CN110488562A - Integrated laser projection mould group - Google Patents
Integrated laser projection mould group Download PDFInfo
- Publication number
- CN110488562A CN110488562A CN201910765804.3A CN201910765804A CN110488562A CN 110488562 A CN110488562 A CN 110488562A CN 201910765804 A CN201910765804 A CN 201910765804A CN 110488562 A CN110488562 A CN 110488562A
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- mould group
- substrate
- laser projection
- circuit board
- projection mould
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- 239000000758 substrate Substances 0.000 claims abstract description 98
- 238000004020 luminiscence type Methods 0.000 claims abstract description 55
- 230000003287 optical effect Effects 0.000 claims abstract description 21
- 238000005375 photometry Methods 0.000 claims description 19
- 239000000919 ceramic Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 5
- 239000000565 sealant Substances 0.000 claims description 3
- 239000000306 component Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000010276 construction Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000002320 enamel (paints) Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
- G02B27/4205—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive optical element [DOE] contributing to image formation, e.g. whereby modulation transfer function MTF or optical aberrations are relevant
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2033—LED or laser light sources
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/147—Details of sensors, e.g. sensor lenses
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Vascular Medicine (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Semiconductor Lasers (AREA)
Abstract
This application discloses a kind of laser projection mould groups, it includes module casing, optical element, luminescence chip and flexible circuit board, module casing includes the substrate of retainer with an open end for being connected to retainer, wherein, the main part of the luminescence chip and the flexible circuit board is set up directly on respectively on the top surface of the substrate, and the luminescence chip is electrically connected to the flexible circuit board at least partially through the substrate.Such laser projection mould group eliminates in the prior art for the needs of the connecting plate for luminescence chip to be connected to flexible circuit board, simplifies structure.
Description
Technical field
The present invention relates to a kind of integrated laser projection mould group, especially one kind can be used for structural light three-dimensional sensing technology
Laser projection mould group.
Background technique
In recent years, structural light three-dimensional sensing technology answering in fields such as consumer electronics, robot, logistics, industrial detections
With more and more extensive.Laser projection mould group for generating structure light is the core component in structural light three-dimensional sensor-based system,
Structure and function has a great impact for the realization of structural light three-dimensional sensing technology.
Fig. 1 shows a kind of existing structure light laser projection mould group, the retainer 1 with frame shape.The one of retainer 1
End is equipped with producing for being based on laser for such as DOE (diffraction optical element, Diffractive Optical Element) etc
The optical element 2 of structure light is given birth to, is pasted with flexible circuit board 3 on the other end.One opposite with retainer 1 of flexible circuit board 3
Side is provided with substrate 4.Substrate 4 usually has preferable rigidity and heat dissipation performance, for keeping the corresponding portion of flexible circuit board 3
Planarization and enhancing heat dissipation.Luminescence chip 5, such as VCSEL (Vcsel, Vertical Cavity
Surface Emitting Laser), it is mounted and electrically connected on flexible circuit board 3 via connecting plate 6.
It can be seen that in existing laser projection mould group as shown in Figure 1, in order to realize luminescence chip and flexible circuit board
Electrical connection, is specially provided with connecting plate.Which increase the volume of mould group, complex process degree and costs of manufacture.Simultaneously as protecting
Frame 1 is held to be bonded on flexible circuit board, and the rigidity of flexible circuit board itself and stability are poor, therefore mould group itself
Structural stability is insufficient.In addition, such laser projection mould group only has basic projection function, need to cooperate when in use outer
The circuit enclosed is used together with other components.This has resulted in projective module group when in use, and whole system structure is excessively complicated,
Using it is upper not convenient and at high cost the problems such as.
In short, there is also more urgently improvements for existing laser projection mould group.
Summary of the invention
The object of the present invention is to provide a kind of laser projection mould groups, at least partially overcome existing laser projection mould
Deficiency in group.
A kind of laser projection mould group according to an embodiment of the present invention includes: module casing, including retainer and is connected to guarantor
Hold the substrate of an open end of frame；Optical element, installation to another open end of the retainer；Luminescence chip, setting
In the module casing, for emitting laser；And flexible circuit board, including the main part being arranged in the module casing
With the extension outside the module casing is extended to from main part.The main body of the luminescence chip and the flexible circuit board
Part is set up directly on respectively on the top surface of the substrate, and the luminescence chip is electrically connected at least partially through the substrate
It is connected to the flexible circuit board.
Preferably, the laser projection mould group can also be in the module casing, described for driving including being arranged in
The driving chip of luminescence chip, the driving chip are set up directly on the top surface of the substrate and are electrically connected by the substrate
To the flexible circuit board.
Preferably, the laser projection mould group can also include the photometry element that is arranged in the module casing and/or
Temperature element, the photometry element and/or temperature element are set up directly on the top surface of the substrate and by the substrates
It is electrically connected to the flexible circuit board.The photometry element and/or temperature element can connect to the driving chip, thus will
Signal measured by it is exported to the driving chip.
In some embodiments, the substrate provides the positive and negative polar electrical connection for leading to the flexible circuit board simultaneously.
Preferably, the top surface of the substrate is formed with conductive circuit layer.The conductive circuit layer may include at least one
Conducting wire and be formed in conducting wire described in each both ends pad.
In some embodiments, the substrate includes metal layer, forms insulating layer on the metal layer and be formed in
The conductive circuit layer on the insulating layer.
In further embodiments, the substrate includes ceramic layer and the conducting wire that is formed on the ceramic layer
Layer, and dissipating vias is formed in the ceramic layer.
Preferably, the main part of the flexible circuit board have less than the substrate outer dimension, the substrate with
It is directly tightly connected between the retainer.It wears the extension that could be formed on the retainer for the flexible circuit board
The opening crossed, the opening are sealed preferably by sealant.
Preferably, the substrate has roughly the same outer dimension with one open end of the retainer.
The luminescence chip can be VCSEL chip.
The optical element can be diffraction optical element.
New pattern laser projective module group according to an embodiment of the present invention, by the way that the devices such as luminescence chip are directly installed on substrate
It at least partly realizes above and via substrate and is electrically connected, eliminate in the prior art for for luminescence chip to be connected to flexibility
The needs of the connecting plate of circuit board, simplify structure.Laser projection mould group according to some embodiments of the invention is also integrated with tool
There is the component of other functions, realizes Highgrade integration, easy-to-use laser projection mould group.In addition, according to the present invention
The laser projection mould group of embodiment also improves the encapsulating structure of mould group.
Detailed description of the invention
By reading the detailed description referring to made by the following drawings to non-limiting embodiment, other spies of the invention
Sign, objects and advantages will become more apparent upon:
Fig. 1 shows a kind of existing structure light laser projection mould group；
Fig. 2A and Fig. 2 B shows an example of laser projection mould group according to a first embodiment of the present invention, wherein Fig. 2 B
It is the cross-sectional view that Fig. 2A is intercepted at the A-A of position；
Fig. 3 shows a variation example of laser projection mould group shown in Fig. 2A and Fig. 2 B；
Fig. 4 shows another variation example of laser projection mould group shown in Fig. 2A and Fig. 2 B；
Fig. 5 A shows an example of laser projection mould group according to a second embodiment of the present invention, and Fig. 5 B shows available
One example of the substrate in the laser projection mould group shown in Fig. 5 A；
Fig. 6 shows an example of laser projection mould group according to a third embodiment of the present invention；
Fig. 7 A and Fig. 7 B show an example of laser projection mould group according to a fourth embodiment of the present invention, wherein Fig. 7 B
It is the cross-sectional view that Fig. 7 A is intercepted at the B-B of position；
Fig. 8 shows the example that can be used for the substrate of laser projection mould group shown in Fig. 7 A and Fig. 7 B；
Fig. 9 shows the example that can be used for the flexible circuit board of laser projection mould group shown in Fig. 7 A and Fig. 7 B；
Figure 10 A and Figure 10 B show the tripe systems that can be used for the substrate of laser projection mould group according to an embodiment of the present invention
Two examples made；And
Figure 11 shows an example of laser projection mould group according to a fifth embodiment of the present invention.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining related invention, rather than the restriction to the invention.It also should be noted that in order to
Convenient for description, part relevant to invention is illustrated only in attached drawing.
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
Fig. 2A and Fig. 2 B shows an example of laser projection mould group according to a first embodiment of the present invention, wherein Fig. 2 B
It is the overhead sectional view that Fig. 2A is intercepted at the A-A of position.As shown, laser projection mould group 100 includes module casing 10, installation
In optical element 20, the luminescence chip 30 that is arranged in module casing 10 and for providing on the open end of module casing 10
The inside and outside flexible circuit board 40 being electrically connected of mould group.Wherein, module casing 10 includes retainer 11 and is connected to the one of retainer 11
The substrate 12 of a open end, the installation of optical element 20 to another open end of retainer 11.Flexible circuit board 40 includes setting
Extend in the main part 41 in module casing 10 and from main part 41 extension 42 outside module casing 10.According to this
The main part 41 of inventive embodiments, luminescence chip 30 and flexible circuit board 40 is set up directly on the top surface of substrate 12, and
And luminescence chip 30 is electrically connected to flexible circuit board 40 at least partially through substrate 12.
It can be seen that luminescence chip is set directly on substrate in laser projection mould group according to an embodiment of the present invention,
And the connection with flexible circuit board is realized via substrate.In this way, being saved for the existing laser projection mould group shown in Fig. 1
Connecting plate has been omited, structure is simplified.This correspondingly makes it possible to simplify the packaging technology of mould group and reduces cost of manufacture, Er Qieyou
Conducive to the miniaturization and lightness of mould group.
Optical element 20 includes first device of structure light required for the laser for being emitted based on luminescence chip 30 is generated
Part, such as diffraction optical element.Optical element 20 also may include for example to the laser from luminescence chip 30 carry out collimation or
The other optical elements, such as lens etc. of modulation.
In laser projection mould group according to an embodiment of the present invention, luminescence chip 30 is preferably VCSEL chip of laser, however
The present invention is not limited thereto.
According to the present embodiment, an electrode (such as cathode) of the luminescence chip 30 of laser projection mould group 100 is via substrate
12 connect with flexible circuit board 40, another electrode (such as anode) is electrically connected by lead 43 with flexible circuit board 40.
In the example shown in Fig. 2A and Fig. 2 B, pad 41a, 41b can be set in the main part 41 of flexible circuit board 40,
These pads are electrically connected with the connector 42a on the extension 42 that flexible circuit board 40 is arranged in.Connector 42a for example can be with
For pad or engagement pad form.In this example, luminescence chip 30 is for example welded on the substrate 12 by Reflow Soldering；Substrate 12
Corresponding conductive path is provided, which is electrically connected with the electrode terminal of the bottom of luminescence chip 30, the other end with
The pad 41a being formed on the opposite surface (lower surface) with substrate 12 of the main part 41 of flexible circuit board 40 is electrically connected
It is logical.In this way, an electrode of luminescence chip 30 can be electrically connected to flexible circuit board 40 via substrate 12.As shown, shining
Another electrode of chip 30 can be connected to the pad 41b on flexible circuit board 40 by common lead connection type.
In the example shown in Fig. 2A and Fig. 2 B, substrate 12 can for example be made of conductive metal material, or at least portion
Point ground is provided comprising conductive material above-mentioned is connected to leading between 30 bottom of luminescence chip and the pad 41a of flexible circuit board 40
Electric pathway；The present invention is unrestricted in terms of the concrete form of substrate.
For the miniaturization of mould group, substrate 12 preferably has the outer dimension roughly the same with the open end of retainer 11.
Moreover it is preferred that as shown in Figure 2 A and 2B, the main part 41 of flexible circuit board 40 has outer less than substrate 12
Shape size is directly tightly connected between substrate 12 and retainer 11.For example, can use sealing between substrate 12 and retainer 11
Glue sealing bonds together.It is connect compared to retainer in mould group shown in FIG. 1 with flexible circuit board, flexible circuit board is fixed to again
For structure on substrate, the laser projection mould group that substrate is directly connected to and is fixed together with retainer in this way can simplify
Structure improves the stability of mould group well, reduces installation error, to be also beneficial to improve the optical of laser projection mould group
Energy.
As shown in Figure 2 A and 2B, it could be formed on retainer 11 and opened for what the extension 42 of flexible circuit board 40 passed through
Mouth 11a.Preferably, opening 11a is sealed using sealant.Be conducive to keep the leakproofness of module casing inner space in this way,
Influence of the adverse environmental factors such as external dust, steam to internal components is prevented, to guarantee the optical property of mould group, improves mould
The service life of group.
In the example shown in Fig. 2A and Fig. 2 B, the main part 41 of flexible circuit board 40 has fork-like shape, wherein as schemed
It is shown, pad 41b is respectively set in two forked sections, for realizing that lead is connect with luminescence chip 30 respectively.However, according to
In the mould group of the embodiment of the present invention, the shape and construction of main part 41 are not limited to any specific form, are more not limited to figure
Shape shown in 2A and Fig. 2 B and construction.In order to make it easy to understand, Fig. 3 and Fig. 4 show two variation examples.Mould group shown in Fig. 3
In 100A, the main part 41 of flexible circuit board 40 can cover most of area in module casing 10 on substrate 12 and intermediate
It is provided with opening, luminescence chip 30 is arranged in the openings and is connected directly to substrate 12.It is soft in mould group 100B shown in Fig. 4
Property circuit board 40 main part 41 can only cover the relatively small area in module casing 10 on substrate 12, and at it close to shining
A side edge portion of chip 30 is provided with the pad 41b for lead connection.
Fig. 5 A shows an example of laser projection mould group according to a second embodiment of the present invention.According to the present invention second
The laser projection mould group 200 of embodiment has substantially the same with laser projection mould group 100 according to a first embodiment of the present invention
Structure, difference essentially consists in, in laser projection mould group 200, luminescence chip 30 be configured to its bottom have it is positive and negative
The connection terminal (pad) of two electrodes, and substrate 12 is that luminescence chip 30 provides positive and negative two towards flexible circuit board 40
Polar electrical connection.Therefore, as shown in Figure 5A, gage system can be no longer needed between luminescence chip 30 and flexible circuit board 40
Connection.
Fig. 5 B shows an example of the substrate that can be used in laser projection mould group shown in Fig. 5 A, wherein the top of substrate 12
It is provided with two pad 12a and 12a ' of the electric connection terminal corresponding to 30 bottom of luminescence chip on face and corresponds to flexibility
Pad 41a (including two discrete pads in this example, be not shown in the figure) on 41 lower surface of main part of circuit board 40
Two pads 12b and 12b '.Substrate 12 be additionally provided be connected to pad 12a and 12b and pad 12a ' and pad 12b ' it
Between conducting wire 12c.In the example shown in Fig. 5 B, conducting wire 12c is formed on the top surface of substrate 12, such as is printed on
On the top surface of substrate 12.However, conducting wire 12c also may include being formed in leading each other for position other than the top surface of substrate 12
Logical feature, such as conductive via etc.；The present invention is not limited in this regard.
Fig. 6 shows an example of laser projection mould group according to a third embodiment of the present invention.Third according to the present invention
The laser projection mould group 300 of embodiment has substantially the same with laser projection mould group 100 according to a first embodiment of the present invention
Structure, difference essentially consists in, and further collection includes the drive for driving luminescence chip 30 in laser projection mould group 300
Dynamic chip 50, the driving chip 50 are integrated in module casing 10, are set up directly on the top surface of substrate 12, and part
Ground is electrically connected to flexible circuit board by substrate 12.
Company in laser projection mould group 300 according to the third embodiment, between driving chip 50 and flexible circuit board 40
The mode of connecing can be the same as or similar to the connection type between luminescence chip 30 and flexible circuit board 40.In the example shown in fig. 6,
One electrode (such as cathode) of driving chip 50 is connected to the pad of the main part 41 of flexible circuit board 40 via substrate 12
41a, another electrode (such as anode) are connected directly to the pad in the main part 41 of flexible circuit board 40 by lead
41b.It is preferred that the electrode (such as being cathode) of the identical polar of luminescence chip 30 and driving chip 50 is connected to via substrate 12
Flexible circuit board 40.Be conducive to simplify the construction of substrate 12 in this way.For example, substrate 12 can be for example golden by whole conductive material
Belong to and being formed.
Luminescence chip need cooperate be suitable for the luminescence chip driving circuit come using.As combined Fig. 1 to introduce above
, laser projection mould group only has the function of laser projection in the prior art, and the driving circuit of luminescence chip is but needed in laser
It is separately provided except projective module group, so that the laser projection mould group and its volume of peripheral circuit etc. is big, line is complicated when using, no
Inconvenience is used only, or even also limits the applicable situation of mould group sometimes.According to a third embodiment of the present invention, it will directly use
It is integrated into the module casing of laser projection mould group 300 in the driving chip of driving luminescence chip, this is provided not just for mould group
Corresponding power drives function, and relative to the technology of driving chip or driving circuit is provided outside mould group, mould group 300 exists
Being a highly integrated in structure can use existing component in the moulds group such as substrate, flexible circuit board and provide for driving chip
Electrical connection, externally provides simple connecting interface, the reliable structure with overall package.It is appreciated that such laser is thrown
Penetrate mould group be it is very easy to use, correspondingly applicable situation also more extensively.
Fig. 7 A and Fig. 7 B show an example of laser projection mould group according to a fourth embodiment of the present invention, wherein Fig. 7 B
It is the cross-sectional view that Fig. 7 A is intercepted at the B-B of position.As shown, laser projection mould group 400 according to a fourth embodiment of the present invention
With the structure substantially the same with laser projection mould group 100 according to a first embodiment of the present invention, difference is essentially consisted in,
The driving chip 50 for driving luminescence chip 30 is further integrated in laser projection mould group 400, for sensing temperature in mould group
The photometry element 70 of the temperature element 60 of degree and the light emission luminance for sensing luminescence chip 30.Driving chip 50, temperature element
60 and photometry element 70 be integrated in module casing 10, they are set up directly on the top surface of substrate 12, and via base
Plate 12 is electrically connected to flexible circuit board 40.
Temperature element 60 and photometry element 70 can be when projective module group 400 work in real time by the temperature and luminance of mould group
Degree feeds back to driving circuit (driving chip 50).Driving circuit can then adjust the hair of mould group according to the working condition of mould group 400
Light mode.Also the writable pre-set different driving corresponding to 400 different working condition of projective module group in driving circuit
Mode, for example, different driving currents, whether stroboscopic, different strobing frequencies and different pulse duty factors etc..
According to the present embodiment, laser projection mould group 400 will be for realizing the component of project structured light (including luminescence chip
With optical element etc.) it is integrated with laser driving circuit (driving chip), temperature element, photometry element, so that projection
Mould group 400 not only has the function of basic structure light projection, moreover it is possible to have the function of automatic adjustment projection module temperature and brightness and
The drive control function of luminescence chip.This makes in use in projective module group, does not need to cooperate other peripheral equipments, improves
The integrated level of system and property easy to use, and reduce use cost.
Although should be understood that in example shown in Fig. 7 A and Fig. 7 B, laser projection mould group 400 is integrated with driving core simultaneously
Piece 50, temperature element 60 and photometry element 70, but the present invention is not limited thereto.Laser according to other embodiments of the present invention is thrown
Penetrating mould group can also only any one of integrated drive chips, temperature element 60 and photometry element 70 or two.
In the example shown in Fig. 7 A and Fig. 7 B, the connection type of luminescence chip 30 and flexible circuit board 40 such as above combine is schemed
2A and Fig. 2 B is introduced identical, and details are not described herein.It will be appreciated, of course, that luminescence chip 30 can also use Fig. 5 A and figure
Electric connection mode shown in 5B.
In addition, driving chip 50, temperature element 60 and photometry element 70 are then by base in the example shown in Fig. 7 A and Fig. 7 B
Plate 12 provides the positive and negative two polar electrical connections for leading to flexible circuit board 40.For example, driving chip 50,60 and of temperature element
Photometry element 70 can be respectively arranged with the pad of positive-negative polarity in its bottom, thus connect with the pad on 12 top surface of substrate,
It is respectively connected to that the following table of the main part 41 of flexible circuit board 40 is for example arranged in via the conductive path provided on substrate 12
The pad 41a corresponding to positive-negative polarity on face.
Although it is not shown, preferably, temperature element 60 and photometry element 70 can connect to driving chip 50, example
The conductive path such as provided via substrate 12, to exporting the signal measured by it to the driving chip.
In order to make it easy to understand, being not intended to limit the present invention, next Fig. 7 A and Fig. 7 B will be suitable in conjunction with Fig. 8 and Fig. 9 introduction
The substrate of shown laser projection mould group and the example of flexible circuit board.
Fig. 8 shows the example that can be used for the substrate of laser projection mould group 400 shown in Fig. 7 A and Fig. 7 B.Such as Fig. 8 institute
Show, substrate 12 is provided with a plurality of conducting wire in its top surface, each conducting wire 12c, each conducting wire 12c its two
End is formed with pad 12a and 12b.Comparative diagram 8 and Fig. 7 B, it can be seen that the pad 12a of the one end conducting wire 12c can be used for
Setting with such as luminescence chip 30, driving chip 50, temperature element 60 and photometry element 70 etc is in module casing 10
Component electrical connection；The pad 12b of the conducting wire 12c other end can be used for and the main part 41 of flexible circuit board 40
Pad 41a (see Fig. 9) connection on lower surface.
Corresponding to the example of substrate shown in Fig. 8, Fig. 9 shows the flexible circuit board that can be used for laser projection mould group 400
40 example.As shown in figure 9, the lower surface of the main part 41 of flexible circuit board 40 be provided with for on substrate 12
The pad 41a of pad 12b connection, upper surface be provided with for luminescence chip 30 or other members being integrated in module casing 10
The pad 41b that device is connected by lead.Pad 41a and 41b is connected to soft by the conducting wire 40a in flexible circuit board 40
Property circuit board 40 extension 42 on set connector 42a, for being connect with external power supply, equipment etc..Connector 42a
It may include multiple pads for example corresponding with multiple pad 41a and 41b in main part 41 or engagement pad.
It should be understood that Fig. 8 and Fig. 9 only respectively illustrate a specific example of substrate 12 and flexible circuit board 40.
In some preferred implementations, substrate 12 can further provide for such as driving chip 50 and luminescence chip 30, temperature element
The conducting wire being directly electrically connected between 60 and/or photometry element 70.It as an alternative or supplement, can also be on flexible circuit board 40
Conducting wire for being electrically connected between driving chip 50 and luminescence chip 30, temperature element 60 and/or photometry element 70 is provided.
Such as luminescence chip, temperature element 60 and/or photometry element 70 can be connected to driving chip via substrate and flexible circuit board
50。
In the embodiment of the present invention that wherein substrate needs to provide more than one conducting wire, the top surface shape of preferable substrate 12
At there is conductive circuit layer.Figure 10 A and Figure 10 B show two examples of the substrate with conductive circuit layer.
Substrate 121 shown in Figure 10 A uses metal substrate.Specifically, substrate 121 includes metal layer 121c, is formed in this
Insulating layer 121b on the metal layer and conductive circuit layer 121a being formed on insulating layer 121b.On conductive circuit layer 121a
Such as Fig. 5 B and conducting wire shown in Fig. 8 are made, for luminescence chip 30, driving chip 50 etc. to be electrically connected to flexible circuit
Plate 40.In substrate 121, itself heating conduction of metal layer 121c is good, is advantageously implemented good heat sinking function.
Substrate 121 shown in Figure 10 B uses ceramic substrate.Specifically, substrate 122 includes ceramic layer 122b and is formed in pottery
Conductive circuit layer 122a on enamel coating 122b.The insulation performance of ceramic material is good, but heating conduction is poor.Therefore, ceramic
Dissipating vias 122c is preferably formed in layer 122b.Dissipating vias 122c is for example by the through-hole for running through ceramic layer 122b and filling
Heat Conduction Material (such as scolding tin) in through-holes is constituted, to improve the heat dissipation performance of substrate.
Although display optics 20 and substrate 12 are separately positioned on two of retainer 11 phases each other in Fig. 2A and Fig. 7 A
Pair open end, but the present invention is not limited thereto.For example, with reference to it is illustrated in fig. 11 according to a fifth embodiment of the present invention swash
Light projection mould group example.Laser projection mould group 500 shown in Figure 11 can be with laser for example according to a fourth embodiment of the present invention
Projective module group 400 has basically the same structure, and difference essentially consists in, and optical element 20 and the setting of substrate 12 are being kept
On open end on the direction perpendicular to one another of two of frame 11.Such as reflecting element 80, such as reflecting mirror or prism can be used, it is real
The deviation of existing laser optical path.Laser projection mould group 500 is for the size-constrained application in the light exit direction of mould group
It is especially suitable.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.Those skilled in the art
Member is it should be appreciated that invention scope involved in the application, however it is not limited to technology made of the specific combination of above-mentioned technical characteristic
Scheme, while should also cover in the case where not departing from the inventive concept, it is carried out by above-mentioned technical characteristic or its equivalent feature
Any combination and the other technical solutions formed.Such as features described above has similar function with (but being not limited to) disclosed herein
Can technical characteristic replaced mutually and the technical solution that is formed.
Claims (14)
1. a kind of laser projection mould group, comprising:
Module casing, the substrate including retainer He an open end for being connected to retainer；
Optical element, installation to another open end of the retainer；
Luminescence chip is arranged in the module casing, for emitting laser；With
Flexible circuit board extends to the mould group shell including the main part being arranged in the module casing and from main part
External extension,
Wherein, the main part of the luminescence chip and the flexible circuit board is set up directly on the top surface of the substrate respectively
On, and the luminescence chip is electrically connected to the flexible circuit board at least partially through the substrate.
2. laser projection mould group as described in claim 1, further include be arranged in it is in the module casing, described for driving
The driving chip of luminescence chip, the driving chip are set up directly on the top surface of the substrate and are electrically connected by the substrate
To the flexible circuit board.
3. laser projection mould group as claimed in claim 2, further include the photometry element being arranged in the module casing and/or
Temperature element, the photometry element and/or temperature element are set up directly on the top surface of the substrate and by the substrates
It is electrically connected to the flexible circuit board.
4. laser projection mould group as claimed in claim 3, wherein the photometry element and/or temperature element are connected to described
Driving chip, to exporting the signal measured by it to the driving chip.
5. such as laser projection mould group of any of claims 1-4, wherein the substrate is provided simultaneously towards described soft
The positive and negative polar electrical connection of property circuit board.
6. laser projection mould group as claimed in claim 5, wherein the top surface of the substrate is formed with conductive circuit layer.
7. laser projection mould group as claimed in claim 6, wherein the conductive circuit layer include at least one conducting wire with
And it is formed in the pad at the both ends of conducting wire described in each.
8. laser projection mould group as claimed in claims 6 or 7, wherein the substrate includes metal layer, is formed in the metal layer
On insulating layer and form the conductive circuit layer on which insulating layer.
9. laser projection mould group as claimed in claims 6 or 7, wherein the substrate includes ceramic layer and is formed in the ceramics
The conductive circuit layer on layer, and dissipating vias is formed in the ceramic layer.
10. laser projection mould group as described in claim 1, wherein the main part of the flexible circuit board, which has, is less than institute
The outer dimension of substrate is stated, is directly tightly connected between the substrate and the retainer.
11. laser projection mould group as claimed in claim 10, wherein be formed on the retainer for the flexible circuit board
The opening that passes through of extension, which is sealed using sealant.
12. laser projection mould group as described in claim 10 or 11, wherein the substrate is one with the retainer
Open end has roughly the same outer dimension.
13. laser projection mould group as described in claim 1, wherein the luminescence chip is VCSEL chip.
14. laser projection mould group as described in claim 1, wherein the optical element is diffraction optical element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910765804.3A CN110488562A (en) | 2019-08-19 | 2019-08-19 | Integrated laser projection mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910765804.3A CN110488562A (en) | 2019-08-19 | 2019-08-19 | Integrated laser projection mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110488562A true CN110488562A (en) | 2019-11-22 |
Family
ID=68552017
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910765804.3A Pending CN110488562A (en) | 2019-08-19 | 2019-08-19 | Integrated laser projection mould group |
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