CN105700155A - Diffractive optical element and semiconductor laser-diffractive optical element module - Google Patents
Diffractive optical element and semiconductor laser-diffractive optical element module Download PDFInfo
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- CN105700155A CN105700155A CN201410704730.XA CN201410704730A CN105700155A CN 105700155 A CN105700155 A CN 105700155A CN 201410704730 A CN201410704730 A CN 201410704730A CN 105700155 A CN105700155 A CN 105700155A
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Abstract
The invention provides a diffractive optical element and a semiconductor laser-diffractive optical element module. The semiconductor laser-diffraction optical element module comprises a laser light source module and the diffraction optical element, wherein the laser light source module outputs a non-collimated point beam; the diffraction optical element receives the non-collimated point light beam from the laser light source module and modulates and outputs the non-collimated point light beam into light with optical information. The invention can receive the non-collimated point beam by the diffractive optical element which can receive the non-collimated point beam, and the invention can be used for matching with the laser light source module which emits the non-collimated point beam, so that the distance between the laser light source module and the diffractive optical element can be shortened as much as possible, and the length of the whole semiconductor laser-diffractive optical element module can be shortened.
Description
Technical field
The present invention is about the field of semiconductor laser-diffraction optical element module, more particularly to the field of integrating semiconductor laser and diffraction optical element module。
Background technology
The mobile device such as smart mobile phone is indispensable outfit during modern lives, and under the designer trends of large touch plate, mobile device can have the element needed for enough space。But, except large touch plate, light and slimming outward appearance is also the mainstay of mobile device。Therefore; when the some elements in mobile device must be arranged in mobile device in a specific way because of factors such as functions; the thinness of the thickness of these a little elements or size and mobile device will have direct relation; such as presently commercially available smart mobile phone; the thickness of its camera lens module is more than the thickness of smart mobile phone; therefore it being placed in the camera lens module in smart mobile phone, the position at its place would generally protrude from the lid of smart mobile phone, affects the attractive in appearance of smart mobile phone。
Except camera lens module, more and more many signs show, having the element of projecting function, to be integrated into smart mobile phone be one of designer trends。Fig. 1 is the side schematic view of the light source design needed for general projection。Refer to Fig. 1, general semiconductor laser 12 sends a light beam 13, collimating mirror 14 receives some light beam 13 and a light beam 13 also collimates chemical conversion for collimated beam 15, then by diffraction optical element (DOE) 16 receive collimated beam 15 by diffraction after export required diffraction light 17。In above-mentioned light source framework, the operating distance between semiconductor laser 12 and collimating mirror 14 is specific and needs high accuracy, therefore adds assembly cost。Furthermore, it is necessary to the light source of above-mentioned three kinds of elements, its entire length or thickness are also considerable, probably are difficult to be placed on lightening mobile device。
Summary of the invention
The technical problem to be solved in the present invention is in that, for prior art above shortcomings, a kind of diffraction optical element is provided and integrates the semiconductor laser-diffraction optical element module of this diffraction optical element, this diffraction optical element can receive and process non-alignedization light beam, therefore when being applied to projection light source, it is possible to reduce the lens of the required collimating mirror of script and assembly cost。
The technical problem to be solved in the present invention is in that, for prior art above shortcomings, a kind of diffraction optical element is provided and integrates the semiconductor laser-diffraction optical element module of this diffraction optical element, without arranging general collimating mirror between this diffraction optical element and semiconductor laser, therefore decrease the length that framework is overall, be suitably applied the mobile device such as smart mobile phone。
The technical problem to be solved in the present invention is in that, for prior art above shortcomings, a kind of diffraction optical element is provided and integrates the semiconductor laser-diffraction optical element module of this diffraction optical element, it includes the concave mirror structure being made on diffraction optical element, the function that tool expands, when making light beam can arrive diffraction optical element face in short distance, enough beam area are had to beat on diffraction optical element face。
The technical problem to be solved in the present invention is in that, for prior art above shortcomings, a kind of diffraction optical element is provided and integrates the semiconductor laser-diffraction optical element module of this diffraction optical element, utilize the diffraction optical element of the light source not needing tool collimation, it is possible to produce required diffraction and go out light configuration。
The technical solution adopted for the present invention to solve the technical problems is to provide a kind of semiconductor laser-diffraction optical element module, and it includes LASER Light Source module and diffraction optical element, and this LASER Light Source module exports one non-aligned some light beam；This diffraction optical element receives from this non-aligned some light beam of this LASER Light Source module, and this non-aligned some beam modulation is output into one with the light of optical information。
It is preferred that this semiconductor laser-diffraction optical element module also includes the housing of this LASER Light Source module accommodating and this diffraction optical element。
It is preferred that this diffraction optical element includes transparency carrier and is formed at the micro structure of one first of this transparent substrates, this non-aligned some light beam of this micro structure diffraction。
It is preferred that this first that is formed with this micro structure is a plane or a curved surface。
It is preferred that this cavity disperse characteristic is in this part or all of first。
It is preferred that this micro structure is positioned at this outside of first to be exposed to outside this first, or, this micro structure is positioned at this inner side of first。
It is preferred that this is first facing to this LASER Light Source module, or, this is first outside this semiconductor laser-diffraction optical element module。
It is preferred that this diffraction optical element also includes the functional structure that can expand, the functional structure that this can expand forms or is arranged at one second of this transparent substrates, and this non-aligned some light beam is by this functional structure that can expand。
It is preferred that this functional structure that can expand includes the concavees lens being processed into or becoming with Precision Machining a geometric optics face with manufacture of semiconductor。
It is preferred that this first between this LASER Light Source module and this second, or this second between this LASER Light Source module and this first。
It is preferred that this LASER Light Source module and this diffraction optical element keep a spacing, this spacing is 0 or is not 0。
The present invention also provides for a kind of diffraction optical element, and it includes transparent substrates and receives the micro structure of non-aligned laser spots light beam, and wherein, this micro structure is formed on this transparent substrates。
It is preferred that this micro structure of this diffraction optical element is positioned at one first of this transparent substrates, this diffraction optical element also includes the functional structure that can expand, and this functional structure that can expand is positioned at one second of this transparent substrates。
It is preferred that this cavity disperse characteristic of this diffraction optical element is in this part or all of first。
It is preferred that this functional structure that can expand of this diffraction optical element includes the concavees lens being distributed on part or all of this second。
The diffraction optical element of the present invention does not need the light source of tool collimation, and can receive and process non-alignedization light beam, when being applied to projection light source, it is possible to reduce the lens of the required collimating mirror of script and assembly cost；And the diffraction optical element of the present invention also can arrange the functional structure that can expand, expanding function thus having so that when light beam can arrive diffraction optical element face in short distance, having enough beam area to beat on diffraction optical element face。By this diffraction optical element, the semiconductor laser of the present invention-diffraction optical element module, eliminate the collimation optics needing to place between existing diffraction optical element and LASER Light Source module, even diffraction optical element can be attached on LASER Light Source module, thus can shorten whole module length on parallel optical axis direction, reduce material and the assembly cost of whole module simultaneously, be suitably applied on movement or the object wearing device of slimming。
In order to be able to further appreciate that the present invention reaches technology, means and effect that predetermined purpose is taked, refer to the detailed description below in connection with the present invention and accompanying drawing。The purpose of the present invention, feature or feature, go deep into and concrete understanding when can thus obtain one, but institute's accompanying drawings only provide with reference to and use is described, and be not used to the present invention person of being any limitation as。
Accompanying drawing explanation
Fig. 1 is the side schematic view of the light source design needed for general projection。
Fig. 2 is the side schematic view of the semiconductor laser-diffraction optical element module design embodiment of the present invention。
Fig. 3 is the amplification side schematic view of diffraction optical element one embodiment of the present invention。
Fig. 4 is the amplification side schematic view of diffraction optical element one embodiment of the present invention。
Fig. 5 is the amplification side schematic view of diffraction optical element one embodiment of the present invention。
Fig. 6 is the amplification side schematic view of diffraction optical element one embodiment of the present invention。
Detailed description of the invention
Semiconductor laser-diffraction optical element the module of the diffraction optical element of the present invention and this diffraction optical element of integration, is suitably applied on the mobile devices such as smart mobile phone as LASER Light Source。Presently, to utilize the laser instrument that TO-CAN encapsulates, the semiconductor laser module being suitable for smart mobile phone is of a size of 6 × 6 × 7 millimeters (length × width x thickness), and future, more evolution was to 4 × 6 × 4 millimeters。Therefore, the thickness of the semiconductor laser-diffraction optical element module integrating this diffraction optical element of the present invention can be compressed to less than 4 millimeters。If using surface fixed pattern element (SurfaceMountDevice further, SMD) laser instrument encapsulated, laser module thickness more can drop to 2 millimeters, enough hand-held devices use, and laser module also can directly in printed circuit board (PCB) (PrintedCircuitBoard, PCB), on, tradition piece mode is utilized to produce。
Secondly, the laser beam sent is one uncollimated some light beam to general LASER Light Source, and prior art just can other optical element incident after utilizing a collimating mirror that this uncollimated some beam collimation turns to directional light more。The non-collimated light of the following stated of the present invention, refers to the laser beam sent by general LASER Light Source, and without any collimation before the diffraction optical element of the incident present invention, it generally has the beam divergence angle (beamdivergence) being not equal to 0 degree。The applicable LASER Light Source sending uncollimated some light beam of the present invention, illustrate but do not limit ground, for instance the LASER Light Source of common semiconductor edge-emitting laser device (edgeemittinglaser), vertical cavity surface-emitting laser (VCSEL) or other kind。
Fig. 2 is the side schematic view of the semiconductor laser-diffraction optical element module design embodiment of the present invention。Refer to Fig. 2, semiconductor laser-diffraction optical element module 2 includes LASER Light Source module 22 and a diffraction optical element 24, and semiconductor laser-diffraction optical element module 2 can more include a housing 23 of accommodating LASER Light Source module 22 and diffraction optical element 24。In the present embodiment; non-aligned some light beam 25 of LASER Light Source module 22 is penetrated by a window 221 of LASER Light Source module 22; wherein window 221 can be an opening of LASER Light Source module 22; or have other not have the element of alignment function (not painting on figure) at opening, for instance one transparency protected dust-proof or encapsulating。It should be understood that LASER Light Source module 22 also can provide a surface, or such as the array of source of vertical cavity surface-emitting laser (VCSEL), to send multiple non-aligned some light beam 25。
Secondly, diffraction optical element 24 is arranged on LASER Light Source module 22 so that the incident diffraction optical element 24 of non-aligned some light beam 25, wherein, LASER Light Source module 22 itself or and diffraction optical element 24 between do not have optical element or the structure intervention of any tool collimationization function。Again, can having a spacing L between diffraction optical element 24 and LASER Light Source module 22, wherein spacing L can be 0 or not be 0, and also meaning diffraction optical element 24 can be attached on LASER Light Source module 22 completely, or keeps a distance with LASER Light Source module 22。Be with, the diffraction optical element 24 of the present invention can be attached on LASER Light Source module 22 completely, so that diffraction optical element 24 can shorten to only small with the total length T of LASER Light Source module 22 (length on parallel non-aligned some light beam 25 optical axis direction), and then make the thickness U of housing 23 can also shorten to reach below above-mentioned 4 millimeter。
Furthermore, non-aligned some light beam 25 is incident also just becomes the light 27 with optical information with two or more than two dimensions after the diffraction of diffraction optical element 24 processes, and penetrates with the light 27 of optical information and just can project after outside semiconductor laser-diffraction optical element module 2 to any suitable bright finish or spatially。It should be understood that owing to being the modulation through diffraction optical element 24 with the light 27 of optical information, therefore the brightness of optical information very uniformly or can have the change of gray scale according to design requirement, does not have the lofty bright spot outside design condition。Except the optical information with greater brightness, with optical information light 27 can also with the more weak bias light of brightness, even and the brightness of bias light be also uniform or gradual。
Fig. 3,4,5 are the amplification side schematic view of the diffraction optical element difference embodiment of the present invention。Refer to Fig. 3,4,5, the diffraction optical element 34,44,54 of the present invention can with suitable light transmissive material for transparent substrates 28, and at least any surface at transparent substrates 28 makes or forms the micro structure of diffraction lines or pattern。With Fig. 3, first face 341 of transparent substrates 28 is towards LASER Light Source module, light with optical information is then penetrated by the second face 343 of transparent substrates 28, the micro structure 36 then with the diffraction lines or pattern that receive non-aligned some light beam is made on the first face 341 of transparent substrates 28, second face 343 can be then without micro structure, and wherein micro structure 36 can be that UV solidification glue-line making is exposed on the first face 341 or etching makes lines outside the first face 341。Fig. 4 is then contrary with Fig. 3, does not have diffraction function towards the first face 441 of LASER Light Source module, and the second face 443 then includes the micro structure 46 of diffraction lines or the pattern that can receive non-aligned some light beam and produces diffraction image。The first face 541 in Fig. 5 and the second face 543 then all include the micro structure 56 of diffraction lines or the pattern receiving non-aligned some light beam。Additionally, be noted that first of diffraction optical element 34,44,54 or the second face all can respectively planes or have the face of radian or curvature。It addition, the micro structure of the diffraction lines of non-aligned some light beam or pattern can be distributed or be formed at part or all of surface of transparent substrates。
Except making the micro structure of diffraction lines or pattern, the diffraction optical element of the present invention still can include the functional surfaces of other function。Fig. 6 is the amplification side schematic view of another embodiment of diffraction optical element of the present invention。Refer to Fig. 6, diffraction optical element 64 is also with light transmissive material for transparent substrates 28, it has towards the first face 641 of LASER Light Source module or includes a structure that can expand or shape 642, the one concavees lens structure in the geometric optics face such as made with manufacture of semiconductor DOE making or Precision Machining, light with optical information is then penetrated by the second face 643 of the micro structure 66 including diffraction lines or pattern, its role is to expand non-aligned incident beam size, make the light beam through micro structure 66 can have bigger light area, more wavefront modification information could be accepted, and then project finer and smoother pattern。It should be understood that the structure that so can expand or shape can also be distributed in a part for transparent substrates or whole surface。
According to above-mentioned, for whole semiconductor laser-diffraction optical element module, omit the collimation optics needing to place between existing diffraction optical element and LASER Light Source module, even diffraction optical element is attached on LASER Light Source module, the semiconductor laser of the present invention-diffraction optical element module can shorten whole module length on parallel optical axis direction, reduce material and the assembly cost of whole module simultaneously, be suitably applied on movement or the object wearing device of slimming。
The foregoing is only presently preferred embodiments of the present invention, be not limited to scope of the presently claimed invention, therefore all other changes without departing from the equivalence completed under disclosed spirit or modifies, and is intended to be limited solely by the scope of the present invention。
Claims (15)
1. semiconductor laser-diffraction optical element module, it is characterised in that including:
LASER Light Source module, it exports one non-aligned some light beam；And
Diffraction optical element, it receives from this non-aligned some light beam of this LASER Light Source module, and this non-aligned some beam modulation is output into one with the light of optical information。
2. semiconductor laser-diffraction optical element module as claimed in claim 1, it is characterised in that this semiconductor laser-diffraction optical element module also includes the housing of this LASER Light Source module accommodating and this diffraction optical element。
3. semiconductor laser-diffraction optical element module as claimed in claim 1, it is characterised in that this diffraction optical element includes transparency carrier and is formed at the micro structure of one first of this transparent substrates, this non-aligned some light beam of this micro structure diffraction。
4. semiconductor laser-diffraction optical element module as claimed in claim 3, it is characterised in that this first that is formed with this micro structure is a plane or a curved surface。
5. semiconductor laser-diffraction optical element module as claimed in claim 4, it is characterised in that this cavity disperse characteristic is in this part or all of first。
6. semiconductor laser-diffraction optical element module as claimed in claim 4, it is characterised in that this micro structure is positioned at this outside of first to be exposed to outside this first, or, this micro structure is positioned at this inner side of first。
7. semiconductor laser-diffraction optical element module as claimed in claim 3, it is characterised in that this is first facing to this LASER Light Source module, or, this is first outside this semiconductor laser-diffraction optical element module。
8. semiconductor laser-diffraction optical element module as claimed in claim 3, it is characterized in that, this diffraction optical element also includes the functional structure that can expand, the functional structure that this can expand forms or is arranged at one second of this transparent substrates, and this non-aligned some light beam is by this functional structure that can expand。
9. semiconductor laser-diffraction optical element module as claimed in claim 8, it is characterised in that this functional structure that can expand includes the concavees lens being processed into or becoming with Precision Machining a geometric optics face with manufacture of semiconductor。
10. semiconductor laser-diffraction optical element module as claimed in claim 8, it is characterised in that this first between this LASER Light Source module and this second, or this second between this LASER Light Source module and this first。
11. semiconductor laser-diffraction optical element module as claimed in claim 1, it is characterised in that this LASER Light Source module and this diffraction optical element keep a spacing, and this spacing is 0 or is not 0。
12. a diffraction optical element, it is characterised in that including transparent substrates and receive the micro structure of non-aligned laser spots light beam, wherein, this micro structure is formed on this transparent substrates。
13. diffraction optical element as claimed in claim 12, it is characterised in that this micro structure is positioned at one first of this transparent substrates, and this diffraction optical element also includes the functional structure that can expand, and this functional structure that can expand is positioned at one second of this transparent substrates。
14. diffraction optical element as claimed in claim 13, it is characterised in that this cavity disperse characteristic is in this part or all of first。
15. diffraction optical element as claimed in claim 13, it is characterised in that this functional structure that can expand includes the concavees lens being distributed on part or all of this second。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103139607A TWI583991B (en) | 2014-11-14 | 2014-11-14 | Doe and laser diode-doe module |
| TW103139607 | 2014-11-14 |
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| CN105700155A true CN105700155A (en) | 2016-06-22 |
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| TW (1) | TWI583991B (en) |
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| CN108614363A (en) * | 2018-04-10 | 2018-10-02 | Oppo广东移动通信有限公司 | Laser projection module, camera assembly and terminal |
| CN109521639A (en) * | 2019-01-15 | 2019-03-26 | 深圳市安思疆科技有限公司 | A kind of project structured light mould group and 3D imaging device without collimation lens |
| CN110208889A (en) * | 2018-02-28 | 2019-09-06 | 宁波舜宇光电信息有限公司 | The diffractive-optical element and its manufacturing method of anti-reverse mounting |
| WO2019213861A1 (en) * | 2018-05-09 | 2019-11-14 | 深圳阜时科技有限公司 | Light source module, image acquisition device, identity recognition device, and electronic apparatus |
| CN111142323A (en) * | 2018-11-02 | 2020-05-12 | 三赢科技（深圳）有限公司 | Structured light projection module and electronic device with same |
| CN114019597A (en) * | 2021-11-12 | 2022-02-08 | 深圳市安思疆科技有限公司 | Method for designing diffractive optical element, and structured light projector |
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| CN112904585B (en) * | 2021-04-21 | 2022-11-08 | 南昌三极光电有限公司 | Optical system |
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Also Published As
| Publication number | Publication date |
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| TW201617679A (en) | 2016-05-16 |
| TWI583991B (en) | 2017-05-21 |
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Application publication date: 20160622 |