CN208300111U - Circuit board assemblies, photoelectricity mould group, depth camera and electronic device - Google Patents
Circuit board assemblies, photoelectricity mould group, depth camera and electronic device Download PDFInfo
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- CN208300111U CN208300111U CN201820837807.4U CN201820837807U CN208300111U CN 208300111 U CN208300111 U CN 208300111U CN 201820837807 U CN201820837807 U CN 201820837807U CN 208300111 U CN208300111 U CN 208300111U
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Abstract
The utility model discloses a kind of circuit board assemblies.Circuit board assemblies include heat-radiating substrate, heater element and stiffening plate.Heat-radiating substrate includes loading end and the joint face opposite with loading end, forms the first conducting element on loading end, forms the second conducting element on joint face.Heater element is arranged on loading end and is electrically connected with the first conducting element.Circuit board is arranged on joint face and is electrically connected with the second conducting element, and circuit board opens up at least one via hole.Stiffening plate is arranged on the surface opposite with the joint face of the circuit board, and stiffening plate includes that reinforcement ontology and the boss from the extension of reinforcement ontology, boss wear via hole and contact with heat-radiating substrate.The heat of heater element is passed through heat-radiating substrate and thermally conductive stiffening plate conduction evacuation, good heat dissipation effect by the way that the stiffening plate of circuit board is directly contacted and worn with heat-radiating substrate by the circuit board assemblies of the utility model embodiment.A kind of photoelectricity mould group, depth camera and electronic device is also disclosed in the utility model.
Description
Technical field
The utility model relates to consumer electronics fields, more specifically, be related to a kind of circuit board assemblies, photoelectricity mould group,
Depth camera and electronic device.
Background technique
Due to light-emitting diode (Light Emitting Diode, LED) lamp, the laser emitter of recognition of face sensor
Electric current/luminous power it is big, therefore calorific value is big, and especially in numbers such as mobile phones, excessive calorific value will cause complete machine work temperature
The problems such as degree height, infrared laser band discontinuity, directly affect properties of product.The LED light of the relevant technologies, recognition of face sensor
Laser emitter is bonded by silver paste die bond and flexible circuit board (Flexible Printed Circuit, FPC), but in FPC
Containing stack materials such as polyimides, binder, solder mask, conductive adhesive film and copper foils, average thermal conductance coefficient is only≤0.38 watt
Special/(rice is opened) (W/ (mK)), heat dissipation effect is poor.
Utility model content
The utility model embodiment provides a kind of circuit board assemblies, photoelectricity mould group, depth camera and electronic device.
The circuit board assemblies of the utility model embodiment include heat-radiating substrate, heater element, circuit board and thermally conductive benefit
Strong plate.The heat-radiating substrate includes loading end and the joint face opposite with the loading end, is formed with first on the loading end
Conducting element is formed with the second conducting element on the joint face.The heater element be arranged on the loading end and with institute
State the electrical connection of the first conducting element.The circuit board is arranged on the joint face and is electrically connected with second conducting element,
The circuit board offers via hole.The stiffening plate is arranged on the surface opposite with the joint face of the circuit board, institute
The boss that stiffening plate includes reinforcement ontology and extends from the reinforcement ontology is stated, the boss wears the via hole and dissipates with described
Hot substrate contact.
The circuit board assemblies of the utility model embodiment by the way that heater element is arranged on the loading end of heat-radiating substrate,
Circuit board is arranged on the joint face of heat-radiating substrate and opens up via hole on circuit boards so that the boss of stiffening plate wears via hole
It is contacted with heat-radiating substrate, so that the heat of heater element is conducted evacuation, heat dissipation effect by heat-radiating substrate and thermally conductive stiffening plate
Fruit is good.
In some embodiments, first conducting element includes pad, and the heater element is arranged described first
On the pad of conducting element.
Pad is for conventional conducting wire, and area is relatively large, so the pad of the first conducting element connects
Heater element, convenient welding and connection are than stronger；Moreover, the contact area of pad and heater element is larger, it can be more rapidly
To heater element generate heat evacuate and absorb, improving radiating effect.
In some embodiments, the heater element is mounted on the pad of first conducting element by conductive silver paste
On.
Relative to the thermal conductivity coefficient (≤0.38W/ (mK)) of conventional flexible circuit board, the thermal conductivity coefficient of conductive silver paste
Higher, heat dissipation effect is preferable.
In some embodiments, the circuit board assemblies further include non-emissive source electrical part, the non-emissive source electric appliance
Part is arranged on first conducting element by tin cream.
Relative to the thermal conductivity coefficient (≤0.38W/ (mK)) of conventional flexible circuit board, the thermal conductivity coefficient of tin cream is higher,
Heat dissipation effect is preferable, and connection is more firm when being attached by tin cream.
In some embodiments, second conducting element includes pad, and the boss setting is conductive described second
On the pad of element, the boss is corresponding with the heater element.
For pad for conventional conducting wire, area is relatively large, so boss setting is conductive described second
On the pad of element, convenient welding and connection than stronger；Moreover, the contact area of pad and boss is larger, it can be more rapidly
To heater element generate heat conduct and evacuation, improving radiating effect.
In some embodiments, the boss is arranged on the pad of second conducting element by tin cream.
Relative to the thermal conductivity coefficient (≤0.38W/ (mK)) of conventional flexible circuit board, the thermal conductivity coefficient of tin cream is higher,
Heat dissipation effect is preferable, and connection is more firm when being attached by tin cream.
In some embodiments, the circuit board is arranged on second conducting element by tin cream.
Relative to the thermal conductivity coefficient (≤0.38W/ (mK)) of conventional flexible circuit board, the thermal conductivity coefficient of tin cream is higher,
Heat dissipation effect is preferable, and connection is more firm when being attached by tin cream.
In some embodiments, the heat-radiating substrate includes ceramic substrate or metal substrate.
Relative to the thermal conductivity coefficient (≤0.38W/ (mK)) of conventional flexible circuit board, ceramic substrate and metal substrate
Thermal conductivity coefficient it is higher, heat dissipation effect is preferable.
In some embodiments, the thermal conductivity of the heat-radiating substrate is more than or equal to 2.5W/mK.
Relative to the thermal conductivity coefficient (≤0.38W/ (mK)) of Traditional flexible circuit plate, the thermal conductivity coefficient of heat-radiating substrate is big
In or equal to 2.5W/ (mK), thermal conductivity coefficient is higher, good heat dissipation effect.
In some embodiments, the heat-radiating substrate offers multiple conductive through holes, and the inner wall of the conductive through hole is set
It is equipped with metal layer, first conducting element is electrically connected with second conducting element by the metal layer, the circuit board
One end be arranged on the joint face and with second conducting element and be electrically connected.
First conducting element and the second conducting element pass through the metal layer electrical connection that conductive through hole inner wall is arranged in, both can be with
The electrical connection of the first conducting element and the second conducting element is realized, to guarantee the signal transmission of circuit board and heater element, also
It can carry out thermally conductive, heater element is transmitted to the heat on the first conducting element by metal layer conductive to the second conducting element
The upper evacuation to realize the heat of heater element generation.
In some embodiments, the stiffening plate is also provided with multiple thermal vias, and the thermal vias is located at described
Region except the perforation region of stiffening plate.
Stiffening plate offers multiple thermal vias and thermal vias is located at except punched areas, is guaranteeing circuit board and heat dissipation
Mitigate the quality of circuit board assemblies in the case where substrate attachment area intensity, and dredging for heat can be carried out by thermal vias
It dissipates.
In some embodiments, the stiffening plate is connect by bonded adhesives with the circuit board.
Stiffening plate is connect by connecting glue with circuit board, and connection is more firm.
The photoelectricity mould group of the utility model includes the circuit board assemblies of any of the above-described embodiment and is arranged in the circuit
Optical module on board group part.The optical module is corresponding with the circuit board assemblies.
The photoelectricity mould group of the utility model embodiment, will by the way that heater element to be arranged on the loading end of heat-radiating substrate
Circuit board be arranged on the joint face of heat-radiating substrate and open up via hole on circuit boards so that the boss of stiffening plate wear via hole with
Heat-radiating substrate contact, so that the heat of heater element is conducted evacuation, heat dissipation effect by heat-radiating substrate and thermally conductive stiffening plate
It is good.
The depth camera of the utility model include photoelectricity mould group, image acquisition device described in any of the above-described embodiment and
Processor.The heater element is light source and is used to emit laser, and the optical module includes being arranged in the circuit board assemblies
On light beam generator, the light beam generator is corresponding with the light source interval and for converting the laser to form laser figure
Case.Described image collector is used to acquire the laser pattern projected by the photoelectricity mould group.The processor respectively with the light
Electric mould group and the connection of described image collector, the processor is for handling the laser pattern to obtain depth image.
The depth camera of the utility model embodiment, will by the way that heater element to be arranged on the loading end of heat-radiating substrate
Circuit board be arranged on the joint face of heat-radiating substrate and open up via hole on circuit boards so that the boss of stiffening plate wear via hole with
Heat-radiating substrate contact, so that the heat of heater element is conducted evacuation, heat dissipation effect by heat-radiating substrate and thermally conductive stiffening plate
It is good.
The electronic device of the utility model embodiment includes depth camera described in shell and any of the above-described embodiment,
The depth camera is arranged in the shell and from shell exposure to obtain depth image.
The electronic device of the utility model embodiment, will by the way that heater element to be arranged on the loading end of heat-radiating substrate
Circuit board be arranged on the joint face of heat-radiating substrate and open up via hole on circuit boards so that the boss of stiffening plate wear via hole with
Heat-radiating substrate contact, so that the heat of heater element is conducted evacuation, heat dissipation effect by heat-radiating substrate and thermally conductive stiffening plate
It is good.
The additional aspect and advantage of the embodiments of the present invention will be set forth in part in the description, partially will be from
Become obvious in following description, or is recognized by the practice of the embodiments of the present invention.
Detailed description of the invention
In description of the above-mentioned and/or additional aspect and advantage of the utility model from combination following accompanying drawings to embodiment
It will be apparent and be readily appreciated that, in which:
Fig. 1 is the structural schematic diagram of the electronic device of the utility model embodiment；
Fig. 2 is the structural schematic diagram of the depth camera of the utility model embodiment；
Fig. 3 is the structural schematic diagram of the photoelectricity mould group of the utility model embodiment；
Fig. 4 is the stereoscopic schematic diagram of the circuit board assemblies of Fig. 3；
Fig. 5 be in Fig. 4 circuit board assemblies along the partial sectional schematic view of V-V line；
Fig. 6 is the floor map at another visual angle of the circuit board assemblies in the utility model embodiment Fig. 4；
Fig. 7 is partial sectional schematic view of the circuit board assemblies along V-V line of another embodiment；
Fig. 8 is partial sectional schematic view of the circuit board assemblies along V-V line of a further embodiment；With
Fig. 9 is the structural schematic diagram of the photoelectricity mould group of another embodiment of the utility model.
Specific embodiment
The embodiments of the present invention is described further below in conjunction with attached drawing.Same or similar label in attached drawing
Same or similar element or element with the same or similar functions are indicated from beginning to end.
In addition, the embodiments of the present invention described with reference to the accompanying drawing is exemplary, it is only used for explaining this reality
With novel embodiment, and should not be understood as limiting the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature is in the second feature " on " or " down "
It can be that the first and second features directly contact or the first and second features are by intermediary mediate contact.Moreover, first is special
Sign can be fisrt feature above the second feature " above ", " above " and " above " and be directly above or diagonally above the second feature, or only
Indicate that first feature horizontal height is higher than second feature.Fisrt feature under the second feature " below ", " below " and " below " can be with
It is that fisrt feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
Referring to Fig. 1, the electronic device 1000 of the utility model embodiment includes shell 200 and depth camera 100.Electricity
Sub-device 1000 can be mobile phone, tablet computer, laptop computer, game machine, head and show equipment, access control system, automatic teller machine etc., this reality
It is illustrated so that electronic device 1000 is mobile phone as an example with new embodiment, it will be understood that the concrete form of electronic device 1000
It can be other, this is not restricted.Depth camera 100 is arranged in shell 200 and from the exposure of shell 200 to obtain depth map
Picture, shell 200 can provide the protection such as dust-proof, waterproof, shatter-resistant to depth camera 100, offer on shell 200 and depth camera
100 corresponding holes, so that light is pierced by from hole or penetrates shell 200.
Referring to Fig. 2, depth camera 100 include photoelectricity mould group 10 (at this point, photoelectricity mould group 10 be project structured light mould group),
Image acquisition device 20 and processor 30.It could be formed with projection window 40 corresponding with photoelectricity mould group 10 on depth camera 100, and
Acquisition window 50 corresponding with image acquisition device 20.Photoelectricity mould group 10 is used to project laser to object space by projection window 40
Pattern.The laser pattern is the structure light (coding being combined by the collection of limited sub-pattern with uniqueness by coding
Pattern), for example, two-dimensional encoded structured light patterns, which is known as reference pattern, each unique figure in reference pattern
Pattern in case window is all unique.Image acquisition device 20 is used to acquire by acquisition window 50 modulated by target object
Laser pattern, i.e. imagewise pattern.In one example, the laser that photoelectricity mould group 10 projects is infrared light, and image acquisition device 20 is
Infrared camera.Processor 30 is all connected with photoelectricity mould group 10 and image acquisition device 20, and processor 30 is for handling imagewise pattern
To obtain depth image.Specifically, processor 30 is decoded by the imagewise pattern to coding, finds out each pixel in the imagewise pattern
The corresponding relationship of point each pixel corresponding with reference pattern, further obtains the laser pattern further according to the corresponding relationship
Depth image.
Above-mentioned photoelectricity mould group 10 can be 3D depth of field camera module, such as project structured light mould group 10, flight time (Time
Of Flight, TOF) imaging modules etc.；Certain photoelectricity mould group 10 is also possible to other imaging modules, such as recognition of face passes
Sensor mould group, specially camera module；Photoelectricity mould group 10 can also be pure light source emitter, such as LED, automobile lamp etc..
It is appreciated that the concrete form of photoelectricity mould group 10 can also be other devices, such as the element that any calorific value is big, do not make herein
Limitation.
Referring to Fig. 3, in one example, photoelectricity mould group 10 is project structured light mould group 10.Project structured light mould group 10
For projecting laser pattern to object space, which can be speckle pattern, or coding pattern.Pass through acquisition
With processing by the modulated laser pattern of target object, the depth image of the target object in object space can be obtained.
Photoelectricity mould group 10 includes circuit board assemblies 11, lens barrel 12, optical module 13.
Fig. 4 to fig. 6 is please referred to, circuit board assemblies 11 include heat-radiating substrate 111, heater element 112, circuit board 113, reinforcement
Plate 114, connector 115 and non-emissive source electrical part 116.
Specifically, heat-radiating substrate 111 includes loading end 1111, the joint face 1112 opposite with loading end 1111, is formed in
The first conducting element 1113 on loading end 1111, the second conducting element 1114, the metal layer being formed on joint face 1112
1115 and through loading end 1111 to multiple conductive through holes 1116 of joint face 1112.Heater element 112 is arranged in loading end
On 1111, for carrying lens barrel 12 (Fig. 3 shows) and heater element 112, circuit board 113 is set the loading end 1111 of heat-radiating substrate 111
It sets on joint face 1112.The inner wall of conductive through hole 1116 is arranged in metal layer 1115, and the second conducting element 1114 and first are led
Electric device 1113 is electrically connected by metal layer 1115.It is conductive that the first conducting element 1113 and second had both may be implemented in metal layer 1115
The electrical connection of element 1114 can also carry out thermally conductive.The heat that heater element 112 is issued and is transmitted on the first conducting element 1113
Amount is transmitted on the second conducting element 1114 to realize the evacuation of the heat of heater element 112 by metal layer 1115.Wherein,
The quantity of conductive through hole 1116 is determined according to radiating requirements and functional requirement.The position of conductive through hole 1116 opened up is according to scattered
The installation site of component on hot substrate 111 determines, can both be located at the region where heater element 112, can also be located at
Region except 112 region of heater element.Metal layer 1115 is not only thermally conductive but also conductive material, such as metallic iron, copper and silver
At least one of or it is a variety of.
Heat-radiating substrate 111 can be ceramic substrate or metal substrate.Ceramic substrate is made of ceramic materials, ceramic material packet
Include aluminium nitride (AlN) lamina, aluminium nitride (AlN) multilayer co-firing wiring board, aluminium oxide (Al2O3) lamina, aluminium oxide
(Al2O3) any one in multilayer co-firing wiring board and low-temp, co-fired ceramic multi-layer wiring board.Wherein, aluminium nitride (AlN) is single
The thermal conductivity coefficient of laminate is up to 170W/ (mK), compared to the thermal conductivity coefficient (≤0.38W/ (m of conventional flex circuits plate
K)), the thermal conductivity coefficient of aluminium nitride (AlN) lamina is higher, and high thermal conductivity makes radiating efficiency high, and single layer circuit board technique
Simply, at low cost；The thermal conductivity coefficient of aluminium nitride (AlN) multilayer co-firing wiring board is up to 170W/ (mK), and high thermal conductivity to dissipate
The thermal efficiency is high, and can walk multilayer line, and cabling is more；The thermal conductivity coefficient of aluminium oxide (Al2O3) lamina is higher, reaches 24W/ (m
K), high thermal conductivity makes radiating efficiency high, and single layer wiring board simple process and low cost；Aluminium oxide (Al2O3) multilayer co-firing line
Road plate thermal conductivity coefficient is higher, reaches 24W/ (mK), and it is high that high thermal conductivity makes radiating efficiency, and can walk multilayer line, and cabling is more；
Low-temp, co-fired ceramic multi-layer wiring board thermal conductivity coefficient is good, reaches 2.5W/ (mK), simple process is at low cost, and radiating efficiency is higher.
Metal substrate is made of metal material, and metal material includes copper alloy metal substrate, Al-alloy metal substrate and stainless steel alloy
Any one in metal substrate.Wherein, copper alloy metal substrate thermal conductivity coefficient is up to 385W/ (mK), soft compared to tradition
The thermal conductivity coefficient (≤0.38W/ (mK)) of property circuit board, the thermal conductivity coefficient of copper alloy metal substrate is higher, and high thermal conductivity makes
Radiating efficiency is high, and can walk single layer route, simple process.Al-alloy metal substrate thermal conductivity coefficient be up to 201W/ (mK) and
Multilayer line can be walked, cabling is more, and high thermal conductivity makes radiating efficiency height；Stainless steel alloy metal substrate thermal conductivity coefficient is higher, reaches
To 17W/ (mK), single layer route can be walked, at low cost and simple process, radiating efficiency is higher.When using ceramic substrate, it can pass through
The first conducting element 1113 is formed in the etching of loading end 1111 of heat-radiating substrate 111, heater element 112 is mounted by conductive silver paste
On the first conducting element 1113, the heat that heater element 112 generates is dredged by the first conducting element 1113 and ceramic substrate
It dissipates and absorbs；When using metal substrate, is handled using NiPdAu or chemical nickel gold processing heat-radiating substrate 111 obtains the first conductive element
Part 1113, heater element 112 are fitted on the first conducting element 1113, and the heat that heater element 112 generates is conductive by first
Element 1113 and metal substrate are evacuated and are absorbed.Certainly, other than the above ceramic material and metal material, heat-radiating substrate
111 can also use other suitable materials, it is only necessary to meet radiating requirements, such as: thermal conductivity coefficient is greater than or equal to 2.5W/
(mK).The material of the heat-radiating substrate 111 of the utility model embodiment is aluminium nitride (AlN) lamina.
Heater element 112 can be light source 112, and light source 112 can be laser emitter, and laser emitter can be vertical cavity surface
Emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL), light source 112 or LED
Lamp, in present embodiment, heater element 112 is VCSEL.VCSEL includes the luminous member of semiconductor substrate and setting on substrate
Single light-emitting component can be set in part, substrate, and the array laser being made of a plurality of light-emitting elements also can be set, specifically,
A plurality of light-emitting elements can be arranged on substrate in the form of regularly or irregularly two-dimensional pattern.Certainly, heater element 112
It is also possible to other electronic components, such as: photodetector, temperature sensor etc..
First conducting element 1113 includes at least one pad 1117, and light source 112 is arranged by conductive silver paste leads first
On the pad 1117 of electric device 1113.Second conducting element 1114 includes at least one pad 1118, and circuit board 113 offered
Hole 1132.Stiffening plate 114 includes reinforcement ontology 1142 and the boss 1144 from the extension of reinforcement ontology 1142, and boss 1144 is fed through
Hole 1132 is contacted with heat-radiating substrate 111, wherein contact includes directly contact and mediate contact, the utility model embodiment
Boss 1144 and 111 mediate contact of heat-radiating substrate.Specifically, via hole 1132 is corresponding with the region where light source 112, for example, mistake
Hole 1132 can be located at view field of the light source 112 on circuit board 113, the size and the size phase of boss 1144 of via hole 1132
Matching is to guarantee that boss 1144 passes through via hole 1132.Boss 1144 wears via hole 1132 and is led by high temperature tin cream with second
The pad 1118 of electric device 1114 connects, in this way, realizing that boss 1144 connects with the indirect of the second conducting element 1114 by tin cream
Touching.High temperature tin cream thermal conductivity is higher, and the heat of heat-radiating substrate 111 can be quickly transmitted to boss 1144 to pass through stiffening plate
114 are evacuated, good heat dissipation effect.High temperature tin cream also high temperature resistant, upon connection not vulnerable to Effect of Hyperthermic Environment, combination stability
It is good.In addition, for conventional conducting wire, the pad 1117 of the first conducting element 1113 and the second conducting element 1114
Pad 1118 area it is larger, facilitate welding and connection than stronger, the pad 1117 and light source of the first conducting element 1113
112 contacts area are larger, and the pad 1118 and the contact area of boss 1144 of the second conducting element 1114 are larger, the first conductive element
Part 1113, heat-radiating substrate 111, the second conducting element 1114 and stiffening plate 114 match to quickly to the generation of light source 112
Heat evacuation and absorption, improving radiating effect.
One end of circuit board 113, which is arranged on joint face 1112 and covers, is located at boss 1144 in the second conducting element 1114
Region except region, the region can be pad 1118.Circuit board 113 is arranged by high temperature tin cream in the second conductive element
On part 1114, circuit board 113 and the bonded area of the second conducting element 1114 are larger, it is ensured that bond strength, and high temperature tin
Cream high temperature resistant, combination stability are good.Non-emissive source electrical part 116 is arranged on the first conducting element 1113 by high temperature tin cream.
Certainly, the connection of the connection of light source 112 and heat-radiating substrate 111, circuit board 113 and heat-radiating substrate 111, boss 1144 and heat dissipation base
The connection of plate 111 and the connection of non-emissive source electrical part 116 and heat-radiating substrate 111 can be all attached by conductive silver paste,
It can also be all attached by high temperature tin cream.Conductive silver paste electric conductivity and good heat conductivity, high temperature tin cream is at low cost, can be with
Conductive silver paste or high temperature tin cream are used according to the radiating requirements of different link positions, conductive demand and at original determine, thus
While taking into account heat dissipation performance and electric conductivity, cost is saved.Wherein, tin cream is divided into high temperature tin cream and low temperature tin cream, high temperature
Tin cream is more preferable relative to the high temperature resistance of low temperature tin cream, due to the bonding pad of non-emissive source electrical part 116 and heat-radiating substrate 111
The heat that the heat that the join domain in domain, circuit board 113 and heat-radiating substrate 111 generates is generated relative to light source 112 is less, heat dissipation
Demand is lower, it is possible to is attached using low temperature tin cream.The heat-radiating substrate 111 and light source of the utility model embodiment
112 are connected by conductive silver paste, and heat-radiating substrate 111 and circuit board 113, non-emissive source electrical part 116, boss 1144 pass through high temperature
Tin cream is attached, to obtain better electric conductivity, heat dissipation effect and connective stability.The other end of circuit board 113 is set
It is equipped with connector 115, project structured light mould group 10 can be connected to the electronic device 1000 in Fig. 1 embodiment by connector 115
Mainboard on.Circuit board 113 is mounted on weldering by surface mounting technology (Surface Mount Technology, SMT) technique
On disk 1118, difficulty of processing is lower, binding yield height and automation easy to accomplish.Circuit board 113 and the second conducting element 1114
Electrical connection can be cooperated thus will be electric in this way by the second conducting element 1114, metal layer 1115 and the first conducting element 1113
Road plate 113 and the electrical connection of light source 112 are to realize the control to light source 112.Circuit board 113 can be printed circuit board, flexible electrical
Any one in road plate, Rigid Flex.
The reinforcement ontology 1142 of stiffening plate 114 offers multiple thermal vias 1146, in other words, thermal vias 1146
Region except 1144 region of boss.The surface opposite with joint face 1112 of circuit board 113 is arranged in stiffening plate 114
On, in other words, for circuit board 113 between joint face 1112 and stiffening plate 114, stiffening plate 114 can be with accentuator plate 113
With the intensity of 111 join domain of heat-radiating substrate.Thermal vias 1146 is corresponding with circuit board 113 and light source 112, may is that heat dissipation
Through-hole 1146 only with it is corresponding with the region of 112 face of light source on circuit board 113, be also possible to: thermal vias 1146 and electricity
Road plate 113 is corresponding with the whole region that heat-radiating substrate 111 connects, so that the heat that light source 112 is generated quickly is conducted and evacuated.
The quantity of thermal vias 1146 is determined according to the intensity needs of circuit board assemblies 11, loss of weight demand and radiating requirements.Stiffening plate 114
It can be metal, such as copper, iron or copper alloy, facilitate processing and good heat conduction effect.Certainly, stiffening plate 114 is also possible to it
His material, it is only necessary to meet intensity requirement and cooling requirements.The stiffening plate 114 of the utility model embodiment is copper alloy
Stiffening plate.Boss 1144 is added by the surface opposite with circuit board 113 in stiffening plate 114 by etch process or laser carving technique
Work is formed, simple process.Boss 1144 can also be formed by other techniques, for example, boss 1144 is processed by impact forging technique
It is formed (Fig. 7 shows), intensity is high, and boss 1144 is processed through the stamping process forms (Fig. 8 shows), and machining accuracy is high, intensity height and matter
Amount is light.
Fig. 2, Fig. 4, Fig. 5 and Fig. 6 are please referred to, non-emissive source electrical part 116 can be temperature-sensitive element 116, temperature-sensitive element 116
It is arranged on loading end 1111 and is electrically connected with the first conducting element 1113, the first conducting element 1113 and the second conducting element
1114 electrical connections, circuit board 113 are electrically connected with the second conducting element 1114, so that 113 electricity of temperature-sensitive element 116 and circuit board
Connection, when light source 112, which works, generates heat, the temperature conditions of 116 real-time detection heat-radiating substrate 111 of temperature-sensitive element, processor
30 control the operating power of light source 112 according to temperature conditions.For example, reducing the power of light source 112 when the temperature is excessively high to prevent
Excessively high damage circuit board assemblies 11 of temperature etc..
When circuit board assemblies 11 work, light source 112 generates heat, is transmitted to heat dissipation base by the first conducting element 1113
Plate 111 is transmitted to the second conducting element 1114 by metal layer 1115 and heat-radiating substrate 111, then the second conducting element 1114
Boss 1144 is conducted heat to pass through stiffening plate 114 for heat rapid evacuation.Due to the first conducting element 1113, heat dissipation
Substrate 111, metal layer 1115, the second conducting element 1114 and stiffening plate 114 all have good thermal conductivity coefficient, conduct heat
Effect it is good, so that the heat of light source 112 quickly be lost, radiating efficiency is high.
Referring to Fig. 3, lens barrel 12 is carried on circuit board assemblies 11 and receiving is collectively formed with circuit board assemblies 11
Chamber 121,113 one end of circuit board are arranged on the loading end 1111 of heat-radiating substrate 111 and are located at outside lens barrel 12, circuit board 113
The other end connect with connector 115, project structured light mould group 10 can be connected to the electricity in Fig. 1 embodiment by connector 115
On the mainboard of sub-device 1000.The material of lens barrel 12 can be plastics, and light source 112 and optical module 13 are housed in accommodating chamber
In 121.Light source 112 is for emitting laser.Optical module 13 is for the diffraction laser to form laser pattern.Optical module 13 can
To include collimating element 131 and diffraction element 132 (Diffractive Optical Elements, DOE).Collimating element 131
Laser for converging or collimated light source 112 issues, be formed on diffraction element 132 can diffraction after collimating element 131
Laser diffraction structure.When project structured light mould group 10 works, the laser that VCSEL is issued successively passes through collimating element 131
After diffraction element 132, laser pattern is projected outward.
To sum up, the circuit board assemblies 11 of the utility model embodiment are by being arranged heater element 112 in heat-radiating substrate
On 111 loading end 1111, circuit board 113 is arranged on the joint face 1112 of heat-radiating substrate 111 and is opened on circuit board 113
If via hole 1132 is so that boss 1144 wears via hole 1132 connect with joint face 1112, thus by the heat of heater element 112
Pass through heat-radiating substrate 111 and the conduction evacuation of stiffening plate 114, good heat dissipation effect.
In some embodiments, that Heat Conduction Material can be set inside conductive through hole 1116 and thermal vias 1146 is for example thermally conductive
Glue etc..In this way, the evacuation speed of heat, improving radiating effect can be accelerated.
Referring to Fig. 9, in other embodiments, photoelectricity mould group 10 can be camera module.Camera module can be
Visible image capturing head mould group, is also possible to infrared camera mould group.Camera module includes circuit board assemblies 11, lens barrel 12 and light
Learn component 13.At this point, heater element 112 can be complementary metal oxide semiconductor (CMOS, Complementary Metal
Oxide Semiconductor) image sensor chip or charge coupled cell (CCD, Charge-coupled Device) figure
As sensing chip, lens barrel 12 is carried on circuit board assemblies 11 and accommodating chamber 121 is collectively formed with circuit board assemblies 11.Lens barrel 12
Include gluing with the connection type of circuit board assemblies 11, engage.Image sensor chip 112 and optical module 13 are housed in lens barrel
In 12.Optical module 13 includes camera lens 133, and the image side of camera lens 133, specifically, optical module is arranged in image sensor chip 112
13 optical axis is overlapped with the centre normal of image sensor chip 112.When photoelectricity mould group 10 works, by the light of target object reflection
It is imaged on image sensor chip 112 after optical module 13.In the present embodiment, camera lens 133 can be individual lens,
The lens are convex lens or concavees lens；Or be more pieces of lens, more pieces of lens can be convex lens or concavees lens, or part is convex
Lens are partially concavees lens.
Please continue to refer to Fig. 9, further, optical module 13 further includes optical filter 134, such as cutoff filter
(photoelectricity mould group 10 is visible image capturing head mould group at this time), optical filter 134 is used to adjust the wavelength of light section of imaging, specific to use
It can enter circuit board assemblies 11 in filtering out the infrared light in natural light and making it not, to prevent infrared light to visual light imaging shape
At colors of image impacted with clarity.Certainly, optical filter 134 can also be infrared by optical filter (photoelectricity mould at this time
Group 10 is infrared camera mould group), optical filter 134 is used to adjust the wavelength of light section being imaged, specifically for only allowing infrared light
Into circuit board assemblies 11 (prevent visible light enter circuit board assemblies 11), with guarantee colors of image that infrared imaging is formed with
Clarity.Optical filter 134 is housed in accommodating chamber 121 and is arranged between circuit board assemblies 11 and optical module 13.In photoelectricity
When mould group 10 works, photoelectricity mould group 10 is entered by the light that target object reflects, successively passes through camera lens 133, optical filter 134 and is scheming
As being imaged on sensing chip 112.
Referring to Fig. 1, the utility model also provides a kind of electronic device 1000, which may include in Fig. 9
Photoelectricity mould group 10.In other words, above-mentioned to can also be applied to electronic device 1000 for the photoelectricity mould group 10 of camera module.At this point,
Photoelectricity mould group 10 can be used for obtaining visible images or infrared light image etc..
Similarly, the electronic device 1000 of the utility model embodiment, photoelectricity mould group 10 and circuit board assemblies 11 pass through
Heater element 112 is arranged on the loading end 1111 of heat-radiating substrate 111, circuit board 113 is arranged in the company of heat-radiating substrate 111
Via hole 1132 is opened up in junction 1112 and on circuit board 113 so that boss 1144 wears via hole 1132 and joint face 1112 connects
It connects, so that the heat of heater element 112 is passed through heat-radiating substrate 111 and the conduction evacuation of stiffening plate 114, good heat dissipation effect.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means in conjunction with the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment of the utility model or show
In example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.And
And particular features, structures, materials, or characteristics described can be in any one or more embodiments or example to close
Suitable mode combines.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one described feature.The meaning of " plurality " is at least two, such as two in the description of the present invention,
It is a, three, unless otherwise specifically defined.
Although the embodiments of the present invention have been shown and described above, it is to be understood that above-described embodiment is
Illustratively, it should not be understood as limiting the present invention, those skilled in the art are in the scope of the utility model
It inside can make changes, modifications, alterations, and variations to the above described embodiments, the scope of the utility model is by claim and its is equal
Object limits.
Claims (15)
1. a kind of circuit board assemblies, which is characterized in that the circuit board assemblies include:
Heat-radiating substrate, the heat-radiating substrate include loading end and the joint face opposite with the loading end, shape on the loading end
At there is the first conducting element, the second conducting element is formed on the joint face；
Heater element, the heater element are arranged on the loading end and are electrically connected with first conducting element；
Circuit board, the circuit board are arranged on the joint face and are electrically connected with second conducting element, the circuit board
Offer via hole；With
Thermally conductive stiffening plate, the stiffening plate are arranged on the surface opposite with the joint face of the circuit board, the benefit
Strong plate includes reinforcement ontology and the boss that extends from the reinforcement ontology, the boss wear the via hole and with the heat dissipation base
Plate contact.
2. circuit board assemblies according to claim 1, which is characterized in that first conducting element includes pad, described
Heater element is arranged on the pad of first conducting element.
3. circuit board assemblies according to claim 2, which is characterized in that the heater element is mounted on by conductive silver paste
On the pad of first conducting element.
4. circuit board assemblies according to claim 2, which is characterized in that the circuit board assemblies further include non-emissive source electricity
Device, the non-emissive source electrical part are arranged on first conducting element by tin cream.
5. circuit board assemblies according to claim 1, which is characterized in that second conducting element includes pad, described
Boss is arranged on the pad of second conducting element, and the boss is corresponding with the heater element.
6. circuit board assemblies according to claim 5, which is characterized in that the boss is arranged by tin cream described second
On the pad of conducting element.
7. circuit board assemblies according to claim 1, which is characterized in that the circuit board is arranged by tin cream described the
On two conducting elements.
8. circuit board assemblies according to claim 1, which is characterized in that the heat-radiating substrate includes ceramic substrate or metal
Substrate.
9. circuit board assemblies according to claim 1, which is characterized in that the thermal conductivity of the heat-radiating substrate is more than or equal to
2.5W/m·K。
10. circuit board assemblies according to claim 1, which is characterized in that the heat-radiating substrate offers multiple conductive logical
Hole, the inner wall of the conductive through hole are provided with metal layer, first conducting element and second conducting element described in
One end of metal layer electrical connection, the circuit board is arranged on the joint face and is electrically connected with second conducting element.
11. circuit board assemblies according to claim 1, which is characterized in that it is logical that the stiffening plate is also provided with multiple heat dissipations
Hole, the thermal vias are located at the region except the boss region.
12. circuit board assemblies according to claim 1, which is characterized in that the stiffening plate passes through bonded adhesives and the electricity
The connection of road plate.
13. a kind of photoelectricity mould group characterized by comprising
Circuit board assemblies described in claim 1-12 any one；With
Optical module on the circuit board assemblies is set, and the optical module is corresponding with the circuit board assemblies.
14. a kind of depth camera characterized by comprising
Photoelectricity mould group described in claim 13, the heater element are light source and are used to emit laser, the optical module packet
The light beam generator being arranged on the circuit board assemblies is included, the light beam generator is corresponding with the light source interval and for inciting somebody to action
The laser is converted to form laser pattern；
Image acquisition device, described image collector are used to acquire the laser pattern projected by the photoelectricity mould group；And
Processor, the processor are connect with the photoelectricity mould group and described image collector respectively, and the processor is for locating
The laser pattern is managed to obtain depth image.
15. a kind of electronic device characterized by comprising
Shell；And
Depth camera described in claim 14, the depth camera are arranged in the shell and from shell exposure to obtain
Take depth image.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820837807.4U CN208300111U (en) | 2018-05-31 | 2018-05-31 | Circuit board assemblies, photoelectricity mould group, depth camera and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820837807.4U CN208300111U (en) | 2018-05-31 | 2018-05-31 | Circuit board assemblies, photoelectricity mould group, depth camera and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208300111U true CN208300111U (en) | 2018-12-28 |
Family
ID=64722386
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820837807.4U Active CN208300111U (en) | 2018-05-31 | 2018-05-31 | Circuit board assemblies, photoelectricity mould group, depth camera and electronic device |
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| CN (1) | CN208300111U (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110536062A (en) * | 2019-10-15 | 2019-12-03 | Oppo广东移动通信有限公司 | The assembling procedure and electronic equipment of camera module, camera module |
| CN110557881A (en) * | 2018-05-31 | 2019-12-10 | 南昌欧菲生物识别技术有限公司 | Circuit board assembly, photoelectric module, depth camera and electronic device |
| WO2020142955A1 (en) * | 2019-01-09 | 2020-07-16 | 深圳市大疆创新科技有限公司 | Ranging device and mobile platform |
| CN112857248A (en) * | 2019-11-12 | 2021-05-28 | 宁波舜宇光电信息有限公司 | Depth information camera module, projection module and preparation method thereof |
| CN112995453A (en) * | 2019-12-18 | 2021-06-18 | 宁波舜宇光电信息有限公司 | Depth information camera module and assembling method thereof |
| CN114615397A (en) * | 2020-12-09 | 2022-06-10 | 华为技术有限公司 | TOF device and electronic apparatus |
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2018
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110557881A (en) * | 2018-05-31 | 2019-12-10 | 南昌欧菲生物识别技术有限公司 | Circuit board assembly, photoelectric module, depth camera and electronic device |
| WO2020142955A1 (en) * | 2019-01-09 | 2020-07-16 | 深圳市大疆创新科技有限公司 | Ranging device and mobile platform |
| CN110536062A (en) * | 2019-10-15 | 2019-12-03 | Oppo广东移动通信有限公司 | The assembling procedure and electronic equipment of camera module, camera module |
| CN110536062B (en) * | 2019-10-15 | 2021-03-02 | Oppo广东移动通信有限公司 | Camera module, camera module assembling process and electronic equipment |
| CN112857248A (en) * | 2019-11-12 | 2021-05-28 | 宁波舜宇光电信息有限公司 | Depth information camera module, projection module and preparation method thereof |
| CN112995453A (en) * | 2019-12-18 | 2021-06-18 | 宁波舜宇光电信息有限公司 | Depth information camera module and assembling method thereof |
| CN114615397A (en) * | 2020-12-09 | 2022-06-10 | 华为技术有限公司 | TOF device and electronic apparatus |
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Address after: 330013 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |