CN109462713A - A kind of ultrathin type image sensor module - Google Patents
A kind of ultrathin type image sensor module Download PDFInfo
- Publication number
- CN109462713A CN109462713A CN201811258500.XA CN201811258500A CN109462713A CN 109462713 A CN109462713 A CN 109462713A CN 201811258500 A CN201811258500 A CN 201811258500A CN 109462713 A CN109462713 A CN 109462713A
- Authority
- CN
- China
- Prior art keywords
- image sensor
- sensor body
- sensor module
- lens
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
- H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
- H04N1/02815—Means for illuminating the original, not specific to a particular type of pick-up head
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/04—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa
Abstract
The invention discloses a kind of ultrathin image sensor modules, including sensor body, right side, which is inlayed, in the sensor body is provided with lens, it is embedded on the left of the lens positioned at the sensor body and is provided with pedestal, mating clamping is provided with reflecting mirror on the pedestal, the reflecting mirror is connected and fixed on the base and is tilted to the left, and chassis left side insertion is located in the sensor body and is provided with light source, right side, which is inlayed, in the sensor body is provided with wafer.The present invention can be in the case of not influencing scanning quality, the integral thickness of image sensor is become smaller, be conducive to client in overall mechanism size design, thinner size can be designed, optimal space utilization rate can be reached, the image sensor thickness of this new-type invention and conventional art production reduces about 30~45%, under the substrate designed herein, can by complete machine be sized for it is more frivolous, to reach easy to carry, the powerful effect that does not take up space.
Description
Technical field
The present invention relates to a kind of influence sensor, specifically a kind of ultrathin type image sensor module.
Background technique
The existing general Technology design mode of contact image sensor is wafer to cylindrical lenses, and cylindrical lenses are another
The corresponding object to be scanned in side, because general contact image sensor lens design is that one to one fixed-focus mirror designs (Lo=Li).Therefore
It can only generally be designed under the thickness of 10.5~12mm with existing common lens.
Under theory of the design based on lightening design, existing image sensor imaging mode is redesigned, and is added
One reflection mirror surface treatment acrylic is read as the image for scanning object, to reach thinner with existing image sensor
A kind of design method realizes the smaller easily portable ideal of whole machine whereby.
Summary of the invention
The purpose of the present invention is to provide a kind of ultrathin image sensor modules, to solve to propose in above-mentioned background technique
The problem of.
To achieve the above object, the invention provides the following technical scheme:
Setting is inlayed on a kind of ultrathin type image sensor module, including sensor body, the interior right side of the sensor body
There are lens, is embedded on the left of the lens positioned at the sensor body and is provided with pedestal, mating clamping setting on the pedestal
There is reflecting mirror, the reflecting mirror is connected and fixed on the base and tilted to the left, is located in the sensor body described
Chassis left side insertion is provided with light source, and right side, which is inlayed, in the sensor body is provided with wafer.
As a further solution of the present invention: the lens are column structure, and the lens are horizontal positioned.
As a further solution of the present invention: the pedestal be opening be right angle " V " shape groove, the chassis side and
It is 35 °~55 ° that horizontal line, which is formed by angle,.
As a further solution of the present invention: the reflecting mirror is strip acrylic material, is done above the reflecting mirror
Reflecting layer processing is 95 ± 3% by reflecting layer treated the reflectance of reflector, and penetrance is 5 ± 3%.
As a further solution of the present invention: from left to right, the light source angle of departure is the source light outbound course
45°。
As a further solution of the present invention: the sensor body two sides, which are symmetrically embedded in, is provided with card hole slot, the card
Hole slot penetrates through the sensor body upper surface open.
As a further solution of the present invention: activity is equipped with upper cover in the sensor body, under the upper cover
Surface two sides and downside left end are provided with altogether at fixed selling sheet seven, the fixed selling sheet and the corresponding activity cooperation of the card hole slot,
It can also be closed and be connected and fixed by UV gluing between the fixed selling sheet and the card hole slot, inlayed and be provided in the middle part of the upper cover
Glass mirror, the glass mirror are located above the reflecting mirror.
As a further solution of the present invention: it has been placed in parallel above the sensor body and has scanned paper, it is described to scan
Paper at this time with access laid parallel composed by the lens and the wafer.
Compared with prior art, the beneficial effects of the present invention are: this new-type invention can be in the feelings for not influencing scanning quality
Under shape, the integral thickness of image sensor is become smaller, is conducive to client in overall mechanism size design, can design thinner
Size can reach optimal space utilization rate, and the image sensor thickness of this new-type invention and conventional art production is reduced about
30~45%, under the substrate designed herein, can complete machine be sized for more frivolous, to reach easy to carry, do not taken up space
Powerful effect.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of ultrathin image sensor module.
Fig. 2 is a kind of installation diagram of ultrathin image sensor module.
Fig. 3 is existing contact video sensor structure schematic diagram.
In figure: 1- scans paper, 2- sensor body, 21- lens, 22- pedestal, 23- reflecting mirror, 24- light source, 25- crystalline substance
Member, 26- card hole slot, 3- upper cover, the fixed selling sheet of 31-, 32- glass mirror.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig. 1~2, in the embodiment of the present invention, a kind of ultrathin type image sensor module, including sensor body 2,
Right side, which is inlayed, in the sensor body 2 is provided with lens 21, and the lens 21 are column structure, and 21 level of lens is put
It sets, is embedded on the left of the lens 21 positioned at the sensor body 2 and is provided with pedestal 22, the pedestal 22 is that opening is right angle
" V " shape groove, it is 35 °~55 ° that 22 side of pedestal and horizontal line, which are formed by angle, mating clamping on the pedestal 22
It is provided with reflecting mirror 23, the reflecting mirror 23 is strip acrylic material, and the reflecting mirror 23 does reflecting layer processing above,
It is 95 ± 3% by reflecting layer treated 23 reflectivity of reflecting mirror, penetrance is 5 ± 3%, and reflectivity is too low can shadow
The quality for arriving image is rung, penetrance is too high, will affect the calculating of focal length, and the reflecting mirror 23 blocks on the pedestal 22
It connects fixed and tilts to the left, and the reflecting mirror 23 is 35 °~55 ° in the angle that the pedestal 22 and horizontal plane are formed,
Design under reflecting mirror is reflected in a manner of 35~55 angles, can get optimum efficiency, the sensor under optical emulation
It is located at insertion on the left of the pedestal 22 in ontology 2 and is provided with light source 24, the 24 light outbound course of light source is from left to right, described
24 angle of departure of light source is 45 °, and in the design of light source, we use 45 degree of light source launch angle, because design can incite somebody to action thus
Light source, which is made into, completely to lie low on pedestal, and to reach lightening design, the interior right side of the sensor body 2, which is inlayed, is provided with crystalline substance
Member 25 is such as schemed, and image can be reflected through the lens 21 by the reflecting mirror 23, so that it is reflected into the wafer 25, it is described
2 two sides of sensor body, which are symmetrically embedded in, is provided with card hole slot 26, and the card hole slot 26 penetrates through 2 upper surface of sensor body and opens
It puts, activity is equipped with upper cover 3 in the sensor body 2, and the 3 lower surface two sides of upper cover and downside left end are provided with altogether
At fixed selling sheet 31 7, the fixed selling sheet 31 and the corresponding activity cooperation of the card hole slot 26, the fixed selling sheet 31 and described
It can also be closed and be connected and fixed by UV gluing between card hole slot 26, inlayed in the middle part of the upper cover 3 and be provided with glass mirror 32, the glass
Glass mirror 32 is located at 23 top of reflecting mirror, has been placed in parallel above the sensor body 2 and has scanned paper 1, described to scan paper
1 at this time with access laid parallel composed by the lens 21 and the wafer 25.
If Fig. 3 shows, the existing general Technology design mode of contact image sensor is wafer to cylindrical lenses, column
The corresponding object to be scanned in lens another side, because general contact image sensor lens design is that one to one fixed-focus mirror designs (Lo
=Li), therefore can only generally be designed under the thickness of 10.5~12mm with existing common lens, relative to setting in the application
Meter, it is obviously desirable to shell mechanism it is bigger, more occupied space.
The standardized element that the present invention uses can commercially, and shaped piece is according to specification and attached drawing note
Load can carry out customized, and the specific connection type of each part is all made of in the prior art mature bolt, rivet, welding etc.
Conventional means, mechanical, part and equipment are all made of in the prior art, conventional model, in addition circuit connection uses the prior art
Middle conventional connection type, this will not be detailed here.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (8)
1. a kind of ultrathin type image sensor module, including sensor body (2), which is characterized in that the sensor body (2)
Interior right side, which is inlayed, to be provided with lens (21), is embedded on the left of the lens (21) positioned at the sensor body (2) and is provided with bottom
Seat (22), mating clamping is provided with reflecting mirror (23) on the pedestal (22), and the reflecting mirror (23) is on the pedestal (22)
It connects and fixes and tilts to the left, insertion on the left of the pedestal (22) is located in the sensor body (2) and is provided with light source
(24), the interior right side of the sensor body (2), which is inlayed, is provided with wafer (25).
2. a kind of ultrathin image sensor module according to claim 1, which is characterized in that the lens (21) are column
Shape structure, the lens (21) are horizontal positioned.
3. a kind of ultrathin image sensor module according to claim 1, which is characterized in that the pedestal (22) is to open
Mouth is the " V " shape groove at right angle, and it is 35 °~55 ° that pedestal (22) side and horizontal line, which are formed by angle,.
4. a kind of ultrathin image sensor module according to claim 1, which is characterized in that the reflecting mirror (23) is
Strip acrylic material, the reflecting mirror (23) do reflecting layer processing above, and by reflecting layer, that treated is described anti-
Penetrating mirror (23) reflectivity is 95 ± 3%, and penetrance is 5 ± 3%.
5. a kind of ultrathin image sensor module according to claim 1, which is characterized in that light source (24) light
From left to right, light source (24) angle of departure is 45 ° to outbound course.
6. any ultrathin image sensor module according to claims 1 to 5, which is characterized in that the sensing
Device ontology (2) two sides, which are symmetrically embedded in, to be provided with card hole slot (26), and the card hole slot (26) penetrates through table on the sensor body (2)
Face is open.
7. a kind of ultrathin image sensor module according to claim 6, which is characterized in that the sensor body
(2) activity is equipped with upper cover (3) on, and upper cover (3) the lower surface two sides and downside left end are provided with fixed selling sheet altogether
At (31) seven, the corresponding activity cooperation of the fixed selling sheet (31) and the card hole slot (26), the fixed selling sheet (31) and described
It can also be closed and be connected and fixed by UV gluing between card hole slot (26), inlayed in the middle part of the upper cover (3) and be provided with glass mirror (32),
The glass mirror (32) is located above the reflecting mirror (23).
8. a kind of ultrathin image sensor module according to claim 1, which is characterized in that the sensor body
(2) top has been placed in parallel and has scanned paper (1), it is described scan paper (1) at this time with the lens (21) and the wafer
(25) access laid parallel composed by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811258500.XA CN109462713A (en) | 2018-10-26 | 2018-10-26 | A kind of ultrathin type image sensor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811258500.XA CN109462713A (en) | 2018-10-26 | 2018-10-26 | A kind of ultrathin type image sensor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109462713A true CN109462713A (en) | 2019-03-12 |
Family
ID=65608559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811258500.XA Pending CN109462713A (en) | 2018-10-26 | 2018-10-26 | A kind of ultrathin type image sensor module |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1331457A (en) * | 2000-07-03 | 2002-01-16 | 明碁电脑股份有限公司 | Image scanner |
| CN2636273Y (en) * | 2003-07-22 | 2004-08-25 | 力捷电脑股份有限公司 | Optics scanning module |
| CN101002164A (en) * | 2004-07-29 | 2007-07-18 | 顶点科技有限公司 | Optical pointing apparatus and personal portable device having the optical pointing apparatus |
| CN101223491A (en) * | 2005-07-14 | 2008-07-16 | 顶点科技有限公司 | Ultra thin optical pointing device and personal portable device having the same |
| CN201585031U (en) * | 2009-10-30 | 2010-09-15 | 王心路 | Novel touch type image sensor |
| CN201828885U (en) * | 2010-01-08 | 2011-05-11 | 埃派克森微电子(上海)有限公司 | Thin-type optical indicating device |
| CN102980105A (en) * | 2012-12-04 | 2013-03-20 | 京东方科技集团股份有限公司 | Backlight module and display device |
| CN107819910A (en) * | 2017-12-06 | 2018-03-20 | 广东欧珀移动通信有限公司 | Cover plate assembly, display panel and electronic equipment |
| CN108614363A (en) * | 2018-04-10 | 2018-10-02 | Oppo广东移动通信有限公司 | Laser projection module, camera assembly and terminal |
-
2018
- 2018-10-26 CN CN201811258500.XA patent/CN109462713A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1331457A (en) * | 2000-07-03 | 2002-01-16 | 明碁电脑股份有限公司 | Image scanner |
| CN2636273Y (en) * | 2003-07-22 | 2004-08-25 | 力捷电脑股份有限公司 | Optics scanning module |
| CN101002164A (en) * | 2004-07-29 | 2007-07-18 | 顶点科技有限公司 | Optical pointing apparatus and personal portable device having the optical pointing apparatus |
| CN101223491A (en) * | 2005-07-14 | 2008-07-16 | 顶点科技有限公司 | Ultra thin optical pointing device and personal portable device having the same |
| CN201585031U (en) * | 2009-10-30 | 2010-09-15 | 王心路 | Novel touch type image sensor |
| CN201828885U (en) * | 2010-01-08 | 2011-05-11 | 埃派克森微电子(上海)有限公司 | Thin-type optical indicating device |
| CN102980105A (en) * | 2012-12-04 | 2013-03-20 | 京东方科技集团股份有限公司 | Backlight module and display device |
| CN107819910A (en) * | 2017-12-06 | 2018-03-20 | 广东欧珀移动通信有限公司 | Cover plate assembly, display panel and electronic equipment |
| CN108614363A (en) * | 2018-04-10 | 2018-10-02 | Oppo广东移动通信有限公司 | Laser projection module, camera assembly and terminal |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190312 |