CN108388064A - The laser projection module and its detection method of rupture, depth camera and electronic device - Google Patents
The laser projection module and its detection method of rupture, depth camera and electronic device Download PDFInfo
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- CN108388064A CN108388064A CN201810164314.3A CN201810164314A CN108388064A CN 108388064 A CN108388064 A CN 108388064A CN 201810164314 A CN201810164314 A CN 201810164314A CN 108388064 A CN108388064 A CN 108388064A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
- G03B15/02—Illuminating scene
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
- G02B27/4205—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive optical element [DOE] contributing to image formation, e.g. whereby modulation transfer function MTF or optical aberrations are relevant
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
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- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a kind of laser projection module and its detection method, depth camera and the electronic devices of rupture.Laser projection module includes laser emitter, collimating element, diffraction optical element and processor.Collimating element and/or diffraction optical element are doped with conducting particles, and conducting particles forms conductive path, and conductive path after being powered for exporting electric signal.Processor is for obtaining electric signal, judging whether electric signal determines collimating element and/or diffraction optical element rupture in preset range and when electric signal is not in preset range.The laser projection module of embodiment of the present invention forms conductive path by adulterating conducting particles in collimating element and/or diffraction optical element, judges whether collimating element and/or diffraction optical element rupture further according to the electric signal of conductive path output.In this way, the laser of laser projection module projection can be not turned on when detecting rupture or be closed in time, harm is generated to avoid to the eyes of user.
Description
Technical field
The present invention relates to technical field of imaging, more particularly to a kind of laser projection module, laser projection module rupture inspection
Survey method, depth camera and electronic device.
Background technology
Some existing laser emitters (such as vertical cavity laser emitter VCSEL etc.) can launch focus signal compared with
Strong laser, these laser energy after collimating element, diffraction optical element can decay, so as to meet signal strength less than pair
The injury thresholding of human body.These laser emitters are usually made of glass or other components being easily broken, and are dropped once encountering
Situations such as, camera lens rupture, then laser will be emitted directly, irradiates the body or eyes of user, serious safety is caused to ask
Topic.
Invention content
The embodiment provides detection method, depth that a kind of laser projection module, laser projection module rupture
Camera and electronic device.
The present invention provides a kind of laser projection modules, which is characterized in that the laser projection module includes laser
Device, collimating element, diffraction optical element and processor.The laser generator is for emitting laser；The collimating element is used for
Collimate the laser；The diffraction optical element is for the laser after collimating element collimation described in diffraction to form laser pattern；
The collimating element and/or the diffraction optical element include conducting particles, and the conducting particles is entrained in the collimating element
And/or in the diffraction optical element, the conducting particles forms conductive path, and the conductive path after being powered for exporting electricity
Signal；The processor is connect with the conductive path, and the processor, which is used to obtain, to be exported after the conductive path is powered
Electric signal judges whether the electric signal is not in preset range and in the electric signal in the preset range
When determine the collimating element and/or the diffraction optical element rupture.
The present invention provides a kind of detection method of laser projection module rupture, the laser projection module includes laser hair
Emitter, collimating element and diffraction optical element, the laser emitter is for emitting laser, and the collimating element is for collimating institute
Laser is stated, the diffraction optical element is for the laser after collimating element collimation described in diffraction to form laser pattern；The standard
Straight element and/or the diffraction optical element include conducting particles, and the conducting particles is entrained in the collimating element and/or institute
It states in diffraction optical element, the conducting particles forms conductive path, and the conductive path after being powered for exporting electric signal；Institute
Stating detection method includes：
Obtain the electric signal exported after the conductive path is powered；
Judge the electric signal whether in preset range；
The collimating element and/or diffraction optics member are determined when the electric signal is not in the preset range
Part ruptures.
The present invention provides a kind of depth cameras.The depth camera includes above-mentioned laser projection module, Image Acquisition
Device and processor.Described image collector is for acquiring the laser figure projected from the laser projection module into object space
Case.The processor is for handling the laser pattern to obtain depth image.
The present invention provides a kind of electronic devices.The electronic device includes shell and above-mentioned depth camera.The depth
Camera is spent to be arranged in the shell and expose to obtain depth image from the shell.
The laser projection module of embodiment of the present invention, detection method, depth camera and the electricity of the rupture of laser projection module
Sub-device forms conductive path, and/or the doping conduction in diffraction optical element by adulterating conducting particles in collimating element
Particle forms conductive path, judges whether are collimating element and/or diffraction optical element further according to the electric signal of conductive path output
Rupture.In this way, can detect that whether laser projection module is intact, and when detecting the rupture of laser projection module, may be selected not
It opens laser projection module or closes the laser of laser projection module projection in time or reduce the hair of laser projection module
Luminous power, after being ruptured to avoid laser projection module, the energy for the laser that laser projection module projects is excessively high, to the eye of user
Eyeball, which is led to the problem of, to be endangered, and the safety that user uses is promoted.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obviously, or practice through the invention is recognized.
Description of the drawings
Above-mentioned and/or additional aspect and advantage of the invention will become from the following description of the accompanying drawings of embodiments
Obviously and it is readily appreciated that, wherein：
Fig. 1 is the flow diagram of the detection method of the laser projection module rupture of certain embodiments of the present invention.
Fig. 2 is the structural schematic diagram of the laser projection module of certain embodiments of the present invention.
Fig. 3 is the sectional view of the diffraction optical element of certain embodiments of the present invention.
Fig. 4 to Fig. 7 is the conspectus of the conductive path of the diffraction optical element of certain embodiments of the present invention.
Fig. 8 is the sectional view of the diffraction optical element of certain embodiments of the present invention.
Fig. 9 to Figure 12 is the conspectus of the conductive path of the diffraction optical element of certain embodiments of the present invention.
Figure 13 is the sectional view of the diffraction optical element of certain embodiments of the present invention.
Figure 14 is the conspectus of the conductive path of the diffraction optical element of certain embodiments of the present invention.
Figure 15 is the sectional view of the diffraction optical element of certain embodiments of the present invention.
Figure 16 is the sectional view of the collimating element of certain embodiments of the present invention.
Figure 17 to Figure 20 is the conspectus of the conductive path of the collimating element of certain embodiments of the present invention.
Figure 21 is the sectional view of the collimating element of certain embodiments of the present invention.
Figure 22 to Figure 25 is the conspectus of the conductive path of the collimating element of certain embodiments of the present invention.
Figure 26 is the sectional view of the collimating element of certain embodiments of the present invention.
Figure 27 is the conspectus of the conductive path of the collimating element of certain embodiments of the present invention.
Figure 28 is the sectional view of the collimating element of certain embodiments of the present invention.
Figure 29 is the flow diagram of the detection method of the laser projection module rupture of certain embodiments of the present invention.
Figure 30 is the structural schematic diagram of the laser projection module of certain embodiments of the present invention.
Figure 31 to Figure 33 is the part-structure schematic diagram of the laser projection module of certain embodiments of the present invention.
Figure 34 is the structural schematic diagram of the depth camera of certain embodiments of the present invention.
Figure 35 is the structural schematic diagram of the electronic device of certain embodiments of the present invention.
Specific implementation mode
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
Can also be to be electrically connected or can be in communication with each other to be mechanical connection；It can be directly connected, it can also be by between intermediary
It connects connected, can be the interaction relationship of the connection or two elements inside two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
Also referring to Fig. 1 and Fig. 2, the present invention provides a kind of detection method that laser projection module 100 ruptures.Laser is thrown
It includes laser emitter 10, collimating element 20, diffraction optical element 30 and processor 40 to penetrate module 100.Laser emitter 10 is used
In transmitting laser.Collimating element 20 is used for the laser that collimation laser transmitter 10 emits.Diffraction optical element 30 is accurate for diffraction
Laser after the straight collimation of element 20 is to form laser pattern.Collimating element 20 includes collimated incident face 201 and collimation exit facet
202.Diffraction optical element 30 includes the diffraction plane of incidence 301 and diffraction exit facet 302.Collimating element 20 and/or diffraction optics member
Part 30 includes conducting particles 21/31 (Fig. 3 and Figure 16 shown in), and conducting particles 21/31 is entrained in collimating element 20 and/or diffraction light
It learns in element 30.Specifically, can be only in collimating element 20 doped with conducting particles 21；Alternatively, only diffraction optical element 30
In doped with conducting particles 31；Alternatively, doped with conducting particles 21 in collimating element 20, while also shape in diffraction optical element 30
At there is conducting particles 31.Conducting particles 21/31 forms conductive path 22/32 (Fig. 3 and Figure 16 shown in), specifically, collimating element
Conducting particles 21 in 20 forms the conductive path 22 of collimating element, and the conducting particles 31 in diffraction optical element 30 forms diffraction
Conductive path 32 in optical element 30.Conductive path 22/32 after being powered for exporting electric signal.
Laser projection module 100 rupture detection method include：
02：It obtains conductive path and leads to the electric signal exported after 22/32 electricity；
04：Judge electric signal whether in preset range；With
06：Determine that collimating element 20 and/or diffraction optical element 30 are ruptured when electric signal is not in preset range.
The present invention also provides a kind of laser projection modules 100.Step 02, step 04 and step 06 can be by laser projections
Processor 40 in module 100 executes.In other words, processor 40 can be used for exporting after acquisition conductive path 22/32 is powered
Electric signal judges whether electric signal determines collimation member in preset range and when electric signal is not in preset range
Part 20 and/or diffraction optical element 30 rupture.
Specifically, conducting particles 21 is doped in collimating element 20, conducting particles 21 forms conductive path 22.When collimation member
It is engagement when part 20 is in serviceable condition, between adjacent conducting particles 21, the resistance of entire conductive path 22 is smaller at this time,
It gives conductive path 22 to be powered in this case, that is, applies a certain size voltage, then the conduction that processor 40 is got at this time is logical
The electric current that road 22 exports is larger.And when collimating element 20 ruptures, it is entrained between the conducting particles 21 in collimating element 20
Junction disconnects, at this time the resistance approach infinity of entire conductive path 22, gives conductive path 22 to be powered in this case,
The electric current that the conductive path 22 that processor 40 is got exports is smaller.Therefore, first way：It can be according in collimating element 20
After conductive path 22 is powered the electric signal (i.e. electric current) that exports and the electric signal detected under 20 non-state of rupture of collimating element it
Between difference size judge whether collimating element 20 ruptures；The second way：It can be according to conductive path 22 in collimating element 20
The electric signal exported after energization directly judges whether collimating element 20 ruptures, specifically, if the electric signal that conductive path 22 exports
Determined that when in not preset range collimating element 20 rupture, if conductive path 22 export electric signal within a preset range when just
Determine that collimating element 20 does not rupture.
Similarly, conducting particles 31 is also doped in diffraction optical element 30, conducting particles 31 forms conductive path 32.When
It is engagement, at this time entire conductive path 32 when diffraction optical element 30 is in serviceable condition, between adjacent conducting particles 31
Resistance it is smaller, in this case give conductive path 32 be powered, that is, apply a certain size voltage, then at this time processor 40 obtain
The electric current that the conductive path 32 arrived exports is larger.And when diffraction optical element 30 ruptures, it is entrained in diffraction optical element 30
Conducting particles 31 between junction disconnect, the resistance approach infinity of entire conductive path 32 at this time, in this state
Under give conductive path 32 to be powered, the electric current that conductive path 32 that processor 40 is got exports is smaller.Therefore, first way：
The electric signal (i.e. electric current) and diffraction optical element 30 exported after being powered according to conductive path 32 in diffraction optical element 30
Difference size between the electric signal detected under non-state of rupture comes whether diffraction optical element 30 ruptures；The second way：
Whether the electric signal exported after being powered according to conductive path 32 in diffraction optical element 30 directly judges diffraction optical element 30
Rupture, specifically, if conductive path 32 export electric signal not within a preset range when determine that diffraction optical element 30 rupture,
If the electric signal that conductive path 32 exports within a preset range when if determine that diffraction optical element 30 does not rupture.
When being doped with conducting particles 21 in collimating element 20, while conducting particles 31 is also doped in diffraction optical element 30
When, processor 40 can get conductive in the electric signal that conductive path 22 exports in collimating element 20 and diffraction optical element 30
The electric signal that access 32 exports, therefore processor 40 can judge according to the electric signal that conductive path 22 in collimating element 20 exports
Whether collimating element 20 ruptures, and judges diffraction optics member according to the electric signal of the output of conductive path 32 in diffraction optical element 30
Whether part 30 ruptures, and processor 40, which can be told, as a result, is the rupture of collimating element 20 or is that diffraction optical element 30 is broken
It splits or is that collimating element 20 is ruptured with diffraction optical element 30.
Embodiment of the present invention laser projection module 100 and laser projection module 100 rupture detection method by
Conducting particles 21 is adulterated in collimating element 20 to form conductive path 22, and/or adulterate conducting particles in diffraction optical element 30
31 form conductive path 32, judge collimating element 20 and/or diffraction optics member further according to the electric signal that conductive path 22/32 exports
Whether part 30 ruptures.In this way, can detect that whether laser projection module 100 is intact, and detecting that laser projection module 100 is broken
When splitting, it may be selected to be not turned on laser projection module 100 or close the laser of 100 projection of laser projection module in time or subtract
The luminous power of small laser projection module 100, after being ruptured to avoid laser projection module 100, laser projection module 100 projects
Laser energy it is excessively high, the eyes of user are led to the problem of and are endangered, the safety that uses of user is promoted.
Also referring to Fig. 3 to Fig. 7, in some embodiments, multiple conductive particles are doped in diffraction optical element 30
Son 31 (will hereafter be entrained in the conducting particles in diffraction optical element 30 31 and be known as diffraction conducting particles 31), and multiple diffraction are conductive
Particle 31 forms a conductive path 32 (conductive path 32 is hereafter known as diffraction conductive path 32).Diffraction conductive path 32 wraps
Include diffraction input terminal 321 and diffraction output end 322.Diffraction input terminal 321 and diffraction output end 322 are connect with processor 40 and shape
At galvanic circle.Wherein, there are many arrangement modes of diffraction conductive path 32：For example, the extending direction of diffraction conductive path 32
For the length direction of diffraction optical element 30, (if diffraction optical element 30 is round, length direction herein is diffraction optics
The first of element 30 is radial, and the explanation of " length direction " of diffraction optical element 30 is similarly hereinafter, as shown in Figure 4)；Or diffraction is conductive
The extending direction of access 32 is the width direction of diffraction optical element 30 (if diffraction optical element 30 is round, width herein
Direction is then first the second radial radial direction perpendicular to diffraction optical element 30, " width direction " of diffraction optical element 30
It explains similarly hereinafter, as shown in Figure 5)；Alternatively, the extending direction of diffraction conductive path 32 is the diagonal of diffraction optical element 30
(as shown in Figure 6 and Figure 7).No matter the arrangement mode of diffraction conductive path 32 is above-mentioned which kind of mode, leads diffraction electric pathway 32
Entire diffraction optical element 30 can be crossed over, can relatively accurately detection of diffracted optical element 30 whether be ruptured.
Also referring to Fig. 8 to Figure 12, in some embodiments, multiple conductive particles are doped in diffraction optical element 30
Son 31 (will hereafter be entrained in the conducting particles in diffraction optical element 30 31 and be known as diffraction conducting particles 31), and multiple diffraction are conductive
Particle 31 forms a plurality of conductive path 32 (conductive path 32 is hereafter known as diffraction conductive path 32), a plurality of diffraction conductive path
32 mutually disjoint also mutual insulating.Every diffraction conductive path 32 includes diffraction input terminal 321 and diffraction output end 322.Each
Diffraction input terminal 321 and each diffraction output end 322 are connect with processor 40 to form a galvanic circle.It is a plurality of as a result, to spread out
It penetrates the diffraction input terminal 321 of conductive path 32 and diffraction output end 322 is connect respectively with processor 40 to be formed a plurality of conductive time
Road.Wherein, there are many arrangement modes of a plurality of diffraction conductive path 32：For example, the extending direction of every diffraction conductive path 32
For the length direction (as shown in Figure 9) of diffraction optical element 30, length of a plurality of diffraction conductive path 32 along diffraction optical element 30
The setting of direction parallel interval is spent, since diffraction optical element 30 has certain thickness, a plurality of diffraction conductive path 32 exists
Can also be in layer along the thickness direction of diffraction optical element 30 after the length direction parallel interval setting of diffraction optical element 30
Folded interval setting (as shown in Figure 8)；Alternatively, the extending direction of every diffraction conductive path 32 is the width of diffraction optical element 30
Direction (as shown in Figure 10), a plurality of diffraction conductive path 32 are arranged along the width direction parallel interval of diffraction optical element 30, by
There is certain thickness in diffraction optical element 30, therefore, a plurality of diffraction conductive path 32 is in the width along diffraction optical element 30
After spending the setting of direction parallel interval setting can also be spaced in stacking along the thickness direction of diffraction optical element 30；Alternatively, every
The extending direction of diffraction conductive path 32 be diffraction optical element 30 the diffraction plane of incidence 301 diagonal (such as Figure 11 and
Shown in Figure 12), diagonal parallel of a plurality of diffraction conductive path 32 along the diffraction plane of incidence 301 of diffraction optical element 30
Every setting, since diffraction optical element 30 has certain thickness, a plurality of diffraction conductive path 32 is along diffraction optics member
It, can also be along the thickness direction of diffraction optical element 30 after the diagonal parallel interval setting of the diffraction plane of incidence 301 of part 30
In the setting of stacking interval；Alternatively, the extending direction of every diffraction conductive path 32 is the diffraction plane of incidence of diffraction optical element 30
301 with the diagonal (not shown) of diffraction exit facet 302, a plurality of the spreading out along diffraction optical element 30 of diffraction conductive path 32
It penetrates the plane of incidence 301 and the diagonal parallel interval of diffraction exit facet 302 is arranged；Alternatively, every 32 edge of diffraction conductive path
(not shown) is arranged in the thickness direction parallel interval of diffraction optical element 30, since diffraction optical element 30 has certain width
Degree, therefore, a plurality of diffraction conductive path 32, can also be along spreading out after the setting of the thickness direction parallel interval of diffraction optical element 30
The width direction of optical element 30 is penetrated in the setting of stacking interval.No matter above-mentioned which kind of arrangement mode of diffraction conductive path 32 be
Mode, for setting single diffraction conductive path 32, a plurality of diffraction conductive path 32 can occupy diffraction optical element
30 more volumes, can correspondingly export more electric signals.When since single diffraction conductive path 32 is only arranged, it is possible to
The position of the position and single diffraction conductive path 32 that are ruptured there are diffraction optical element 30 is separated by very far, and is led to single diffraction
The influence of electric pathway 32 is little, the single diffraction conductive path 32 output electric signal still within a preset range the case where, detection
Accuracy is not high.And in present embodiment, a plurality of diffraction conductive path 32 occupies the more volume of diffraction optical element 30, accordingly
Ground can export more electric signals, and processor 40 can more precisely judge diffraction optical element 30 according to more electric signal
Whether rupture, promotes the accuracy of 30 Safety check-up of diffraction optical element.
Also referring to Figure 13 and Figure 14, in some embodiments, multiple conductions are doped in diffraction optical element 30
The conducting particles being entrained in diffraction optical element 30 (is hereafter known as diffraction conducting particles 31) by particle 31, and multiple diffraction are conductive
Particle 31 forms a plurality of conductive path 32 (conductive path 32 is hereafter known as diffraction conductive path 32), a plurality of diffraction conductive path
32 include a plurality of first diffraction conductive path 323 and a plurality of second diffraction conductive path 324.A plurality of first diffraction conductive path
332 parallel intervals are arranged, a plurality of second diffraction conductive path, 324 parallel interval setting.A plurality of first diffraction conductive path, 323 He
A plurality of second diffraction conductive path 324 is spatially crisscross, and every first diffraction conductive path 323 includes that the first diffraction is defeated
Enter end 3231 and the first diffraction output end 3232, every second diffraction conductive path 324 includes 3241 He of the second diffraction input terminal
Second diffraction output end 3242.Each first diffraction input terminal 3231 and each first diffraction output end 3232 connect with processor 40
It connects to form a galvanic circle, each second diffraction input terminal 3241 and each second diffraction output end 3242 and processor 40
Connection is to form a galvanic circle.The both ends of a plurality of first diffraction conductive path 323 are respectively connect with processor 40 as a result,
To form a plurality of galvanic circle, the both ends of a plurality of second diffraction conductive path 324 are separately connected with processor 40 more to be formed
Galvanic circle.Wherein, a plurality of first diffraction conductive path 323 and a plurality of second diffraction conductive path 324 be spatially in length and breadth
Staggeredly refer to that a plurality of first diffraction conductive path 323 is spatially mutually perpendicular to hand over a plurality of second diffraction conductive path 324
Mistake, the i.e. angle of the first diffraction conductive path 323 and the second diffraction conductive path 324 are 90 degree.At this point, a plurality of first diffraction is led
The extending direction of electric pathway 323 is the length direction of diffraction optical element 30, and the extension of a plurality of second diffraction conductive path 324
Direction is the width direction of diffraction optical element 30；Alternatively, the extending direction of a plurality of first diffraction conductive path 323 is diffraction light
The thickness direction of element 30 is learned, and the length that the extending direction of a plurality of second diffraction conductive path 324 is diffraction optical element 30
Direction.Certainly, in other embodiments, a plurality of first diffraction conductive path 323 exists with a plurality of second diffraction conductive path 324
It is spatially crisscross to can also be a plurality of first diffraction conductive path 323 with a plurality of second diffraction conductive path 324 in space
On be mutually inclined staggeredly.In use, processor 40 can be simultaneously to a plurality of first diffraction conductive path 323 and a plurality of second diffraction
Conductive path 324 is powered to obtain multiple electric signals.Alternatively, processor 40 can be successively to a plurality of first diffraction conductive path 323
It is powered with a plurality of second diffraction conductive path 324 to obtain multiple electric signals, then, processor 40 judges further according to electric signal
Whether diffraction optical element 30 ruptures.Incorporated by reference to Figure 14, when detecting that number is that the first diffraction conductive path 323 2. exports
Not within a preset range, and the electric signal that number is the second diffraction conductive path 324 output 4. is not also in default model for electric signal
When enclosing interior, illustrate that diffraction optical element 30 is the first diffraction conductive path 323 2. in number and number is the second diffraction 4.
The staggered place of conductive path 324 ruptures, then 30 corresponding position of diffraction optical element also ruptures, in this way, spreading out by a plurality of first
Penetrating the mode of conductive path 323 and a plurality of second diffraction conductive path, 324 crisscross arrangement can more precisely detect and spread out
Penetrate the specific location whether optical element 30 ruptures and rupture.
In addition, also referring to Figure 14 and Figure 15, since diffraction optical element 30 has certain width and thickness, because
This, in a plurality of first diffraction conductive path 323 and a plurality of second diffraction conductive path 324, spatially interlaced formation is a pair of
Interlaced conductive path can also be formed multipair above-mentioned to rear in the width direction or thickness direction of diffraction optical element 30
Interlaced conductive path pair.Similarly, in use, processor 40 can be simultaneously to a plurality of first diffraction conductive path 323
It is powered with a plurality of second diffraction conductive path 324 to obtain multiple electric signals.Alternatively, processor 40 can spread out to a plurality of first successively
Conductive path 323 and a plurality of second diffraction conductive path 324 is penetrated to be powered to obtain multiple electric signals, then, the root again of processor 40
Judge specific location that whether diffraction optical element 30 ruptures and rupture according to electric signal.Since a pair of conductive access is only arranged
Clock synchronization, it is possible to which the position of the conductive path pair of the position and single pair that are ruptured there are diffraction optical element 30 is separated by very far, and right
The conductive path of single pair is little to influencing, a plurality of first diffraction conductive path 323 of the single pair conductive path centering and a plurality of the
Two diffraction conductive paths 324 output electric signal still within a preset range the case where, accuracy in detection is not high.And present embodiment
In, multipair conductive path can correspondingly export more electricity to can take up 30 more volumes of diffraction optical element
Signal, processor 40 can more precisely judge the tool whether diffraction optical element 30 ruptures and rupture according to more electric signal
Body position promotes the accuracy of 30 Safety check-up of diffraction optical element.
Also referring to Figure 16 to Figure 20, in some embodiments, multiple conducting particles are doped in collimating element 20
21 (being hereafter entrained in the conducting particles in collimating element 20 21 to be known as collimating conducting particles 21), multiple collimation conducting particles 21
Form a conductive path 22 (being hereafter known as conductive path 22 to collimate conductive path 22).It includes collimation to collimate conductive path 22
Input terminal 221 and collimation output end 222.Collimation input terminal 221 and collimation output end 222 connect with processor 40 and form conduction
Circuit.Wherein, there are many arrangement modes of collimation conductive path 22：For example, the extending direction of collimation conductive path 22 is collimation
The length direction (as shown in figure 17) of element 20；Or the width side that the extending direction of collimation conductive path 22 is collimating element 20
To (as shown in figure 18)；Alternatively, collimation conductive path 22 extending direction be collimating element 20 diagonal (such as Figure 19 and
Shown in Figure 20).No matter which kind of mode that the arrangement mode of conductive path 22 be above-mentioned is collimated, and collimation conductive path 22 can be crossed over
Entire collimating element 20, can relatively accurately detect whether collimating element 20 ruptures.
Also referring to Figure 21 to Figure 25, in some embodiments, multiple conducting particles are doped in collimating element 20
21 (conducting particles in collimating element 20 21 will be entrained in be known as collimating conducting particles 21), multiple formation of collimation conducting particles 21
Conductive path 22 (is hereafter known as collimating conductive path 22) by a plurality of conductive path 22, and a plurality of collimation conductive path 22 mutually disjoints
And mutually insulated.Every collimation conductive path 22 includes collimation input terminal 221 and collimation output end 222.Each collimation input terminal
221 and each collimation output end 222 connect with processor 40 to form a galvanic circle.A plurality of collimation conductive path as a result,
22 collimation input terminal 221 and collimation output end 222 is connect respectively with processor 40 to form a plurality of galvanic circle.Wherein, more
Item collimates there are many arrangement modes of conductive path 22：For example, the extending direction of every collimation conductive path 22 is collimating element
(if collimating element 20 is circle, length direction herein is the first radial direction of collimating element 20, " collimation to 20 length direction
The explanation of the length direction of element 20 " is similarly hereinafter, as shown in figure 22), length of a plurality of collimation conductive path 22 along collimating element 20
Direction parallel interval setting, since collimating element 20 has certain thickness, a plurality of collimation conductive path 22 is along collimation
After the length direction parallel interval setting of element 20, it can also be arranged (such as in stacking interval along the thickness direction of collimating element 20
Shown in Figure 21)；Alternatively, every collimation conductive path 22 extending direction be collimating element 20 width direction (if collimating element
20 be circle, and width direction herein is then the second radial radial, collimating element of first perpendicular to diffraction optical element 30
The explanation of 20 " width direction " is similarly hereinafter, as shown in figure 23), width direction of a plurality of collimation conductive path 22 along collimating element 20
Parallel interval is arranged, since collimating element 20 has certain thickness, a plurality of collimation conductive path 22 is along collimating element
It can also be along the thickness direction of collimating element 20 in the setting of stacking interval after 20 width direction parallel interval setting；Alternatively, every
The extending direction that item collimates conductive path 22 is diagonal (such as Figure 24 and figure in the collimated incident face 201 of collimating element 20
Shown in 25), diagonal parallel interval of a plurality of collimation conductive path 22 along the collimated incident face 201 of collimating element 20 is set
It sets, since collimating element 20 has certain thickness, a plurality of collimation conductive path 22 enters in the collimation along collimating element 20
It, can also be along the thickness direction of collimating element 20 in the setting of stacking interval after penetrating the diagonal parallel interval setting in face 201；Or
Person, the extending direction of every collimation conductive path 22 are pair in the collimated incident face 201 and collimation exit facet 202 of collimating element 20
Linea angulata direction (not shown), a plurality of collimation conductive path 22 is along the collimated incident face 201 of collimating element 20 and collimation exit facet 202
Diagonal parallel interval setting；Alternatively, thickness direction parallel of the every collimation conductive path 22 along collimating element 20
Every setting (not shown), since collimating element 20 has certain width, a plurality of collimation conductive path 22 is along collimation member
It, can also be along the width direction of collimating element 20 in the setting of stacking interval after the thickness direction parallel interval setting of part 20.It is no matter accurate
Directly the arrangement mode of conductive path 22 is which kind of above-mentioned mode, a plurality of for collimating conductive path 22 compared to setting single
Collimation conductive path 22 can occupy the more volume of collimating element 20, can correspondingly export more electric signals.Due to only
When single collimation conductive path 22 is set, it is possible to which there are the positions that collimating element 20 ruptures to collimate conductive path 22 with single
Position is separated by very far, and the influence that conductive path 22 is collimated to single is little, which collimates the telecommunications that conductive path 22 exports
Number still within a preset range the case where, accuracy in detection is not high.And in present embodiment, a plurality of collimation conductive path 22 occupies standard
The more volume of straight element 20, can correspondingly export more electric signals, processor 40 can be according to more electric signal more
It accurately judges that whether collimating element 20 ruptures, promotes the accuracy of 20 Safety check-up of collimating element.
Also referring to Figure 26 and Figure 27, in some embodiments, multiple conducting particles are doped in collimating element 20
21 (being hereafter entrained in the conducting particles in collimating element 20 21 to be known as collimating conducting particles 21), multiple collimation conducting particles 21
A plurality of conductive path 22 (being hereafter known as conductive path 22 to collimate conductive path 22) is formed, a plurality of collimation conductive path 22 includes
A plurality of first collimation conductive path 223 and a plurality of second collimation conductive path 224.A plurality of first collimation conductive path 223 is parallel
Interval setting, a plurality of second collimation, 224 parallel interval of conductive path setting.A plurality of first collimation conductive path 223 and a plurality of the
Two collimation conductive paths 224 are spatially crisscross, and every first collimation conductive path 223 includes the first collimation input terminal
2231 and first collimate output end 2232, and every second collimation conductive path 224 includes the second collimation input terminal 2241 and second
Collimate output end 2242.It is each first collimation input terminal 2231 and it is each first collimation output end 2232 connect with processor 40 with
A galvanic circle is formed, each second collimation input terminal 2241 and each second collimation output end 2242 are connect with processor 40
To form a galvanic circle.The both ends of a plurality of first collimation conductive path 223 are respectively connect with processor 40 with shape as a result,
At a plurality of galvanic circle.The both ends of a plurality of second collimation conductive path 224 are separately connected with processor 40 to form a plurality of lead
Electrical circuit.Wherein, a plurality of first collimation conductive path 223 and a plurality of second collimation conductive path 224 are spatially crisscross
Refer to that a plurality of first collimation conductive path 223 is spatially mutually perpendicular to interlock with a plurality of second collimation conductive path 224, i.e.,
It is 90 degree that first collimation conductive path 223 and second, which collimates the angle of conductive path 224,.At this point, a plurality of first collimation is conductive logical
The extending direction on road 223 is the length direction of collimating element 20, and subject to the extending direction of a plurality of second collimation conductive path 224
The width direction of straight element 20；Alternatively, the extending direction of a plurality of first collimation conductive path 223 is the thickness side of collimating element 20
To, and the length direction that the extending direction of a plurality of second collimation conductive path 224 is collimating element 20.Certainly, in other implementations
In mode, a plurality of first collimation conductive path 223 collimates that conductive path 224 is spatially crisscross with a plurality of second can be with
It is that a plurality of first collimation conductive path 223 is spatially mutually inclined staggeredly with a plurality of second collimation conductive path 224.It uses
When, processor 40 can simultaneously be powered to obtain to a plurality of first collimation conductive path 223 and a plurality of second collimation conductive path 224
To multiple electric signals.Alternatively, processor 40 can be conductive logical to a plurality of first collimation conductive path 223 and a plurality of second collimation successively
Road 224 is powered to obtain multiple electric signals, and then, processor 40 judges whether collimating element 20 ruptures further according to electric signal.
Incorporated by reference to Figure 27, when detect number be the electric signal that exports of the first collimation conductive path 223 2. not within a preset range, and
Number be 4. second collimation conductive path 224 export electric signal also not within a preset range when, illustrate that collimating element 20 exists
Number is the first collimation conductive path 223 2. and the staggered place rupture that number is the second collimation conductive path 224 4., then accurate
Straight 20 corresponding position of element also ruptures, in this way, collimating conductive path 223 and a plurality of second by a plurality of first collimates conductive lead to
The mode of 224 crisscross arrangement of road can more precisely detect the specific position whether collimating element 20 ruptures and rupture
It sets.
In addition, also referring to Figure 27 and Figure 28, since collimating element 20 has certain width and thickness,
A plurality of first collimation conductive path 223 and a plurality of second collimation conductive path 224 spatially interlaced formation are a pair of mutually
Conductive path staggeredly can also be formed multipair above-mentioned interlaced to rear in the width direction or thickness direction of collimating element 20
Conductive path pair.Similarly, in use, processor 40 can be simultaneously to a plurality of first collimation conductive path 223 and a plurality of the
Two collimation conductive paths 224 are powered to obtain multiple electric signals.Alternatively, processor 40 can be conductive logical to a plurality of first collimation successively
Road 223 and a plurality of second collimation conductive path 224 are powered to obtain multiple electric signals, and then, processor 40 is further according to electric signal
To judge specific location that whether collimating element 20 ruptures and rupture.Since a pair of conductive access clock synchronization is only arranged, it is possible to
The position of the conductive path pair of the position and single pair that are ruptured there are collimating element 20 is separated by very far, and to the conductive path pair of single pair
Influence little, a plurality of first collimation conductive path 223 and a plurality of second collimation conductive path 224 of the single pair conductive path centering
The electric signal of output still within a preset range the case where, accuracy in detection is not high.And in present embodiment, multipair conductive path
To can take up 20 more volumes of collimating element, can correspondingly export more electric signals, processor 40 can according to compared with
More electric signals more precisely judges the specific location whether collimating element 20 ruptures and rupture, and promotes collimating element 20 and ruptures
The accuracy of detection,
In some embodiments, step 02 obtain conductive path 22/32 be powered after export electric signal the step of be
What laser projection module 100 carried out before opening.Specifically, before each laser projection module 100 is opened, processor 40 can be successively
Or be powered simultaneously to diffraction conductive path 32 and collimation conductive path 22, and obtain diffraction conductive path 32 and collimation conduction
The electric signal that access 22 exports, judges whether diffraction optical element 30 and collimating element 20 rupture further according to electric signal.It is detecting
When being ruptured to any one in diffraction optical element 30 and collimating element 20, it is not turned on laser projection module 100, to keep away
The energy for exempting from the laser of the projection of laser projection module 100 is excessively high, the problem of endangering eyes of user.
Figure 29 is please referred to, in some embodiments, the detection of the rupture of laser projection module 100 of embodiment of the present invention
Method further includes：
011：Detect the movement velocity of laser projection module 100；With
012：Judge whether movement velocity is more than predetermined speed, is more than in the movement velocity of laser projection module 100 predetermined
When speed, execute obtain conductive path 22/32 be powered after export electric signal the step of.
Referring again to Fig. 2, in some embodiments, step 011 and step 012 can be realized by processor 40.
I other words processor 40 can be additionally used in the movement velocity for detecting laser projection module 100, it is predetermined to judge whether movement velocity is more than
Speed, and when the movement velocity of laser projection module 100 is more than predetermined speed, executes and obtain the energization of conductive path 22/32
The step of electric signal exported afterwards.
The movement velocity of velocity sensor detection laser projection module 100 wherein may be used, velocity sensor can fill
Can also be to be installed along with electronic device 3000 with laser projection module 100 in laser projection module 100 (shown in Figure 35)
In, the movement speed of laser projection module 100 further can be obtained in the movement velocity of velocity sensor detection electronic installation 3000
Degree.When the movement velocity of laser projection module 100 is larger, show that laser projection module 100 is likely to occur the feelings dropped at this time
Condition at this point, processor 40 is sequentially or simultaneously powered to diffraction conductive path 32 and collimation conductive path 22, and obtains diffraction
The electric signal that conductive path 32 and collimation conductive path 22 export judges diffraction optical element 30 and collimation member further according to electric signal
Whether part 20 ruptures.In any one rupture in detecting diffraction optical element 30 and collimating element 20, laser is determined that
Module 100 is projected to rupture.In this way, broken without carrying out laser projection module 100 when using laser projection module 100 each time
The detection split can reduce the power consumption of laser projection module 100.
Referring again to Fig. 2, in some embodiments, the laser projection module 100 of embodiment of the present invention further includes base
Board group part 60, lens barrel 50 and protective cover 70.Board unit 60 includes substrate 61 and the circuit board 62 being carried on substrate.Circuit board
62 offer via 621, and laser emitter 10 is carried on substrate 61 and is housed in via 621.Lens barrel 50 offers receiving
Chamber 54.Lens barrel 50 includes lens barrel roof 51 and the lens barrel side wall 52 of the annular extended from lens barrel roof 51.Lens barrel side wall 51 is arranged
On circuit board 62, lens barrel roof 51 offers the light hole 53 being connected to host cavity 54, and collimating element 20 is housed in host cavity
In 54.Protective cover 70 is arranged on lens barrel roof 51.Protective cover 70 include offer light extraction through-hole 73 protective cover roof 71 and
The protective cover side wall 72 for the annular that self-insurance shield roof 71 extends, diffraction optical element 30 are carried on lens barrel roof 51 and accommodate
In protective cover 70.The opposite both sides of diffraction optical element 30 are contacted with protective cover 70 and lens barrel roof 51 respectively, protective cover top
Wall 71 includes the resistance surface 74 close to light hole 53, and diffraction optical element 30 is contacted with resistance surface 74.
Specifically, diffraction optical element 30 includes opposite the diffraction plane of incidence 301 and diffraction exit facet 302.Diffraction optics
Element 30 is carried on lens barrel roof 51, and diffraction exit facet 302 and the surface of the close light hole 53 of protective cover roof 71 (contradict
Face 74) it contradicts, the diffraction plane of incidence 301 is contradicted with lens barrel roof 51.Light hole 53 is aligned with host cavity 54, light extraction through-hole 73 with it is logical
Unthreaded hole 53 is aligned.Lens barrel roof 51, protective cover side wall 72 and protective cover roof 71 are contradicted with diffraction optical element 30, to prevent
Diffraction optical element 30 falls off along light direction out of protective cover 52.In some embodiments, protective cover 52 passes through glue 80
It is pasted onto on lens barrel roof 51.
Please continue to refer to Fig. 2, in some embodiments, collimating element 20 includes optical section 26 and is set around optical section 26
The mounting portion 25 set, collimating element 20 include the collimated incident face 201 and collimation exit facet positioned at 20 opposite both sides of collimating element
202, optical section 26 includes two curved surfaces for being located at 20 opposite both sides of collimating element, and mounting portion 25 is contradicted with lens barrel roof 51, light
One of the department of the Chinese Academy of Sciences 26 curved surface stretches into light hole 53.
When assembling above-mentioned laser projection module 100, along light path from the bottom end of lens barrel side wall 52 successively to host cavity
It is put into collimating element 20 in 54 and installs the board unit 60 of laser emitter 10.Laser emitter 10 can be first mounted on
On board unit 60, then the board unit 60 for being equipped with laser emitter 10 is combined with lens barrel 50 together again.Against light path
Direction diffraction optical element 30 is carried on lens barrel roof 51, then by protective cover 70 be mounted on lens barrel roof 51 on, from
And diffraction optical element 30 is made to be housed in protective cover 70.In this way, laser projection module 100 is installed simply.In other embodiment party
In formula, first diffraction optical element 30 can also be reversed and be arranged in protective cover 70, then again by diffraction optical element 30 and guarantor
Shield 70 is installed along on lens barrel roof 51.At this point, the diffraction exit facet 302 of diffraction optical element 30 is supported with resistance surface 74
It touches, the diffraction plane of incidence 301 is with the conflict of roof 51 and opposite with the collimation exit facet 202 of optical section 26, and the collimation of optical section 26 enters
It is opposite with laser emitter 10 to penetrate face 201.In this way, the installation of laser projection module 100 is simpler.
In some embodiments, laser emitter 10 can be vertical cavity surface emitting laser (Vertical Cavity
Surface Emitting Laser, VCSEL) or edge-emitting laser (edge-emitting laser, EEL).Wherein,
Edge-emitting laser can be distributed feedback laser (Distributed Feedback Laser, DFB).
Incorporated by reference to Figure 30, when laser emitter 10 is edge-emitting laser, laser emitter 10 is whole to be in the form of a column, laser
An end face of the transmitter 10 far from board unit 60 forms light-emitting surface 11, and laser is sent out from light-emitting surface 11, and light-emitting surface direction is accurate
Straight element 20.Laser emitter 10 is fixed on board unit 60.Specifically, incorporated by reference to Figure 31, laser emitter 10 can lead to
It crosses sealing 15 to be bonded on board unit 60, such as the opposite with light-emitting surface 11 of laser emitter 10 is bonded in substrate in batch on one side
On part 60.Incorporated by reference to Figure 32, the joint face 12 of laser emitter 10 can also be bonded on board unit 60, and sealing 15 wraps
The joint face 12 of surrounding.At this point, sealing 15 can be heat-conducting glue.Base is caused with the heat conduction for generating the work of laser emitter 10
On board group part 60.When laser projection module 100 is using edge-emitting laser, one side edge-emitting laser is compared with VCSEL array
Temperature drift is smaller, on the other hand, since edge-emitting laser is single-point light emitting structure, is not necessarily to array of designs structure, makes simply, swash
The cost of the light source of light projection module 100 is relatively low.
The laser of distributed feedback laser obtains the gain of power by the feedback of optical grating construction, to carry when propagating
The power of high distributed feedback laser is needed by increasing Injection Current and/or increasing the length of distributed feedback laser,
Since the pouring-in electric current of increase can make the power consumption of distributed feedback laser increase and serious problem of generating heat occurs, because
This needs the length for increasing distributed feedback laser, causes point to ensure that distributed feedback laser can work normally
Cloth feedback laser is generally in elongate strip result.When the light-emitting surface 11 of edge-emitting laser is towards collimating element 20, Bian Fa
It penetrates laser to place in vertical, due to the elongate strip structure of edge-emitting laser, edge-emitting laser, which is susceptible to, to be fallen, shifts
Or shaking etc. is unexpected.
Incorporated by reference to Figure 30 and Figure 33, laser emitter 10 can also be fixed on substrate using fixed form as shown in figure 33
On component 60.Specifically, laser projection module 100 includes the support element 16 of multiple elasticity, and support element 16 can be fixed on substrate
On component 60, multiple support elements 16 surround receiving space 160 jointly, and laser emitter 10 is housed in receiving space 160 and quilt
Multiple support elements 16 support, and laser emitter 10 can be directly installed between multiple support elements 16 when mounted.One
In a example, laser emitter 10 is clamped to further prevent laser emitter 10 to shake in multiple support elements 16 jointly.
In some embodiments, substrate 61 can also save, and laser emitter 10 can be directly anchored to circuit board 62
On to reduce the thickness of laser projection module 100.
Figure 34 is please referred to, the present invention also provides a kind of depth cameras 1000.The depth camera 1000 of embodiment of the present invention
Including laser projection module 100, image acquisition device 200 and the processor 40 described in above-mentioned any one embodiment.Wherein, scheme
As collector 200 is for acquiring the laser pattern projected into object space after 30 diffraction of diffraction optical element.Processor 40
It is connect respectively with laser projection module 100 and image acquisition device 200.Processor 40 is for handling laser pattern to obtain depth map
Picture.Processor 40 herein can be the processor 40 in laser projection module 100.
Specifically, laser projection module 100 projects laser pattern into object space by projecting window 901, and image is adopted
Storage 200 is acquired by acquisition window 902 by the modulated laser pattern of target object.Image acquisition device 200 can be infrared phase
Machine, processor 40 calculate each picture corresponding with reference pattern of each pixel in the laser pattern using image matching algorithm
The deviation value of vegetarian refreshments further obtains the depth image of the laser pattern further according to deviation value.Wherein, image matching algorithm can be
Digital picture correlation (Digital Image Correlation, DIC) algorithm.It is of course also possible to use other images match are calculated
Method replaces DIC algorithms.
Laser projection module 100 in the depth camera 1000 of embodiment of the present invention, by being mixed in collimating element 20
Miscellaneous conducting particles 21, which forms conductive logical 22 tunnels, and/or adulterates conducting particles 31 in diffraction optical element 30, forms conductive path
32, the electric signal exported further according to conductive path 22/32 judges whether collimating element 20 and/or diffraction optical element 30 rupture.
In this way, can detect that whether laser projection module 100 is intact, and when detecting that laser projection module 100 ruptures, may be selected not
It opens laser projection module 100 or closes the laser of 100 projection of laser projection module in time or reduce laser projection mould
The luminous power of group 100, after being ruptured to avoid laser projection module 100, the energy for the laser that laser projection module 100 projects
It is excessively high, the eyes of user are led to the problem of and are endangered, the safety that user uses is promoted.
Figure 35 is please referred to, the electronic device 3000 of embodiment of the present invention includes the depth of shell 2000 and the above embodiment
Spend camera 1000.The setting of depth camera 1000 exposes in shell 2000 and from shell 2000 to obtain depth image.
Laser projection module 100 in the electronic device 3000 of embodiment of the present invention, by being mixed in collimating element 20
Miscellaneous conducting particles 21, which forms conductive logical 22 tunnels, and/or adulterates conducting particles 31 in diffraction optical element 30, forms conductive path
32, the electric signal exported further according to conductive path 22/32 judges whether collimating element 20 and/or diffraction optical element 30 rupture.
In this way, can detect that whether laser projection module 100 is intact, and when detecting that laser projection module 100 ruptures, may be selected not
It opens laser projection module 100 or closes the laser of 100 projection of laser projection module in time or reduce laser projection mould
The luminous power of group 100, after being ruptured to avoid laser projection module 100, the energy for the laser that laser projection module 100 projects
It is excessively high, the eyes of user are led to the problem of and are endangered, the safety that user uses is promoted.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiments or example.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one this feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two, three
It is a etc., unless otherwise specifically defined.
Any process described otherwise above or method description are construed as in flow chart or herein, and expression includes
It is one or more for realizing specific logical function or process the step of executable instruction code module, segment or portion
Point, and the range of the preferred embodiment of the present invention includes other realization, wherein can not press shown or discuss suitable
Sequence, include according to involved function by it is basic simultaneously in the way of or in the opposite order, to execute function, this should be of the invention
Embodiment person of ordinary skill in the field understood.
Expression or logic and/or step described otherwise above herein in flow charts, for example, being considered use
In the order list for the executable instruction for realizing logic function, may be embodied in any computer-readable medium, for
Instruction execution system, device or equipment (system of such as computer based system including processor or other can be held from instruction
The instruction fetch of row system, device or equipment and the system executed instruction) it uses, or combine these instruction execution systems, device or set
It is standby and use.For the purpose of this specification, " computer-readable medium " can any can be included, store, communicating, propagating or passing
Defeated program is for instruction execution system, device or equipment or the dress used in conjunction with these instruction execution systems, device or equipment
It sets.The more specific example (non-exhaustive list) of computer-readable medium includes following：Electricity with one or more wiring
Interconnecting piece (electronic device), portable computer diskette box (magnetic device), random access memory (RAM), read-only memory
(ROM), erasable edit read-only storage (EPROM or flash memory), fiber device and portable optic disk is read-only deposits
Reservoir (CDROM).In addition, computer-readable medium can even is that the paper that can print described program on it or other are suitable
Medium, because can be for example by carrying out optical scanner to paper or other media, then into edlin, interpretation or when necessary with it
His suitable method is handled electronically to obtain described program, is then stored in computer storage.
It should be appreciated that each section of the present invention can be realized with hardware, software, firmware or combination thereof.Above-mentioned
In embodiment, software that multiple steps or method can in memory and by suitable instruction execution system be executed with storage
Or firmware is realized.It, and in another embodiment, can be under well known in the art for example, if realized with hardware
Any one of row technology or their combination are realized：With the logic gates for realizing logic function to data-signal
Discrete logic, with suitable combinational logic gate circuit application-specific integrated circuit, programmable gate array (PGA), scene
Programmable gate array (FPGA) etc..
Those skilled in the art are appreciated that realize all or part of step that above-described embodiment method carries
Suddenly it is that relevant hardware can be instructed to complete by program, the program can be stored in a kind of computer-readable storage medium
In matter, which includes the steps that one or a combination set of embodiment of the method when being executed.
In addition, each functional unit in each embodiment of the present invention can be integrated in a processing module, it can also
That each unit physically exists alone, can also two or more units be integrated in a module.Above-mentioned integrated mould
The form that hardware had both may be used in block is realized, can also be realized in the form of software function module.The integrated module is such as
Fruit is realized in the form of software function module and when sold or used as an independent product, can also be stored in a computer
In read/write memory medium.
Storage medium mentioned above can be read-only memory, disk or CD etc..Although having been shown and retouching above
The embodiment of the present invention is stated, it is to be understood that above-described embodiment is exemplary, and should not be understood as the limit to the present invention
System, those skilled in the art can be changed above-described embodiment, change, replace and become within the scope of the invention
Type.
Claims (10)
1. a kind of laser projection module, which is characterized in that the laser projection module includes：
Laser generator, the laser generator is for emitting laser；
Collimating element, the collimating element is for collimating the laser；
Diffraction optical element, the diffraction optical element is for the laser after collimating element collimation described in diffraction to form laser figure
Case；The collimating element and/or the diffraction optical element include conducting particles, and the conducting particles is entrained in the collimation member
In part and/or the diffraction optical element, the conducting particles forms conductive path, and the conductive path after being powered for exporting
Electric signal；With
The processor being connect with the conductive path, the processor are used to obtain the telecommunications exported after the conductive path is powered
Number, judge whether the electric signal true in the preset range and when the electric signal is not in the preset range
The fixed collimating element and/or diffraction optical element rupture.
2. laser projection module according to claim 1, which is characterized in that the conductive path is one, the conduction
Access includes input terminal and is connected to the processor with output end, the input terminal and the output end and forms conductive return
Road.
3. laser projection module according to claim 1, which is characterized in that the conductive path be it is a plurality of, it is a plurality of described
Conductive path mutually disjoints, and every conductive path includes input terminal and output end, each input terminal and each described
Output end is connected to the processor and forms galvanic circle.
4. laser projection module according to claim 1, which is characterized in that the conductive path be it is a plurality of, it is a plurality of described
Conductive path includes a plurality of first conductive path and a plurality of second conductive path, and a plurality of first conductive path parallel interval is set
It sets, a plurality of second conductive path parallel interval setting, a plurality of first conductive path and a plurality of second conduction are logical
Road is spatially crisscross, and every conductive path includes input terminal and output end, each input terminal and each institute
Output end is stated to be connected to the processor and form galvanic circle.
5. laser projection module according to claim 1, which is characterized in that the laser projection module further includes：
Board unit, the board unit include the circuit board of substrate and carrying on the substrate, and the circuit board offers
Via, the laser emitter are carried on the substrate and are housed in the via；
Lens barrel, the lens barrel offer host cavity, and the lens barrel includes lens barrel roof and the annular that extends from the lens barrel roof
Lens barrel side wall, the lens barrel side wall is arranged on the circuit board, and the lens barrel roof is offered to be connected to the host cavity
Light hole, the collimating element is housed in the host cavity；And
Protective cover, the protective cover are arranged on the lens barrel roof, and the protective cover includes the protection for offering light extraction through-hole
The protective cover side wall of cover roof and the annular extended from the protective cover roof, the diffraction optical element are carried on the lens barrel
On roof and it is housed in the protective cover.
6. a kind of detection method of laser projection module rupture, which is characterized in that the laser projection module includes Laser emission
Device, collimating element and diffraction optical element, for the laser emitter for emitting laser, the collimating element is described for collimating
Laser, the diffraction optical element is for the laser after collimating element collimation described in diffraction to form laser pattern；The collimation
Element and/or the diffraction optical element include conducting particles, and the conducting particles is entrained in the collimating element and/or described
In diffraction optical element, the conducting particles forms conductive path, and the conductive path after being powered for exporting electric signal；It is described
Detection method includes：
Obtain the electric signal exported after the conductive path is powered；
Judge the electric signal whether in preset range；
Determine that the collimating element and/or the diffraction optical element are broken when the electric signal is not in the preset range
It splits.
7. the detection method of laser projection module rupture according to claim 6, which is characterized in that led described in the acquisition
The step of electric signal that electric pathway exports after being powered, executes before laser projection module unlatching.
8. the detection method of laser projection module rupture according to claim 6, which is characterized in that the detection method is also
Including：
Obtain the movement velocity of the laser projection module；
Judge whether the movement velocity is more than predetermined speed；With
When the movement velocity is more than the predetermined speed, executes and obtain the electric signal exported after the conductive path is powered
Step.
9. a kind of depth camera, which is characterized in that including：
Laser projection module described in claim 1-5 any one；
Image acquisition device, described image collector is for acquiring the laser projected from the laser projection module into object space
Pattern；With
The processor is for handling the laser pattern to obtain depth image.
10. a kind of electronic device, which is characterized in that the electronic device includes：
Shell；With
Depth camera described in claim 9, the depth camera are arranged in the shell and are exposed from the shell to obtain
Take depth image.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810164314.3A CN108388064A (en) | 2018-02-27 | 2018-02-27 | The laser projection module and its detection method of rupture, depth camera and electronic device |
| PCT/CN2019/074610 WO2019165885A1 (en) | 2018-02-27 | 2019-02-02 | Laser projection module and detection method for its cracking, depth camera and electronic device |
| EP19737647.8A EP3561590A4 (en) | 2018-02-27 | 2019-02-02 | Laser projection module and detection method for its cracking, depth camera and electronic device |
| TW108106937A TWI696000B (en) | 2018-02-27 | 2019-02-27 | Laser projection module and method for detecting same, depth camera and electronic device |
| US16/546,880 US11307431B2 (en) | 2018-02-27 | 2019-08-21 | Laser projection modules and methods for detecting fracture thereof, depth cameras and electronic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810164314.3A CN108388064A (en) | 2018-02-27 | 2018-02-27 | The laser projection module and its detection method of rupture, depth camera and electronic device |
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| CN108388064A true CN108388064A (en) | 2018-08-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810164314.3A Pending CN108388064A (en) | 2018-02-27 | 2018-02-27 | The laser projection module and its detection method of rupture, depth camera and electronic device |
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| CN (1) | CN108388064A (en) |
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| WO2019165885A1 (en) * | 2018-02-27 | 2019-09-06 | Oppo广东移动通信有限公司 | Laser projection module and detection method for its cracking, depth camera and electronic device |
| CN112513684A (en) * | 2018-11-13 | 2021-03-16 | 株式会社大赛璐 | Optical member, laser module including the same, and laser apparatus |
| EP3848850A4 (en) * | 2018-10-15 | 2021-10-27 | Huawei Technologies Co., Ltd. | Optical element and monitoring system and method therefor, active light emitting module, and terminal |
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| US11307431B2 (en) | 2018-02-27 | 2022-04-19 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Laser projection modules and methods for detecting fracture thereof, depth cameras and electronic devices |
| EP3848850A4 (en) * | 2018-10-15 | 2021-10-27 | Huawei Technologies Co., Ltd. | Optical element and monitoring system and method therefor, active light emitting module, and terminal |
| CN112513684A (en) * | 2018-11-13 | 2021-03-16 | 株式会社大赛璐 | Optical member, laser module including the same, and laser apparatus |
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