CN108196418A - Laser projection module, depth camera and electronic device - Google Patents

Laser projection module, depth camera and electronic device Download PDF

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Publication number
CN108196418A
CN108196418A CN201810164311.XA CN201810164311A CN108196418A CN 108196418 A CN108196418 A CN 108196418A CN 201810164311 A CN201810164311 A CN 201810164311A CN 108196418 A CN108196418 A CN 108196418A
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China
Prior art keywords
diffraction
collimation
circuit board
laser
conducting
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CN201810164311.XA
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Chinese (zh)
Inventor
吕杰
白剑
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201810164311.XA priority Critical patent/CN108196418A/en
Priority to CN202011544934.3A priority patent/CN112611546A/en
Publication of CN108196418A publication Critical patent/CN108196418A/en
Priority to EP19737647.8A priority patent/EP3561590A4/en
Priority to PCT/CN2019/074610 priority patent/WO2019165885A1/en
Priority to TW108106937A priority patent/TWI696000B/en
Priority to US16/546,880 priority patent/US11307431B2/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Semiconductor Lasers (AREA)
  • Projection Apparatus (AREA)

Abstract

The invention discloses a kind of laser projection module, depth camera and electronic devices.Laser projection module includes laser emitter, optical module, circuit board assemblies and processor.Detecting element is provided on optical module.Circuit board assemblies include circuit board and conducting element, and detecting element passes through conducting element and circuit board electrical connection.Processor is connect with circuit board.Processor is used to receive the electric signal of detecting element output to judge whether optical module ruptures.Laser projection module, depth camera and the electronic device of embodiment of the present invention on optical module by setting detecting element, and conducting element is used by detecting element and circuit board electrical connection, so that processor can receive the electric signal of detecting element output, to judge whether optical module ruptures and after optical module rupture is detected according to electric signal, close laser emitter in time or reduce the power of laser emitter, to avoid laser energy is excessive and the problem of the eyes of harm users.

Description

Laser projection module, depth camera and electronic device
Technical field
The present invention relates to technical field of imaging, more particularly to a kind of laser projection module, depth camera and electronic device.
Background technology
Some existing laser emitters can launch the stronger laser of focus signal, these laser by collimating element, Energy can decay after diffraction element, to meet signal strength less than the injury thresholding to human body.These laser emitters are usual It is made of glass or other components being easily broken, once encountering situations such as dropping, camera lens rupture, then laser will directly be launched Come, irradiate the body or eyes of user, cause serious safety problem.
Invention content
The embodiment provides a kind of laser projection module, depth camera and electronic devices.
The laser projection module of embodiment of the present invention include laser emitter, optical module, circuit board assemblies and with electricity The processor of road plate component connection.Laser emitter is used to emit laser.The optical module is arranged on the laser emitter Luminous light path on, the laser forms laser pattern after the optical module, and detection is provided on the optical module Element.The circuit board assemblies include circuit board and conducting element, and the detecting element passes through the conducting element and the electricity Road plate electrical connection, the laser emitter are arranged on the circuit board assemblies.The processor is first for receiving the detection The electric signal of part output is to judge whether the optical module ruptures.
The depth camera of embodiment of the present invention includes above-mentioned laser projection module, image acquisition device and processor.Institute State image acquisition device for acquire laser pattern from the laser projection module to object space that projected from, the processor use In handling the laser pattern to obtain depth image.
The electronic device of embodiment of the present invention includes housing and above-mentioned depth camera.The depth camera is arranged on institute It states in housing and obtains depth image from the housing exposure.
Laser projection module, depth camera and the electronic device of embodiment of the present invention are examined by being set on optical module Element is surveyed, and using conducting element by detecting element and circuit board electrical connection, so that processor can receive detecting element The electric signal of output, to judge whether optical module ruptures according to electric signal.After optical module rupture is detected, close in time Laser emitter or the power for reducing laser emitter, to avoid optical module rupture causes the laser energy of transmitting excessive and hinders The problem of eyes of evil user, the safety that improving laser projection module uses.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description It obtains significantly or is recognized by the practice of the present invention.
Description of the drawings
Above-mentioned and/or additional aspect and advantage of the invention will become from the following description of the accompanying drawings of embodiments Significantly and it is readily appreciated that, wherein：
Fig. 1 is the structure diagram of the laser projection module of certain embodiments of the present invention.
Fig. 2 is schematic cross-section of the laser projection module of Fig. 1 along II-II lines.
Fig. 3 is the conspectus of the collimation conductive electrode of certain embodiments of the present invention.
Fig. 4 is the structure diagram of the laser projection module of certain embodiments of the present invention.
Fig. 5 is schematic cross-section of the laser projection module of Fig. 4 along V-V lines.
Fig. 6 is the structure diagram of the laser projection module of certain embodiments of the present invention.
Fig. 7 is schematic cross-section of the laser projection module of Fig. 6 along VII-VII lines.
Fig. 8 is the structure diagram of the laser projection module of certain embodiments of the present invention.
Fig. 9 is the diagrammatic cross-section of the diffraction element of certain embodiments of the present invention.
Figure 10 is the conspectus of the diffraction conductive electrode of certain embodiments of the present invention.
Figure 11 is schematic cross-section of the laser projection module of Fig. 8 along XI-XI lines.
Figure 12 is the structure diagram of the laser projection module of certain embodiments of the present invention.
Figure 13 is schematic cross-section of the laser projection module of Figure 12 along XIII-XIII lines.
Figure 14 is the structure diagram of the laser projection module of certain embodiments of the present invention.
Figure 15 is schematic cross-section of the laser projection module of Figure 14 along XV-XV lines.
Figure 16 is the structure diagram of the laser projection module of certain embodiments of the present invention.
Figure 17 is the diagrammatic cross-section of the collimating element of certain embodiments of the present invention.
Figure 18 is the conspectus of the collimation conductive path of certain embodiments of the present invention.
Figure 19 is schematic cross-section of the laser projection module of Figure 16 along XIX-XIX lines.
Figure 20 is the structure diagram of the laser projection module of certain embodiments of the present invention.
Figure 21 is schematic cross-section of the laser projection module of Figure 20 along XXI-XXI lines.
Figure 22 is the structure diagram of the laser projection module of certain embodiments of the present invention.
Figure 23 is schematic cross-section of the laser projection module of Figure 22 along XXIII-XXIII lines.
Figure 24 is the structure diagram of the laser projection module of certain embodiments of the present invention.
Figure 25 is the diagrammatic cross-section of the diffraction element of certain embodiments of the present invention.
Figure 26 is the conspectus of the diffraction conductive path of certain embodiments of the present invention.
Figure 27 is schematic cross-section of the laser projection module of Figure 24 along XXVII-XXVII lines.
Figure 28 is the structure diagram of the laser projection module of certain embodiments of the present invention.
Figure 29 is schematic cross-section of the laser projection module of Figure 28 along XXIX-XXIX lines.
Figure 30 is the structure diagram of the laser projection module of certain embodiments of the present invention.
Figure 31 is schematic cross-section of the laser projection module of Figure 30 along XXXI-XXXI lines.
Figure 32 and Figure 33 is the structure diagram of the laser projection module of certain embodiments of the present invention.
Figure 34 to Figure 36 is the part-structure schematic diagram of the laser projection module of certain embodiments of the present invention.
Figure 37 is the structure diagram of the depth camera of certain embodiments of the present invention.
Figure 38 is the structure diagram of the electronic device of certain embodiments of the present invention.
Specific embodiment
The embodiment of the present invention is described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that term " first ", " second " are only used for description purpose, and cannot It is interpreted as indicating or implies relative importance or imply the quantity of the technical characteristic indicated by indicating.Define as a result, " the One ", one or more feature can be expressed or be implicitly included to the feature of " second ".In description of the invention In, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or be integrally connected；It can To be mechanical connection or electrical connection or can be in communication with each other；It can be directly connected, it can also be by between intermediary It connects connected, can be the interaction relationship of connection inside two elements or two elements.For the ordinary skill of this field For personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter, This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with Recognize the application of other techniques and/or the use of other materials.
Also referring to Fig. 1 and Fig. 2, the laser projection module 100 of embodiment of the present invention includes laser emitter 10, light Learn component 40, circuit board assemblies 50 and processor 80.Laser emitter 10 is for emitting laser, optical module 40 is arranged on laser In the luminous light path of transmitter 10, laser forms laser pattern after optical module 40.Detection is provided on optical module 40 Element 70.Circuit board assemblies 50 include circuit board 51 and conducting element 52.Detecting element 70 passes through conducting element 52 and circuit board 51 electrical connections.Laser emitter 10 is arranged on circuit board assemblies 50.Processor 80 is connect with circuit board 51.Processor 80 is used for The electric signal of the output of detecting element 70 is received to judge whether optical module 40 ruptures.
Laser projection module 100 further includes lens barrel 60.Lens barrel 60 is arranged on circuit board 51 and surrounds receipts with circuit board 51 Cavity volume 62.Laser emitter 10 is housed in host cavity 62.Optical module 40 includes the diffraction element being housed in host cavity 62 30 and collimating element 20.Collimating element 20 is set gradually with diffraction element 30 along the luminous light path of laser emitter 10.Wherein, it is accurate Straight element 20 is used for the laser that collimation laser transmitter 10 emits.After diffraction element 30 collimates for the collimated element 20 of diffraction Laser is to form laser pattern.
The laser projection module 100 of embodiment of the present invention is made by setting detecting element 70 on optical module 40 Detecting element 70 is electrically connected with circuit board 51 with conducting element 52, so that can to receive detecting element 70 defeated for processor 80 The electric signal gone out, to judge whether optical module 40 ruptures according to electric signal.After detecting that optical module 40 ruptures, close in time It closes laser emitter 10 or reduces the power of laser emitter 10, the laser energy for leading to transmitting is ruptured to avoid optical module 40 The problem of excessive and harm users eyes, the safety that improving laser projection module 100 uses.
Also referring to Fig. 1 to Fig. 3, in some embodiments, conducting element 52 is multiple, and detecting element 70 is light transmission Collimate conductive film 21.Light transmission collimation conductive film 21 is arranged on collimating element 20, and collimation is provided on light transmission collimation conductive film 21 Conductive electrode 22.Judgment mechanism whether collimating element 20 ruptures is as follows：When collimating element 20 is in serviceable condition, light transmission is accurate The resistance of straight conductive film 21 is smaller, is powered in this case to light transmission collimation conductive film 21, that is, applies a certain size voltage, then The electric current that the collimation conductive electrode 22 that processor 80 is got at this time exports is larger.And when collimating element 20 ruptures, it is formed in On collimating element 20 light transmission collimation conductive film 21 also can fragmentation, at this time at fragmentation position light transmission collimation conductive film 21 resistance Resistance value approach infinity is powered in this case to the collimation conductive electrode 22 on light transmission collimation conductive film 21, and processor 80 obtains The electric current that the collimation conductive electrode 22 got exports is smaller.Therefore, first way, can be according to collimation electric signal (i.e. electric current) Judge collimation member with the difference size between the collimation electric signal (i.e. electric current) that is detected under 20 non-state of rupture of collimating element Whether part 20 ruptures, and further, can collimate the state of conductive film 21 according to light transmission to judge whether collimating element 20 ruptures, That is, if light transmission collimation conductive film 21 ruptures, show that collimating element 20 also ruptures；If light transmission collimation conductive film 21 does not rupture, Show that collimating element 20 does not also rupture.The second way：It is exported after being powered according to conductive electrode 22 is collimated on collimating element 20 Collimation electric signal directly judge whether collimating element 20 ruptures, specifically, collimation conductive electrode 22 export collimation electric signal Determine that collimating element 20 ruptures, and then judge that collimating element 20 also ruptures when not in the range of default collimation；If collimating element Determine that collimating element 20 does not rupture, and then judge collimating element 20 when the collimation electric signal of 20 outputs is in the range of default collimation Also it does not rupture.
Light transmission collimation conductive film 21 can be formed in the surface of collimating element 20 by modes such as plating.Light transmission collimates conductive film 21 material can be any one in tin indium oxide (Indium tin oxide, ITO), silver nanowire, metal silver wire.Oxygen Change indium tin, silver nanowire, metal silver wire and be respectively provided with good light transmittance and electric conductivity, it can be achieved that collimation electric signal after being powered Output, at the same will not collimation element 20 light extraction light path generation block.
Specifically, collimating element 20 includes collimated incident face 201 and collimation exit facet 202, and light transmission collimation conductive film 21 is Single layer structure is arranged on collimated incident face 201 or collimation exit facet 202.A plurality of standard is provided on light transmission collimation conductive film 21 Straight conductive electrode 22, a plurality of collimation conductive electrode 22 mutually disjoint.Every collimation conductive electrode 22 includes collimation 221 He of input terminal Collimate output terminal 222.Each collimation input terminal 221 and each collimation output terminal 222 are all connected with forming one with processor 80 Collimate galvanic circle, as a result, it is a plurality of collimation conductive electrode 22 collimation input terminal 221 and collimation output terminal 222 respectively with processing Device 80 connects to form a plurality of collimation galvanic circle.Wherein, there are many arrangement modes of a plurality of collimation conductive electrode 22, for example, The extending direction of every collimation conductive electrode 22 collimates the length direction of conductive film 21 for light transmission, and a plurality of collimation conductive electrode 22 is flat Between-line spacing sets (as shown in Figure 3)；Alternatively, the extending direction of every collimation conductive electrode 22 collimates the width of conductive film 21 for light transmission Spend direction, a plurality of collimation conductive electrode 22 parallel interval setting (not shown)；Alternatively, the extension side of a plurality of collimation conductive electrode 22 To the diagonal that conductive film 21 is collimated for light transmission, a plurality of collimation conductive electrode 22 parallel interval setting (not shown).No matter The arrangement mode for collimating conductive electrode 22 is which kind of above-mentioned mode, more for collimating conductive electrode 22 compared to setting single Item collimation conductive electrode 22 can occupy the more area of light transmission collimation conductive film 21, can correspondingly export more collimation electricity Signal, processor 80 can more precisely judge whether light transmission collimation conductive film 21 ruptures according to more collimation electric signal, into Judge whether collimating element 20 ruptures to one step, promote the accuracy of 20 Safety check-up of collimating element.Light transmission collimates conductive film 21 Can also be individual layer bridging structure, the light transmission collimation conductive film 21 of individual layer bridging structure and the individual layer frame being arranged on diffraction element 30 The light transmission diffraction conductive film 31 of bridge structure is similar, and the light transmission diffraction conductive film 31 of individual layer bridging structure is described below, Therefore, the light transmission of individual layer bridging structure collimation conductive film 21 is not developed in details herein.
Connection collimation conductive electrode 22 and the position of the conducting element 52 of circuit board 51 can be：Multiple conducting elements 52 paste It is attached to the inner surface of the side wall 61 of lens barrel 60, one end and collimation input terminal 221 or the collimation output terminal 222 of each conducting element 52 It is electrically connected, the other end is electrically connected (as depicted in figs. 1 and 2) with circuit board 51；Alternatively, the side wall 61 of lens barrel 60 offer with Multiple 52 corresponding grooves 63 of conducting element, multiple conducting elements 52 are arranged in corresponding groove 63, each conducting element 52 One end be electrically connected with collimation input terminal 221 or collimation output terminal 222, the other end and circuit board 51 be electrically connected (such as Fig. 4 and Shown in Fig. 5)；Alternatively, the side wall 61 of lens barrel 60 is provided in the axial direction with a looping pit 64, multiple conducting elements 52 are arranged at ring In shape hole 64, one end of each conducting element 52 and collimation input terminal 221 or collimation output terminal 222 are electrically connected, the other end with Circuit board 51 is electrically connected (as shown in Figure 6 and Figure 7).
Wherein, conducting element 52 can be brilliant line 521 or shrapnel 522.
For example, as depicted in figs. 1 and 2, conducting element 52 is shrapnel 522.Multi-disc shrapnel 522 is provided on circuit board 51, The length of multi-disc shrapnel 522 extends to the light emission direction of laser emitter 10.Multi-disc shrapnel 522 is attached to the side wall 61 of lens barrel 60 Inner surface, the quantity of shrapnel 522 is twice of the quantity for collimating conductive electrode 22.One end of every shrapnel 522 and circuit board 51 connections, the other end are connect with collimation input terminal 221 or collimation output terminal 222.Spaced setting between multi-disc shrapnel 522, In this way, ensure mutually insulated between multi-disc shrapnel 522, so that it is guaranteed that mutually insulated between a plurality of collimation conductive electrode 22.Certainly, Also it can be wrapped in the remaining surface except the contact position with collimating input terminal 221 or collimation output terminal 222 of every shrapnel 522 One layer of insulating materials is covered, further ensures that mutually insulated between a plurality of collimation conductive electrode 22.
As shown in Figure 4 and Figure 5, the side wall 61 of lens barrel 60 offers and 522 corresponding groove 63 of multi-disc shrapnel, multi-disc shrapnel 522 are arranged in corresponding groove 63.The installation position of shrapnel 522 and multiple collimation input terminals 221 and multiple collimation output terminals 222 position corresponds.The length of shrapnel 522 extends to the light emission direction of laser emitter 10, one end of every shrapnel 522 It is contacted with circuit board 51, the other end is contacted with collimation input terminal 221 or collimation output terminal 222.
As shown in Figure 6 and Figure 7, conducting element 52 is brilliant line 521, and the side wall 61 of lens barrel 60 is provided in the axial direction with looping pit 64, a plurality of crystalline substance line 521 is housed in looping pit 64.Wherein, one end of the brilliant line 521 in part is electrically connected with collimation input terminal 221, The other end is electrically connected with circuit board 51, and one end of the brilliant line 521 of rest part is electrically connected with collimation output terminal 222, the other end with Circuit board 51 is electrically connected.The outer layer of a plurality of crystalline substance line 521 can coat one layer of insulating materials, in this way, between avoiding a plurality of brilliant line 521 It contacts with each other to cause there is no the problem of mutually insulated between a plurality of collimation conductive electrode 22.
In addition, brilliant line 521 can also be attached to the inner surface of lens barrel 60 or be arranged on what the side wall 61 of lens barrel 60 opened up In groove 63；Shrapnel can also be housed in looping pit 64.
Also referring to Fig. 8 to Figure 11, in some embodiments, conducting element 52 is multiple, and detecting element 70 is Optical diffraction conductive film 31.Light transmission diffraction conductive film 31 is arranged on diffraction element 30.It is provided with and spreads out on light transmission diffraction conductive film 31 Penetrate conductive electrode 32.Light transmission collimation conductive film 21 is provided on judgment mechanism and collimating element 20 whether diffraction element 30 ruptures When rupture whether judgment mechanism it is identical, details are not described herein.The material of light transmission diffraction conductive film 31 collimates conductive film with light transmission 21 material is also identical, also repeats no more herein.
Specifically, diffraction element 30 includes the diffraction plane of incidence 301 and diffraction exit facet 302, and light transmission diffraction conductive film 31 is Individual layer bridging structure is arranged on diffraction exit facet 302.The light transmission diffraction conductive film 31 of individual layer bridging structure is equipped with a plurality of spread out Penetrate conductive electrode 32.It is first diffraction conductive electrode 323 of a plurality of diffraction conductive electrode 32 including a plurality of parallel interval, a plurality of parallel The second diffraction conductive electrode 324 and a plurality of bridge formation diffraction conductive electrode 325 at interval.A plurality of first diffraction conductive electrode 323 with A plurality of second diffraction conductive electrode 324 is crisscross, and every first diffraction conductive electrode 323 is continuous uninterrupted, and every second is spread out Penetrate conductive electrode 324 disconnected with the staggered place of corresponding first diffraction conductive electrode 323 and with the conductive electricity of a plurality of first diffraction Pole 323 is not turned on.The gap of corresponding second diffraction conductive electrode 324 is connected every bridge formation diffraction conductive electrode 325.Frame Diffraction insulator 326 is equipped at the intervening portion of bridge diffraction conductive electrode 325 and the first diffraction conductive electrode 323.Every first The both ends of diffraction conductive electrode 323 connect to form a diffraction galvanic circle, the conductive electricity of every second diffraction with processor 80 The both ends of pole 324 are connect with processor 80 to form a diffraction galvanic circle, as a result, a plurality of first diffraction conductive electrode 323 Both ends respectively connect to form a plurality of diffraction galvanic circle with processor 80, the two of a plurality of second diffraction conductive electrode 324 End respectively connect to form a plurality of diffraction galvanic circle with processor 80.Wherein, the material of diffraction insulator 326 can be with The modes system such as silk-screen or yellow light processing procedure can be used in the organic material of good translucency and insulating properties, diffraction insulator 326 Make.A plurality of first diffraction conductive electrode 323 with a plurality of second diffraction conductive electrode 324 is crisscross refers to a plurality of first diffraction Conductive electrode 323 is mutually perpendicular to interlock with a plurality of second diffraction conductive electrode 324, i.e. the first diffraction conductive electrode 323 and second The angle of diffraction conductive electrode 324 is 90 degree.Certainly, in other embodiments, a plurality of first diffraction conductive electrode 323 with it is more The second diffraction of item conductive electrode 324 is crisscross to can also be that a plurality of first diffraction conductive electrode 323 is led with a plurality of second diffraction Electrode 324 is mutually inclined staggeredly.In use, processor 80 can be simultaneously to a plurality of first diffraction conductive electrode 323 and a plurality of Second diffraction conductive electrode 324 is powered to obtain multiple diffraction electric signals, alternatively, processor 80 can be successively to a plurality of first diffraction Conductive electrode 323 and a plurality of second diffraction conductive electrode 324 are powered to obtain multiple diffraction electric signals, and then, processor 80 is again Judge whether light transmission diffraction conductive film 31 ruptures according to diffraction electric signal.For example, when detecting that number is the first diffraction 1. For the diffraction electric signal that conductive electrode 323 exports not in default range of diffraction, number is that the second diffraction conductive electrode 324 3. is defeated When the diffraction electric signal gone out is not in default range of diffraction, illustrate that light transmission diffraction conductive film 31 in number is that the first diffraction 1. is led Electrode 323 and 3. 324 staggered place of the second diffraction conductive electrode rupture that number is, then diffraction element 30 and light transmission diffraction are conductive The corresponding position of 31 rupture location of film also ruptures.In this way, the light transmission diffraction conductive film 31 of individual layer bridging structure can be more accurate The specific location whether ground detection of diffracted element 30 ruptures and rupture.
Light transmission diffraction conductive film 31 or single layer structure.The light transmission diffraction conductive film 31 of single layer structure and single layer structure The structure of light transmission collimation conductive film 21 is similar, and details are not described herein.
Connection diffraction conductive electrode 32 and the position of the conducting element 52 of circuit board 51 can be：Multiple conducting elements 52 paste The inner surface of the side wall 61 of lens barrel 60 is attached to, one end and the diffraction input terminal 321 of each conducting element 52 (are led including the first diffraction The diffraction input terminal 3212 of the 3211 and second diffraction conductive electrode 324 of diffraction input terminal of electrode 323) or diffraction output terminal 322 (the diffraction output terminals of the 3221 and second diffraction conductive electrode 324 of diffraction output terminal including the first diffraction conductive electrode 323 3222) it is electrically connected, the other end is electrically connected (as shown in Figure 8 and Figure 11) with circuit board 51；Alternatively, the side wall 61 of lens barrel 60 is opened Equipped with multiple 52 corresponding grooves 63 of conducting element, multiple conducting elements 52 are arranged in corresponding groove 63, each conductive One end of element 52 is electrically connected with diffraction input terminal 321 or diffraction output terminal 322, and the other end is electrically connected with circuit board 51 (as shown in Figure 12 and Figure 13)；Alternatively, the side wall 61 of lens barrel 60 is provided in the axial direction with a looping pit 64, multiple conducting elements 52 It is arranged in looping pit 64, one end and the diffraction input terminal 321 or diffraction output terminal 322 of each conducting element 52 electrically connect It connects, the other end is electrically connected (as shown in Figure 14 and Figure 15) with circuit board 51.
Wherein, conducting element 52 can be brilliant line 521 or shrapnel 522.
For example, as shown in Figure 8 and Figure 11, conducting element 52 is shrapnel 522.Multi-disc shrapnel 522 is provided on circuit board 51, The length of multi-disc shrapnel 522 extends to the light emission direction of laser emitter 10.Multi-disc shrapnel 522 is attached to the side wall 61 of lens barrel 60 Inner surface, twice for the quantity of diffraction conductive electrode 32 of the quantity of shrapnel 522.One end of every shrapnel 522 and circuit board 51 connections, the other end are connect with diffraction input terminal 321 or diffraction output terminal 322.Specifically, one end of part shrapnel 522 and the One diffraction input terminal 3211 connects, and the other end is connect with circuit board 51；One end of part shrapnel 522 and the first diffraction output terminal 3221 connections, the other end are connect with circuit board 51；One end of part shrapnel 522 is connect with the second diffraction input terminal 3212, another End is connect with circuit board 51；One end of part shrapnel 522 is connect with the second diffraction output terminal 3222, and the other end connects with circuit board 51 It connects.Spaced setting between multi-disc shrapnel 522, in this way, ensureing mutually insulated between multi-disc shrapnel 522, so that it is guaranteed that a plurality of Mutually insulated between diffraction conductive electrode 32.Certainly, also can every shrapnel 522 except with collimation input terminal 221 or collimation One layer of insulating materials is coated in the remaining surface of the contact position of output terminal 222, further ensures that a plurality of diffraction conductive electrode 32 Between mutually insulated.
As shown in Figure 12 and Figure 13, the side wall 61 of lens barrel 60 offers and 522 corresponding groove 63 of multi-disc shrapnel, multi-disc bullet Piece 522 is arranged in corresponding groove 63.The installation position of shrapnel 522 is exported with multiple diffraction input terminals 321 and multiple diffraction The position at end 322 corresponds.The length of shrapnel 522 extends to the light emission direction of laser emitter 10, and the one of every shrapnel 522 End is contacted with circuit board 51, and the other end is in direct contact with diffraction input terminal 321 or diffraction output terminal 322.Specifically, part shrapnel 522 one end is connect with the first diffraction input terminal 3211, and the other end is connect with circuit board 51；One end of part shrapnel 522 and the One diffraction output terminal 3221 connects, and the other end is connect with circuit board 51；One end of part shrapnel 522 and the second diffraction input terminal 3212 connections, the other end are connect with circuit board 51；One end of part shrapnel 522 is connect with the second diffraction output terminal 3222, another End is connect with circuit board 51.
As shown in Figure 14 and Figure 15, conducting element 52 is brilliant line 521, and the side wall 61 of lens barrel 60 is provided in the axial direction with looping pit 64, a plurality of crystalline substance line 521 is housed in looping pit 64.Wherein, one end of the brilliant line 521 in part is electrically connected with diffraction input terminal 321, The other end is electrically connected with circuit board 51, and one end of the brilliant line 521 of rest part is electrically connected with diffraction output terminal 322, the other end with Circuit board 51 is electrically connected.The outer layer of a plurality of crystalline substance line 521 can coat one layer of insulating materials, in this way, avoiding phase between a plurality of brilliant line 521 It mutually contacts to cause there is no the problem of mutually insulated between a plurality of diffraction conductive electrode 32.
In addition, brilliant line 521 can also be attached to the inner surface of lens barrel 60 or be arranged on what the side wall 61 of lens barrel 60 opened up In groove 63；Shrapnel can also be housed in looping pit 64.
Also referring to Figure 16 to Figure 19, in some embodiments, conducting element 52 is multiple, and detecting element 70 is mixes The miscellaneous collimation conducting particles 23 in collimating element 20.It collimates conducting particles 23 and forms collimation conductive path 24.At this point, collimation member The judgment mechanism whether part 20 ruptures is as follows：When collimating element 20 is in serviceable condition, adjacent collimation conducting particles 23 it Between be engagement.Entirely the resistance of collimation conductive path 24 is smaller at this time, is powered in this case to collimation conductive path 24, i.e., Apply a certain size voltage, then the electric current that the collimation conductive path 24 that processor 80 is got at this time exports is larger.And when standard When straight element 20 ruptures, it is entrained in junction between the collimation conducting particles 23 in collimating element 20 and disconnects, at this time entire collimation The resistance approach infinity of conductive path 24 is powered in this case to collimation conductive path 24, the standard that processor 80 is got The electric current that straight conductive path 24 exports is smaller.Therefore, first way exports after being powered according to collimation conductive path 24 Collimation electric signal (i.e. electric current) and collimating element 20 come for the difference size collimated between electric signal detected under state of rupture Judge whether collimating element 20 ruptures；The second way：The collimation electric signal exported after being powered according to collimation conductive path 24 Directly judge whether collimating element 20 ruptures, specifically, if collimation electric signal does not determine that collimation member in the range of default collimation Part 20 ruptures, when electric signal is collimated in the range of default collimation if determine that collimating element 20 does not rupture.
Specifically, multiple collimation conducting particles 23 are doped in collimating element 20, multiple collimation conducting particles 23 form more Item mutually disjoints and a plurality of collimation conductive path 24 of mutually insulated.There are many arrangement modes for collimating conductive path 24：For example, The extending direction of every collimation conductive path 24 is the length direction (as shown in figure 18) of collimating element 20；Alternatively, every collimation The extending direction of conductive path 24 is the width direction (not shown) of collimating element 20, a plurality of collimation 24 parallel interval of conductive path Setting；Alternatively, the extending direction of every collimation conductive path 24 is the diagonal (not shown) for collimating the plane of incidence 201, it is more Item collimation conductive path 24 parallel interval setting；Alternatively, the extending direction of every collimation conductive path 24 is the collimation plane of incidence 201 Diagonal (not shown) with collimating exit facet 202, a plurality of collimation conductive path 24 are set along parallel interval；It is alternatively, every Item collimates conductive path 24 and sets (not shown) along the thickness direction parallel interval of collimating element 20.No matter conductive path 24 is collimated Arrangement mode be which kind of above-mentioned mode, compared to setting single collimate conductive path 24 for, a plurality of collimation conductive path 24 can occupy the more volume of collimating element 20, can correspondingly export more collimation electric signals, processor 80 can basis More collimation electric signal more precisely judges whether collimating element 20 ruptures, and promotes the accurate of 20 Safety check-up of collimating element Property.In other embodiments, the arrangement mode of a plurality of collimation conductive path 24 can also be with the diffraction element 30 that hereafter describes In a plurality of collimation conductive path 24 arrangement mode it is similar, herein first without narration.
Connection collimation conductive path 24 and the position of the conducting element 52 of circuit board 51 can be：Multiple conducting elements 52 paste It is attached to the inner surface of the side wall 61 of lens barrel 60, one end and collimation input terminal 241 or the collimation output terminal 242 of each conducting element 52 It is electrically connected, the other end is electrically connected (as shown in fig. 16 and fig. 19) with circuit board 51；Alternatively, the side wall 61 of lens barrel 60 offers With multiple 52 corresponding grooves 63 of conducting element, multiple conducting elements 52 are arranged in corresponding groove 63, each conducting element 52 one end is electrically connected with collimation input terminal 241 or collimation output terminal 242, and the other end is electrically connected with circuit board 51 (as schemed Shown in 20 and Figure 21)；Alternatively, the side wall 61 of lens barrel 60 is provided in the axial direction with a looping pit 64, multiple conducting elements 52 are all provided with It puts in looping pit 64, one end and the collimation input terminal 241 or collimation output terminal 242 of each conducting element 52 are electrically connected, separately One end is electrically connected (as shown in Figure 22 and Figure 23) with circuit board 51.
Wherein, conducting element 52 can be brilliant line 521 or shrapnel 522.
For example, as shown in fig. 16 and fig. 19, conducting element 52 is shrapnel 522.Multi-disc shrapnel is provided on circuit board 51 522, the length of multi-disc shrapnel 522 extends to the light emission direction of laser emitter 10.Multi-disc shrapnel 522 is attached to the side of lens barrel 60 The inner surface of wall 61, the quantity of shrapnel 522 are twice of the quantity for collimating conductive path 24.One end of every shrapnel 522 and electricity Road plate 51 connects, and the other end is connect with collimation input terminal 241 or collimation output terminal 242.It is spaced between multi-disc shrapnel 522 to set It puts, in this way, ensureing mutually insulated between multi-disc shrapnel 522, so that it is guaranteed that mutually insulated between a plurality of collimation conductive path 24.When It so, also can be in the remaining surface except the contact position with collimating input terminal 241 or collimation output terminal 242 of every shrapnel 522 One layer of insulating materials of upper cladding further ensures that mutually insulated between a plurality of collimation conductive path 24.
As shown in Figure 20 and Figure 21, the side wall 61 of lens barrel 60 offers and 522 corresponding groove 63 of multi-disc shrapnel, multi-disc bullet Piece 522 is arranged in corresponding groove 63.The installation position of shrapnel 522 is exported with multiple collimation input terminals 241 and multiple collimations The position at end 242 corresponds.The length of shrapnel 522 extends to the light emission direction of laser emitter 10, and the one of every shrapnel 522 End is contacted with circuit board 51, and the other end is in direct contact with collimation input terminal 241 or collimation output terminal 242.
As shown in Figure 22 and Figure 23, conducting element 52 is brilliant line 521, and the side wall 61 of lens barrel 60 is provided in the axial direction with looping pit 64, a plurality of crystalline substance line 521 is housed in looping pit 64.Wherein, one end of the brilliant line 521 in part is electrically connected with collimation input terminal 241, The other end is electrically connected with circuit board 51, and one end of the brilliant line 521 of rest part is electrically connected with collimation output terminal 242, the other end with Circuit board 51 is electrically connected.The outer layer of a plurality of crystalline substance line 521 can coat one layer of insulating materials, in this way, avoiding phase between a plurality of brilliant line 521 It mutually contacts to cause there is no the problem of mutually insulated between a plurality of collimation conductive path 24.
In addition, brilliant line 521 can also be attached to the inner surface of lens barrel 60 or be arranged on what the side wall 61 of lens barrel 60 opened up In groove 63；Shrapnel can also be housed in looping pit 64.
Also referring to Figure 24 to Figure 27, in some embodiments, conducting element 52 is multiple, and detecting element 70 is mixes Miscellaneous multiple diffraction conducting particles 33 in diffraction element 30, multiple diffraction conducting particles 33 form conductive path 34.Diffraction member Judgment mechanism when mechanism whether part 30 ruptures adulterates collimation conducting particles 23 with collimating element 20 whether rupture is identical, herein It repeats no more.
Specifically, multiple diffraction conducting particles 33 are doped in diffraction element 30, multiple diffraction conducting particles 33 form more Diffraction conductive path 34, every diffraction conductive path 34 include diffraction input terminal 341 and diffraction output terminal 342.A plurality of diffraction Conductive path 34 includes a plurality of first diffraction conductive path 343 and a plurality of second diffraction conductive path 344.A plurality of first diffraction is led 343 parallel interval of electric pathway is set, a plurality of second diffraction conductive path, 344 parallel interval setting.Wherein, a plurality of first diffraction is led Electric pathway 343 and a plurality of second diffraction conductive path 344 are spatially crisscross, and every first diffraction conductive path 343 wraps The first diffraction input terminal 3411 and the first diffraction output terminal 3421 are included, every second diffraction conductive path 344 includes the second diffraction 3421 and second diffraction output terminal 3422 of input terminal, i.e. diffraction input terminal 341 spread out including the first diffraction input terminal 3411 and second Input terminal 3412 is penetrated, diffraction output terminal 342 includes the first diffraction output terminal 3421 and the second diffraction output terminal 3422.Each first Diffraction input terminal 3411 and each first diffraction output terminal 3421 are connect to form a diffraction galvanic circle, often with processor 80 A second diffraction input terminal 3412 and each second diffraction output terminal 3422 connect to form a diffraction conduction with processor 80 Circuit.The both ends of a plurality of first diffraction conductive path 343 respectively connect conductive to form a plurality of diffraction with processor 80 as a result, Circuit, the both ends of a plurality of second diffraction conductive path 344 connect to form a plurality of diffraction galvanic circle with processor 80 respectively. A plurality of first diffraction conductive path 343 and a plurality of second diffraction conductive path 344 be spatially crisscross to refer to a plurality of the One diffraction conductive path 343 is spatially mutually perpendicular to interlock with a plurality of second diffraction conductive path 344, i.e. the first diffraction is conductive The angle of 343 and second diffraction conductive path 344 of access is 90 degree.At this point, the extension side of a plurality of first diffraction conductive path 343 To the length direction for diffraction element 30, and the width that the extending direction of a plurality of second diffraction conductive path 344 is diffraction element 30 It spends direction (as shown in figure 26)；Alternatively, the extending direction of a plurality of first diffraction conductive path 343 is the thickness side of diffraction element 30 To, and the length direction (not shown) that the extending direction of a plurality of second diffraction conductive path 344 is diffraction element 30.Certainly, exist In other embodiment, a plurality of first diffraction conductive path 343 is spatially handed in length and breadth with a plurality of second diffraction conductive path 344 Mistake can also be that a plurality of first diffraction conductive path 343 is spatially mutually inclined friendship with a plurality of second diffraction conductive path 344 It is wrong.In use, processor 80 can be simultaneously to a plurality of first diffraction conductive path 343 and a plurality of second diffraction conductive path 344 It is powered to obtain multiple electric signals.Alternatively, processor 80 can successively spread out to a plurality of first diffraction conductive path 343 and a plurality of second It penetrates conductive path 344 to be powered to obtain multiple diffraction electric signals, then, processor 80 judges diffraction further according to diffraction electric signal Whether element 30 ruptures.For example, when detecting that number is that the electric signal that the first diffraction conductive path 343 2. exports is not being preset In range of diffraction, and number be 4. the second diffraction conductive path 344 output diffraction electric signal also not in default range of diffraction When interior, illustrate that diffraction element 30 is the first diffraction conductive path 343 2. in number and number is that the second diffraction conduction 4. is led to The staggered place rupture on road 344, then 30 corresponding position of diffraction element also ruptures, in this way, passing through a plurality of first diffraction conductive path 343 and the mode of a plurality of second diffraction conductive path, 344 crisscross arrangement can more precisely detect diffraction element 30 and be No rupture and the specific location of rupture.In other embodiments, the arrangement mode of a plurality of diffraction conductive path 34 can be with Similar with the arrangement mode that conductive path 24 is collimated in collimating element 20, details are not described herein.
Connection diffraction conductive path 34 and the position of the conducting element 52 of circuit board 51 can be：Multiple conducting elements 52 paste The inner surface of the side wall 61 of lens barrel 60 is attached to, one end of each conducting element 52 and diffraction input terminal 341 are (defeated including the first diffraction Enter end 3411 and the second diffraction input terminal 3412) or diffraction output terminal 342 (including the first diffraction output terminal 3421 and the second diffraction Output terminal 3422) it is electrically connected, the other end is electrically connected (as shown in Figure 24 and Figure 27) with circuit board 51；Alternatively, lens barrel 60 Side wall 61, which is offered, to be arranged on multiple 52 corresponding grooves 63 of conducting element, multiple conducting elements 52 in corresponding groove 63, One end of each conducting element 52 is electrically connected with diffraction input terminal 341 or diffraction output terminal 342, the other end and 51 electricity of circuit board Property connection (as shown in Figure 28 and Figure 29)；Alternatively, the side wall 61 of lens barrel 60 is provided in the axial direction with a looping pit 64, multiple conductions Element 52 is arranged in looping pit 64, one end and 342 electricity of diffraction input terminal 341 or diffraction output terminal of each conducting element 52 Property connection, the other end and circuit board 51 are electrically connected (as shown in figures 30 and 31).
Wherein, conducting element 52 can be brilliant line 521 or shrapnel 522.
For example, as shown in Figure 24 and Figure 27, conducting element 52 is shrapnel 522.Multi-disc shrapnel is provided on circuit board 51 522, the length of multi-disc shrapnel 522 extends to the light emission direction of laser emitter 10.Multi-disc shrapnel 522 is attached to the side of lens barrel 60 The inner surface of wall 61, the quantity of shrapnel 522 are twice of the quantity of diffraction conductive path 34.One end of every shrapnel 522 and electricity Road plate 51 connects, and the other end is connect with diffraction input terminal 341 or diffraction output terminal 342.Specifically, one end of part shrapnel 522 It is connect with the first diffraction input terminal 3411, the other end is connect with circuit board 51；One end of part shrapnel 522 is exported with the first diffraction 3421 connection of end, the other end are connect with circuit board 51；One end of part shrapnel 522 is connect with the second diffraction input terminal 3412, separately One end is connect with circuit board 51；One end of part shrapnel 522 is connect with the second diffraction output terminal 3422, the other end and circuit board 51 Connection.Spaced setting between multi-disc shrapnel 522, in this way, ensureing mutually insulated between multi-disc shrapnel 522, so that it is guaranteed that more Mutually insulated between diffraction conductive path 34.It certainly, also can be in every shrapnel 522 except with diffraction input terminal 341 or spreading out One layer of insulating materials of cladding in the remaining surface of the contact position of output terminal 342 is penetrated, further ensures that a plurality of diffraction conductive path Mutually insulated between 34.
As shown in Figure 28 and Figure 29, the side wall 61 of lens barrel 60 offers and 522 corresponding groove 63 of multi-disc shrapnel, multi-disc bullet Piece 522 is arranged in corresponding groove 63.The installation position of shrapnel 522 and multiple diffraction input terminals 341 and diffraction output terminal 342 Position correspond.Light emission direction from the length of shrapnel 522 to laser emitter 10 extend, one end of every shrapnel 522 with Circuit board 51 contacts, and the other end is in direct contact with diffraction input terminal 341 or diffraction output terminal 342.Specifically, part shrapnel 522 One end connect with the first diffraction input terminal 3411, the other end is connect with circuit board 51；Spread out with first one end of part shrapnel 522 It penetrates output terminal 3421 to connect, the other end is connect with circuit board 51；One end of part shrapnel 522 connects with the second diffraction input terminal 3412 It connects, the other end is connect with circuit board 51；One end of part shrapnel 522 is connect with the second diffraction output terminal 3422, the other end and electricity Road plate 51 connects.
As shown in figures 30 and 31, conducting element 52 is brilliant line 521, and the side wall 61 of lens barrel 60 is provided in the axial direction with looping pit 64, a plurality of crystalline substance line 521 is housed in looping pit 64.Wherein, one end of the brilliant line 521 in part and 3411 electricity of the first diffraction input terminal Connection, the other end are electrically connected with circuit board 51；One end of the brilliant line 521 in part is electrically connected with the first diffraction output terminal 3421, another End is electrically connected with circuit board 51；One end of the brilliant line 521 in part is electrically connected with the second diffraction input terminal 3412, the other end and circuit board 51 electrical connections；One end of the brilliant line 521 in part is electrically connected with the second diffraction output terminal 3422, and the other end is electrically connected with circuit board 51. The outer layer of a plurality of crystalline substance line 521 can coat one layer of insulating materials, in this way, it is more to cause to contact with each other between avoiding a plurality of brilliant line 521 There is no the problem of mutually insulated between diffraction conductive path 34.
In addition, brilliant line 521 can also be attached to the inner surface of lens barrel 60 or be arranged on what the side wall 61 of lens barrel 60 opened up In groove 63；Shrapnel can also be housed in looping pit 64.
Figure 32 is please referred to, in some embodiments, light transmission collimation is provided on the collimated incident face 201 of collimating element 20 Conductive film 21, light transmission collimate and are provided with a plurality of collimation conductive electrode 22 being arranged in parallel on conductive film 21, mixed in diffraction element 30 Miscellaneous to have multiple diffraction conducting particles 33, multiple diffraction conducting particles 33 form a plurality of parallel and mutually insulated diffraction conductive path 34.Conducting element 52 is brilliant line 52.The side wall 61 of lens barrel 60 is provided in the axial direction with a looping pit 64, connects a plurality of collimation respectively Conductive electrode 22 and a plurality of brilliant line 5212 (calling in the following text " the brilliant line 5212 of collimation ") of circuit board 51 are attached to the side wall 61 of lens barrel 60 Inner surface on, a plurality of brilliant line 5211 for connecting a plurality of diffraction conductive path 34 and circuit board 51 respectively (calls " diffraction crystalline substance line in the following text 5211 ") it is housed in looping pit 64.Specifically, one end of the brilliant line 5212 of part collimation is electrically connected with collimation input terminal 221, The other end is electrically connected with circuit board 51, and one end of the brilliant line 5212 of collimation of rest part is electrically connected with collimation output terminal 222, another End is electrically connected with circuit board 51.One end of part diffraction crystalline substance line 5211 is connect with diffraction input terminal 321, the other end and circuit board 51 Electrical connection, one end of the diffraction crystalline substance line 5211 of rest part are connect with diffraction output terminal 322, and the other end is connect with circuit board 51. Collimation conductive electrode 22 on collimating element 20 can will collimate electric signal output to processor 80, diffraction by collimating brilliant line 5212 Diffraction conductive path 34 on element 30 can be by diffraction crystalline substance line 5211 by diffraction electric signal output to processor 80.In this way, place Reason device 80 not only can detect whether collimating element 20 ruptures, and also can detect whether diffraction element 30 ruptures, and detecting When any one in collimating element 20 and diffraction element 30 ruptures, it is momentarily turned off laser emitter 10 or reduces laser emitter 10 Transmission power, to avoid to human eye generate harm.
Figure 33 is please referred to, in some embodiments, circuit board assemblies 50 further include substrate 53, and circuit board 51 is carried on base On plate 53.Circuit board 51 can be hardboard, soft board or Rigid Flex.Circuit board 51 offers via 511, laser emitter 10 It is carried on substrate 53 and is housed in via 511.Laser emitter 10 is electrically connected via circuit board 51 with processor 80.Substrate Heat emission hole 531 is further opened on 53, the heat that laser emitter 10 or the work of circuit board 51 generate can be dissipated by heat emission hole 531 Go out, heat-conducting glue can also be filled in heat emission hole 531, to further improve the heat dissipation performance of substrate 53.
Laser emitter 10 can be vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL) or edge-emitting laser (edge-emitting laser, EEL), in embodiment as shown in figure 33, Laser emitter 10 is edge-emitting laser, and specifically, laser emitter 10 can be distributed feedback laser (Distributed Feedback Laser, DFB).Laser emitter 10 is used to emit laser into host cavity 62.Incorporated by reference to Figure 34, laser emitter 10 is whole to be in the form of a column, and an end face of the laser emitter 10 far from substrate 53 forms light-emitting surface 11, laser It is sent out from light-emitting surface 11, light-emitting surface 11 is towards collimating element 20.Laser emitter 10 is fixed on substrate 53, specifically, laser Transmitter 10 can be bonded in by sealing 15 on substrate 53, such as the one side bonding that laser emitter 10 is opposite with light-emitting surface 11 On substrate 53.Incorporated by reference to Figure 33 and Figure 35, the side 12 of laser emitter 10 can also be bonded on substrate 53, and sealing 15 is wrapped The side of surrounding is wrapped, can also only bond some face of side and substrate 53 or certain several face of bonding and substrate 53.At this time Sealing 15 can be heat-conducting glue, and the work heat of generation of laser emitter 10 is conducted into substrate 53.
Laser projection module 100 using edge-emitting laser as laser emitter 10, one side edge-emitting laser compared with The temperature drift of VCSEL array is smaller, on the other hand, since edge-emitting laser is single-point light emitting structure, without array of designs structure, It makes simply, the cost of laser projection module 100 is relatively low.
The laser of distributed feedback laser obtains the gain of power when propagating, by the feedback of optical grating construction.It carries The power of high distributed feedback laser is needed by increasing Injection Current and/or increasing the length of distributed feedback laser, Since increase Injection Current can cause the power consumption of distributed feedback laser to increase and the problem of serious of generating heat occurs, In order to ensure that distributed feedback laser can work normally, need to increase the length of distributed feedback laser, cause to be distributed Feedback laser is generally in elongate strip structure.When the light-emitting surface 11 of edge-emitting laser is towards collimating element 20, edge emitting Laser is placed in vertical, since edge-emitting laser is in elongate strip structure, edge-emitting laser be susceptible to fall, shift or Shaking etc. is unexpected, therefore by setting sealing 15 that can fix edge-emitting laser, prevents edge-emitting laser from falling It falls, shift or shakes etc. and is unexpected.
Figure 33 and Figure 36 are please referred to, in some embodiments, as shown in figure 36 consolidate can also be used in laser emitter 10 Determine mode to be fixed on substrate 53.Specifically, laser projection module 100 includes multiple support elements 16, and support element 16 can be fixed On substrate 53.Multiple support elements 16 surround receiving space 160, and laser emitter 10 is housed in receiving space 160 and more A 16 support column of support element.Laser emitter 10 can be directly installed between multiple support elements 16 when mounted.At one In example, multiple support elements 16 clamp laser emitter 10 jointly, laser emitter 10 to be further prevented to shake.
In some embodiments, substrate 53 can save, and laser emitter 10 is directly anchored on circuit board 51 subtract The integral thickness of small laser projection module 100.
Figure 37 is please referred to, the present invention also provides a kind of depth cameras 1000.The depth camera 1000 of embodiment of the present invention Laser projection module 100, image acquisition device 200 and processor 80 including above-mentioned any one embodiment.Wherein, image is adopted The laser pattern that storage 200 projects for acquisition after diffraction element diffraction into object space.Processor 80 respectively with laser Projection module 100 and image acquisition device 200 connect.Processor 80 is used to handle laser pattern to obtain depth image.Herein Processor 80 can be the processor 80 in laser projection module.
Specifically, laser projection module 100 projects laser pattern into object space by projecting window 901, and image is adopted Storage 200 is acquired by acquisition window 902 by the modulated laser pattern of target object.Image acquisition device 200 can be infrared phase Machine, processor 80 calculate each picture corresponding with reference pattern of each pixel in the laser pattern using image matching algorithm The deviation value of vegetarian refreshments further obtains the depth image of the laser pattern further according to deviation value.Wherein, image matching algorithm can be Digital picture correlation (Digital Image Correlation, DIC) algorithm.It is of course also possible to use other images match are calculated Method replaces DIC algorithms.
Also referring to Fig. 1 and Figure 38, the electronic device 3000 of embodiment of the present invention includes housing 2000 and above-mentioned reality Apply the depth camera 1000 of mode.Depth camera 1000 is arranged in housing 2000 and exposes to obtain depth map from housing 2000 Picture.
The laser projection module 100 of embodiment of the present invention is made by setting detecting element 70 on optical module 40 Detecting element 70 with circuit board 51 is electrically connected with conducting element, is exported so that processor 80 can receive detecting element 70 Electric signal, to judge whether optical module 40 ruptures according to electric signal.After detecting that optical module 40 ruptures, close in time Laser emitter 10 or the power for reducing laser emitter 10, the laser energy mistake for leading to transmitting is ruptured to avoid optical module 40 The problem of big and eyes of harm users, the safety that improving laser projection module 100 uses.
In the description of this specification, reference term " one embodiment ", " example ", " is specifically shown " some embodiments " The description of example " or " some examples " etc. means specific features, structure, material or the spy for combining the embodiment or example description Point is contained at least one embodiment of the present invention or example.In the present specification, schematic expression of the above terms are not It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office It is combined in an appropriate manner in one or more embodiments or example.In addition, without conflicting with each other, the skill of this field Art personnel can tie the different embodiments or examples described in this specification and the feature of different embodiments or examples It closes and combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned Embodiment is changed, changes, replacing and modification.

Claims (14)

1. a kind of laser projection module, which is characterized in that the laser projection module includes：
Laser emitter, the laser emitter are used to emit laser；
Optical module, the optical module are arranged in the luminous light path of the laser emitter, and the laser passes through the light Laser pattern is formed after learning component, detecting element is provided on the optical module；
Circuit board assemblies, the circuit board assemblies include circuit board and conducting element, and the detecting element passes through the conductive element Part and the circuit board electrical connection, the laser emitter are arranged on the circuit board assemblies；With
The processor being connect with the circuit board, the processor are used to receive the electric signal of the detecting element output to judge Whether the optical module ruptures.
2. laser projection module according to claim 1, which is characterized in that the laser projection module further includes lens barrel, The lens barrel is arranged on the circuit board and surrounds host cavity with the circuit board, and the laser emitter is housed in the receipts In cavity volume, the optical module includes being housed in diffraction element and collimating element in the host cavity, the collimating element with The diffraction element is set gradually along the luminous light path of the laser emitter.
3. laser projection module according to claim 2, which is characterized in that the conducting element includes multiple, the inspection It is the light transmission collimation conductive film being arranged on the collimating element to survey element, and being provided with collimation on the light transmission collimation conductive film leads Electrode, the collimation conductive electrode include collimation input terminal and collimation output terminal, and the collimation input terminal passes through described in one Conducting element is connect with the circuit board, and the collimation output terminal is connected by conducting element another described and the circuit board It connects.
4. laser projection module according to claim 2, which is characterized in that the conducting element includes multiple, the inspection It is the collimation conducting particles being entrained in the collimating element to survey element, and the collimation conducting particles forms collimation conductive path, The collimation conductive path includes collimation input terminal and collimation output terminal；The collimation input terminal passes through a conducting element and institute Circuit board connection is stated, the collimation output terminal is connect by conducting element another described with the circuit board.
5. laser projection module according to claim 3 or 4, which is characterized in that multiple conducting elements are attached to institute The inner surface of the side wall of lens barrel is stated, one end of each conducting element and the collimation input terminal or the collimation output terminal electricity Property connection, the other end and the circuit board are electrically connected；Or
The side wall of the lens barrel is provided in the axial direction with a looping pit, and multiple conducting elements are arranged at the looping pit Interior, one end of each conducting element is electrically connected with the collimation input terminal or the collimation output terminal, the other end and institute State circuit board electric connection；Or
The side wall of the lens barrel offers groove corresponding with multiple conducting elements, and each conducting element is arranged on corresponding In the groove, one end of each conducting element is electrically connected with the collimation input terminal or the collimation output terminal, separately One end is electrically connected with the circuit board.
6. laser projection module according to claim 2, which is characterized in that the conducting element includes multiple, the inspection It is the light transmission diffraction conductive film being arranged on the diffraction element to survey element, and being provided with diffraction on the light transmission diffraction conductive film leads Electrode, the diffraction conductive electrode include diffraction input terminal and diffraction output terminal, and the diffraction input terminal passes through described in one Conducting element is connect with the circuit board, and the diffraction output terminal is connected by conducting element another described and the circuit board It connects.
7. laser projection module according to claim 2, which is characterized in that the conducting element includes multiple, the inspection It is the diffraction conducting particles being entrained in the diffraction element to survey element, and the diffraction conducting particles forms diffraction conductive path, The diffraction conductive path includes diffraction input terminal and diffraction output terminal；The diffraction input terminal passes through a conducting element and institute Circuit board connection is stated, the diffraction output terminal is connect by conducting element another described with the circuit board.
8. the laser projection module described according to claim 6 or 7, which is characterized in that multiple conducting elements are attached to institute The inner surface of the side wall of lens barrel is stated, one end and the diffraction input terminal or the diffraction output terminal electricity of each conducting element Property connection, the other end and the circuit board are electrically connected；Or
The side wall of the lens barrel is provided in the axial direction with a looping pit, and multiple conducting elements are arranged at the looping pit Interior, one end and the diffraction input terminal or the diffraction output terminal of each conducting element are electrically connected, the other end and institute State circuit board electric connection；Or
The side wall of the lens barrel offers multiple grooves corresponding with multiple conducting elements, and each conducting element is arranged on pair In the groove answered, one end of each conducting element electrically connects with the diffraction input terminal or the diffraction output terminal It connects, the other end is electrically connected with the circuit board.
9. laser projection module according to claim 1, which is characterized in that the laser emitter includes edge emitting laser Device, the edge-emitting laser include light-emitting surface, and the light-emitting surface is towards the collimating element.
10. laser projection module according to claim 9, which is characterized in that the laser projection module further includes fixation Part, the circuit board assemblies further include substrate, and on the substrate, the fixing piece is used for the side circuit board bearing Emitting laser is fixed on the substrate.
11. laser projection module according to claim 10, which is characterized in that the fixing piece includes sealing, the envelope Glue is arranged between the edge-emitting laser and the circuit board, and the sealing is heat-conducting glue.
12. laser projection module according to claim 10, which is characterized in that the fixing piece includes being arranged on the electricity Receiving space, the receiving is collectively formed in the support element of at least two elasticity on the plate component of road, at least two support elements For accommodating the laser emitter, at least two support elements are used to support residence and state laser emitter in space.
13. a kind of depth camera, which is characterized in that the depth camera includes：
Laser projection module described in claim 1 to 12 any one；
Image acquisition device, the laser that described image collector is projected for acquisition from the laser projection module into object space Pattern；With
The processor is used to handle the laser pattern to obtain depth image.
14. a kind of electronic device, which is characterized in that the electronic device includes：
Housing；With
Depth camera described in claim 13, the depth camera are arranged in the housing and are obtained from the housing exposure Take depth image.
CN201810164311.XA 2018-02-27 2018-02-27 Laser projection module, depth camera and electronic device Pending CN108196418A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN201810164311.XA CN108196418A (en) 2018-02-27 2018-02-27 Laser projection module, depth camera and electronic device
CN202011544934.3A CN112611546A (en) 2018-02-27 2018-02-27 Laser projection module, depth camera and electronic device
EP19737647.8A EP3561590A4 (en) 2018-02-27 2019-02-02 Laser projection module and detection method for its cracking, depth camera and electronic device
PCT/CN2019/074610 WO2019165885A1 (en) 2018-02-27 2019-02-02 Laser projection module and detection method for its cracking, depth camera and electronic device
TW108106937A TWI696000B (en) 2018-02-27 2019-02-27 Laser projection module and method for detecting same, depth camera and electronic device
US16/546,880 US11307431B2 (en) 2018-02-27 2019-08-21 Laser projection modules and methods for detecting fracture thereof, depth cameras and electronic devices

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CN201810164311.XA CN108196418A (en) 2018-02-27 2018-02-27 Laser projection module, depth camera and electronic device

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