CN110913565A - Circuit board device capable of dissipating heat and heat dissipation method and manufacturing method thereof - Google Patents
Circuit board device capable of dissipating heat and heat dissipation method and manufacturing method thereof Download PDFInfo
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- CN110913565A CN110913565A CN201910592996.2A CN201910592996A CN110913565A CN 110913565 A CN110913565 A CN 110913565A CN 201910592996 A CN201910592996 A CN 201910592996A CN 110913565 A CN110913565 A CN 110913565A
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Abstract
A circuit board device capable of dissipating heat and a heat dissipation method and a manufacturing method thereof are provided, the device comprises a circuit board main body, the circuit board main body is provided with a heat dissipation cavity; a chip component electrically connected to the circuit board main body; and a heat sink having an end portion extended into the heat dissipation chamber to be connected to the chip component for conducting heat of the chip component to the outside.
Description
Technical Field
The invention relates to a circuit board device, in particular to a circuit board device capable of radiating and applied to a projection module, a radiating method and a manufacturing method thereof.
Background
With the development of digital technology, mobile platform products such as mobile phones and tablets are continuously and deeply researched, the newly researched camera module has insufficient new functions, the most attractive electronic product belongs to a 3D projection module, the 3D projection module can change the current life style, and the field of the camera module is brought to another height by the 3D projection module. The 3D projection module is widely applied to the field of mobile phones or tablet computers, and a user can take 3D pictures or 3D images through the mobile phones or the tablet computers, so that the function application of the mobile phones or the tablet computers is continuously improved, and the pursuit of people on digital science and technology is met. In the modern day of the advanced technological level, the mobile phone or tablet computer with the 3D projection module will have stronger competitiveness.
When the 3D projection function is realized, a laser emitter (Vcsel) is adopted as a projection light source, the directions of current and emitted light beams generated by the laser emitter are perpendicular to the surface of a chip, and meanwhile, the laser emitter has the characteristics of large output power, low laser speckle effect and the like, so that a unique solution is provided for 3D imaging. However, the working state of large current and high power causes the laser emitter to generate large amount of heat while projecting the light source, which results in serious heat generation of the projection module. Therefore, after the projection module is used for a period of time, the working temperature of the projection module exceeds the rated temperature, so that the projection module cannot continue to work stably, once the temperature of the projection module is too high, the imaging definition of the projection module is influenced, and even the internal components of the projection module are damaged.
Epoxy resin is used as a material of a circuit board of the common projection module, the epoxy resin is a poor heat conductor, and heat generated by the operation of a chip fixed on the circuit board cannot be effectively conducted to the outside through the epoxy resin. Because the projection module is a confined environment, once the heat that produces in the projection module can't conduct the outside through peripheral material, the temperature of projection module in high frequency operating condition will sharply rise, surpass rated temperature, hinder projection module's normal use. Simultaneously, realize attached (DA) of chip through glue between traditional chip and the circuit board, the DA of use glues and does not have good heat conductivity, and on the chip heat was difficult to conduct the circuit board even, even the circuit board material can heat conduction, DA glues and also can make the heat gathering in the chip and can't get rid of for the operating temperature of chip rises more fast.
On the other hand, the conventional circuit board is a printed circuit board, that is, a PCB, and because the hardness of the PCB is poor, the PCB is easily deformed seriously after a reflow soldering process, which reduces the smoothness of the circuit board, resulting in that the soldering application of the chip and the circuit board is limited. In order to increase the hardness and the smoothness of the circuit board, a reinforcing plate is often added to the bottom layer of the circuit board, wherein the reinforcing layer and the circuit board are usually connected by windowing the bottom layer of the circuit board and conducting the reinforcing plate and the bonding pad with conductive adhesive, but the resistance of the conductive adhesive generally reaches 3 Ω, so that the heat productivity of a large-current circuit is increased, the energy loss is further increased, and the heat dissipation effect of the projection module is unsatisfactory. Therefore, how to effectively solve the heat dissipation problem of products in the structured light technology optical field such as projection modules and the like and the flatness problem of circuit board deformation becomes a great challenge for relevant manufacturers,
disclosure of Invention
The invention mainly aims to provide a circuit board device capable of dissipating heat, a heat dissipation method and a manufacturing method thereof.
Another object of the present invention is to provide a circuit board device capable of dissipating heat, a heat dissipating method and a manufacturing method thereof, in which the reinforcing of the heat dissipating member can enhance the overall strength of the circuit board device, effectively solve the problem of high temperature deformation of the circuit board, and improve the flatness of the circuit board device, in other words, the heat dissipating member can help the circuit board device dissipate heat while maintaining the flatness thereof.
Another objective of the present invention is to provide a circuit board device capable of dissipating heat, a heat dissipating method and a manufacturing method thereof, wherein the heat dissipating member can dissipate the heat generated by the chip component in time, and the medium passing through the heat dissipating member is efficiently led out to the outside, so as to reduce the temperature of the chip component, and the circuit board device is suitable for effective heat dissipation of a projection module.
Another objective of the present invention is to provide a circuit board device capable of dissipating heat, a heat dissipating method thereof, and a manufacturing method thereof, wherein the circuit board device includes a circuit board main body, and the circuit board main body provides a butt space for the chip component and the heat dissipating member, so that the chip component can transfer heat in a heat generating region to the heat dissipating member, thereby facilitating efficient conduction of heat generated by a projection light source, and being suitable for solving the heat dissipating problem in the structured light technology.
Another object of the present invention is to provide a circuit board device capable of dissipating heat, a heat dissipating method and a manufacturing method thereof, which can solder the chip component and the heat dissipating member by the good thermal conductivity of the solder material, thereby preventing the internal temperature from being too high due to the use of D/a glue, and facilitating to accelerate the heat conduction speed between the chip component and the heat dissipating member.
Another object of the present invention is to provide a circuit board device capable of dissipating heat, a heat dissipating method and a manufacturing method thereof, wherein the soldering method employs a symmetrical pad design, so as to reduce the uncontrollable over-reflow soldering of the solder material, thereby contributing to reducing the offset of the chip component during the attachment.
Another objective of the present invention is to provide a circuit board device capable of dissipating heat, a heat dissipating method thereof, and a manufacturing method thereof, wherein a conductive layer is used to directly connect the heat dissipating member and a pad circuit in the circuit board device, thereby effectively avoiding the problem of high impedance caused by using a conductive adhesive to connect the pad.
Another object of the present invention is to provide a circuit board device capable of dissipating heat, a heat dissipating method and a manufacturing method thereof, in which complicated mechanical manufacturing steps and devices are not required, and the original structure of the circuit board is not significantly changed, thereby reducing the related manufacturing cost.
Therefore, in order to achieve the above mentioned object, the present invention provides a circuit board device capable of dissipating heat, comprising a circuit board main body, wherein the circuit board main body is provided with a heat dissipation cavity; a chip member electrically coupled to the wiring board body; and a heat sink having an end portion extended into the heat dissipation chamber and connected to the chip component for conducting heat of the chip component to the outside.
According to an embodiment of the present invention, the heat sink includes a guide portion and an extension portion, the guide portion integrally extends from the extension portion to the chip component for abutting against the chip component, and the extension portion is attached to the circuit board main body.
According to one embodiment of the present invention, the diameter of the heat sink guide portion is matched to the inner diameter of the heat dissipation cavity of the board main body for the guide portion to abut against the chip component through the heat dissipation cavity.
According to an embodiment of the invention, the extension portion of the heat dissipation member overlaps a base of the circuit board body to expand a heat dissipation area of the heat dissipation member and reinforce the base of the circuit board body, wherein the heat dissipation cavity is formed in the base.
According to an embodiment of the invention, the heat-dissipatable circuit board device further includes at least one attaching layer, and the attaching layers are respectively disposed between the chip component, the heat-dissipatable member and the circuit board main body, so as to attach the chip component, the heat-dissipatable member and the circuit board main body.
According to an embodiment of the present invention, the attachment layer includes a first attachment layer and a second attachment layer, the first attachment layer is disposed between the chip component and the guide portion of the heat sink for thermally abutting the chip component and the heat sink, and the second attachment layer is disposed between the extension portion of the heat sink and the base of the circuit board main body for attaching the heat sink and the circuit board main body.
According to an embodiment of the invention, the first adhesive layer is a solder layer, and the chip component and the heat sink are thermally and conductively joined by soldering.
According to an embodiment of the present invention, the heat sink further includes a plurality of protrusions, and correspondingly, the base of the circuit board main body is provided with a plurality of through holes, and the protrusions extend from the extension portion of the heat sink to the through holes of the base for joining the heat sink and the base of the circuit board main body, so that the extension portion of the heat sink is attached to the circuit board main body.
According to an embodiment of the present invention, in the first attaching layer, the chip component is symmetrically butted against the base of the wiring board main body and the heat sink for reducing the chip component soldering offset.
According to one embodiment of the invention, through the symmetrical connection of the chip component and the circuit board main body, the height of the guiding part of the heat dissipation member is higher than that of the heat dissipation cavity of the base, so that the abutting distance between the heat dissipation member and the chip component is shortened.
According to an embodiment of the present invention, the heat sink is provided with a slot symmetrically formed in a shape of the guide portion of the heat sink for the chip component to symmetrically weld the guide portion of the heat sink.
According to one embodiment of the invention, the heat sink is a sheet of heat dissipating steel.
According to one embodiment of the invention, the circuit board device capable of dissipating heat is suitable for a circuit board device of a projection module.
A heat dissipation method of a circuit board device capable of dissipating heat comprises the following steps: and conducting the heat of the chip component connected with the circuit board main body of the circuit board device to the outside of the circuit board main body through a heat dissipation piece arranged in the base heat dissipation cavity.
According to an embodiment of the present invention, the heat dissipation method further includes the steps of: the heat generation amount of the chip component is conducted to the guide portion of the heat dissipation member through a first attachment layer, wherein the first attachment layer is a heat-conductive soldering tin layer.
According to an embodiment of the invention, the method further comprises the step of:
transferring heat from the heat sink guiding part to an outer extension part of the heat sink outward; and
heat is conducted radially outward from the outer extension to the ambient for extended area heat dissipation.
According to an embodiment of the invention, the method further comprises the step of: the heat productivity of the chip component is conducted to a circuit board main body through the first attaching layer, wherein the circuit board main body is a flexible circuit board capable of conducting heat.
According to an embodiment of the invention, the method further comprises the step of: the heat dissipation piece is jointed with the base of the circuit board main body through the bulge arranged in the through hole welding disc of the circuit board main body, so that the extension part of the heat dissipation piece is attached to the circuit board main body.
A manufacturing method of a circuit board device capable of dissipating heat comprises the following steps:
(a) providing a circuit board main body, wherein the circuit board main body is provided with a heat dissipation cavity; and
(b) and a chip component and a heat dissipation member are butted through the heat dissipation cavity so as to dissipate heat of the chip component.
According to one embodiment of the present invention, the manufacturing method further comprises step (c): the circuit board main body, the chip component and the heat dissipation member are attached through at least one attachment layer.
According to one embodiment of the present invention, the manufacturing method further comprises step (d): electrically connecting the chip component with the heat sink and/or the circuit board body.
According to an embodiment of the present invention, the step (c) includes the steps of:
(c.1) welding the chip component and the heat sink through a first attachment layer for thermally connecting a guide portion of the chip component and the heat sink; and
(c.2) attaching the heat dissipation piece to the circuit board main body through a second attachment layer so as to attach the extension part of the heat dissipation piece to the circuit board main body, and the heat dissipation piece is suitable for enlarging the heat dissipation area of the heat dissipation piece and reinforcing the circuit board main body.
According to one embodiment of the invention, said step (b) comprises a step (b.1): symmetrically docking the chip component to the heat sink for reducing offset resulting from the docking of the chip component.
According to one embodiment of the invention, said step (b.1) comprises the steps of:
(b.1.1) soldering the chip component to the heat sink; and
(b.1.2) symmetrically butting the chip component to the circuit board main body by means of welding so as to reduce the welding offset of the chip component.
According to one embodiment of the invention, said step (b.1) further comprises the steps of:
(b.1.3) slotting in the heat sink leading portion for forming symmetrical pads on the heat sink; and
(b.1.4) symmetrically butting the chip component to the guide part of the heat sink by means of welding so as to reduce the welding offset of the chip component.
According to one embodiment of the invention, said step (c.2) comprises the steps of:
(c.2.1) correspondingly engaging the protrusion of the heat sink to the through hole of the circuit board body; and
and (c.2.2) directly conducting the bulge of the heat dissipation piece and the pad circuit of the circuit board main body in an electroplating and tin filling mode.
Drawings
Fig. 1 is an exploded view of a preferred embodiment according to the present invention.
Fig. 2 is a schematic structural view of the above preferred embodiment according to the present invention.
Fig. 3A is a sectional view taken along the direction of fig. 2A-a according to the above preferred embodiment of the present invention.
Fig. 3B is a schematic diagram of heat dissipation according to the above preferred embodiment of the present invention.
Fig. 4 is an exploded view showing a first modification of the above preferred embodiment of the present invention.
Fig. 5A is a structural sectional view of a first variation according to the above preferred embodiment of the present invention.
Fig. 5B is a schematic diagram of heat dissipation according to the first variation of the above preferred embodiment of the present invention.
Fig. 6 is an exploded view showing a second modification of the above preferred embodiment of the present invention.
Fig. 7 is a schematic configuration diagram of a second variation of the above preferred embodiment according to the present invention.
Fig. 8A is a sectional view in the direction of fig. 7B-B according to a second variation of the above preferred embodiment of the present invention.
Fig. 8B is a schematic diagram of heat dissipation according to a second variation of the above preferred embodiment of the present invention.
Detailed Description
The technical scheme of the invention is specifically as follows according to the contents disclosed in the claims and the specification of the invention.
As shown in fig. 1 to 2, a circuit board device 1 capable of dissipating heat is provided, where the circuit board device 1 capable of dissipating heat includes a circuit board main body 10, and the circuit board main body 10 is provided with a heat dissipation cavity 12; a chip component 20, wherein the chip component 20 is electrically connected to the circuit board main body 10; and a heat sink 30, an end of the heat sink 30 extending into the heat dissipation chamber 12 to be connected to the chip component 20 for conducting heat of the chip component 20 to the outside. In other words, the chip component 20 is disposed at an opening of the heat dissipation cavity 12, the heat dissipation member 30 extends from another opening of the heat dissipation cavity 12 to the chip component 20, and is abutted to the chip component 20 through the heat dissipation cavity 12 of the circuit board main body 10 for conducting the heat of the chip component 20 to the outside of the circuit board main body 10, so that the internal heat of the circuit board device 1 can be effectively conducted to the outside through the heat dissipation member 30, and the working temperature of the circuit board device 1 and the chip component 20 is reduced.
The circuit board main body 10 includes a base 11 and a connecting portion 13 extending outward from one end of the base 11, the base 11 is used for arranging circuits so that the chip component 20 is electrically connected to the circuit board main body 10 for transmitting signals between the chip component 20 and the circuit board main body 10, and the connecting portion 13 has a connector so as to control the operations of the chip component 20 and other components. The heat dissipation cavity 12 is formed on the base 11, and when the base 11 is wired, the dimension prohibition wiring is cut at the heat dissipation cavity 12 for providing a joint space for the chip component 20 and the heat dissipation member 30, that is, the heat dissipation cavity 12. The heat dissipation chamber 12 communicates with the inside and the outside of the circuit board device 1, so that the heat of the circuit board device 1 is conducted from the internal chip component 20 of the circuit board device 1 to the outside of the circuit board device 1 by conduction in the heat dissipation chamber 12. In other words, the heat dissipation cavity 12 has an inner opening 121 and an outer opening 122, the inner opening 121 connects the chip component 20 and the heat dissipation cavity 12, and the outer opening 122 connects the heat dissipation cavity 12 and the outside, and the heat generated by the chip component 20 is transferred to the outside by a medium in the heat dissipation cavity 12, wherein the medium is a good conductor of heat, and the heat dissipation member 30 is used as the heat conductive medium.
The chip component 20 includes a laser emitter thereon for projecting a light source, the chip component 20 has a large output power and operates by conducting a large current, when the chip component 20 operates, the operating state of the large current will cause the projection module to generate heat seriously, so that the temperature inside the circuit board device 1 rises, that is, the temperature at the inner opening 121 of the heat dissipation cavity 12 rises, and the heat at the inner opening 121 is transferred to the outside of the circuit board main body 10 by the medium heat conduction in the heat dissipation cavity 12.
The heat sink 30 extends from the opening 122 outside the heat dissipation cavity 12 of the circuit board body 10 to the opening 121 inside, and is abutted against the chip component 20, so that the heat generated by the chip component 20 is conducted to the outside through the high-efficiency heat-conducting property of the heat sink 30. The heat sink 30 includes a guiding portion 31 and an extending portion 32, the guiding portion 31 integrally extends from the extending portion 32 to the chip component 20, and passes through the heat dissipation cavity 12 of the circuit board body 10 for abutting against the chip component 20, and the extending portion 32 is attached to the circuit board body 10. The guiding portion 31 is used for conducting the heat of the chip component 20 from the inner opening 121 of the circuit board main body 10 to the extending portion 32, and the extending portion 32 is used for conducting the heat conducted by the guiding portion 31 to the outside, so that the heat inside the circuit board main body 10 is dissipated outwards.
The heat dissipation cavity 12 forms a region with a predetermined volume size on the base 11 by means of hollowing out, so as to transfer heat generated by the chip component 20. Wherein the area of the inner opening 121 of the heat dissipation cavity 12 corresponds to the area of the chip component 20, so that the chip component 20 is superposed on the inner opening 121 of the heat dissipation cavity 12. Wherein the predetermined volume of the heat dissipation cavity 12 corresponds to the guiding portion 31 of the heat dissipation member 30, and the guiding portion 31 is adapted to be disposed in the heat dissipation cavity 12, in other words, the diameter of the guiding portion 31 of the heat dissipation member 30 is matched to the inner diameter of the heat dissipation cavity 12 of the circuit board main body 10, so that the guiding portion 31 is abutted to the chip component 20 through the heat dissipation cavity. The diameter of the guide portion 31 of the heat sink 30 is smaller than or equal to the diameter of the heat dissipation cavity 12, so that the guide portion 31 of the heat sink 30 is butted against the chip component 20 through the heat dissipation cavity 12.
The extension portion 32 of the heat sink 30 overlaps the base 11 of the circuit board main body 10 to expand the heat dissipation area of the heat sink 30 and reinforce the base 11 of the circuit board main body 10, wherein the heat dissipation cavity 12 is formed in the base 11. The extension portion 32 of the heat dissipation member 30 corresponds to the base 11 of the circuit board main body 10, so that the extension portion 32 of the heat dissipation member 30 is overlapped on the bottom layer of the base 11 to reinforce the base 11 of the circuit board main body 10, enhance the overall strength of the circuit board device 1, effectively solve the problem of high-temperature deformation of the circuit board, and improve the flatness of the circuit board device 1, and thus, the extension portion 32 of the heat dissipation member 30 helps to conduct heat outwards and maintain the flatness of the circuit board base 11.
In other words, the heat sink 30 has a size corresponding to the size of the base 11, the guide portion 31 of the heat sink 30 is corresponding to the heat dissipation cavity 12 for the guide portion 31 to abut against the chip component 20, and the extension portion 32 of the heat sink 30 is corresponding to the base 11 for reinforcing the base 11. The engagement does not mean complete engagement, a certain preset gap may be formed between the guide portion 31 of the heat dissipation member 30 and the heat dissipation chamber 12, or the predetermined gap may not be formed, when the guide portion 31 and the inner wall of the heat dissipation chamber 12 have the preset gap, the diameter of the guide portion 31 is smaller than the inner diameter of the heat dissipation chamber 12, and when the guide portion 31 and the inner wall of the heat dissipation chamber 12 do not have the preset gap, the diameter of the guide portion 31 is equal to the inner diameter of the heat dissipation chamber 12. The extension portion 32 of the heat sink 30 extends from the guide portion 31 to the edge of the base 11 with reference to the center of the guide portion 31, so that the heat sink 30 is attached to the outer layer of the base 11 and reinforces the outer layer of the base 11, wherein the area of the extension portion 32 may or may not be the same as that of the base 11, and the fitting degree of the heat sink 30 with the base 11 is suitable for transferring heat and reinforcing the circuit board main body 10. Preferably, for the balance and convenience of the installation of the circuit board device 1, the area of the extension portion 32 of the heat sink 30 is consistent with the area of the base 11 of the circuit board.
The heat dissipation member 30 with there is a predetermined difference in height between the heat dissipation chamber 12, predetermined difference in height is suitable for heat dissipation member 30 docks chip component 20, so that guide portion 31 dock set up in the chip component 20 of heat dissipation chamber 12 top, preferably, the guide portion 31 height of heat dissipation member 30 is not less than the heat dissipation chamber 12 height of circuit board main part 10 helps chip component 20 attach in guide portion 31 of heat dissipation member 30, conveniently carries out chip component 20 with attached operation between the heat dissipation member 30 and chip component 20 with quick heat conduction between the heat dissipation member 30.
It is worth mentioning that, since the extension portion 32 extends outward from the guide portion 31, the heat dissipation area of the heat sink 30 is enlarged, and when heat is transferred from the guide portion 31 to the extension portion 32, the extension portion 32 can rapidly transfer the heat outward to the outside, so as to accelerate the heat dissipation of the chip component 20. In order to increase the heat dissipation area of the heat dissipation member 30, preferably, the area of the extension portion 32 of the heat dissipation member 30 is consistent with the area of the base 11 of the circuit board, the heat dissipation member 30 can dissipate the heat generated by the chip component 20 in time, the medium passing through the heat dissipation member 30 is efficiently led out to the outside, the temperature of the chip component 20 is reduced, and the heat dissipation member is suitable for effective heat dissipation of a projection module. Therefore, the heat generated by the projection light source can be efficiently led out, and the heat dissipation structure is suitable for solving the heat dissipation problem in the structured light technology. The circuit board device capable of radiating is a circuit board device of the projection module.
Fig. 3A shows a heat-dissipating circuit board device 1 cut along a direction a-a in fig. 2, a base 11 of a circuit board main body 10 is sandwiched between a chip component 20 and a heat dissipating member 30, a first attaching surface 411 and a second attaching surface 421 are formed on the base 11, the first attaching surface 411 faces upward to the chip component 20, the second attaching surface 421 faces downward to the heat dissipating member 30, and the chip component 20 is firmly abutted to the heat dissipating member 30 by fixing the chip component 20 to the first attaching surface 411 and fixing the second attaching surface 421 to the heat dissipating member 30, so that the heat dissipating member 30 timely guides out the heat dissipating amount of the chip component 20.
The circuit board device 1 capable of dissipating heat further comprises at least one attaching layer 40, wherein the attaching layers 40 are respectively arranged among the chip component 20, the heat dissipating member 30 and the circuit board main body 10 and used for attaching the circuit board main body 10, the chip component 20 and the heat dissipating member 30, so that the circuit board device 1 capable of dissipating heat is stable in structure. Wherein, attached layer 40 includes a first attached layer 41 and a second attached layer 42, first attached layer 41 is located chip component 20 with between the first attached face 411 for firmly dock chip component 20 with guide portion 31 of heat dissipation member 30, the attached layer 42 of second is located the attached face 421 of second with between the heat dissipation member 30, for laminating heat dissipation member 30 with circuit board main body 10.
The first adhesive layer 41 is a solder layer made of a solder material, and thermally connects the chip component 20 and the heat sink 30 by soldering using solder paste. The first attaching surface 411 is disposed on the guide portion 31 of the heat sink 30, and when the guide portion 31 passes through the heat dissipation cavity 12, the first attaching surface 411 is formed on the upper surface of the guide portion 31, so that the chip component 20 is firmly attached to the guide portion 31 of the heat sink 30 by soldering. Since the thermal conductivity of the solder material is much greater than that of the conventional D/a glue, the heat generated by the chip component 20 can be timely conducted to the heat sink 30 through the solder material, thereby preventing the internal temperature from being too high due to the use of the D/a glue, and facilitating the increase of the thermal conduction speed between the chip component 20 and the heat sink 30.
The second attaching layer 42 is made of a conductive adhesive layer, and the heat dissipation member 30 and the pad of the base 11 are connected through the conductive adhesive layer in a mode of the window 111 on the bottom of the base 11. The second attaching surface 421 of the second attaching layer 42 is disposed on the lower surface of the base 11, and when the heat dissipation member 30 enters the heat dissipation cavity 12, the extension portion 32 of the heat dissipation member 30 abuts against the second attaching surface 421, and the heat dissipation member 30 is fixed to the circuit board main body 10 in a glue adhesion manner so as to reinforce the strength of the base 11 of the circuit board main body 10, prevent high-temperature deformation, and enable the circuit board device 1 to have better flatness. Because the traditional circuit board adopts a PCB (printed circuit board), the hardness of the PCB is poor, and the board is deformed due to serious deformation after reflow soldering of the base 11, the whole strength of the circuit board base 11 is obviously enhanced by the way that the heat dissipation piece 30 reinforces the bottom layer of the base 11.
In other words, the first attachment layer 41 is provided between the chip component 20 and the guide portion 31 of the heat sink 30 for thermally abutting the chip component 20 and the heat sink 30, and the second attachment layer 42 is provided between the extension portion 32 of the heat sink 30 and the base 11 of the circuit board body 10 for attaching the heat sink 30 and the circuit board body 10.
The heat sink 30 is made of a material with good thermal conductivity and high hardness, such as a steel sheet, a copper sheet, duralumin, high-strength ceramic, or other alloy materials with such properties. In comprehensive consideration, the heat sink 30 may be a steel sheet integrated heat sink 30, a copper sheet integrated heat sink 30 or a combination of a steel sheet and a copper sheet, if the material of the guide portion 31 of the heat sink 30 is the same as that of the extension portion 32 of the heat sink 30, the heat sink 30 may be integrally formed of a steel sheet or a copper sheet, if the material of the guide portion 31 of the heat sink 30 is different from that of the extension portion 32 of the heat sink 30, the heat sink 30 may be formed by combining a steel sheet and a copper sheet, for example, the guiding part 31 is made of steel, the extending part 32 is made of copper, which is helpful to lead out the heat of the chip component 20 in time and keep the strength of the circuit board main body 10 through the synergistic effect of the two materials, according to the preset environment, the guiding portion 31 may be made of copper, and the extending portion 32 is made of steel. Preferably, the heat sink 30 is a heat dissipating steel sheet.
Wherein the guide part 31 of the heat sink 30 protrudes from the extension part 32 by way of steel sheet etching, and the protruding height of the guide part 31 corresponds to the height of the heat dissipation chamber 12. When the extension portion 32 is attached to the first attaching surface 411 of the base 11, the height of the guide portion 31 of the heat dissipation body is consistent with that of the heat dissipation cavity 12. The chip component 20 is attached to the steel sheet forming the guide portion 31 through soldering tin, heat generated by the chip component 20 is conducted to the extending portion 32 integrally through the steel sheet, the heat dissipation steel sheet is timely led out to a connected external heat dissipation device, and meanwhile the heat dissipation steel sheet can strengthen the strength of the base 11 of the circuit board main body 10 to a large extent and reduce deformation.
Since the laser emitter on the chip component 20 needs a large current to support during operation, the chip component 20 is electrically connected to the heat sink 30 or the base 11 of the circuit board main body 10, preferably, the chip component 20 is charged with positive electricity, the heat sink 30 or the circuit board base 11 is charged with negative electricity, and through the electrical connection between the pad of the base 11 and the heat sink 30, the negative electricity on the pad of the base 11 is conducted together with the negative electricity of the heat sink 30.
The chip component 20 is aligned with the heat dissipation cavity 12 of the base 11 and faces the heat dissipation member 30 in the heat dissipation cavity 12, when the chip component 20 generates heat, the heat is transferred to the heat dissipation member 30 through the solder layer of the first attachment layer 41, the guide portion 31 of the heat dissipation member 30 transfers the heat downward to the extension portion 32 with enlarged area, wherein the heat transferred from the guide portion 31 is radially conducted to the extension portion 32, and the extension portion 32 rapidly guides the heat out to the outside, that is, to an external heat dissipation device connected, which helps to reduce the temperature of the chip component 20 in time, as shown in fig. 3B.
Since the area of the guide portion 31 of the heat sink 30 is smaller than that of the extension portion 32, when heat is transferred from the guide portion 31 to the extension portion 32, as the area of the extension portion 32 increases, the heat is dissipated outward on the one hand, and is conducted radially from the center of the extension portion 32 to the periphery of the extension portion 32 on the other hand, which helps to enlarge the area for heat dissipation and heat conduction, and simultaneously reduces the overall volume of the heat sink 30, and the contact area between the guide portion 31 and the chip component 20 is reduced, which helps to reduce the overall mass of the circuit board device 1.
Fig. 4 to 5A show a first variation of the heat-dissipatable circuit board device 1A, where the chip components 20A are attached to the heat dissipation member 30A and the base 11A of the circuit board main body 10A at intervals, and the chip components 20A are not only butted against the heat dissipation member 30A but also butted against the circuit board bases 11A on both sides of the heat dissipation member 30A symmetrically by soldering, so as to effectively prevent the chip components 20A from moving laterally, so that the chip components 20A are parallel to the circuit board bases 11A after being positioned.
Because the first attaching layer 41A is attached by solder paste to the chip component 20A and the heat sink 30A, in the operation process, the solder paste may be stretched after reflow soldering, so that the chip component 20A may shift, and the chip component 20A may move in a single direction, and lateral shifting of the chip component 20A, such as translation and inclination, may cause the laser emitter on the chip component 20A to be unable to project a light source at a specific position and direction, which may affect the normal use of the projection module. By attaching the chip components 20A to the heat sink 30A and the base 11A at symmetrical intervals, the offset of the chip components 20A after solder paste reflow soldering can be effectively solved.
The area of the chip component 20A is larger than the area of the heat dissipation cavity 12A of the base 11A, that is, the area of the chip component 20A is larger than the inner opening 121A of the heat dissipation cavity 12A, and when the chip component 20A is stacked on the heat dissipation cavity 12A, the chip component 20A covers the heat dissipation cavity 12A and is abutted to the base 11A around the heat dissipation cavity 12A. The chip components 20A are symmetrically soldered to the base 11A of the circuit board main body 10A at intervals of the heat dissipation cavities 12A.
The guide portion 31A of the heat dissipation member 30A extends toward the chip component 20A through the heat dissipation cavity 12A, the volume of the guide portion 31A is smaller than that of the chip component 20A, and when the heat dissipation member 30A is attached to the circuit board body 10A through the second attachment layer 42A, the guide portion 31A of the heat dissipation member 30A penetrates the heat dissipation cavity 12A at intervals. In other words, the diameter of the guide portion 31A of the heat dissipation member 30A is smaller than the inner cavity of the heat dissipation cavity 12A, so that the guide portion 31A of the heat dissipation member 30A forms a predetermined gap with the inner wall of the heat dissipation cavity 12A, which facilitates the soldering operation between the chip component 20A and the heat dissipation member 30A, and the structure of the circuit board device 1A is more stable. The height of the guiding portion 31A of the heat dissipation member 30A is higher than that of the heat dissipation cavity 12A, so that the heat dissipation member 30A is closer to the chip component 20A, which helps to shorten the heat conduction distance between the chip component 20A and the heat dissipation cavity 12A, and meanwhile, since the chip component 20A is symmetrically butted against the base 11A, shortening the heat conduction distance between the chip component 20A and the heat dissipation cavity 12A will not cause poor soldering or positioning.
The first attaching surface 411A is formed on the guide portion 31A of the heat sink 30A and the upper surface of the circuit board base 11A, so that the chip component 20A is firmly abutted to the heat sink 30A by means of symmetrical soldering, and the solder paste in the first attaching layer 41A is pulled toward the chip component 20A when reflow soldering is performed, so that the obtained chip component 20A cannot move laterally and form unidirectional offset, and the offset of the chip component 20A can be effectively reduced.
In other words, in the first attaching layer 41A, the chip component 20A is symmetrically butted against the base 11A of the wiring board main body 10A and the heat sink 30A for reducing the soldering offset of the chip component 20A.
The material that circuit board main part 10A's base 11A adopted is flexible circuit board, also is the FPC pad, and the FPC pad has good radiating effect, and the heat can pass through the FPC pad conducts heat dissipation piece 30A, works as chip component 20A symmetrically attached in during base 11A, the heat that chip component 20A produced also can pass through base 11A conducts heat dissipation piece 30A. The reinforcing property of the heat sink 30A helps prevent the base 11A formed by the FPC pad from deforming at high temperature, and increases the hardness of the base 11A. The base 11A designed by the FPC symmetrical bonding pad can reduce the uncontrollable stretching of solder paste over reflow soldering, effectively solve the problem of heat dissipation of the chip component 20A, reduce the attaching offset of the chip component 20A and ensure good parallelism of the chip component 20A and the base 11A.
Since the laser emitter on the chip component 20A needs a large current to support during operation, the chip component 20A is electrically connected to the base 11A of the circuit board main body 10A, preferably, the chip component 20A is positively charged, the circuit board base 11A, i.e., the FPC pad, is negatively charged, and the FPC negative pad is electrically connected to the chip component 20A.
Fig. 5B shows a heat dissipation process of the heat-dissipatable circuit board device 1A, the chip component 20A is aligned with the heat dissipation cavity 12A of the base 11A and faces the heat dissipation member 30A and the base 11A in parallel, when the chip component 20A generates heat, the heat is symmetrically transferred to the heat dissipation member 30A and the base 11A which are butted with each other through the solder layer of the first adhesion layer 41A, the base 11A and the lead portion 31A of the heat dissipation member 30A transfer the heat to the extension portion 32A of the heat dissipation member 30A with an enlarged area, wherein the heat transferred from the lead portion 31A is radially conducted to the extension portion 32A, and the extension portion 32A rapidly conducts the heat to the outside, i.e., to an external heat dissipation device connected to help reduce the temperature of the chip component 20A in time, and at the same time, the chip component 20A and the base 11A, The symmetry welding of heat dissipation member 30A makes chip component 20A with FPC pad base 11A's depth of parallelism is good not have the slope, through heat dissipation member 30A extension 32A is right base 11A's reinforcement also does not have obvious deformation phenomenon to take place, effectively solves the attached skew slope problem that chip component 20A produced through the welded mode.
Since the area of the guide portion 31A of the heat sink 30A is smaller than that of the extension portion 32A, when heat is transferred from the guide portion 31A to the extension portion 32A, as the area of the extension portion 32A increases, the heat is dissipated outward on the one hand, and is radially conducted from the center of the extension portion 32A to the periphery of the extension portion 32A on the other hand, which contributes to enlarging the area for heat dissipation and heat conduction, and simultaneously reduces the overall volume of the heat sink 30A, and the contact area between the guide portion 31A and the chip component 20A is reduced, which contributes to reducing the overall mass of the circuit board device 1A.
Fig. 6 to 8B show a second variation of the heat-dissipatable circuit board device 1B, in which the chip components 20B are symmetrically attached to the heat dissipation member 30B, and the chip components 20B are symmetrically abutted to the guide portions 31B of the heat dissipation member 30B by soldering. The guide portion 31B of the heat sink 30B is provided with a slot 311B, the slot 311B is used for symmetrically separating the guide portion 31B of the heat sink 30B, so that the guide portion 31B becomes a symmetric pad, when the chip component 20B is symmetrically soldered to the guide portion 31B, the symmetric separation structure of the guide portion 31B helps the chip component 20B to shift during solder over-reflow soldering, effectively prevents the chip component 20B from moving laterally and tilting, and maintains good parallelism between the chip component 20B and the heat sink 30B as well as the circuit board base 11B.
In other words, in the first attachment layer 41B, the chip component 20B is symmetrically butted against the base 11B of the wiring board main body 10B and the heat sink 30B for reducing the soldering offset of the chip component 20B. The slot 311B is symmetrically formed in shape to the guide portion 31B of the heat sink 30B for the chip component 20B to symmetrically weld the guide portion 31B of the heat sink 30B.
The slot 311B may have a cross structure, or a grid structure, and is used to provide a first attaching surface 411B of a symmetrical pad shape for the guiding portion 31B of the heat sink 30B. The area of the chip component 20B is consistent with the area of the heat dissipation cavity 12B of the base 11B, when the chip component 20B is overlapped on the heat dissipation cavity 12B, the chip component 20B covers the heat dissipation cavity 12B and is symmetrically attached to the pad area of the guiding portion 31B in the heat dissipation cavity 12B, the pad area does not need to be extended to the base 11B around the heat dissipation cavity 12B, so that the welding operation of the heat dissipation member 30B and the chip component 20B is facilitated, the application range of the heat dissipation member 30B is expanded, even if the material of the circuit board base 11B is not easy to conduct heat, the heat can be conducted completely in a mode that the heat dissipation member 30B is symmetrically attached to the chip component 20B, the offset of the chip component 20B and the laser emitter thereof can be effectively reduced, and the heat dissipation area can be increased, the heat conduction speed is increased by increasing the contact area between the chip component 20B and the guide portion 31B of the heat sink 30B.
The first attaching surface 411B is formed on the guide portion 31B of the heat sink 30B, and the chip component 20B is symmetrically welded to the heat sink 30B in such a manner that the slot 311B symmetrically separates the guide portion 31B, so that the chip component 20B is firmly butted to the heat sink 30B, and the solder paste in the first attaching layer 41B is oppositely stretched to the chip component 20B during the solder reflow, so that the obtained chip component 20B cannot move laterally and form unidirectional offset, the uncontrollable stretching of the solder paste during the solder reflow is reduced, and the offset of the chip component 20B can be effectively reduced.
Fig. 8A is a cross-section taken along the direction B-B in fig. 7, and since the laser transmitter on the chip component 20B needs a large current for supporting during operation, the chip component 20B is electrically connected to the heat sink 30B and the circuit board base 11B, preferably, the chip component 20B is positively charged and the heat sink 30B is negatively charged with the base 11B.
The heat dissipation member further includes at least one protrusion 33B, and correspondingly, at least one through hole 14B is formed around the base 11B of the circuit board main body 10B, that is, through hole pads are designed on the periphery of the base 11B, the protrusion 33B extends from the extension portion 32B of the heat dissipation member 30B to the through hole 14B of the base 11B so as to be used for joining the heat dissipation member 30B and the base 11B of the circuit board main body 10B, so that the extension portion 32B of the heat dissipation member 30B is attached to the circuit board main body 10B, and the heat dissipation member 30B is attached to the base 11B through the connection of the through hole 14B without using conductive adhesive. Because the resistance of the conductive adhesive is large, and the through hole pad of the base 11B is electrically conducted with the chip component 20B, if the heat dissipation member 30B is attached to the circuit board base 11B by using the conductive adhesive, the heat generation amount is increased due to the movement of charges in the chip component 20B, the base 11B and the heat dissipation member 30B, the energy loss is large, and the timely heat conduction of the heat dissipation member 30B is influenced to a certain extent.
In other words, what the attached layer 42B of second adopted is a straight conducting layer, the straight conducting layer does not need extra glue will heat dissipation member 30B in attached in circuit board main part 10B, heat dissipation member 30B through protruding 33B all around with through-hole 14B on the base 11B is connected, heat dissipation member 30B's extension 32B closely attached in the bottom of base 11B helps preventing base 11B of circuit board main part 10B takes place the deformation, simultaneously, avoids the great problem of conducting resin resistance. The direct conducting layer directly leads to the heat dissipation member 30B and a pad circuit in the base 11B in a mode of electroplating and tin filling on the protrusion 33B of the heat dissipation member 30B, effectively avoids the problem of high impedance of a windowing pad connected by conductive adhesive, and meets the requirement of the chip component 20B on high current.
The protrusion 33B of the heat sink 30B is made of a material selected from copper, steel, and the like, which have high thermal conductivity and high hardness, and preferably, the protrusion 33B is made of steel, and the height of the protrusion 33B is equal to the height of the guide portion 31B, corresponding to the depth of the through hole 14B of the base 11B. The negative electricity on the through hole pad of the base 11B is transferred to the heat dissipation member 30B through the protrusion 33B, so that the chip component 20B and the heat dissipation member 30B are electrically conducted without consuming more energy, and meanwhile, the heat near the protrusion 33B can be timely transferred to the heat dissipation member 30B, and the heat conduction area of the heat dissipation member 30B is enlarged.
Fig. 8B shows a heat dissipation process of the heat dissipatable circuit board device 1B, wherein the chip component 20B is aligned with the heat dissipation cavity 12B of the base 11B and faces parallel to the guiding portion 31B of the heat dissipation member 30B, when the chip component 20B generates heat during operation, the heat is symmetrically transferred to the heat dissipation member 30B through the solder layer of the first attachment layer 41B, the base 11B and the guiding portion 31B of the heat dissipation member 30B transfer the heat to the extending portion 32B of the heat dissipation member 30B with enlarged area, wherein the heat transferred from the guiding portion 31B is radially conducted to the extending portion 32B, and the extending portion 32B rapidly conducts the heat to the outside, i.e. to an external heat dissipation device connected to help timely reduce the temperature of the chip component 20B, and simultaneously, the chip component 20B and the heat dissipation member 30B are symmetrically welded, the problem of the attaching deviation inclination generated by the chip component 20B through a welding mode is effectively solved.
Since the area of the guide portion 31B of the heat sink 30B is smaller than that of the extension portion 32B, when heat is transferred from the guide portion 31B to the extension portion 32B, as the area of the extension portion 32B increases, the heat is radiated outward on the one hand, and is conducted radially from the center of the extension portion 32B to the periphery of the extension portion 32B on the other hand, which contributes to increasing the area for heat conduction for heat dispersion and reducing the overall volume of the heat sink 30B, and the contact area between the guide portion 31B and the chip component 20B is reduced, which contributes to reducing the overall mass of the circuit board device 1B.
The circuit board device 1B capable of dissipating heat effectively solves the problem of a large amount of heat generated by the projection module during operation, optimizes the heat dissipation of the chip component 20B, and helps to maintain the flatness of the circuit board main body 10B. The heat productivity of the chip component 20B can be dissipated in time, the internal temperature is improved from 60-70 ℃ to 40-50 ℃, and the working temperature reaches an acceptable range.
A heat dissipation method of a circuit board device 1 capable of dissipating heat comprises the following steps: the heat of the chip component 20 attached to the board body 10 of the board device 1 is conducted to the outside thereof through a heat sink 30 provided in the heat dissipation chamber 12 of the base 11.
Wherein the method comprises the steps of: the heat generated by the chip component 20 is conducted to the guiding portion 31 of the heat sink 30 through a first adhesive layer 41, wherein the first adhesive layer 41 is a heat conductive solder layer.
Wherein the method further comprises the steps of:
an outward extension portion 32 that transfers heat from the guide portion 31 of the heat sink 30 to the heat sink 30; and
heat is conducted radially outwardly from the outer extension 32 to the ambient for increased area heat dissipation.
Wherein the method further comprises the steps of: the heat generated by the chip component 20 is conducted to a circuit board main body 10 through the first adhesion layer 41, wherein the circuit board main body 10 is a flexible circuit board capable of conducting heat.
Wherein the method further comprises the steps of: the heat sink 30 is joined to the base 11 of the board body 10 by the bumps 33 provided in the through-hole pads of the board body 10, so that the extension portion 32 of the heat sink 30 is attached to the board body 10.
A method for manufacturing a circuit board device 1 capable of dissipating heat comprises the following steps:
(a) providing a circuit board main body 10, wherein the circuit board main body 10 is provided with a heat dissipation cavity 12; and
(b) a chip component 20 and a heat sink 30 are interfaced through the heat dissipation chamber 12 for dissipating heat from the chip component 20.
Wherein the manufacturing method further comprises a step (c): the circuit board body 10, the chip component 20, and the heat sink 30 are attached by at least one attaching layer 40.
Wherein the manufacturing method further comprises a step (d): electrically conducting the chip component 20 with the heat sink 30 and/or the wiring board body 10.
Wherein the step (c) comprises the steps of:
(c.1) welding the chip component 20 and the heat sink 30 through a first attachment layer 41 for thermally connecting the chip component 20 and a guide portion 31 of the heat sink 30; and
(c.2) attaching the heat dissipation member 30 to the circuit board main body 10 through a second attachment layer 42, so as to attach the extension portion 32 of the heat dissipation member 30 to the circuit board main body 10, thereby enlarging the heat dissipation area of the heat dissipation member 30 and reinforcing the circuit board main body 10.
Wherein step (b) comprises step (b.1): the chip component 20 is symmetrically butted against the heat sink 30 for reducing offset caused by the butting of the chip component 20.
Wherein step (b.1) comprises the steps of:
(b.1.1) soldering the chip component 20 to the heat sink 30; and
(b.1.2) symmetrically butting the chip component 20 to the circuit board main body 10 by means of soldering so as to reduce the offset of soldering of the chip component 20.
Wherein said step (b.1) further comprises the steps of:
(b.1.3) grooving the heat sink lead 31 for forming symmetrical pads on the heat sink 30; and
(b.1.4) symmetrically butting the chip component 20 to the guide part 31 of the heat sink 30 by means of soldering for reducing the offset of soldering of the chip component 20.
Wherein step (c.2) comprises the steps of:
(c.2.1) correspondingly engaging the projections 33B of the heat sink 30 to the through-holes 14B of the board main body 10; and
and (c.2.2) directly conducting the protrusion 33B of the heat sink 30 and the land circuit of the circuit board main body 10 by electroplating and tin filling.
The foregoing is illustrative of specific embodiments of the present invention and reference should be made to the implementation of apparatus and structures not specifically described herein, which is understood to be a general purpose apparatus and method of operation known in the art.
Meanwhile, the above embodiments of the present invention are only used for illustrating the technical solutions of the present invention, and are only examples of the technical solutions of the present invention, and are not used to limit the technical solutions of the present invention and the protection scope thereof. Modifications of the technical solutions disclosed in the claims and the specification by equivalent technical means, equivalent devices and the like should be considered as not exceeding the scope of the claims and the specification of the invention.
Claims (22)
1. A circuit board device capable of dissipating heat, comprising:
the circuit board comprises a circuit board main body, a heat dissipation device and a control device, wherein the circuit board main body is provided with a heat dissipation cavity;
a chip component; and
a heat sink, wherein an end portion of the heat sink extends into the heat dissipation chamber to be electrically connected to the chip component, and the heat sink is conductively connected to the board body to electrically connect the chip component and the board body through the heat sink while conducting heat of the chip component to the outside through the heat sink.
2. The heat dissipatable wiring board device of claim 1, wherein the heat dissipation member comprises a guide portion and an extension portion, wherein the guide portion integrally extends from the extension portion to the chip component for conductively interfacing to the chip component, wherein the extension portion is affixed to a bottom side of the wiring board body for conductively connecting to the wiring board body.
3. The heat dissipatable board device of claim 2, further comprising at least one attachment layer disposed between the chip component and the heat dissipation member and between the heat dissipation member and the board body, respectively, for attaching the chip component to the heat dissipation member and for attaching the heat dissipation member to the board body.
4. The heat dissipatable board device of claim 3, wherein said attachment layer comprises a first attachment layer and a second attachment layer, wherein said first attachment layer is disposed between said chip component and said guide portion of said heat dissipation element to thermally conductively interface said chip component and said guide portion of said heat dissipation element; wherein the second attaching layer is provided between the extension part of the heat radiating member and the circuit board main body, so as to attach the heat radiating member to the circuit board main body.
5. The heat dissipating circuit board assembly of claim 4, wherein the first attachment layer is a thermally conductive solder layer and the second attachment layer is a conductive adhesive layer.
6. The heat dissipatable cord plate device of claim 4, wherein a diameter of the guide portion of the heat dissipation member matches an inner diameter of the heat dissipation cavity of the cord plate body for the guide portion to interface with the chip component through the heat dissipation cavity.
7. The heat dissipatable board device according to claim 6, wherein the extension portion of the heat dissipation member overlaps a base of the board body for enlarging a heat dissipation area of the heat dissipation member and reinforcing the base of the board body, wherein the heat dissipation cavity is formed in the base.
8. The heat dissipatable board device of claim 7, wherein the heat dissipation member further comprises at least one protrusion, and correspondingly, the base of the board body is provided with at least one through hole, wherein the protrusion extends from the outer extension of the heat dissipation member to the through hole of the base for engaging the heat dissipation member with the base of the board body, so that the outer extension of the heat dissipation member is attached to the board body.
9. The heat dissipatable board device of claim 8, wherein there is a predetermined height difference between the heat dissipation member and the heat dissipation cavity, wherein the predetermined height difference is suitable for the heat dissipation member to interface with the chip component, such that the guide portion for the heat dissipation member to interface with the chip component.
10. The heat dissipatable board device of claim 9, wherein the heat dissipation member is provided with a slot symmetrically shaped to the guide portion of the heat dissipation member for the chip component to symmetrically weld the guide portion of the heat dissipation member.
11. The heat dissipatable cord plate device of any one of claims 1 to 10, wherein the heat dissipater is a sheet of heat dissipating steel.
12. The heat dissipatable wiring board apparatus of any of claims 1 to 10, wherein the heat dissipatable wiring board apparatus is a wiring board apparatus of a projection module.
13. The heat dissipatable board device of any of claims 1 to 10, wherein the heat dissipater is electrically connected to a negative electrical terminal located at the back side of the chip component.
14. A heat dissipation method of a circuit board device capable of dissipating heat is characterized by comprising the following steps: the heat of the chip component is conducted to the outside of the circuit board body through a heat dissipation member provided in a heat dissipation chamber of the circuit board body,
wherein an end portion of the heat sink extends into the heat dissipation chamber to be electrically connected to the chip component, and the heat sink is communicably connected to the board main body to electrically connect the chip component with the board main body through the heat sink.
15. The method for dissipating heat from a heat-dissipatable wiring board assembly as recited in claim 14, further comprising the steps of: the heat generated by the chip component is conducted to the guide part of the heat dissipation member through a first attaching layer, wherein the first attaching layer is a heat-conductive soldering tin layer.
16. The method for dissipating heat from a heat-dissipatable wiring board assembly as recited in claim 15, further comprising the steps of:
transferring heat from the guide portion of the heat sink to an outer extension portion of the heat sink; and
heat is conducted radially outward from the outer extension to the ambient for extended area heat dissipation.
17. A method for manufacturing a circuit board device capable of dissipating heat is characterized by comprising the following steps:
(a) providing a circuit board main body, wherein the circuit board main body is provided with a heat dissipation cavity; and
(b) a chip component and a heat sink are butted through the heat dissipation chamber for dissipating heat of the chip component through the heat sink, wherein an end portion of the heat sink extends into the heat dissipation chamber to be electrically connected to the chip component, and the heat sink is communicably connected to the board main body to electrically connect the chip component with the board main body through the heat sink.
18. The method of manufacturing a heat-dissipatable wiring board apparatus of claim 17, further comprising step (c): the chip component, the heat dissipation member and the circuit board main body are attached through at least one attachment layer.
19. The method of manufacturing a heat dissipatable wiring board apparatus of claim 18, said step (c) comprising the steps of:
(c.1) welding the chip component and the heat sink through a first attachment layer for thermally connecting the chip component and a guide portion of the heat sink; and
(c.2) attaching the heat dissipation piece to the circuit board main body through a second attachment layer so as to attach the extension part of the heat dissipation piece to the circuit board main body, and the heat dissipation piece is suitable for enlarging the heat dissipation area of the heat dissipation piece and reinforcing the circuit board main body.
20. The method of manufacturing a heat dissipatable wiring board apparatus of claim 19, said step (b) comprising the step (b.1): symmetrically docking the chip component to the heat sink for reducing offset resulting from the docking of the chip component.
21. The method of manufacturing a heat dissipatable wiring board apparatus of claim 20, said step (b.1) further comprising the steps of:
the groove is formed in the guide part of the heat dissipation piece so as to form a symmetrical pad on the heat dissipation piece; and
the chip component is symmetrically butted to the guide portion of the heat sink by means of soldering for reducing offset of soldering of the chip component.
22. A method of manufacturing a heat dissipatable wiring board apparatus according to any of claims 19 to 21, said step (c.2) comprising the steps of:
(c.2.1) correspondingly engaging the protrusion of the heat sink to the through hole of the circuit board body; and
and (c.2.2) directly conducting the bulge of the heat dissipation piece and the pad circuit of the circuit board main body in an electroplating and tin filling mode.
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| CN201910592996.2A CN110913565A (en) | 2015-02-10 | 2015-02-10 | Circuit board device capable of dissipating heat and heat dissipation method and manufacturing method thereof |
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| CN201510068183.5A CN105992453A (en) | 2015-02-10 | 2015-02-10 | Circuit board device capable of heat radiation and heat radiation method and manufacture method of circuit board device |
| CN201910592996.2A CN110913565A (en) | 2015-02-10 | 2015-02-10 | Circuit board device capable of dissipating heat and heat dissipation method and manufacturing method thereof |
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| CN208569282U (en) * | 2018-03-18 | 2019-03-01 | 宁波舜宇光电信息有限公司 | Projection arrangement and depth information device |
| CN110739284B (en) * | 2019-09-24 | 2020-12-08 | 杭州臻镭微波技术有限公司 | Flexible circuit board radio frequency module with heat dissipation function and manufacturing method thereof |
| CN115134483A (en) * | 2021-03-25 | 2022-09-30 | 华为技术有限公司 | Driving motor, camera module and electronic equipment |
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| CN204014265U (en) * | 2014-08-28 | 2014-12-10 | 广景科技有限公司 | A kind of printed circuit board (PCB) |
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| CN105992453A (en) | 2016-10-05 |
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