CN208386605U - Bracket, in-out box and electronic device - Google Patents
Bracket, in-out box and electronic device Download PDFInfo
- Publication number
- CN208386605U CN208386605U CN201820506787.2U CN201820506787U CN208386605U CN 208386605 U CN208386605 U CN 208386605U CN 201820506787 U CN201820506787 U CN 201820506787U CN 208386605 U CN208386605 U CN 208386605U
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- chamber
- mould group
- hole
- bracket
- face
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- 238000003331 infrared imaging Methods 0.000 claims abstract description 26
- 238000003384 imaging method Methods 0.000 claims abstract description 23
- 230000000007 visual effect Effects 0.000 claims abstract description 20
- 238000009434 installation Methods 0.000 claims abstract description 13
- 238000000465 moulding Methods 0.000 claims abstract description 4
- 230000003287 optical effect Effects 0.000 claims description 32
- 230000005540 biological transmission Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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Abstract
The utility model discloses a kind of brackets.For installing input and output mould group, bracket is an integral molding structure and including ontology bracket.Input and output mould group includes infrared imaging mould group, visual light imaging mould group, laser projection mould group and receiver.Ontology includes opposite the first face and the second face.Second face offers accommodating chamber, and the first face offers the through-hole being connected to accommodating chamber, and input and output mould group is housed in accommodating chamber and exposes from through-hole.Accommodating chamber includes the first chamber, the second chamber and third chamber being arranged successively.First chamber is for installing infrared imaging mould group, and the second chamber is for installing visual light imaging mould group, and third chamber is for installing laser projection mould group.Accommodating chamber further includes the 4th chamber, and the 4th chamber is for installing receiver.The invention also discloses a kind of in-out box and electronic devices.Multiple functional module groups can be fixed on mobile phone by one bracket, save the installation space inside electronic device, conducive to the lightening of electronic device is realized.
Description
Technical field
The utility model relates to consumer electronics technical fields, more specifically, are related to a kind of bracket, in-out box
And electronic device.
Background technique
In the related art, mobile phone configuration has multiple functional module groups, and multiple functional module groups generally require multiple brackets with
Functional module group is fixed on mobile phone one by one, the space for causing multiple brackets to occupy interior of mobile phone is larger, is unfavorable for the light of mobile phone
Thinning.
Utility model content
The utility model embodiment provides a kind of bracket, in-out box and electronic device.
For installing input and output mould group, the bracket is an integral molding structure simultaneously the bracket of the utility model embodiment
Including ontology, the input and output mould group includes infrared imaging mould group, visual light imaging mould group, laser projection mould group and called
Device, the ontology include opposite the first face and the second face, and second face offers accommodating chamber, first face offer with
The through-hole of the accommodating chamber connection, the input and output mould group is housed in the accommodating chamber and from through-hole exposure, described
Accommodating chamber includes the first chamber, the second chamber and third chamber being arranged successively, and first chamber is used to install the infrared imaging mould group,
For second chamber for installing the visual light imaging mould group, the third chamber is described for installing the laser projection mould group
Accommodating chamber further includes the 4th chamber, and the 4th chamber is for installing the receiver.
In some embodiments, the 4th chamber is between first chamber and second chamber；Or the described 4th
Chamber is between second chamber and the third chamber.
In some embodiments, the through-hole includes first through hole, the second through-hole, third through-hole and fourth hole, institute
It states first through hole to be connected to first chamber, second through-hole is connected to second chamber, the third through-hole and described the
The connection of three chambers, the fourth hole are connected to the 4th chamber.
In some embodiments, the center of the first through hole, second through-hole and the third through-hole is located at same
On one straight line.
In some embodiments, the ontology includes side wall, and the side wall connects first face and second face,
The side wall includes opposite side wall and downside wall, and the fourth hole is between the straight line and the downside wall.
In some embodiments, the ontology includes side wall, and the side wall connects first face and second face,
The side wall includes opposite side wall and downside wall, and the side wall forms jagged, is formed with recess on first face,
The recess is connected to the notch.
In some embodiments, the position that the recess is formed is corresponding with the position of the 4th chamber.
In some embodiments, the bracket further includes the positioning column protruded from the bottom of the recess.
The in-out box of the utility model embodiment includes:
Input and output mould group, the input and output mould group include infrared imaging mould group, visual light imaging mould group, laser projection
Device and receiver；With
Bracket described in any of the above-described embodiment, the infrared imaging mould group be mounted on it is described first intracavitary, it is described can
Light-exposed imaging modules are mounted on described second intracavitary, and it is intracavitary that the laser projection mould group is mounted on the third, the receiver
It is intracavitary to be mounted on the described 4th.
In some embodiments, the in-out box further includes the flexible circuit board of installation on the bracket,
The receiver includes the connection elastic slice of the direction protrusion along described first towards second face, the connection elastic slice and institute
Flexible circuit board is stated to contradict to be electrically connected the receiver and the flexible circuit board.
In some embodiments, the flexible circuit board includes the first segment closed with first face paste and with described the
The second segment that two face pastes are closed, the connection elastic slice and the second segment contradict, and the in-out box further includes infrared light filling
Lamp, proximity sensor and optical flame detector, the infrared light compensating lamp, the proximity sensor and the optical flame detector are both connected to described
On one section.
In some embodiments, location hole is offered on the flexible circuit board, the location hole is described for positioning
The installation site of flexible circuit board on the bracket.
The electronic device of the utility model embodiment includes:
Shell；With
In-out box described in any of the above-described embodiment, the in-out box are mounted in the shell.
In some embodiments, the electronic device further includes being fixed on the intracorporal mainboard of the shell, and the input is defeated
Depanning group is electrically connected with the mainboard, and the mainboard is formed with installing port, the bracket wear the installing port and with the master
Plate is fixedly connected.
In some embodiments, the shell includes front housing and rear shell, and the front housing and first face offset and institute
It states rear shell and second face offsets to clamp the bracket.
In some embodiments, the electronic device further includes cover board, the cover board and the input and output mould splits
Not Wei Yu the front housing opposite two sides, the front housing offer the first perforation, second perforation, third perforation and the 4th perforation,
First perforation is corresponding with the infrared imaging mould group, and second perforation is corresponding with the visual light imaging mould group, described
Third perforation it is corresponding with the laser projection mould group, it is described 4th perforate it is corresponding with the receiver, the cover board with it is described
First perforation and third perforation corresponding position are formed with infrared through ink, and the cover board opens up corresponding with the 4th perforation
Go out acoustic aperture.
It, can will using a bracket in the bracket of the utility model embodiment, in-out box and electronic device
Multiple functional module groups are fixed on mobile phone, save the installation space inside electronic device, conducive to the lightening of electronic device is realized.
The additional aspect and advantage of the embodiments of the present invention will be set forth in part in the description, partially will be from
Become obvious in following description, or is recognized by the practice of the embodiments of the present invention.
Detailed description of the invention
In description of the above-mentioned and/or additional aspect and advantage of the utility model from combination following accompanying drawings to embodiment
It will be apparent and be readily appreciated that, in which:
Fig. 1 is the perspective exploded view of the electronic device of the utility model embodiment；
Fig. 2 is the plane assembling schematic diagram of the in-out box of the utility model embodiment；
Fig. 3 is the plane assembling schematic diagram at another visual angle of in-out box in Fig. 2；
Fig. 4 is the perspective exploded view of the in-out box in Fig. 2；
Fig. 5 is the perspective exploded view at another visual angle of the in-out box in Fig. 2；
Fig. 6 is the partial structure diagram of the electronic device of the utility model embodiment；
Fig. 7 to Figure 10 is that the part-structure of the laser projection mould group of the in-out box of the utility model embodiment shows
It is intended to.
Specific embodiment
The embodiments of the present invention is described further below in conjunction with attached drawing.Same or similar label in attached drawing
Same or similar element or element with the same or similar functions are indicated from beginning to end.
In addition, the embodiments of the present invention described with reference to the accompanying drawing is exemplary, it is only used for explaining this reality
With novel embodiment, and should not be understood as limiting the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature is in the second feature " on " or " down "
It can be that the first and second features directly contact or the first and second features are by intermediary mediate contact.Moreover, first is special
Sign can be fisrt feature above the second feature " above ", " above " and " above " and be directly above or diagonally above the second feature, or only
Indicate that first feature horizontal height is higher than second feature.Fisrt feature under the second feature " below ", " below " and " below " can be with
It is that fisrt feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
Referring to Fig. 1, the electronic device 100 of the utility model embodiment includes shell 10, mainboard 20 and input and output
Component 30.Electronic device 100 can be mobile phone, tablet computer, laptop computer, game machine, head and show equipment, access control system, teller
Machine etc., the utility model embodiment are illustrated so that electronic device 100 is mobile phone as an example, it will be understood that the tool of electronic device 100
Body form can be other, and this is not restricted.
Referring to Fig. 1, shell 10 can be used as the installation carrier of mainboard 20 and in-out box 30, shell 10 can be given
Mainboard 20 and in-out box 30 provide the protection of dust-proof, waterproof, shatter-resistant, and display screen, electricity are also equipped on shell 10
The components such as pond.Shell 10 include front housing 11 and rear shell 12, front housing 11 be combined with each other with rear shell 12 and by mainboard 20 and input it is defeated
Component 30 is housed between front housing 11 and rear shell 12 out, and front housing 11 and rear shell 12 can be using materials such as stainless steel, aluminium alloy, plastics
Material is made.
Referring to Fig. 1, mainboard 20 is fixed in shell 10, specifically, mainboard 20 can be solid by the modes such as screwing togather, engaging
It is scheduled in front housing 11 or rear shell 12.Mainboard 20 can be connect with each input and output mould group 31 (such as Fig. 3) of in-out box 30,
Processing chip, the control chip etc. of electronic device 100 can also be connected on mainboard 20, the route being laid on mainboard 20 can be used for
Transmission telecommunications number.Installing port is formed on mainboard 20, installing port is passed through for in-out box 30, reduces mainboard 20 and input is defeated
Component 30 is mounted on the space occupied when in shell 10 out.
It please refers to Fig.1 to Fig.3, in-out box 30 is mounted in shell 10, and in-out box 30 includes that input is defeated
Depanning group 31 and bracket 32, input and output mould group 31 are mounted on bracket 32.
Input and output mould group 31 can outwardly issue signal and perhaps receive extraneous signal or be provided simultaneously with outwardly
It issues signal and receives the function of extraneous signal, wherein signal can be light signal, voice signal, touch signal etc..It can
To understand, according to the different function demand of electronic device 100, the specific type of input and output mould group 31 and every kind of input and output mould
The quantity of group 31 can be varied.
Incorporated by reference to Fig. 4 and Fig. 5, in the utility model embodiment, input and output mould group 31 includes infrared imaging mould group
311, visual light imaging mould group 312, laser projection mould group 313 and receiver 314.Wherein, infrared imaging mould group 311 can be used for connecing
Extraneous infrared signal is received to generate infrared image.Visual light imaging mould group 312 can receive extraneous visible light signal with life
At color image.Laser projection mould group 313 can be used for the projection laser pattern of the target object outside electronic device 100, and laser can
To be infrared laser.Receiver 314 sends out sound wave under the action of driving signal and realizes the functions such as call.In an example
In, infrared imaging mould group 311 can receive the laser pattern that laser projection mould group 313 emits and reflected to form by target object,
Laser projection mould group 313 and infrared imaging mould group 311 are provided commonly for obtaining the depth information of target object.Infrared imaging mould group
311, visual light imaging mould group 312 and laser projection mould group 313 can be provided commonly for obtaining the depth image of target user, input
Connector 33 can be set in output mould group 31, connector 33 is inserted on mainboard 20 on specific attachment base, with electricity
Property and mechanical connection input and output mould group 31 and mainboard 20, connector 33 is extracted from attachment base then can be by input and output mould
Group 31 separates with mainboard 20 and disconnects electric connection between the two.
It please refers to Fig.1 to Fig.3, bracket 32 is an integral molding structure, and bracket 32 is for installing input and output mould group 31.Bracket
32 include ontology 321.
Ontology 321 includes the first face 3211, the second face 3212 and side wall 3213.3212 phase of first face 3211 and the second face
Back, side wall 3213 connect the first face 3211 and the second face 3212, and side wall 3213 includes opposite side wall 3214 and downside wall
3215.When in-out box 30 to be mounted in shell 10, front housing 11 can offset with the first face 3211, and rear shell 12 can be with
It offsets with the second face 3212 with clamp bracket 32, avoids bracket 32 and input and output mould group 31 along the thickness side of electronic device 100
It is mobile to (Z-direction as shown in figure 1), meanwhile, the installation corresponding with the position of the installing port of mainboard 20 of bracket 32, the side wall of bracket 32
3213 can offset with the inner wall of installing port, so that bracket 32 is stuck in installing port, it is only necessary to fix the position of mainboard 20, just
It is mobile along the width direction (Y-direction as shown in figure 1) of electronic device 100 to can avoid bracket 32 and input and output mould group 31.
Incorporated by reference to Fig. 4 and Fig. 5, the second face 3212 offers accommodating chamber 322.First face 3211 offers and accommodating chamber 322
Corresponding through-hole 323, accommodating chamber 322 is between side wall 3214 and downside wall 3215.Accommodating chamber 322 is defeated for accommodating input
Depanning group 31.The concrete shape of accommodating chamber 322 is corresponding with the shape of corresponding input and output mould group 31, the cavity of accommodating chamber 322
Can be slightly larger than input and output mould group 31 in order to the dispensing in accommodating chamber 322, the cavity of accommodating chamber 322 also can be slightly less than defeated
Enter to export mould group 31 so that input and output mould group 31 can be mounted in accommodating chamber 322 by interference fit.The quantity of accommodating chamber 322
It can be equal with the quantity of input and output mould group 31.When input and output mould group 31 is mounted on bracket 32, input and output mould group
31 expose from through-hole 323.In the utility model embodiment, exposure refers to can be from the first face 3211 or from the second face
3212 see input and output mould group 31, for example, input and output mould group 31 can pass through the through-hole 323 in the first face 3211 from the first face
3211 exposures, input and output mould group 31 can also not pass through through-hole 323, but by through-hole 323 it can be seen that input and output mould group
31。
Specifically, accommodating chamber 322 includes the first chamber 3221, the second chamber 3222, third chamber 3223 and the 4th chamber 3224.Wherein
First chamber 3221, the second chamber 3222 and third chamber 3223 are arranged successively, be arranged successively can be length direction along bracket 32 according to
Secondary arrangement, specifically can be and arrays from left to right, and be also possible to be arranged successively from right to left.In implementation as shown in Figure 5
In example, the 4th chamber 3224 is between the second chamber 3222 and third chamber 3223, and in other embodiments, the 4th chamber 3224 can also be with
Between the first chamber 3221 and the second chamber 3222；Or the 4th chamber 3224 be located at the opposite with the second chamber 3222 of the first chamber 3221
Side；Or the 4th chamber 3224 be located at the side opposite with the second chamber 3222 of third chamber 3223.
First chamber 3221 is for installing infrared imaging mould group 311, and the second chamber 3222 is for installing visual light imaging mould group
312, third chamber 3223 is for installing laser projection mould group 313, and the 4th chamber 3224 is for installing receiver 314.In other words, may be used
Infrared imaging mould group 311, visual light imaging mould group 312, laser projection mould group 313 and receiver 314 are sequentially arranged at
In one chamber 3221, the second chamber 3222, third chamber 3223 and the 4th chamber 3234.Side wall 3213 includes multiple spaced walls 3218.It is multiple
Between accommodating chamber 322 can be apart from one another by, such as the first chamber 3221, the second chamber 3222, third chamber 3223 and the 4th chamber 3224 pass through
Next door 3218 is successively spaced (such as Fig. 5), and the accommodating chamber 322 for being also possible to any two or three etc. interconnects, such as first
Chamber 3221 is connected to the second chamber 3222, the second chamber 3222 and the 4th chamber 3224 interval etc..
Through-hole 323 include first through hole 3231, the second through-hole 3232, third through-hole 3233 and fourth hole 3234, first
Through-hole 3231, the second through-hole 3232, third through-hole 3233 and fourth hole 3234 respectively with the first chamber 3221, the second chamber 3222,
Third chamber 3223 is connected to the 4th chamber 3224, and in other words, first through hole 3231 is connected to the first chamber 3221, the second through-hole 3232
It is connected to the second chamber 3222, third through-hole 3233 is connected to third chamber 3223, fourth hole 3234 is connected to the 4th chamber 3224.Separately
Outside, fourth hole 3234 is also corresponding with the sound mouth of receiver 314.The aperture of fourth hole 3234 is smaller than receiver 314
The aperture of sound mouth, in this way, receiver 314 can not pass through fourth hole 3234, the sound wave that receiver 314 issues can be passed through
Fourth hole 3234 simultaneously enters extraneous.The center of first through hole 3231, the second through-hole 3232 and third through-hole 3233 is located at same
On straight line L, fourth hole 3234 (as shown in Figure 2) between straight line L and downside wall 3215.Infrared imaging mould group 311, can
After light-exposed imaging modules 312 and laser projection mould group 313 are installed, infrared imaging mould group 311 is pierced by from first through hole 3231, it is seen that
Light imaging modules 312 are pierced by from the second through-hole 3232, and laser projection mould group 313 is pierced by from third through-hole 3233, the optical axis of three
It is in the same plane, is easy to three and works in coordination work.Infrared imaging mould group 311, visual light imaging mould group 312 and laser are thrown
The top surface for being pierced by through-hole 323 for penetrating mould group 313 also flushes, specifically, incidence surface, the visual light imaging of infrared imaging mould group 311
The incidence surface of mould group 312 and the light-emitting surface of laser projection mould group 313 can be in approximately the same plane.
To sum up, the electronic device 100 of the utility model embodiment can will be multiple defeated since bracket 32 is integrally formed
Enter to export mould group 31 to be mounted on the same bracket 32 and be housed in accommodating chamber 322, in this way, saving inside electronic device 100
Installation space, conducive to realize electronic device 100 it is lightening.In addition, being mounted on the input and output mould on the same bracket 32
Group 31 will not cause the relative position of multiple input and output mould groups 31 to change because movement occurs for bracket 32, to make multiple
Input and output mould group 31 being capable of preferably cooperating.
Fig. 2 and Fig. 4 are please referred to, in some embodiments, side wall 3214 forms jagged 3216, on the first face 3211
It is formed with recess 3217, recess 3217 is connected to notch 3216.In-out box 30 further includes infrared light compensating lamp 35, close biography
Sensor 36 and optical flame detector 37.Infrared light compensating lamp 35 is for launching outward infrared light, and proximity sensor 36 is for detecting target object
To the distance of electronic device 100, optical flame detector 37 is used to detect the intensity of environment light, wherein proximity sensor 36 and optical flame detector 37
It can integrate as a mould group.Infrared light compensating lamp 35, proximity sensor 36 and optical flame detector 37 are mounted in recess 3217.In this reality
With in new embodiment, the position that recess 3217 is formed is corresponding with the position of the 4th chamber 3224.
Fig. 4 and Fig. 5 are please referred to, in some embodiments, in-out box 30 further includes flexible circuit board 34, called
Device 314 includes connection elastic slice 3141, and connection elastic slice 3141 is protruded along the direction that the second face 3212 is directed toward in the first face 3211, connection
Elastic slice 3141 is contradicted with flexible circuit board 34 to be electrically connected receiver 314 and flexible circuit board 34.Specifically, flexible circuit board 34
One end may be coupled on mainboard 20, could be formed with contact 345 on flexible circuit board 34, connect elastic slice 3141 and contact
345 contradict to be electrically connected receiver 314 and flexible circuit board 34.In one example, the contact 345 on flexible circuit board 34 can
To there is multiple groups, connection elastic slice 3141 is contradicted with any one group of contact 345 can be electrically connected receiver 314 and mainboard 20, in this way, only
Want sound mouth and the second through-hole 3232 of receiver 314 opposite, receiver 314 can be installed in the second chamber with multiple angles
In 3222, and it can make to connect elastic slice 3141 and the conflict of contact 345.
Please see Fig. 2 to Fig. 4, in some embodiments, flexible circuit board 34 includes first segment 341 and second segment 342.
First segment 341 be bonded with the first face 3211 (offered on the first face 3211 recess 3217 when, first segment 341 and recess 3217
Bottom fitting), second segment 342 is bonded with the second face 3212.It connects elastic slice 3141 and second segment 342 contradicts.Input and output group
Part 30 further includes infrared light compensating lamp 35, proximity sensor 36 and optical flame detector 37, infrared light compensating lamp 35, proximity sensor 36 and light sensation
Device 37 is installed on first segment 341.
In the utility model embodiment, flexible circuit board 34 further includes the connection for connecting first segment 341 and second segment 342
Section 343, linkage section 343 pass through notch 3216.Specifically, first segment 341 is housed in recess 3217, and second segment 342 connects certainly
Section 343 extends along the direction that side wall 3142 is directed toward downside wall 3145.In this way, can be connected by a flexible circuit board 34
Infrared light compensating lamp 35, proximity sensor 36, optical flame detector 37 and receiver 314 are connect, the overall structure of in-out box 30 is simpler
It is single compact.
Fig. 2 and Fig. 4 are please referred to, in some embodiments, bracket 32 further includes determining from the bottom of recess 3217 protrusion
Position column 324.Positioning column 324 is between straight line L and side wall 3214.Positioning column 324 can be used for location and installation in bracket 32
On element, the elements such as flexible circuit board 34, infrared light compensating lamp 35, proximity sensor 36 or optical flame detector 37 as escribed above, prevent
Only element shakes.Specifically, positioning column 324 wears and fixes the first segment 341 of flexible circuit board 34, therefore, setting
Infrared light compensating lamp 35, proximity sensor 36 and optical flame detector 37 on first segment 341 are also fixed, the center of the 4th chamber 3224
The two sides of straight line L can be located at positioning column 324.The quantity of positioning column 324 can be to be multiple, and multiple positioning columns 324 divide
The periphery of infrared light compensating lamp 35, proximity sensor 36 and optical flame detector 37 is not set, element is so further fixed.
Fig. 3 and Fig. 5 are please referred to, in some embodiments, bracket 32 further includes support positioning block 325, support positioning block
325 is corresponding with the position of the second chamber 3222, and specifically, support positioning block 325 is protruded from the second face 3212.Support positioning block 325
It can be used for flexible circuit board 34 of the location and installation on bracket 32, prevent flexible circuit board 34 from shaking, specifically, bracket
Locating piece 325 wears and fixes the second segment 342 of flexible circuit board 34.
Fig. 4 and Fig. 5 are please referred to, in some embodiments, location hole 344, location hole are offered on flexible circuit board 34
344 are used for installation site of the positioning flexible circuit board 34 on bracket 32.Specifically, location hole 344 can be provided with first segment
341, second segment 342 or linkage section 343 it is any on one or more snippets, in embodiment as shown in Figure 4 and Figure 5, location hole
344 are provided on first segment 341 and second segment 342 simultaneously, and the position that location hole 344 opens up can be with above-mentioned positioning column 324
It is corresponding with the position of support positioning block 325, when installing flexible circuit board 34, first segment 341 is bonded with the first face 3211 (
When offering recess 3217 on the first face 3211, first segment 341 is bonded with the bottom of recess 3217) and by location hole 344 and determine
Position column 324 cooperates, and second segment 342 is bonded with the second face 3212 and cooperates location hole 344 and support positioning block 325, in this way,
The position of flexible circuit board 34 is not susceptible to shake.
Fig. 1 and Fig. 6 are please referred to, in some embodiments, electronic device 100 further includes cover board 40, cover board 40 and input
Output mould group 31 is located at the opposite two sides of front housing 11.Front housing 11 offers the first perforation 111, second perforation 112, third is worn
Hole 113 and the 4th perforation 114.First perforation 111 is corresponding with infrared imaging mould group 311, the second perforation 112 and visual light imaging
Mould group 312 is corresponding, and third perforation 113 is corresponding with laser projection mould group 313, and the 4th perforation 114 is corresponding with receiver 314.Cover board
40 are being formed with infrared transmission ink 50 with the first perforation 111 and 113 corresponding positions of third perforation, and cover board 40 opens up and the 4th perforation
114 corresponding acoustic aperture 41 out.
Specifically, cover board 40 can be light transmission, and the material of cover board 40 can be the glass of light transmission, resin, plastics etc..Lid
First perforation of the covering of plate 40,111, second perforation 112, third perforation 113 and the 4th perforation 114.Ambient passes through cover board 40
Enter infrared imaging mould group 311 by the first perforation 111 afterwards.The sound wave that receiver 314 issues is worn again after passing through the 4th perforation 114
Cross out acoustic aperture 41.The laser that laser projection mould group 313 issues is pierced by cover board 40 after passing through third perforation 113, and ambient passes through
Enter visual light imaging mould group 312 by the second perforation 112 after cover board 40.In the present embodiment, cover board 40 is perforated with first
111 and third perforate 113 corresponding positions be formed with it is infrared penetrate ink 50.It is infrared to have higher transmission to infrared light through ink 50
Rate, such as can reach 85% or more, and have higher attenuation rate to visible light, such as can reach 70% or more, so that user
During normal use, it is visually difficult to see that on electronic device 100 by the infrared region covered through ink 50.In this way, user is difficult
To see the internal structure of electronic device 100 (that is, being difficult to see that infrared imaging mould by the first perforation 111 and third perforation 113
Group 311 and laser projection mould group 313), the shape of electronic device 100 is more beautiful.
Referring to Fig. 7, in some embodiments, laser projection mould group 313 include board unit 3121, lens barrel 3122,
Light source 3123, collimating element 3124, diffraction optical element (diffractive optical elements, DOE) 3125 and guarantor
Protecting cover 3126.
Board unit 3121 includes substrate 31211 and circuit board 31212.Circuit board 31212 is arranged on substrate 31211,
Circuit board 31212 is used to connect the mainboard 20 of light source 3123 Yu electronic device 100, circuit board 31212 can be hardboard, soft board or
Rigid Flex.
Lens barrel 3122 is fixedly connected with board unit 3121, and lens barrel 3122 is formed with accommodating cavity 31221, and lens barrel 3122 includes
The peripheral wall 31224 of roof 31222 and the annular extended from roof 31222, peripheral wall 31224 are arranged on board unit 3121, top
Wall 31222 offers the light hole 31225 being connected to accommodating cavity 31221.Peripheral wall 31224 can pass through viscous with circuit board 31212
Glue connection.
Protection cap 3126 is arranged on roof 31222.Protection cap 3126 includes the baffle for offering out light through-hole 31260
31262 and from baffle 31262 extend annular sidewall 31264.
Light source 3123 and collimating element 3124 are arranged in accommodating cavity 31221, and diffraction optical element 3125 is mounted on mirror
On cylinder 3122, collimating element 3124 and diffraction optical element 3125 are successively set in the luminous optical path of light source 3123.Collimation member
The laser that part 3124 issues light source 3123 collimates, and laser is then passed through diffraction optical element after passing through collimating element 3124
3125 to form laser pattern.
Light source 3123 can be vertical cavity surface emitting laser (Vertical Cavity Surface Emitting
Laser, VCSEL) or edge-emitting laser (edge-emitting laser, EEL), in the embodiment as shown in figure 7,
Light source 3123 is edge-emitting laser, and specifically, light source 3123 can be distributed feedback laser (Distributed
Feedback Laser, DFB).Light source 3123 is for emitting laser into accommodating cavity 31221.Incorporated by reference to Fig. 8, light source 3123 is whole
Body is in the form of a column, and an end face of the light source 3123 far from board unit 3121 forms light-emitting surface 31231, and laser is from light-emitting surface 31231
It issues, light-emitting surface 31231 is towards collimating element 3124.Light source 3123 is fixed on board unit 3121, specifically, light source 3123
It can be bonded on board unit 3121 by sealing 3127, such as the one side opposite with light-emitting surface 31231 of light source 3123 is viscous
It connects on board unit 3121.Incorporated by reference to Fig. 7 and Fig. 9, the side 31232 of light source 3123 can also be bonded in board unit 3121
On, sealing 3127 wraps the side 31232 of surrounding, can also only bond some face and the board unit of side 31232
3121 or bond certain several face and board unit 3121.Sealing at this time 3127 can be heat-conducting glue, and light source 3123 is worked and is produced
Raw heat is conducted into board unit 3121.
Referring to Fig. 7, diffraction optical element 3125 is carried on roof 31222 and is housed in protection cap 3126.Diffraction
The opposite two sides of optical element 3125 are contradicted with protection cap 3126 and roof 31222 respectively, and baffle 31262 includes close to light hole
31225 resistance surface 31263, diffraction optical element 3125 and resistance surface 31263 contradict.
Specifically, diffraction optical element 3125 includes opposite the diffraction plane of incidence 31252 and diffraction exit facet 31254.Spread out
Optical element 3125 is penetrated to be carried on roof 31222, the close light hole 31225 of diffraction exit facet 31254 and baffle 31262
Surface (resistance surface 31263) contradicts, and the diffraction plane of incidence 31252 and roof 31122 contradict.Light hole 31225 and accommodating cavity 31221
Alignment, light through-hole 31260 is aligned with light hole 31225 out.Roof 31222, annular sidewall 31264 and baffle 31262 and diffraction
Optical element 3125 contradicts, to prevent diffraction optical element 3125 from falling off out of protection cap 3126 along light direction.Certain
In embodiment, protection cap 3126 is pasted on roof 31222 by glue.
The light source 3123 of above-mentioned laser projection mould group 313 use edge-emitting laser, one side edge-emitting laser compared with
The temperature drift of VCSEL array is smaller, on the other hand, since edge-emitting laser is single-point light emitting structure, is not necessarily to array of designs structure,
Production is simple, and the cost of light source of laser projection mould group 313 is lower.
The laser of distributed feedback laser obtains the gain of power by the feedback of optical grating construction when propagating.It mentions
The power of high distributed feedback laser is needed by increasing Injection Current and/or increasing the length of distributed feedback laser,
Since increase Injection Current can make the power consumption of distributed feedback laser increase and serious problem of generating heat occurs,
In order to guarantee that distributed feedback laser can work normally, needs to increase the length of distributed feedback laser, cause to be distributed
Feedback laser is generally in elongate strip structure.When the light-emitting surface 31231 of edge-emitting laser is towards collimating element 3124, side
Emitting laser is placed in vertical, and since edge-emitting laser is in elongate strip structure, edge-emitting laser, which is easy to appear, to be fallen, moves
Position or shaking etc. are unexpected, therefore can be fixed edge-emitting laser by the way that sealing 3127 is arranged, and prevent edge-emitting laser
Fall, be displaced or shake etc. and is unexpected.
Fig. 7 and Figure 10 are please referred to, in some embodiments, light source 3123 can also be using fixation side as shown in Figure 10
Formula is fixed on board unit 3121.Specifically, laser projection mould group 313 includes multiple supporting blocks 3128, and supporting block 3128 can
To be fixed on board unit 3121, the common ambient light source 3123 of multiple supporting blocks 3128 during installation can be by light source 3123
It is directly installed between multiple supporting blocks 3128.In one example, the clamping light source 3123 jointly of multiple supporting blocks 3128, with into
One step prevents light source 3123 from shaking.
In some embodiments, protection cap 3126 can be omitted, and diffraction optical element 3125, which can be set, at this time is holding
It sets in chamber 31221, the diffraction exit facet 31254 of diffraction optical element 3125 can offset with roof 31222, and laser passes through diffraction
Light hole 31225 is pierced by after optical element 3125 again.In this way, diffraction optical element 3125 is not easily to fall off.
In some embodiments, substrate 31211 can save, and light source 3123 can be directly anchored to circuit board 31212
On to reduce the integral thickness of laser projection mould group 313.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means in conjunction with the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment of the utility model or show
In example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.And
And particular features, structures, materials, or characteristics described can be in any one or more embodiments or example to close
Suitable mode combines.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one described feature.The meaning of " plurality " is at least two, such as two in the description of the present invention,
It is a, three, unless otherwise specifically defined.
Although the embodiments of the present invention have been shown and described above, it is to be understood that above-described embodiment is
Illustratively, it should not be understood as limiting the present invention, those skilled in the art are in the scope of the utility model
It inside can make changes, modifications, alterations, and variations to the above described embodiments, the scope of the utility model is by claim and its is equal
Object limits.
Claims (16)
1. a kind of bracket, which is characterized in that for installing input and output mould group, the bracket is an integral molding structure and including this
Body, the input and output mould group include infrared imaging mould group, visual light imaging mould group, laser projection mould group and receiver, described
Ontology includes opposite the first face and the second face, and second face offers accommodating chamber, and first face offers and the receipts
The through-hole of cavity connection, the input and output mould group are housed in the accommodating chamber and expose from the through-hole, the accommodating chamber
Including the first chamber, the second chamber and third chamber being arranged successively, first chamber is for installing the infrared imaging mould group, and described the
Two chambers are for installing the visual light imaging mould group, and the third chamber is for installing the laser projection mould group, the accommodating chamber
It further include the 4th chamber, the 4th chamber is for installing the receiver.
2. bracket according to claim 1, which is characterized in that the 4th chamber is located at first chamber and second chamber
Between；Or the 4th chamber is between second chamber and the third chamber.
3. bracket according to claim 1, which is characterized in that the through-hole includes that first through hole, the second through-hole, third are logical
Hole and fourth hole, the first through hole are connected to first chamber, and second through-hole is connected to second chamber, and described
Three through-holes are connected to the third chamber, and the fourth hole is connected to the 4th chamber.
4. bracket according to claim 3, which is characterized in that the first through hole, second through-hole and the third
The center of through-hole is located along the same line.
5. bracket according to claim 4, which is characterized in that the ontology includes side wall, side wall connection described the
On one side with second face, the side wall includes opposite side wall and downside wall, the fourth hole be located at the straight line with
Between the downside wall.
6. bracket according to claim 1, which is characterized in that the ontology includes side wall, side wall connection described the
On one side with second face, the side wall includes opposite side wall and downside wall, the side wall formed it is jagged, described
Recess is formed on one side, the recess is connected to the notch.
7. bracket according to claim 6, which is characterized in that the position of position and the 4th chamber that the recess is formed
It is corresponding.
8. bracket according to claim 6, which is characterized in that the bracket further includes protruding from the bottom of the recess
Positioning column.
9. a kind of in-out box characterized by comprising
Input and output mould group, the input and output mould group include infrared imaging mould group, visual light imaging mould group, laser projecting apparatus and
Receiver；With
Bracket described in claim 1-8 any one, the infrared imaging mould group be mounted on it is described first intracavitary, it is described visible
Light imaging modules are mounted on described second intracavitary, and it is intracavitary that the laser projection mould group is mounted on the third, the receiver peace
It is intracavitary mounted in the described 4th.
10. in-out box according to claim 9, which is characterized in that the in-out box further includes installation
Flexible circuit board on the bracket, the receiver include protruding along the described first direction towards second face
Elastic slice is connected, the connection elastic slice is contradicted with the flexible circuit board to be electrically connected the receiver and the flexible circuit board.
11. in-out box according to claim 10, which is characterized in that the flexible circuit board includes and described
The first segment being bonded on one side and the second segment closed with second face paste, the connection elastic slice and the second segment contradict, described
In-out box further includes infrared light compensating lamp, proximity sensor and optical flame detector, the infrared light compensating lamp, the proximity sensor
It is both connected on the first segment with the optical flame detector.
12. in-out box described in 0 or 11 according to claim 1, which is characterized in that offered on the flexible circuit board
Location hole, the location hole is for positioning the installation site of the flexible circuit board on the bracket.
13. a kind of electronic device characterized by comprising
Shell；With
In-out box described in claim 9-12 any one, the in-out box are mounted in the shell.
14. electronic device according to claim 13, which is characterized in that the electronic device further includes being fixed on the shell
Intracorporal mainboard, the input and output mould group are electrically connected with the mainboard, and the mainboard is formed with installing port, and the bracket is worn
It the installing port and is fixedly connected with the mainboard.
15. electronic device according to claim 14, which is characterized in that the shell includes front housing and rear shell, before described
Shell and first face offset and the rear shell and second face offset to clamp the bracket.
16. electronic device according to claim 15, which is characterized in that the electronic device further includes cover board, the lid
Plate is located at the opposite two sides of the front housing with the input and output Mo Zu respectively, and the front housing offers the first perforation, second wears
Hole, third perforation and the 4th perforation, it is described first perforation it is corresponding with the infrared imaging mould group, it is described second perforate and it is described can
Light-exposed imaging modules are corresponding, and the third perforation is corresponding with the laser projection mould group, the 4th perforation and the receiver
It is corresponding, the cover board be formed with first perforation and third perforation corresponding position it is infrared through ink, the cover board
Open up acoustic aperture out corresponding with the 4th perforation.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820506787.2U CN208386605U (en) | 2018-04-10 | 2018-04-10 | Bracket, in-out box and electronic device |
| US16/493,286 US11330090B2 (en) | 2018-04-10 | 2019-04-03 | Bracket, input/output assembly and terminal |
| PCT/CN2019/081325 WO2019196726A1 (en) | 2018-04-10 | 2019-04-03 | Support, input/output assembly and terminal |
| EP19773330.6A EP3609168B1 (en) | 2018-04-10 | 2019-04-03 | Support, input/output assembly and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820506787.2U CN208386605U (en) | 2018-04-10 | 2018-04-10 | Bracket, in-out box and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208386605U true CN208386605U (en) | 2019-01-15 |
Family
ID=64976009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820506787.2U Expired - Fee Related CN208386605U (en) | 2018-04-10 | 2018-04-10 | Bracket, in-out box and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208386605U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019196726A1 (en) * | 2018-04-10 | 2019-10-17 | Oppo广东移动通信有限公司 | Support, input/output assembly and terminal |
-
2018
- 2018-04-10 CN CN201820506787.2U patent/CN208386605U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019196726A1 (en) * | 2018-04-10 | 2019-10-17 | Oppo广东移动通信有限公司 | Support, input/output assembly and terminal |
| US11330090B2 (en) | 2018-04-10 | 2022-05-10 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Bracket, input/output assembly and terminal |
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| CF01 | Termination of patent right due to non-payment of annual fee |
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