The content of the invention
The purpose of this utility model is to solve volume when prior art chips are combined with circuit board and radiating
Problem, proposes a kind of light-emitting device and its optical projection module, and the problem of volume is with radiating can be taken into account simultaneously.
The utility model provides a kind of light-emitting device, including：Base, for supporting and radiating, the base is opposed
Two surfaces difference it is fluted with it is raised；Light source, for launching light beam, the light source is arranged in the groove of the base；Electricity
Road plate, for controlling light source luminescent, the circuit board is provided with through hole；The base is installed to the circuit board by projection
In through hole.
In some embodiments, the base includes ceramic bases, and the ceramic bases are provided with through hole, described to cause
Circuit board is electrically connected with the light source.
In some embodiments, the light source includes VCSEL array light source, and the VCSEL array light source includes partly leading
Body substrate and VCSEL light source, the VCSEL light source are arranged on the semiconductor base with irregular pattern.
In some embodiments, the circuit board includes flexible PCB, printed circuit board and rigid-flexible circuit
One kind of plate or combination.
The utility model also provides a kind of optical projection module, including light-emitting device as described above, for launching light beam；
Optics, including：Lens, for receiving and collimating the light beam；Diffraction optical element, for by the light beam after expanding
Form fixed beam pattern and outwards launch；Lens barrel, for fixing the lens and the diffraction optical element, and with it is described
Light-emitting device is connected.
In some embodiments, the lens include microlens array.
Compared with prior art, the beneficial effects of the utility model have：
The utility model provides light-emitting device, by setting groove respectively on the base two sides with support and heat sinking function
And it is raised, it is respectively used to chip placement and is connected with circuit board, so can fully reduces the overall volume of device, simultaneously
Chip directly contacts connection with thermal component, and thermal component plays a part of supporting chip simultaneously, it is ensured that provide maximum to chip
The radiating of limit.Compared with prior art, light-emitting device of the present utility model have high heat conduction, high stable, high reliability and
The advantage of small volume, so as to be integrated into miniature computing device.
In order that the utility model embodiment technical problem to be solved, technical scheme and beneficial effect are more clear bright
In vain, below in conjunction with drawings and Examples, the utility model is further elaborated.It should be appreciated that described herein
Specific embodiment only to explain the utility model, is not used to limit the utility model.
It should be noted that when element is referred to as " being fixed on ", " being arranged at " or " being installed on " another element, it can be with
Directly on another element or it is connected on another element.When an element is known as " being connected to " another yuan
Part, it can be directly to another element or be indirectly connected on another element.In addition, connection can be used
Can also be used for circuit communication effect in fixation.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System, is for only for ease of description the utility model embodiment and simplifies description, rather than indicate or imply the device or member of meaning
Part must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.
The utility model proposes the chip flush mounting of a kind of perfect heat-dissipating and small volume.Will in explanation below
Illustrated by taking the projection module of depth camera as an example, but be not meant to that this scheme is only capable of applying in depth camera, appointed
Every direct or indirect utilization program is intended to be included in protection domain of the present utility model what in his device.
The depth camera side schematic view based on structure light shown in Fig. 1.The main building block of depth camera 10 has optics
Module 13, collection module 14, mainboard 12 and processor 11 are projected, RGB camera 16 is further provided with some depth cameras.Light
Projection module 13, collection module 14 and RGB camera 16 is learned to be generally mounted in same depth camera plane, and in same
One baseline, each module or camera correspond to a light portal 17.Usually, processor 11 is integrated on mainboard 12,
And optical projection module 13 is connected with collection module 14 by interface 15 with mainboard, described interface is in one embodiment
FPC interfaces.Wherein, optical projection module is used to project encoded structured light patterns into object space, collection module collection
Handle to obtain the depth image of object space by processor after to the structure light image.In one embodiment, structure light
Image is infrared speckle pattern, and pattern has distribution of particles relatively uniform but with very high local irrelevance, office here
Portion's irrelevance refers to that each sub-regions all have higher uniqueness in pattern.Corresponding collection module 14 is infrared phase
Based on time flight method principle（TOF）Depth camera chief component be also projection module with collection mould
Group, is used to launch the light pulse clocked, collection module collection from its projection module unlike the depth camera of structure light principle
Can be obtained by the flight time of light in space after to the light pulse, recycle processor calculate corresponding spatial point away from
Depth camera single at present is larger due to volume, is mostly, as independent peripheral hardware, to pass through the data-interfaces such as USB
Be connected with other equipment such as computer, mobile phone etc., and the information transfer such as the depth obtained carried out to other equipment it is further
Processing.It is more and more extensive with the application of depth camera, depth camera and other equipment are subjected to integrated, integration and would is that future
Developing direction.Mainboard, processor and computer cell phone of depth camera etc. can be set at the integrated aspect of mainboard and processor
Standby mainboard, processor are integrated；At the integrated aspect of collection module and optical projection module, the large scale equipment such as current computer
There is the scheme of correlation, but for micromodule equipments such as mobile phones, the optical projection module of only small volume could meet requirement, separately
It is outer because the power consumption of optical projection module is larger, it is more to generate heat, therefore possess higher thermal diffusivity and be also highly desirable to.This practicality
New emphasis will propose a kind of light-emitting device and its optical projection module for possessing high-cooling property and small size.Following root
Optical projection module is described in detail according to embodiment scheme of the present utility model.
Fig. 2 is the schematic diagram of the optical projection module according to the utility model embodiment.Optical projection module 13 includes hair
Electro-optical device is constituted with optics, and wherein light-emitting device is made up of base 131, circuit board 132 and light source 134, optics
By lens barrel 137, lens 135 and diffraction optical element（DOE）136 compositions.It is by lens barrel between optics and light-emitting device
137 are connected with base 131.The light beam that light source 132 in light-emitting device is sent collimate or converge through lens 135 after from DOE136 to
Launch in space, usually lens 135 are located between light source 134 and diffraction optical element 136, typically, lens 135 and light
The distance between source 132 is approximately equal to the focal length of lens.Lens 135 and DOE can also be integrated into one in other embodiments
Optical element, microscope base can also be divided into upper and lower microscope base to install or debug.On the one hand base 131 requires have enough
Hardness supports light source, on the other hand also needs to higher thermal diffusivity.
In one embodiment, lens can also be microlens array.
The size of the volume influence entire depth camera of optical projection module, and the wherein size of light source 134 and base 131
It is then to influence the key factor of optical projection modular volume.In the selection of light source, vertical cavity surface generating laser (VCSEL) is gathered around
Having the advantages that small volume, the light source angle of departure are small, stability is good can be used as projecting the light source of module reducing overall body
Product.Next first VCSEL and its array chip are illustrated, secondly its light-emitting device constituted with base 131 explained
Fig. 3 is the vcsel structure schematic diagram in one embodiment of the utility model.In figure 3,301 be single
VCSEL, usually, VCSEL active layer 305 is in centre, and what is be connected with active layer is limiting layer 306, and the effect of limiting layer is
For controlling light field and electric current to realize the control to laser shape etc., the semiconductor that there be p-type and N-type in active layer two ends reflects
Mirror 304 and 307, the opposite side of speculum 307 is top electrodes 308（P poles, positive pole）, the side of speculum 304 is partly to lead respectively
Body substrate 303 and bottom electrode 302（N poles, negative pole）.
Fig. 4 is the VCSEL chip front views in one embodiment of the utility model.When the power of single VCSEL light source
During etc. not reaching application requirement, by the way that multiple VCSEL403 are arranged in same Semiconductor substrate 402 in an array manner
Light source power can be improved, manufacturing multiple VCSEL light sources simultaneously in same Semiconductor substrate in addition can also greatly improve
Manufacture efficiency.VCSEL array chip 401 can reach the yardstick of wafer scale at present, you can with 1mm2Chip on be arranged to
Hundred thousands of VCSEL light sources.Control to light source can have VCSEL light sources all on different patterns, chip synchronously to be controlled
System opening and closing, or, the VCSEL on chip is controlled to produce different illumination density by independent or packet.In some realities
Apply in example, opening is in synchronized control with closing using VCSEL light source all on the first pattern, i.e. chip.In other realities
Apply in example, can be using second of pattern, i.e. VCSEL on chip is close to produce different illumination by independent or packet control
VCSEL403 form and arrangement can have a variety of according to specific application demand, such as be uniformly regularly arranged or
Person carries out irregular alignment with certain uncorrelated pattern.Single VCSEL shape, area can also be differed.Formal
Randomization can bring the reduction of manufacture efficiency.In certain embodiments, VCSEL403 is uniformly regularly arranged in semiconductor lining
On bottom 402, in further embodiments, according to specific application demand, VCSEL403 is irregular with certain uncorrelated pattern
It is arranged in Semiconductor substrate 402.
In certain embodiments, VCSEL chips can also be packaged by special purposes, similar to CPU of computer etc.
Chip, both positive and negative polarity is connected by being connected to pin in the same side with the external world.It is real for depth camera described in the utility model
Apply for example, due to requiring small volume, thus preferably processing mode is directly by unencapsulated VCSEL semiconductor slice chips
It is placed on base 131.Usually, the bottom cathode connection of chip, the connection of top positive pole.It will be cut in the following description with VCSEL
Illustrated exemplified by piece chip, it will be appreciated that encapsulation chip is also contained in protection domain of the present utility model.
Chip has been required for carrying and bindiny mechanism, to ensure the normal function of chip.Its promising independence of such as computer CPU
The bite type connection of design and fixed mechanism；For the little special chip of some caloric values, pin and mainboard directly can be passed through
It is joined directly together；And for chip described in the utility model, typically there is higher caloric value, and need firm consolidate
Determine device.VCSEL array chip due to be for launching light beam, it is necessary to larger power, caloric value is larger, further need exist for by
It is integrated into the micromodule equipment of small volume, heat dissipation problem needs to solve；On the other hand, for depth camera, optics is thrown
The relative position requirement of shadow module is consolidated very much, to ensure to have stabilization, accurate depth image to export.Therefore, VCSEL array core
The carrying of piece requires both to possess small volume in order to integrated with bindiny mechanism, preferable heat dispersion is needed again and steady
Fig. 2, light-emitting device of the present utility model, including base 131 are returned to, for supporting chip 134 and providing radiating
Function；Circuit board 132, works for control chip 134.Wherein base 131 can be that metal material can also be other materials,
Typically, base 131 is ceramic material, and ceramic material has excellent thermal diffusivity and hardness.In order to reduce light-emitting device
Thickness, on a surface fluted 138 for base 131, for chip placement 134, has projection 132, high spot is used in another side
In base 131 being installed in the corresponding through hole of circuit board 132.Typically, the projection of the through hole of circuit board 132 and base 131
Size is identical, and the end of circuit board 132 also has the port 133 electrically connected with outside realization, such as USB, MINI USB, MIPI etc.
In light-emitting device, the control of chip 134 is performed by circuit board 132, due to quilt between circuit board 132 and chip 134
Base 131 is separated, therefore generally requires on base 131 opened hole to realize connection.In certain embodiments, due to chip
134 be unencapsulated nude film, therefore its bottom is an electrode, therefore when base 131 is conductive material, 134 electrode directly with
Conductive material is connected, then circuit board 132 is electrically connected to the connection for realizing the also electrode with base 131；And it is another for chip 134
The connection of one electrode can then open up after through hole that the electrode is electrically connected with circuit board by chip on base 131.
In one embodiment, base 131 is nonconducting ceramic material, can now be injected in its surface or through hole
The conductive material such as material such as silver, copper, gold, allows also have while its high heat conduction with ceramics, high stable, high reliability and leads
The two surfaces difference fluted 138 and projection 139 of base, set the effect one of groove 138 in the utility model
Aspect is to be fixed on chip 134 wherein to reduce the integral thickness of optical projection module 13, on the other hand can be with
Ensure lens barrel 137 has enough thickness to ensure the intensity of connection with the position that base 131 is connected.In addition, in the middle of circuit board 132
The projection 139 being provided with through hole, base is matched so that base 131 to be connected with circuit board 132 with through hole, and light will be further reduced in this
Learn the thickness of projection module 13.
Circuit board 132 can be printed circuit board（PCB）, flexible PCB (FPC) or the two be combined into it is soft or hard
Board.When base 131 has enough hardness and stability, typically, circuit board 132 can be FPC, one side FPC
Thickness it is small, another aspect FPC connections and install it is more convenient.
For the laser module shown in Fig. 2 during fabrication, light-emitting device and optics can synchronously carry out.For luminous
Device, base 131 is connected with circuit board 132, and secondly light source 134 is connected on base 131, finally optics is installed
Onto base 131.
Above content is to combine specific preferred embodiment further detailed description of the utility model, it is impossible to
Assert that specific implementation of the present utility model is confined to these explanations.For the utility model person of ordinary skill in the field
For, without departing from the concept of the premise utility, some equivalent substitutes or obvious modification, and performance can also be made
Or purposes is identical, the protection domain of technical solutions of the utility model should be all considered as belonging to.