CN107958179B - Photoelectric sensing module and electronic device - Google Patents
Photoelectric sensing module and electronic device Download PDFInfo
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- CN107958179B CN107958179B CN201710268243.7A CN201710268243A CN107958179B CN 107958179 B CN107958179 B CN 107958179B CN 201710268243 A CN201710268243 A CN 201710268243A CN 107958179 B CN107958179 B CN 107958179B
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- 238000012545 processing Methods 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 239000008280 blood Substances 0.000 claims description 4
- 210000004369 blood Anatomy 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
Abstract
The invention discloses a photoelectric sensing module and an electronic device. The photoelectric sensing module includes: the device comprises a first substrate and a second substrate which are oppositely arranged, wherein the first substrate comprises a first surface facing the second substrate, and the second substrate comprises a second surface facing the first substrate; the light-emitting unit is arranged between the first substrate and the second substrate, is a passive matrix organic electroluminescent diode and is used for emitting light to reach a target object when the target object is positioned on the photoelectric sensing module; and the optical sensing unit is arranged on the first surface or the second surface and is used for receiving the optical signal reflected by the target object and converting the received optical signal into a corresponding electric signal. The electronic device comprises the photoelectric sensing module.
Description
Technical Field
The present disclosure relates to photoelectric sensing devices, and particularly to a photoelectric sensing module and an electronic device having the same.
Background
Currently, image recognition modules, such as fingerprint recognition modules, are becoming standard components of electronic products such as mobile terminals. However, the cost of the image recognition module is relatively high, which is not beneficial to the wide popularization.
Disclosure of Invention
Embodiments of the present invention aim to solve at least one of the technical problems existing in the prior art. For this reason, the embodiment of the invention needs to provide a photoelectric sensing module and an electronic device.
An embodiment of the present invention provides a photoelectric sensing module, including:
the device comprises a first substrate and a second substrate which are oppositely arranged, wherein the first substrate comprises a first surface facing the second substrate, and the second substrate comprises a second surface facing the first substrate;
the light-emitting unit is arranged between the first substrate and the second substrate and is used for emitting light to reach the target object when the target object is positioned on the photoelectric sensing module;
a light sensing unit disposed on the first surface or the second surface, the light sensing unit being configured to receive a light signal reflected by the target object and convert the received light signal into a corresponding electrical signal;
wherein the light emitting unit is a passive matrix organic electroluminescent diode.
In some embodiments, the photoelectric sensing module comprises any one or more of a fingerprint sensing module, a pulse sensing module, a blood oxygen sensing module and a heartbeat sensing module.
In some embodiments, the light emitting unit includes a plurality of self-luminous pixel points, each pixel point includes a cathode electrode and an anode electrode disposed opposite to each other, and a light emitting layer is disposed between the cathode electrode and the anode electrode.
In some embodiments, the light emitting layer includes an organic light emitting material that emits any one or more of visible light, infrared light, ultraviolet light, and green light.
In some embodiments, the light emitting unit includes a plurality of first electrode serials and a plurality of second electrode serials, wherein the first electrode serials are arranged along a first direction, the second electrode serials are arranged along a second direction, the first direction is different from the second direction, each first electrode serials includes a plurality of the cathode electrodes and leads connected to the cathode electrodes, and each second electrode serials includes a plurality of the anode electrodes and leads connected to the anode electrodes.
In some embodiments, the light sensing unit includes a plurality of photosensitive elements, and the projections of the photosensitive elements and the pixel points on the same substrate do not overlap or partially overlap.
In some embodiments, the photoelectric sensing module further includes a driving circuit, the driving circuit drives the light emitting unit to emit light, and drives the light sensing unit to perform light sensing, where the driving circuit and the light sensing unit are disposed on the same substrate.
In some embodiments, the driving circuit includes a first driving circuit driving the light sensing unit and a second driving circuit driving the light emitting unit; the first driving circuit and the light sensing unit are arranged on the same substrate, and the second driving circuit and the light emitting unit are arranged on another substrate; or, the first driving circuit, the second driving circuit, the light sensing unit and the light emitting unit are all arranged on the same substrate.
In some embodiments, the photo sensing module performs touch sensing before performing biometric information sensing, and starts biometric information sensing after detecting that a target object is touched, wherein when the photo sensing module performs touch sensing, an anode electrode or a cathode electrode of the light emitting unit serves as a touch sensing electrode to perform touch sensing.
In some embodiments, the optoelectronic sensing module further includes a touch sensing unit for determining a contact area of a target object on the optoelectronic sensing module, wherein the touch sensing unit includes a touch sensing layer and a touch detection circuit for driving the touch sensing layer to perform touch sensing to determine the contact area; the touch sensing layer and the light sensing unit are arranged on the same substrate, and the touch sensing unit is positioned between the substrate and the light sensing unit, or the touch sensing unit and the light sensing unit are positioned on two opposite sides of the substrate.
In some embodiments, the photoelectric sensing module further includes a controller, where the controller is configured to control the pixel point corresponding to the contact area to be lit in a time-sharing manner according to the contact area on which the target object determined by the photoelectric sensing module contacts, so as to emit an optical signal to the target object.
In some embodiments, the photoelectric sensing module is attached to a touch screen, and when the driving circuit contacts a contact area on the photoelectric sensing module according to the target object determined by the touch screen, the driving circuit controls a plurality of pixel points corresponding to the contact area to be lightened in a time-sharing manner so as to emit an optical signal to the target object.
In some embodiments, when the photoelectric sensing module is disposed below a display screen of an electronic device, the substrate of the photoelectric sensing module near the electronic device is multiplexed with a transparent substrate of the display screen.
In some embodiments, the photoelectric sensing module further comprises a processing circuit, and the processing circuit obtains the biological characteristic information of the target object according to the electric signal output by the light sensing unit.
An electronic device according to an embodiment of the present invention includes the photoelectric sensing module according to any of the above embodiments.
The photoelectric sensing module is simple in structure and thinner in thickness, and is favorable for being assembled into electronic equipment. Accordingly, the electronic device also has the following three main advantages.
Firstly, compared with the optical image recognition module adopting a camera, the thickness of the photoelectric sensing module is thinner, so that the thickness of the electronic device with the photoelectric sensing module is thinner, the development of the electronic device towards the light and thin direction is not influenced, and the application of the photoelectric sensing module on the light and thin electronic device is facilitated;
secondly, the sensing precision of the photoelectric sensing module is less influenced by the thickness of the glass cover plate, so that after the photoelectric sensing module is placed below the protective cover plate of the electronic device, the sensing precision of the photoelectric sensing module is less influenced, and the user experience of the electronic device is improved;
thirdly, when the electronic device includes a display device, the photoelectric sensing module can utilize some elements existing in the display device to realize point light sources, touch functions and the like, so that materials are saved, the overall cost of the electronic device is reduced, and the electronic device is not influenced to develop towards the direction of lightening and thinning.
As described above, the photoelectric sensing module may be integrated into an identification chip, and disposed at a proper position such as a front side, a back side, and a side of the electronic device, and may expose an outer surface of the electronic device, or may be disposed inside the electronic device, and adjacent to the housing. In addition, the collecting part of the biological characteristic information of the photoelectric sensing module can also be arranged in the display device of the electronic device, so that the full-screen execution of the biological characteristic information sensing is realized.
Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.
Drawings
The foregoing and/or additional aspects and advantages of embodiments of the invention will become apparent and may be readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic diagram of an embodiment of a photo sensor module according to the present invention;
FIG. 2 is a schematic diagram illustrating a positional relationship between a pixel and a photosensitive element in a photo-sensor module according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a photosensitive element of a photoelectric sensor module according to an embodiment of the present invention receiving a reflected light signal;
FIG. 4a is a schematic diagram of a structure of a cathode electrode and an anode electrode forming a pixel in a photoelectric sensor module according to an embodiment of the present invention;
FIG. 4b is a schematic view of another structure of a cathode electrode and an anode electrode forming a pixel in the photoelectric sensing module according to the embodiment of the present invention;
FIG. 5 is a schematic view illustrating a structure of another embodiment of a photoelectric sensor module according to the present invention;
FIG. 6 is a schematic structural diagram of another embodiment of a photoelectric sensor module according to the present invention;
FIG. 7 is a schematic diagram of a photo sensor module according to an embodiment of the present invention when performing image information sensing;
FIG. 8 is a schematic block diagram of another embodiment of a photo-sensor module according to an embodiment of the present invention;
FIG. 9 is a schematic structural diagram of another embodiment of a photo-sensor module according to the present invention;
FIG. 10 is a schematic diagram showing distribution of point light sources corresponding to contact areas of the photoelectric sensor module according to the embodiment of the present invention;
FIG. 11 is another schematic distribution diagram of point light sources corresponding to contact areas of the photoelectric sensor module according to the embodiment of the present invention;
fig. 12 is a schematic plan view of an electronic device according to an embodiment of the present invention.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present invention and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise. "contact" or "touch" includes direct contact or indirect contact. For example, the photo-sensing module disclosed hereinafter may be directly contacted by a user's finger if it is disposed in a housing hole of the electronic device exposing the housing, but indirectly contacted by the user's finger through a protective cover if it is disposed inside the electronic device, e.g., under the protective cover.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; may be mechanically connected, may be electrically connected, or may be in communication with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
Further, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the invention. It will be appreciated, however, by one skilled in the art that the inventive aspects may be practiced without one or more of the specific details, or with other structures, components, etc. In other instances, well-known structures or operations are not shown or described in detail to avoid obscuring the invention.
At present, the capacitive recognition module is mainly used as the image recognition module in the market, however, the manufacturing cost of the capacitive recognition module is higher due to the complicated circuit of the capacitive recognition module, and the signal penetrating capability of the capacitive recognition module is weak, if the capacitive recognition module is arranged below a glass cover plate of a mobile phone, the sensing precision is rapidly reduced.
The optical recognition module is mainly applied to products such as entrance guard card punch and the like at present due to the large size. In addition, the optical recognition module has a lens assembly and the like, which results in high manufacturing cost.
The inventor finds that, through a great deal of research, the Passive Matrix Organic Light Emitting Diode (PMOLED) has a simple structure and low manufacturing cost, and if the PMOLED is combined with a photosensitive device to be manufactured into an area array type photoelectric sensing module to sense biological characteristic information of a living body, the beneficial effects include but are not limited to the four aspects listed herein: first, the manufacturing cost is saved; second, the thickness of the photoelectric sensing module is reduced, so that the photoelectric sensing module can be assembled into a mobile terminal (such as a mobile phone); thirdly, the photoelectric sensing module can be arranged below the protective cover plate of the mobile terminal, and the sensing precision is less influenced by the thickness of the protective cover plate; fourth, by changing the material of the light emitting layer of the PMOLED, for example, letting the PMOLED emit green light, infrared light, ultraviolet light, or the like, living body detection or the like can be performed.
Correspondingly, the invention provides a photoelectric sensing module which is mainly used for sensing biological characteristic information of organisms. For example, the photoelectric sensing module is used for sensing image information of the target object so as to identify the identity of the target object according to the sensed image information. The image information may include fingerprint information, palm print information, ear print information, and skin texture information for other locations of the living being. Since the skin texture and the skin layer structure of the living body have different characteristics, different living bodies can be identified according to the characteristics. The organism is for example, but may not be limited to, a human body. Furthermore, the photoelectric sensing module can also be suitable for sensing biological characteristics such as pulse, blood oxygen, heart rate and the like of organisms.
In the following specific embodiments, the application is mainly described by taking fingerprint information of a human body identified by the photoelectric sensing module as an example, but the application is extensible, and the photoelectric sensing module can also detect biological characteristic information of other suitable organisms, and is not limited to fingerprint image information, but also biological characteristic information such as pulse.
Referring to fig. 1, an optoelectronic sensor module 100 according to an embodiment of the invention includes a first substrate 110, a second substrate 120, a light emitting unit 130, and a light sensing unit 140.
The first substrate 110 and the second substrate 120 are disposed opposite to each other, and the first substrate 110 includes a first surface 111 facing the second substrate 120, and the second substrate 120 includes a second surface 121 facing the first substrate 110. The light emitting unit 130 and the light sensing unit 140 are located between the first substrate 110 and the second substrate 120, and the light sensing unit 140 may be disposed on the first surface 111 or the second surface 121 and located at a light emitting side of the light emitting unit 130. The light emitting unit 130 is configured to emit light to reach the target object when the target object is located on the photo-sensor module 100. The optical sensing unit 140 is configured to receive an optical signal reflected by a target object and convert the received optical signal into a corresponding electrical signal. The target object is a suitable object such as a finger, a palm and the like.
Taking the target object as a finger as an example, when the photoelectric sensing module 100 is applied, if the finger of the user is placed on the first substrate 110, the light emitted by the light emitting unit 130 will reach the finger of the user through the first substrate 110, and the optical signal reflected by the finger of the user is received by the light sensing unit 140 and converted into a corresponding electrical signal. Based on the electrical signal output from the light sensing unit 140, a fingerprint image of the user's finger can be generated. Since the light emitted by the light emitting unit 130 passes through the first substrate 110, the first substrate 110 is a panel made of a light-transmitting material, and may be a transparent film.
Preferably, in the present embodiment, the light emitting unit 130 is a Passive Matrix Organic Light Emitting Diode (PMOLED), so that not only cost can be saved, but also the structure of the photoelectric sensing module 100 is simple and the thickness is thin, which is beneficial for assembly into an electronic device.
The photoelectric sensing module 100 can be applied to various electronic devices, such as different fields of entrance guard card punch, mobile phone, tablet personal computer, wearable or penetrating equipment, smart home products, vehicle-mounted electronic products, smart cards and the like. The photoelectric sensing module 100 may be disposed at an opening of a protective cover plate or an opening of a rear case or an opening of a side wall of the electronic device, or may be disposed inside the electronic device, for example, below the protective cover plate, at a Home key position, or the like. If the electronic device has a display screen, even a touch screen, the optoelectronic sensor module 100 can be disposed below a display area of the electronic device, such as a display screen or a touch screen. When the photoelectric sensing module is located below the display screen, the display screen is, for example, an Active matrix organic light emitting diode (Active-matrix Organic Light Emitting Diode, AMOLED), and the AMOLED display screen is a double-sided transparent display screen, and the photoelectric sensing device can receive light penetrating through the AMOLED display screen, so that the biological characteristics of the living body can be identified.
In the above-mentioned photoelectric sensing module 100, when the target object is located on the photoelectric sensing module, the light emitting unit 130 emits light, the light is reflected after reaching the target object, the light sensing unit 140 receives the reflected light signal, and converts the received light signal into a corresponding electrical signal, so as to form a biological image according to the electrical signal, and further perform image recognition. Therefore, the photoelectric sensing module 100 is simple in structure and easy to implement. In addition, when the photoelectric sensing module 100 is applied to an electronic device, for example, when the photoelectric sensing module 100 is fixedly arranged below a display screen of the electronic device, a substrate of the photoelectric sensing module 100, which is close to the electronic device, can be reused with a transparent substrate of the display screen, so that a substrate is saved, and the manufacturing cost is further saved. In addition, other structures on the electronic device, such as light sources, etc., may also be utilized. Therefore, when the photoelectric sensing module is applied to the electronic device, the existing structure of the electronic device can be fully utilized, so that the cost of the electronic device is reduced.
Specifically, referring to fig. 2, in some examples, the light emitting unit 130 may include a plurality of pixel points 131 that emit light with a space between the plurality of pixel points 131. The plurality of pixel points 131 may be arranged in an array. Of course, the plurality of pixel points 131 may be arranged in other regular or irregular arrangements. The light sensing unit 140 may include a plurality of light sensing elements 141. Preferably, the projections of the photosensitive element 141 and the pixel point 131 on the same substrate do not overlap or partially overlap, i.e. the photosensitive element 141 and the pixel point 131 are completely or partially staggered. In one example, the photosensitive element 141 is disposed at a spaced position between adjacent pixel points 131. Alternatively, the photosensitive element 141 is disposed at, for example, intersection positions of 4 pixel points 131 adjacent to each other in the up-down, left-right direction. The design is such that the light emitted from the pixel 131 after being reflected by the target object can be captured by, but not limited to, 4 photosensitive elements 141 (four blocks A, B, C, D) around the pixel 131, thereby improving the acquisition accuracy.
With continued reference to fig. 1 and 2, since the light emitting unit 130 is a PMOLED, each pixel 131 includes a cathode electrode 1311 and an anode electrode 1312 disposed correspondingly up and down, and a light emitting layer 1313 is disposed between the cathode electrode 1311 and the anode electrode 1312. The light emitting layer 1313 may include, for example, an organic light emitting material that emits white light, and may also include, for example, an organic light emitting material that emits infrared light. By using infrared light, the photo-sensor module can not only recognize fingerprint image information, but also detect whether the living body contacting the photo-sensor module 100 is a living body by detecting pulse, blood oxygen, heart rate, etc. It can be seen that the photo sensor module 100 is low in cost and can realize living body detection. In addition, since the light sensing unit 140 and the light emitting unit 130 are stacked, the light sensing unit 140 does not require a component such as a lens, and thus the thickness of the photo-sensing module 100 is thin, so that it can be mounted inside the electronic device.
In some embodiments, the plurality of pixel points 131 in the light emitting unit 130 are independently controlled, so that point light source irradiation can be achieved by controlling the lighting of a single pixel point 131. In optical fingerprint recognition, compared with the area light source illumination, not only the light reflected by the target object does not affect each other, but also the area of the light collecting area through which the light sensing unit 140 passes when the light is collected by the light sensing unit 140 by using the principle of specular reflection is irrelevant to the thickness of the medium. In one example, referring to FIG. 3, the arrowed lines in FIG. 3 represent light rays, with the thickness of the first medium 300 on the left being shown to be less than the thickness of the second medium 302 on the right. For a pixel 131 and a photosensitive element 141 that are adjacent, the area of the collection area 304 or 306 of the photosensitive element 141 that receives light reflected from the target object on the first medium 300 or the second medium 302 is the same as that of the collection area of the photosensitive element 141. Therefore, when the photoelectric sensing module 100 of the present application is mounted below a protective cover plate of an electronic device, for example, the sensing accuracy thereof is less affected by the thickness of the protective cover plate. The first medium 300 and the second medium 302 may be, for example, protective cover plates in the case of electronic devices. It should be noted that, fig. 3 is only a schematic illustration of the optical path during sensing of the biometric information, and the positional relationship between the photosensitive element 141 and the pixel 131 is not limited to the positional relationship shown in fig. 3, and the positional relationship between the photosensitive element 141 and the pixel 131 may be referred to the description of the later embodiment of the present invention.
By combining the structure of the light emitting unit 130, when the target object is located above the photoelectric sensing module 100, the pixel points 131 corresponding to the contact area of the target object on the photoelectric sensing module 100 are controlled to be lightened in a time-sharing manner, so that a single pixel point 131 can be selected to emit light when the target object 200 is scanned, and a plurality of pixel points 131 with enough distance to be preset can also be selected to emit light simultaneously, so that the mutual influence of the light reflected by the target object 200 is small enough, and the light reflected by the target object is better received by the photosensitive element 141. In addition, the mirror reflection principle is also utilized to enable the photoelectric sensing module 100 not to be limited to the thickness of the protective cover plate but to collect clear image information, so that the photoelectric sensing module 100 is more widely applied.
It should be noted that, the photosensitive element 141 opposite to the valley of the fingerprint mainly receives the light reflected by the mirror surface of the protective cover, and the photosensitive element 141 opposite to the ridge of the fingerprint mainly receives the light reflected by the ridge of the fingerprint. The light reflected by the mirror surface is much stronger than the light reflected by the diffuse reflection, so that after the photosensitive element 141 determines the positions of the valleys of the fingerprint according to the light reflected by the mirror surface of the protective cover, for example, by an exclusive method, the positions of the ridges of the fingerprint can be determined together with the positions of the valleys of the fingerprint, or the photosensitive element 141 can also determine the positions of the ridges and the valleys of the fingerprint according to the intensity of the received light.
Referring to fig. 4a, the light emitting unit 130 includes a plurality of cathode electrodes 1311 and a plurality of anode electrodes 1312. The plurality of cathode electrodes 1311 and the plurality of anode electrodes 1312 are located in different layers, and the two types of electrodes are arranged in a crossing manner. Wherein the plurality of cathode electrodes 1311 are arranged along the first direction X, each cathode electrode 1311 extending along the second direction Y. The plurality of anode electrodes 1312 are arranged along the second direction Y, and each anode electrode 1312 extends along the first direction X. The first direction is different from the second direction, such as but not limited to a perpendicular relationship. The crossing area between the plurality of cathode electrodes 1311 and the plurality of anode electrodes 1312 is the area where the pixel point 131 is located.
Referring to fig. 4b, the light emitting unit 130 may alternatively include a plurality of first electrode serials 130a and a plurality of second electrode serials 130b. The plurality of first electrode strings 130a and the plurality of second electrode strings 130b are located at different layers, and the two types of electrode strings are arranged in a crossing manner. Wherein the plurality of first electrode serials 130a are arranged along the first direction X. The plurality of second electrode serials 130b are arranged along the second direction Y. The first direction is different from the second direction, such as but not limited to a perpendicular relationship. Each of the first electrode serials 130a includes a plurality of cathode electrodes 1311 and a lead 1313 connecting adjacent cathode electrodes 1311, wherein the plurality of cathode electrodes 1311 of the same first electrode serials 130a are arranged along the second direction Y. Each of the second electrode serials 130b includes a plurality of anode electrodes 1312 and a lead 1314 connecting adjacent anode electrodes 1312, wherein the plurality of anode electrodes 1312 of the same second electrode serials 130b are arranged along the first direction X. Each cathode electrode 1311 is provided corresponding to each anode electrode 1312. The lead 1313 is formed in the same layer as the cathode 1311, and is made of the same material, preferably, may be formed in the same process. However, alternatively, the lead 1313 and the cathode 1311 may be made of different materials. Similarly, the lead 1314 is located in the same layer as the anode electrode 1312, is made of the same material, and preferably can also be made in the same process. Alternatively, however, the lead 1314 and the anode electrode 1312 may be made of the same material.
The above-described cathode electrode 1311, such as but not limited to an ITO electrode or a metal electrode, may be formed on the second surface 121 of the second substrate 120 by, for example, but not limited to, an evaporation process. Next, a light emitting layer 1313 is formed over the cathode electrode 1311, for example, but not limited to, by an evaporation process, and a transfer layer (not shown) is formed between the cathode electrode 1311 and the light emitting layer 1313. The anode electrode 1312 is, for example, but not limited to, an ITO electrode or a metal electrode, which may be, for example, but not limited to, formed on the light emitting layer 1313 by an evaporation process, and a transmission layer (not shown) is formed between the light emitting layer 1313 and the anode electrode 1312.
In some embodiments, the photosensitive element 141 is a semiconductor photosensitive element or other suitable type of photosensitive element, where the semiconductor photosensitive element includes, for example, but is not limited to, any one or more of a thin film transistor (Thin Film Transistor, TFT), a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS) transistor, and a Charge-coupled Device (CCD), and may be any other suitable type of semiconductor photosensitive element, which is not limited in this regard. The photosensitive element 141 may also be a photodiode, for example.
Taking the photosensitive element 141 as a TFT for example, light collection is achieved by using the active region material of the TFT to be sensitive to light. Thus, the plurality of photosensitive elements 141 can be directly manufactured by using the semiconductor process, so that the cost of the photoelectric sensor module 100 is low.
With continued reference to fig. 1, the above-mentioned photo-sensor module 100 may further include a driving circuit 150, wherein the driving circuit 150 drives the light emitting unit 130 to emit light, and drives the light sensing unit 140 to perform light sensing. Specifically, in some examples, the driving circuit 150 may include a first driving circuit 151 and a second driving circuit 152, wherein the first driving circuit 151 drives the light sensing unit 140, and the second driving circuit 152 drives the light emitting unit 130. Further, the first driving circuit 151 and the second driving circuit may be integrated in a single chip, or may be integrated separately into two chips. When the driving circuit 150 is integrated in a Chip, it is bonded (bound) On the first substrate 110 and/or the second substrate 120, for example, by means of Chip On Glass (COG).
The light emitting unit 130 is connected to a second driving circuit 152, and the second driving circuit 152 applies a voltage to the cathode electrode 1311 and the anode electrode 1312 to excite the organic light emitting material between the cathode electrode 1311 and the anode electrode 1312 to emit light.
The first driving circuit 151 drives the photosensitive elements 141 to operate, for example, row by row.
In some embodiments, the driving circuit 150 and the light sensing unit 140 are disposed on the same substrate. For example, the light sensing unit 140 is formed on the first surface of the first substrate 110, and the driving circuit 150 is also located on the first substrate 110. Preferably, if the light sensing unit 140 is formed on the first substrate 110 and the light emitting unit 130 is formed on the second substrate 120, the driving circuits 150 are separately disposed, the first driving circuit 151 is formed on the first substrate 110, and the second driving circuit 152 is formed on the second substrate 120. This makes the wiring of the driving circuit more compact and less messy.
The first driving circuit 151 is further connected to an external circuit, for example, through a flexible circuit board (Flexible Printed Circuit Board, abbreviated as FPC) (not shown). The second driving circuit 152 is connected to an external circuit through another FPC, for example.
Alternatively, in other embodiments, the light sensing unit 140 shown in fig. 1 may be further formed on the light emitting unit 130 after the light emitting unit 130 is formed on the second surface of the second substrate 120. Accordingly, the second driving circuit 151 may also be formed on the second substrate 120. Thereafter, the first substrate 110 is disposed on the light sensing unit 140.
In still another modification, for example, referring to fig. 5, in the photoelectric sensing module 100, the light sensing unit 140 is located on the second substrate 120, and the first driving circuit 151 and the second driving circuit 152 are both formed on the second substrate 120. When the photoelectric sensing module 100 is manufactured, the light sensing unit 140 is formed on the second substrate 120, then the anode electrode 1312, the light emitting layer 1313 and the cathode electrode 1311 are sequentially formed on the light sensing unit 140, and finally the first substrate 110 is encapsulated after being covered. The photo-sensor module 100 can avoid the problem of misalignment of the photo-sensor unit 140 and the light-emitting unit 130 during the manufacturing process.
In yet another modification, referring to fig. 6, for example, the above-mentioned optoelectronic sensor module 100 further includes a touch sensing unit 160 for determining a contact area of the target object on the optoelectronic sensor module 100. In the sensing of the biometric information, referring to fig. 7, when the target object 200 is placed on the optoelectronic sensor module 100, the touch sensor unit 160 senses that a parameter value of a certain area 161 is changed, and the area 161 of the touch sensor unit 160 corresponds to the contact area 101 of the target object 200 on the optoelectronic sensor module 100, so that the touch sensor unit 160 can determine the contact area 101 of the target object 200 on the optoelectronic sensor module 100.
Preferably, the touch sensing unit 160 may determine the contact area 101 of the target object 200 on the optoelectronic sensing module 100 using, for example and without limitation, capacitive sensing principle.
Specifically, in some embodiments, the touch sensing unit 160 and the light sensing unit 140 are disposed on the same substrate, and the touch sensing unit 160 is located between the substrate and the light sensing unit 140. Of course, alternatively, the touch sensing unit 160 and the light sensing unit 140 are located at two sides of the substrate, as shown in fig. 8.
The touch sensing unit 160 described above may include a touch sensing layer and a touch detection circuit for driving the touch sensing layer to perform touch sensing to determine the contact area 101. The touch sensing layer is located at the light emitting side of the light emitting unit 130 and between the substrate and the light sensing unit 140. Alternatively, the touch sensing unit 160 and the light sensing unit are positioned at both sides of the substrate, which is positioned at the light emitting side of the light emitting unit 130. Thus, the manufacturing process is simple. Specifically, in one example, the touch sensing layer of the touch sensing unit 160 is disposed at the outer side of the substrate, so that the touch sensing unit 160 can be manufactured separately, and after the manufacturing is completed, the touch sensing layer of the touch sensing unit 160 is directly attached to the upper side of the substrate.
Preferably, in other examples, the touch sensing layer can be multiplexed with the cathode electrode 1311 or the anode electrode 1312 in the light emitting unit 130, thereby saving additional touch sensing layers. For example, the anode electrodes 1312 are multiplexed as a touch sensing layer, and all or part of the anode electrodes 1312 may be selectively connected together to perform capacitive touch sensing, and when a touch of a target object is detected and a touch area is determined, the anode electrodes 1312 are separated from each other to be used as electrodes of the light emitting unit 130. Thus, not only touch sensing is realized, but also the cost of the photoelectric sensing module 100 is saved, and the thickness of the photoelectric sensing module 100 is reduced. Alternatively, when capacitive touch sensing is performed, the positive electrodes 1312 may not be connected.
It should be noted that, if the photoelectric sensing module 100 is applied to an electronic device, for example, the photoelectric sensing module is attached below a touch screen of the electronic device, the touch sensing function may utilize a touch function of the touch screen of the electronic device. Specifically, when the target object is located on the touch screen, the touch screen determines a contact area of the target object on the touch screen, and further determines a contact area of the target object on the photoelectric sensing module, wherein the contact area corresponds to the contact area. The driving circuit 150 controls the pixel points 131 corresponding to the contact area to be lightened in a time-sharing manner according to the contact area determined by the touch screen so as to emit light signals to the target object. Therefore, when the photoelectric sensing module 100 is applied to an electronic device, not only the light source of the photoelectric sensing module can be fully utilized, but also the touch function of the touch screen of the photoelectric sensing module can be utilized, so that the structure is simple, and the cost is greatly reduced.
Referring to fig. 9, the photo sensor module 100 of embodiments of the present application may further include a controller 170. The controller 170 is configured to control the touch sensing unit 160 to perform touch sensing first, and after determining that the target object touches the optoelectronic sensing module 100 and determining the contact area, control the plurality of pixel points 131 corresponding to the contact area to be lightened in a time-sharing manner so as to emit an optical signal to the target object. Specifically, the controller 170 is connected to the first driving circuit 151 and the second driving circuit 152, respectively, to drive the pixel point 131 of the light emitting unit 130 and the photosensitive element 141 of the light sensing unit 140 to operate.
The above-mentioned photo-sensor module 100 may further include a processing circuit 180, where the processing circuit 180 is configured to obtain the biometric information of the target object according to the electrical signal output by the photo-sensor unit 140. In some embodiments, the processing circuit 180 receives the electrical signals output by each row of photosensitive elements 141 to obtain biometric information from the electrical signals. However, in order to improve the working efficiency and save the power consumption, the processing circuit 180 may also obtain sufficient biometric information by selectively receiving the electrical signals output by several but not the full row of photosensitive elements 141 at a time, for example, according to the position of the lighted pixel point 131. For example, the processing circuit 180 acquires biometric information by receiving an electrical signal output from the photosensitive element 141 around the illuminated pixel 131 by one, two, or three turns.
It is understood that the controller 170 and/or the processing circuit 180 may be disposed separately from the first driving circuit 151 and the second driving circuit 152, or may be integrated into the same chip or several chips with the first driving circuit 151 and the second driving circuit 152, and disposed on the first substrate 110 or the second substrate 120. In addition, when the optoelectronic sensor module 100 is applied to an electronic device, the controller 170 and the processing circuit 180 can also be implemented by using the existing control and processing functions of the electronic device.
In some embodiments, when controlling the time-sharing lighting of the pixel points 131, the controller 170 is used to control several pixel points 131 corresponding to the contact area 101 to be sequentially lighted, or several pixel points of a predetermined distance to be simultaneously lighted.
Thus, the time-sharing lighting mode is diversified, which is advantageous for the design flexibility of the controller 170.
Specifically, in one example, the plurality of pixel points 131 corresponding to the contact area 101 are also arranged in an array, and the controller 170 may control the plurality of pixel points 131 in the array to sequentially light up from top to bottom and from left to right. However, alternatively, in other examples, the controller 170 may control the plurality of pixels 131 to sequentially light up in other regular or irregular sequences.
Referring to fig. 10, fig. 10 shows an arrangement of a plurality of pixel points 131 corresponding to the contact area 101. The plurality of pixel points corresponding to the contact area 101 are arranged in 5 rows and 4 columns to form 20 pixel points 131, and for convenience of explanation, the 20 pixel points 131 are respectively numbered as P11, P12, P13, …, P53 and P54.
When performing biometric information sensing, the controller 170 controls the pixel P11 to be turned on and controls other pixels to be turned off, and the photosensitive element 141 around the pixel P11 will receive the light signal reflected by the target object 200.
Then, the controller 170 controls the pixel P12 to be turned on and controls the pixel to be turned off, and the photosensitive element 141 around the pixel P12 receives the light signal reflected by the target object 200. By analogy, the controller 170 completes the time-sharing lighting of all 20 pixel points corresponding to the contact area 101, and the processing circuit 180 receives the electrical signal output by the photosensitive element 141 to determine the image information of the target object 200.
In another example, the predetermined distance may be a distance separating one row of point sources, several rows of point sources, one column of point sources, or several rows of point sources in the array.
Specifically, referring to fig. 11, in such an example, a plurality of pixel points 131 corresponding to the contact area 101 are arranged in 6 rows and 4 columns for 24 pixel points, and for convenience of explanation, the 24 pixel points are respectively numbered as T11, T12, T13, …, T63, and T64. In an example, the predetermined distance is two rows of point light sources apart.
When the biometric information sensing is performed, the controller 170 controls the pixels T11 and T41 to be simultaneously turned on and controls the other pixels to be turned off, and the photosensitive elements 141 around the pixels T11 and T41 receive the light signal reflected by the target object 200.
Then, the controller 170 controls the pixels T12 and T42 to be turned on simultaneously, controls the other pixels to be turned off, and the photosensitive elements 141 around the pixels T12 and T42 receive the light signal reflected by the target object 200. By analogy, the controller 170 completes the time-sharing lighting of all 24 pixel points corresponding to the contact area 101, and the processing circuit 180 receives the electrical signal output by the photosensitive element 141 to determine the image information of the target object 200.
It should be noted that the above examples are provided for the convenience of understanding the embodiments of the present invention and should not be construed as limiting the scope of the present invention.
In some embodiments, the horizontal precision of the image of the target object 200 formed from the biometric information is half the horizontal width of the pixel, and the vertical precision of the image of the target object 200 is half the vertical width of the pixel.
In this way, mainstream electronic devices, such as mobile phones, tablet computers, notebook computers, and the like, can realize the accuracy of capturing the image of the target object 200, so that the application range of the photoelectric sensing module 100 is wider.
Specifically, when the screen of the electronic device is 5 inches (for example, a mobile phone screen), and the resolution is 1920×1080, the width of the pixel 131 is about 60um, and the image acquisition accuracy of the target object 200 is 10um horizontally and 30um vertically.
When the screen of the electronic device is 13.3 inches (such as a notebook computer screen) and the resolution is 1366×768, the width of the pixel 131 is about 220um, and the image acquisition accuracy of the target object 200 is 36um horizontally and 110um vertically.
When the screen of the electronic device is 22 inches (for example, a display screen of a personal computer), and the resolution is 1920×1080, the width of the pixel 131 is about 270um, and the image acquisition accuracy of the target object 200 is 45um horizontally and 135um vertically.
Taking biological characteristic information as fingerprint information as an example, it can be seen from the above that the screen of the mainstream electronic device can realize fingerprint image acquisition of the resolution fingerprint.
Alternatively, the PMOLED is used as a light emitting element, not an image display element.
Referring to fig. 12, an electronic device 500 according to an embodiment of the invention includes the photoelectric sensing module 100 according to any of the above embodiments.
In the above-mentioned electronic device 500, the cost of the photoelectric sensor module 100 is low, so the cost of the electronic device 500 using the photoelectric sensor module 100 is low. Further, since the photoelectric sensing module 100 uses time-sharing lighting for a plurality of pixels corresponding to the contact area of the target object 200, when the target object 200 is scanned, single-point light emission can be selected, and a plurality of pixels with enough distance between preset intervals can be selected to emit light, accordingly, the mutual influence of the light reflected by the target object 200 is small enough; in addition, light can be collected by the photosensitive element 141 using the principle of specular reflection, and the area of the photosensitive element 141 passing through the reflected light collection area is independent of the thickness of the medium, thereby improving the image accuracy of the collection target object 200. Meanwhile, the time-sharing lighting of the pixel points may form the image information of the complete target object 200.
Specifically, the electronic device 500 is, for example, a consumer electronic product or a household electronic product or a vehicle-mounted electronic product. The consumer electronic products are electronic products using biological recognition technology, such as mobile phones, tablet computers, notebook computers, desktop displays, and computer integrated machines. Household electronic products such as intelligent door locks, televisions, refrigerators, wearable equipment and other electronic products applying biological recognition technology. The vehicle-mounted electronic products are, for example, vehicle-mounted navigator, vehicle-mounted DVD and the like.
In the example of fig. 12, the electronic device 500 is a mobile phone, the front surface of the mobile phone is provided with a touch screen and the display device 400, and the photoelectric sensing module is disposed below the front cover plate of the electronic device 500. In one example, when the biometric information to be acquired is fingerprint information, the target object 200 is a finger, and the finger is placed on the electronic device 500 when the fingerprint information acquisition is performed, so that the touch screen can determine the contact area of the finger on the photoelectric sensing module 100, and the photoelectric sensing module 100 performs subsequent fingerprint information acquisition.
However, in other embodiments, the photoelectric sensor module 100 may be disposed on the touch screen and the display device 400. In addition, the image capturing portion of the photoelectric sensing module 100 may be integrated into a biological recognition chip, and be correspondingly disposed at a proper position such as a front side, a back side, and a side of the electronic device 500, and may expose an outer surface of the electronic device 500, or may be disposed inside the electronic device 500 and adjacent to the housing.
In the description of the present specification, reference to the terms "one embodiment," "certain embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
Claims (12)
1. An optoelectronic sensor module, comprising:
the device comprises a first substrate and a second substrate which are oppositely arranged, wherein the first substrate comprises a first surface facing the second substrate, and the second substrate comprises a second surface facing the first substrate;
the light-emitting unit is arranged between the first substrate and the second substrate and is used for emitting light to reach the target object when the target object is positioned on the photoelectric sensing module;
a light sensing unit disposed on the first surface or the second surface, the light sensing unit being configured to receive a light signal reflected by the target object and convert the received light signal into a corresponding electrical signal;
wherein the light emitting unit is a passive matrix organic electroluminescent diode;
the photoelectric sensing module comprises any one or more of a fingerprint sensing module, a pulse sensing module, a blood oxygen sensing module and a heartbeat sensing module;
the light-emitting unit comprises a plurality of self-luminous pixel points, each pixel point comprises a cathode electrode and an anode electrode which are oppositely arranged, and a light-emitting layer is arranged between the cathode electrode and the anode electrode;
the light emitting unit comprises a plurality of first electrode strings and a plurality of second electrode strings, wherein the first electrode strings are distributed along a first direction, the second electrode strings are distributed along a second direction, the first direction is different from the second direction, each first electrode string comprises a plurality of negative electrodes and leads connected with the negative electrodes, and each second electrode string comprises a plurality of positive electrodes and leads connected with the positive electrodes.
2. The optoelectronic sensor module as claimed in claim 1, wherein the light sensing unit comprises a plurality of light sensing elements, and the light sensing elements and the pixel point are projected on the same substrate without overlapping or partially overlapping.
3. The optoelectronic sensor module of claim 1, further comprising a drive circuit that drives the light emitting unit to emit light and the light sensing unit to perform light sensing, wherein the drive circuit is disposed on the same substrate as the light sensing unit.
4. The optoelectronic sensor module of claim 3, wherein the drive circuit comprises a first drive circuit and a second drive circuit, wherein the first drive circuit drives the light sensing unit and the second drive circuit drives the light emitting unit; the first driving circuit and the light sensing unit are arranged on the same substrate, and the second driving circuit and the light emitting unit are arranged on another substrate; or, the first driving circuit, the second driving circuit, the light sensing unit and the light emitting unit are all arranged on the same substrate.
5. The photo-sensing module according to claim 1, wherein the photo-sensing module performs touch sensing before performing biometric information sensing, and starts biometric information sensing after detecting that a target object is touched, wherein when the photo-sensing module performs touch sensing, an anode electrode or a cathode electrode of the light emitting unit serves as a touch sensing electrode to perform touch sensing.
6. The optoelectronic sensing module of claim 1, further comprising a touch sensing unit to determine a contact area of a target object on the optoelectronic sensing module, wherein the touch sensing unit comprises a touch sensing layer and a touch detection circuit to drive the touch sensing layer to perform touch sensing to determine the contact area; the touch sensing layer and the light sensing unit are arranged on the same substrate, and the touch sensing unit is positioned between the substrate and the light sensing unit, or the touch sensing unit and the light sensing unit are positioned on two opposite sides of the substrate.
7. The optoelectronic sensor module of claim 5 or 6, further comprising a controller configured to control the time-sharing illumination of the pixels corresponding to the contact areas to emit an optical signal to the target object according to the contact areas on which the target object determined by the optoelectronic sensor module contacts.
8. The optoelectronic sensor module of claim 1, wherein the luminescent layer comprises an organic luminescent material that emits any one or more of visible light, infrared light, ultraviolet light, green light.
9. The optoelectronic sensor module as claimed in claim 4, wherein the optoelectronic sensor module is attached to a touch screen, and when the driving circuit contacts a contact area on the optoelectronic sensor module according to the target object determined by the touch screen, the driving circuit controls a plurality of pixel points corresponding to the contact area to be lighted in a time-sharing manner so as to emit an optical signal to the target object.
10. The optoelectronic sensor module as recited in claim 1, wherein when the optoelectronic sensor module is disposed under a display screen of an electronic device, the optoelectronic sensor module is multiplexed with a transparent substrate of the display screen adjacent to a substrate of the electronic device.
11. The optoelectronic sensor module of claim 1, further comprising a processing circuit that obtains biometric information of the target object from the electrical signal output by the light sensing unit.
12. An electronic device comprising a photo-sensor module according to any one of claims 1-11.
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| CN212675566U (en) * | 2018-08-23 | 2021-03-09 | 深圳市汇顶科技股份有限公司 | Fingerprint module and electronic equipment |
| WO2020047801A1 (en) | 2018-09-06 | 2020-03-12 | 深圳市汇顶科技股份有限公司 | Optical image collection unit, optical image collection system and electronic device |
| CN110069998B (en) * | 2019-03-23 | 2021-12-07 | 深圳阜时科技有限公司 | Base and sensing module |
| CN110772394A (en) * | 2019-12-11 | 2020-02-11 | 奥佳华智能健康科技集团股份有限公司 | Massage chair with novel seat induction device and induction method thereof |
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