CN206877030U - Light-emitting device and its laser projection module - Google Patents
Light-emitting device and its laser projection module Download PDFInfo
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- CN206877030U CN206877030U CN201720819823.6U CN201720819823U CN206877030U CN 206877030 U CN206877030 U CN 206877030U CN 201720819823 U CN201720819823 U CN 201720819823U CN 206877030 U CN206877030 U CN 206877030U
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Abstract
The utility model proposes a kind of laser projection module, it is made up of light-emitting device and optics.Light-emitting device includes：Light source, for launching light beam；Base, it is connected with light source, for supporting the radiating of the light source and realization to the light source；Circuit board, for controlling light source luminescent, the circuit board is provided with through hole, and the base is placed in the through hole；Support member, it is connected with the base and the circuit board, for fixing the base and the circuit board.Optics, including：Lens, for receiving and collimating the light beam；Diffraction optical element, for the light beam to be formed into fixed beam pattern after expanding and outwards launched；Lens barrel, it is connected for fixing the lens and the diffraction optical element, and with the light-emitting device.The utility model proposes laser projection module there is high radiating, high stability, specifically accumulate small can be integrated into miniature computing device.
Description
Technical field
Electronics and optical component manufacturing field are the utility model is related to, more particularly to a kind of light-emitting device and its laser are thrown
Shadow module.
Background technology
The depth information that depth camera can obtain target realizes 3D scannings, scene modeling, gesture interaction whereby, and current
The RGB camera being widely used is compared, and depth camera is just progressively paid attention to by all trades and professions.Such as utilize depth camera and electricity
Somatic sensation television game can be realized to reach the two-in-one effect of game and body-building depending on combinations such as, computers.In addition, the tango projects of Google
It is directed to bringing depth camera into mobile device, such as flat board, mobile phone, brings the usage experience overturned completely with this, such as can be with
Very real AR game experiencings are realized, it can be used to carry out the functions such as indoor map establishment, navigation.
Core component in depth camera is laser projection module, and with the continuous extension of application, laser projection module will
Constantly evolved on to less and less volume and higher and higher performance.Usually, laser projection module group is by circuit board, light
The part composition such as source and optics, the vertical cavity surface emitting laser of wafer current level size（VCSEL）Array light source makes
The volume of laser projection module can be reduced to and be embedded in the small electronic equipments such as mobile phone.Usually, VSCEL is made
On a semiconductor substrate, and by Semiconductor substrate and flexible PCB（FPC）It is attached, in order to solve heat dissipation problem, may be used also
To introduce semiconductor cooler（TEC）.TEC can be very good to be controlled light source heating, but because the power consumption of itself is higher,
And take larger volume so that the volume and power consumption of the laser projection module of this form are still undesirable.
Except the laser projection die set in depth camera, in the field that other chips are combined with circuit board, also together
Sample is faced with the problem of volume is with radiating.
Utility model content
The purpose of this utility model is to solve volume when prior art chips are combined with circuit board and radiating
Problem, a kind of light-emitting device and its laser projection module is proposed, the problem of volume, stability are with radiating can be taken into account simultaneously.
The utility model provides a kind of light-emitting device, including：Light source, for launching light beam, the light source is arranged on described
In the groove of base；Base, for supporting the radiating of the light source and realization to the light source；Circuit board, for controlling light
Source is lighted, and the circuit board is provided with through hole, and the base is placed in the through hole；Support member, with the base and described
Circuit board connects, for fixing the base and the circuit board.
In some embodiments, the base includes ceramic bases.
In some embodiments, the support member is located at the same side of the base with the light source.
In some embodiments, the support member includes ceramic bases, and the ceramic bases are provided with through hole, to cause
Circuit board is stated to electrically connect with the light source.
In some embodiments, the light source includes VCSEL array light source, and the VCSEL array light source includes partly leading
Body substrate and VCSEL light source, the VCSEL light source are arranged on the semiconductor base with irregular pattern.
In some embodiments, the circuit board includes flexible PCB, printed circuit board and rigid-flexible circuit
One kind of plate or combination.
The utility model also provides a kind of laser projection module, including light-emitting device as described above, for launching light beam；
Optics, including：Lens, for receiving and collimating the light beam；Diffraction optical element, for by the light beam after expanding
Form fixed beam pattern and outwards launch；Lens barrel, for fixing the lens and the diffraction optical element, and with it is described
Light-emitting device connects.
In some embodiments, the lens include microlens array.
Compared with prior art, the beneficial effects of the utility model have：
The utility model provides light-emitting device, come fixed chip and is provided scattered by the base with support and heat sinking function
Heat, while the base is put into the circuit board for be provided with through hole to reduce device thickness, on the other hand, in order to improve stability
Support member is connected with base and circuit board, support member is provided with through hole and causes light beam by so can fully reduce device
Overall volume, while chip directly contacts connection with thermal component, and thermal component plays a part of supporting chip simultaneously, ensures
There is provided to chip and radiate to greatest extent.Compared with prior art, light-emitting device of the present utility model has high heat conduction, Gao Wen
The advantage of fixed, high reliability and small volume, so as to be integrated into miniature computing device.
Brief description of the drawings
Fig. 1 is the side view of the depth camera system in one embodiment of the utility model.
Fig. 2 is the side view of the laser projection module in one embodiment of the utility model.
Fig. 3 is the structural representation of the vertical cavity surface generating laser in one embodiment of the utility model.
Fig. 4 is the VCSEL chip front views in one embodiment of the utility model.
Embodiment
In order that the utility model embodiment technical problem to be solved, technical scheme and beneficial effect are more clear bright
In vain, below in conjunction with drawings and Examples, the utility model is further elaborated.It is it should be appreciated that described herein
Specific embodiment only to explain the utility model, is not used to limit the utility model.
It should be noted that when element is referred to as " being fixed on ", " being arranged at " or " being installed on " another element, it can be with
Directly on another element or it is connected on another element.When an element is known as " being connected to " another yuan
Part, it can be directly to another element or be indirectly connected on another element.In addition, connection can be used
Can also be used to circuit communication act in fixation.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System, it is for only for ease of description the utility model embodiment and simplifies description, rather than instruction or the device or member that imply meaning
Part must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.
The utility model proposes the laser projection device of a kind of perfect heat-dissipating and small volume.Will in explanation below
Illustrated by taking the projection arrangement of depth camera as an example, but be not meant to that this scheme is only capable of applying in depth camera, appointed
It is every what in his device to be directly or indirectly intended to be included in using the program in the scope of protection of the utility model.
The depth camera side schematic view based on structure light shown in Fig. 1.10 main building block of depth camera has laser
Module 13, collection module 14, mainboard 12 and processor 11 are projected, RGB camera 16 is further provided with some depth cameras.Swash
Light projection module 13, collection module 14 and RGB camera 16 are generally mounted in same depth camera plane, and in same
One baseline, each module or camera correspond to a light portal 17.Usually, processor 11 is integrated on mainboard 12,
And laser projection module 13 is connected with collection module 14 by interface 15 with mainboard, described interface is in one embodiment
FPC interfaces.Wherein, laser projection module is used to project encoded structured light patterns into object space, collection module collection
By the processing of processor so as to obtaining the depth image of object space after to the structure light image.In one embodiment, tie
Structure light image is infrared speckle pattern, and pattern is relatively uniform with distribution of particles but with very high local irrelevance, here
Local irrelevance refer to that each sub-regions all have higher uniqueness in pattern.Corresponding collection module 14 is corresponding
Infrared camera.
Based on time flight method principle（TOF）The chief component of depth camera be also laser projection module and collection
Module, it projects module and is used to launch the light pulse clocked unlike the depth camera of structure light principle, and collection module is adopted
The flight time of light in space is can be obtained by after collecting the light pulse, recycles processor to calculate corresponding spatial point
Distance.
Depth camera single at present is mostly as independent peripheral hardware, passes through the data-interfaces such as USB because volume is larger
It is connected with other equipment such as computer, mobile phone etc., and the information transfer such as depth obtained is carried out further to other equipment
Processing.It is more and more extensive with the application of depth camera, depth camera and other equipment are integrated, integrates and would is that future
Developing direction.Mainboard, processor and computer cell phone of depth camera etc. can be set at the integrated aspect of mainboard and processor
Standby mainboard, processor are integrated；The integrated aspect of module and laser projection module is being gathered, at present the large scale equipment such as computer
There is the scheme of correlation, but could meet to require for the micromodule equipments such as mobile phone, the laser projection module of only small volume, separately
Outside because the power consumption of laser projection is larger, heating is more, therefore possess higher thermal diffusivity and be also highly desirable.The utility model
Emphasis will be propose it is a kind of possess the laser projection module and its light-emitting device of high-cooling property and small size, but be not limited to
Depth camera.Next laser projection module is described in detail according to embodiment scheme of the present utility model.
Fig. 2 is the schematic diagram according to the laser projection module of the utility model embodiment.Laser projection module 13 includes hair
Electro-optical device forms with optics, and wherein light-emitting device is by 134 groups of support member 131, base 133, circuit board 132 and light source
Into optics is by lens barrel 137, lens 135 and diffraction optical element（DOE）136 compositions.Optics and light-emitting device it
Between be to be connected by lens barrel 137 with support member 131.The light beam that light source 134 in light-emitting device is sent is collimated or converged through lens 135
Afterwards from launching fixed beam pattern into space after DOE136 beam splitting, usually lens 135 are located at light source 134 and diffraction
Between optical element 136, typically, the distance between lens 135 and light source 134 are approximately equal to the focal length of lens.Lens 135
It can be microlens array.Lens 135 and DOE136 can also be integrated into an optical element, microscope base in other embodiments
Upper and lower microscope base is segmented into order to install or debug.The one side of base 133 requires enough hardness to support light source,
On the other hand higher thermal diffusivity is also needed to.Support member 131 need also exist for enough hardness support optics and
Connect base 133 and circuit board 132.
The volume of laser projection module influences the size of entire depth camera, and wherein the size of light-emitting device is then to influence
An important factor for laser projection modular volume.For light-emitting device, wherein in the selection of light source, vertical cavity surface generating laser
(VCSEL) possessing the advantages that small volume, the light source angle of departure are small, stability is good can be used as projecting the light source of module to reduce
Overall volume.Next first VCSEL and its array chip are illustrated, secondly light-emitting device are illustrated.
Fig. 3 is the vcsel structure schematic diagram in one embodiment of the utility model.In figure 3,301 be single
VCSEL, usually, VCSEL active layer 305 is in centre, and what is be connected with active layer is limiting layer 306, and the effect of limiting layer is
For controlling light field and electric current to realize the control to laser shape etc., there be the reflection of the semiconductor of p-type and N-type at active layer both ends
Mirror 304 and 307, the opposite side of speculum 307 is top electrodes 308（P poles, positive pole）, the side of speculum 304 is partly to lead respectively
Body substrate 303 and bottom electrode 302（N poles, negative pole）.
Fig. 4 is the VCSEL chip front views in one embodiment of the utility model.When the power of single VCSEL light source
During etc. not reaching application requirement, by the way that multiple VCSEL403 are arranged in same Semiconductor substrate 402 in an array manner
Light source power can be improved, manufacturing multiple VCSEL light sources simultaneously in same Semiconductor substrate in addition can also greatly improve
Manufacture efficiency.VCSEL array chip 401 can reach the yardstick of wafer scale at present, you can with 1mm2Chip on be arranged to
Hundred thousands of individual VCSEL light sources.Control to light source can have a different patterns, and all VCSEL light sources are synchronously controlled on chip
System opening and closing, or, the VCSEL on chip is controlled to produce different illumination density by independent or packet.In some realities
Apply in example, using the first pattern, i.e., all VCSEL light sources are in synchronized control opening and closed on chip.In other realities
Apply in example, second of pattern can be used, i.e., the VCSEL on chip is close to produce different illumination by independent or packet control
Degree.
VCSEL403 form and arrangement can have according to specific application demand it is a variety of, such as be uniformly regularly arranged or
Person carries out irregular alignment with certain uncorrelated pattern.Single VCSEL shape, area can also differ.Formal
Randomization can bring the reduction of manufacture efficiency.In certain embodiments, VCSEL403 is uniformly regularly arranged serves as a contrast in semiconductor
On bottom 402, in further embodiments, according to specific application demand, VCSEL403 is irregular with certain uncorrelated pattern
It is arranged in Semiconductor substrate 402.
In certain embodiments, VCSEL chips can also be packaged by special purposes, similar to CPU of computer etc.
Chip, both positive and negative polarity is connected by being connected to pin in the same side with the external world.It is real for depth camera described in the utility model
For applying example, due to requiring small volume, thus preferably processing mode is directly by unencapsulated VCSEL semiconductor slice chips
It is placed on base 131.Usually, the bottom cathode connection of chip, the connection of top positive pole.It will be cut in the following description with VCSEL
Illustrated exemplified by piece chip, it will be appreciated that encapsulation chip is also contained in the scope of protection of the utility model.
Chip has been required for carrying and bindiny mechanism, to ensure the normal function of chip.Such as its promising independence of computer CPU
The bite type connection of design and fixed mechanism；For the little special chip of some caloric values, it can directly pass through pin and mainboard
It is joined directly together；And for chip described in the utility model, typically there is higher caloric value, and need firm consolidate
Determine device.VCSEL array chip due to be for launching light beam, it is necessary to larger power, caloric value is larger, further need exist for by
It is integrated into the micromodule equipment of small volume, heat dissipation problem needs to solve；On the other hand, for depth camera, laser is thrown
The relative position requirement of shadow module is very firm, to ensure to have stabilization, accurate depth image to export.Therefore, VCSEL array core
The carrying of piece and bindiny mechanism require both to possess small volume in order to integrated, need preferable heat dispersion and steady again
Solid connection.
Fig. 2, light-emitting device of the present utility model, including base 133 are returned to, for supporting chip 134 and providing radiating
Function；Circuit board 132, worked for control chip 134；Support member 131, it is connected with base 133 and circuit board 132.Wherein
Base 133 and support member 131 can be that metal material can also be other materials, and typically, base 133 is ceramic material, pottery
Ceramic material has excellent thermal diffusivity and hardness.In order to reduce the thickness of light-emitting device, the thickness of ceramic material is controlled in
It is 0.1mm ~ 10mm in less scope, because base 133 is single piece of material, therefore when making can be easier to produce thin
Ceramic base.Circuit board 132 is provided with through hole, and base 133 is mounted in through-holes.Typically, the through hole of circuit board 132 and bottom
The size of seat 133 is identical, and the end of circuit board 132 also has the port 138 electrically connected with outside realization, such as USB, MINI
The interfaces such as USB, MIPI.Further, since the thickness of base 133 is small, its support performance is relatively low, therefore, its with circuit board 132
One piece of support member 131 is connected, through hole is provided with support member and is used for so that the light beam that light source 134 is sent passes through.Thus, light-emitting device
It is small while there is stronger support performance to realize thickness.Support member 131 can be placed in the base with the same side of light source 134
On surface, another side can also be placed on, unlike, it is placed on will not impact laser projection mould during 134 the same side of light source
The integral thickness of group（Usually, the distance between lens 135 and light source 134 are fixed value）, and be placed on and 134 different tables of light source
The integral thickness of laser projection module will be increased during face.
In light-emitting device, the control of chip 134 is performed by circuit board 132, due to not having between circuit board 132 and chip 134
It is directly connected to, therefore generally requires the opened hole on base 133 or support member 131 and connected with realizing.In one embodiment,
Because chip 134 is unencapsulated nude film, therefore its bottom is an electrode, therefore when base 133 is conductive material, 134 electricity
Extremely directly it is connected with conductive material, then circuit board 132 is electrically connected to the connection for realizing the also electrode with base 133；And for
The connection of 134 another electrode of chip can be then opened up after through hole on support member 131 by the chip electrode and circuit board electrical connection.
In one embodiment, base 133 is nonconducting ceramic material, can now be injected in its surface or through hole
The conductive material such as material such as silver, copper, gold, allow its high heat conduction with ceramics, high stable, high reliability while also with leading
Electrically.
Circuit board 132 can be printed circuit board（PCB）, flexible PCB (FPC) or the two be combined into it is soft or hard
Board.When base 131 has enough hardness and stability, typically, circuit board 132 can be FPC, one side FPC
Thickness it is small, another aspect FPC connections and installation it is more convenient.
For the laser module shown in Fig. 2 during fabrication, light-emitting device can be carried out synchronously with optics.For luminous
Device, base 133, support member 131 are connected with circuit board 132, secondly light source 134 are connected on base 133, finally by light
Device is learned to be installed on support member 131.
Above content is to combine specific preferred embodiment further detailed description of the utility model, it is impossible to
Assert that specific implementation of the present utility model is confined to these explanations.For the utility model person of ordinary skill in the field
For, without departing from the concept of the premise utility, some equivalent substitutes or obvious modification, and performance can also be made
Or purposes is identical, the protection domain of technical solutions of the utility model should be all considered as belonging to.
Claims (10)
- A kind of 1. light-emitting device, it is characterised in that including：Light source, for launching light beam；Base, it is connected with light source, for supporting the radiating of the light source and realization to the light source；Circuit board, for controlling light source luminescent, the circuit board is provided with through hole, and the base is placed in the through hole；Support member, it is connected with the base and the circuit board, for fixing the base and the circuit board.
- 2. light-emitting device according to claim 1, it is characterised in that the base includes ceramic bases.
- 3. light-emitting device according to claim 1, it is characterised in that the support member is located at the base with the light source The same side.
- 4. light-emitting device according to claim 1, it is characterised in that the support member includes ceramic bases.
- 5. light-emitting device according to claim 4, it is characterised in that the ceramic bases are provided with through hole, described to cause Circuit board electrically connects with the light source.
- 6. light-emitting device according to claim 1, it is characterised in that the light source includes VCSEL array light source.
- 7. light-emitting device according to claim 6, it is characterised in that the VCSEL array light source includes semiconductor base And VCSEL light source, the VCSEL light source are arranged on the semiconductor base with irregular pattern.
- 8. light-emitting device according to claim 1, it is characterised in that the circuit board includes flexible PCB, printing electricity One kind or combination of road plate and rigid-flexible circuit board.
- A kind of 9. laser projection module, it is characterised in that including：Light-emitting device as described in claim 1 ~ 8, for launching light beam；Optics, including：Lens, for receiving and collimating the light beam；Diffraction optical element, for the light beam to be formed into fixed beam pattern after expanding and outwards launched；Lens barrel, it is connected for fixing the lens and the diffraction optical element, and with the light-emitting device.
- 10. laser projection module according to claim 9, it is characterised in that the lens include microlens array.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201720819823.6U CN206877030U (en) | 2017-07-07 | 2017-07-07 | Light-emitting device and its laser projection module |
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| CN201720819823.6U CN206877030U (en) | 2017-07-07 | 2017-07-07 | Light-emitting device and its laser projection module |
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| CN108333859A (en) * | 2018-02-08 | 2018-07-27 | 宁波舜宇光电信息有限公司 | Project structured light device, depth camera are with the depth image imaging method based on depth camera |
| CN108387365A (en) * | 2018-02-27 | 2018-08-10 | 广东欧珀移动通信有限公司 | The laser projection module and its detection method of damage, depth camera and electronic device |
| CN108490572A (en) * | 2018-03-12 | 2018-09-04 | 广东欧珀移动通信有限公司 | Laser projection module, depth camera and electronic device |
| CN108614363A (en) * | 2018-04-10 | 2018-10-02 | Oppo广东移动通信有限公司 | Laser projection module, camera assembly and terminal |
| CN108702218A (en) * | 2018-05-09 | 2018-10-23 | 深圳阜时科技有限公司 | A kind of light source module group, image acquiring device, identity recognition device and electronic equipment |
| CN109143756A (en) * | 2018-09-08 | 2019-01-04 | 深圳阜时科技有限公司 | A kind of optical module, optical projection mould group, sensing device and equipment |
| CN109643052A (en) * | 2018-11-24 | 2019-04-16 | 深圳阜时科技有限公司 | A kind of light-source structure, optical projection mould group, sensing device and equipment |
| CN109683440A (en) * | 2018-12-13 | 2019-04-26 | 深圳阜时科技有限公司 | Optical projection mould group, sensing device, equipment and optical projection module group assembling method |
| CN109683439A (en) * | 2018-12-13 | 2019-04-26 | 深圳阜时科技有限公司 | Optical projection mould group, sensing device, equipment and optical projection module group assembling method |
| CN110275371A (en) * | 2018-03-18 | 2019-09-24 | 宁波舜宇光电信息有限公司 | Projection arrangement and its manufacturing method and depth information device |
| WO2019196525A1 (en) * | 2018-04-10 | 2019-10-17 | Oppo广东移动通信有限公司 | Laser projection structure and electronic device |
| TWI685678B (en) * | 2018-03-12 | 2020-02-21 | 大陸商Ｏｐｐｏ廣東移動通信有限公司 | Laser projection module , depth camera and electronic device |
| CN111146690A (en) * | 2020-01-06 | 2020-05-12 | 常州纵慧芯光半导体科技有限公司 | Laser module and preparation method thereof |
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| US11307431B2 (en) | 2018-02-27 | 2022-04-19 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Laser projection modules and methods for detecting fracture thereof, depth cameras and electronic devices |
| US11441895B2 (en) | 2018-03-12 | 2022-09-13 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Control method, depth camera and electronic device |
| US11563930B2 (en) | 2018-03-12 | 2023-01-24 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Laser projection component, detection method thereof, and electronic device |
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| CN108333859A (en) * | 2018-02-08 | 2018-07-27 | 宁波舜宇光电信息有限公司 | Project structured light device, depth camera are with the depth image imaging method based on depth camera |
| CN108333859B (en) * | 2018-02-08 | 2024-03-12 | 宁波舜宇光电信息有限公司 | Structured light projection device and depth camera for depth image imaging method based on depth camera |
| CN108387365A (en) * | 2018-02-27 | 2018-08-10 | 广东欧珀移动通信有限公司 | The laser projection module and its detection method of damage, depth camera and electronic device |
| US11307431B2 (en) | 2018-02-27 | 2022-04-19 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Laser projection modules and methods for detecting fracture thereof, depth cameras and electronic devices |
| CN108387365B (en) * | 2018-02-27 | 2020-09-11 | Oppo广东移动通信有限公司 | Laser projection module, damage detection method thereof, depth camera and electronic device |
| US11441895B2 (en) | 2018-03-12 | 2022-09-13 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Control method, depth camera and electronic device |
| US11563930B2 (en) | 2018-03-12 | 2023-01-24 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Laser projection component, detection method thereof, and electronic device |
| TWI685678B (en) * | 2018-03-12 | 2020-02-21 | 大陸商Ｏｐｐｏ廣東移動通信有限公司 | Laser projection module , depth camera and electronic device |
| CN108490572A (en) * | 2018-03-12 | 2018-09-04 | 广东欧珀移动通信有限公司 | Laser projection module, depth camera and electronic device |
| US11082671B2 (en) | 2018-03-12 | 2021-08-03 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Laser projection module, depth camera and electronic device |
| US11199398B2 (en) | 2018-03-12 | 2021-12-14 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Laser projection module, depth camera and electronic device |
| CN110275371A (en) * | 2018-03-18 | 2019-09-24 | 宁波舜宇光电信息有限公司 | Projection arrangement and its manufacturing method and depth information device |
| WO2019196525A1 (en) * | 2018-04-10 | 2019-10-17 | Oppo广东移动通信有限公司 | Laser projection structure and electronic device |
| US11163225B2 (en) | 2018-04-10 | 2021-11-02 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Laser projection structure and electronic device |
| CN108614363A (en) * | 2018-04-10 | 2018-10-02 | Oppo广东移动通信有限公司 | Laser projection module, camera assembly and terminal |
| CN108702218A (en) * | 2018-05-09 | 2018-10-23 | 深圳阜时科技有限公司 | A kind of light source module group, image acquiring device, identity recognition device and electronic equipment |
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| CN109683439A (en) * | 2018-12-13 | 2019-04-26 | 深圳阜时科技有限公司 | Optical projection mould group, sensing device, equipment and optical projection module group assembling method |
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| CN109683439B (en) * | 2018-12-13 | 2024-03-29 | 深圳阜时科技有限公司 | Optical projection module, sensing device, equipment and optical projection module assembling method |
| CN109683440B (en) * | 2018-12-13 | 2024-03-29 | 深圳阜时科技有限公司 | Optical projection module, sensing device, equipment and optical projection module assembling method |
| CN111146690B (en) * | 2020-01-06 | 2021-09-07 | 常州纵慧芯光半导体科技有限公司 | Laser module and preparation method thereof |
| CN111146690A (en) * | 2020-01-06 | 2020-05-12 | 常州纵慧芯光半导体科技有限公司 | Laser module and preparation method thereof |
| CN111830521A (en) * | 2020-07-31 | 2020-10-27 | 帷幄匠心科技（杭州）有限公司 | Laser induction strip and induction method |
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