CN108664892A - Image Acquisition structure and electronic device - Google Patents

Image Acquisition structure and electronic device Download PDF

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Publication number
CN108664892A
CN108664892A CN201810290154.7A CN201810290154A CN108664892A CN 108664892 A CN108664892 A CN 108664892A CN 201810290154 A CN201810290154 A CN 201810290154A CN 108664892 A CN108664892 A CN 108664892A
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China
Prior art keywords
laser
image acquisition
light
transmitter
laser transmitter
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CN201810290154.7A
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Chinese (zh)
Inventor
张学勇
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201810290154.7A priority Critical patent/CN108664892A/en
Publication of CN108664892A publication Critical patent/CN108664892A/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/18Eye characteristics, e.g. of the iris
    • G06V40/19Sensors therefor
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/10Image acquisition
    • G06V10/12Details of acquisition arrangements; Constructional details thereof
    • G06V10/14Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G06V10/145Illumination specially adapted for pattern recognition, e.g. using gratings
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/10Image acquisition
    • G06V10/12Details of acquisition arrangements; Constructional details thereof
    • G06V10/14Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G06V10/147Details of sensors, e.g. sensor lenses

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Artificial Intelligence (AREA)
  • Ophthalmology & Optometry (AREA)
  • Human Computer Interaction (AREA)
  • Vascular Medicine (AREA)
  • Studio Devices (AREA)

Abstract

The present invention discloses a kind of Image Acquisition structure.Image Acquisition structure includes project structured light module, the first image acquisition device, the second image acquisition device, the first optical module and single acquisition window, propagates to the first image acquisition device after the transmission of the first optical module from the target light of acquisition window incidence and propagates to the second image acquisition device after the reflection of the first optical module;Project structured light module include for emitting the first laser transmitter of first laser, the second laser transmitter for emitting second laser, the second optical module, collimating element, second optical module makes first laser and second laser propagates to collimating element, and target light includes first laser and/or second laser.Invention additionally discloses a kind of electronic devices.The Image Acquisition structure and electronic device of the present invention makes to propagate to two image acquisition devices respectively with a branch of target light using the first optical module, to which two image acquisition devices can acquire two kinds of images substantially without pixel parallax.

Description

Image Acquisition structure and electronic device
Technical field
The present invention relates to technical field of imaging, more particularly to a kind of Image Acquisition structure and electronic device.
Background technology
In the related art, in order to acquire a variety of images, generally multiple images collector is arranged in parallel so that multiple Image acquisition device can acquire a variety of images, however there are larger pixel parallax between a variety of images for acquiring of this mode, To be difficult to carry out specific image procossing (such as image co-registration) according to a variety of images.
Invention content
A kind of Image Acquisition structure of embodiment of the present invention offer and electronic device.
The Image Acquisition structure of embodiment of the present invention, including project structured light module, the first image acquisition device, the second figure As collector, the first optical module and single acquisition window, from the target light of acquisition window incidence through first light Described first image collector is propagated to after learning component transmission, from the target light of acquisition window incidence through described the Second image acquisition device is propagated to after the reflection of one optical module;The project structured light module includes first laser transmitting Device, second laser transmitter, the second optical module, collimating element and diffraction optical element, the first laser transmitter are used for Emit first laser, the second laser transmitter is for emitting second laser, the first laser transmitter and described second At least one of laser emitter be edge-emitting laser, second optical module for changing the first laser biography The direction of propagation in direction and/or the second laser is broadcast so that the first laser and the second laser propagate to the standard Straight element, for collimating the first laser and/or the second laser, the diffraction optical element is used for the collimating element The first laser and/or the second laser, the target light after collimating element collimation described in diffraction include described After diffraction optical element diffraction and pass through the first laser and/or the second laser that target reflects to form.
The electronic device of embodiment of the present invention, including:
Shell;With
Above-mentioned Image Acquisition structure, described image acquire structure installation and expose on the housing and from the shell.
The Image Acquisition structure and electronic device of embodiment of the present invention are made using the first optical module from acquisition window Incident same a branch of target light propagates to the first image acquisition device and the second image acquisition device respectively, to the first Image Acquisition Device and the second image acquisition device can acquire two kinds of images substantially without pixel parallax.
The additional aspect and advantage of embodiment of the present invention will be set forth in part in the description, partly will be from following Become apparent in description, or practice through the invention is recognized.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention can be from the description in conjunction with following accompanying drawings to embodiment It will be apparent and be readily appreciated that, wherein:
Fig. 1 is the structural schematic diagram of the Image Acquisition structure of certain embodiments of the present invention;
Fig. 2 is the structural schematic diagram of the project structured light module of certain embodiments of the present invention;
Fig. 3 is the part-structure schematic diagram of project structured light module in Fig. 2;
Fig. 4 is the part-structure schematic diagram of project structured light module in Fig. 2;
Fig. 5 is the part-structure schematic diagram of the project structured light module of another embodiment of the present invention;
Fig. 6 is the part-structure schematic diagram of the project structured light module of a further embodiment of this invention;
Fig. 7 is the part-structure schematic diagram of the project structured light module of a further embodiment of the present invention;
Fig. 8 is the part-structure schematic diagram of the project structured light module of a further embodiment of this invention;
Fig. 9 is the part-structure schematic diagram of the project structured light module of a further embodiment of this invention;
Figure 10 is the floor map of the electronic device of certain embodiments of the present invention.
Specific implementation mode
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein identical Or similar label indicates same or similar element or element with the same or similar functions from beginning to end.Below by ginseng The embodiment for examining attached drawing description is exemplary, and is only used for explaining embodiments of the present invention, and should not be understood as to this hair The limitation of bright embodiment.
In the description of embodiments of the present invention, it is to be understood that term "center", " longitudinal direction ", " transverse direction ", " length Degree ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", The orientation or positional relationship of the instructions such as "outside", " clockwise ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, only It is embodiments of the present invention and simplified description for ease of description, does not indicate or imply the indicated device or element is necessary With specific orientation, with specific azimuth configuration and operation, therefore should not be understood as the limitation to embodiments of the present invention. In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance or implicit Indicate the quantity of indicated technical characteristic." first " is defined as a result, the feature of " second " can be expressed or impliedly wrap Include one or more feature.In the description of embodiments of the present invention, the meaning of " plurality " is two or two More than, unless otherwise specifically defined.
In the description of embodiments of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " connection ", " connection " shall be understood in a broad sense, for example, it may be fixedly connected, may be a detachable connection or one Connect to body;It can be mechanical connection, can also be to be electrically connected or can mutually communicate;Can be directly connected to, can also lead to It crosses intermediary to be indirectly connected with, can be the interaction relationship of the connection or two elements inside two elements.For ability For the those of ordinary skill in domain, it can understand that above-mentioned term in embodiments of the present invention specific contains as the case may be Justice.
Following disclosure provides many different embodiments or example is used for realizing embodiments of the present invention not Same structure.In order to simplify the disclosure of embodiments of the present invention, hereinafter the component of specific examples and setting are described.When So, they are merely examples, and is not intended to limit the present invention.In addition, embodiments of the present invention can be in different examples Repeat reference numerals and/or reference letter in son, this repetition are for purposes of simplicity and clarity, itself not indicate to be begged for By the relationship between various embodiments and/or setting.In addition, the various specific techniques that embodiments of the present invention provide With the example of material, but make those of ordinary skill in the art may realize that the application of other techniques and/or other materials With.
Referring to Fig. 1, Image Acquisition structure 100 includes project structured light module 10, the first image acquisition device 22, the second figure As collector 24 and the first optical module 60.It could be formed in Image Acquisition structure 100 corresponding with project structured light module 10 Projection window 40, and corresponding with image acquisition device 20 (including the first image acquisition device 22 and second image acquisition device 24) adopt Collect window 50, wherein the number of acquisition window 50 is one.Project structured light module 10 is used for by projecting window 40 to target Space projects laser pattern.The target light incident from acquisition window 50 propagates to the first figure after the transmission of the first optical module 60 As collector 22, the target light incident from acquisition window 50 propagates to the second Image Acquisition after the reflection of the first optical module 60 Device 24, target light include the laser pattern after target reflects.In one example, project structured light module 10 projects Laser is infrared laser, and image acquisition device 20 is infrared camera, and the first optical module 60 is half-reflecting half mirror.Utilize half anti-half Lens can make target light propagate to the first image acquisition device 22 and the second image acquisition device 24 respectively, and make first Image acquisition device 22 and the second image acquisition device 24 collect two kinds of images substantially without pixel parallax.
Referring to Fig. 2, project structured light module 10 includes board unit 11, lens barrel 12, first laser transmitter 132, the Dual-laser transmitter 134, collimating element 14, diffraction optical element 15 and the second optical module 19.Collimating element 14 and diffraction light It learns element 15 to be successively set in the light path of first laser transmitter 132 and second laser transmitter 134, specifically, first swashs The second laser of first laser and/or the second laser transmitter 134 transmitting that optical transmitting set 132 emits is through the second optics group Collimating element 14 and diffraction optical element 15 are sequentially passed through after part 19.
Board unit 11 includes substrate 111 and the circuit board 112 being carried on substrate 111.Substrate 111 is for carrying lens barrel 12, first laser transmitter 132, second laser transmitter 134 and circuit board 112.The material of substrate 111 can be plastics, than Such as polyethylene terephthalate (Polyethylene Glycol Terephthalate, PET), poly-methyl methacrylate Ester (Polymethyl Methacrylate, PMMA), makrolon (Polycarbonate, PC), polyimides At least one of (Polyimide, PI).That is, any one in PET, PMMA, PC or PI may be used in substrate 111 Unitary plastic material be made.In this way, 111 lighter weight of substrate and have enough support strengths.
Circuit board 112 can be any one in printed circuit board, flexible PCB, Rigid Flex.Circuit board 112 On can offer via 113, can be used for accommodating first laser transmitter 132 and/or second laser transmitter in via 113 134,112 part of circuit board is covered by lens barrel 12, and another part extends out and can be connect with connector 17, connector 17 Project structured light module 10 can be connected on other electronic components (such as the mainboard of electronic device shown in Fig. 10 1000 On).
Lens barrel 12 is arranged on board unit 11 and host cavity 121 is collectively formed with board unit 11.Specifically, lens barrel 12 It can be connect with the circuit board 112 of board unit 11, lens barrel 12 can be bonded by viscose glue with circuit board 112, to improve receiving The air-tightness of chamber 121.Certainly, lens barrel 12 and the specific connection type of board unit 11 can have other, such as be connected by engaging It connects.Host cavity 121 can be used for accommodating components, the host cavities 121 such as collimating element 14, diffraction optical element 15 and be formed simultaneously knot A part for the light path of structure light projection module 10.In embodiments of the present invention, lens barrel 12 is in hollow tubular, and lens barrel 12 includes mirror Cylinder side wall 122 and limit protrusion 123.
Lens barrel side wall 122 surrounds host cavity 121, and the outer wall of lens barrel side wall 122 could be formed with location structure and installation is tied Structure, in order to the installation (such as precalculated position in electronic device 1000) of project structured light module 10.Lens barrel 12 wraps Opposite the first face 124 and the second face 125 are included, wherein the one of host cavity 121 is opened on the second face 125, another It is opened on the first face 124.Second face 125 is combined with circuit board 112, such as glued.
Please continue to refer to Fig. 2, limit protrusion 123 is inwardly projecting from lens barrel side wall 122, and specifically, limit protrusion 123 is from mirror Cylinder side wall 122 is prominent into host cavity 121.Limit protrusion 123 can be in that continuous cyclic annular or limit protrusion 123 includes more A, multiple limit protrusions 123 are spaced apart.Limit protrusion 123 surrounded unthreaded hole 1231, and host cavity can be used as by crossing unthreaded hole 1231 121 part, laser penetrated diffraction optical element 15 after passing through unthreaded hole 1231.Limit protrusion 123 includes the first confined planes 1232 and second confined planes 1233, the first confined planes 1232 it is opposite with the second confined planes 1233.Specifically, limit protrusion 123 Between the first face 124 and the second face 125, the first confined planes 1232 compared with the second confined planes 1233 closer to the first face 124, first Confined planes 1232 and the second confined planes 1233 can be parallel planes.Receipts between first confined planes 1232 and the first face 124 Vessel 121 can be used for accommodating diffraction optical element 15, and the host cavity 121 between the second confined planes 1233 and the second face 125 can For accommodating collimating element 14.
Incorporated by reference to Fig. 3, first laser transmitter 132 and second laser transmitter 134 can be arranged on board unit 11. Specifically, first laser transmitter 132 can be arranged on substrate 111 and be housed in via 113 (can by arrange conducting wire Laser emitter 132/134 is electrically connected with circuit board 112, similarly hereinafter), second laser transmitter 134 can be arranged in circuit board It is electrically connected on 112 and with circuit board 112.First laser transmitter 132 is for emitting first laser, second laser transmitter 134 For emitting second laser, laser can be infrared laser.First laser and second laser can be different, such as first laser Light intensity is different from the light intensity of second laser or the pattern of first laser and the pattern of second laser it is different.
In embodiments of the present invention, at least one of first laser transmitter 132 and second laser transmitter 134 are Edge-emitting laser (edge-emitting laser, EEL) 136.Light source, one side side are used as using edge-emitting laser 136 Emitting laser 136 is smaller compared with the temperature drift of VCSEL array, other direction, since edge-emitting laser 136 is single-point light-emitting junction Structure is not necessarily to array of designs structure, makes simply, the cost of light source of project structured light module 10 is relatively low.
Referring to Fig. 3, first laser transmitter 132 and second laser transmitter 134 are edge-emitting laser 136, tool Body, edge-emitting laser 136 can be distributed feedback laser (Distributed Feedback Laser, DFB).The First light-emitting surface 1322 of one laser emitter 132 is towards collimating element 14, the second light-emitting surface of second laser transmitter 134 1342 the second optical modules 19 of direction.
The laser of distributed feedback laser obtains the gain of power by the feedback of optical grating construction when propagating.It carries The power of high distributed feedback laser is needed by increasing Injection Current and/or increasing the length of distributed feedback laser, Since increase Injection Current can make the power consumption of distributed feedback laser increase and serious problem of generating heat occurs, In order to ensure that distributed feedback laser can work normally, the length for increasing distributed feedback laser is needed, causes to be distributed Feedback laser is generally in elongate strip structure.
Fig. 4 to fig. 6 is please referred to, project structured light module 10 further includes fixing piece 18, and fixing piece 18 is for swashing edge emitting Light device 136 is fixed on board unit 11.When the first light-emitting surface 1322 of first laser transmitter 132 is towards collimating element 14 When, edge-emitting laser 136 is placed in vertical, since edge-emitting laser 136 is in elongate strip structure, edge-emitting laser 136 It is susceptible to and falls, shifts or shake etc. surprisingly, therefore edge-emitting laser 136 can be fixed by the way that fixing piece 18 is arranged Firmly, prevent edge-emitting laser 136 fall, shift or shake etc. it is unexpected.
Specifically, Fig. 4 and Fig. 5 are please referred to, in some embodiments, fixing piece 18 includes sealing 181, and sealing 181 is set It sets between edge-emitting laser 136 and board unit 11.More specifically, in the example as depicted in fig. 4, the first light-emitting surface 1322 opposite are bonded on board unit 11 on one side.In example as shown in Figure 5, the side of first laser transmitter 132 1324 can also be bonded on board unit 11, and sealing 181 wraps the side 1324 of surrounding, can also only bond side 1324 Some face and board unit 11 or bond certain several face and board unit 11.Further, sealing 181 can be heat conduction Glue conducts the heat that the work of first laser transmitter 132 generates into board unit 11.In order to improve radiating efficiency, base Heat emission hole 1111 can also be offered on plate 111, the heat that light source 13 or the work of circuit board 112 generate can be by heat emission hole 1111 It sheds, heat-conducting glue can also be filled in heat emission hole 1111, to further increase the heat dissipation performance of board unit 11.
Referring to Fig. 6, in some embodiments, fixing piece 18 includes at least two bullets being arranged on board unit 11 Property supporting rack 182, at least two supporting racks 182 are collectively formed receiving space 183, and receiving space 183 swashs for accommodating edge emitting Light device 136, at least two supporting racks 182 are used to support edge-emitting laser 136, to further prevent edge-emitting laser 136 shake.
Referring again to Fig. 2, collimating element 14 can be optical lens, collimating element 14 for collimate first laser and/or Second laser, collimating element 14 are housed in host cavity 121, and collimating element 14 can be directed toward the first face 124 along the second face 125 Direction is assembled into host cavity 121, and specifically, collimating element 14 includes faying face 143, when faying face 143 and the second confined planes When 1233 combination, it is believed that collimating element 14 is installed in place.Collimating element 14 includes optical section 141 and mounting portion 142, installation Portion 142 with lens barrel side wall 122 for being combined so that collimating element 14 is fixed in host cavity 121, in embodiments of the present invention, is tied Conjunction face 143 is an end face of mounting portion 142, and optical section 141 includes two curved surfaces positioned at 14 opposite both sides of collimating element.It is accurate One of straight element 14 curved surface stretched into unthreaded hole 1231.
Diffraction optical element 15 is mounted on limit protrusion 123, and specifically, diffraction optical element 15 includes mounting surface 151, Mounting surface 151 is combined with the first confined planes 1232 diffraction optical element 15 to be mounted on limit protrusion 123.Wherein mounting surface Some regions on 151 could be formed with diffraction structure, and diffraction structure can be corresponding with the position of unthreaded hole 1231 is crossed and will be through standard First laser and/or second laser diffraction after the straight collimation of element 14 go out laser pattern corresponding with diffraction structure (due to first Laser and second laser difference, cause first laser and second laser that can form different laser figures by identical diffraction structure Case), and other regions on mounting surface 151 can be plane and be combined with the first confined planes 1232.Diffraction optical element 15 It can be made of glass, can also be to be made of composite plastic (such as PET).
Please refer to Fig. 2 and Fig. 3, the direction of propagation and/or second laser of second optical module 19 for changing first laser The direction of propagation so that first laser and second laser propagate to collimating element 14.Specifically, where the first light-emitting surface 1322 The 1342 place plane intersection of plane and the second light-emitting surface, such as 1342 institute of 1322 place plane of the first light-emitting surface and the second light-emitting surface It is mutually perpendicular in plane, therefore, first laser and second laser may not all propagate to collimating element 14, at this time, it may be necessary to borrow The second optical module 19 is helped to change the direction of propagation of first laser and/or second laser, such as by the second optical module 19 Change the direction of propagation of second laser, so that first laser and second laser propagate to collimating element 14, so that First laser transmitter 132 and second laser transmitter 134 can share collimating element 14 and diffraction optical element 15.
Referring to Fig. 3, the second optical module 19 is prism 192, prism 192 includes transmission plane 1922 and reflecting surface 1924, First laser propagates to collimating element 14 after the transmission of transmission plane 1922, and second laser propagates to standard after the reflection of reflecting surface 1924 Straight element 14.In this way, first laser and second laser compare diffusion, launch by collimating element 14 and diffraction optical element 15 Larger range can be covered after going.
Referring to Fig. 7, in some embodiments, first laser transmitter 132 can be arranged on substrate 111 and accommodate In via 113, second laser transmitter 134 can be arranged on circuit board 112 and is electrically connected with circuit board 112.First swashs Optical transmitting set 132 can be vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL) 138, second laser transmitter 134 can be edge-emitting laser 136.The first of first laser transmitter 132 shines Face 1322 is towards collimating element 14, and the second light-emitting surface 1342 of second laser transmitter 134 is towards the second optical module 19.Vertically Cavity surface emitting lasers 138 are generally arranged in array so that first laser transmitter 132 is in the first light-emitting surface 1322 towards collimation When element 14, first laser transmitter 132 and the contact area of board unit 11 are larger, and first laser transmitter 132 can be more Easily fix.In addition, by the second light-emitting surface 1342 of second laser transmitter 134 towards the second optical module 19 when, can Second laser transmitter 134 to be horizontally arranged, second laser transmitter 134 also can be fixed relatively easily.Second optics Component 19 is prism 192, and prism 192 includes transmission plane 1922 and reflecting surface 1924, and first laser is after the transmission of transmission plane 1922 Collimating element 14 is propagated to, second laser propagates to collimating element 14 after the reflection of reflecting surface 1924.In this way, first laser and Dual-laser compares diffusion, and larger range can be covered after collimating element 14 and diffraction optical element 15 are launched.When So, in other embodiments, first laser device 132 can be edge-emitting laser 136, and second laser transmitter 134 can be with For 138 (not shown) of vertical cavity surface emitting laser, it is not specifically limited herein.
Referring to Fig. 8, in some embodiments, first laser transmitter 132 and second laser transmitter 134 can be equal It is arranged on substrate 111 and is housed in via 113.First laser device 132 and second laser 134 can be that edge emitting swashs Light device 136.Second optical module 19 is speculum 194, and first laser is propagated directly to collimating element 14, and second laser is through reflection Mirror 194 propagates to collimating element 14 after reflecting.In this way, first laser and second laser compare diffusion, by 14 He of collimating element Diffraction optical element 15 can cover larger range after launching, at this point, the same Fig. 2 of the fixed form of first laser device 132 Shown in embodiment (that is, being fixed on board unit by fixing piece 18), details are not described herein.Certainly, in other implementations In mode, first laser transmitter 132 can be arranged on substrate 111 and be housed in via 113, second laser transmitter 134 can be arranged on circuit board 112 and be electrically connected (not shown) with circuit board 112;Or, first laser transmitter 132 and Dual-laser transmitter 134 is arranged on circuit board 112 and is electrically connected (not shown) with circuit board 112.In addition, first laser is sent out Emitter 132 can be vertical cavity surface emitting laser 138, and second laser transmitter 134 can be (the figure of edge-emitting laser 136 Do not show);Or, first laser transmitter 132 can be edge-emitting laser 136, second laser transmitter 134 can be vertical cavity 138 (not shown) of surface-emitting laser, at this point, the fixed form of first laser transmitter 132 is with embodiment shown in Fig. 2, Details are not described herein.
Referring to Fig. 9, in some embodiments, first laser transmitter 132 can be arranged on substrate 111 and accommodate In via 113, second laser transmitter 134 can be arranged on circuit board 112 and is electrically connected with circuit board 112.First swashs Optical transmitting set 132 can be vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL) 138, second laser transmitter 134 can be edge-emitting laser 136.The first of first laser transmitter 132 shines Face 1322 is towards collimating element 14, and the second light-emitting surface 1342 of second laser transmitter 134 is towards the second optical module 19.Vertically Cavity surface emitting lasers 138 are generally arranged in array so that first laser transmitter 132 is in the first light-emitting surface 1322 towards collimation When element 14, first laser transmitter 132 and the contact area of board unit 11 are larger, and first laser transmitter 132 can be more Easily fix.In addition, by the second light-emitting surface 1342 of second laser transmitter 134 towards the second optical module 19 when, can Second laser transmitter 134 to be horizontally arranged, second laser transmitter 134 also can be fixed relatively easily.Second optics Component 19 is half-reflecting half mirror 196, and first laser propagates to collimating element 14, second laser after the transmission of half-reflecting half mirror 196 Collimating element 14 is propagated to after the reflection of half-reflecting half mirror 196.In this way, the central shaft of first laser and the central shaft of second laser Can be coaxial, project the pixel parallax of the two field pictures acquired after same object to reduce first laser and second laser.When So, in other embodiments, first laser device 132 can be edge-emitting laser 136, and second laser transmitter 134 can be with For 138 (not shown) of vertical cavity surface emitting laser, at this point, the fixed form of first laser transmitter 132 is the same as reality shown in Fig. 2 Mode is applied, details are not described herein;Or first laser device 132 and second laser 134 can be (the figure of edge-emitting laser 136 Do not show), similarly, the fixed form of first laser transmitter 132 is with embodiment shown in Fig. 2, and details are not described herein.
Please continue to refer to Fig. 2, in some embodiments, project structured light module 10 further includes protective cover 16, protective cover 16 are arranged on the first face 124.The one side opposite with mounting surface 151 of diffraction optical element 15 is contradicted with protective cover 16.Spreading out Protective cover 16 is installed after optical element 15 is penetrated on limit protrusion 123, so as to prevent diffraction optical element 15 from falling off. Protective cover 16 can be made of translucent material, for example, glass, polymethyl methacrylate (Polymethyl Methacrylate, PMMA), makrolon (Polycarbonate, PC), polyimides (Polyimide, PI) etc..Due to glass, PMMA, PC and The translucent materials such as PI all have excellent light transmission, and protective cover 16 can not have to open up loophole.In this way, protective cover 16 can While preventing diffraction optical element 15 from falling off, additionally it is possible to avoid diffraction optical element 15 exposed in the outside of lens barrel 12, from And it realizes to 15 water proof and dust proof of diffraction optical element.Certainly, in other embodiments, protective cover 16 can offer light transmission Hole, loophole are opposite with the optics effective district of diffraction optical element 15 to avoid blocking the light path of diffraction optical element 15.
In some embodiments, substrate 111 can save, first laser transmitter 132 and second laser transmitter 134 It can be directly anchored on circuit board 112 to reduce the integral thickness of laser projecting apparatus 10.
Referring again to Fig. 1, in some embodiments, Image Acquisition structure 100 further includes processor 30, and the first image is adopted Storage 22 is Laser video camera module.Processor 30 for control first laser transmitter 132 emit first laser and/or second swash Optical transmitting set 134, which emits second laser and controls the first image acquisition device 22, acquires the first laser formed according to first laser Pattern, the second laser pattern formed according to second laser, the third laser pattern formed according to first laser and second laser At least one of.Specifically, processor 30 controls 132 transmitting first laser of first laser transmitter and/or second laser hair Emitter 134 emits second laser, it can be understood as, processor 30 controls first laser transmitter 132 and emits first laser, or place It manages device 30 and controls that second laser transmitter 134 emits second laser or processor 30 controls first laser transmitter 132 and emits the One laser and 134 transmitting second laser of control second laser transmitter.In one embodiment, processor 30 can control first Laser emitter 132 emits first laser, can so control what the acquisition of the first image acquisition device 22 was formed according to first laser First laser pattern;Processor 30 can control second laser transmitter 134 and emit second laser, can so control the first figure As collector 22 acquires the second laser pattern formed according to second laser.In addition, processor 30 can control first laser hair Emitter 132 and second laser transmitter 134 alternately shine, and can so control the acquisition of the first image acquisition device 22 and swash according to first The first laser pattern that light is formed and the second laser pattern formed according to second laser.Processor 30 can also control first and swash Optical transmitting set 132 and second laser transmitter 134 shine simultaneously, can so control the acquisition of the first image acquisition device 22 according to the The third laser pattern that one laser and second laser are collectively formed.Processor 30 can handle first laser pattern to obtain first Depth image, processing second laser pattern is to obtain the second depth image, and processing third laser pattern is to obtain third depth map Picture.Third depth image has gathered the third laser pattern of first laser and second laser due to being derived from, as long as meeting the The incoherence of one laser and second laser is bigger, then the incoherence of third laser pattern is also stronger, by third depth image The depth accuracy of acquisition can higher.On the other hand, the light intensity or pattern shape of control first laser and second laser can be passed through Shape carries out the detection of different depth range to realize first laser pattern with second laser pattern, for example, the power of first laser Smaller and/or incoherence is relatively low, then first laser pattern can practical short distance depth detection;The power of second laser compared with Big and/or incoherence is higher, then second laser pattern can practical remote depth detection;Control the can so be passed through One laser emitter 132 shines or second laser transmitter 134 shines to meet the depth detection of different distance.
In some embodiments, the second image acquisition device 24 can be visible image capturing module or infrared photography module, Target light further includes the visible light and infrared light reflected through target, and processor 30 can be also used for the second image acquisition device of control The 4th image that 24 acquisition visible or infrared lights are formed.Wherein, when the second image acquisition device 24 is visible image capturing module, the 4th image of two image acquisition devices 24 acquisition is visible images, can since visible images include abundant color information It is regarded with the image (the first image, the second image or third image) acquired according to the first image acquisition device 22 and the formation of the 4th image Feel the preferable 3-D view of effect, and the 3-D view does not have parallax.When second image acquisition device 24 is infrared photography module, the 4th image of two image acquisition devices 24 acquisition is infrared image, can be with using the second image acquisition device 24 cooperation infrared light compensating lamp It realizes the efficient operation under half-light environment, and the functions such as iris recognition can also be carried out using the second image acquisition device 24.
Referring to Fig. 10, the electronic device 1000 of embodiment of the present invention includes the image of any one of the above embodiment Acquire structure 100 and shell 200.Electronic device 1000 can be mobile phone, tablet computer, laptop computer, game machine, head is aobvious sets Standby, access control system, automatic teller machine etc., this is not restricted.The setting of Image Acquisition structure 100 is in shell 200 and sudden and violent from shell 200 Reveal second laser pattern, the root can obtain the first laser pattern formed according to first laser, be formed according to second laser According to the third laser pattern that first laser and second laser are formed, shell 200 can be provided to Image Acquisition structure 100 it is dust-proof, The protections such as waterproof, shatter-resistant offer hole corresponding with Image Acquisition structure 100 on shell 200 so that light be pierced by from hole or Penetrate shell 200.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation The description of mode ", " example ", " specific example " or " some examples " etc. means the tool described in conjunction with the embodiment or example Body characteristics, structure, material or feature are contained at least one embodiment or example of the present invention.In the present specification, Schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific features of description, knot Structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
Any process described otherwise above or method description are construed as in flow chart or herein, and expression includes It is one or more for realizing specific logical function or process the step of executable instruction code module, segment or portion Point, and the range of the preferred embodiment of the present invention includes other realization, wherein can not press shown or discuss suitable Sequence, include according to involved function by it is basic simultaneously in the way of or in the opposite order, to execute function, this should be of the invention Embodiment person of ordinary skill in the field understood.
Expression or logic and/or step described otherwise above herein in flow charts, for example, being considered use In the order list for the executable instruction for realizing logic function, may be embodied in any computer-readable medium, for Instruction execution system, device or equipment (system of such as computer based system including processing module or other can be from instruction Execute system, device or equipment instruction fetch and the system that executes instruction) use, or combine these instruction execution systems, device or Equipment and use.For the purpose of this specification, " computer-readable medium " can be it is any can include, store, communicating, propagating or Transmission program uses for instruction execution system, device or equipment or in conjunction with these instruction execution systems, device or equipment Device.The more specific example (non-exhaustive list) of computer-readable medium includes following:With one or more wiring Electrical connection section (IPM current foldback circuits), portable computer diskette box (magnetic device), random access memory (RAM) are read-only to deposit Reservoir (ROM), erasable edit read-only storage (EPROM or flash memory), fiber device and portable optic disk are only Read memory (CDROM).In addition, computer-readable medium can even is that the paper that can print described program on it or other conjunctions Suitable medium, because can be for example by carrying out optical scanner to paper or other media, then into edlin, interpretation or when necessary It is handled with other suitable methods electronically to obtain described program, is then stored in computer storage.
It should be appreciated that each section of embodiments of the present invention can be with hardware, software, firmware or combination thereof come real It is existing.In the above-described embodiment, multiple steps or method can use storage in memory and by suitable instruction execution system The software or firmware of execution is realized.For example, if realized with hardware, in another embodiment, ability can be used Any one of following technology or their combination well known to domain are realized:With for realizing logic function to data-signal The discrete logic of logic gates, the application-specific integrated circuit with suitable combinational logic gate circuit, programmable gate array (PGA), field programmable gate array (FPGA) etc..
Those skilled in the art are appreciated that realize all or part of step that above-described embodiment method carries Suddenly it is that relevant hardware can be instructed to complete by program, the program can be stored in a kind of computer-readable storage medium In matter, which includes the steps that one or a combination set of embodiment of the method when being executed.
In addition, each functional unit in various embodiments of the present invention can be integrated in a processing module, also may be used To be that each unit physically exists alone, can also two or more units be integrated in a module.It is above-mentioned integrated The form that hardware had both may be used in module is realized, can also be realized in the form of software function module.The integrated module If being realized in the form of software function module and when sold or used as an independent product, a calculating can also be stored in In machine read/write memory medium.
Storage medium mentioned above can be read-only memory, disk or CD etc..
Although embodiments of the present invention have been shown and described above, it is to be understood that the above embodiment is Illustratively, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be right The above embodiment is changed, changes, replacing and modification.

Claims (15)

1. a kind of Image Acquisition structure, which is characterized in that including project structured light module, the first image acquisition device, the second image Collector, the first optical module and single acquisition window, from the target light of acquisition window incidence through first optics Described first image collector is propagated to after component transmission, from the target light of acquisition window incidence through described first Second image acquisition device is propagated to after optical module reflection;The project structured light module include first laser transmitter, Second laser transmitter, the second optical module, collimating element and diffraction optical element, the first laser transmitter is for emitting First laser, the second laser transmitter is for emitting second laser, the first laser transmitter and the second laser At least one of transmitter be edge-emitting laser, second optical module for changing the first laser propagation side To and/or the second laser the direction of propagation so that the first laser and the second laser propagate to collimation member Part, the collimating element are used for diffraction for collimating the first laser and/or the second laser, the diffraction optical element The first laser and/or the second laser, the target light after the collimating element collimation include by the diffraction After optical element diffraction and pass through the first laser and/or the second laser that target reflects to form.
2. Image Acquisition structure according to claim 1, which is characterized in that second optical module is prism, described Prism includes transmission plane and reflecting surface, and the first laser propagates to the collimating element after transmission plane transmission, described Second laser propagates to the collimating element after the reflective surface.
3. Image Acquisition structure according to claim 1, which is characterized in that second optical module is speculum, institute It states first laser and is propagated directly to the collimating element, the second laser propagates to the collimation after speculum reflection Element.
4. Image Acquisition structure according to claim 1, which is characterized in that second optical module is half-reflection and half-transmission Mirror, the first laser propagate to the collimating element after half-reflecting half mirror transmission, and the second laser is through described half The collimating element is propagated to after anti-pellicle mirror reflection.
5. Image Acquisition structure according to claim 1, which is characterized in that the light intensity of the first laser and described second The light intensity of laser is different;
Or, the pattern of the first laser is different from the pattern of the second laser.
6. Image Acquisition structure according to claim 1, which is characterized in that the project structured light module further includes substrate Component and lens barrel, the lens barrel are arranged on the board unit and host cavity, the base are collectively formed with the board unit Board group part includes the circuit board of substrate and carrying on the substrate, and the circuit board offers via, the first laser hair Emitter is carried on the substrate and is housed in the via, and the second laser transmitter is carried on the circuit board.
7. Image Acquisition structure according to claim 1, which is characterized in that the project structured light module further includes substrate Component and lens barrel, the lens barrel are arranged on the board unit and host cavity, the base are collectively formed with the board unit Board group part includes the circuit board of substrate and carrying on the substrate, and the circuit board offers via, the first laser hair Emitter and the second laser transmitter are housed in the via or are carried on the circuit board.
8. the Image Acquisition structure described according to claim 6 or 7, which is characterized in that the first laser transmitter is vertical Cavity surface emitting lasers, the second laser transmitter are edge-emitting laser, and the first of the first laser transmitter shines Facing towards the collimating element, the second light-emitting surface of the second laser transmitter is towards second optical module.
9. the Image Acquisition structure described according to claim 6 or 7, which is characterized in that the first laser transmitter is sent out for side Laser is penetrated, the second laser transmitter is vertical cavity surface emitting laser or edge-emitting laser, the first laser hair First light-emitting surface of emitter is towards the collimating element, and the second light-emitting surface of the second laser transmitter is towards second light Learn component.
10. Image Acquisition structure according to claim 9, which is characterized in that the project structured light module further includes base Board group part and fixing piece, the fixing piece are used to the first laser transmitter being fixed on the board unit.
11. Image Acquisition structure according to claim 10, which is characterized in that the fixing piece includes sealing, the envelope Glue is arranged between the first laser transmitter and the board unit, and the sealing is heat-conducting glue.
12. Image Acquisition structure according to claim 10, which is characterized in that the fixing piece includes being arranged in the base Receiving space, the receiving space is collectively formed at least two flexible supporting frames on board group part, at least two support frames as described above For accommodating the first laser transmitter, at least two support frames as described above are used to support residence and state first laser transmitter.
13. Image Acquisition structure according to claim 1, which is characterized in that it includes processor that described image, which acquires structure, The processor is used for:
It controls the first laser transmitter transmitting first laser and/or the control second laser transmitter transmitting second is sharp Light;With
Control described first image collector acquires the first laser pattern formed according to the first laser, according to described second In laser-formed second laser pattern, the third laser pattern formed according to the first laser and the second laser extremely Few one kind.
14. Image Acquisition structure according to claim 13, which is characterized in that second image acquisition device is visible light Camera module or infrared pick-up module, the target light includes the visible light and infrared light reflected through the target, described Processor is additionally operable to:
It controls second image acquisition device and acquires the 4th image that the visible light or the infrared light are formed.
15. a kind of electronic device, which is characterized in that including:
Shell;With
Image Acquisition structure described in claim 1-14, described image acquire structure installation on the housing and from the shell Body exposes.
CN201810290154.7A 2018-04-03 2018-04-03 Image Acquisition structure and electronic device Pending CN108664892A (en)

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Application publication date: 20181016