CN201522712U - Image capturing module capable of electrically linking up two circuit boards - Google Patents
Image capturing module capable of electrically linking up two circuit boards Download PDFInfo
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- CN201522712U CN201522712U CN2009201779582U CN200920177958U CN201522712U CN 201522712 U CN201522712 U CN 201522712U CN 2009201779582 U CN2009201779582 U CN 2009201779582U CN 200920177958 U CN200920177958 U CN 200920177958U CN 201522712 U CN201522712 U CN 201522712U
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Abstract
An image capturing module capable of electrically linking up two circuit boards comprises a board unit, an image capturing unit, an optical imaging unit, a luminescent unit and a light transmitting unit. The board unit is provided with a base layer board and a top layer board arranged above the base layer board, and a light transmitting zone is arranged on the top layer board; an electric conduction unit is provided with an electric conduction element which is electrically connected between the base layer board and the top layer board; the image capturing unit is provided with an image capturing element which is electrically arranged on the base layer board; the optical imaging unit is disposed on the base layer board and covered with the image capturing unit; the luminescent unit is provided with a luminescent element which is electrically disposed on the top layer board and positioned above the optical imaging unit; and the light transmitting unit is provided with a light transmitting element which is arranged on the top layer board next to the luminescent unit and used for placing an article.
Description
Technical field
The utility model relates to a kind of capturing images module, refers to a kind of capturing images module that can electrically be connected two circuit substrates especially.
Background technology
Individual's fingerprint is one to be different from the exclusive biological characteristic of other people fingerprint, and therefore individual fingerprint application is when personal identification number, and the security that it possessed is very high.Because the increase with its storage volume is popularized in the use of electronic equipment, the protection that is stored in the personal information in it is more apparent for important.Therefore, with the password of individual fingerprint, can manage personal information effectively as the unlatching or the use of control electronic equipment.Above-mentioned electronic equipment, as mobile phone, main frame and various computer peripheral equipments or the like, it captures its user's the work of fingerprint to authenticate by means of a fingerprint scan device.After fingerprint image in this fingerprint scan device was converted into digital finger-print information, still needing transferred in the controller of this electronic equipment the effect of its finger print identifying of competence exertion.
See also shown in Figure 1ly, it is the synoptic diagram of known capturing images module.By among the figure as can be known, known capturing images module comprises: a circuit board P, is arranged at imageing sensor S, on this circuit board P electrically and is arranged at collector lens G, and the light-guide device T who is arranged at this light emitting diode D top that light emitting diode D, on this circuit board P is arranged at this imageing sensor S top electrically.The capturing images principle of known capturing images module is: the guiding that the light beam L that is produced by this light emitting diode D sees through this light-guide device T forms a projecting beam L ' who invests the object F that is positioned at this collector lens G top, "; this folded light beam L " at last passed this collector lens G and invested this imageing sensor S to form a folded light beam L who invests this collector lens G then after the reflection of this object of this projecting beam L ' process F, to be used for capturing the image information of this object F one side.
So, the improving of the above-mentioned defective of inventor's thoughts, and according to the correlation experience of being engaged in for many years in this respect, the concentrated observation and research, and cooperate the utilization of scientific principle, and propose a kind of reasonable in design and effectively improve the utility model of above-mentioned defective.
The utility model content
Technical problem to be solved in the utility model, be to provide a kind of capturing images module that can electrically be connected two circuit substrates, it is separately positioned on a capturing images unit on the different circuit substrates with a luminescence unit, and electrically connects two different circuit substrates through a conducting element.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present utility model, a kind of capturing images module that can electrically be connected two circuit substrates is provided, and it comprises: a base board unit, a conductive unit, a capturing images unit, an optical imagery unit, a luminescence unit and a printing opacity unit.Wherein, this base board unit has the top layer substrate that a bottom substrate and is positioned at this bottom substrate top and corresponding this bottom substrate, and wherein this top layer substrate has a transmission region.This conductive unit has at least one conducting element that is electrically connected between this bottom substrate and this top layer substrate.This capturing images unit has at least one capturing images element that is arranged at electrically on this bottom substrate.This optical imagery unit is arranged on this bottom substrate and covers this capturing images unit.This luminescence unit has at least one light-emitting component that is arranged on this top layer substrate electrically and is positioned at this top, optical imagery unit.This printing opacity unit has one and is arranged on this top layer substrate and the translucent element of contiguous this luminescence unit, for a placing object on this translucent element.
Therefore, the beneficial effects of the utility model are: invest this translucent element by the light beam that above-mentioned at least one light-emitting component produced, and this light beam sees through the guiding of this translucent element and invests this object, this light beam is through forming a folded light beam of investing this optical imagery unit after this reflected by objects then, and this folded light beam is passed this optical imagery unit and invested this capturing images unit at last.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present utility model, a kind of capturing images module that can electrically be connected two circuit substrates is provided, and it comprises: a base board unit, a conductive unit, a capturing images unit, an optical imagery unit, a luminescence unit and a printing opacity unit.Wherein, this base board unit has the top layer substrate that a bottom substrate and is positioned at this bottom substrate top and corresponding this bottom substrate, and wherein this top layer substrate has a transmission region, and this bottom substrate is a transparency carrier.This conductive unit has at least one conducting element that is electrically connected between this bottom substrate and this top layer substrate.This capturing images unit has the capturing images element at least one bottom that is arranged at this bottom substrate electrically.This optical imagery unit is arranged on this bottom substrate and covers this capturing images unit.This luminescence unit has at least one light-emitting component that is arranged on this top layer substrate electrically and is positioned at this top, optical imagery unit.This printing opacity unit has one and is arranged on this top layer substrate and the translucent element of contiguous this luminescence unit, for a placing object on this translucent element.
Therefore, the beneficial effects of the utility model are: invest this translucent element by the light beam that above-mentioned at least one light-emitting component produced, and this light beam sees through the guiding of this translucent element and invests this object, this light beam is through forming a folded light beam of investing this optical imagery unit after this reflected by objects then, and this folded light beam is passed this optical imagery unit and this bottom substrate and invested this capturing images unit at last.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present utility model, a kind of capturing images module that can electrically be connected two circuit substrates is provided, and it comprises: a base board unit, a conductive unit, a capturing images unit, an optical imagery unit, a luminescence unit and a printing opacity unit.Wherein, this base board unit has the top layer substrate that a bottom substrate and is positioned at this bottom substrate top and corresponding this bottom substrate, and wherein this top layer substrate has a transmission region, and this bottom substrate has an opening.This conductive unit has at least one conducting element that is electrically connected between this bottom substrate and this top layer substrate.This capturing images unit has the capturing images element at least one bottom that is arranged at this bottom substrate electrically.This optical imagery unit is arranged on this bottom substrate and covers this capturing images unit.This luminescence unit has at least one light-emitting component that is arranged on this top layer substrate electrically and is positioned at this top, optical imagery unit.This printing opacity unit has one and is arranged on this top layer substrate and the translucent element of contiguous this luminescence unit, for a placing object on this translucent element.
Therefore, the beneficial effects of the utility model are: invest this translucent element by the light beam that above-mentioned at least one light-emitting component produced, and this light beam sees through the guiding of this translucent element and invests this object, this light beam is through forming a folded light beam of investing this optical imagery unit after this reflected by objects then, and this folded light beam is passed the opening of this optical imagery unit and this bottom substrate and invested this capturing images unit at last.
In order further to understand the utility model is to reach technology, means and the effect that predetermined purpose is taked, see also following about detailed description of the present utility model and accompanying drawing, believe the purpose of this utility model, feature and characteristics, go deep into and concrete understanding when getting one thus, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the utility model is limited.
Description of drawings
Fig. 1 is the synoptic diagram of known capturing images module;
Fig. 2 can electrically be connected the diagrammatic cross-section of first embodiment of the capturing images module of two circuit substrates for the utility model;
Fig. 3 can electrically be connected the diagrammatic cross-section of second embodiment of the capturing images module of two circuit substrates for the utility model;
Fig. 4 can electrically be connected the diagrammatic cross-section of the 3rd embodiment of the capturing images module of two circuit substrates for the utility model;
Fig. 5 can electrically be connected the diagrammatic cross-section of the 4th embodiment of the capturing images module of two circuit substrates for the utility model;
Fig. 5 A is the diagrammatic cross-section of another kind the 4th embodiment of the utility model capturing images module that can electrically be connected two circuit substrates;
Fig. 5 B is the diagrammatic cross-section of another the 4th embodiment of the utility model capturing images module that can electrically be connected two circuit substrates;
Fig. 6 can electrically be connected the diagrammatic cross-section of the 5th embodiment of the capturing images module of two circuit substrates for the utility model;
Fig. 7 can electrically be connected the diagrammatic cross-section of the 6th embodiment of the capturing images module of two circuit substrates for the utility model;
Fig. 8 can electrically be connected the diagrammatic cross-section of the 7th embodiment of the capturing images module of two circuit substrates for the utility model;
Fig. 9 can electrically be connected the diagrammatic cross-section of the 8th embodiment of the capturing images module of two circuit substrates for the utility model;
Fig. 9 A is the diagrammatic cross-section of another kind the 8th embodiment of the utility model capturing images module that can electrically be connected two circuit substrates; And
Fig. 9 B is the diagrammatic cross-section of another the 8th embodiment of the utility model capturing images module that can electrically be connected two circuit substrates.
[main element description of reference numerals]
[known]
Circuit board P
Imageing sensor S
Light emitting diode D
Collector lens G
Light-guide device T
Object F
Light beam L
Projecting beam L '
Folded light beam L "
[the utility model]
Capturing images unit 2 capturing images elements 20
Conductive unit W conducting element W1
Object F
Electric conductor B
Light beam L1
Folded light beam L2
Embodiment
See also shown in Figure 2, the utility model first embodiment provides a kind of capturing images module that can electrically be connected two circuit substrates, and it comprises: a base board unit 1, a capturing images unit 2, an optical imagery unit 3, a luminescence unit 4, a printing opacity unit 5 and a conductive unit W.
Wherein, this base board unit 1 has the top layer substrate 12 (this bottom substrate 10 and these top layer substrate 12 preset distances separated from one another) that a bottom substrate 10 and is positioned at these bottom substrate 10 tops and corresponding this bottom substrate 10, wherein this top layer substrate 12 has a transmission region 120, and the transmission region 120 of this top layer substrate 12 can be an opening or a light penetrating object (for example this light penetrating object can be inserted in this opening, to form this transmission region).With the utility model first embodiment for example, this transmission region 120 is an opening.In addition, according to different design requirements, this bottom substrate 10 is hard substrate, and this top layer substrate 12 is a soft base plate; Perhaps, this bottom substrate 10 is hard substrate, and this top layer substrate 12 is hard substrate.With the utility model first embodiment for example, this bottom substrate 10 and this top layer substrate 12 are all hard substrate.
In addition, when if this transmission region 120 is a light penetrating object, the top layer substrate 12 of this base board unit 1 can be a transparent substrates (this part printing opacity place is this light penetrating object) with part printing opacity, therefore the utility model also can omit the use of this printing opacity unit 5, and makes an object F directly be seated on this transmission region 120 (this light penetrating object).
Moreover, this capturing images unit 2 has at least one capturing images element 20 (so these capturing images element 20 needed quantity can adjust according to different design requirements) that is arranged at electrically on this bottom substrate 10, and this capturing images element 20 can be an imageing sensor.In addition, this imageing sensor can be linked to an analysis software (figure does not show), to be used to judge the image information that is captured.
In addition, this optical imagery unit 3 (this optical imagery unit 3 has the function of anti-parasitic light) is arranged on this bottom substrate 10 and covers this capturing images unit 2.With the utility model first embodiment for example, this optical imagery unit 3 has a shading body 30 (for example can coat light shield layer at the outside surface of this shading body 30, can reach the effect of anti-parasitic light) and one be linked to this shading body 30 and be positioned at the collective optics 31 (so this shading body 30 can be integrate shaped type with this collective optics 31) of these 2 tops, capturing images unit, and this collective optics 31 can be a collector lens that is used for light focusing.Therefore, see through the use of this optical imagery unit 3, guaranteeing that 2 of this capturing images unit can receive light source (other external parasitic light can be blocked by this optical imagery unit 3) from specific direction, and make this capturing images unit 2 can capture more accurate image information.
In addition, this luminescence unit 4 has at least one light-emitting component 40 that is arranged on this top layer substrate 12 electrically and is positioned at these 3 tops, optical imagery unit, and above-mentioned at least one light-emitting component 40 can be a light emitting diode.With the utility model first embodiment for example, this luminescence unit 4 has two light-emitting components 40 that are arranged at electrically on this top layer substrate 12.Yet defining of above-mentioned light emitting diode just is used for for example, and all any light-emitting components all can be applicable to the utility model.
Moreover this printing opacity unit 5 has one and is arranged on this top layer substrate 12 and the translucent element 50 (for example clear glass or clear plastic) of contiguous this luminescence unit 4, is placed on this translucent element 50 for an object F.In other words, the user can be positioned over the side (for example Shou Zhi fingerprint) of desiring sensing among this object F on this translucent element 50, to carry out the image sensing of the side.
In addition, this conductive unit W has at least one conducting element W1 that is electrically connected between this bottom substrate 10 and this top layer substrate 12.For example: above-mentioned at least one conducting element W1 can be made up of many leads; Above-mentioned at least one conducting element W1 can be a flexible circuit board; Above-mentioned at least one conducting element W1 can be made up of many tin balls.Therefore, all any conducting element W1 with conductive capability all can be applicable to the utility model.
Therefore, as shown in Figure 2, the characteristics of the utility model first embodiment are: this luminescence unit 4 is arranged at respectively on the two opposite surfaces of this top layer substrate 12 with this printing opacity unit 5, and this luminescence unit 4 is between this optical imagery unit 3 and this top layer substrate 12.In other words, this top layer substrate 12 can see through above-mentioned two light-emitting components 40 (perhaps any fixed block that is positioned on this optical imagery unit 3), to be positioned at the top of this optical imagery unit 3.
Thus, the light beam L1 that above-mentioned two light-emitting components 40 are produced invests this translucent element 50 (this light beam L 1 is through this transmission region 120), and this light beam L1 sees through the guiding of this translucent element 50 and invests this object F, form the folded light beam L2 (this folded light beam L2 is through this transmission region 120) of this optical imagery unit 3 of trend of purchasing then after the reflection of this object of this light beam L1 process F, this folded light beam L2 passes this optical imagery unit 3 and invests this capturing images unit 2 at last, to be used for capturing the image information of this object F one side.
See also shown in Figure 3, the utility model second embodiment provides a kind of capturing images module that can electrically be connected two circuit substrates, and it comprises: a base board unit 1, a capturing images unit 2, an optical imagery unit 3, a luminescence unit 4, a printing opacity unit 5 and a conductive unit W.By among the figure more as can be known, the difference of the utility model second embodiment and the first embodiment maximum is: the bottom of this translucent element 50 is passed this transmission region 120 and is contacted with this optical imagery unit 3 or only is positioned at the top of this optical imagery unit 3 and does not touch this optical imagery unit 3.Thus, the light beam L1 that above-mentioned two light-emitting components 40 are produced invests this translucent element 50 (this light beam L 1 is through this transmission region 120), and this light beam L1 sees through the guiding of this translucent element 50 and invests this object F, form the folded light beam L2 (this folded light beam L 2 is through these transmission regions 120) of this optical imagery unit 3 of trend of purchasing then after the reflection of this object of this light beam L1 process F, this folded light beam L2 passes this optical imagery unit 3 and invests this capturing images unit 2 at last, to be used for capturing the image information of this object F one side.
See also shown in Figure 4, the utility model the 3rd embodiment provides a kind of capturing images module that can electrically be connected two circuit substrates, and it comprises: a base board unit 1, a capturing images unit 2, an optical imagery unit 3, a luminescence unit 4, a printing opacity unit 5 and a conductive unit W.By among the figure more as can be known, the difference of the utility model the 3rd embodiment and first and second embodiment maximum is: this luminescence unit 4 all is arranged on the outside surface of this top layer substrate 12 with this printing opacity unit 5, this luminescence unit 4 is between this printing opacity unit 5 and this top layer substrate 12, and this top layer substrate 12 directly is arranged on this optical imagery unit 3 in addition.Thus, the light beam L1 that above-mentioned at least one light-emitting component 40 is produced invests this translucent element 50, and this light beam L1 sees through the guiding of this translucent element 50 and invests this object F, form the folded light beam L2 (this folded light beam L2 is through this transmission region 120) of this optical imagery unit 3 of trend of purchasing then after the reflection of this object of this light beam L1 process F, this folded light beam L2 passes this optical imagery unit 3 and invests this capturing images unit 2 at last, to be used for capturing the image information of this object F one side.
See also shown in Figure 5, the utility model the 4th embodiment provides a kind of capturing images module that can electrically be connected two circuit substrates, and it comprises: a base board unit 1, a capturing images unit 2, an optical imagery unit 3, a luminescence unit 4, a printing opacity unit 5 and a conductive unit W.By among the figure more as can be known, the difference of the utility model the 4th embodiment and the 3rd embodiment maximum is: the outside surface of this top layer substrate 12 has two grooves 121, two light-emitting components 40 of this luminescence unit 4 are placed in respectively in above-mentioned two grooves 121, and this printing opacity unit 5 is arranged on the outside surface of this top layer substrate 12 and covers this luminescence unit 4.Thus, the light beam L1 that above-mentioned two light-emitting components 40 are produced invests this translucent element 50, and this light beam L1 sees through the guiding of this translucent element 50 and invests this object F, form the folded light beam L2 (this folded light beam L2 is through this transmission region 120) of this optical imagery unit 3 of trend of purchasing then after the reflection of this object of this light beam L1 process F, this folded light beam L2 passes this optical imagery unit 3 and invests this capturing images unit 2 at last, to be used for capturing the image information of this object F one side.
See also shown in Fig. 5 A, the utility model another kind of the 4th embodiment provide a kind of capturing images module that can electrically be connected two circuit substrates, and it comprises: a base board unit 1, a capturing images unit 2, an optical imagery unit 3, a luminescence unit 4, a printing opacity unit 5 and a conductive unit W.By among the figure more as can be known, the maximum difference of another kind of the 4th embodiment of the utility model and the 4th embodiment (Fig. 5) is: the bottom substrate 10 of this base board unit 1 is a transparency carrier, and at least one capturing images element 20 of this capturing images unit 2 in the mode of covering crystalline substance (Flip-chip) through a plurality of electric conductor B (for example tin ball B) and be arranged at electrically on the bottom of this bottom substrate 10.
Thus, the light beam L1 that above-mentioned two light-emitting components 40 are produced invests this translucent element 50, and this light beam L1 sees through the guiding of this translucent element 50 and invests this object F, form the folded light beam L2 (this folded light beam L2 is through this transmission region 120) of this optical imagery unit 3 of trend of purchasing then after the reflection of this object of this light beam L1 process F, this folded light beam L 2 passes this optical imagery unit 3 and this bottom substrate 10 and invests this capturing images unit 2 at last, to be used for capturing the image information of this object F one side.
See also shown in Fig. 5 B, another the 4th embodiment of the utility model provides a kind of capturing images module that can electrically be connected two circuit substrates, and it comprises: a base board unit 1, a capturing images unit 2, an optical imagery unit 3, a luminescence unit 4, a printing opacity unit 5 and a conductive unit W.By among the figure more as can be known, the maximum difference of another the 4th embodiment of the utility model and the 4th embodiment (Fig. 5) is: the bottom substrate 10 of this base board unit 1 has an opening 101, and at least one capturing images element 20 of this capturing images unit 2 sees through a plurality of electric conductor B (for example tin ball B) in the mode of covering crystalline substance (Flip-chip) and is arranged at electrically on the bottom of this bottom substrate 10.
Thus, the light beam L1 that above-mentioned two light-emitting components 40 are produced invests this translucent element 50, and this light beam L1 sees through the guiding of this translucent element 50 and invests this object F, form the folded light beam L2 (this folded light beam L2 is through this transmission region 120) of this optical imagery unit 3 of trend of purchasing then after the reflection of this object of this light beam L1 process F, this folded light beam L2 passes the opening 101 of this optical imagery unit 3 and this bottom substrate 10 and invests this capturing images unit 2 at last, to be used for capturing the image information of this object F one side.
See also shown in Figure 6, the utility model the 5th embodiment provides a kind of capturing images module that can electrically be connected two circuit substrates, and it comprises: a base board unit 1, a capturing images unit 2, an optical imagery unit 3, a luminescence unit 4, a printing opacity unit 5, an outer cover unit 6 and a conductive unit W.
Wherein, this base board unit 1 has the top layer substrate 12 (this bottom substrate 10 and these top layer substrate 12 preset distances separated from one another) that a bottom substrate 10 and is positioned at these bottom substrate 10 tops and corresponding this bottom substrate 10, wherein this top layer substrate 12 has a transmission region 120, and the transmission region 120 of this top layer substrate 12 can be an opening or a light penetrating object (for example this light penetrating object can be inserted in this opening, to form this transmission region).With the utility model first embodiment for example, this transmission region 120 is an opening.In addition, according to different design requirements, this bottom substrate 10 is hard substrate, and this top layer substrate 12 is a soft base plate; Perhaps, this bottom substrate 10 is hard substrate, and this top layer substrate 12 is hard substrate.With the utility model first embodiment for example, this bottom substrate 10 and this top layer substrate 12 are all hard substrate.
In addition, when if this first transmission region 120 is a light penetrating object, the top layer substrate 12 of this base board unit 1 can be a transparent substrates (this part printing opacity place is this light penetrating object) with part printing opacity, therefore the utility model also can omit the use of this printing opacity unit 5, and makes an object F directly be seated on this first transmission region 120 (this light penetrating object).
Moreover, this capturing images unit 2 has at least one capturing images element 20 (so these capturing images element 20 needed quantity can adjust according to different design requirements) that is arranged at electrically on this bottom substrate 10, and this capturing images element 20 can be an imageing sensor.In addition, this imageing sensor can be linked to an analysis software (figure does not show), to be used to judge the image information that is captured.
In addition, this optical imagery unit 3 (this optical imagery unit 3 has the function of anti-parasitic light) is arranged on this bottom substrate 10 and covers this capturing images unit 2.With the utility model first embodiment for example, this optical imagery unit 3 has a shading body 30 (for example can coat light shield layer at the outside surface of this shading body 30, can reach the effect of anti-parasitic light) and one be linked to this shading body 30 and be positioned at the collective optics 31 (so this shading body 30 can be integrate shaped type with this collective optics 31) of these 2 tops, capturing images unit, and this collective optics 31 can be a collector lens that is used for light focusing.Therefore, see through the use of this optical imagery unit 3, guaranteeing that 2 of this capturing images unit can receive light source (other external parasitic light can be blocked by this optical imagery unit 3) from specific direction, and make this capturing images unit 2 can capture more accurate image information.
In addition, this luminescence unit 4 has at least one light-emitting component 40 that is arranged on this top layer substrate 12 electrically and is positioned at these outer cover unit 6 tops, and above-mentioned at least one light-emitting component 40 can be a light emitting diode.With the utility model first embodiment for example, this luminescence unit 4 has two light-emitting components 40 that are arranged at electrically on this top layer substrate 12.Yet defining of above-mentioned light emitting diode just is used for for example, and all any light-emitting components all can be applicable to the utility model.
Moreover this printing opacity unit 5 has one and is arranged on this top layer substrate 12 and the translucent element 50 (for example clear glass or clear plastic) of contiguous this luminescence unit 4, is placed on this translucent element 50 for an object F.In other words, the user can be positioned over the side (for example Shou Zhi fingerprint) of desiring sensing among this object F on this translucent element 50, to carry out the image sensing of the side.
In addition, this outer cover unit 6 is arranged on this bottom substrate 10 and covers this optical imagery unit 3, wherein this outer cover unit 6 has second transmission region 60 of corresponding this first transmission region 120, and second transmission region 60 of this outer cover unit 6 can be an opening or a light penetrating object (for example this light penetrating object can be inserted in this opening, to form this second transmission region).With the utility model the 5th embodiment for example, this second transmission region 60 is an opening.
In addition, this conductive unit W have at least one be electrically connected at this bottom substrate 10 and this top layer substrate 12 between conducting element W1.For example: above-mentioned at least one conducting element W1 can be made up of many leads; Above-mentioned at least one conducting element W1 can be a flexible circuit board; Above-mentioned at least one conducting element W1 can be made up of many tin balls.Therefore, all any conducting element W1 with conductive capability all can be applicable to the utility model.
Therefore, as shown in Figure 6, the characteristics of the utility model the 5th embodiment are: this luminescence unit 4 is arranged at respectively on the two opposite surfaces of this top layer substrate 12 with this printing opacity unit 5, and this luminescence unit 4 is between this outer cover unit 6 and this top layer substrate 12.In other words, this top layer substrate 12 can see through above-mentioned two light-emitting components 40 (perhaps any fixed block that is positioned on this outer cover unit 6), to be positioned at the top of this outer cover unit 6.
Thus, the light beam L1 that above-mentioned two light-emitting components 40 are produced invests this translucent element 50 (this light beam L1 is through this first transmission region 120), and this light beam L1 sees through the guiding of this translucent element 50 and invests this object F, form the folded light beam L2 (this folded light beam L2 passes through this first transmission region 120 and this second transmission region 60 in regular turn) of this optical imagery unit 3 of trend of purchasing then after the reflection of this object of this light beam L1 process F, this folded light beam L2 passes this optical imagery unit 3 and invests this capturing images unit 2 at last, to be used for capturing the image information of this object F one side.
See also shown in Figure 7, the utility model the 6th embodiment provides a kind of capturing images module that can electrically be connected two circuit substrates, and it comprises: a base board unit 1, a capturing images unit 2, an optical imagery unit 3, a luminescence unit 4, a printing opacity unit 5, an outer cover unit 6 and a conductive unit W.By among the figure more as can be known, the difference of the utility model the 6th embodiment and the 5th embodiment maximum is: the bottom of this translucent element 50 is passed this first transmission region 120 and is positioned at the top of this outer cover unit 6.Thus, the light beam L1 that above-mentioned two light-emitting components 40 are produced invests this translucent element 50 (this light beam L1 is through this first transmission region 120), and this light beam L1 sees through the guiding of this translucent element 50 and invests this object F, form the folded light beam L2 (this folded light beam L2 passes through this first transmission region 120 and this second transmission region 60 in regular turn) of this optical imagery unit 3 of trend of purchasing then after the reflection of this object of this light beam L1 process F, this folded light beam L2 passes this optical imagery unit 3 and invests this capturing images unit 2 at last, to be used for capturing the image information of this object F one side.
See also shown in Figure 8, the utility model the 7th embodiment provides a kind of capturing images module that can electrically be connected two circuit substrates, and it comprises: a base board unit 1, a capturing images unit 2, an optical imagery unit 3, a luminescence unit 4, a printing opacity unit 5, an outer cover unit 6 and a conductive unit W.By among the figure more as can be known, the difference of the utility model the 7th embodiment and the 5th, six embodiment maximums is: this luminescence unit 4 all is arranged on the outside surface of this top layer substrate 12 with this printing opacity unit 5, this luminescence unit 4 is between this printing opacity unit 5 and this top layer substrate 12, and this top layer substrate 12 is set directly on this outer cover unit 6.Thus, the light beam L1 that above-mentioned two light-emitting components 40 are produced invests this translucent element 50, and this light beam L1 sees through the guiding of this translucent element 50 and invests this object F, form the folded light beam L2 (this folded light beam L2 passes through this first transmission region 120 and this second transmission region 60 in regular turn) of this optical imagery unit 3 of trend of purchasing then after the reflection of this object of this light beam L1 process F, this folded light beam L2 passes this optical imagery unit 3 and invests this capturing images unit 2 at last, to be used for capturing the image information of this object F one side.
See also shown in Figure 9, the utility model the 8th embodiment provides a kind of capturing images module that can electrically be connected two circuit substrates, and it comprises: a base board unit 1, a capturing images unit 2, an optical imagery unit 3, a luminescence unit 4, a printing opacity unit 5, an outer cover unit 6 and a conductive unit W.By among the figure more as can be known, the difference of the utility model the 8th embodiment and the 7th embodiment maximum is: the outside surface of this top layer substrate 12 has two grooves 121, two light-emitting components 40 of this luminescence unit 4 are placed in respectively in above-mentioned two grooves 121, and this printing opacity unit 5 is arranged on the outside surface of this top layer substrate 12 and covers this luminescence unit 4.Thus, the light beam L1 that above-mentioned two light-emitting components 40 are produced invests this translucent element 50, and this light beam L1 sees through the guiding of this translucent element 50 and invests this object F, form the folded light beam L2 (this folded light beam L2 passes through this first transmission region 120 and this second transmission region 60 in regular turn) of this optical imagery unit 3 of trend of purchasing then after the reflection of this object of this light beam L1 process F, this folded light beam L2 passes this optical imagery unit 3 and invests this capturing images unit 2 at last, to be used for capturing the image information of this object F one side.
See also shown in Fig. 9 A, the utility model another kind of the 8th embodiment provide a kind of capturing images module that can electrically be connected two circuit substrates, and it comprises: a base board unit 1, a capturing images unit 2, an optical imagery unit 3, a luminescence unit 4, a printing opacity unit 5, an outer cover unit 6 and a conductive unit W.By among the figure more as can be known, the maximum difference of another kind of the 8th embodiment of the utility model and the 8th embodiment (Fig. 9) is: the bottom substrate 10 of this base board unit 1 is a transparency carrier, and at least one capturing images element 20 of this capturing images unit 2 in the mode of covering crystalline substance (Flip-chip) through a plurality of electric conductor B (for example tin ball B) and be arranged at electrically on the bottom of this bottom substrate 10.
Thus, the light beam L1 that above-mentioned two light-emitting components 40 are produced invests this translucent element 50, and this light beam L1 sees through the guiding of this translucent element 50 and invests this object F, form the folded light beam L2 (this folded light beam L2 passes through this first transmission region 120 and this second transmission region 60 in regular turn) of this optical imagery unit 3 of trend of purchasing then after the reflection of this object of this light beam L1 process F, this folded light beam L2 passes this optical imagery unit 3 and this bottom substrate 10 and invests this capturing images unit 2 at last, to be used for capturing the image information of this object F one side.
See also shown in Fig. 9 B, another the 8th embodiment of the utility model provides a kind of capturing images module that can electrically be connected two circuit substrates, and it comprises: a base board unit 1, a capturing images unit 2, an optical imagery unit 3, a luminescence unit 4, a printing opacity unit 5, an outer cover unit 6 and a conductive unit W.By among the figure more as can be known, the maximum difference of another the 8th embodiment of the utility model and the 8th embodiment (Fig. 9) is: the bottom substrate 10 of this base board unit 1 has an opening 101, and at least one capturing images element 20 of this capturing images unit 2 sees through a plurality of electric conductor B (for example tin ball B) in the mode of covering crystalline substance (Flip-chip) and is arranged at electrically on the bottom of this bottom substrate 10.
Thus, the light beam L1 that above-mentioned two light-emitting components 40 are produced invests this translucent element 50, and this light beam L1 sees through the guiding of this translucent element 50 and invests this object F, form the folded light beam L2 (this folded light beam L2 passes through this first transmission region 120 and this second transmission region 60 in regular turn) of this optical imagery unit 3 of trend of purchasing then after the reflection of this object of this light beam L1 process F, this folded light beam L2 passes the opening 101 of this optical imagery unit 3 and this bottom substrate 10 and invests this capturing images unit 2 at last, to be used for capturing the image information of this object F one side.
But; all scopes of the present utility model should be as the criterion with claim; all embodiment that meets the spirit variation similar of the utility model claim protection domain with it; all should be contained in the claim protection domain of the present utility model; any those of ordinary skill in field of the present utility model, can think easily and variation or revise all can be encompassed in the claim protection domain of the present utility model.
Claims (12)
1. the capturing images module that can electrically be connected two circuit substrates is characterized in that, comprising:
One base board unit, it has the top layer substrate that a bottom substrate and is positioned at this bottom substrate top and corresponding this bottom substrate, and wherein this top layer substrate has a transmission region;
One conductive unit, it has at least one conducting element that is electrically connected between this bottom substrate and this top layer substrate;
One capturing images unit, it has at least one capturing images element that is arranged at electrically on this bottom substrate;
One optical imagery unit, it is arranged on this bottom substrate and covers this capturing images unit;
One luminescence unit, it has at least one light-emitting component that is arranged on this top layer substrate electrically and is positioned at this top, optical imagery unit; And
One printing opacity unit, it has one and is arranged on this top layer substrate and the translucent element of contiguous this luminescence unit, for a placing object on this translucent element;
The light beam that above-mentioned at least one light-emitting component produced is invested this translucent element, and this light beam sees through the guiding of this translucent element and invests this object, and this light beam is through forming a folded light beam of investing this optical imagery unit after this reflected by objects, described folded light beam is passed this optical imagery unit and invested this capturing images unit.
2. the capturing images module that can electrically be connected two circuit substrates as claimed in claim 1 is characterized in that: this bottom substrate is hard substrate, and this top layer substrate is a soft base plate.
3. the capturing images module that can electrically be connected two circuit substrates as claimed in claim 1 is characterized in that: this bottom substrate is hard substrate, and this top layer substrate is hard substrate.
4. the capturing images module that can electrically be connected two circuit substrates as claimed in claim 1 is characterized in that: above-mentioned at least one conducting element is made up of many leads or is made up of many tin balls.
5. the capturing images module that can electrically be connected two circuit substrates as claimed in claim 1 is characterized in that: above-mentioned at least one conducting element is a flexible circuit board.
6. the capturing images module that can electrically be connected two circuit substrates as claimed in claim 1, it is characterized in that: this luminescence unit is arranged at respectively on the two opposite surfaces of this top layer substrate with this printing opacity unit, and this luminescence unit is between this optical imagery unit and this top layer substrate.
7. the capturing images module that can electrically be connected two circuit substrates as claimed in claim 1, it is characterized in that: this luminescence unit is arranged at respectively on the two opposite surfaces of this top layer substrate with this printing opacity unit, the bottom of this translucent element is passed this transmission region and is contacted with this optical imagery unit, and this luminescence unit is between this optical imagery unit and this top layer substrate.
8. the capturing images module that can electrically be connected two circuit substrates as claimed in claim 1, it is characterized in that: this luminescence unit and this printing opacity unit all are arranged on the outside surface of this top layer substrate, this luminescence unit is between this printing opacity unit and this top layer substrate, and this top layer substrate is set directly on this optical imagery unit.
9. the capturing images module that can electrically be connected two circuit substrates as claimed in claim 1, it is characterized in that: the outside surface of this top layer substrate has at least one groove, this luminescence unit is placed in above-mentioned at least one groove, this printing opacity unit is arranged on the outside surface of this top layer substrate and covers this luminescence unit, and this top layer substrate is set directly on this optical imagery unit.
10. the capturing images module that can electrically be connected two circuit substrates as claimed in claim 1 is characterized in that: this optical imagery unit has the collective optics that a shading body and is linked to this shading body and is positioned at this top, capturing images unit.
11. the capturing images module that can electrically be connected two circuit substrates is characterized in that, comprising:
One base board unit, it has the top layer substrate that a bottom substrate and is positioned at this bottom substrate top and corresponding this bottom substrate, and wherein this top layer substrate has a transmission region, and this bottom substrate is a transparency carrier;
One conductive unit, it has at least one conducting element that is electrically connected between this bottom substrate and this top layer substrate;
One capturing images unit, it has the capturing images element at least one bottom that is arranged at this bottom substrate electrically;
One optical imagery unit, it is arranged on this bottom substrate and covers this capturing images unit;
One luminescence unit, it has at least one light-emitting component that is arranged on this top layer substrate electrically and is positioned at this top, optical imagery unit; And
One printing opacity unit, it has one and is arranged on this top layer substrate and the translucent element of contiguous this luminescence unit, for a placing object on this translucent element;
The light beam that above-mentioned at least one light-emitting component produced is invested this translucent element, and this light beam sees through the guiding of this translucent element and invests this object, and this light beam is through forming a folded light beam of investing this optical imagery unit after this reflected by objects, and described this folded light beam is passed this optical imagery unit and this bottom substrate and invested this capturing images unit.
12. the capturing images module that can electrically be connected two circuit substrates is characterized in that, comprising:
One base board unit, it has the top layer substrate that a bottom substrate and is positioned at this bottom substrate top and corresponding this bottom substrate, and wherein this top layer substrate has a transmission region, and this bottom substrate has an opening;
One conductive unit, it has at least one conducting element that is electrically connected between this bottom substrate and this top layer substrate;
One capturing images unit, it has the capturing images element at least one bottom that is arranged at this bottom substrate electrically;
One optical imagery unit, it is arranged on this bottom substrate and covers this capturing images unit;
One luminescence unit, it has at least one light-emitting component that is arranged on this top layer substrate electrically and is positioned at this top, optical imagery unit; And
One printing opacity unit, it has one and is arranged on this top layer substrate and the translucent element of contiguous this luminescence unit, for a placing object on this translucent element;
The light beam that above-mentioned at least one light-emitting component produced is invested this translucent element, and this light beam sees through the guiding of this translucent element and invests this object, this light beam is through forming a folded light beam of investing this optical imagery unit after this reflected by objects, described this folded light beam is passed the opening of this optical imagery unit and this bottom substrate and invested this capturing images unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201779582U CN201522712U (en) | 2009-09-25 | 2009-09-25 | Image capturing module capable of electrically linking up two circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201779582U CN201522712U (en) | 2009-09-25 | 2009-09-25 | Image capturing module capable of electrically linking up two circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201522712U true CN201522712U (en) | 2010-07-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201779582U Expired - Fee Related CN201522712U (en) | 2009-09-25 | 2009-09-25 | Image capturing module capable of electrically linking up two circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201522712U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108073305A (en) * | 2016-11-18 | 2018-05-25 | 光宝新加坡有限公司 | Portable electronic devices and its closely optical sensing module |
| CN108196418A (en) * | 2018-02-27 | 2018-06-22 | 广东欧珀移动通信有限公司 | Laser projection module, depth camera and electronic device |
| CN108333850A (en) * | 2018-02-27 | 2018-07-27 | 广东欧珀移动通信有限公司 | The laser projection module and its detection method of damage, depth camera and electronic device |
| CN108594563A (en) * | 2018-04-03 | 2018-09-28 | Oppo广东移动通信有限公司 | Project structured light module, image capturing device and electronic equipment |
| US11307431B2 (en) | 2018-02-27 | 2022-04-19 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Laser projection modules and methods for detecting fracture thereof, depth cameras and electronic devices |
-
2009
- 2009-09-25 CN CN2009201779582U patent/CN201522712U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108073305A (en) * | 2016-11-18 | 2018-05-25 | 光宝新加坡有限公司 | Portable electronic devices and its closely optical sensing module |
| CN108196418A (en) * | 2018-02-27 | 2018-06-22 | 广东欧珀移动通信有限公司 | Laser projection module, depth camera and electronic device |
| CN108333850A (en) * | 2018-02-27 | 2018-07-27 | 广东欧珀移动通信有限公司 | The laser projection module and its detection method of damage, depth camera and electronic device |
| CN112611546A (en) * | 2018-02-27 | 2021-04-06 | Oppo广东移动通信有限公司 | Laser projection module, depth camera and electronic device |
| US11307431B2 (en) | 2018-02-27 | 2022-04-19 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Laser projection modules and methods for detecting fracture thereof, depth cameras and electronic devices |
| CN108594563A (en) * | 2018-04-03 | 2018-09-28 | Oppo广东移动通信有限公司 | Project structured light module, image capturing device and electronic equipment |
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