CN208351232U

CN208351232U - Projection arrangement and depth information device

Info

Publication number: CN208351232U
Application number: CN201820718380.6U
Authority: CN
Inventors: 陈飞帆; 戎琦; 戚杨迪; 戴蓓蓓; 曾俊杰; 潘民杰
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2018-03-18
Filing date: 2018-05-15
Publication date: 2019-01-08
Anticipated expiration: 2028-05-15
Also published as: CN110275371A; CN208569282U

Abstract

The utility model discloses a projection arrangement and depth information devices.The projection arrangement includes a luminescence component and a lens subassembly.The luminescence component includes a circuit board, a light-emitting component and a pedestal.The circuit board has an opening provided.The light-emitting component is arranged at the opening of the circuit board, and the light-emitting component can conductively be connect with the circuit board, for issuing a light beam.The pedestal is mounted on the circuit board, and the light-emitting component is directly mounted on the pedestal, and wherein the pedestal is made of metal material, to distribute the heat of light-emitting component generation by the pedestal.The lens subassembly is arranged at the light emitting path of the luminescence component, the light beam issued for adjusting the light-emitting component.

Description

Projection arrangement and depth information device

Technical field

The utility model relates to field of optical device technology, relate more specifically to a projection arrangement and depth information dress It sets.

Background technique

Depth camera can obtain the depth information of a target object, user can whereby as a kind of depth information device To realize the functions such as 3-D scanning, recognition of face, machine vision, movement tracking and scene modeling.Due to depth camera energy User's experience for being different from two-dimensional camera is brought, therefore depth camera is just by the attention of all trades and professions.

Laser projection mould group is that depth camera acquisition depth information is indispensable as the core component in depth camera Component is usually made of wiring board, light-emitting component and optical element.The light-emitting component of the laser projection mould group is usually to use Light source made of semi-conducting material manufacturing.Such as VCSEL (vertical cavity surface emitting laser) light source, because it is easily integrated large area Laser array, therefore VCSEL light source be particularly suitable for pattern light scheme in.However, due to light-emitting component (such as VCSEL light Source) light and heat is constantly generated at work, exist simultaneously the higher situation of power consumption.Especially after a period of operation, the hair Optical element will generate a large amount of heat.And existing laser projection modular structure can not exclude a large amount of heat in time, so that Generated thermal energy is largely accumulated in laser projection mould group, and then causes changing in performance to light-emitting component and optical element Become, this not only will affect the projection quality of the laser projection mould group, it is also possible to will cause the safe handling of the laser projection mould group Problem.

Since laser projection mould group does not require nothing more than good heat dissipation performance, and with depth camera direction more and more Lightening and high performance direction is developed, and laser projection mould group is also towards smaller size, more preferably property development, because of the industry Expect a kind of performance more preferably laser projection modular structure.

Utility model content

The one of the utility model is designed to provide a projection arrangement and depth information device, with good heat dissipation Performance is accumulated in the projection arrangement or the depth information device to avoid heat.

The another object of the utility model is to provide a projection arrangement and depth information device, can enhance described The heat dissipation performance of projection arrangement changes to prevent the projection performance of the projection arrangement because of the accumulation of heat.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein practical at this In novel some embodiments, a luminescence component of the projection arrangement uses ceramic substrate+flexible circuit board+pedestal knot Structure to enhance the heat dissipation performance of the projection arrangement, and then prevents the projection performance of the projection arrangement due to accumulation of heat It changes.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein practical at this In novel some embodiments, the pedestal of the luminescence component is made of the good material of the thermal diffusivities such as metal, with Heat is distributed to the external world by the pedestal, and then enhances the heat dissipation performance of the projection arrangement.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein practical at this In novel some embodiments, a ceramic substrate and a flexible circuit board for the luminescence component is realized by the way of Reflow Soldering Electrical connection, to enhance the heat transfer efficiency between the ceramic substrate and the flexible circuit board.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein practical at this In novel some embodiments, the ceramic substrate of the luminescence component is capable of providing a smooth datum clamp face, for peace A light-emitting component of the luminescence component is filled, enters light with guarantee light that the light-emitting component is issued and the lens subassembly Surface has consistent angle.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein practical at this In novel some embodiments, the pedestal of the luminescence component is capable of providing a smooth datum clamp face, for installing institute A light-emitting component of luminescence component is stated, to guarantee that the light that the light-emitting component is issued has preferable consistency.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein practical at this In novel some embodiments, the flexible circuit board of the luminescence component is arranged at the ceramic substrate and the bottom Seat between, bend due to by extraneous stress to prevent the flexible circuit board, so that it is guaranteed that the projection arrangement have it is good Good projection quality.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein practical at this In novel some embodiments, the flexible circuit board is arranged at one end of the ceramic substrate, so that the ceramic substrate It can directly be connect with the pedestal, and eliminate the process via flexible circuit board conduction heat, to further enhance State the heat dissipation performance of projection arrangement.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein practical at this In novel some embodiments, the flexible circuit board is arranged at a upside of the ceramic substrate, not only without considering institute The correlation between pedestal and the flexible circuit board is stated, and also can ensure that between the pedestal and the ceramic substrate With good heat-conducting effect.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein practical at this In novel some embodiments, a light-emitting component of the luminescence component is connect by conductive silver glue with the ceramic substrate, with Heat is improved by the light-emitting component to the transmission efficiency of the ceramic substrate, and then enhances the thermal diffusivity of the projection arrangement Energy.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein practical at this In novel some embodiments, the ruler when size is all larger than corresponding the three of the flexible circuit board of the three of the ceramic substrate It is very little, to prevent causing the flexible circuit board to deviate from the ceramic substrate because of the error in size.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein practical at this In novel some embodiments, the projection arrangement further includes a load-carrying unit, and the load-carrying unit is arranged at one luminous group It is described to ensure by adjusting positional relationship between the two to provide enough adjustment spaces between part and a lens subassembly Lens subassembly is located on the light emitting path of the luminescence component.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein in production institute During stating projection arrangement, electronic component is first welded in the ceramic substrate by first time Reflow Soldering, then again will The ceramic substrate with electronic component is welded in the flexible circuit board by second of Reflow Soldering, can effectively keep away Exempt to cause the attaching of the electronic component to tilt because flexible circuit board is there are out-of-flatness, to guarantee the electronic component Installation accuracy, while also can be improved the packaging efficiency of the projection arrangement.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein in production institute During stating projection arrangement, the welding section temperature of second of Reflow Soldering is lower than the welding section temperature of the first time Reflow Soldering Degree, so that cured scolding tin will not melt again in first time Reflow Soldering, when carrying out second of Reflow Soldering to prevent occurring State the phenomenon that electronic component warps.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein practical at this In novel some embodiments, the luminescence component further includes a molded base, and the mould group pedestal is formed in the ceramic base Plate, the phenomenon that prevent causing the molded base warped because of the effect of molding material internal stress when being molded.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein practical at this In novel some embodiments, a DOE element of a lens subassembly of the projection arrangement is equipped with ITO plated film, the ITO plating Film can lead to the flexible circuit board for being electrically coupled to the luminescence component, to enhance the projection performance of the projection arrangement.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein practical at this In novel some embodiments, the luminescence component includes a light-emitting component, a circuit board and a pedestal, wherein the circuit board With a through-hole, so that the through-hole is suitable for accommodating the light-emitting component, and the light-emitting component is mounted on the pedestal, To be scattered and disappeared the heat that the light-emitting component generates by the pedestal, to guarantee that the projection arrangement can work normally.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein practical at this In novel some embodiments, the pedestal further comprises a first base and a second base, wherein the second base It is connect by insulating layer with the first base, and the second base provides the effect of the circuit ground in the circuit board, from And improve the Electro Magnetic Compatibility and the jamproof ability of signal of the laser projection mould group.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein practical at this In novel some embodiments, the circuit board further comprises a flexible circuit board and a hard circuit board, wherein described hard Matter circuit board is a ceramic substrate, and the ceramic circuit board is connect by a conductive layer with the flexible circuit board, described to lead Electric layer material is preferably welding tin material, so that the circuit board has good heat dissipation performance.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein practical at this In novel some embodiments, the light-emitting component is placed in the through-hole of the circuit board, thus the projection arrangement Optics overall length it is constant in the case where can reduce the size of the projection arrangement.

The another object of the utility model is to provide a projection arrangement and depth information device, wherein the depth is believed Ceasing device includes a projection arrangement and a reception device, wherein the projection arrangement is suitable for outwardly projection patterning light, The reception device be used for obtains include be projected in it is modulated in target after pattern image, with obtain including target depth Information.

In order to realize above-mentioned at least a purpose of utility model or other objects and advantages, the utility model provides a projection Device, comprising:

One luminescence component, wherein the luminescence component includes:

One circuit board, wherein the circuit board has an opening provided；

One light-emitting component, wherein the light-emitting component is arranged at the opening of the circuit board, and described luminous Element can conductively be connect with the circuit board, for issuing a light beam；And

One pedestal wherein the pedestal is mounted on the circuit board, and the light-emitting component is directly mounted on described Pedestal, wherein the pedestal is made of metal material, directly to distribute the heat that the light-emitting component generates by the pedestal； With

One lens subassembly, wherein the lens subassembly is arranged at the light emitting path of the luminescence component, for adjusting State the light beam that light-emitting component is issued.

In some embodiments of the utility model, the pedestal includes a first base, a second base and an insulation Layer, wherein the insulating layer is arranged between the first base and the second base, and the light-emitting component is installed In the first base.

In some embodiments of the utility model, the light-emitting component is mounted on described by a conductive silver glue-line One pedestal, and the first base can conductively be connect with the circuit board, wherein a bottom electrode of the light-emitting component It can conductively be connect by the first base with the circuit board, and a top electrodes of the light-emitting component draw by one Line can conductively be connect with the circuit board.

In some embodiments of the utility model, the first base of the pedestal is embedded in the circuit board The opening, and the first base can be connect by a conduct piece with the circuit board with being powered, wherein the pedestal The second base is set to support the circuit board.

In some embodiments of the utility model, the second base can conductively be connect with the circuit board, so that An earthing pole of the second base as the projection arrangement.

In some embodiments of the utility model, the second base includes a base body and a protrusion, wherein The base body is in a tabular, to support the circuit board and the first base, wherein the protrusion is from the bottom The periphery of seat main body integrally upwardly extends, and the lens subassembly is installed in the protrusion.

In some embodiments of the utility model, the first base of the pedestal includes a light-emitting component support portion An at least extension wherein the light-emitting component support zone is in the opening of the circuit board, and described shines Element is mounted on the light-emitting component support portion, wherein each extension integrally extends outwardly from the support portion, To support the circuit board.

In some embodiments of the utility model, the first base further includes a lens barrel support portion, wherein the mirror Cylinder support portion is integrally connected with the light-emitting component support portion by the extension, and the lens subassembly is installed in The lens barrel support portion.

In some embodiments of the utility model, the circuit board is a hard circuit board or a flexible circuit board.

In some embodiments of the utility model, the circuit board includes that a hard circuit board and one are electric with the hard The flexible circuit board that road plate can be connected conductively, wherein the flexible circuit board be located at the hard circuit board and the pedestal it Between, and the opening of the circuit board is formed on the hard circuit board and the flexible circuit board, and the pedestal is logical It crosses an adhesive layer and is attached at the flexible circuit board.

In some embodiments of the utility model, the circuit board includes that a hard circuit board and one are electric with the hard The flexible circuit board that road plate can be connected conductively, wherein the flexible circuit board and the pedestal are positioned apart from described hard The bottom side of matter circuit board, wherein the opening of the circuit board is formed on the hard circuit board, the pedestal passes through one Adhesive layer is directly mounted on the hard circuit board.

In some embodiments of the utility model, the circuit board includes that a hard circuit board and one are electric with the hard The flexible circuit board that road plate can be connected conductively, wherein the flexible circuit board and the pedestal are located at the hard circuit The opposite side of plate, wherein the opening of the circuit board is formed on the hard circuit board, and the pedestal passes through one Adhesive layer is directly mounted on the hard circuit board.

In some embodiments of the utility model, the lens subassembly includes collimating lens, a diffractive-optical element And a lens barrel, wherein the collimation lens and the diffractive-optical element are arranged at the lens barrel, and the lens barrel quilt It is installed on a fringe region of the hard circuit board, to guarantee that it is described that the collimation lens and the diffractive-optical element are located at The light emitting path of light-emitting component.

In some embodiments of the utility model, the luminescence component further includes a molded base, wherein the molding Pedestal is formed in a fringe region of the hard circuit board, and the molded base has one and the light-emitting component phase The light hole answered, wherein the lens subassembly is installed in the molded base.

In some embodiments of the utility model, the luminescence component further includes one group of electronic component, wherein described Electronic component is positioned apart from the fringe region in the hard circuit board, so that the molded base wraps It is arranged at the electronic component of the fringe region of the hard circuit board.

In some embodiments of the utility model, the lens subassembly further includes an ito film and a metalwork, wherein institute It states ito film and is arranged at the diffractive-optical element, the metalwork is set conductively to connect the ito film and described hard Matter circuit board.

Another aspect according to the present utility model, the utility model additionally provide a depth information device, comprising:

Above-mentioned projection arrangement, wherein the projection arrangement is for projecting a light beam a to target object；With

An at least reception device, wherein the reception device is used to receive the light beam being transmitted back to through the target object, for Obtain the depth information of the target object.

By the understanding to subsequent description and attached drawing, the further purpose of the utility model and advantage will be able to abundant body It is existing.

The these and other objects of the utility model, feature and advantage, by following detailed descriptions, attached drawing and right are wanted It acquires to fully demonstrate.

Detailed description of the invention

Fig. 1 is the schematic diagram of a depth information device of one first preferred embodiment according to the present utility model.

Fig. 2 is a projection arrangement of the depth information device of above-mentioned first preferred embodiment according to the present utility model Schematic cross-sectional view.

Fig. 3 is that the partial enlargement section view of the projection arrangement of above-mentioned first preferred embodiment according to the present utility model is shown It is intended to.

Fig. 4 is the elevational schematic view of the projection arrangement of above-mentioned first preferred embodiment according to the present utility model.

Fig. 5 A and Fig. 5 B are the system of the projection arrangement of above-mentioned first preferred embodiment according to the present utility model respectively Make process schematic.

Fig. 6 is one first deformation implementation of the projection arrangement of above-mentioned first preferred embodiment according to the present utility model The schematic cross-sectional view of mode.

Fig. 7 A and Fig. 7 B are the one second of the projection arrangement of above-mentioned first preferred embodiment according to the present utility model The schematic diagram of variant embodiment.

Fig. 8 A to Fig. 8 C is a third of the projection arrangement of above-mentioned first preferred embodiment according to the present utility model The schematic diagram of variant embodiment mode.

Fig. 9 is one the 4th deformation implementation of the projection arrangement of above-mentioned first preferred embodiment according to the present utility model The schematic cross-sectional view of mode.

Figure 10 is that one the 5th deformation of the projection arrangement of above-mentioned first preferred embodiment according to the present utility model is real Apply the schematic cross-sectional view of mode.

Figure 11 is the stream of the manufacturing method of the projection arrangement of above-mentioned first preferred embodiment according to the present utility model Journey schematic diagram.

Figure 12 is the manufacturing method of the depth information device of above-mentioned first preferred embodiment according to the present utility model Flow diagram.

Figure 13 is the schematic diagram of a depth information device of one second preferred embodiment according to the present utility model.

Figure 14 is a projection dress of the depth information device of above-mentioned second preferred embodiment according to the present utility model The schematic cross-sectional view set.

Figure 15 is that one first deformation of the projection arrangement of above-mentioned second preferred embodiment according to the present utility model is real Apply the schematic cross-sectional view of mode.

Figure 16 is that one second deformation of the projection arrangement of above-mentioned second preferred embodiment according to the present utility model is real Apply the schematic cross-sectional view of mode.

Figure 17 is that the third deformation of the projection arrangement of above-mentioned second preferred embodiment according to the present utility model is real Apply the schematic cross-sectional view of mode.

Figure 18 is that one the 4th deformation of the projection arrangement of above-mentioned second preferred embodiment according to the present utility model is real Apply the schematic cross-sectional view of mode.

Figure 19 A is the one of a pedestal of the projection arrangement of above-mentioned second preferred embodiment according to the present utility model The schematic diagram of one first alternate embodiments of one pedestal.

Figure 19 B is the first base of the projection arrangement of above-mentioned second preferred embodiment according to the present utility model One second alternate embodiments schematic diagram.

Figure 19 C is the first base of the projection arrangement of above-mentioned second preferred embodiment according to the present utility model A third alternate embodiments schematic diagram.

Figure 19 D is the first base of the projection arrangement of above-mentioned second preferred embodiment according to the present utility model One the 4th alternate embodiments schematic diagram.

Figure 20 is that one the 5th deformation of the projection arrangement of above-mentioned second preferred embodiment according to the present utility model is real Apply the schematic cross-sectional view of mode.

Figure 21 is the system of a circuit board of the projection arrangement of above-mentioned second preferred embodiment according to the present utility model Make step schematic diagram.

Figure 22 A is the circuit board of the projection arrangement of above-mentioned second preferred embodiment according to the present utility model Structural schematic diagram.

Figure 22 B is the circuit board of the projection arrangement of above-mentioned second preferred embodiment according to the present utility model The schematic diagram of first alternate embodiments.

Figure 22 C is the circuit board of the projection arrangement of above-mentioned second preferred embodiment according to the present utility model The schematic diagram of second alternate embodiments.

Figure 22 D is the circuit board of the projection arrangement of above-mentioned second preferred embodiment according to the present utility model The schematic diagram of third alternate embodiments.

Figure 23 is that one the 6th deformation of the projection arrangement of above-mentioned second preferred embodiment according to the present utility model is real Apply the schematic cross-sectional view of mode.

Specific embodiment

It is described below for disclosing the utility model so that those skilled in the art can be realized the utility model.It retouches below Preferred embodiment in stating is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It is retouched following The basic principle of the utility model defined in stating can be applied to other embodiments, deformation scheme, improvement project, etc. Tongfangs The other technologies scheme of case and the spirit and scope without departing from the utility model.

It will be understood by those skilled in the art that in the exposure of the utility model, term " longitudinal direction ", " transverse direction ", "upper", The orientation of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" or position are closed System is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of describing the present invention and simplifying the description, without It is that the device of indication or suggestion meaning or element must have a particular orientation, be constructed and operated in a specific orientation, therefore on Stating term should not be understood as limiting the present invention.

In the present invention, term " one " is interpreted as " one or more " in claim and specification, i.e., one A embodiment, the quantity of an element can be one, and in a further embodiment, the quantity of the element can be multiple. Unless clearly illustrate in the exposure of the utility model the element quantity only one, otherwise term " one " can not be interpreted as Unique or single, term " one " should not be understood as the limitation to quantity.

With reference to shown in Fig. 1 to Figure 12 of the Figure of description of the utility model, one first according to the utility model is preferable One depth information device of embodiment is elucidated with.As shown in Figure 1, the depth information device includes a projection arrangement 1, at least one Reception device 2 and a processing system 3, wherein the projection arrangement 1 can generate and project a light beam or pattern to target object, institute The light beam or pattern being reflected back through the target object can be received by stating reception device 2, and the processing system 3 can handle the reception Light beam received by device 2 or pattern to obtain the depth information of the target object, for example obtain the depth of the target object Image (i.e. 3D rendering).It will be appreciated by those skilled in the art that although in Fig. 1 to Figure 12 and following description of attached drawing with For the depth information device only includes the reception device 2, the depth information device of the utility model is illustrated Feature and advantage, but the depth information device disclosed in Fig. 1 to Figure 12 and following description is only for example, simultaneously The limitation to the content and range of the utility model is not constituted, for example, in other examples of the depth information device, it is described The quantity of reception device 2 may be two, one of them described reception device 2 is used to receive to be reflected back through the target object The light beam or pattern, to obtain the depth information of the target object, and another described reception device 2 can acquire and obtain this The colouring information of target object so that the depth information device can obtain simultaneously the target object depth information and Colouring information, to obtain the color depth image of the target object.

It is worth noting that, the depth information device and the projection arrangement 1 can be suitable for various application scenarios, than Such as gesture identification, recognition of face, object identification, scene Recognition, three-dimensional reduction, machine vision, and with the hair of science and technology Exhibition and improvement of living standard, the projection arrangement 1 can not only be integrated in the large sizes such as computer, computer, robot In equipment, but also gradually it is intended to be integrated in such as portable miniaturized electronics of smart phone, Ipad etc., with Meet market to such as multifunction of the portable miniaturized electronics of smart phone, Ipad etc., intelligence, it is lightening with And the demand of high performance.

Specifically, as depicted in figs. 1 and 2, the projection arrangement 1 includes a luminescence component 100 and a lens subassembly 200, Wherein the lens subassembly 200 is arranged at the light emitting path of the luminescence component 100, for receiving and adjusting described luminous group The light beam that part 100 issues is suitable for generating the light beam of depth image with formation, for example, having the light beam of coding pattern or with scattered The light beam of spot pattern, in the present invention with no restrictions to its types of patterns.

It should be appreciated that when the lens subassembly 200 includes the diffractive-optical element (DOE) as needed for project structured light mould group When with collimating mirror, the projection arrangement 1 is then implemented as a project structured light mould group, for generate and be projected out coding pattern or Speckle pattern is into object space, so as to the depth map of the reception device 2 and the acquisition of the processing system 3 target object Picture；When the lens subassembly 200 includes the lens as needed for flight time projective module group (TOF projective module group), the projection Device 1 is then implemented as a TOF projective module group, for generating and projecting by modulated light beam into object space, so as to The reception device 2 and the processing system 3 obtain the depth image of the target object.

It is noted that although being dissipated in Figure of description and with the projection arrangement 1 in following description for one For spot project structured light mould group (forming the projection arrangement of speckle pattern), the projection arrangement of the utility model is illustrated Feature and advantage, it will be appreciated by those skilled in the art that the institute disclosed in Figure of description and next description It states projection arrangement to be only for example, does not constitute the limitation to the content and range of the utility model, for example, being filled in the projection In other examples set, the projection arrangement also may be implemented as a such as coded structured light projective module group and (form coding The projection arrangement of pattern) or a TOF projective module group (i.e. formed modulation light beam projection arrangement) etc. other projective modules Group.It should be appreciated that the lens subassembly 200 of the projection arrangement 1 may include any well known for laser projection mould group Optical module, details are not described herein.

In the present invention, by taking the projection arrangement for forming speckle pattern as an example, as shown in Fig. 2, the luminescence component 100 Including a light-emitting component 110, for generating the light beam for having basic dot pattern picture.The lens subassembly of the projection arrangement 1 200 include at least collimating lens 210, at least a diffractive-optical element 220 and a lens barrel 230, wherein the collimation lens 210 and the diffractive-optical element 220 be arranged in the lens barrel 230, the lens barrel 230 is arranged at the luminescence component 100, so that the collimation lens 210 and the diffractive-optical element 220 are held in the luminous road of the luminescence component 100 Diameter.The collimation lens 210 is suitable for collimating the light that the luminescence component 100 is issued, to form a collimated light beam.The light It learns diffraction element 220 and is used as beam splitter, for generating and projecting multiple copies of the light beam for having basic dot pattern picture to mesh It marks in space, so as to the depth image of the reception device 2 and the acquisition of the processing system 3 target object.

Preferably, the light-emitting component 110 is implemented as a planar laser with vertical cavity (i.e. VCSEL).Due to described vertical Cavity surface laser has many advantages, such as that small in size, light source generation angle is small, stability is good, therefore generally selects in the projection arrangement 1 Light-emitting component of the planar laser with vertical cavity as the projection arrangement 1 to reduce the overall volume of the projection arrangement 1, and mentions The accuracy of identification of the high projection arrangement 1.However, due to the planar laser with vertical cavity at work power consumption it is larger, fever compared with It is more, in order to ensure the normal work of the projection arrangement 1, need efficiently to radiate to the planar laser with vertical cavity, because This utility model carries out the structure of projection arrangement for the heat dissipation problem of planar laser with vertical cavity described in projection arrangement It improves, so that the thermal diffusivity of the projection arrangement 1 is improved, to avoid heat in the projection arrangement or the depth information device Middle accumulation.

Further, as shown in Fig. 2, the luminescence component 100 further includes a circuit board 120 and a pedestal 130.The electricity Road plate 120 can conductively be connect with the light-emitting component 110, for providing electric energy for the light-emitting component 110 and controlling the hair The luminance of optical element 110.The pedestal 130 is made of the good material of the thermal diffusivities such as metal, using as the hair One heat dissipation base of optical assembly 100, and the pedestal 130 is set to support the circuit board 120, to pass through the pedestal 130 distribute heat caused by the light-emitting component 110, to improve the heat dissipation performance of the projection arrangement 1.

More specifically, the circuit board 120 of the luminescence component 100 includes a flexible circuit board 122 and hard electricity Road plate 125, wherein the flexible circuit board 122 can conductively be connect with the hard circuit board 125, and the light-emitting component 110 can be conductively set to the hard circuit board 125.Due to compared to the flexible circuit board 122, the hard circuit Plate 125 has good flatness, and the hard circuit board 125 is enabled to be that the light-emitting component 110 provides a smooth peace Datum level is filled, to guarantee that the light that the light-emitting component 110 is issued has good consistency, and can be with the lens group The light-entering surface of part 200 has consistent angle.

Preferably, the hard circuit board 125 is implemented as a ceramic substrate (below described in ceramic substrate replacement Hard circuit board 125 is described).

Since in existing projective module group, the circuit board of large-scale use is usually by resin and reinforcing material as base The heat dissipation performance of plate material, such material is generally bad.Especially in structured light projection module packaging field, due to the member that shines Part produces a large amount of heat at work, and the heat dissipation for circuit board based on resin base material is unable to satisfy requirement, and at work After accumulating a large amount of heat, it is easy to cause the light-emitting component, the lens subassembly such as collimation lens etc. deformation or performance The case where change, to influence service life and the stability of the projection arrangement, therefore pcb board is not able to satisfy present dissipate increasingly In the big electronic package of heat.

And the ceramic substrate 125 generally refers to copper foil and is bonded directly to aluminium oxide (Al2O3) or aluminium nitride at high temperature (AlN) the special process plate in ceramic substrate surface (single or double), so that made ultra-thin composite substrate is with excellent Electrical insulation capability, high thermal conductivity characteristic, excellent solderability and high adhesive strength, and can be etched as pcb board each Kind figure, has very big current-carrying capability, therefore the utility model uses the ceramic substrate 125 as the circuit board 120 The hard circuit board, can be improved the heat dissipation effect of the circuit board 120, to prevent the circuit board 120 and it is described shine Element 110 causes the change of performance because accumulating excessive heat.

Citing ground, by taking the ceramic substrate 125 of aluminium nitride material as an example, the aluminum nitride ceramic substrate 125 has big In the thermal coefficient of 170W/ (m.K), and by taking the made pcb board of epoxide resin material as an example, the pcb board of the epoxide resin material Thermal coefficient is generally in 0.2-0.8W/ (m.K) range, therefore the aluminum nitride ceramic substrate 125 is compared to the epoxy resin The pcb board of material has good heating conduction.

It is highly preferred that the thickness of the ceramic substrate 125 is implemented as 0.25~0.35mm, so that the ceramic substrate 125 thickness can not only ensure that the ceramic substrate 125 has efficient radiating efficiency, and ensure that in design again The integral strength of the ceramic substrate 125 is unlikely to the ceramic substrate 125 and is destroyed because too thin and easy.

It should be appreciated that since the ceramic substrate 125 itself has efficient radiating efficiency, so that the light-emitting component Heat caused by 110 directly radiates via the ceramic substrate 125, therefore, in some other realities of the utility model Apply in example, the luminescence component 100 of the grenade instrumentation 1 only include the light-emitting component 110 and the circuit board 120, and It does not include the pedestal 130, it will be produced by the light-emitting component 110 to pass through the ceramic substrate 125 of the circuit board 120 Heat directly distribute into environment.

First preferred embodiment according to the present utility model, as shown in Figures 2 and 3, the ceramic substrate 125 includes One smooth chip attachment region 1253 and a fringe region 1254, wherein the chip attachment region 1253 and the marginal zone Domain 1254 is integrally formed, and the fringe region 1254 is located at the outside in the chip attachment region 1253.It is described to shine Element 110 is mounted on the chip attachment region 1253 of the ceramic substrate 125, to guarantee to be mounted on the chip patch The planarization of the light-emitting component 110 in area 1253 is filled, and then it is higher to ensure that light beam that the light-emitting component 110 is issued has Consistency.The lens barrel 230 of the lens subassembly 200 is arranged in correspondence in the edge of the ceramic substrate 125 Region 1254, so that the collimation lens 210 and the diffractive-optical element 220 to be held in the hair of the luminescence component 100 Light path.

Preferably, as shown in Fig. 2, the ceramic substrate 125 further includes that one group of ceramic substrate weld pad 1251 and one group are conductive Channel 1252, wherein the ceramic substrate weld pad 1251 is arranged at the fringe region of the ceramic substrate 125 respectively 1254 upper and lower surface, the conductive channel 1252 are penetratingly formed respectively in the upper following table for being located at the fringe region 1254 On face between the corresponding two ceramic substrate weld pad 1251, for can conductively connect the opposite of the ceramic substrate 125 The ceramic substrate weld pad 1251 answered.It should be appreciated that the conductive channel 1252 can be implemented as an inside filled with conduction The ceramic substrate through-hole of ink or metal paste, will be above and below the ceramic substrate 125 will pass through the conductive channel 1252 The two ceramic substrate weld pads 1251 on surface can connect steadily and conductively.

It is worth noting that, as shown in figure 3, the circuit board 120 of the projection arrangement 1 further comprises one group of electronics Component 123, wherein each electronic component 123 is suitable for passing through such as SMT (SurfaceMount Technology) work Skill is mounted on the fringe region 1254 of the ceramic substrate 125 spaced reciprocally.It is noted that the electronics member Device 123 and the light-emitting component 110 can be located at the ipsilateral or opposite side of the ceramic substrate 125, such as at this In first preferred embodiment of utility model, the electronic component 123 and the light-emitting component 110 are respectively positioned on the pottery The upper surface of porcelain substrate 125, and the electronic component 123 is installed on the ceramic substrate 125 by welding The ceramic substrate weld pad 1251, so that the electronic component 123 can be conductively installed on the ceramic substrate 125.Separately Outside, in the projection arrangement 1 of the utility model, the type of the electronic component 123 can be unrestricted, such as described Electronic component 123 can be implemented as resistance, capacitor, driving element etc..

It is highly preferred that the luminescence component 100 further includes a conductive silver glue-line 170, wherein 170, the conductive silver glue layer Between the light-emitting component 110 and the chip attachment region 1253 of the ceramic substrate 125, to pass through the conductive silver The light-emitting component 110 is securely mounted on the chip attachment region 1253 by glue-line 170.

Typically also, when the planar laser with vertical cavity (VCSEL) is as the light-emitting component 110, the luminous member Part 110 generally includes a top electrodes 111 (pole P, anode) and a bottom electrode 112 (pole N, cathode).And due to the conduction Elargol layer 170 not only has stronger adhesive property, for by the light-emitting component 110 with the ceramic substrate 125 securely Connection, but also have good conductive property, will pass through the conductive silver glue-line 170 for the institute of the light-emitting component 110 Stating bottom electrode 112 can conductively connect with the ceramic substrate 125, only need to shine using a lead 126 by described at this time The top electrodes 111 of element 110 can conductively be connect with the ceramic substrate weld pad 1251 of the ceramic substrate 125, The light-emitting component 110 can conductively can be attached at the ceramic substrate 125, with the simplification luminescence component 100 Assembling process.

It will be appreciated by those skilled in the art that the type of the lead 126 can be unrestricted, such as the lead 126 Can be gold thread, i.e., the light-emitting component 110 be mounted on the ceramic substrate 125 the chip attachment region 1253 it Afterwards, it can make the lead 126 that the light-emitting component 110 and the ceramic substrate 125 be connected by beating gold thread technique.Although such as This, in other embodiments, the lead 126 is also possible to other kinds of lead 126, such as silver wire, copper wire etc., with logical It crosses the lead 126 light-emitting component 110 and the ceramic substrate 125 are connected.

It is worth noting that, the conductive silver glue-line 170 also has good heating conduction, so as to by the light-emitting component Heat caused by 110 is efficiently transfer to the ceramic substrate 125, to transmit or distribute institute by the ceramic substrate 125 The heat for stating the generation of light-emitting component 110, accumulates at the light-emitting component 110 to prevent the heat and influences the light-emitting component 110 luminescent properties, such as the light-emitting component 110 generate temperature drift phenomenon since temperature is excessively high during the work time.

It is noted that in first preferred embodiment of the utility model, as shown in figure 3, the flexible electrical Road plate 122 is arranged between the ceramic substrate 125 and the pedestal 130, and the flexible circuit board 122 and the pottery Porcelain substrate 125 is realized by the way of Reflow Soldering conductively to be connected, and in the flexible circuit board 122 and the ceramic substrate A tin layers 1222 are formed between 125, to improve the heat transfer between the ceramic substrate 125 and the flexible circuit board 122 Efficiency.Specifically, one in the ceramic substrate weld pad 1251 of the ceramic substrate 125 and the flexible circuit board 122 is soft Property circuit board welding pad 1221 between the tin material that coats liquid is melted into Reflow Soldering, shape after the cooled solidification of the liquid tin material At the tin layers 1222, conductively to connect the ceramic substrate 125 and the flexible circuit board 122.

Preferably, the thickness of the tin layers 1222 is implemented as 25~55um, so that the tin layers 1222 are described in the guarantee In the case where there is enough bonding strengths between ceramic substrate 125 and the flexible circuit board 122, additionally it is possible to the maximum extent Enhance the heat transfer efficiency between the ceramic substrate 125 and the flexible circuit board 122.

It will be appreciated by those skilled in the art that in the prior art, the ceramic substrate 125 usually passes through ACF glue and institute Flexible circuit board 122 is stated to be electrically connected, because the ACF glue is coated by the way of adhesive tape, pressed and is heated bonding, and Adhesive tape itself has well-regulated size and thickness control, the bond area of the ACF glue is also required in technique, therefore to the pottery Weld pad design on porcelain substrate 125 and the flexible circuit board 122 also requires to be that rule is related to, and just the ACF glue can in this way risen To good cementability and turn-on effect.However, it is more for certain weld pads and in the case that solder pad arrangement is complicated, utilize this The technique at the angle ACF is just difficult to realize the ceramic substrate 125 and is connect well with the flexible circuit board 122, but at this In utility model, which can be fully solved by the technique of Reflow Soldering.

In addition, tin material selected by the Reflow Soldering is better than the heating conduction of ACF glue in the comparison of heating conduction, Since the filler of ACF glue mainly has epoxy resin and acrylic material, the thermal coefficient of both materials generally 0.19~ 0.8W/ (m.K), and the thermal coefficient of tin 67W/ (m.K) left and right, therefore through this embodiment in reflow soldering process process, It has been made the tin layers 1222 that connection function is played between the ceramic substrate 125 and the flexible circuit board 122, and tin It, can be quickly by the heat transfer at the ceramic substrate 125 to the flexible circuit as the preferable medium of thermal coefficient Plate 122, it is thus possible to so that the projection arrangement 100 has good heat dissipation performance.

Although it is worth noting that, in the ceramic substrate 125 and the flexible circuit board 122 by the way of Reflow Soldering Between form the tin layers 1222 more higher than the thermal coefficient of the ACF glue, and in order to guarantee that the luminescence component 100 has Enough heat dissipation performances, therefore the thickness control by the flexible circuit board 122 is also needed in certain size, to prevent described soft Property circuit board 122 stop heat transmitted between the ceramic substrate 125 and the pedestal 130.

Preferably, the thickness of the flexible circuit board 122 is implemented as 0.1~0.2mm, to ensure the flexible circuit In the case that plate 122 meets the requirement of structural strength and electric conductivity, reduce the flexible circuit board 122 to the maximum extent in institute The thermal resistance formed between ceramic substrate 125 and the pedestal 130 is stated, so that the projection arrangement 1 has preferably heat dissipation Performance.

First preferred embodiment according to the present utility model, as shown in figure 3, the luminescence component 100 further include by The adhesive layer 180 being set between the flexible circuit board 122 and the pedestal 130, to pass through the adhesive layer 180 for institute It states flexible circuit board 122 securely to link together with the pedestal 130, and then the flexible circuit board 122 is steadily protected It is held between the ceramic substrate 125 and the pedestal 130, to keep the smooth of the flexible circuit board 122.In addition, institute Heat transfer efficiency between the flexible circuit board 122 and the pedestal 130 can also be improved by stating adhesive layer 180, so as to will Heat at the flexible circuit board 122 is rapidly transferred to the pedestal 130, thus prevent the flexible circuit board 122 because It accumulates heat and warped phenomenon occurs.

Preferably, as shown in figure 3, the adhesive layer 180 is implemented as by the conduction material of such as conductive silver glue etc. Material is made, to form a conductive adhesion layer 181, to guarantee having foot between the flexible circuit board 122 and the pedestal 130 In the case where enough bonding strengths, additionally it is possible to improve the heat transfer effect between the flexible circuit board 122 and the pedestal 130 Rate, so that the heat at the flexible circuit board 122 is rapidly transferred to the pedestal 130.

Significantly, since the conductive adhesion layer 181 has good conductive property, so that the pedestal 130 The conductive adhesion layer 181 and the flexible circuit board weld pad at the zero potential point of the flexible circuit board 122 can be passed through 1221 can conductively connect, therefore the pedestal 130 can be by the zero potential electrode (i.e. ground level) as entire circuit, so that institute Stating pedestal 130 can contact with electronic equipment casing, to achieve the effect that ground connection.That is, the throwing in the utility model Injection device 1 no longer needs to the effect by a metal shell to be grounded, and only passes through the pedestal connecting with circuit earth polar 130 can be realized circuit ground, to be reduced the size of the grenade instrumentation 1, and can achieve the effect of electromagnetic shielding Fruit prevents the interference of outer signals, improves the stability of the projection arrangement 1.

It is highly preferred that the pedestal 130 is implemented as a steel plate, so that the pedestal 130 not only has good heat dissipation Performance to enhance the heat dissipation performance of the projection arrangement 1, but also has good conductive property, wherein when the pedestal 130 When can conductively connect with the zero potential point of the circuit board 120, the pedestal 130 can be by the zero potential electricity as entire circuit Pole (i.e. ground level), so that the pedestal 130 can be contacted with electronic equipment casing, to reach good earthing effect, to improve The stability of the projection arrangement 1.

Most preferably, the thickness of the steel plate 130 (the i.e. described pedestal 130) is implemented as 0.3~0.8mm, so that the thickness Degree can either guarantee that the steel plate 130 can be in better radiating state, and it is enough strong to ensure that the steel plate 130 has Degree, so that the flexible circuit board 122 that the steel plate 130 is the circuit board 120 is provided and steadily supported, to prevent described soft Property circuit board 122 occur warping phenomenon.

In first preferred embodiment of the utility model, as shown in figure 4, the usually ceramic substrate 125 has One rectangular shape is since the ceramic substrate 125 is connect by the technique of Reflow Soldering with the flexible circuit board 122 Prevention causes because of the error in size the flexible circuit board 122 to deviate from the ceramic substrate 125, therefore practical new at this Three of ceramic substrate 125 described in type in corresponding the three of the flexible circuit board 122 between reserve one first safety away from From S1, and the size of one end of the flexible circuit board 122 is less than the size of the ceramic substrate 125.Stated differently, since The width dimensions of the flexible circuit board 122 and the width dimensions of the ceramic substrate 125 are not much different, in the flexible circuit When one end of plate 122 is connect with the ceramic substrate 125, the other end of the flexible circuit board 122 is from the ceramic substrate 125 Extend outwardly on one side, therefore the size for ensuring described one end of the flexible circuit board 122 be less than the ceramic substrate 125 Size while, also need the three side sizes of the described one end for ensuring the flexible circuit board 122 to be respectively smaller than the ceramic base The corresponding three side size of plate 125.

Preferably, three sides of described one end of the flexible circuit board 122 and corresponding the three of the ceramic substrate 125 The first safe distance S1 between side is implemented as 0.05~0.125mm, to prevent the flexible circuit board 122 from deviating Out while ceramic substrate 125, can also increase as far as possible the ceramic substrate 125 and the flexible circuit board 122 it Between contact area, that is, increase the heat transfer area between the ceramic substrate 125 and the flexible circuit board 122, and then enhance Heat transfer efficiency between the ceramic substrate 125 and the flexible circuit board 122.

Similarly, as shown in figure 4, the size of the pedestal 130 is less than the ruler of described one end of the flexible circuit board 122 It is very little, and the three of the pedestal 130 while respectively to described one end of the flexible circuit board 122 corresponding three while between reserve one Second safe distance S2, to prevent causing the pedestal 130 to offset out the flexible circuit board 122 because of the error in size.This Outside, while remaining corresponding with the ceramic substrate 125 on one side of the pedestal 130 between also reserve described second safely away from From S2, to prevent causing the pedestal 130 to offset out the ceramic substrate 125 because of the error in size, and then guarantee the bottom Seat 130 provides stable support force for the circuit board 120.

Preferably, the second safe distance S2 is implemented as 0.05~0.125mm, to prevent the pedestal 130 partially While removing flexible circuit board 122, can also increase as far as possible the pedestal 130 and the flexible circuit board 122 it Between contact area, that is, increase the heat transfer area between the pedestal 130 and the flexible circuit board 122, and then described in enhancing Heat transfer efficiency between ceramic substrate 125 and the flexible circuit board 122.

Significantly, since the projection performance of the projection arrangement 1 and the luminescence component 100 and the lens group Assembly precision between part 200 has very big relationship, that is to say, that the center of the light-emitting component 110 of the projection arrangement 1 It just can guarantee the light information energy that the projection arrangement 1 is projected after region is corresponding with the central area of the lens subassembly 200 Enough correctly received by the reception device 2 post-processes, to obtain the depth information image of high quality, therefore in the utility model In, as shown in figure 3, the luminescence component 100 further includes one be arranged between the lens barrel 230 and the ceramic substrate 125 Glue-line 190 is carried, the lens barrel 230 is securely set to the ceramic substrate 125 by the carrying glue-line 190.

It should be appreciated that due to the presence of the carrying glue-line 190 make the lens barrel 230 and the ceramic substrate 125 it Between there are adjustment spaces so that the projection arrangement 1 can be realized the active calibration in later period, to reach the adjustment projection arrangement The corresponding relationship of 1 optical axis, so that parameters of the projection arrangement 1 after active calibration are all up to standard.In the utility model First preferred embodiment in, it is described carrying glue-line 190 thickness be preferably implemented as 100~300um, so as in master When dynamic calibration, the carrying glue-line 190 can guarantee enough adjustment spaces, so that will not be because of the carrying glue in calibration The thickness of layer 190 is insufficient and adjustment amount required between the lens barrel 230 and the ceramic substrate 125 is caused to be greater than the carrying The thickness of glue-line 190 in turn results in the lens barrel 230 and collides with the ceramic substrate 125, to influence the effect of active calibration Fruit.

Further, as shown in Fig. 2, the fringe region 1254 of the ceramic substrate 125 includes in a ceramic substrate Side 12541, a ceramic substrate interconnecting piece 12542 and a ceramic substrate outside portion 12543, wherein on the inside of the ceramic substrate Portion 12541 is located at the periphery in the chip attachment region 1253, and the ceramic substrate interconnecting piece 12542 inwardly or outwardly prolongs respectively It stretches to be connected to the ceramic substrate inside portion 12541 and the ceramic substrate outside portion 12543, the ceramic substrate weld pad 1251 are arranged at the ceramic substrate interconnecting piece 12542.In other words, the electronic component 123 is mounted on the ceramics The ceramic substrate interconnecting piece 12542 of substrate 125.

It is noted that in the present invention, the ceramic substrate 125 is used to set up the ceramic substrate The region of weld pad 1251 is defined as the ceramic substrate interconnecting piece 12542, by the ceramic substrate 125 from the ceramic substrate The region of interconnecting piece 12542 to the chip photosensitive region 1251 is defined as the ceramic substrate inside portion 12541, by the pottery The region from the ceramic substrate interconnecting piece 12542 to the outer edge of the ceramic substrate 125 of porcelain substrate 125 is defined as described Ceramic substrate outside portion 12543.In other words, the ceramic substrate 125 from the point of view of depression angle, is successively the core from inside to outside Piece pasting area 1253, the ceramic substrate inside portion 12541, the ceramic substrate interconnecting piece 12542 and the ceramic substrate Outside portion 12543.

It is worth noting that, the carrying glue-line 190 is set in first preferred embodiment of the utility model In the ceramic substrate outside portion 12543 of the fringe region 1254 of the ceramic substrate 125, so that in the lens barrel 230 by the carrying glue-line 190 be installed in the ceramic substrate 125 when, the lens barrel 230 is located at the ceramic substrate The 125 ceramic substrate outside portion 12543 contacts or damages 1251 He of ceramic substrate weld pad to prevent the lens barrel 230 The electronic component 230.At the same time, the electronic component 123 is also enclosed in the lens barrel 230 by the lens barrel 230 It is interior, to play the role of the protection electronic component 230.

It is the throwing of first preferred embodiment according to the present utility model with reference to shown in Fig. 5 A and Fig. 5 B of attached drawing The schematic diagram of the manufacturing process of image device 1, it will be appreciated by those skilled in the art that the throwing shown in attached drawing 5A and Fig. 5 B The manufacturing process of image device 1 is merely illustrative, for illustrating the feature and advantage of the utility model, does not constitute practical new to this The limitation of the content and range of type.

Specifically, in attached drawing 5A, the electronic component 123 is mounted on a ceramic substrate array with being respectively separated 124 upper surface, and the electronic component 123 is located at mounting position different on the ceramic substrate array 124. Preferably, the electronic component 123 is welded in the ceramic substrate array 124 by first time Reflow Soldering, so as to by institute Stating electronic component 123 can connect securely and conductively with the ceramic substrate array 124.It is highly preferred that the first time Welding section temperature range in Reflow Soldering is implemented as 183~300 DEG C, and weld interval is implemented as 10~120 seconds, to guarantee First time Reflow Soldering is stated with good welding quality.

In attached drawing 5A, along predeterminated position, the ceramic substrate array 124 is cut, so that the ceramic substrate array 124 form each ceramic substrate 125 for having the electronic component 123, wherein the electronic component 123 is located at institute State the fringe region 1254 of ceramic substrate 125.It should be appreciated that in the other embodiments of the utility model, it can also be first The ceramic substrate array 124 is cut into the single ceramic substrate 125, then again passes through the electronic component 123 Cross the fringe region 1254 that first time Reflow Soldering is welded in the ceramic substrate 125.

In attached drawing 5B, a tin cream is first coated at the flexible circuit board weld pad 1221 of the flexible circuit board 122, So that when the ceramic substrate 125 is attached at the flexible circuit board 122, the tin cream is located at flexible circuit board weldering Between pad 1221 and the ceramic substrate weld pad 1251, it is ready for subsequent Reflow Soldering process.It should be appreciated that practical at this In novel other embodiments, the tin cream can also be first coated on to the ceramic substrate weld pad of the ceramic substrate 125 1251, the tin cream can also be respectively coated in the flexible circuit board weld pad 1221 of the flexible circuit board 122 and institute The ceramic substrate weld pad 1251 of ceramic substrate 125 is stated, is attached at the flexible electrical in the ceramic substrate 125 to realize When the plate 122 of road, the tin cream is between the flexible circuit board weld pad 1221 and the ceramic substrate weld pad 1251.

In attached drawing 5B, the lower surface of the ceramic substrate 125 is attached to the predetermined bits of the flexible circuit board 122 It sets, so that the ceramic substrate weld pad 1251 of the ceramic substrate 125 and the flexible circuit board for being coated with the tin cream Weld pad 1221 is aligned and contacts, and completes the ceramic substrate 125 and the flexible circuit board by second of reflow soldering process 122 can conductively connect.Specifically, in second of reflow process, it is located at 1251 He of ceramic substrate weld pad The tin cream between the flexible circuit board weld pad 1221 is heated to be melted into liquid under the action of Reflow Soldering, then should The cooled solidification of liquid tin cream is to form institute between the ceramic substrate weld pad 1251 and the flexible circuit board weld pad 1221 Tin layers 1222 are stated, to can conductively connect the ceramic substrate 125 and the flexible circuit board by the tin layers 1222 122.It should be appreciated that the flexible circuit board 122 can also be with the ceramic substrate in the other embodiments of the utility model 125 upper surface fitting, can be conductively by the ceramic substrate 125 and the flexible circuit board 122 to pass through reflow soldering process Connection.

Preferably, the welding section temperature range in second of Reflow Soldering is implemented as 183~300 DEG C, weld interval It is implemented as 10~120 seconds, to guarantee that second of Reflow Soldering has good welding quality.

It is noted that the welding section temperature of second of Reflow Soldering is preferably lower than the first time Reflow Soldering Welding section temperature, to prevent that during carrying out second of Reflow Soldering, will not make to have consolidated in the first time Reflow Soldering The phenomenon that scolding tin of change causes the electronic component 123 to warp because melting again.Citing ground, the first time reflux Tin material used in welding is lead-free tin cream, and tin material used in second of Reflow Soldering is to have Pb-Sn paste (for example, described have The content of tin is 63% in Pb-Sn paste, the content of lead be 37%), it is described to have lead since the fusing point of the lead-free tin cream is 217 DEG C The fusing point of tin cream is 183 DEG C, so that when the welding section temperature of second of Reflow Soldering is 183 DEG C, it is sufficient to make described There is Pb-Sn paste to melt to execute welding sequence, without making the lead-free tin cream having been cured in the first time Reflow Soldering again Secondary thawing, so as to be effectively prevented from the problem of electronic component 123 warps.Those skilled in the art should manage It solves, the welding section temperature of the Reflow Soldering in the utility model refers to the temperature for melting tin material in general reflow soldering process process Region.

In attached drawing 5B, the light-emitting component 110 is attached to the chip attachment region of the ceramic substrate 125 1253, and the light-emitting component 110 can conductively be connect with the ceramic substrate 125.Specifically, pass through a conductive silver glue-line The bottom electrode 112 of the light-emitting component 110 can be mounted on securely and conductively the ceramic substrate 125 by 170 The chip attachment region 1253, and the top electrodes 111 of the light-emitting component 110 can be connected by a lead 126 Ground is connected to the ceramic substrate weld pad 1251 of the ceramic substrate 125, so that the light-emitting component 110 can conductively be pacified Loaded on the ceramic substrate 125.It should be appreciated that in the other embodiments of the utility model, the light-emitting component 110 and described Electronic component 123 can synchronously be mounted on the ceramic substrate array 124, can also incite somebody to action before second of Reflow Soldering The light-emitting component 110 is attached at the ceramic substrate 125, then draws in second of Reflow Soldering and then by described The light-emitting component 110 is conductively connect by line 126 with the ceramic substrate 125, to prevent reflow soldering process damage The lead 126 connected.

In attached drawing 5B, the pedestal 130 is attached at by the flexible circuit board 122 by an adhesive layer 180, to be made The luminescence component 100 of the projection arrangement 1.Preferably, the adhesive layer 180 is described conductive silver glue-line 170 etc. Or the like conductive adhesion layer 181, with by the conductive adhesion layer 181 by the zero potential of the flexible circuit board 122 Point can conductively be connect with the pedestal 130, so that ground level of the pedestal 130 as the projection arrangement 1, to prevent believing Number interference, to improve the safety and stability of the projection arrangement 1.

In attached drawing 5B, the lens barrel 230 of the lens subassembly 200 is mounted on by a carrying glue-line 190 described The fringe region 1254 of the ceramic substrate 125 of luminescence component 100, and adjust the mirror of the lens subassembly 200 The relative position of cylinder 230 and the ceramic substrate 125, to guarantee that the lens subassembly 200 is precisely located at the light-emitting component 110 light emitting path, so that the projection arrangement 1 of high quality be made.Preferably, the carrying glue-line 190 is formed on institute The ceramic substrate outside portion 12543 of the fringe region 1254 of ceramic substrate 125 is stated, to prevent being arranged at the carrying The lens barrel 230 on glue-line 190 contacts and damages the ceramic substrate interconnecting piece 12542 positioned at the fringe region 1254 The electronic component 123 and the ceramic substrate weld pad 1251 at place.

Attached drawing 6 shows first of the projection arrangement 1 of first preferred embodiment according to the present utility model Variant embodiment, wherein the pedestal 130 of the luminescence component 100 of the projection arrangement 1 is not by as the projection The earthing pole of device 1, that is to say, that the pedestal 130 described in this variant embodiment of the utility model not with it is described soft The zero potential point of property circuit board 122 can be connected conductively.Specifically, the adhesive layer 180 of the luminescence component 100 is by reality It applies by being made of the insulating materials of such as hot melt adhesive or the like, to form an insulation adhesive layer 182, with logical in the pedestal 130 When crossing the insulation adhesive layer 182 and being mounted on the flexible circuit board 122, the pedestal 130 and the flexible circuit board 122 Mutually it is not turned on.

It will be appreciated by those skilled in the art that the insulation adhesive layer 182 is not limited to be implemented as the hot melt adhesive, may be used also To be implemented with thermally conductive, insulation and with the other materials of adhesive property, repeat no more in the present invention.Certainly, In the other embodiments of the utility model, the region directly contacted on the flexible circuit board 122 with the pedestal 130 can also To be not provided with any flexible circuit board weld pad 1221, even if therefore the adhesive layer 180 be implemented as the conductive adhesive Layer 181, then the pedestal 130 will not be formed with the flexible circuit board 122 and can conductively be connect.

Attached drawing 7A and Fig. 7 B show the projection arrangement 1 of first preferred embodiment according to the present utility model Second variant embodiment, wherein the ceramic substrate 125 further has an attachment end 1255 and one from the attachment end 1255 connecting pins 1256 integrally extended, wherein the chip attachment region 1253 of the ceramic substrate 125 is positioned at described The attachment end 1255 of ceramic substrate 125, the flexible circuit board 122 is in the connecting pin of the ceramic substrate 125 It can conductively be connect at 1256 with the lower surface of the ceramic substrate 125, at the attachment end of the ceramic substrate 125 A space is reserved in 1255 lower surface, so that the pedestal 130 and the ceramic substrate 125 directly bond together, and makes The pedestal 130 and the flexible circuit board 122 are connect with the same side of the ceramic substrate 125.

In other words, one side of the fringe region 1254 of the ceramic substrate 125 integrally extends outwardly to form The connecting pin 1256 of the ceramic substrate 125, on the fringe region 1254 of the ceramic substrate 125 there are with The position that the flexible circuit board 122 connects, enables the flexible circuit board 122 and the pedestal 130 abreast to be pasted The same side (lower surface of the i.e. described ceramic substrate 125) loaded on the ceramic substrate 125, and the pedestal 130 with it is described Light-emitting component 110 is correspondingly set to the opposite side of the ceramic substrate 125, and the flexible circuit board 122 and described Pedestal 130 does not overlap, and hinders the ceramic substrate 125 and described so as to be effectively prevented from the flexible circuit board 122 Heat transfer between pedestal 130, to enhance the heat dissipation effect of the projection arrangement 1.

It will be appreciated by those skilled in the art that since the flexible circuit board 122 is not present in 130 He of pedestal Between the ceramic substrate 125, that is to say, that in entire radiation processes, eliminate the heat warp at the ceramic substrate 125 The process of the pedestal 130 is conducted to by the flexible circuit board 122, therefore second variant embodiment can greatly improve The heat dissipation performance of the projection arrangement 1.At the same time, since the pedestal 130 does not need to be mounted on the flexible circuit board On 122, therefore the width dimensions of the pedestal 130 do not need the width less than the flexible circuit board 122, that is to say, that energy Increase the lateral dimension of the pedestal 130 enough to increase the heat dissipation area of the pedestal 130, to further increase the projection The heat dissipation performance of device 1.

Preferably, as shown in Figure 7 B, the width dimensions of the width dimensions of the pedestal 130 and the flexible circuit board 122 It is equal, and when the pedestal 130 and the flexible circuit board 122 are mounted on the ceramic substrate 125, the flexibility The first safe distance S1, the bottom are reserved between the both sides of circuit board 122 and the corresponding both sides of the ceramic substrate 125 Seat 130 three in corresponding the three of the ceramic substrate 125 between reserve the second safe distance S2, the pedestal A third safe distance S3 is reserved between 130 remaining one side and the flexible circuit board 122, to prevent the pedestal 130 and institute State flexible circuit board 122 and offset out the ceramic substrate 125 because of installation error, at the same also can be avoided the pedestal 130 with The flexible circuit board 122 influences the effect of the heat transfer between the ceramic substrate 125 and the pedestal 130 because overlapped Rate.

It is highly preferred that described first and second safe distances S1, S2 are implemented as 0.05~0.125mm, the third Safe distance S3 is implemented as 0.75~4mm.

Since the pedestal 130 and the flexible circuit board 122 are abreast mounted on the bottom of the ceramic substrate 125 Side, therefore, the thickness of the pedestal 130 need the thickness greater than the flexible circuit board 122, so that the bottom of the pedestal 130 Integrated support face of the face as the projection arrangement 1, and then guarantee the luminescence component 100 of the projection arrangement 1 and described Lens subassembly 200 has good flatness.Preferably, the thickness of the pedestal 130 is implemented as being greater than 0.3mm, to guarantee The lower surface of the flexible circuit board 122 is higher than the bottom surface of the pedestal 130, so that it is guaranteed that the supporting surface of the projection arrangement 1 For the bottom surface of the pedestal 130.

Attached drawing 8A to Fig. 8 C shows the projection arrangement 1 of first preferred embodiment according to the present utility model Third variant embodiment.It is real compared to second deformation of first preferred embodiment according to the present utility model Apply a mode, the projection arrangement 1 of the third variant embodiment the difference is that: the flexible circuit board 122 and the pedestal 130 be mounted on the two opposite sides of the ceramic substrate 125 respectively.Specifically, the flexible circuit board 122 can conductively connect at the connecting pin 1256 of the ceramic substrate 125 with the upper surface of the ceramic substrate 125, And the lower surface of the pedestal 130 and the ceramic substrate 125 directly bonds together, so that the pedestal 130 and described Flexible circuit board 122 respectively with the two opposite sides of the ceramic substrate 125 (upper surface of the i.e. described ceramic substrate 125 and following table Face) connection.

Significantly, since the flexible circuit board 122 is arranged at the upper surface of the ceramic substrate 125, and The pedestal 130 is arranged at the lower surface of the ceramic substrate 125, therefore when the pedestal 130 is arranged, without considering The correlation between pedestal 130 and the flexible circuit board 122 is stated, so that the pedestal 130 can be with the ceramic substrate 125 entire lower surface bonds together, to increase between the pedestal 130 and the ceramic substrate 125 to the maximum extent Heat-transfer surface, and then enhance the heat dissipation performance of the projection arrangement 1.Further, since the lower surface of the ceramic substrate 125 It is only bonded with the pedestal 130, therefore the selection of 130 thickness of the pedestal is not by the shadow of the thickness of the flexible circuit board 122 It rings, the thickness of the pedestal 130 is allowed to be less than 0.3mm, still be able to ensure that the supporting surface of the projection arrangement 1 is the bottom The bottom surface of seat 130.

Preferably, as shown in Figure 8 B, the four of the pedestal 130 while with the ceramic substrate 125 corresponding four while it Between reserve the second safe distance S2, to guarantee the case where pedestal 130 will not offset out ceramic substrate 125 Under, increase the lateral dimension of the pedestal 130, as far as possible to increase the heat dissipation area of the projection arrangement 1.Specifically, described Second safe distance S2 is preferably implemented as 0.05~0.125mm.

Further, as shown in Figure 8 C,

Described is reserved between the both sides of the flexible circuit board 122 and the corresponding both sides of the ceramic substrate 125 One safe distance S1 is offset out when connecting with the ceramic substrate 125 because of scale error to prevent the flexible circuit board 122 The ceramic substrate 125.Specifically, the first safe distance S1 is implemented as 0.05~0.125mm.

It should be appreciated that the pedestal 130 can be connected by the conductive adhesion layer 181 and the ceramic substrate 125 Ground connection, so that the pedestal 130 is implemented as the earthing pole of the projection arrangement 1；Certainly, the pedestal 130 can also lead to The insulation adhesive layer 182 and the insulated connection of the ceramic substrate 125 are crossed, to distribute by the pedestal 130 from described The heat of ceramic substrate 125.

Attached drawing 9 shows the 4th of the projection arrangement 1 of first preferred embodiment according to the present utility model Variant embodiment, wherein the luminescence component 100 of the projection arrangement 1 further includes a molded base 150, wherein the mould Pedestal 150 processed is arranged at the fringe region 1254 of the ceramic substrate 125, so as to by the institute of the lens subassembly 200 It states lens barrel 230 and is assembled in the molded base 150, touched to prevent the lens barrel 230 or damage is arranged at the ceramic substrate The electronic component 123 and the lead 126 on 125.Specifically, the molded base 150 of the utility model passes through Molding process is shaped in the upper surface of the fringe region 1254 of the ceramic substrate 125, so that the molding base Seat 150 is integrally combined with the ceramic substrate 125, and the molded base 150 and institute are connected without such as adhesive glue State ceramic substrate 125.It should be appreciated that forming the mould since the ceramic substrate 125 has stronger heat resistance When pedestal 150 processed, the ceramic substrate 125 is able to bear the stress of the molding material of high temperature, without will cause the ceramics The problem of substrate 125 bends or deforms.

Further, as shown in figure 9, the molded base 150 has a light hole 151, wherein the molded base 150 The light hole 151 it is corresponding with the light-emitting component 110 so that the light beam that the light-emitting component 110 is issued is led to It crosses the light hole 151 and reaches the lens subassembly 200, that is to say, that the light hole of the molded base 150 151 In on the light emitting path of the light-emitting component 110, the light-emitting component 110 is stopped to be issued to prevent the molded base 150 Light beam.

Preferably, in a molding process, the molded base 150 is shaped in the described of the ceramic substrate 125 A part of the ceramic substrate interconnecting piece 12542 of fringe region 1254 and the ceramic substrate outside portion 12543, so that institute State molded base 150 coat after shaping it is every at the ceramic substrate interconnecting piece 12542 positioned at the fringe region 1254 One electronic component 123, the adjacent electronic component 123 to be isolated by the molded base 150.

In the projection arrangement 1 of the utility model, coated after shaping by the molded base 150 each described The mode of electronic component 123 has many advantages, firstly, the molded base 150 coats each electronic component 123, so as to be not in the bad phenomenon interfered with each other between the adjacent electronic component 123, the even adjacent electricity The projection quality that can also guarantee the projection arrangement 1 when being closer of sub- component 123, in this way, small area can be made The greater number of electronic component 123 can be mounted on the ceramic substrate 125, to make the projection arrangement 1 Structure is more compact, to be conducive to improve the throwing of the projection arrangement 1 on the basis of controlling the size of the projection arrangement 1 Penetrate quality；Secondly, the molded base 150 coats each electronic component 123, thus in the horizontal direction, described Reserved safe distance is not needed between molded base 150 and each electronic component 123, the projection can be reduced The size of device.Third, the molded base 150 coat each electronic component 123, thus in the molded base It does not need to be attached and level using glue between 150 and the ceramic substrate 125, to advantageously reduce the projection arrangement 1 height dimension.4th, the molded base 150 coats each electronic component 123, in subsequent transportation and assembling institute During projection arrangement 1 is stated to form the projection arrangement 1, the molded base 150 can prevent the electronic component 123 shake and fall off, to advantageously ensure that the structural stability of the projection arrangement 1.5th, the molded base 150 wraps Each electronic component 123 is covered, in subsequent transportation and assembles the projection arrangement 1 to form the process of the projection arrangement In, each electronic component 123 of contaminants can be prevented, to guarantee the projection quality of the projection arrangement 1.The Six, the molded base 150 can lead to the electronic component 123 and air exclusion after coating the electronic component 123 Such mode is crossed, the oxidation rate of the metal part of the electronic component 123 can be slowed down, is conducive to improve the electronics The environmental stability of component 123 and the projection arrangement 1.

It should be appreciated that the molded base 150 can also be formed in described in the other embodiments of the utility model The ceramic substrate outside portion 12543 of the fringe region 1254 of ceramic substrate 125, to prevent in molding process, high temperature Molding material damage the electronic component 123 because of contact or punching press due to.Certainly, the molded base 150 can also by A part in the ceramic substrate inside portion 12541 of the fringe region 1254 of the ceramic substrate 125 of type, the pottery Porcelain substrate connecting portion 12542 and the ceramic substrate outside portion 12543, to further decrease the required ceramic substrate 125 area, and then reduce the size of the projection arrangement 1.

Attached drawing 10 shows the 5th of the projection arrangement 1 of first preferred embodiment according to the present utility model Variant embodiment, wherein the lens subassembly 200 of the projection arrangement 1 further includes one being arranged at optical diffraction member The ito film 240 of part 220 and one is arranged at the metalwork 250 of the lens barrel 230, and passing through the metalwork 250 will be described Ito film 240 and the ceramic substrate 125 can be connected conductively, for being that the ito film 240 mentions by the ceramic substrate 125 For electric energy, to improve the projection quality of the grenade instrumentation 1 by the ito film 240.

Specifically, the metalwork 250 is embedded into the lens barrel 230 by interior embedding technology, and the metalwork 250 has There are one first pin and a second pin, wherein first pin of the metalwork 250 and the diffractive-optical element 220 The ito film 240 connect, the ceramic substrate of the second pin of the metalwork 250 and the ceramic substrate 125 Weld pad 1251 connects, conductively to connect the ito film 240 and the ceramic substrate 125 by the metalwork 250.With this Meanwhile the ceramic substrate weld pad 1251 being connect with the second pin by the conductive channel 1252 and with the flexibility The ceramic substrate weld pad 1251 that circuit board 123 connects can be connected conductively, so as to by the ito film 240 and the flexibility Circuit board 123 can be connected conductively.

First preferred embodiment of another aspect according to the present utility model, the utility model additionally provides a projection The manufacturing method of device.Specifically, as shown in figure 11, the projection arrangement manufacturing method comprising steps of

(a) light-emitting component 110 of a luminescence component 100 can conductively be mounted in a ceramic substrate of a circuit board 120 125；

(b) flexible circuit board 122 and the ceramic substrate 125 of the circuit board 120 are conductively connected；

(c) the attachment pedestal 130 is in the specified position of the circuit board 120, to form the luminescence component 100, Described in pedestal 130 be a steel plate, to distribute the heat from the circuit board 120 by the pedestal 130；And

(d) lens subassembly 200 is accordingly mounted in the ceramic substrate 125 of the luminescence component 100, so that described Lens subassembly 200 is located at the light emitting path of the luminescence component 100, and then a projection arrangement 1 is made.

It should be appreciated that the step (a) is not necessarily necessary in the manufacturing method of the projection arrangement of the utility model It is performed before the step (b), and need to only guarantee the step (a) and be completed before the step (d).

More specifically, as shown in figure 11, the step (b) comprising steps of

(b1) by first time Reflow Soldering, an at least electronic component 123 is welded in the ceramic substrate 125；

(b2) one tin material of coating is in flexible circuit board weld pad 1221 corresponding on the flexible circuit board 122；And

(b3) it by second of Reflow Soldering, welds corresponding on the ceramic substrate 125 to the flexible circuit board 122 Position, with corresponding described soft on the flexible circuit board 122 in a ceramic substrate weld pad 1251 of the ceramic substrate 125 A tin layers 1222 are formed between property circuit board welding pad 1221.

Preferably, in the step (b), the welding section temperature of second of Reflow Soldering flows back lower than the first time The welding section temperature of weldering.

In first preferred embodiment of the utility model, the step (c) is comprising steps of by an adhesive layer 180, the pedestal 130 is bonded in the flexible circuit board 122 of the circuit board 120, so that the flexible circuit board 122 Between the pedestal 130 and the ceramic substrate 125.

In the other embodiments of the utility model, the step (c) may include step: by an adhesive layer 180, glue The pedestal 130 is connect in the ceramic substrate 125 of the circuit board 120 so that the pedestal 130 directly with the ceramic base Plate 125 connects.

First preferred embodiment according to the present utility model, the manufacturing method of the projection arrangement further comprise the steps of:

By first time Reflow Soldering, one group of electronic component 123 is respectively welded in the default of a ceramic substrate array 124 Position；With

The ceramic substrate array 124 is cut, to form the ceramic substrate 125 for having the electronic component 123.

Another aspect according to the present utility model, as shown in figure 12, the utility model further provide a depth information The manufacturing method of device, comprising steps of

(i) light-emitting component 110 of a luminescence component 100 can conductively be mounted in a ceramic substrate of a circuit board 120 125；

(ii) flexible circuit board 122 and the ceramic substrate 125 of the circuit board 120 are conductively connected；

(iii) the attachment pedestal 130 is in the specified position of the circuit board 120, to form the luminescence component 100, Wherein the pedestal 130 is a steel plate, to distribute the heat from the circuit board 120 by the pedestal 130；

(iv) lens subassembly 200 is accordingly mounted in the ceramic substrate 125 of the luminescence component 100, so that institute The light emitting path that lens subassembly 200 is located at the luminescence component 100 is stated, and then a projection arrangement 1 is made；And

(v) projection arrangement 1, a reception device 2 and a processing system 3 are assembled, so that the projection arrangement 1 and institute Stating reception device 2 can connect with the processing system 3 with being powered, a depth information device is made, for obtaining a target pair The depth information of elephant.

With reference to shown in Figure 13 to Figure 23 of the Figure of description of the utility model, one second according to the utility model is preferable One depth information device of embodiment is elucidated with.In second preferred embodiment of the utility model, the depth information The principle that device obtains depth information is as shown in figure 13, and the projection arrangement 1A of the depth information device is generated and projected volume Code pattern or speckle pattern are into object space, so that image receiving apparatus 2 and processing system 3 are at the depth image of target, It is exactly described 3D rendering.The projection arrangement 1A is suitable for various scenes, for example, gesture identification, recognition of face, object knowledge Not, scene Recognition etc..With the development of science and technology and improvement of living standard, projection arrangement 1 be not only integrated with computer etc. compared with In large scale equipment, also gradually it is intended to be integrated in the portable miniaturized electronics such as mobile phone, to meet market opponent Multifunction, intelligence, the high performance demand of the portable electronic devices such as machine.Since planar laser with vertical cavity (VCSEL) has Have the advantages that small in size, the light source angle of departure is small, stability is good, therefore generally select VCSEL in projection arrangement as light-emitting component, To reduce whole volume, accuracy of identification is improved.However power consumption is larger at work, fever is more by VCSEL, therefore this is practical new Type improves projection arrangement structure, for the heat dissipation problem of VCSEL in projection arrangement to improve the projection group The thermal diffusivity of part and grenade instrumentation, and guarantee the stability of its electric signal.

As shown in figure 14, the projection arrangement 1A according to one second preferred embodiment of the utility model will be set forth. The projection arrangement 1A includes a luminescence component 100A and a lens subassembly 200.The lens subassembly 200 is set and is fixed on The luminescence component 100A is suitable for receiving the light beam of the luminescence component 100A sending and adjusting the light beam being suitable for producing to be formed The light beam of raw depth image, for example, the light beam with coding pattern or the light beam with speckle pattern, right in the present invention Its types of patterns is with no restrictions.

In the present embodiment, by taking the projection arrangement for forming speckle pattern as an example.The luminescence component 100A includes one luminous Element 110A, the light-emitting component 110A are implemented as a planar laser with vertical cavity (VCSEL), are suitable for generating with base light The light beam of dot pattern.The lens subassembly 200 includes that at least collimating lens 210, an at least diffractive-optical element 220 is (following Abbreviation DOE220) and a lens barrel 230, the collimation lens 210 and DOE220 be arranged in the lens barrel 230, the lens barrel 230 make the collimation lens 210 and DOE220 be held in the optical path of the luminescence component 100.The collimation lens 210 light for being suitable for issuing laser collimate, to form collimated light beam.The DOE220 is generated as beam splitter And multiple copies of basic spot pattern are projected into object space, so that image receiving apparatus and processing system form target Depth image.

Further, the luminescence component 100A further includes that circuit board a 120A, the circuit board 120A shines with described Element 110A electrical connection, to provide electricity for the light-emitting component 110A and control its luminance.The luminescence component 100A further comprises that pedestal a 130A, the circuit board 120A and the light-emitting component 110A is arranged at the pedestal 130A, the pedestal 130A is made of the good material of the thermal diffusivities such as metal, to improve the heat dissipation performance of the projection arrangement. It should be appreciated that the circuit board 120A may be implemented as various existing circuit boards (such as wiring board, pcb board, aluminum substrate or High frequency plate etc.), it is not limited in the present embodiment.

Since the heating conduction of traditional circuit board material is poor, in order to further improve dissipating for the projection arrangement 1A Hot property, in second preferred embodiment of the utility model, as shown in figure 14, the electricity of the luminescence component 100A Road plate 120A has fluting design, that is to say, that the circuit board 120A has one to be suitable for accommodating the light-emitting component 110A's Be open 121A, and the opening 121A is the opening of a through-hole type, that is to say, that is arranged at the described of the circuit board 120A and opens The light-emitting component 110A in mouth 121A, bottom is directly contacted with the pedestal 130A, so that the light-emitting component The thermal energy that 110A is issued directly is transferred to external environment by the pedestal 130A, thus further improves the projection arrangement The heat dissipation performance of 1A avoids generating temperature drift phenomenon since temperature is excessively high during its work, even results in the lens The eyeglass of component 200 since high temperature is deformed or causes other structures (such as circuit etc.) since high temperature fails, thus Improve service life and the stability of the projection arrangement 1A.It will be appreciated by those skilled in the art that due to the circuit board 120A It is designed with fluting, the light-emitting component 110A is enabled directly to be mounted on the pedestal 130A, to pass through the pedestal 130A distributes the heat that the light-emitting component 110A is generated, therefore the circuit board 120A in second preferred embodiment Selection is not just limited and is influenced by the heating conduction of circuit board, that is to say, that the circuit board 120A, which can choose, such as to make pottery Porcelain substrate or the like has the circuit board of Thermal conductivity, and it is poor also to can choose such as pcb board etc. heating conduction Circuit board.

Generally, the light-emitting component 110A of VCSEL includes a top electrodes 111A (pole P, anode) and bottom electricity Pole 112A (pole N, cathode), therefore in existing technology, the anode 111A of the light-emitting component 110A passes through a lead 126A is electrically connected to the circuit board 120A, and the cathode 112A of the light-emitting component 110A passes through pedestal made of metal 130A is electrically connected to circuit board 120A, but in this type of design, since the surface area of the pedestal 120A is larger, thus described The negative signal of light-emitting component 110A will be radiated to external environment by pedestal 130A, which will affect the depth letter Cease the work of other components of device.Meanwhile the pedestal 130A will also be used as a signal receiver, receive and come from other The radiation signal of electronic component, to influence the work of the light-emitting component 110A.

The considerations of for the above problem, attached drawing 15 show the institute of second preferred embodiment according to the present utility model One first variant embodiment of projection arrangement 1A is stated, wherein the pedestal 130A of the projection arrangement 1A includes one first Pedestal 131A and second base a 132A, the first base 131A are supported on the second base 132A, the luminous member Part 110A is installed in the first base 131A, and the bottom electrode 112A of the light-emitting component 110A passes through described the One pedestal 131A is electrically connected to the circuit board 120A.On the other hand, the second base 132A is electrically connected to the circuit board The zero potential point of 120A, so that the second base 132A is by the zero potential electrode as entire circuit, that is, ground level, it is described Second base 120A can also be contacted with the shell of the depth information device, to achieve the effect that ground connection, that is to say, that this reality The effect by a metal shell to be grounded is no longer needed to the grenade instrumentation 1A in novel.Only by connecting with circuit earth polar Circuit ground can be realized in the second base 132A connect, to be reduced the size of the grenade instrumentation 1A, and can be with Achieve the effect that electromagnetic shielding, prevent the interference of outer signals, improves the stability of the projection arrangement 1A.

Further, an insulating layer 133A is equipped between the first base 131A and the second base 132A, thus So that the cathode 112A of the light-emitting component 110A is isolated with circuit earth polar, short circuit is prevented.It is noted that such as Shown in Figure 15, the surface area of the first base 131A is less than the second base 132A, thus reduces signal amplitude above-mentioned The risk penetrated.

Specifically, conductive material is set between the light-emitting component 110A and the first base 131A, described in realization Being electrically connected between the cathode 131A and the first base 131A of light-emitting component 110A.For example, the electric conductivity such as tin cream and The good material of thermal conductivity.It is understood that the conductive materials such as conductive silver glue also can be used.The first base 131A's Upper surface, which has, to be suitable for installing the light-emitting component 110A shape.Normally, the light-emitting component 110A is arranged to rectangular, therefore In one embodiment of the utility model, the light-emitting component 110A is rectangular with the first base 131A.

It is understood that as needed, the light-emitting component 110A can also be arranged to the first base 131A Other shapes.The assembly of the light-emitting component 110A and first base 131A is housed inside the institute of the circuit board 120A It states in opening 121A, so that the opening 121A, which has, is suitable for accommodating the light-emitting component 110A's and first base 131A Shape.Therefore in the present embodiment, the shape of the opening 131A is also square, and is installed on the hair of the first base 131A The upper surface of optical element 110A can be higher than the upper surface of the circuit board 120A, can also be parallel or below the circuit board The upper surface of 120A, depending on the thickness of the first base 131A and the thickness of the light-emitting component 110A.

Preferably, the area of the upper surface of the first base 131A is equal or slightly larger than the bottom of the light-emitting component 110A Area improves radiating efficiency so that the contact area of the two be made to reach maximum.

Further, in first embodiment of second preferred embodiment of the utility model, such as scheme Shown in 15, by pre-seting a conduct piece 140A in the side the first base 131A or bottom surface, for example, tin cream, will be equipped with institute State conduct piece 140A the first base 131A be installed on the opening 121A of the circuit board 120A after, pass through Reflow Soldering Etc. suitable technique, so that tin cream melts, so that the side or bottom of the first base 131A Yu the circuit board 120A be connected Face solder joint, to realize being electrically connected between the cathode 112A of the light-emitting component 110A and the circuit board 120A.Ability Domain personnel are it is understood that the conduct piece 140A can also be predisposed at the opening 121A of the circuit board 120A At side or bottom surface solder joint.The conduct piece 140A also may be implemented as other conductive materials such as conductive silver glue.

Attached drawing 16 shows the one of the projection arrangement 1A of second preferred embodiment according to the present utility model Two variant embodiments, wherein can be realized by lead 126A between the first base 131A and the circuit board 120A Electrical connection, that is to say, that the surface area of the upper surface of the first base 131A is at least greater than the light-emitting component 110A, and So that there is enough spaces to be electrically connected to the first base 131A for one end of the lead 126A, and make the lead 126A is able to reach the circuit board 120A by the opening 121A, so that its other end is able to and the circuit board 120A electricity Connection.

It is attached that Figure 17 shows the one of the projection arrangement 1A of second preferred embodiment according to the present utility model Three variant embodiments, wherein the first base 131A is embedded in the opening 121A of the circuit board 120A, it is described Gap between pedestal 131A and the circuit board 120A is filled by a dielectric layer 150A, in the present embodiment the conduct piece 140A forms a layers of copper 160A in the circuit board 120A, the first base 131A and the dielectric by modes such as copper sputters The upper surface of layer 150A, to realize being electrically connected between the circuit board 120A and the first base 131A.In this implementation In example, the upper surface of the first base 131A is preferably flush to the upper surface of the circuit board 120A.

Specifically, in the present embodiment, the erection sequence of the pedestal 130A and the circuit board 120A are: first will The circuit board 120A is installed on the second base 132A, realizes the second base 132A by tin cream, conductive silver glue etc. Being electrically connected between the zero potential point of the circuit board 120A, then the first base 131A on the second base 132A Installation region the insulating layer 133A is set, then the first base 131A is installed on the institute equipped with the insulating layer 133A It states on second base 132A.It is understood that the erection sequence is also possible to assemble and fix described first on a substrate The pedestal 131A and circuit board 120A, is being installed on the second base 132A for the assembly.

Further, the lens barrel 230 is installed in the circuit board 120A, thus by the collimation lens 210 and institute State the beam path that DOE220 is held in the luminescence component 100A.Since the pedestal 130A is in the bottom of the circuit board 120A Portion provides support for the circuit board, to strengthen the structural strength of the circuit board 120A, prevents the circuit board 120A By being bent after extraneous stress, to influence to project quality.Further, since the pedestal 130A by metal etc. have it is high-intensitive, The material of high-flatness is made, to improve the flatness of the circuit board 120A, thereby reduces the peace of the lens barrel 230 Difficulty is filled, the projection quality of the grenade instrumentation 1A is further improved.

Attached drawing 18 shows the one of the projection arrangement 1A of second preferred embodiment according to the present utility model Four variant embodiments.With described first of attached second preferred embodiment according to the present utility model shown in figure 15 Variant embodiment is compared, in the 4th variant embodiment of second preferred embodiment according to the present utility model The projection arrangement 1A, in addition to the pedestal 130A of the projection arrangement 1A the second base 132A structure Except difference, the other structures of the projection arrangement 1A are described with second preferred embodiment according to the present utility model Projection arrangement 1 in first variant embodiment is identical.

Specifically, the second base 132A of the projection arrangement 1A includes a base body 1321A and a protrusion 1322A, the base body 1321A are in a tabular, described for supporting the circuit board 120A and first base 131A The periphery of protrusion 1322A from the base body 1321A integrally upwardly extend, wherein the upper table of the protrusion 1322A The shapes and sizes in face can be adapted to the lens barrel 230, therefore in the present embodiment, and the lens barrel 230 is installed in described The protrusion 1322A of second base 132A, due to for installing the light-emitting component 110A the first base 131A with The protrusion 1322A for installing the lens barrel 230 has metal material to be made up of the suitable technique such as punching press, to guarantee The depth of parallelism between the mounting surface of the first base 131A and the surface of the protrusion 1322A, therefore can guarantee institute The optical axis of lens subassembly 230 and the optical axis keeping parallelism of the luminescence component 100A are stated, to improve the projection arrangement 1A Projection quality, and reduce the assembling difficulty of the projection arrangement 1A.

Attached drawing 19A shows the described of the projection arrangement 1A of second preferred embodiment according to the present utility model One first alternate embodiments of first base 131A.As shown in Figure 19 A, in the first substitution embodiment party of the utility model In formula, preferably in fact in addition to the structure of the first base 131A of the pedestal 130A and according to the present utility model described second Except the structure difference for applying the first base 131A in the projection arrangement 1A of example, other knots of the projection arrangement 1A Structure is identical as the projection arrangement 1A of second preferred embodiment according to the present utility model, therefore the projection arrangement Details are not described herein for the other structures of 1A.

Specifically, the first base 131A includes an a light-emitting component support portion 1311A and at least extension 1312A. The light-emitting component support portion 1311A is arranged at the opening 121A of the circuit board 120A, for supporting and being electrically connected The cathode 112A of the light-emitting component 110A, each extension 1312A are integrally outside from the support portion 1311A Extend, to form centrosymmetric shape, so that the circuit board 120A is stably supported described in the pedestal 130A The extension 1312A of first base 131A, to realize the purpose of the padded circuit board 120A.

Citing ground, as shown in Figure 19 A, the extension 1312A is respectively from the quadrangle of the light-emitting component support portion 1311A Same length is extended out to, and the circuit board 120A is supported on the first base 131A.The extension as a result, The uniform shapes of 1312A are able to guarantee the flatness of the circuit board 120A, that is to say, that the extension 1312A is able to uniformly The padded circuit board 120A.In this alternate embodiments, the first base 131A by the extension 1312A with The circuit board 120A electrical connection, that is to say, that the conduct piece 140A is arranged at the extension 1312A and the circuit Between plate 120A.It is understood that in the other embodiments of the utility model, the position of the conduct piece 140A can also be with It is identical as the position of conduct piece 140A described in second preferred embodiment, that is, is located at the light-emitting component support portion Between 1311A and circuit board 120A.

Attached drawing 19B shows the described of the projection arrangement 1A of second preferred embodiment according to the present utility model One second alternate embodiments of first base 131A, wherein four extension 1312A are from the light-emitting component support portion The four side midpoints of 1311A extend to same length, to guarantee the flatness of the circuit board 120A, that is to say, that the extension Portion 1312A is able to the uniform padded circuit board 120A.

Attached drawing 19C shows the described of the projection arrangement 1A of second preferred embodiment according to the present utility model A third alternate embodiments of first base 131A, wherein the first base 131A further includes a lens barrel support portion 1313A, The lens barrel support portion 1313A and light-emitting component support portion 1311A is integrally connected by two extension 1312A It connects, the lens barrel 230 is installed in the lens barrel support portion 1313A.

Preferably, lens barrel support portion 1313A structure annular in shape, to be surrounded on the outside of the circuit board 120A, That is the circuit board 120A is embedded in the first base 131A.At the same time, the institute in this alternate embodiments First base 131A is stated to further improve between the mounting surface of the lens barrel 230 and the mounting surface of the light-emitting component 110A The depth of parallelism.

Attached drawing 19D shows the described of the projection arrangement 1A of second preferred embodiment according to the present utility model A third alternate embodiments of first base 131A, wherein the first base 131A only has the extension 1312A, to be integrally connected the lens barrel support portion 1313A and light-emitting component support by an extension 1312 Portion 1311A, with the structure of the simplification first base 131A.

Attached drawing 20 shows the one of the projection arrangement 1A of second preferred embodiment according to the present utility model Five variant embodiments.Compared to second deformation implementation of second preferred embodiment according to the present utility model Mode, the projection arrangement 1A in this variant embodiment is other than the structure of the circuit board 120A is different, the throwing Remaining structure of image device 1A all can refer to second deformation of second preferred embodiment according to the present utility model Embodiment, details are not described herein.

Specifically, as shown in figure 20, the circuit board 120A packet of the luminescence component 100A of the projection arrangement 1A Include a flexible circuit board 122A and a hard circuit board 125A, wherein the hard circuit board 125A by a tin layers 1222A with The flexible circuit board 122A can be connected conductively, and the hard circuit board 125A and the flexible circuit board 122A are opened Equipped with a through-hole, to form the electricity when the hard circuit board 125A is mounted on together with the flexible circuit board 122A The opening 121A of road plate 120A, to accommodate the light-emitting component 110A.

It is noted that the flexible circuit board 122A is arranged at the pedestal 130A and the hard circuit board Between 125A, so that the one side of the flexible circuit board 122A is attached at the pedestal 130A.Since the pedestal 130A is excellent It is selected as the good heat dissipations such as metal and smooth material, therefore to be supplied to the flexible circuit board 122A mono- smooth by the pedestal 130A Face, bends or warped to prevent the flexible circuit board 122A.Further, since the hard circuit board 125A can be also supplied to The smooth reference for installation of the lens subassembly 230 1, to guarantee that the lens subassembly 230 is located at the luminescence component 100A's Light emitting path.

Preferably, the hard circuit board 125A is implemented as a ceramic substrate 125A, below with the ceramic substrate 125A replaces hard circuit board 125A to be described.The ceramic substrate 125A generally refers to copper foil and is bonded directly at high temperature Special process plate on aluminium oxide (Al2O3) or aluminium nitride (AlN) ceramic substrate surface (single or double).Made is ultra-thin Composite substrate has good electrical insulation performance, high thermal conductivity characteristic, excellent solderability and high adhesive strength, and can be as PCB Plate is the same to etch various figures, have very big current-carrying capability.Present projective module group and the extensive of camera module make For the circuit board used by resin and reinforcing material as baseplate material, the heat dissipation performance of such material is generally bad.In high frequency camera shooting Mould group, in structured light projection module packaging field, due to producing a large amount of heat when electronic component work, based on resin base material Heat dissipation for circuit board is unable to satisfy requirement.Therefore pcb board is not able to satisfy increasingly in the big electronic package of present heat dissipation capacity. At work because after accumulation of heat, it is easy to cause light-emitting component, optical element such as eyeglass etc. deformation or performance change Situation, to influence service life and the stability of the projection arrangement.

By taking the ceramic substrate 125A of aluminium nitride material as an example, aluminum nitride ceramic substrate has thermally conductive greater than 170W/ (m.K) Coefficient, and by taking the made pcb board of epoxide resin material as an example, the pcb board thermal coefficient of epoxide resin material is generally in 0.2- In 0.8W/ (m.K) range, therefore aluminum nitride ceramic substrate has good heating conduction compared to the pcb board of epoxide resin material.

Due to ceramic substrate 125A have very high flatness, and the flatness of flexible circuit board 122A be not it is very high, because If this by the ceramic substrate 125A prior to flexible circuit board 122A connection after, then electronic component 123A is installed, is easy because of institute State flexible circuit board 122A out-of-flatness that may be present and caused by electronic component 123A the case where attaching inclination.

In order to guarantee the installation accuracy of the electronic component 123A, and also to improve the group of the circuit board 120A Efficiency is filled, the utility model proposes the technical solutions for assembling the ceramic substrate 125A and the flexible circuit board 122A.Such as figure Shown in 21, the assemble method of the circuit board 120A comprising steps of

(A) an electronic component 123A is welded in a ceramic substrate array 124A by first time Reflow Soldering；

(B) the ceramic substrate array 124A is cut, to form individual ceramic substrate 125A；

(C) the corresponding flexible circuit board weld pad 1221 of 122A coats a tin cream on a flexible circuit board；And

(D) the ceramic substrate 125A is attached to the specified position of the flexible circuit board 122A, and is passed through second The tin cream is melted in Reflow Soldering, to form a tin layers between the ceramic substrate 125A and the flexible circuit board 122A 1222, so that the ceramic substrate 125A and the flexible circuit board 122A are connect switched only.

It is worth noting that, the ceramic substrate array 124A can be first to offer and pass through up and down in the step (A) The ceramic substrate 125A for opening up mouthful 121A is also possible to not offer the ceramic substrate of opening 121A up and down in advance 125A.Dotted line on attached drawing 21 indicates position and the shape of the opening 121A, and dotted line indicates that the opening 121A can have Can nothing, and the order for opening up the opening 121A step will not influence the beneficial effect of assemble method described in the present embodiment, That is the step of opening up the opening 121A can be before or after appealing arbitrary steps.

Preferably, for the temperature range of the welding section of the first time Reflow Soldering at 183~300 DEG C, the time is 10~120 Second；For the welding section temperature range of second of Reflow Soldering at 183~300 DEG C, the time is 10~120 seconds.

It is highly preferred that the welding section temperature of second of Reflow Soldering is preferably set to compare in the step (D) The welding section temperature of step (A) first time Reflow Soldering wants low temperature.Citing ground, flows back for the first time described in the step (A) Weldering uses a lead-free tin cream, and the lead-free tin cream fusing point is at 217 DEG C, then second of Reflow Soldering is preferably used than 217 DEG C low tin cream material is relatively good, for example one has Pb-Sn paste (wherein the content of tin is 63%, and the content of lead is 37%, fusing point It is 183 DEG C) so that the welding section temperature of second of Reflow Soldering is at 183 DEG C, it is sufficient to have Pb-Sn paste thawing described in making After the scolding tin that welds, and first time welding will not be made to have been cured melts the appearance electronic component 123 again and warps The phenomenon that.The welding section temperature of Reflow Soldering in the utility model refers to making tin cream thawing in general reflow soldering process process Temperature region.

The ceramic substrate 125A, the tin layers 1222A and the flexible circuit board have been obtained by above-mentioned assemble method The structure of 122A, to realize that the ceramic substrate 125A and flexible circuit board 122A electrically connects by the tin layers 1222A The effect connect, that is to say, that the tin layers 1222A is as the ceramic substrate weld pad 1251A and the flexible circuit board weld pad 1221A connection needs conducting medium.It will be appreciated by those skilled in the art that in the prior art, the ceramic substrate 125A is logical ACF glue is crossed to be attached with the flexible circuit board 122A, because the ACF glue is coated by the way of adhesive tape, pressure and add Temperature bonding, adhesive tape itself have well-regulated size and thickness control, the bond area of ACF adhesive tape are also required in technique.Therefore The weld pad design of corresponding ceramic substrate and flexible circuit board also requires to be regular design, can just play good cementability in this way And turn-on effect.

However, it is more for certain weld pads and in the case that solder pad arrangement is complicated, institute is difficult to realize using the technique of ACF glue State the effect of ceramic substrate 125A and the excellent connection of flexible circuit board 122A.The utility model is first existed using reflow soldering process 124A installs the electronic component 123A on the ceramic substrate array, wherein the electronic component 123A may include one As capacitor, outside resistance, can also include this kind of light-emitting component of such as VCSEL, be realized on the ceramic substrate array 124A Then monomer ceramic substrate 125A after cutting is mounted on the flexible circuit board by the installation of the electronic component 123A 122A is upper can to greatly improve process efficiency, realize the assembling flow path of batch type.

Heating conduction relatively on, tin material selected by Reflow Soldering is better than the heating conduction of ACF glue, due to ACF glue Filler mainly have epoxy resin and acrylic material, the thermal coefficient of both materials generally at 0.19-0.8W/ (m.K), And the thermal coefficient of tin is in the left and right 67W/ (m.K).Process flow in through this embodiment, be made mainly played by tin it is described The connection function of hard circuit board 125A and the flexible circuit board 122A, tin is as the preferable medium of thermal coefficient, Neng Gougeng The heat of generation is transmitted fastly, it is thus possible to which there is good heat dissipation performance.

As shown in fig. 22, according to the described of the projection arrangement 1A of second preferred embodiment of the utility model The structure of circuit board 120A described in 5th variant embodiment will be elucidated with, wherein the hard of the circuit board 120A Circuit board 125A in turn ensures that enough connections are strong while electric connection by the tin layers 1222A and flexible circuit board 122A Degree, and it is previously provided with an opening up and down in the hard circuit board 121A and the flexible circuit board 122A, with shape At the opening 121A of the circuit board 120A, so that the opening 121A is suitable for accommodating the light-emitting component 110A.

Attached drawing 22B shows the described of the projection arrangement 1A of second preferred embodiment according to the present utility model One first alternate embodiments of circuit board 120A described in 5th variant embodiment, wherein the hard circuit board 125A It is conductively connect by the tin layers 1222A with the flexible circuit board 122A, and in the hard circuit board 121A and institute It states flexible circuit board 122A and is not previously provided with an opening up and down.Therefore, can in the hard circuit board 121A and The flexible circuit board 122A links together and then on the hard circuit board 121A and the flexible circuit board 122A Through-hole up and down is set, to form the opening 121A of the circuit board 120A, so that the opening 121A is suitable for holding Receive the light-emitting component 110A.

Attached drawing 22C shows the described of the projection arrangement 1A of second preferred embodiment according to the present utility model One second alternate embodiments of circuit board 120A described in 5th variant embodiment, wherein the hard circuit board 125A One end of the hard circuit board 125A is connected to by the tin layers 1222A and the flexible circuit board 122A, and described Flexible circuit board 122A is attached at the downside of the hard circuit board 125A, wherein in the another of the hard circuit board 125A End offers the opening of a perforation, to form the opening 121A of the circuit board 130A.It should be appreciated that in the circuit board In second alternate embodiments of 120A, it is not necessarily in the flexible circuit board 122A upper opening, to protect the flexibility The integrality of the internal circuit of circuit board 122C, so that the flexible circuit board 122A only conveys electronic signal as to terminal Effect.

Attached drawing 22D shows the described of the projection arrangement 1A of second preferred embodiment according to the present utility model A third alternate embodiments of circuit board 120A described in 5th variant embodiment, wherein the flexible circuit board 122A It is attached at the upside of the hard circuit board 125A.

Attached drawing 23 shows the one of the projection arrangement 1A of second preferred embodiment according to the present utility model Six variant embodiments, wherein the luminescence component 100A of the projection arrangement 1A is in addition to including the light-emitting component Except 110A, the circuit board 120A and the pedestal 130A, a molded base 150A is still further comprised.The molded base 150A is formed in the upper surface of the circuit board 120A, by molding process integrally in conjunction with the circuit board 120A and by The electronic component 123A being set on the circuit board 120A (can be control chip, capacitor, resistance, crystal oscillator as needed Equal components).

Preferably, the molded base 150A is formed in after the second base 131A is in conjunction with the circuit board 120A The upper surface the circuit board 120A, thus the second base 131A is the circuit board when forming the molded base 150A 120A provides support, prevents it from being bent, deforming by the stress of the molding material of high temperature.

Further, the molded base 150A has a light hole 151A, wherein the light hole 151A and the electricity The opening 121A and the light-emitting component 110A of road plate 120A is corresponding, so that the light-emitting component 110A was issued Light beam is able to reach the lens subassembly 200 by the light hole 151A.

It is highly preferred that the length and width dimensions of the light hole 151A of the molded base 150A are greater than the circuit board 120A The opening 121A, and make not described to be electrically connected the weld pad of the light-emitting component 110A on the circuit board 120A Molded base 150A covering, so that the weld pad is shone by way of playing lead with described after forming the molded base 150A Element 120A electrical connection, that is to say, that the light-emitting component 110A is installed on described again after forming the molded base 150A First base 132A, to prevent damaging or polluting the light-emitting component 110A during molded base 150A is molding.

In the 6th variant embodiment, the lens barrel 230 is installed in the upper table of the molded base 150A Face, on the one hand, due to the molded base 150A flatness with higher, so that the installation for reducing the lens barrel 230 is difficult Degree, ensure that the depth of parallelism between the optical axis of the lens subassembly 200 and the optical axis of the luminescence component 100A；On the other hand, The molded base 150A intensity with higher mentions to further strengthen the structural strength of the circuit board 120A The stability of the projection arrangement 1A is risen.

It should be understood by those skilled in the art that foregoing description and the embodiments of the present invention shown in the drawings are only used as It illustrates and is not intended to limit the utility model.The purpose of this utility model completely and effectively realizes.The function of the utility model Energy and structural principle show and illustrate in embodiment, under without departing from the principle, the embodiments of the present invention Can there are any deformation or modification.

Claims

1. a projection arrangement characterized by comprising

One luminescence component, wherein the luminescence component includes:

One circuit board, wherein the circuit board has the opening of a through-hole type；

One light-emitting component, wherein the light-emitting component is arranged at the opening of the circuit board, and the light-emitting component It can conductively be connect with the circuit board, for issuing a light beam；And

The light-emitting component wherein the pedestal is mounted on the circuit board, and is directly mounted on the pedestal by one pedestal, Wherein the pedestal is made of metal material, directly to distribute the heat that the light-emitting component generates by the pedestal；With

One lens subassembly, wherein the lens subassembly is arranged at the light emitting path of the luminescence component, for adjusting the hair The light beam that optical element is issued.

2. projection arrangement as described in claim 1, wherein the pedestal includes that a first base, a second base and one are exhausted Edge layer wherein the insulating layer is arranged between the first base and the second base, and the light-emitting component is pacified Loaded on the first base.

3. projection arrangement as claimed in claim 2, wherein the light-emitting component is mounted on described by a conductive silver glue-line First base, and the first base can conductively be connect with the circuit board, wherein the bottom electricity of the light-emitting component Pole can conductively be connect by the first base with the circuit board, and a top electrodes of the light-emitting component pass through one Lead can conductively be connect with the circuit board.

4. projection arrangement as claimed in claim 3, wherein the first base of the pedestal is embedded in the circuit board The opening, and the first base can be connect with the circuit board by a conduct piece with being powered, wherein the pedestal The second base be set to support the circuit board.

5. projection arrangement as claimed in claim 4, wherein the second base can conductively be connect with the circuit board, with Make an earthing pole of the second base as the projection arrangement.

6. projection arrangement as claimed in claim 5, wherein the second base includes a base body and a protrusion, Described in base body be in a tabular, to support the circuit board and the first base, wherein the protrusion from described in The periphery of base body integrally upwardly extends, and the lens subassembly is installed in the protrusion.

7. projection arrangement as claimed in claim 5, wherein the first base of the pedestal is supported including a light-emitting component Portion and at least an extension, wherein the light-emitting component support zone is in the opening of the circuit board, and the hair Optical element is mounted on the light-emitting component support portion, wherein each extension is from the support portion integrally to extension It stretches, to support the circuit board.

8. projection arrangement as claimed in claim 7, wherein the first base further includes a lens barrel support portion, wherein described Lens barrel support portion is integrally connected with the light-emitting component support portion by the extension, and the lens subassembly is mounted In the lens barrel support portion.

9. the projection arrangement as described in any in claim 1~8, wherein the circuit board is that a hard circuit board or one are soft Property circuit board.

10. the projection arrangement as described in any in claim 1~8, wherein the circuit board includes a hard circuit board and one The flexible circuit board that can be conductively connect with the hard circuit board, wherein the flexible circuit board is located at the hard circuit board Between the pedestal, and the opening of the circuit board is formed on the hard circuit board and the flexible circuit Plate, the pedestal are attached at the flexible circuit board by an adhesive layer.

11. the projection arrangement as described in any in claim 1~8, wherein the circuit board includes a hard circuit board and one The flexible circuit board that can be conductively connect with the hard circuit board, wherein the flexible circuit board and the pedestal are by compartment of terrain It is set to the bottom side of the hard circuit board, wherein the opening of the circuit board is formed on the hard circuit board, institute It states pedestal and the hard circuit board is directly mounted on by an adhesive layer.

12. the projection arrangement as described in any in claim 1~8, wherein the circuit board includes a hard circuit board and one The flexible circuit board that can be conductively connect with the hard circuit board, wherein the flexible circuit board and the pedestal are located at The opposite side of the hard circuit board, wherein the opening of the circuit board is formed on the hard circuit board, and institute It states pedestal and the hard circuit board is directly mounted on by an adhesive layer.

13. projection arrangement as claimed in claim 10, wherein the lens subassembly includes collimating lens, an optical diffraction Element and a lens barrel, wherein the collimation lens and the diffractive-optical element are arranged at the lens barrel, and the mirror Cylinder is installed in a fringe region of the hard circuit board, to guarantee that the collimation lens and the diffractive-optical element are located at The light emitting path of the light-emitting component.

14. projection arrangement as claimed in claim 10, wherein the luminescence component further includes a molded base, wherein described Molded base is formed in a fringe region of the hard circuit board, and the molded base has one and the luminous member The corresponding light hole of part, wherein the lens subassembly is installed in the molded base.

15. projection arrangement as claimed in claim 14, wherein the luminescence component further includes one group of electronic component, wherein The electronic component is positioned apart from the fringe region in the hard circuit board, so that the molded base packet Wrap the electronic component for being arranged at the fringe region of the hard circuit board.

16. projection arrangement as claimed in claim 10, wherein the lens subassembly further includes an ito film and a metalwork, Described in ito film be arranged at the diffractive-optical element, the metalwork is set conductively to connect the ito film and institute State hard circuit board.

17. a depth information device characterized by comprising

Projection arrangement as described in any in claim 1~16, wherein the projection arrangement is for projecting a light beam a to mesh Mark object；With

An at least reception device, wherein the reception device is used to receive the light beam being transmitted back to through the target object, for obtaining The depth information of the target object.