CN207884070U - A kind of laser emitter and 3D photographic devices - Google Patents
A kind of laser emitter and 3D photographic devices Download PDFInfo
- Publication number
- CN207884070U CN207884070U CN201820371574.3U CN201820371574U CN207884070U CN 207884070 U CN207884070 U CN 207884070U CN 201820371574 U CN201820371574 U CN 201820371574U CN 207884070 U CN207884070 U CN 207884070U
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- wiring board
- laser emitter
- laser
- plastic packaging
- packaging holder
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Abstract
The utility model discloses a kind of laser emitters and 3D photographic devices.The laser emitter includes wiring board and the Laser emission chip that is arranged on the wiring board, and the Laser emission chip is electrically connected by binding line and the wiring board；And plastic packaging holder on the wiring board is integrally formed in using plastic package process and the light diffusion element at the plastic packaging holder light extraction end is set；The Laser emission chip is located in the accommodating chamber of the plastic packaging holder.
Description
Technical field
The utility model is related to 3D field of photography more particularly to a kind of laser emitters and 3D photographic devices.
Background technology
With the development of 3D photography technologies, 3D photographic devices are widely used on the mobile terminals such as mobile phone to be surveyed with realizing
Away from the functions such as, recognition of face, important component of the laser emitter as 3D photographic devices, the quality of performance is to 3D photographic devices
Normal use have conclusive effect.Existing laser emitter is generally carried out by the way of glue bonding plastics holder
Encapsulation, since the size of laser emitter is small, and while being bonded, needs the binding line between Laser emission chip and wiring board
It is avoided, the wall thickness of the plastic stent of encapsulation is too small to be easily broken off, and the overall stability and peace of laser emitter are affected
Quan Xing.
Utility model content
In order to solve above-mentioned the deficiencies in the prior art, a kind of laser emitter of the utility model offer and 3D photographic devices.
All tool improves a lot the laser emitter in terms of overall stability and safety.
Technical problem to be solved in the utility model is achieved by the following technical programs：
A kind of laser emitter, including wiring board and the Laser emission chip being arranged on the wiring board, the laser
Transmitting chip is electrically connected by binding line and the wiring board；And the circuit is integrally formed in using plastic package process
Plastic packaging holder on plate and the light diffusion element at the plastic packaging holder light extraction end is set；The Laser emission chip is located at described
In the accommodating chamber of plastic packaging holder.
Further, binding line is stated in the plastic packaging holder environmental sealing residence.
Further, the plastic packaging holder is covered on the non-luminous region in Laser emission chip light emitting face.
Further, the light diffusion element is light diverging lens.
Further, the wiring board is PCB.
Further, it is provided with heat sink in one side of the wiring board far from the Laser emission chip.
Further, the heat sink is ceramic heat-dissipating plate.
Further, the wiring board and heat sink are structure as a whole.
Further, the Laser emission chip is IR VCSEL chips.
A kind of 3D photographic devices, including above-mentioned laser emitter.
The utility model has the advantages that：The laser emitter is using plastic package process directly on the wiring board
The plastic packaging holder for being made into one first binds the Laser emission chip and makes the plastic packaging holder again, exist in this way in step
With regard to that without being avoided to the binding line, the wall thickness of the plastic packaging holder can be increased, improved when making the plastic packaging holder
Overall stability and safety.
Description of the drawings
Fig. 1 is the schematic diagram of laser emitter provided by the utility model.
Specific implementation mode
The utility model is described in detail with reference to the accompanying drawings and examples.
Embodiment one
As shown in Figure 1, a kind of laser emitter, including wiring board 1 and the Laser emission core that is arranged on the wiring board 1
Piece 2, the Laser emission chip 2 are electrically connected by binding line 3 and the wiring board 1；And use plastic package process one
The plastic packaging holder 3 and the light diffusion element 4 at 3 light extraction end of the plastic packaging holder is set that body is formed on the wiring board 1；It is described
Laser emission chip 2 is located in the accommodating chamber of the plastic packaging holder 3.
The laser emitter uses the plastic packaging holder 3 of plastic package process being made into one directly on the wiring board 1, in step
On rapid, first bind the Laser emission chip 2 and make the plastic packaging holder 3 again, in this way when making the plastic packaging holder 3 with regard to nothing
The binding line 3 need to be avoided, the wall thickness of the plastic packaging holder 3 can be increased, improve overall stability and safety.
Binding line 3 is stated in 3 environmental sealing residence of the plastic packaging holder, to increase the wall thickness of the plastic packaging holder 3 and to institute
It states binding line 3 and protection is provided；Even in the case where craft precision is permitted, the plastic packaging holder 3 is covered in the laser hair
On the non-luminous region of 2 light-emitting surface of core shooting piece.
The light diffusion element 4 is light diverging lens.
The wiring board 1 is PCB, also, is provided in one side of the wiring board 1 far from the Laser emission chip 2
Heat sink 5, the heat sink 5 are preferably but not limited to as ceramic heat-dissipating plate.
Optimally, the wiring board 1 and heat sink 5 are structure as a whole, i.e., the described wiring board 1 and heat sink 5 integrally turn to
Surface has the ceramic substrate of circuit, to have both conductive and heat sinking function.
Preferably, the Laser emission chip 2 is IR VCSEL chips, and the emission wavelength of the IR VCSEL chips is preferred
But it is not limited to 850nm or 940nm, frequency spectrum is in ± 10nm.
Embodiment two
A kind of 3D photographic devices, including laser emitter, Laser imagers and main processing block described in embodiment one,
The main processing block is respectively electrically connected to the laser emitter and Laser imagers.
The Laser imagers are preferably IR imagers, for being imaged to the infrared laser on object surface, are obtained
Obtain the infrared imaging with range information.
The embodiment of the utility model above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot it therefore be interpreted as the limitation to the utility model patent range, as long as using the form institute of equivalent substitution or equivalent transformation
The technical solution of acquisition, shall fall within the scope of the present invention.
Claims (10)
1. a kind of laser emitter, which is characterized in that including wiring board and the Laser emission chip that is arranged on the wiring board,
The Laser emission chip is electrically connected by binding line and the wiring board；And it is integrally formed in using plastic package process
Plastic packaging holder on the wiring board and the light diffusion element at the plastic packaging holder light extraction end is set；The Laser emission chip
In the accommodating chamber of the plastic packaging holder.
2. laser emitter according to claim 1, which is characterized in that state binding in the plastic packaging holder environmental sealing residence
Line.
3. laser emitter according to claim 2, which is characterized in that the plastic packaging holder is covered in the Laser emission
On the non-luminous region in chip light emitting face.
4. laser emitter according to claim 1, which is characterized in that the light diffusion element is light diverging lens.
5. laser emitter according to claim 1, which is characterized in that the wiring board is PCB.
6. laser emitter according to claim 1 or 5, which is characterized in that the wiring board is far from the Laser emission
It is provided with heat sink in the one side of chip.
7. laser emitter according to claim 6, which is characterized in that the heat sink is ceramic heat-dissipating plate.
8. laser emitter according to claim 6, which is characterized in that the wiring board and heat sink are structure as a whole.
9. laser emitter according to claim 1, which is characterized in that the Laser emission chip is IR VCSEL cores
Piece.
10. a kind of 3D photographic devices, which is characterized in that including any laser emitter in claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820371574.3U CN207884070U (en) | 2018-03-19 | 2018-03-19 | A kind of laser emitter and 3D photographic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820371574.3U CN207884070U (en) | 2018-03-19 | 2018-03-19 | A kind of laser emitter and 3D photographic devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207884070U true CN207884070U (en) | 2018-09-18 |
Family
ID=63496251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820371574.3U Active CN207884070U (en) | 2018-03-19 | 2018-03-19 | A kind of laser emitter and 3D photographic devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207884070U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112447614A (en) * | 2019-08-30 | 2021-03-05 | 朋程科技股份有限公司 | Power device packaging structure |
-
2018
- 2018-03-19 CN CN201820371574.3U patent/CN207884070U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112447614A (en) * | 2019-08-30 | 2021-03-05 | 朋程科技股份有限公司 | Power device packaging structure |
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