CN108614363A - Laser projection module, camera assembly and terminal - Google Patents
Laser projection module, camera assembly and terminal Download PDFInfo
- Publication number
- CN108614363A CN108614363A CN201810315993.XA CN201810315993A CN108614363A CN 108614363 A CN108614363 A CN 108614363A CN 201810315993 A CN201810315993 A CN 201810315993A CN 108614363 A CN108614363 A CN 108614363A
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- Prior art keywords
- laser
- module
- light source
- light
- laser projection
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
- G02B27/4205—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive optical element [DOE] contributing to image formation, e.g. whereby modulation transfer function MTF or optical aberrations are relevant
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses a kind of laser projection module, camera assembly and terminals.Laser projection module includes light source, optical module and diffraction element.For light source for edge-emitting laser and for emitting laser, edge-emitting laser includes light-emitting surface.Optical module includes prism, and optical module is arranged in the light path of light source, and light-emitting surface is towards optical module, and optical module is for changing the light path of the laser sent out from light source, and the laser sent out for collimated light source.Laser after diffraction element is collimated with optical module is corresponding, and diffraction element is for the corresponding laser of diffraction to form laser pattern.Laser projection module, camera assembly and the terminal of the present invention, light source is using the smaller edge-emitting laser of temperature drift, in addition, the laser that optical module can change the light path for the laser that light source is sent out and collimated light source is sent out, diffraction element can diffraction by the laser of optical module to form laser pattern, reduce influence of the light source temperature drift to laser projection module measurement accuracy.
Description
Technical field
The present invention relates to consumer electronics fields, more specifically, are related to a kind of laser projection module, camera assembly and end
End.
Background technology
In the prior art, electronic device usually obtains the laser of scene using laser projection module to scene simulation laser
Pattern.The light source of laser projection module mostly uses vertical cavity surface emitting laser (Vertical-Cavity Surface-
Emitting Laser, VCSEL) array, however the heat that laser projection module generates at work is larger, and VCSEL array
Temperature drift it is larger, the temperature drift of light source is easy the measurement accuracy for influencing laser projection module to scene depth image.
Invention content
A kind of laser projection module of embodiment of the present invention offer, camera assembly and terminal.
The laser projection module of embodiment of the present invention includes：
Light source, for the light source for edge-emitting laser and for emitting laser, the edge-emitting laser includes light-emitting surface；
Optical module, the optical module include prism, and the optical module is arranged in the light path of the light source, described
Towards the optical module, the optical module and is used for light-emitting surface for changing the light path of the laser sent out from the light source
Collimate the laser that the light source is sent out；And
Diffraction element, the laser after the diffraction element is collimated with the optical module is corresponding, and the diffraction element is used for
The corresponding laser of diffraction is to form laser pattern.
The camera assembly of embodiment of the present invention includes：
Laser projection module described in the above embodiment；
Infrared imaging module, the infrared imaging module is for acquiring the laser figure projected by the laser projection module
Case；
Frame, the frame include ontology, and the ontology includes opposite the first face and the second face, and second face opens up
There are at least two host cavities, first face offers at least two through-holes being connected to at least two host cavities, described
Laser projection module and the infrared imaging module are housed in the host cavity and are exposed from the through-hole；And
Processor, the processor are connect with the laser projection module and the infrared imaging module respectively, the place
Reason device is for handling the laser pattern to obtain depth image.
The terminal of embodiment of the present invention includes：
Mainboard offers installing port on the mainboard；And
Camera assembly described in the above embodiment, the frame are mounted on the installing port, the camera assembly and institute
State mainboard electrical connection.
Laser projection module, camera assembly and the terminal of embodiment of the present invention, light source is using the smaller edge emitting of temperature drift
Laser, in addition, the laser that optical module can change the light path for the laser that light source is sent out and collimated light source is sent out, diffraction element energy
Enough diffraction, to form laser pattern, reduce shadow of the light source temperature drift to laser projection module measurement accuracy by the laser of optical module
It rings.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become apparent, or the practice of embodiment through the invention is recognized.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, wherein：
Fig. 1 is the structural schematic diagram of the terminal of embodiment of the present invention；
Fig. 2 is the plane assembling schematic diagram of the camera assembly of embodiment of the present invention terminal；
Fig. 3 is the plane assembling schematic diagram at another visual angle of the camera assembly in Fig. 2；
Fig. 4 is the perspective exploded view of the camera assembly in Fig. 2；
Fig. 5 is the perspective exploded view at another visual angle of the camera assembly in Fig. 2；
Fig. 6 is the diagrammatic cross-section of the laser projection module of embodiment of the present invention camera assembly；
Fig. 7 is the diagrammatic cross-section of the laser projection module of embodiment of the present invention camera assembly；
Fig. 8 is the part-structure schematic diagram of the laser projection module of embodiment of the present invention camera assembly；
Fig. 9 is the part-structure schematic diagram of the terminal of embodiment of the present invention.
Specific implementation mode
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the same or similar element of expression or element with the same or similar functions eventually.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature
It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is directly under or diagonally below the second feature, or is merely representative of fisrt feature level height and is less than second feature.
Referring to Fig. 1, the terminal 1000 of embodiment of the present invention includes camera assembly 100, shell 200 and mainboard 300.Eventually
End 1000 can be mobile phone, tablet computer, laptop computer, game machine, head aobvious equipment, access control system, automatic teller machine etc., and the present invention is real
It applies example to illustrate so that terminal 1000 is mobile phone as an example, it will be understood that the concrete form of terminal 1000 can be other, herein not
It is restricted.
Please refer to Fig.1 to Fig.3, camera assembly 100 include frame 40, laser projection module 10, infrared imaging module 20, can
Light-exposed imaging modules 50 and processor 30 (Fig. 9 shows).Laser projection module 10 and infrared imaging module 20 are mounted on frame 40.
Laser projection module 10 can be used for the projection laser pattern of the target object outside electronic device 100, and laser can be
Infrared laser, infrared imaging module 20 can be used for receiving extraneous infrared signal to generate infrared image, in one example,
Infrared imaging module 20 can receive the laser pattern that laser projection module 10 emits and reflected to form by target object, and laser is thrown
It penetrates module 10 and infrared imaging module 20 is provided commonly for obtaining the depth information of target object.Visual light imaging module 50 can receive
Extraneous visible light signal can obtain the 3 dimensional drawing of object by depth information and coloured image to generate coloured image
Picture.Processor 30 is connect with laser projection module 10, infrared imaging module 20 and visual light imaging module 50 respectively.Processor 30
For handling laser pattern to obtain depth image.Specifically, processor 30 calculates the laser figure using image matching algorithm
The deviation value of each pixel each pixel corresponding with reference pattern in case further obtains this further according to the deviation value and swashs
The depth image of light pattern.Wherein, image matching algorithm can be digital picture it is related (Digital Image Correlation,
DIC) algorithm.It is of course also possible to use other image matching algorithms replace DIC algorithms.Processor 30 also merge depth image and
Coloured image can obtain the three-dimensional image of object.
Installation carrier of the frame 40 as laser projection module 10 and infrared imaging module 20, frame 40 can be fixed and be limited
Position laser projection module 10 and infrared imaging module 20, the relative position of such laser projection module 10 and infrared imaging module 20
It will not change, thus preferably cooperating.Specifically, frame 40 is an integral molding structure, and frame 40 includes ontology 41.
Ontology 41 includes the first face 411, the second face 412 and side wall 413, and the first face 411 is opposite with the second face 412, and side wall 413 connects the
On one side 411 and second face 412, side wall 413 include opposite side wall 414 and downside wall 415.
Incorporated by reference to Fig. 4 and Fig. 5, the second face 412 offers at least two host cavities 42, and host cavity 42 is located at side wall 414
Between downside wall 415.First face 411 offers at least two through-hole corresponding at least two host cavities 42 43.Laser is thrown
It penetrates module 10 and infrared imaging module 20 is housed in host cavity 42.The concrete shape of host cavity 42 and corresponding laser projection mould
Group 10 and the shape of infrared imaging module 20 correspond to, the cavity of host cavity 42 can be slightly larger than laser projection module 10 and it is infrared at
As module 20 is in order to the dispensing in host cavity 42, the cavity of host cavity 42 can also be slightly less than laser projection module 10 and infrared
Imaging modules 20 are so that laser projection module 10 and infrared imaging module 20 can be mounted on by interference fit in host cavity 42.When
When laser projection module 10 and infrared imaging module 20 are mounted on frame 40, laser projection module 10 and infrared imaging module 20
It is exposed from through-hole 43.Specifically, host cavity 42 includes the first chamber 421, the second chamber 422 and third chamber 423.First chamber 421 is used for
Laser projection module 10 is installed, the second chamber 422 for installing infrared imaging module 20, third chamber 423 for install visible light at
As module 50.Multiple host cavities 42 can be apart from one another by, such as the first chamber 421, the second chamber 422 and third chamber 423 pass through interval
Wall 416 (such as Fig. 3) is spaced successively, can also be that the host cavity 42 of any two or three etc. interconnects, such as the first chamber
421 are connected to the second chamber 422, and the second chamber 422 is spaced with third chamber 423.
Through-hole 43 includes first through hole 431, the second through-hole 432 and third through-hole 433, first through hole 431, the second through-hole
432 and third through-hole 433 be connected to respectively with the first chamber 421, the second chamber 422 and third chamber 423, in other words, first through hole 431
It is connected to the first chamber 421, the second through-hole 432 is connected to the second chamber 422, and third through-hole 433 is connected to third chamber 423.In laser
Project module 10, after visual light imaging module 50 and infrared imaging module 20 are installed, laser projection module 10 is from first through hole 431
Exposure, infrared imaging module 20 are exposed from the second through-hole 432, it is seen that light imaging modules 50 are exposed from third through-hole 433, three's
In optical axis is generally aligned in the same plane, it is easy to three and works in coordination work.Laser projection module 10, visual light imaging module 50 and infrared
The top surface of imaging modules 20 flushes, specifically, the light-emitting surface of laser projection module 10, the incidence surface of infrared imaging module 20 and can
The incidence surface of light-exposed imaging modules 50 can be located in approximately the same plane.In embodiments of the present invention, refer to can for exposure
To see laser projection module 10, infrared imaging module 20 and visual light imaging module from the first face 411 or from the second face 412
50, for example, laser projection module 10, infrared imaging module 20 and visual light imaging module 50 can pass through the logical of the first face 411
Hole 43 is simultaneously exposed from the first face 411, and laser projection module 10, infrared imaging module 20 and visual light imaging module 50 can also be not
Across through-hole 43, but by through-hole 43 it can be seen that laser projection module 10, infrared imaging module 20 and visual light imaging module
50.First through hole 431 and the second through-hole 432 are spaced, so that laser projection module 10, infrared imaging module 20 and visual light imaging
Module 50 is spaced, and is reduced the heat generated between two neighboring module and is influenced each other.
Referring to Fig. 1, the setting of camera assembly 100 exposes in shell 200 and from shell 200 to obtain laser pattern.Shell
Body 200 can provide the protection of dust-proof, waterproof, shatter-resistant to camera assembly 100, and display screen, electricity are also equipped on shell 200
The components such as pond.Shell 200 includes front housing 201 and rear shell 202, and front housing 201 and rear shell 202 are combined with each other and by camera assemblies
100 are housed between front housing 201 and rear shell 202, and the materials such as stainless steel, aluminium alloy, plastics may be used with rear shell 202 in front housing 201
Material is made.In conjunction with Fig. 2 and Fig. 3, when camera assembly 100 to be mounted in shell 10, front housing 201 can be with 411 phase of the first face
Support, rear shell 202 can offset with the second face 412 frame 40 is clamped, avoid frame 40 with laser projection module 10, it is infrared at
As module 20 and visual light imaging module 50 are mobile along the thickness direction (Z-direction in such as Fig. 1) of terminal 1000.
Referring to Fig. 1, shell 200 can also be used as the installation carrier of mainboard 300, shell 200 can give mainboard 300 to provide
The protection of dust-proof, waterproof, shatter-resistant.Mainboard 300 is fixed in shell 200, and specifically, mainboard 300 can be by screwing togather, engaging
Mode is fixed in front housing 201 or rear shell 202.Mainboard 300 can be connect with camera assembly 100, can also be connected on mainboard 300
Processing chip, control chip of terminal 1000 etc., the circuit being laid on mainboard 300 can be used for transmission telecommunications number.On mainboard 300
It is formed with installing port, frame 40 is mounted on installing port, and camera assembly 100 is electrically connected with mainboard 300.Specifically, camera assembly 100
On can be provided with connector 60 (such as Fig. 2), connector 60 is inserted on mainboard 300 on specific connecting seat, with electrical
And mechanical connection camera assembly 100 and mainboard 300, by connector 60 extracted from connecting seat then can by camera assembly 100 with
Mainboard 300 detaches and disconnects electric connection between the two.Frame 40 is corresponding with the position of the installing port of mainboard 300, frame 40
Side wall 413 can offset with the inner wall of installing port so that frame 40 is stuck in installing port, it is only necessary to by the position of mainboard 300
It is fixed, so that it may to avoid frame 40 and camera assembly 100 mobile along the width direction (Y-direction in such as Fig. 1) of terminal 1000.
Referring to Fig. 6, will be described further below to the structure of laser projection module 10.Laser projection module 10 includes
Light source 11, optical module 12, diffraction element 13, board unit 14 and lens barrel 15.
Light source 11 is for emitting laser.Light source 11 is edge-emitting laser (Edge-Emitting Laser, EEL).Specifically
Ground, edge-emitting laser can be distributed feedback laser (Distributed Feedback Laser, DFB).Distribution is anti-
For the laser of feedback formula laser when propagating, the feedback that need to pass through optical grating construction obtains the gain of power.Improve distributed feedback
The power of laser needs, by increasing Injection Current and/or increasing the length of distributed feedback laser, to inject due to increasing
Electric current can make the power consumption of distributed feedback laser increase and serious problem of generating heat occur, therefore, in order to ensure to be distributed
Feedback laser can work normally, and need the length for increasing distributed feedback laser, therefore distributed feedback laser
Generally in elongate strip structure.Specifically, light source 11 includes light-emitting surface 111 and faying face 112, and laser is sent out from light-emitting surface 111, is tied
Conjunction face 112 is the end face that light source 11 is combined with board unit 14.Using edge-emitting laser as light source 11, one side side
Emitting laser is smaller compared with the temperature drift of VCSEL array, on the other hand, since edge-emitting laser is single-point light emitting structure, is not necessarily to
Array of designs structure makes simply, and the cost of light source 11 is relatively low.
Optical module 12 is arranged in the light path of light source 11, and optical module 12 is opposite with light source 11.Specifically, optical module
12 for changing the laser sent out from light source 11 light path, and the laser sent out for collimated light source 11.Optical module 12 includes
Prism 121.One or more layers is provided on prism 121 can reflect and the material of transmission laser.The material of reflection and transmission laser
Material includes the materials such as metal (silver, aluminium, tin), alloy or metal compound film.Optical module 12 further include can collimate or
Converge the arcwall face of laser.
Laser after diffraction element 13 is collimated with optical module 12 is corresponding.Diffraction element 13 for the corresponding laser of diffraction with
Form laser pattern.Specifically, diffraction element 13 can be arranged in the light path of light source 11.Diffraction element 13 includes opposite
The plane of incidence 131 and exit facet 132.The plane of incidence 131 is towards optical module 12.The plane of incidence 131 be diffraction element 13 into smooth surface, go out
Penetrate the light-emitting surface that face 132 is diffraction element 13.Diffraction structure is formed on the plane of incidence 131, laser is formed under its diffraction
Laser pattern corresponding with diffraction structure.The laser that light source 11 emits successively after optical module 12 and diffraction element 13, from
Laser projection module 10 projects.In the present embodiment, diffraction element 13 can be made of glass, can also be by composite plastic (such as
PET it) is made.
Board unit 14 includes substrate 141 and the circuit board 142 being carried on substrate 141.Light source 11 is arranged in substrate in batch
On part 14, substrate 141 is used for bearer circuit plate 142.Light source 11, which lies low, to be arranged on board unit 14, and light-emitting surface 111 is towards light
Source 11, the laser that light source 11 is sent out inject diffraction element 13 after optical module 12 collimates and reflects.The material of substrate 141 can
To be plastics, for example polyethylene terephthalate (Polyethylene Glycol may be used in substrate 141
Terephthalate, PET), polymethyl methacrylate (Polymethyl Methacrylate, PMMA), makrolon
The unitary plastic material of any one is made in (Polycarbonate, PC), polyimides (Polyimide, PI).In this way, base
141 lighter weight of plate and have enough support strengths.
Circuit board 142 can be any one in printed circuit board, flexible PCB, Rigid Flex.Circuit board 142
On can offer via 143, can be used for accommodating light source 11 and optical module 12 in via 143.In order to improve radiating efficiency,
Heat emission hole 1411 can also be offered on substrate 141, the heat that light source 11 or the work of circuit board 142 generate can be by heat emission hole
1411 shed, and heat-conducting glue can also be filled in heat emission hole 1411, to further increase the heat dissipation performance of board unit 14.Certainly,
Faying face 112 can be bonded on board unit 14 by light source 11 by sealing, and such light source 11 is combined with board unit 14
It is relatively reliable.
Lens barrel 15 is arranged on board unit 14 and accommodating cavity 151, light source 11, optics group is collectively formed with board unit 14
Part 12 and diffraction element 13 are housed in accommodating cavity 151.Lens barrel 15 includes 153 at the top of lens barrel peripheral wall 152 and opposite lens barrel
With lens barrel bottom 154.Lens barrel peripheral wall 152 surrounds accommodating cavity 151.Accommodating cavity 151 can be a part for the light path of light source 11.Hold
Set chamber 151 one is opened on 153 at the top of lens barrel, another is opened on lens barrel bottom 154.Lens barrel bottom
154 are combined with board unit 14, such as glued.
To sum up, the laser projection module 10, camera assembly 100 and terminal 1000 of embodiment of the present invention, light source 11 use
The smaller edge-emitting laser of temperature drift, in addition, optical module 12 can change the light path and collimated light source of the laser that light source 11 is sent out
11 laser sent out, diffraction element 13 can diffraction by optical module 12 laser to form laser pattern, in this way, reduce light
Influence of 11 temperature drift of source to 10 measurement accuracy of laser projection module.Furthermore in addition, camera assembly 100 is housed in frame 40 together
Host cavity 42 in, and without be arranged multiple frames come fixed laser projection module 10, infrared imaging module 20 and visible light at
As module 50, the installation space inside terminal 1000 has been saved.
Referring to Fig. 6, in some embodiments, prism 121 includes the collimation portion 122 to connect and reflecting part 123, reflection
Towards light-emitting surface 111, collimation portion 122 is arc-shaped and between light source 11 and reflecting part 123 in portion 123；And/or reflecting part 123
Towards light-emitting surface 111, collimation portion 122 is arc-shaped and between diffraction element 13 and reflecting part 123.
Specifically, collimation portion 122 and reflecting part 123 are respectively positioned on prism 121.Reflecting part 123 is on prism 121 and to shine
An opposite end face of face 111.Collimation portion 122 arc-shaped (convex surface or concave surface) is for collimation or converging beam.Collimation portion
122 quantity can be one, collimation portion 122 between light source 11 and reflecting part 123, arcwall face towards light-emitting surface 111 with
The laser that collimation and convergence are sent out from light source 11；Alternatively, collimation portion 122 is between diffraction element 13 and reflecting part 123, arc
Facing towards diffraction element 13 to collimate the laser reflected by reflecting part 123.The quantity of collimation portion 122 may be two, wherein
One collimation portion 122 is between light source 11 and reflecting part 123, and arcwall face is towards light-emitting surface 111, another collimation portion 122
Between diffraction element 13 and reflecting part 123, and arcwall face is towards diffraction element 13.The laser that light source 11 is sent out passes through successively
After one of collimation portion 122, reflecting part 123, another collimation portion 122 and diffraction element 13, penetrated from laser projection module 10
Go out.In the present embodiment, since prism 121 can collimate simultaneously and reflect the laser sent out from light source 11, without used in laser
Other collimation optics and reflective optical devices are set in light path, reduce laser projection module 10 along the direction of light extraction
Thickness.
Referring to Fig. 7, in some embodiments, optical module 12 further includes collimating element 124, collimating element 124
Between light source 11 and prism 121；And/or collimating element 124 is between diffraction element 13 and prism 121.
Specifically, when collimating element 124 is between light source 11 and prism 121, then the laser that light source 11 is sent out passes through successively
After crossing collimating element 124, one of collimation portion 122, reflecting part 123, another collimation portion 122 and diffraction element 13, from swash
Light projection module 10 projects.When the laser that collimating element 124 is between diffraction element 13 and prism 121, then light source 11 is sent out
Pass through one of collimation portion 122, reflecting part 123, another collimation portion 122, collimating element 124 and diffraction element 13 successively
Afterwards, it is projected from laser projection module 10.When the quantity of collimating element 124 is two, one of collimating element 124 is located at light source
Between 11 and prism 121, between diffraction element 13 and prism 121, then what light source 11 was sent out swashs another collimating element 124
Light passes through one of collimating element 124, one of collimation portion 122, reflecting part 123, another collimation portion 122, another successively
After one collimating element 124 and diffraction element 13, projected from laser projection module 10.
Referring to Fig. 6, in some embodiments, lens barrel 15 further includes from the projecting inward positive stop lug boss of lens barrel peripheral wall 152
155.Specifically, positive stop lug boss 155 is arranged at the top of lens barrel between 153 and lens barrel bottom 154.Positive stop lug boss 155 is all from lens barrel
The inner peripheral of wall 152 extends to the center of accommodating cavity 151.Specifically, positive stop lug boss 155 can be in continuous cyclic annular, or limit
Position boss 155 includes multiple, and multiple positive stop lug boss 155 are spaced apart.It is accommodating between lens barrel peripheral wall 152 and positive stop lug boss 155
Chamber 151 can be used for accommodating diffraction element 13.Specifically, the plane of incidence 131 of diffraction element 13 is combined with positive stop lug boss 155 to incite somebody to action
Diffraction element 13 is mounted on positive stop lug boss 155.Positive stop lug boss 155 is formed with the light hole 156 being connected to accommodating cavity 151.It is logical
Unthreaded hole 156 can be injected by the laser of optical module 12 after across light hole 156 and spread out as a part for accommodating cavity 151
Penetrate element 13.
Please continue to refer to Fig. 6, in some embodiments, laser projection module 10 further includes protective cover 16.Protective cover 16
It is combined with lens barrel 15, protective cover 16 is used for the position of diffraction-limited element 13, and specifically, protective cover 16 can stop diffraction element
13 move along the light direction of laser projection module 10.The setting of protective cover 16 153 at the top of the lens barrel on, diffraction element 13 it is opposite
Both sides are contradicted with protective cover 16 and positive stop lug boss 155 respectively.Specifically, protective cover 16 and exit facet 132 are inconsistent, positive stop lug boss
155 is inconsistent with the plane of incidence 131, to prevent diffraction element 13 from falling off out of accommodating cavity 151 along light direction.In an example
In, protective cover 16 can be pasted onto on 153 at the top of lens barrel by glue so that protective cover 16 is combined relatively reliable with lens barrel 15.
In some embodiments, protective cover 16 is made of metal material, such as silver nanowire, metal silver wire, copper sheet etc..
Protective cover 16 made of metal offers loophole 161.The position of loophole 161 is corresponding with diffraction element 13, laser
It is projected from laser projection module 10 after optical module 12, light hole 156, diffraction element 13 and loophole 161.In this reality
It applies in example, loophole 161 can be in the shapes such as regular polygon, circle, rectangle, ellipse, trapezoidal.The aperture of loophole 161 is big
It is less than at least one of width or length of diffraction element 13 with the position of diffraction-limited element 13.In other embodiment
In, protective cover 16 can also be made of translucent material, such as glass, polymethyl methacrylate (Polymethyl
Methacrylate, PMMA), makrolon (Polycarbonate, PC), polyimides (Polyimide, PI) etc..Due to glass
The translucent materials such as glass, PMMA, PC and PI all have excellent light transmission, and protective cover 16 can not have to open up loophole 161.
Referring to Fig. 8, in some embodiments, laser projection module 10 further includes fixing piece 17, fixing piece 17 is used for
Light source 11 and optical module 12 are fixed on board unit 14.Specifically, light source 11 further includes and light-emitting surface 111 and faying face
112 mounting surfaces 113 to connect.Fixing piece 17 distinguishes the mounting surface 113 of 11 opposite both sides of fixed light source, and fixing piece 17 is solid respectively
Two opposite end faces of optical module 12 are determined, to prevent light source 11 and the relative position of optical module 12 from changing.At one
In example, fixing piece 17 include be at least two flexible supporting frames 172, at least two supporting racks 172 are used to support light source 11
And optical module 12.
Fig. 3 and Fig. 5 are please referred to, in some embodiments, the second face 412 offers a separate space 417, between separate space 417
Every the first chamber 421 and third chamber 423.Specifically, ontology 41 further includes multiple spaced walls 416.Side wall 414,415 and of downside wall
A separate space 417 is collectively formed in spaced walls 416.It is mounted on frame 40 in laser projection module 10 and visual light imaging module 50
Afterwards, separate space 417 is spaced laser projection module 10 and visual light imaging module 50, with the heat for preventing laser projection module 10 from generating
The heat that amount and visual light imaging module 50 generate influences each other.
Fig. 3 and Fig. 5 are please referred to, in some embodiments, the second face 412 offers compartment 418, between compartment 418
Every the second chamber 422 and third chamber 423.Specifically, ontology 41 further includes multiple spaced walls 416.Side wall 414,415 and of downside wall
Compartment 418 is collectively formed in spaced walls 416.After visual light imaging module 50 and infrared imaging module 20 are mounted on frame 40,
Compartment 418 is spaced visual light imaging module 50 and infrared imaging module 20, with the heat for preventing laser projection module 10 from generating
The heat generated with visual light imaging module 50 influences each other.
Please continue to refer to Fig. 3, in some embodiments, in the above embodiment between separate space 417 and compartment 418 set
It is equipped with heat sink material 44.Since the heat generated when camera assembly 100 works compares concentration, it be easy to cause camera assembly 100
Some optical elements generate temperature drift, influence the precision of camera assembly 100.In addition, camera assembly 100 is chronically at hot environment,
Shorten the service life of camera assembly 100.Heat sink material 44 is respectively set in separate space 417 and in compartment 418, it is single in energy
While being solely that laser projection module 10, visual light imaging module 50 and infrared imaging module 20 radiate, moreover it is possible to reduce camera shooting group
The heat that two neighboring module in part 100 generates influences each other.In the present embodiment, heat sink material 44 can be thermal conductive silicon
Fat, heat-conducting metal (such as silver, copper, gold etc.) can also be ceramic material.When heat sink material 44 is heat-conducting silicone grease, radiate material
Material 44 can be laid on the inner wall of a separate space 417 and the inner wall of compartment 418.When heat sink material 44 is heat-conducting metal, dissipate
Hot material 44 can be laid in the form of single layer or multilayer on the inner wall of separate space 417 and the inner wall of compartment 418, example
Such as, silver layer, layers of copper are alternately laid with.When heat sink material 44 is ceramic material, heat sink material 44 can fill it is completely entire between separate space
417 and compartment 418.
Fig. 4 and Fig. 5 are please referred to, in some embodiments, frame 40 offers locating slot in the side wall of the second through-hole 432
419a, locating slot 419a are used to limit the installation site of infrared imaging module 20.Specifically, infrared imaging module 20 includes being formed
In the protrusion 201 of lens barrel periphery.The position of locating slot 419a and quantity are corresponding with the position of protrusion 201 and quantity.Protrusion
The quantity in portion 201 can be one or more, and in the present embodiment, the quantity of protrusion 201 is two, and two protrusions 201
The opposite both sides of the lens barrel periphery of infrared imaging module 20 are formed in, the quantity of locating slot 419a is also two, and two positioning
Slot 419a is opened in respectively on the side wall of the opposite sides of the second through-hole 432.It is mounted on the second chamber 422 in infrared imaging module 20
And when being exposed from the second through-hole 432, locating slot 419a is engaged with protrusion 201 to indicate to be installed in place.
Fig. 4 and Fig. 5 are please referred to, in some embodiments, frame 40 offers limiting slot in the side wall of third through-hole 433
419b, limiting slot 419b are used to limit the installation site of visual light imaging module 50.Specifically, it is seen that light imaging modules 50 include
It is formed in the lug boss 501 of lens barrel periphery.The position of limiting slot 419b and quantity are corresponding with the position of lug boss 501 and quantity.
The quantity of lug boss 501 can be one or more, and in the present embodiment, the quantity of lug boss 501 is two, and two lug bosses
501 are formed in the opposite both sides of lens barrel periphery of visual light imaging module 50, and the quantity of limiting slot 419b is also two, and two
Limiting slot 419b is opened in respectively on the side wall of the opposite sides of third through-hole 433.It is mounted on the in visual light imaging module 50
Three chambers 423 and when being exposed from third through-hole 433, limiting slot 419b is engaged with lug boss 501 to indicate to be installed in place.
Fig. 2 and Fig. 4 are please referred to, in some embodiments, location hole 45 is offered on the first face 411, location hole 45 is used
In the installation site of positioning framework 40.Specifically, the quantity of location hole 45 can be one or more, in the present embodiment, positioning
The quantity in hole 45 is two, and two location holes 45 are opened in the position of the diagonally opposing corner of ontology 41.It is corresponding, it is preceding incorporated by reference to Fig. 1
It can be protruded on shell 201 and be formed with front case locating pole 203, when the first face 411 offsets with front housing 201, front case locating pole 203 is stretched
Enter in location hole 45 and coordinates with location hole 45, it can quick posting by the cooperation of front case locating pole 203 and location hole 45
The installation site of frame 40, and further avoid frame 40 and shaken in shell 10.
It please refers to Fig.1 and Fig. 9, in some embodiments, terminal 1000 further includes cover board 70, cover board 70 and camera assembly
100 are located at the opposite both sides of front housing 201.Front housing 201 offers the first perforation 204, second perforation 205 and third perforation
206.First perforation 204 is corresponding with laser projection module 10, and the second perforation 205 is corresponding with visual light imaging module 50, and third is worn
Hole 206 is corresponding with infrared imaging module 20.Cover board 70 is being formed with the first perforation 204 and 206 corresponding positions of third perforation respectively
Have infrared through ink 80.
Specifically, cover board 70 can be light transmission, and the material of cover board 70 can be glass, resin, plastics of light transmission etc..Lid
First perforation of the covering of plate 70,204, second perforation 205 and third perforation 206.The laser that laser projection module 10 is sent out passes through first
It is pierced by cover board 70 after perforation 204.Ambient enters visual light imaging module 50 after cover board 70 by the second perforation 205.
Ambient enters infrared imaging module 20 after cover board 70 by third perforation 206.In the present embodiment, cover board 70 with
First perforation 204 and 206 corresponding positions of third perforation are formed with infrared through ink 80.It is infrared through ink 80 to infrared light have compared with
High transmitance, such as 85% or more is can reach, and have higher attenuation rate to visible light, such as 70% or more is can reach,
So that user during normal use, is visually difficult to see that in terminal 1000 by the infrared region covered through ink 80.In this way, with
Family is difficult to see that the internal structure of terminal 1000 (is difficult to see that laser projection mould by the first perforation 204 and third perforation 206
Group 10 and infrared imaging module 20), the shape of terminal 1000 is more beautiful.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means in conjunction with the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, and the scope of the present invention is limited by claim and its equivalent.
Claims (12)
1. a kind of laser projection module, which is characterized in that including：
Light source, for the light source for edge-emitting laser and for emitting laser, the edge-emitting laser includes light-emitting surface；
Optical module, the optical module include prism, and the optical module is arranged in the light path of the light source, described to shine
Facing towards the optical module, the optical module for changing the laser sent out from the light source light path, and for collimating
The laser that the light source is sent out；And
Diffraction element, the laser after the diffraction element is collimated with the optical module is corresponding, and the diffraction element is used for diffraction
The corresponding laser is to form laser pattern.
2. laser projection module according to claim 1, which is characterized in that the prism includes the collimation portion to connect and anti-
Portion is penetrated, for the reflecting part towards the light-emitting surface, the collimation portion is arc-shaped and between the light source and the reflecting part；
And/or
The reflecting part towards the light-emitting surface, the collimation portion it is arc-shaped and positioned at the diffraction element and the reflecting part it
Between.
3. laser projection module according to claim 2, which is characterized in that the optical module further includes collimating element,
The collimating element is between the light source and the prism；And/or
The collimating element is between the diffraction element and the prism.
4. laser projection module according to claim 1, which is characterized in that the laser projection module further includes substrate in batch
Part and lens barrel, the lens barrel are arranged on the board unit and accommodating cavity, the light source are collectively formed with the board unit
It is arranged on the board unit, and the light source, the optical module and the diffraction element are housed in the accommodating cavity
It is interior.
5. laser projection module according to claim 4, which is characterized in that the lens barrel include lens barrel peripheral wall and from described in
Lens barrel peripheral wall is mounted on to the projecting inward positive stop lug boss of the accommodating cavity, the diffraction element on the positive stop lug boss.
6. a kind of camera assembly, which is characterized in that including：
Laser projection module described in claim 1 to 5 any one；
Infrared imaging module, the infrared imaging module is for acquiring the laser pattern projected by the laser projection module；
Frame, the frame include ontology, and the ontology includes opposite the first face and the second face, second face offer to
Few two host cavities, first face offers at least two through-holes being connected to at least two host cavities, the laser
Projection module and the infrared imaging module are housed in the host cavity and are exposed from the through-hole；And
Processor, the processor are connect with the laser projection module and the infrared imaging module respectively, the processor
For handling the laser pattern to obtain depth image.
7. camera assembly according to claim 6, which is characterized in that the camera assembly further includes visual light imaging mould
Group, the host cavity include the first chamber, the second chamber and third chamber being arranged in order, and first chamber is thrown for installing the laser
Module is penetrated, second chamber is for installing the infrared imaging module, and the third chamber is for installing the visual light imaging mould
Group.
8. camera assembly according to claim 7, which is characterized in that the through-hole include first through hole, the second through-hole and
Third through-hole, the first through hole, second through-hole and the third through-hole respectively with first chamber, second chamber and
The third chamber connection.
9. camera assembly according to claim 8, which is characterized in that the first through hole, second through-hole, described
The center of three through-holes is located along the same line.
10. a kind of terminal, which is characterized in that including：
Mainboard offers installing port on the mainboard；And
Claim 6 to 9 any one of them camera assembly, the frame be mounted on the installing port, the camera assembly with
The mainboard electrical connection.
11. terminal according to claim 10, which is characterized in that the terminal further includes shell, and the camera assembly is set
It sets in the shell and is exposed from the shell to obtain laser pattern, the shell includes front housing and rear shell, the front housing
It is offseted respectively with first face and second face the frame is clamped with the rear shell.
12. terminal according to claim 11, which is characterized in that the terminal further includes cover board, the cover board with it is described
Camera assembly is located at the opposite both sides of the front housing, and the front housing offers the first perforation, the second perforation and third perforation,
First perforation is corresponding with the laser projection module, and second perforation is corresponding with the visual light imaging module, described
Third perforation it is correspondings with the infrared imaging module, the cover board with it is described first perforate and the third perforation corresponding position shape
It is infrared through ink at having.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810315993.XA CN108614363A (en) | 2018-04-10 | 2018-04-10 | Laser projection module, camera assembly and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810315993.XA CN108614363A (en) | 2018-04-10 | 2018-04-10 | Laser projection module, camera assembly and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108614363A true CN108614363A (en) | 2018-10-02 |
Family
ID=63659721
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810315993.XA Pending CN108614363A (en) | 2018-04-10 | 2018-04-10 | Laser projection module, camera assembly and terminal |
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| CN109462713A (en) * | 2018-10-26 | 2019-03-12 | 敦南科技（无锡）有限公司 | A kind of ultrathin type image sensor module |
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Application publication date: 20181002 |