CN108401045A - Holder, in-out box and electronic device - Google Patents
Holder, in-out box and electronic device Download PDFInfo
- Publication number
- CN108401045A CN108401045A CN201810317084.XA CN201810317084A CN108401045A CN 108401045 A CN108401045 A CN 108401045A CN 201810317084 A CN201810317084 A CN 201810317084A CN 108401045 A CN108401045 A CN 108401045A
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- Prior art keywords
- chamber
- hole
- module
- holder
- face
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses a kind of holders.For installing input and output module, holder is an integral molding structure and includes ontology holder.Input and output module includes infrared imaging module, visual light imaging module, laser projection module and receiver.Ontology includes opposite the first face and the second face.Second face offers host cavity, and the first face offers the through-hole being connected to host cavity, and input and output module is housed in host cavity and is exposed from through-hole.Host cavity includes the first chamber, the second chamber and third chamber being arranged in order.First chamber is for installing infrared imaging module, and the second chamber is for installing visual light imaging module, and third chamber is for installing laser projection module.Host cavity further includes the 4th chamber, and the 4th chamber is for installing receiver.The invention also discloses a kind of in-out box and electronic devices.Multiple functional module groups can be fixed on mobile phone by one holder, save the installation space inside electronic device, be conducive to realize the lightening of electronic device.
Description
Technical field
The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of holder, in-out box and electricity
Sub-device.
Background technology
In the related art, mobile phone configuration has multiple functional module groups, and multiple functional module groups generally require multiple holders with
Functional module group is fixed on mobile phone one by one, causes the space that multiple holders occupy interior of mobile phone larger, is unfavorable for the light of mobile phone
Thinning.
Invention content
A kind of holder of embodiment of the present invention offer, in-out box and electronic device.
For installing input and output module, the holder is an integral molding structure and includes the holder of embodiment of the present invention
Ontology, the input and output module include infrared imaging module, visual light imaging module, laser projection module and receiver, institute
State the first face and the second face that ontology includes opposite, second face offers host cavity, first face offer with it is described
The through-hole of host cavity connection, the input and output module are housed in the host cavity and are exposed from the through-hole, the receiving
Chamber includes the first chamber, the second chamber and third chamber being arranged in order, and first chamber is described for installing the infrared imaging module
Second chamber is for installing the visual light imaging module, and the third chamber is for installing the laser projection module, the receiving
Chamber further includes the 4th chamber, and the 4th chamber is for installing the receiver.
In some embodiments, the 4th chamber is between first chamber and second chamber；Or the described 4th
Chamber is between second chamber and the third chamber.
In some embodiments, the through-hole includes first through hole, the second through-hole, third through-hole and fourth hole, institute
It states first through hole to be connected to first chamber, second through-hole is connected to second chamber, the third through-hole and described the
Three chambers are connected to, and the fourth hole is connected to the 4th chamber.
In some embodiments, the center of the first through hole, second through-hole and the third through-hole is located at same
On one straight line.
In some embodiments, the ontology includes side wall, and the side wall connects first face and second face,
The side wall includes opposite side wall and downside wall, and the fourth hole is between the straight line and the downside wall.
In some embodiments, the ontology includes side wall, and the side wall connects first face and second face,
The side wall includes opposite side wall and downside wall, and the side wall forms jagged, and recess is formed on first face,
The recess is connected to the notch.
In some embodiments, the position that the recess is formed is corresponding with the position of the 4th chamber.
In some embodiments, the holder further includes the positioning column protruded from the bottom of the recess.
The in-out box of embodiment of the present invention includes：
Input and output module, the input and output module include infrared imaging module, visual light imaging module, laser projection
Device and receiver；With
Holder described in any of the above-described embodiment, the infrared imaging module be mounted on first intracavitary, it is described can
Light-exposed imaging modules are mounted on second intracavitary, and the laser projection module is mounted on the third intracavitary, the receiver
Mounted on the 4th intracavitary.
In some embodiments, the in-out box further includes the flexible PCB of installation on the bracket,
The receiver includes the connection shrapnel of the direction protrusion towards second face along described first, the connection shrapnel and institute
Flexible PCB is stated to contradict to be electrically connected the receiver and the flexible PCB.
In some embodiments, the flexible PCB includes the first segment closed with first face paste and with described
The second segment that two face pastes are closed, the connection shrapnel are contradicted with the second segment, and the in-out box further includes infrared light filling
Lamp, proximity sensor and optical flame detector, the infrared light compensating lamp, the proximity sensor and the optical flame detector are both connected to described
On one section.
In some embodiments, location hole is offered on the flexible PCB, the location hole is described for positioning
The installation site of flexible PCB on the bracket.
The electronic device of embodiment of the present invention includes：
Shell；With
In-out box described in any of the above-described embodiment, the in-out box are mounted in the shell.
In some embodiments, the electronic device further includes the mainboard being fixed in the shell, and the input is defeated
Go out module to be electrically connected with the mainboard, the mainboard is formed with installing port, the holder wear the installing port and with the master
Plate is fixedly connected.
In some embodiments, the shell includes front housing and rear shell, and the front housing offsets with first face and institute
Rear shell is stated to offset so that the holder is clamped with second face.
In some embodiments, the electronic device further includes cover board, the cover board and the input and output mould splits
Not Wei Yu the front housing opposite both sides, the front housing offer the first perforation, second perforation, third perforation and the 4th perforation,
First perforation is corresponding with the infrared imaging module, and second perforation is corresponding with the visual light imaging module, described
Third perforation it is corresponding with the laser projection module, it is described 4th perforate it is corresponding with the receiver, the cover board with it is described
First perforation and the third perforation corresponding position be formed with it is infrared penetrate ink, the cover board opens up corresponding with the 4th perforation
Go out acoustic aperture.
It, can will be multiple using a holder in the holder of embodiment of the present invention, in-out box and electronic device
Functional module group is fixed on mobile phone, saves the installation space inside electronic device, is conducive to realize the lightening of electronic device.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become apparent, or the practice of embodiment through the invention is recognized.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, wherein：
Fig. 1 is the perspective exploded view of the electronic device of embodiment of the present invention；
Fig. 2 is the plane assembling schematic diagram of the in-out box of embodiment of the present invention；
Fig. 3 is the plane assembling schematic diagram at another visual angle of in-out box in Fig. 2；
Fig. 4 is the perspective exploded view of the in-out box in Fig. 2；
Fig. 5 is the perspective exploded view at another visual angle of the in-out box in Fig. 2；
Fig. 6 is the part-structure schematic diagram of the electronic device of embodiment of the present invention；
Fig. 7 to Figure 10 is the part-structure signal of the laser projection module of the in-out box of embodiment of the present invention
Figure.
Specific implementation mode
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the same or similar element of expression or element with the same or similar functions eventually.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature
It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is directly under or diagonally below the second feature, or is merely representative of fisrt feature level height and is less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes shell 10, mainboard 20 and in-out box
30.Electronic device 100 can be that mobile phone, tablet computer, laptop computer, game machine, head show equipment, access control system, automatic teller machine etc.,
The embodiment of the present invention is illustrated so that electronic device 100 is mobile phone as an example, it will be understood that the concrete form of electronic device 100 can
To be other, this is not restricted.
Referring to Fig. 1, shell 10 can be given as the installation carrier of mainboard 20 and in-out box 30, shell 10
Mainboard 20 and in-out box 30 provide the protection of dust-proof, waterproof, shatter-resistant, and display screen, electricity are also equipped on shell 10
The components such as pond.Shell 10 include front housing 11 and rear shell 12, front housing 11 be combined with each other with rear shell 12 and by mainboard 20 and input it is defeated
Go out component 30 to be housed between front housing 11 and rear shell 12, the materials such as stainless steel, aluminium alloy, plastics may be used with rear shell 12 in front housing 11
Material is made.
Referring to Fig. 1, mainboard 20 is fixed in shell 10, specifically, mainboard 20 can be solid by the modes such as screwing togather, engaging
It is scheduled in front housing 11 or rear shell 12.Mainboard 20 can be connect with each input and output module 31 (such as Fig. 3) of in-out box 30,
Processing chip, the control chip etc. of electronic device 100 can also be connected on mainboard 20, the circuit being laid on mainboard 20 can be used for
Transmission telecommunications number.Installing port is formed on mainboard 20, installing port is passed through for in-out box 30, reduces mainboard 20 and input is defeated
The space occupied when going out component 30 in shell 10.
It please refers to Fig.1 to Fig.3, in-out box 30 is mounted in shell 10, and in-out box 30 includes that input is defeated
Go out module 31 and holder 32, input and output module 31 is mounted on holder 32.
Input and output module 31 can outwardly send out signal and either receive extraneous signal or be provided simultaneously with outwardly
It sends out signal and receives the function of extraneous signal, wherein signal can be light signal, voice signal, touch signal etc..It can
To understand, according to the different function demand of electronic device 100, the specific type of input and output module 31 and each input and output mould
The quantity of group 31 can be varied from.
Incorporated by reference to Fig. 4 and Fig. 5, in embodiments of the present invention, input and output module 31 include infrared imaging module 311, can
Light-exposed imaging modules 312, laser projection module 313 and receiver 314.Wherein, infrared imaging module 311 can be used for receiving extraneous
Infrared signal to generate infrared image.Visual light imaging module 312 can receive extraneous visible light signal to generate colour
Image.Laser projection module 313 can be used for the projection laser pattern of the target object outside electronic device 100, and laser can be red
Outer laser.Receiver 314 sends out sound wave under the action of drive signal and realizes the functions such as call.In one example, red
Outer imaging modules 311 can receive the laser pattern that laser projection module 313 emits and reflected to form by target object, and laser is thrown
It penetrates module 313 and infrared imaging module 311 is provided commonly for obtaining the depth information of target object.It is infrared imaging module 311, visible
Light imaging modules 312 and laser projection module 313 can be provided commonly for obtaining the depth image of target user, input and output module
Connector 33 can be provided on 31, connector 33 is inserted on mainboard 20 on specific connecting seat, with electrical and mechanical
Input and output module 31 and mainboard 20 are connected, connector 33 is extracted from connecting seat then can be by input and output module 31 and master
Plate 20 detaches and disconnects electric connection between the two.
It please refers to Fig.1 to Fig.3, holder 32 is an integral molding structure, and holder 32 is for installing input and output module 31.Holder
32 include ontology 321.
Ontology 321 includes the first face 3211, the second face 3212 and side wall 3213.3212 phase of first face 3211 and the second face
The back of the body, side wall 3213 connect the first face 3211 and the second face 3212, and side wall 3213 includes opposite side wall 3214 and downside wall
3215.When in-out box 30 to be mounted in shell 10, front housing 11 can offset with the first face 3211, and rear shell 12 can be with
It offsets with clamp bracket 32 with the second face 3212, avoids holder 32 and input and output module 31 along the thickness side of electronic device 100
It is mobile to (Z-direction in such as Fig. 1), meanwhile, the installation corresponding with the position of the installing port of mainboard 20 of holder 32, the side wall of holder 32
3213 can offset with the inner wall of installing port so that holder 32 is stuck in installing port, it is only necessary to be fixed the position of mainboard 20, just
It is mobile along the width direction (Y-direction in such as Fig. 1) of electronic device 100 to can avoid holder 32 and input and output module 31.
Incorporated by reference to Fig. 4 and Fig. 5, the second face 3212 offers host cavity 322.First face 3211 offers and host cavity 322
Corresponding through-hole 323, host cavity 322 is between side wall 3214 and downside wall 3215.Host cavity 322 is defeated for accommodating input
Go out module 31.The concrete shape of host cavity 322 is corresponding with the shape of corresponding input and output module 31, the cavity of host cavity 322
Input and output module 31 can be slightly larger than in order to the dispensing in host cavity 322, the cavity of host cavity 322 can also be slightly less than defeated
Enter to export module 31 so that input and output module 31 can be mounted on by interference fit in host cavity 322.The quantity of host cavity 322
It can be equal with the quantity of input and output module 31.When input and output module 31 is mounted on holder 32, input and output module
31 expose from through-hole 323.In embodiments of the present invention, refer to can be from the first face 3211 or from the second face 3212 for exposure
To input and output module 31, for example, input and output module 31 can pass through the through-hole 323 in the first face 3211 sudden and violent from the first face 3211
Dew, input and output module 31 can also not pass through through-hole 323, but by through-hole 323 it can be seen that input and output module 31.
Specifically, host cavity 322 includes the first chamber 3221, the second chamber 3222, third chamber 3223 and the 4th chamber 3224.Wherein
First chamber 3221, the second chamber 3222 and third chamber 3223 are arranged in order, be arranged in order can be along holder 32 length direction according to
Secondary arrangement can be specifically to array from left to right, can also be to be arranged in order from right to left.In implementation as shown in Figure 5
In example, the 4th chamber 3224 is between the second chamber 3222 and third chamber 3223, and in other embodiments, the 4th chamber 3224 can also
Between the first chamber 3221 and the second chamber 3222；Or the 4th chamber 3224 be located at the opposite with the second chamber 3222 of the first chamber 3221
Side；Or the 4th chamber 3224 be located at the side opposite with the second chamber 3222 of third chamber 3223.
First chamber 3221 is for installing infrared imaging module 311, and the second chamber 3222 is for installing visual light imaging module
312, third chamber 3223 is for installing laser projection module 313, and the 4th chamber 3224 is for installing receiver 314.In other words, may be used
Infrared imaging module 311, visual light imaging module 312, laser projection module 313 and receiver 314 are sequentially arranged at
In one chamber 3221, the second chamber 3222, third chamber 3223 and the 4th chamber 3234.Side wall 3213 includes multiple spaced walls 3218.It is multiple
Between host cavity 322 can be apart from one another by, such as the first chamber 3221, the second chamber 3222, third chamber 3223 and the 4th chamber 3224 pass through
Next door 3218 is spaced (such as Fig. 5) successively, can also be that the host cavity 322 of any two or three etc. interconnects, such as first
Chamber 3221 is connected to the second chamber 3222, the second chamber 3222 and the 4th chamber 3224 interval etc..
Through-hole 323 include first through hole 3231, the second through-hole 3232, third through-hole 3233 and fourth hole 3234, first
Through-hole 3231, the second through-hole 3232, third through-hole 3233 and fourth hole 3234 respectively with the first chamber 3221, the second chamber 3222,
Third chamber 3223 is connected to the 4th chamber 3224, and in other words, first through hole 3231 is connected to the first chamber 3221, the second through-hole 3232
It is connected to the second chamber 3222, third through-hole 3233 is connected to third chamber 3223, fourth hole 3234 is connected to the 4th chamber 3224.Separately
Outside, fourth hole 3234 is also corresponding with the sound mouth of receiver 314.The aperture of fourth hole 3234 is smaller than receiver 314
The aperture of sound mouth, in this way, receiver 314 can not pass through fourth hole 3234, the sound wave that receiver 314 is sent out can pass through
Fourth hole 3234 simultaneously enters extraneous.The center of first through hole 3231, the second through-hole 3232 and third through-hole 3233 is located at same
On straight line L, fourth hole 3234 (as shown in Figure 2) between straight line L and downside wall 3215.Infrared imaging module 311, can
After light-exposed imaging modules 312 and laser projection module 313 are installed, infrared imaging module 311 is pierced by from first through hole 3231, it is seen that
Light imaging modules 312 are pierced by from the second through-hole 3232, and laser projection module 313 is pierced by from third through-hole 3233, the optical axis of three
In being generally aligned in the same plane, it is easy to three and works in coordination work.Infrared imaging module 311, visual light imaging module 312 and laser are thrown
The top surface for being pierced by through-hole 323 for penetrating module 313 also flushes, specifically, incidence surface, the visual light imaging of infrared imaging module 311
The incidence surface of module 312 and the light-emitting surface of laser projection module 313 can be located in approximately the same plane.
To sum up, the electronic device 100 of embodiment of the present invention can be defeated by multiple input since holder 32 is integrally formed
Go out module 31 on the same holder 32 and be housed in host cavity 322, in this way, saving the peace inside electronic device 100
Space is filled, is conducive to realize the lightening of electronic device 100.In addition, the input and output module 31 on the same holder 32
The relative position that multiple input will not be caused to export module 31 because movement occurs for holder 32 changes, to make multiple input
Exporting module 31 being capable of preferably cooperating.
Fig. 2 and Fig. 4 are please referred to, in some embodiments, side wall 3214 forms jagged 3216, on the first face 3211
It is formed with recess 3217, recess 3217 is connected to notch 3216.In-out box 30 further includes infrared light compensating lamp 35, close biography
Sensor 36 and optical flame detector 37.Infrared light compensating lamp 35 for emitting infrared light outward, and proximity sensor 36 is for detecting target object
To the distance of electronic device 100, optical flame detector 37 is used to detect the intensity of ambient light, wherein proximity sensor 36 and optical flame detector 37
A module can be integrated into.Infrared light compensating lamp 35, proximity sensor 36 and optical flame detector 37 are mounted in recess 3217.In this hair
In bright embodiment, the position that recess 3217 is formed is corresponding with the position of the 4th chamber 3224.
Fig. 4 and Fig. 5 are please referred to, in some embodiments, in-out box 30 further includes flexible PCB 34, called
Device 314 includes connection shrapnel 3141, and the direction that connection shrapnel 3141 is directed toward the second face 3212 along the first face 3211 is protruded, connection
Shrapnel 3141 is contradicted with flexible PCB 34 to be electrically connected receiver 314 and flexible PCB 34.Specifically, flexible PCB 34
One end may be coupled on mainboard 20, could be formed with contact 345 on flexible PCB 34, connect shrapnel 3141 and contact
345 contradict to be electrically connected receiver 314 and flexible PCB 34.In one example, the contact 345 on flexible PCB 34 can
Multigroup to have, connection shrapnel 3141 is contradicted with any one group of contact 345 can be electrically connected receiver 314 and mainboard 20, in this way, only
Want sound mouth and the second through-hole 3232 of receiver 314 opposite, receiver 314 can be installed in the second chamber with multiple angles
In 3222, and connection shrapnel 3141 can contradicted with contact 345.
Please see Fig. 2 to Fig. 4, in some embodiments, flexible PCB 34 includes first segment 341 and second segment 342.
First segment 341 be bonded with the first face 3211 (offered on the first face 3211 recess 3217 when, first segment 341 with recess 3217
Bottom fitting), second segment 342 is bonded with the second face 3212.Shrapnel 3141 is connected to contradict with second segment 342.Input and output group
Part 30 further includes infrared light compensating lamp 35, proximity sensor 36 and optical flame detector 37, infrared light compensating lamp 35, proximity sensor 36 and light sensation
Device 37 is installed on first segment 341.
In embodiments of the present invention, flexible PCB 34 further includes the linkage section for connecting first segment 341 and second segment 342
343, linkage section 343 passes through notch 3216.Specifically, first segment 341 is housed in recess 3217, and second segment 342 is from linkage section
343 directions that downside wall 3145 is directed toward along side wall 3142 extend.In this way, can be connected by a flexible PCB 34
Infrared light compensating lamp 35, proximity sensor 36, optical flame detector 37 and receiver 314, the overall structure of in-out box 30 are simpler
It is compact.
Fig. 2 and Fig. 4 are please referred to, in some embodiments, holder 32 further includes determining from the bottom of recess 3217 protrusion
Position column 324.Positioning column 324 is between straight line L and side wall 3214.Positioning column 324 can be used for location and installation in holder 32
On element, the elements such as flexible PCB 34, infrared light compensating lamp 35, proximity sensor 36 or optical flame detector 37 as escribed above, prevent
Only element shakes.Specifically, positioning column 324 wears and fixes the first segment 341 of flexible PCB 34, therefore, setting
Infrared light compensating lamp 35, proximity sensor 36 and optical flame detector 37 on first segment 341 are also fixed, the center of the 4th chamber 3224
The both sides of straight line L can be located at positioning column 324.The quantity of positioning column 324 can be multiple, and multiple positioning columns 324 divide
Periphery in infrared light compensating lamp 35, proximity sensor 36 and optical flame detector 37 is not set, element is so further fixed.
Fig. 3 and Fig. 5 are please referred to, in some embodiments, holder 32 further includes support positioning block 325, support positioning block
325 is corresponding with the position of the second chamber 3222, and specifically, support positioning block 325 is protruded from the second face 3212.Support positioning block 325
It can be used for flexible PCB 34 of the location and installation on holder 32, prevent flexible PCB 34 from shaking, specifically, holder
Locating piece 325 wears and fixes the second segment 342 of flexible PCB 34.
Fig. 4 and Fig. 5 are please referred to, in some embodiments, location hole 344, location hole are offered on flexible PCB 34
344 are used for installation site of the positioning flexible circuit board 34 on holder 32.Specifically, location hole 344 can be opened in first segment
341, second segment 342 or linkage section 343 it is arbitrary on one or more snippets, in embodiment as shown in Figure 4 and Figure 5, location hole
344 are opened on first segment 341 and second segment 342 simultaneously, and the position that location hole 344 opens up can be with above-mentioned positioning column 324
It is corresponding with the position of support positioning block 325, when installing flexible PCB 34, first segment 341 is bonded with the first face 3211 (
When offering recess 3217 on the first face 3211, first segment 341 is bonded with the bottom of recess 3217) and by location hole 344 and determine
Position column 324 coordinates, and second segment 342 is bonded with the second face 3212 and coordinates location hole 344 and support positioning block 325, in this way,
The position of flexible PCB 34 is not susceptible to shake.
It please refers to Fig.1 and Fig. 6, in some embodiments, electronic device 100 further includes cover board 40, cover board 40 and input
Output module 31 is located at the opposite both sides of front housing 11.Front housing 11 offers the first perforation 111, second perforation 112, third is worn
The perforation of hole 113 and the 4th 114.First perforation 111 is corresponding with infrared imaging module 311, the second perforation 112 and visual light imaging
Module 312 corresponds to, and third perforation 113 is corresponding with laser projection module 313, and the 4th perforation 114 is corresponding with receiver 314.Cover board
40 are being formed with infrared transmission ink 50 with the first perforation 111 and 113 corresponding positions of third perforation, and cover board 40 opens up and the 4th perforation
114 it is corresponding go out acoustic aperture 41.
Specifically, cover board 40 can be light transmission, and the material of cover board 40 can be glass, resin, plastics of light transmission etc..Lid
First perforation of the covering of plate 40,111, second perforation 112, third perforation 113 and the 4th perforation 114.Ambient passes through cover board 40
Enter infrared imaging module 311 by the first perforation 111 afterwards.The sound wave that receiver 314 is sent out is worn again after passing through the 4th perforation 114
Cross out acoustic aperture 41.The laser that laser projection module 313 is sent out is pierced by cover board 40 after passing through third perforation 113, and ambient passes through
Enter visual light imaging module 312 by the second perforation 112 after cover board 40.In the present embodiment, cover board 40 is perforated with first
111 and third perforate 113 corresponding positions be formed with it is infrared penetrate ink 50.It is infrared to have higher transmission to infrared light through ink 50
Rate, such as 85% or more is can reach, and have higher attenuation rate to visible light, such as can reach 70% or more so that user
During normal use, it is visually difficult to see that on electronic device 100 by the infrared region covered through ink 50.In this way, user is difficult
To see the internal structure of electronic device 100 (that is, being difficult to see that infrared imaging mould by the first perforation 111 and third perforation 113
Group 311 and laser projection module 313), the shape of electronic device 100 is more beautiful.
Referring to Fig. 7, in some embodiments, laser projection module 313 include board unit 3121, lens barrel 3122,
Light source 3123, collimating element 3124, diffraction optical element (diffractive optical elements, DOE) 3125 and guarantor
Protecting cover 3126.
Board unit 3121 includes substrate 31211 and circuit board 31212.Circuit board 31212 is arranged on substrate 31211,
Circuit board 31212 is used to connect the mainboard 20 of light source 3123 and electronic device 100, circuit board 31212 can be hardboard, soft board or
Rigid Flex.
Lens barrel 3122 is fixedly connected with board unit 3121, and lens barrel 3122 is formed with accommodating cavity 31221, and lens barrel 3122 includes
The peripheral wall 31224 of roof 31222 and the annular extended from roof 31222, peripheral wall 31224 are arranged on board unit 3121, top
Wall 31222 offers the light hole 31225 being connected to accommodating cavity 31221.Peripheral wall 31224 can pass through viscous with circuit board 31212
Glue connection.
Protection cap 3126 is arranged on roof 31222.Protection cap 3126 includes offering the baffle of light extraction through-hole 31260
31262 and from baffle 31262 extend annular sidewall 31264.
Light source 3123 is arranged at collimating element 3124 in accommodating cavity 31221, and diffraction optical element 3125 is mounted on mirror
On cylinder 3122, collimating element 3124 is successively set on diffraction optical element 3125 in the luminous light path of light source 3123.Collimation member
The laser that part 3124 sends out light source 3123 collimates, and laser is then passed through diffraction optical element after passing through collimating element 3124
3125 to form laser pattern.
Light source 3123 can be vertical cavity surface emitting laser (Vertical Cavity Surface Emitting
Laser, VCSEL) or edge-emitting laser (edge-emitting laser, EEL), in the embodiment as shown in figure 7,
Light source 3123 is edge-emitting laser, and specifically, light source 3123 can be distributed feedback laser (Distributed
Feedback Laser, DFB).Light source 3123 into accommodating cavity 31221 for emitting laser.Incorporated by reference to Fig. 8, light source 3123 is whole
Body is in the form of a column, and an end face of the light source 3123 far from board unit 3121 forms light-emitting surface 31231, and laser is from light-emitting surface 31231
It sends out, light-emitting surface 31231 is towards collimating element 3124.Light source 3123 is fixed on board unit 3121, specifically, light source 3123
It can be bonded on board unit 3121 by sealing 3127, such as the one side opposite with light-emitting surface 31231 of light source 3123 is viscous
It is connected on board unit 3121.Incorporated by reference to Fig. 7 and Fig. 9, the side 31232 of light source 3123 can also be bonded in board unit 3121
On, sealing 3127 wraps the side 31232 of surrounding, can also only bond some face and the board unit of side 31232
3121 or cohesive certain several face and board unit 3121.Sealing at this time 3127 can be heat-conducting glue, and light source 3123 is worked and is produced
Raw heat is conducted into board unit 3121.
Referring to Fig. 7, diffraction optical element 3125 is carried on roof 31222 and is housed in protection cap 3126.Diffraction
The opposite both sides of optical element 3125 are contradicted with protection cap 3126 and roof 31222 respectively, and baffle 31262 includes close to light hole
31225 resistance surface 31263, diffraction optical element 3125 are contradicted with resistance surface 31263.
Specifically, diffraction optical element 3125 includes opposite the diffraction plane of incidence 31252 and diffraction exit facet 31254.Spread out
It penetrates optical element 3125 to be carried on roof 31222, diffraction exit facet 31254 and the close light hole 31225 of baffle 31262
Surface (resistance surface 31263) contradicts, and the diffraction plane of incidence 31252 is contradicted with roof 31122.Light hole 31225 and accommodating cavity 31221
Alignment, light extraction through-hole 31260 are aligned with light hole 31225.Roof 31222, annular sidewall 31264 and baffle 31262 and diffraction
Optical element 3125 contradicts, to prevent diffraction optical element 3125 from falling off out of protection cap 3126 along light direction.Certain
In embodiment, protection cap 3126 is pasted onto by glue on roof 31222.
The light source 3123 of above-mentioned laser projection module 313 use edge-emitting laser, one side edge-emitting laser compared with
The temperature drift of VCSEL array is smaller, on the other hand, since edge-emitting laser is single-point light emitting structure, is not necessarily to array of designs structure,
It makes simply, the cost of light source of laser projection module 313 is relatively low.
The laser of distributed feedback laser obtains the gain of power by the feedback of optical grating construction when propagating.It carries
The power of high distributed feedback laser is needed by increasing Injection Current and/or increasing the length of distributed feedback laser,
Since increase Injection Current can make the power consumption of distributed feedback laser increase and serious problem of generating heat occurs,
In order to ensure that distributed feedback laser can work normally, the length for increasing distributed feedback laser is needed, causes to be distributed
Feedback laser is generally in elongate strip structure.When the light-emitting surface 31231 of edge-emitting laser is towards collimating element 3124, side
Emitting laser is placed in vertical, and since edge-emitting laser is in elongate strip structure, edge-emitting laser, which is susceptible to, to be fallen, moves
Position or shaking etc. are unexpected, therefore can be fixed edge-emitting laser by the way that sealing 3127 is arranged, and prevent edge-emitting laser
Fall, displacement or shaking etc. it is unexpected.
Fig. 7 and Figure 10 are please referred to, in some embodiments, light source 3123 can also use fixation side as shown in Figure 10
Formula is fixed on board unit 3121.Specifically, laser projection module 313 includes multiple supporting blocks 3128, and supporting block 3128 can
To be fixed on board unit 3121,3128 common ambient light source 3123 of multiple supporting blocks when mounted can be by light source 3123
It is directly installed between multiple supporting blocks 3128.In one example, multiple supporting blocks 3128 jointly clamping light source 3123, with into
One step prevents light source 3123 from shaking.
In some embodiments, protection cap 3126 can be omitted, and diffraction optical element 3125, which can be arranged, at this time is holding
It sets in chamber 31221, the diffraction exit facet 31254 of diffraction optical element 3125 can offset with roof 31222, and laser passes through diffraction
Light hole 31225 is pierced by after optical element 3125 again.In this way, diffraction optical element 3125 is not easily to fall off.
In some embodiments, substrate 31211 can save, and light source 3123 can be directly anchored to circuit board 31212
On to reduce the integral thickness of laser projection module 313.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means in conjunction with the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, and the scope of the present invention is limited by claim and its equivalent.
Claims (16)
1. a kind of holder, which is characterized in that for installing input and output module, the holder is an integral molding structure and includes this
Body, the input and output module include infrared imaging module, visual light imaging module, laser projection module and receiver, described
Ontology includes opposite the first face and the second face, and second face offers host cavity, and first face offers and the receipts
The through-hole of vessel connection, the input and output module are housed in the host cavity and are exposed from the through-hole, the host cavity
Including the first chamber, the second chamber and third chamber being arranged in order, first chamber is for installing the infrared imaging module, and described the
Two chambers are for installing the visual light imaging module, and the third chamber is for installing the laser projection module, the host cavity
Further include the 4th chamber, the 4th chamber is for installing the receiver.
2. holder according to claim 1, which is characterized in that the 4th chamber is located at first chamber and second chamber
Between；Or the 4th chamber is between second chamber and the third chamber.
3. holder according to claim 1, which is characterized in that the through-hole includes that first through hole, the second through-hole, third are logical
Hole and fourth hole, the first through hole are connected to first chamber, and second through-hole is connected to second chamber, and described
Three through-holes are connected to the third chamber, and the fourth hole is connected to the 4th chamber.
4. holder according to claim 3, which is characterized in that the first through hole, second through-hole and the third
The center of through-hole is located along the same line.
5. holder according to claim 4, which is characterized in that the ontology includes side wall, side wall connection described the
On one side with second face, the side wall includes opposite side wall and downside wall, the fourth hole be located at the straight line with
Between the downside wall.
6. holder according to claim 1, which is characterized in that the ontology includes side wall, side wall connection described the
On one side with second face, the side wall includes opposite side wall and downside wall, the side wall formed it is jagged, described
Recess is formed on one side, the recess is connected to the notch.
7. holder according to claim 6, which is characterized in that the position for the position and the 4th chamber that the recess is formed
It is corresponding.
8. holder according to claim 6, which is characterized in that the holder further includes being protruded from the bottom of the recess
Positioning column.
9. a kind of in-out box, which is characterized in that including：
Input and output module, the input and output module include infrared imaging module, visual light imaging module, laser projecting apparatus and
Receiver；With
Holder described in claim 1-8 any one, the infrared imaging module is mounted on first intracavitary, described visible
Light imaging modules are mounted on second intracavitary, and the laser projection module is mounted on the third intracavitary, the receiver peace
Mounted in the 4th intracavitary.
10. in-out box according to claim 9, which is characterized in that the in-out box further includes installation
Flexible PCB on the bracket, the receiver include being protruded along the described first direction towards second face
Shrapnel is connected, the connection shrapnel is contradicted with the flexible PCB to be electrically connected the receiver and the flexible PCB.
11. in-out box according to claim 10, which is characterized in that the flexible PCB includes and described
The first segment being bonded on one side and the second segment closed with second face paste, the connection shrapnel is contradicted with the second segment, described
In-out box further includes infrared light compensating lamp, proximity sensor and optical flame detector, the infrared light compensating lamp, the proximity sensor
It is both connected on the first segment with the optical flame detector.
12. the in-out box according to claim 10 or 11, which is characterized in that offered on the flexible PCB
Location hole, the location hole is for positioning the installation site of the flexible PCB on the bracket.
13. a kind of electronic device, which is characterized in that including：
Shell；With
In-out box described in claim 9-12 any one, the in-out box are mounted in the shell.
14. electronic device according to claim 13, which is characterized in that the electronic device further includes being fixed on the shell
Internal mainboard, the input and output module are electrically connected with the mainboard, and the mainboard is formed with installing port, and the holder is worn
It the installing port and is fixedly connected with the mainboard.
15. electronic device according to claim 14, which is characterized in that the shell includes front housing and rear shell, before described
Shell offsets with first face and the rear shell offsets with second face the holder is clamped.
16. electronic device according to claim 15, which is characterized in that the electronic device further includes cover board, the lid
Plate is located at the opposite both sides of the front housing with the input and output module, and the front housing offers the first perforation, second wears
Hole, third perforation and the 4th perforation, it is described first perforation it is correspondings with the infrared imaging module, it is described second perforate and it is described can
Light-exposed imaging modules correspond to, and the third perforation is corresponding with the laser projection module, the 4th perforation and the receiver
Corresponding, the cover board infrared penetrates ink, the cover board being formed with first perforation and third perforation corresponding position
Open up it is corresponding with the 4th perforation go out acoustic aperture.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810317084.XA CN108401045A (en) | 2018-04-10 | 2018-04-10 | Holder, in-out box and electronic device |
| EP19773330.6A EP3609168B1 (en) | 2018-04-10 | 2019-04-03 | Support, input/output assembly and terminal |
| PCT/CN2019/081325 WO2019196726A1 (en) | 2018-04-10 | 2019-04-03 | Support, input/output assembly and terminal |
| US16/493,286 US11330090B2 (en) | 2018-04-10 | 2019-04-03 | Bracket, input/output assembly and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810317084.XA CN108401045A (en) | 2018-04-10 | 2018-04-10 | Holder, in-out box and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108401045A true CN108401045A (en) | 2018-08-14 |
Family
ID=63099870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810317084.XA Pending CN108401045A (en) | 2018-04-10 | 2018-04-10 | Holder, in-out box and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108401045A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109194781A (en) * | 2018-08-22 | 2019-01-11 | Oppo广东移动通信有限公司 | Bracket, in-out box and mobile device |
| CN109361877A (en) * | 2018-12-25 | 2019-02-19 | 信利光电股份有限公司 | More camera module group arrangements and technique |
| WO2019196726A1 (en) * | 2018-04-10 | 2019-10-17 | Oppo广东移动通信有限公司 | Support, input/output assembly and terminal |
| WO2019196524A1 (en) * | 2018-04-10 | 2019-10-17 | Oppo广东移动通信有限公司 | Input and output assembly, and terminal |
| WO2020038052A1 (en) * | 2018-08-22 | 2020-02-27 | Oppo广东移动通信有限公司 | Input/output assembly and mobile device |
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| CN107483692A (en) * | 2017-08-22 | 2017-12-15 | 广东欧珀移动通信有限公司 | Cover assembly, housing unit, the processing method of housing unit and mobile terminal |
| US20170364172A1 (en) * | 2016-06-21 | 2017-12-21 | Samsung Electronics Co., Ltd. | Cover window and electronic device including same |
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| US20170364172A1 (en) * | 2016-06-21 | 2017-12-21 | Samsung Electronics Co., Ltd. | Cover window and electronic device including same |
| CN107483692A (en) * | 2017-08-22 | 2017-12-15 | 广东欧珀移动通信有限公司 | Cover assembly, housing unit, the processing method of housing unit and mobile terminal |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019196726A1 (en) * | 2018-04-10 | 2019-10-17 | Oppo广东移动通信有限公司 | Support, input/output assembly and terminal |
| WO2019196524A1 (en) * | 2018-04-10 | 2019-10-17 | Oppo广东移动通信有限公司 | Input and output assembly, and terminal |
| US11330090B2 (en) | 2018-04-10 | 2022-05-10 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Bracket, input/output assembly and terminal |
| CN109194781A (en) * | 2018-08-22 | 2019-01-11 | Oppo广东移动通信有限公司 | Bracket, in-out box and mobile device |
| WO2020038052A1 (en) * | 2018-08-22 | 2020-02-27 | Oppo广东移动通信有限公司 | Input/output assembly and mobile device |
| CN109194781B (en) * | 2018-08-22 | 2021-03-09 | Oppo广东移动通信有限公司 | Support, input/output assembly and mobile device |
| CN109361877A (en) * | 2018-12-25 | 2019-02-19 | 信利光电股份有限公司 | More camera module group arrangements and technique |
| CN109361877B (en) * | 2018-12-25 | 2020-11-27 | 信利光电股份有限公司 | Multi-camera module assembly and method |
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Application publication date: 20180814 |
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