CN207801154U - A kind of Laser emission module and 3D sensing device furthers - Google Patents
A kind of Laser emission module and 3D sensing device furthers Download PDFInfo
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- CN207801154U CN207801154U CN201820281673.2U CN201820281673U CN207801154U CN 207801154 U CN207801154 U CN 207801154U CN 201820281673 U CN201820281673 U CN 201820281673U CN 207801154 U CN207801154 U CN 207801154U
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- laser emission
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Abstract
The utility model discloses a kind of Laser emission module and 3D sensing device furthers.The Laser emission module includes substrate and Laser emission chip and laser-driven chip on the substrate is respectively set, and the laser-driven chip is electrically connected by the substrate and drives the Laser emission chip.The advantages such as the Laser emission module has miniaturization, circuit is short, driveability is good, luminous power is high, corresponding speed is fast, square wave feature is good.
Description
Technical field
The utility model is related to the sensing fields 3D more particularly to a kind of Laser emission module and 3D sensing device furthers.
Background technology
With the development of 3D detection technologies, Laser emission module and camera module are combined for ranging, face recognition, body
Shape identification, action recognition etc. are more and more extensive.As shown in Figure 1, existing Laser emission module includes mainly Laser emission
Device 1 ' and laser driver 2 ', the laser emitter 1 ' and laser driver 2 ' are all monolithic devices, are separately positioned on difference
Substrate 11 ', 12 ' on, then use FPC 3 ' or connecting line 3 ' to realize electrical connection again, lead to the size of the Laser emission module
It is larger, it is unfavorable for minimizing, and long transmission line reduces the laser driver 2 ' to the driveability of laser emitter 1 ', leads
Cause laser emitter 1 ' response time is long, waveform effect is poor.
Utility model content
In order to solve above-mentioned the deficiencies in the prior art, a kind of Laser emission module of the utility model offer and 3D sensing dresses
It sets.The Laser emission module have miniaturization, circuit is short, driveability is good, luminous power is high, corresponding speed is fast, square wave feature
The advantages such as good.
Technical problem to be solved in the utility model is achieved by the following technical programs：
A kind of Laser emission module, including substrate and Laser emission chip on the substrate is respectively set and laser drives
Dynamic chip, the laser-driven chip are electrically connected by the substrate and drive the Laser emission chip.
Further, it is provided with light diffusion element on the Laser emission direction of the Laser emission chip.
Further, the light diffusion element is light diverging lens.
Further, further include the holder being supported between the substrate and light diffusion element.
Further, the Laser emission chip and laser-driven chip are respectively positioned on forms between the holder and substrate
In accommodating chamber.
Further, the Laser emission chip is VCSEL chips.
Further, the substrate is PCB or FPC.
A kind of 3D sensing device furthers, including camera module and above-mentioned Laser emission module, the camera module and laser hair
It penetrates module and is respectively electrically connected to primary processor.
Further, the Laser emission chip is IR chips, and the camera module is IR modules.
Further, the image sensor chip of the camera module is also provided on the substrate.
The utility model has the advantages that：The Laser emission module is by the Laser emission chip and Laser Driven
Chip integrates as integrated device and realizes electrical connection on the same substrate, reduces required space, realizes miniaturization, Er Qielian
Wiring is short out, improves driveability of the laser-driven chip to Laser emission chip, the hair of the Laser emission chip
Luminous power is high, corresponding speed is fast, square wave feature is good.
Description of the drawings
Fig. 1 is the schematic diagram of existing Laser emission module；
Fig. 2 is the schematic diagram of Laser emission module provided by the utility model；
Fig. 3 is the functional block diagram of 3D sensing device furthers provided by the utility model.
Specific implementation mode
The utility model is described in detail with reference to the accompanying drawings and examples.
Embodiment one
As shown in Fig. 2, a kind of Laser emission module, including substrate 11 are sent out with the laser being separately positioned on the substrate 11
Core shooting piece 12 and laser-driven chip 13, the laser-driven chip 13 are electrically connected by the substrate 11 and drive the laser
Transmitting chip 12.
The Laser emission chip 12 and laser-driven chip 13 as integrated device, are integrated in by the Laser emission module
Electrical connection is realized on same substrate 11, reduces required space, realizes miniaturization, and connecting line is short out, is improved described sharp
Optical drive chip 13 is to the driveability of Laser emission chip 12, and the luminous power of the Laser emission chip 12 is high, corresponding speed
Degree is fast, square wave feature is good.
Light diffusion element 14, the light diffusion element 14 are provided on the Laser emission direction of the Laser emission chip 12
It is preferably but not limited to as light diverging lens.
The Laser emission module further includes the holder 15 being supported between the substrate 11 and light diffusion element 14, described to swash
Light emitting chip 12 and laser-driven chip 13 are respectively positioned in the accommodating chamber that the holder 15 and substrate 11 are formed.
The Laser emission chip 12 is preferably but not limited to as VCSEL chips, and the substrate 11 is PCB or FPC.
Embodiment two
As shown in figure 3, a kind of 3D sensing device furthers, including camera module and above-mentioned Laser emission module, the camera shooting mould
Group and Laser emission module are respectively electrically connected to primary processor.
The Laser emission module is used to emit laser to object；The camera module is used for the laser on object
It is imaged, obtains the laser imaging with range information；The primary processor is for controlling the camera module and laser hair
Penetrate module.
Preferably, the Laser emission chip 12 is IR chips, and the camera module is IR modules.
More preferably, the image sensor chip of the camera module can also be arranged on the substrate 11, and optimally,
The camera shooting driving chip of the camera module can also be arranged on the substrate 11, and the camera shooting driving chip passes through the base
Plate 11 is electrically connected and drives the camera module.
The embodiment of the utility model above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot it therefore be interpreted as the limitation to the utility model patent range, as long as using the form institute of equivalent substitution or equivalent transformation
The technical solution of acquisition, shall fall within the scope of the present invention.
Claims (10)
1. a kind of Laser emission module, which is characterized in that including substrate and Laser emission core on the substrate is respectively set
Piece and laser-driven chip, the laser-driven chip are electrically connected by the substrate and drive the Laser emission chip.
2. Laser emission module according to claim 1, which is characterized in that the Laser emission side of the Laser emission chip
Light diffusion element is set up.
3. Laser emission module according to claim 2, which is characterized in that the light diffusion element is light diverging lens.
4. Laser emission module according to claim 2 or 3, which is characterized in that further include being supported on the substrate and light
Holder between diffused component.
5. Laser emission module according to claim 4, which is characterized in that the Laser emission chip and Laser Driven core
Piece is respectively positioned in the accommodating chamber formed between the holder and substrate.
6. Laser emission module according to claim 1, which is characterized in that the Laser emission chip is VCSEL chips.
7. according to any Laser emission module in claim 1-3,6, which is characterized in that the substrate be PCB or
FPC。
8. a kind of 3D sensing device furthers, which is characterized in that including any Laser emission in camera module and claim 1-7
Module, the camera module and Laser emission module are respectively electrically connected to primary processor.
9. 3D sensing device furthers according to claim 8, which is characterized in that the Laser emission chip is IR chips, described
Camera module is IR modules.
10. 3D sensing device furthers according to claim 8 or claim 9, which is characterized in that the image sensor chip of the camera module
It is also provided on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820281673.2U CN207801154U (en) | 2018-02-28 | 2018-02-28 | A kind of Laser emission module and 3D sensing device furthers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820281673.2U CN207801154U (en) | 2018-02-28 | 2018-02-28 | A kind of Laser emission module and 3D sensing device furthers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207801154U true CN207801154U (en) | 2018-08-31 |
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ID=63275576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820281673.2U Active CN207801154U (en) | 2018-02-28 | 2018-02-28 | A kind of Laser emission module and 3D sensing device furthers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207801154U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110488562A (en) * | 2019-08-19 | 2019-11-22 | 北京驭光科技发展有限公司 | Integrated laser projection mould group |
-
2018
- 2018-02-28 CN CN201820281673.2U patent/CN207801154U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110488562A (en) * | 2019-08-19 | 2019-11-22 | 北京驭光科技发展有限公司 | Integrated laser projection mould group |
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