400, and the integrated structure of the bracket 400 with the light-entering lens 502 and the light-exiting lens 501 and the cover 200 is coupled to the casing 200.

In another example, the bracket 400 and the cover 200 may also be formed as separate structures. When assembling the electronic device 100, the depth acquisition module 20, the bracket 400 and the lens group 500 may be assembled into the depth acquisition module 20, Then, the depth acquisition module 20 is mounted on the casing 10 as a whole, and finally the cover 200 is combined with the casing 10.

Referring to FIG. 14, in some embodiments, the spacer 402 and the body 401 together form at least two receiving grooves 403. At least two receiving slots 403 are spaced from each other. The light-exiting lens 501 and the light-entering lens 502 are disposed in different receiving slots 403.

Specifically, the spacer 402 may extend from the body 401, the direction in which the spacer 402 extends from the body 401 may be perpendicular to the plane where the body 401 is located, and the plurality of receiving grooves 403 may be spaced apart from each other by the spacer 402. The light-exiting lens 501 and the light-entering lens 502 are disposed in different receiving slots 403.

Furthermore, taking the light-emitting lens 501 as an example, the glue can be dispensed in the receiving groove 403 first, and then the light-emitting lens 501 can be installed in the receiving groove 403. The light-emitting lens 501 can resist the spacer 402, and the glue can be filled with light The gap between the lens 501 and the body 401 and the gap between the light-emitting lens 501 and the spacer 402 prevent external dust and water vapor from entering the electronic device 100 through the light-emitting hole 4011. The method of installing the light-entering lens 502 is similar to the method of installing the light-exiting lens 501, and details are not described herein again.

Please refer to FIGS. 14 to 15. In some embodiments, the bracket 400 further includes a partition wall 404 extending from the body 401 to the depth acquisition module 20. The partition wall 404 surrounds the light transmitter 23 and the light receiver 24. . The partition wall 404 and the spacer 402 may be respectively located on two opposite sides of the body 401, and the partition wall 404 and the body 401 may be formed with a plurality of cavities.

Specifically, when assembling the depth acquisition module 20 and the bracket 400, the light transmitter 23 and the light receiver 24 can be respectively aligned with different cavities, and the light transmitter 23 can be at least partially housed in a cavity. The receiver 24 is at least partially housed in another cavity. Due to the blocking effect of the partition wall 404, it is further avoided that the optical signal emitted by the light transmitter 23 is not directly received by the light receiver 24 without passing through the electronic device 100.

In the description of this specification, reference is made to the terms "certain embodiments", "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" The description means that a specific feature, structure, material, or characteristic described in combination with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same implementation or example. Moreover, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more implementations or examples.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "plurality" is at least two, for example, two, three, unless specifically defined otherwise.

Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limitations on the present application. Those skilled in the art may, within the scope of the present application, understand the above. The embodiments are subject to change, modification, replacement, and modification, and the scope of the present application is defined by the claims and their equivalents.

Claims

A depth acquisition module, comprising:

A first substrate assembly including a first substrate;

A first optical device, the first optical device being disposed on the first substrate; and

A second optical device, the second optical device being disposed on the first substrate, the second optical device including a casing and an optical element disposed in the casing, the casing forming a top wall and a side Wall, an avoidance gap is formed at an interface between the top wall and the side wall near the first optical device.
The depth acquisition module according to claim 1, wherein the first optical device is a light emitter, and the light emitter is configured to emit an optical signal to the outside;

The second optical device is a light receiver, and the light receiver is configured to receive the optical signal emitted by the light transmitter that is reflected back.
The depth acquisition module according to claim 1, wherein the depth acquisition module further comprises a pad, the pad is disposed on the first substrate, and the first optical device is disposed on the first substrate. On the pad, the first substrate assembly further includes a flexible circuit board, one end of the flexible circuit board is connected to the first substrate, and the other end of the flexible circuit board is connected to the first optical device.
The depth acquisition module according to claim 3, wherein the casing and the pad are an integrally formed structure.
The depth acquisition module according to claim 3, wherein the first optical device comprises:

A second substrate assembly disposed on the pad, the second substrate assembly being connected to the flexible circuit board;

A light source assembly disposed on the second substrate assembly, the light source assembly being configured to emit the optical signal; and

A casing provided on the second substrate assembly, and the casing is formed with a receiving space to receive the light source assembly.
The depth acquisition module according to claim 5, wherein the second substrate assembly includes a second substrate and a reinforcing member, the second substrate is connected to the flexible circuit board, the light source assembly and the The reinforcing members are disposed on opposite sides of the second substrate.
The depth acquisition module according to claim 6, wherein a first positioning member is formed on the reinforcing member, the cushion block comprises a main body and a second positioning member formed on the main body, and When the second substrate assembly is disposed on the pad, the first positioning member cooperates with the second positioning member.
The depth acquisition module according to claim 3, wherein a receiving cavity is provided on a side where the pad is combined with the first substrate, and the depth acquisition module further comprises a first substrate The electronic components are housed in the receiving cavity.
The depth acquisition module according to claim 3, wherein the pad includes a protruding portion protruding from a side edge of the first substrate, and the flexible circuit board is bent and disposed around the protruding portion .
The depth acquisition module according to claim 3, wherein the depth acquisition module further comprises a connector, the connector is connected to the first substrate, and is used to connect the first substrate component and the outside Equipment, the connector and the flexible circuit board are respectively connected at opposite ends of the first substrate.
An electronic device is characterized by comprising a casing and a depth acquisition module, the depth acquisition module is installed on the casing, and the depth acquisition module includes:

A first substrate assembly including a first substrate;

A first optical device, the first optical device being disposed on the first substrate; and

A second optical device, the second optical device being disposed on the first substrate, the second optical device including a casing and an optical element disposed in the casing, the casing forming a top wall and a side Wall, an avoidance gap is formed at an interface between the top wall and the side wall near the first optical device.
The electronic device according to claim 11, wherein the first optical device is a light emitter, and the light emitter is configured to emit an optical signal to the outside;

The second optical device is a light receiver, and the light receiver is configured to receive the optical signal emitted by the light transmitter that is reflected back.
The electronic device according to claim 11, wherein the depth acquisition module further comprises a pad, the pad is disposed on the first substrate, and the first optical device is disposed on the pad Preferably, the first substrate assembly further includes a flexible circuit board, one end of the flexible circuit board is connected to the first substrate, and the other end of the flexible circuit board is connected to the first optical device.
The electronic device according to claim 13, wherein the casing and the pad are an integrally formed structure.
The electronic device according to claim 13, wherein the first optical device comprises:

A second substrate assembly disposed on the pad, the second substrate assembly being connected to the flexible circuit board;

A light source assembly disposed on the second substrate assembly, the light source assembly being configured to emit the optical signal; and

A casing provided on the second substrate assembly, and the casing is formed with a receiving space to receive the light source assembly.
The electronic device according to claim 15, wherein the second substrate assembly includes a second substrate and a reinforcing member, the second substrate is connected to the flexible circuit board, the light source assembly and the reinforcement The strong members are disposed on opposite sides of the second substrate.
The electronic device according to claim 16, wherein a first positioning member is formed on the reinforcing member, the pad comprises a main body and a second positioning member formed on the main body, and the second positioning member is formed on the reinforcing member. When the substrate assembly is disposed on the pad, the first positioning member cooperates with the second positioning member.
The electronic device according to claim 13, wherein a receiving cavity is provided on a side where the pad is combined with the first substrate, and the depth acquisition module further comprises a An electronic component is contained in the containing cavity.
The electronic device according to claim 13, wherein the pad includes a protruding portion protruding from a side edge of the first substrate, and the flexible circuit board is bent and disposed around the protruding portion.
The depth acquisition module according to claim 13, wherein the depth acquisition module further comprises a connector, the connector is connected to the first substrate, and is used to connect the first substrate component and the outside Equipment, the connector and the flexible circuit board are respectively connected at opposite ends of the first substrate.
The electronic device according to any one of claims 11 to 20, wherein the electronic device further comprises a cover, a bracket provided on the cover, and a lens group mounted on the bracket. The bracket includes a main body and a spacer. The main body is provided with a light exit hole corresponding to the first optical device and a light entrance hole corresponding to the second optical device. The lens group includes a light exit lens and a light entrance lens. The light emitting lens covers the light emitting hole, the light incident lens covers the light incident hole, and the spacer separates the light emitting lens and the light incident lens.
The electronic device according to claim 21, wherein the spacer and the body jointly surround at least two receiving slots spaced apart from each other, and the light-exiting lens and the light-entering lens are disposed in different of the receiving slots. Containment tank.