WO2021195978A1 - Time of flight transmission module, time of flight measurement device, and electronic device - Google Patents
Time of flight transmission module, time of flight measurement device, and electronic device Download PDFInfo
- Publication number
- WO2021195978A1 WO2021195978A1 PCT/CN2020/082480 CN2020082480W WO2021195978A1 WO 2021195978 A1 WO2021195978 A1 WO 2021195978A1 CN 2020082480 W CN2020082480 W CN 2020082480W WO 2021195978 A1 WO2021195978 A1 WO 2021195978A1
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- WIPO (PCT)
- Prior art keywords
- circuit board
- light
- tof
- rigid circuit
- shielding cover
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
- G01S17/894—3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Definitions
- This application relates to the technical field of electronic products, in particular to a time-of-flight transmitting module, a time-of-flight detection device, and electronic equipment.
- the Time of Flight (TOF) camera module is a commonly used depth camera module that can be used to measure depth of field (depth) or distance information, and can realize the function of three-dimensional imaging or distance detection of the target by the electronic device.
- the TOF camera module generally includes an optical signal transmitting (Tx) module and an optical signal receiving (Rx) module.
- chip heat dissipation generally adopts the method of adding a thermal pad on the surface of the chip. If heat dissipation has higher requirements, a heat sink such as a thermal conductive copper sheet will be added above the thermal pad for auxiliary heat dissipation. This kind of heat dissipation solution has a large chip area. , The application scenarios that are not sensitive to the volume of the device are more suitable. However, for the light emitting module (module) in the TOF module, the light-emitting chip and the driving chip that drive the light-emitting chip are all small in area.
- the present application provides a TOF emission module, a TOF detection device and electronic equipment, which can improve the heat dissipation efficiency of the TOF emission module.
- a TOF emission module in an electronic device includes: a light-emitting assembly; The light-emitting component emits light, the driving unit is located in the first shielding cover, and the thermally conductive gel is filled between the driving unit and the first shielding cover.
- the TOF transmitter module of the embodiment of the present application by injecting a thermally conductive gel between the drive unit and the shielding cover, the process problem that ordinary thermal pads cannot pass reflow soldering can be avoided, and the shielding cover can be soldered after reflow soldering , Inject the thermal gel through the reserved holes of the shielding cover, through the thermal conductive gel can quickly conduct heat to the external space, realize the rapid cooling of the drive chip, solve the problem of the air layer between the drive chip and the shielding cover blocking heat dissipation, and improve the chip The heat dissipation efficiency.
- the first shielding cover has a first opening for injecting the thermally conductive gel through the first opening.
- the first opening is located on a surface of the first shielding cover opposite to the driving unit.
- the TOF emission module further includes: a circuit board for fixing the light-emitting component and the driving component, and the light-emitting component The component and the driving component are electrically connected through the circuit board.
- the light-emitting assembly and the driving unit are respectively fixed on the first surface of the circuit board, and the second The surface is electrically connected to the main board of the electronic device through a patch.
- the TOF transmitter module further includes: a heat dissipating device disposed on the outer surface of the first shielding cover and the electronic device Between the back cover.
- the heat dissipating device in another implementation manner of the first aspect, includes a thermal pad and/or a heat dissipation copper sheet.
- the light-emitting assembly includes: a light-emitting unit, the light-emitting unit is located in the first shielding cover, the light-emitting unit and the The first surface is electrically connected, and the first shielding cover above the light-emitting unit has a second opening to expose the light emitted by the light-emitting unit.
- a silicone sleeve is provided between the first shielding cover above the light-emitting unit and the back cover of the electronic device, so The silicone sleeve has a third opening to expose the light emitted by the light-emitting unit.
- the circuit board is a rigid-flex board
- the rigid-flex board includes: a first rigid circuit board and a second rigid circuit Board, a third rigid circuit board and a U-shaped flexible circuit board, the first rigid circuit board and the second rigid circuit board are respectively arranged on the upper and lower surfaces of one end of the U-shaped flexible circuit board, and the third rigid circuit
- the board is arranged on the lower surface of the other end of the U-shaped flexible circuit board, and the U-shaped flexible circuit board is used to electrically connect the first rigid circuit board, the second rigid circuit board and the third rigid circuit board;
- the light emitting component is arranged above the first rigid circuit board and is electrically connected to the first rigid circuit board;
- the driving component is arranged below the second rigid circuit board, and the driving unit is connected to the first rigid circuit board.
- the second rigid circuit board is electrically connected to drive the light-emitting component to emit light;
- the third rigid circuit board is electrically connected to the main
- the rigid-flex board further includes a fourth rigid circuit board, and the fourth rigid circuit board is disposed on the U-shaped flexible circuit board.
- the TOF transmitter module further includes: a heat sink device located between the first shielding cover and the fourth rigid circuit board.
- the heat sink device in another implementation manner of the first aspect, includes a thermally conductive copper sheet.
- one surface of the thermally conductive copper sheet is attached to the first shielding cover through a thermally conductive adhesive; and/or, the The other surface of the thermally conductive copper sheet is attached to the surface of the fourth rigid circuit board through another thermally conductive adhesive.
- the light-emitting assembly includes: a light-emitting unit and a second shielding cover, the light-emitting unit is located in the second shielding cover, so The light emitting unit is electrically connected to the first rigid circuit board, and the second shielding cover has a fourth opening to expose the light emitted by the light emitting unit.
- the driving component further includes: an auxiliary device for assisting the driving unit to generate a driving signal for driving the light-emitting component.
- a TOF detection device in an electronic device includes: the TOF transmitting module in the first aspect or any possible implementation of the first aspect, and the TOF receiving module, wherein The TOF transmitting module is used for transmitting optical signals, and the TOF receiving module is used for receiving the return optical signals after the object is illuminated by the optical signals.
- the TOF receiving module is electrically connected to the main board of the electronic device through a board-to-board connector BTB.
- an electronic device which includes: the TOF transmitting module in the first aspect or any possible implementation of the first aspect; and a main board, the TOF transmitting module and the main board Electric connection.
- the electronic device further includes: a silicone sleeve disposed between the TOF transmitter module and the back cover of the electronic device, the silicone sleeve having The fifth opening is to expose the light emitted by the light-emitting unit.
- Fig. 1 is a partial cross-sectional view of a TOF transmitting module according to an embodiment of the present application.
- Fig. 2 is a cross-sectional view of another TOF transmitting module according to an embodiment of the present application.
- FIG. 3 is a three-dimensional exploded schematic diagram of the TOF transmitter module shown in FIG. 2.
- FIG. 4 is a cross-sectional view of still another TOF transmitting module according to an embodiment of the present application.
- FIG. 5 is a three-dimensional exploded schematic diagram of the TOF transmitting module shown in FIG. 4.
- FIG. 1 shows a partial cross-sectional view of a TOF transmitter module 100 according to an embodiment of the present application.
- the TOF detection device may include a TOF transmitting module (or Tx module) and a TOF receiving module (or Rx module) , wherein, the Tx module is used to emit a light signal, and the light signal irradiates an object to generate a return light signal.
- the object can refer to the object to be photographed (or called the shooting target, the imaging target, the detection target); and the Rx module is used To receive the return light signal, or the Rx module is used to sense the return light signal, and the return light signal carries the depth information of the object to be photographed, so that the electronic device can realize the imaging function of the object to be photographed.
- the following embodiments of the application mainly focus on the Tx module.
- the electronic device in the embodiment of the present application may be any electronic device with TOF function requirements, such as a mobile phone, a tablet computer, a notebook computer, a desktop computer, an in-vehicle electronic device, medical treatment, and aviation.
- TOF testing devices generally include a combined design and a separate design.
- the communication between the integrated TOF module composed of the Tx module and the Rx module and the main board of the electronic device is usually realized through the BTB connector.
- this assembly method is convenient to install the TOF detection device as a whole to the electronic device, this kind of Rx
- the combined form of the module and the Tx module is not conducive to maintenance. Any damage will cause the entire TOF module to be scrapped, and subsequent maintenance costs are high.
- the Tx module 100 in the embodiment of the present application may refer to a Tx module in a combined design or a separate design, and the embodiment of the present application is not limited thereto.
- the Tx module 100 includes a light-emitting component (not shown in FIG. 1) and a driving component 110.
- the light emitting component is used to emit light required for TOF detection;
- the driving component 110 includes a driving unit 111, a first shielding cover 112, and a thermally conductive gel 113.
- the driving unit 111 is used to drive the light emitting component to emit light, and the driving unit 111 Located in the first shielding cover 112, the thermally conductive gel 113 is filled between the driving unit 111 and the first shielding cover 112, so that the thermally conductive gel 113 can conduct the heat generated by the driving unit 111 to the second A shield 112 outside.
- the thermally conductive gel 113 can be injected from the reserved hole on the first shielding cover 112 by using a needle in the process, and the gel flow characteristic is used to fill the upper surface of the driving unit 111 and the first shielding cover.
- the space between the covers 112, or the fluidity of the gel is used to fill the inner space of the first shielding cover 112, that is, the first opening 114 can be provided on the first shielding cover 112 to inject the thermally conductive condensation through the first opening 114. ⁇ 113.
- the thermally conductive gel 113 may be located between the upper surface of the driving unit 111 and the first shielding cover 112.
- a first opening 114 may be provided on the top of the first shielding cover 112.
- a first opening 114 is provided on the surface of the first shielding cover 112 opposite to the driving unit 111, and the thermally conductive gel is injected through the first opening 114, so that the thermally conductive gel 113 is filled on the upper surface of the driving unit 111 Between and the first shield 112.
- the thermally conductive gel 113 can be further filled between the side of the driving unit 111 and the first shielding cover 112. For example, as shown in FIG.
- a first opening 114 is also provided on the top of the first shielding cover 112, but The difference from FIG. 1 is that the flow characteristics of the gel can be used to make the thermally conductive gel 113 fill all the upper and side gaps between the driving unit 111 and the first shielding cover 112; or, it can also be in the first shielding cover 112. Holes are opened in other positions, for example, holes are opened on the side wall of the first shielding cover 112, and the flow characteristics of the gel are used to make the thermally conductive gel 113 fill up all the gaps between the driving unit 111 and the first shielding cover 112.
- the embodiment of the present application It is not limited to this.
- the drive unit 111 on the Tx module is very concentrated, the device is small and cannot be directly added with a heat sink, and in order to shield the electromagnetic interference generated by other external components, the drive unit 111 usually needs to be equipped with a shielding cover, and a thermal pad is used to dissipate heat.
- the thermal pad cannot pass reflow soldering (if the thermal pad heat dissipation solution is adopted, the thermal pad needs to be attached to the driver chip first, and then the shielding cover is soldered on top of the driver chip by reflow soldering, but the temperature of the reflow soldering process Too high will cause the thermal pad to expand in the thickness direction, and the shielding cover cannot be welded to the drive chip).
- the driver unit of the Tx module on the market and the shielding cover are generally left blank, and the heat dissipation is achieved through air.
- Minimum heat dissipation requirements, but with such a heat dissipation structure, other parameters of the system will be more balanced. For example, consideration will be given to limiting the luminous power of the drive unit to a certain amount (that is, the design of luminous power is limited by The heat dissipation of the module), and the luminous power will affect the detection range (detection distance) of the system, so the heat dissipation problem is also one of the reasons that affect the current TOF detection or recognition system in scenarios with larger detection distances.
- thermally conductive gel can fill between the driving unit 111 and the first shielding cover 112, so that there is no air gap between the driving unit 111 and the first shielding cover 112, and the thermally conductive gel can quickly Conduct heat to the external space to achieve rapid cooling of the drive chip, solve the problem of heat dissipation blocked by the air layer between the drive chip and the shield, and improve the heat dissipation efficiency of the chip. Furthermore, the flexibility of system design can be improved, and it can be applied to more systems with different detection distance requirements.
- a heat sink 130 may be provided outside the first shielding cover 112, for example, a heat sink 130 may be provided on the outer surface of the first shielding cover 112.
- the heat dissipating device 130 may include a thermal pad and/or a heat dissipation copper sheet. In this way, arranging the heat sink 130 outside the first shielding cover 112 can realize the heat transfer through the heat-conducting gel and then through the heat sinking device. Compared with not providing the heat sink 130, it only depends on the air on the upper surface of the first shielding cover 112.
- the heat dissipation is beneficial to increase the heat dissipation speed; and the small area of concentrated heat emitted by the drive unit 111 passes through the thermally conductive gel and then passes through the large area heat sink, which can further increase the heat dissipation area.
- the TOF emission module 100 may further include: a circuit board 120 for fixing the light-emitting component and the driving component 110, and the light-emitting component and the driving component 110 can pass through The circuit board 120 realizes electrical connection.
- the light-emitting component and the driving component 110 may be respectively disposed at different positions of the circuit board 120. The following will describe in detail in combination with different embodiments of the circuit board 120.
- FIG. 2 shows another cross-sectional view of the TOF transmitter module 100 according to an embodiment of the present application
- FIG. 3 is a three-dimensional exploded view of the TOF transmitter module 100 shown in FIG. 2, wherein FIG. 1 only shows the Tx module 2 and 3 may be a possible form of the Tx module 100.
- the cross-sectional view shown in FIG. 2 is along the dashed line AB in FIG. 3 A cross-sectional view cut from top to bottom in the direction shown.
- the circuit board 120 includes two upper and lower surfaces, which are referred to herein as a first surface and a second surface, respectively.
- the light-emitting assembly and the driving unit 111 are respectively fixed on the first surface of the circuit board 120.
- One surface, that is, the light-emitting assembly and the driving unit 111 are electrically connected through the conductive devices on the first surface; and the second surface of the circuit board 120 is electrically connected to the main board 200 of the electronic device, for example, the second surface is connected to the main board 200 They can be electrically connected by means of patches.
- the light-emitting assembly in this application may specifically include a light-emitting unit 141 and a second shielding cover.
- the light-emitting unit 141 is disposed in the second shielding cover.
- the second shielding cover can shield electromagnetic interference generated by other external components and avoid Impact on the light-emitting unit 141.
- the driving unit 111 and the light-emitting assembly can be arranged on the same side of the circuit board 120, that is, the driving unit 111 and the light-emitting unit 141 can be arranged on the second side of the circuit board 120.
- the light-emitting unit 141 and the driving unit 111 can be located in the same shielding cover, that is, the driving assembly 110 and the light-emitting assembly share a shielding cover.
- the light-emitting unit 141 is also disposed in the first shielding cover 112. Inside, even if the first shielding case and the second shielding case are the same shielding case, space can be saved.
- the first shielding cover 112 can be regarded as two parts on the left and right sides, the driving unit 111 and the thermally conductive gel 113 are arranged on the left side, and the light-emitting unit 141 is arranged on the right side.
- the light-emitting unit 141 is located in the first shielding cover 112, the light-emitting unit 141 is electrically connected to the first surface of the circuit board 120, and the light-emitting unit 141 is used for light-emitting; the first shielding cover 112 corresponds to the light-emitting unit 141
- the part of may have an opening, here called a second opening 143, the second opening 143 is used to expose the light emitted by the light-emitting unit 141; or, at the light-emitting position of the first shielding cover 112 corresponding to the light-emitting unit 141 ,
- a transparent material is provided so that the light emitted by the light-emitting unit 141 can be emitted to reach the detection object or imaging target.
- a thermally conductive gel may be filled between the driving unit 111 and the light emitting unit 141, but the embodiment of the present application is not limited thereto.
- the light-emitting unit 141 in the embodiment of the present application may be used to emit invisible light.
- the light-emitting unit 141 may be an infrared laser transmitter.
- the Rx module may include a photosensitive sensor, and the photosensitive sensor may be an infrared sensor. .
- the light-emitting unit 141 may specifically be a vertical-cavity surface-emitting laser (VCSEL), but the embodiment of the present application is not limited thereto.
- VCSEL vertical-cavity surface-emitting laser
- the light-emitting assembly may also include other elements, and the driving assembly 110 may also include other elements.
- the light-emitting assembly and/or other elements included in the driving assembly such as inductors, capacitors, or resistors, may also be provided in the first shielding cover 112, for cooperating with or assisting the driving unit to generate driving light.
- the drive signal required by the unit may also be provided in the first shielding cover 112, for cooperating with or assisting the driving unit to generate driving light.
- the outer surface or upper surface of the first shielding cover 112 corresponding to the light-emitting unit 141 may also be provided with a silicone sleeve 150 for sealing, and the silicone sleeve 150 can expose the light emitted by the light-emitting unit 141 Light.
- the silicone sleeve 150 may also be provided between the first shielding cover 112 and the back cover 300 of the electronic device (such as a mobile phone), considering that the back cover 300 and the first shield The cover 112 is made of hard material, and the two directly abut against each other, and there will be a gap.
- the silicone sleeve 150 is relatively soft, so that the silicone sleeve 150 can play a role of sealing between the back cover 300 and the first shielding cover 112. At the same time, it also has the function of dustproof and waterproof. Specifically, as shown in FIG. 2 or FIG. 3, the silicone sleeve 150 may have a third opening 151 to expose the light emitted by the light-emitting unit 141, and the part of the back cover 300 corresponding to the light-emitting position of the light-emitting unit is usually made of transparent material.
- the silicone sleeve 150 For example, glass, while exposing the light emitted by the light-emitting unit 141, there is no gap between the back cover 300, the silicone sleeve 150 and the first shielding cover 112, which has the function of dust and water resistance to protect the light-emitting unit 141.
- the silicone sleeve 150 can be pasted on the corresponding position on the upper surface of the first shielding cover 112 and/or the surface of the back cover 300 by double-sided tape, or directly abuts against the surface of the back cover 300.
- the embodiment of the present application does not Limited to this.
- the size and shape of the second opening 143 and the third opening 151 can be set according to actual applications, and the shape and size of the second opening 143 and the third opening 151 can be the same or different.
- the shapes of the second opening 143 and the third opening 151 may both be set to be rectangular, or the size of the third opening 151 may be set to be larger than that of the second opening 143.
- the heat transferred through the thermally conductive gel 113 continues to be transferred outwards.
- the air on the upper surface of the first shielding cover 112 is used for heat dissipation, which is beneficial to increase the heat dissipation speed; and the driving unit 111 sends out
- the small area of concentrated heat passes through the thermally conductive gel and then through the large-area heat sink, which can further increase the heat dissipation area.
- a heat sink 130 may be provided between the outer surface of the first shielding cover 112 and the back cover 300 of the electronic device.
- the heat sink may include a thermal pad 131 and/or a heat sink.
- the copper sheet 132 may also include aluminum sheets and other metal good thermal conductors.
- the heat sink 130 can be fixed to the back cover 300 by pasting, or it can directly abut against the back cover 300; similarly, the heat sink 130 and the lower first shielding cover 112 can be pasted with firmware, For example, it can be pasted by double-sided tape, or can also be fixed in other ways, and the embodiments of the present application are not limited to this.
- Arranging the driving component 111 and the light-emitting component 141 on the same side of the circuit board can reduce the thickness of the Tx module, but this will make the heat of the driving component 111 and the light-emitting component 141 more concentrated.
- the thermal conductive gel in the driving assembly 111 and the heat dissipating component above it, the heat can be transferred to the back cover and external space of the electronic device, thereby significantly improving the heat dissipation capacity of the Tx module, reducing usage problems, and improving the mold Group service life.
- FIG. 4 shows another cross-sectional view of the TOF emission module 100 according to an embodiment of the present application
- FIG. 5 is a three-dimensional exploded view of the TOF emission module 100 shown in FIG. 4, wherein FIG. 1 only shows A part of the Tx module 100 is shown, and FIGS. 4 and 5 may be a possible form of the Tx module 100, and the Tx module 100 shown in FIGS. 4 and 5 is different from that shown in FIGS. 2 and 3. The form of the Tx module 100 is shown.
- the circuit board 120 may be a rigid-flex board 120.
- the rigid-flex board 120 includes: a first rigid circuit board 121, a second rigid circuit board 122, a third rigid circuit board 123, and a U-shaped flexible printed circuit (FPC) 125, where U-shaped The FPC 125 is used to electrically connect the first rigid circuit board 121, the second rigid circuit board 122, and the third rigid circuit board 123.
- FPC flexible printed circuit
- the first rigid circuit board 121 and the second rigid circuit board 122 are respectively arranged on the upper and lower surfaces of one end of the U-shaped FPC 125, that is, the first rigid circuit board 121, one end of the U-shaped FPC 125, and the The second rigid circuit board 122 forms a laminated structure.
- the light-emitting component 140 is disposed above the first rigid circuit board 121 and is electrically connected to the first rigid circuit board 121; and the driving component 110 is disposed below the second rigid circuit board 122 and is connected to the second rigid circuit board.
- the board 122 is electrically connected.
- the third rigid circuit board 123 is arranged on the bottom surface of the other end of the U-shaped FPC 125; the third rigid circuit board 123 may include conductive terminals for mounting the Tx module 100 to the motherboard 200 of the electronic device. 126, that is, conductive terminals 126 are provided on the lower surface of the third rigid circuit board 123, so that the third rigid circuit board 123 is electrically connected to the main board 200 of the electronic device by means of a patch, thereby realizing the TOF emission module Electrical connection between the group and the main board 200 of the electronic device.
- the patching method in the embodiment of the present application may include Surface Mounted Technology (SMT).
- SMT Surface Mounted Technology
- a pad array can be provided on the lower surface of the lower third rigid circuit board 123, that is, the conductive terminal 126 can be a pad array, through which the third rigid circuit board 123 is soldered to the main board 200 of the electronic device.
- the connection between the TOF transmitter module 100 formed by using the rigid-flex board 120 including the third rigid circuit board 123 as the carrier and the main board 200 of the electronic device is realized, thereby realizing the functional communication between the two.
- the Tx module of the embodiment of the present application can adopt a folding structure of a flexible and hard board.
- the structure can be divided into an upper half and a lower half, and the two are electrically connected by an FPC; the upper and lower surfaces of the upper half They are used to set the light-emitting component and the driving component respectively, and realize the communication between the light-emitting component and the driving component, and the lower part can realize the direct mounting of the Tx module on the main board through the pad on the lowermost surface.
- the Tx module mounted on the main board of the electronic device through the patch method is conducive to automated patch production, facilitates mass production, reduces production costs, and saves space and cost compared with the BTB solution.
- the rigid-flex board 120 may further include a fourth rigid circuit board 124 located at The upper surface of the other end of the U-shaped FPC 125 is arranged opposite to the third rigid circuit board 123, but the embodiment of the present application is not limited to this.
- the rigid circuit board in the embodiment of the present application may be a printed circuit board (Printed Circuit Board, PCB).
- PCB printed Circuit Board
- the first rigid circuit board 121, the second rigid circuit board 122, the third rigid circuit board 123, and the fourth rigid circuit board 124 in the rigid-flex board 120 may all be PCBs.
- the first rigid circuit board 121, the second rigid circuit board 122, the third rigid circuit board 123, and the fourth rigid circuit board 124 in the embodiment of the present application it may be a single layer
- the circuit board may also be a multilayer circuit board, or it may be any one or more layers of a multilayer circuit board.
- the first rigid circuit board 121 and the second rigid circuit board 122 can be two independent circuit boards; or the first rigid circuit board 121, the middle flexible circuit board 125, and the second rigid circuit board 122 can also be the same.
- the layer circuit board is the first rigid circuit board 121 in the embodiment of the application, and one or more layers of the circuit board located in the lower part of the flexible circuit board in the multilayer circuit board is the second rigid circuit board 122 in the embodiment of the application .
- the third rigid circuit board 123 and the fourth rigid circuit board 124 can also be two independent circuit boards, or the third rigid circuit board 123, the middle flexible circuit board 125, and the fourth rigid circuit board 124 can also be It can be three parts in the same multilayer circuit board, which will not be repeated here.
- the shape and area of the first rigid circuit board 121 and the second rigid circuit board 122 on the upper half of the flexible and rigid combined board 120 in the embodiment of the present application can be set to be the same, for example, set to have the same size.
- the shape and area of the third rigid circuit board 123 and the fourth rigid circuit board 124 in the lower half of the rigid-flex board 120 can also be set to be the same, for example, set to be rectangular with the same size.
- the shape and area of the two rigid circuit boards of the upper half and the two rigid circuit boards of the lower half can also be set to be the same; the upper half and the lower half can be arranged in parallel, and both remain Right, that is, the projections of the two rigid circuit boards in the upper half on the surface where the two rigid circuit boards in the lower half are located along the vertical direction are completely overlapped with the two rigid circuit boards in the lower half, so that the In the vertical space, the rigid circuit boards of the upper and lower parts occupy the same size, which will not cause the problem of the rigid circuit boards of the lower half occupying more space.
- the light-emitting assembly 140 in the embodiment of the present application may specifically include a light-emitting unit 141 and a shielding cover 142.
- the shielding cover 142 included in the light-emitting assembly 140 is referred to herein as The second shielding cover 142 in which the light-emitting unit 141 is disposed, and the second shielding cover 142 can shield electromagnetic interference generated by other external components and avoid the influence on the light-emitting unit 141.
- the light-emitting unit 141 is located in the second shielding cover 142, the light-emitting unit 141 is electrically connected to the first rigid circuit board 121, and the light-emitting unit 141 is used to emit light;
- the second shielding cover 142 may have an opening 144 , Here referred to as the fourth opening 144, the fourth opening is used to expose the light emitted by the light-emitting unit 141; or, at the light-emitting position of the second shielding cover 142 corresponding to the light-emitting unit 141, a transparent material is provided to expose The light emitted by the light emitting unit 141.
- the light-emitting unit 141 shown in FIG. 4 or FIG. 5 is similar to the light-emitting unit 141 described in FIGS. 2 and 3, and is applicable to the related description of the light-emitting unit 141 described in FIGS.
- the light-emitting unit in FIG. 5 may be a VCSEL, which is not repeated here for the sake of brevity.
- the light-emitting assembly 140 may also include other elements.
- other elements included in the light-emitting assembly 140 such as inductors, capacitors or Resistor, etc., used to coordinate or assist the light-emitting unit to emit light.
- a silicone sleeve 150 can be provided on the outer surface or upper surface of the second shielding cover 112 for sealing, and the silicone sleeve 150 can expose the light emitted by the light-emitting unit 141.
- the silicone sleeve 150 may also be provided between the second shielding cover 142 and the back cover 300 of the electronic device (such as a mobile phone), considering that the back cover 300 and the second shield The cover 142 is made of hard material, and the two directly abut against each other, there will be a gap, while the silicone sleeve 150 is relatively soft.
- the silicone sleeve 150 can play a role of sealing between the back cover 300 and the second shielding cover 142, and at the same time It also has the function of dustproof and waterproof.
- the silicone sleeve 150 may have a fifth opening 152 to expose the light emitted by the light-emitting unit 141, and the part of the back cover 300 corresponding to the light-emitting position of the light-emitting unit 141 is usually transparent Material, such as glass, so that while the light emitted by the light-emitting unit 141 can be exposed, there is no gap between the back cover 300, the silicone sleeve 150 and the second shielding cover 142, which is dust-proof and waterproof to protect the light-emitting unit.
- the silicone sleeve 150 can be pasted on the upper surface of the second shielding cover 142 and/or the surface of the back cover 300 by double-sided tape, or directly abuts against the surface of the back cover 300, the embodiment of the present application is not limited to this.
- the size and shape of the fourth opening 144 and the fifth opening 152 can be set according to actual applications, and the shape and size of the fourth opening 144 and the fifth opening 152 can be the same or different.
- the shapes of the fourth opening 144 and the fifth opening 152 may both be set to be rectangular, or the size of the fifth opening 152 may be set to be larger than that of the fourth opening 144.
- the driving unit 111 and the light-emitting unit 141 can be arranged in alignment, that is, the driving unit 111 is arranged directly below the light-emitting unit 141, so that the Tx module 100 can be reduced as much as possible.
- the thickness further reduces the volume of the Tx module 100, but in this way, the heat of the driving unit 111 and the light-emitting unit 141 is relatively concentrated, which is not conducive to heat dissipation.
- the driving unit 111 and the light-emitting unit 141 can also be staggered, that is, the driving unit 111 is arranged obliquely below the light-emitting unit 141.
- the thickness of the Tx module 100 cannot be minimized, but it can facilitate the heat dissipation of the driving unit 111 and the light emitting unit 141, so that the heat dissipation of the two is relatively dispersed.
- the driving unit 111 and the light-emitting unit 141 are respectively arranged on the surface of the upper and lower rigid circuit boards at one end of the flexible and hard combined board 120, and the electrical and signal communication between the two rigid circuit boards is realized through FPC.
- the distance of the communication line between the driving unit 111 and the light-emitting unit 141 is the distance between the two in the vertical direction
- the distance can be shortened to less than 1 mm, which can greatly reduce the parasitic inductance on the communication line between the driving unit 111 and the light-emitting unit 141, thereby improving the overall performance of the driving unit 111 and the light-emitting unit 141.
- the distance of the communication line between the driving unit 111 and the light emitting unit 141 depends on the horizontal interval between the two
- the distance between the driving unit 111 and the light-emitting unit 141 should not be too close; for another example, for a solution where the driving unit 111 is arranged on the fourth rigid circuit board 124, the driving unit 111 and the light-emitting unit
- the distance of the communication line between 141 increases from one end of the U-shaped FPC 125 where the drive unit 111 is located to the other end of the U-shaped FPC 125 where the light-emitting unit 141 is located, and the communication distance between the drive unit 111 and the light-emitting unit 141 increases. This will significantly increase the parasitic inductance, that is, reduce the overall performance of the driving unit 111 and the light-emitting unit 141.
- a heat sink 130 is arranged between the fourth rigid circuit board 124 to continue to transfer the heat transmitted through the thermally conductive gel 113 to the outside. Compared with no heat sink 130, only the air on the outer surface of the first shielding cover 112 is used for heat dissipation.
- the good heat dissipation function of the main board 200 can also be fully utilized to conduct heat from the upper driving component 110 and the light emitting component 140 to the main board 200 to achieve a good heat dissipation function.
- the heat dissipating device 130 in the embodiment of the present application may include a thermally conductive copper sheet 134, or may also be other good thermal conductor devices. With its heat conduction and heat equalization effects, it can quickly conduct heat from a small area of the chip to a large area. On the heat sink 130, it is conducted to the rigid circuit board below, and then to the peripheral space such as the main board 200 or the middle frame to achieve rapid heat dissipation and cooling effects.
- one surface of the thermally conductive copper sheet 134 of the embodiment of the present application may be bonded to the first shielding cover 112 through a thermally conductive adhesive 133; and/or, the thermally conductive copper sheet 134
- the other surface of the fourth rigid circuit board 124 can be attached to the upper surface of the fourth rigid circuit board 124 through another thermally conductive adhesive 135.
- the Tx module of the embodiment of the present application includes a light-emitting component and a driving component.
- a thermally conductive gel between the driving unit included in the driving component and the shielding cover, the heat of the chip is mainly conducted through the thermally conductive gel to the shield.
- the shielding cover is then conducted to the radiator, the motherboard or the back cover of the electronic device, and then makes full use of the good heat dissipation function of the motherboard or the back cover to achieve rapid heat dissipation and cooling effects.
- the disclosed system, device, and method can be implemented in other ways.
- the device embodiments described above are only illustrative.
- the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components may be combined or It can be integrated into another system, or some features can be ignored or not implemented.
- the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical, mechanical or other forms.
- the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments.
- the functional units in the various embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit.
- the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium.
- the technical solution of the present application essentially or the part that contributes to the existing technology or the part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including Several instructions are used to make a computer device (which may be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the methods described in the various embodiments of the present application.
- the aforementioned storage media include: U disk, mobile hard disk, read-only memory (read-only memory, ROM), random access memory (random access memory, RAM), magnetic disks or optical disks and other media that can store program codes. .
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Abstract
A time-of-flight (TOF) transmission module, a time-of-flight measurement device, and an electronic device, capable of improving the heat dissipation efficiency of the TOF transmission module. The TOF transmission module comprises: a light-emitting component; and a driving component (110) comprising a drive unit (111), a first shield (112) and a heat-conductive gel (113). The drive unit (111) is used for driving light emission by the light-emitting component, said drive unit (111) being located within the first shield (112). The heat-conductive gel (113) is filled in between the drive unit (111) and the first shield (112) so that heat produced by the drive unit (111) can be conveyed by said heat-conductive gel (113) to the exterior of said first shield (112).
Description
本申请涉及电子产品技术领域,尤其涉及飞行时间发射模组、飞行时间检测装置和电子设备。This application relates to the technical field of electronic products, in particular to a time-of-flight transmitting module, a time-of-flight detection device, and electronic equipment.
随着科学技术的发展,越来越多的具有成像功能的电子设备被广泛的应用于人们的日常生活以及工作当中,为人们的日常生活以及工作带来了巨大的便利,成为当今人们不可或缺的重要工具。With the development of science and technology, more and more electronic devices with imaging functions are widely used in people’s daily life and work, bringing great convenience to people’s daily life and work, and becoming indispensable for people today. Important tools that are missing.
飞行时间(Time of flight,TOF)摄像模组是一种常用的深度摄像机模组,可以用于测量景深(深度)或距离信息,能够实现电子设备对目标的三维成像或距离检测功能。TOF摄像模组一般包括光信号发射(Tx)模块以及光信号接收(Rx)模块。The Time of Flight (TOF) camera module is a commonly used depth camera module that can be used to measure depth of field (depth) or distance information, and can realize the function of three-dimensional imaging or distance detection of the target by the electronic device. The TOF camera module generally includes an optical signal transmitting (Tx) module and an optical signal receiving (Rx) module.
目前,芯片散热一般采用在芯片表面增加导热垫的方式,散热有更高要求的会在导热垫上方再增加诸如导热铜片之类的散热器进行辅助散热,这种散热解决方案在芯片面积大,对设备体积不敏感的应用场景是比较合适的,然而对于TOF模组中的光发射模块(模组)而言,其所包含的发光芯片和驱动发光芯片的驱动芯片都是面积很小但发热量很大的元器件,因此前面所述的散热解决方案不能满足TOF模组对散热的要求,或者说会使得散热效率低而无法满足产品对散热的需求。At present, chip heat dissipation generally adopts the method of adding a thermal pad on the surface of the chip. If heat dissipation has higher requirements, a heat sink such as a thermal conductive copper sheet will be added above the thermal pad for auxiliary heat dissipation. This kind of heat dissipation solution has a large chip area. , The application scenarios that are not sensitive to the volume of the device are more suitable. However, for the light emitting module (module) in the TOF module, the light-emitting chip and the driving chip that drive the light-emitting chip are all small in area. Components that generate a lot of heat, so the heat dissipation solutions described above cannot meet the heat dissipation requirements of the TOF module, or it will make the heat dissipation efficiency low and fail to meet the product's heat dissipation requirements.
发明内容Summary of the invention
本申请提供了一种TOF发射模组、TOF检测装置和电子设备,能够提高TOF发射模组的散热效率。The present application provides a TOF emission module, a TOF detection device and electronic equipment, which can improve the heat dissipation efficiency of the TOF emission module.
第一方面,提供了一种电子设备中的TOF发射模组,该TOF发射模组包括:发光组件;驱动组件,包括驱动单元、第一屏蔽罩和导热凝胶,所述驱动单元用于驱动所述发光组件发光,所述驱动单元位于所述第一屏蔽罩内,所述导热凝胶填充在所述驱动单元与所述第一屏蔽罩之间。In a first aspect, a TOF emission module in an electronic device is provided. The TOF emission module includes: a light-emitting assembly; The light-emitting component emits light, the driving unit is located in the first shielding cover, and the thermally conductive gel is filled between the driving unit and the first shielding cover.
因此,本申请实施例的TOF发射模组,通过在驱动单元与屏蔽罩之间注入导热凝胶的方法,可以规避普通导热垫无法过回流焊的工艺难题,可以 在屏蔽罩过回流焊焊接后,通过屏蔽罩预留孔注入导热凝胶,通过该导热凝胶能够快速将热量传导到外部空间,实现驱动芯片快速降温,解决了驱动芯片和屏蔽罩之间空气层阻挡散热的问题,提高芯片的散热效率。Therefore, in the TOF transmitter module of the embodiment of the present application, by injecting a thermally conductive gel between the drive unit and the shielding cover, the process problem that ordinary thermal pads cannot pass reflow soldering can be avoided, and the shielding cover can be soldered after reflow soldering , Inject the thermal gel through the reserved holes of the shielding cover, through the thermal conductive gel can quickly conduct heat to the external space, realize the rapid cooling of the drive chip, solve the problem of the air layer between the drive chip and the shielding cover blocking heat dissipation, and improve the chip The heat dissipation efficiency.
结合第一方面,在第一方面的一种实现方式中,所述第一屏蔽罩具有第一开孔,以通过所述第一开孔注入所述导热凝胶。With reference to the first aspect, in an implementation of the first aspect, the first shielding cover has a first opening for injecting the thermally conductive gel through the first opening.
结合第一方面及其上述实现方式,在第一方面的另一种实现方式中,所述第一开孔位于所述第一屏蔽罩的与所述驱动单元相对的表面。With reference to the first aspect and the foregoing implementation manners of the first aspect, in another implementation manner of the first aspect, the first opening is located on a surface of the first shielding cover opposite to the driving unit.
结合第一方面及其上述实现方式,在第一方面的另一种实现方式中,所述TOF发射模组还包括:电路板,用于固定所述发光组件和所述驱动组件,所述发光组件与所述驱动组件之间通过所述电路板电连接。With reference to the first aspect and the foregoing implementation manners of the first aspect, in another implementation manner of the first aspect, the TOF emission module further includes: a circuit board for fixing the light-emitting component and the driving component, and the light-emitting component The component and the driving component are electrically connected through the circuit board.
结合第一方面及其上述实现方式,在第一方面的另一种实现方式中,所述发光组件与所述驱动单元分别固定在所述电路板的第一表面,所述电路板的第二表面与所述电子设备的主板通过贴片的方式电连接。With reference to the first aspect and the foregoing implementation manners, in another implementation manner of the first aspect, the light-emitting assembly and the driving unit are respectively fixed on the first surface of the circuit board, and the second The surface is electrically connected to the main board of the electronic device through a patch.
结合第一方面及其上述实现方式,在第一方面的另一种实现方式中,所述TOF发射模组还包括:散热器件,设置在所述第一屏蔽罩的外表面与所述电子设备的后盖之间。In combination with the first aspect and the foregoing implementation manners, in another implementation manner of the first aspect, the TOF transmitter module further includes: a heat dissipating device disposed on the outer surface of the first shielding cover and the electronic device Between the back cover.
结合第一方面及其上述实现方式,在第一方面的另一种实现方式中,所述散热器件包括导热垫和/或散热铜片。In combination with the first aspect and the foregoing implementation manners thereof, in another implementation manner of the first aspect, the heat dissipating device includes a thermal pad and/or a heat dissipation copper sheet.
结合第一方面及其上述实现方式,在第一方面的另一种实现方式中,所述发光组件包括:发光单元,所述发光单元位于所述第一屏蔽罩内,所述发光单元与所述第一表面电连接,所述发光单元上方的所述第一屏蔽罩具有第二开孔,以露出所述发光单元发出的光。With reference to the first aspect and the foregoing implementation manners, in another implementation manner of the first aspect, the light-emitting assembly includes: a light-emitting unit, the light-emitting unit is located in the first shielding cover, the light-emitting unit and the The first surface is electrically connected, and the first shielding cover above the light-emitting unit has a second opening to expose the light emitted by the light-emitting unit.
结合第一方面及其上述实现方式,在第一方面的另一种实现方式中,所述发光单元上方的所述第一屏蔽罩与所述电子设备的后盖之间设置有硅胶套,所述硅胶套具有第三开孔,以露出所述发光单元发出的光。In combination with the first aspect and the foregoing implementation manners of the first aspect, in another implementation manner of the first aspect, a silicone sleeve is provided between the first shielding cover above the light-emitting unit and the back cover of the electronic device, so The silicone sleeve has a third opening to expose the light emitted by the light-emitting unit.
结合第一方面及其上述实现方式,在第一方面的另一种实现方式中,所述电路板为软硬结合板,所述软硬结合板包括:第一硬性电路板、第二硬性电路板、第三硬性电路板和U型柔性电路板,所述第一硬性电路板和所述第二硬性电路板分别设置在所述U型柔性电路板一端的上下表面,所述第三硬性电路板设置在所述U型柔性电路板另一端的下表面,U型柔性电路板用于电连接所述第一硬性电路板、所述第二硬性电路板和所述第三硬性电路板; 所述发光组件设置于所述第一硬性电路板的上方,且与所述第一硬性电路板电连接;所述驱动组件设置于所述第二硬性电路板的下方,且所述驱动单元与所述第二硬性电路板电连接,以用于驱动所述发光组件发光;所述第三硬性电路板通过贴片的方式与所述电子设备的主板电连接。With reference to the first aspect and the foregoing implementation manners of the first aspect, in another implementation manner of the first aspect, the circuit board is a rigid-flex board, and the rigid-flex board includes: a first rigid circuit board and a second rigid circuit Board, a third rigid circuit board and a U-shaped flexible circuit board, the first rigid circuit board and the second rigid circuit board are respectively arranged on the upper and lower surfaces of one end of the U-shaped flexible circuit board, and the third rigid circuit The board is arranged on the lower surface of the other end of the U-shaped flexible circuit board, and the U-shaped flexible circuit board is used to electrically connect the first rigid circuit board, the second rigid circuit board and the third rigid circuit board; The light emitting component is arranged above the first rigid circuit board and is electrically connected to the first rigid circuit board; the driving component is arranged below the second rigid circuit board, and the driving unit is connected to the first rigid circuit board. The second rigid circuit board is electrically connected to drive the light-emitting component to emit light; the third rigid circuit board is electrically connected to the main board of the electronic device by means of a patch.
结合第一方面及其上述实现方式,在第一方面的另一种实现方式中,所述软硬结合板还包括第四硬性电路板,所述第四硬性电路板设置在所述U型柔性电路板另一端的上表面,所述TOF发射模组还包括:散热器件,位于所述第一屏蔽罩与所述第四硬性电路板之间。With reference to the first aspect and the foregoing implementation manners of the first aspect, in another implementation manner of the first aspect, the rigid-flex board further includes a fourth rigid circuit board, and the fourth rigid circuit board is disposed on the U-shaped flexible circuit board. On the upper surface of the other end of the circuit board, the TOF transmitter module further includes: a heat sink device located between the first shielding cover and the fourth rigid circuit board.
结合第一方面及其上述实现方式,在第一方面的另一种实现方式中,所述散热器件包括导热铜片。In combination with the first aspect and the foregoing implementation manners, in another implementation manner of the first aspect, the heat sink device includes a thermally conductive copper sheet.
结合第一方面及其上述实现方式,在第一方面的另一种实现方式中,所述导热铜片的一个表面通过导热背胶与所述第一屏蔽罩贴合;和/或,所述导热铜片的另一个表面通过另一导热背胶与所述第四硬性电路板的表面贴合。In combination with the first aspect and the foregoing implementation manners of the first aspect, in another implementation manner of the first aspect, one surface of the thermally conductive copper sheet is attached to the first shielding cover through a thermally conductive adhesive; and/or, the The other surface of the thermally conductive copper sheet is attached to the surface of the fourth rigid circuit board through another thermally conductive adhesive.
结合第一方面及其上述实现方式,在第一方面的另一种实现方式中,所述发光组件包括:发光单元和第二屏蔽罩,所述发光单元位于所述第二屏蔽罩内,所述发光单元与所述第一硬性电路板电连接,所述第二屏蔽罩具有第四开孔,以露出所述发光单元发出的光。In combination with the first aspect and the foregoing implementation manners of the first aspect, in another implementation manner of the first aspect, the light-emitting assembly includes: a light-emitting unit and a second shielding cover, the light-emitting unit is located in the second shielding cover, so The light emitting unit is electrically connected to the first rigid circuit board, and the second shielding cover has a fourth opening to expose the light emitted by the light emitting unit.
结合第一方面及其上述实现方式,在第一方面的另一种实现方式中,所述驱动组件还包括:辅助器件,用于辅助所述驱动单元产生用于驱动发光组件的驱动信号。With reference to the first aspect and the foregoing implementation manners of the first aspect, in another implementation manner of the first aspect, the driving component further includes: an auxiliary device for assisting the driving unit to generate a driving signal for driving the light-emitting component.
第二方面,提供了一种电子设备中的TOF检测装置,该TOF检测装置包括:上述第一方面或第一方面的任意可能的实现方式中的TOF发射模组,和TOF接收模组,其中,所述TOF发射模组用于发射光信号,所述TOF接收模组用于接收由所述光信号照射物体后的返回光信号。In a second aspect, a TOF detection device in an electronic device is provided. The TOF detection device includes: the TOF transmitting module in the first aspect or any possible implementation of the first aspect, and the TOF receiving module, wherein The TOF transmitting module is used for transmitting optical signals, and the TOF receiving module is used for receiving the return optical signals after the object is illuminated by the optical signals.
结合第二方面,在第二方面的一种实现方式中,所述TOF接收模组通过板对板连接器BTB与所述电子设备的主板电连接。With reference to the second aspect, in an implementation of the second aspect, the TOF receiving module is electrically connected to the main board of the electronic device through a board-to-board connector BTB.
第三方面,提供了一种电子设备,该电子设备包括:上述第一方面或第一方面的任意可能的实现方式中的TOF发射模组;以及主板,所述TOF发射模组与所述主板电连接。In a third aspect, an electronic device is provided, which includes: the TOF transmitting module in the first aspect or any possible implementation of the first aspect; and a main board, the TOF transmitting module and the main board Electric connection.
结合第三方面,在第三方面的一种实现方式中,所述电子设备还包括:硅胶套,设置在所述TOF发射模组与所述电子设备的后盖之间,所述硅胶 套具有第五开孔,以露出所述发光单元发出的光。With reference to the third aspect, in an implementation of the third aspect, the electronic device further includes: a silicone sleeve disposed between the TOF transmitter module and the back cover of the electronic device, the silicone sleeve having The fifth opening is to expose the light emitted by the light-emitting unit.
图1是根据本申请实施例的TOF发射模组的部分剖视图。Fig. 1 is a partial cross-sectional view of a TOF transmitting module according to an embodiment of the present application.
图2是根据本申请实施例的另一TOF发射模组的剖视图。Fig. 2 is a cross-sectional view of another TOF transmitting module according to an embodiment of the present application.
图3是图2示出的TOF发射模组的立体分解示意图。FIG. 3 is a three-dimensional exploded schematic diagram of the TOF transmitter module shown in FIG. 2.
图4是根据本申请实施例的再一TOF发射模组的剖视图。FIG. 4 is a cross-sectional view of still another TOF transmitting module according to an embodiment of the present application.
图5是图4示出的TOF发射模组的立体分解示意图。FIG. 5 is a three-dimensional exploded schematic diagram of the TOF transmitting module shown in FIG. 4.
下面将结合附图,对本申请实施例中的技术方案进行描述。The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings.
图1示出了本申请实施例的TOF发射模组100的部分剖视图。具体地,如图1所示,对于任意包括TOF检测装置的电子设备,该TOF检测装置可以包括TOF发射模组(或者称为Tx模组)和TOF接收模组(或者称为Rx模组),其中,该Tx模组用于发射光信号,该光信号照射到物体后产生返回光信号,该物体可以指待拍摄对象(或称拍摄目标、成像目标、检测目标);而Rx模组用于接收该返回光信号,或者说Rx模组用于感应返回的光信号,该返回光信号中携带有待拍摄对象的景深信息,从而能够实现电子设备对该待拍摄物体的成像功能。本申请实施例下面主要针对Tx模组进行介绍。FIG. 1 shows a partial cross-sectional view of a TOF transmitter module 100 according to an embodiment of the present application. Specifically, as shown in FIG. 1, for any electronic device that includes a TOF detection device, the TOF detection device may include a TOF transmitting module (or Tx module) and a TOF receiving module (or Rx module) , Wherein, the Tx module is used to emit a light signal, and the light signal irradiates an object to generate a return light signal. The object can refer to the object to be photographed (or called the shooting target, the imaging target, the detection target); and the Rx module is used To receive the return light signal, or the Rx module is used to sense the return light signal, and the return light signal carries the depth information of the object to be photographed, so that the electronic device can realize the imaging function of the object to be photographed. The following embodiments of the application mainly focus on the Tx module.
可选地,本申请实施例的电子设备可以为:手机、平板电脑、笔记本电脑、台式机电脑、车载电子设备、医疗、航空等任意有TOF功能需求的电子设备。Optionally, the electronic device in the embodiment of the present application may be any electronic device with TOF function requirements, such as a mobile phone, a tablet computer, a notebook computer, a desktop computer, an in-vehicle electronic device, medical treatment, and aviation.
TOF检测装置一般包括合体设计和分体设计。对于合体设计,通常通过BTB连接器实现Tx模组与Rx模组组成的整体TOF模组和电子设备的主板通讯,虽然这种组装方式便于将TOF检测装置整体安装到电子设备,但是这种Rx模组和Tx模组合体形式不利于维护,任何一个损坏都会导致整个TOF模组报废,后期维护成本高。相反的,采用Rx模组和Tx模组分体设计来分别实现Rx模组和Tx模组的功能,比较灵活,同时还能克服Tx模组面临的散热、寄生电感、大批量生产良率、成本等问题,例如,Rx模组和Tx模组分体设计有利于分体散热,能降低大批量生产和维护成本。本申请实施例中的Tx模组100可以指合体设计或者分体设计中的Tx模组,本申请 实施例并不限于此。TOF testing devices generally include a combined design and a separate design. For the integrated design, the communication between the integrated TOF module composed of the Tx module and the Rx module and the main board of the electronic device is usually realized through the BTB connector. Although this assembly method is convenient to install the TOF detection device as a whole to the electronic device, this kind of Rx The combined form of the module and the Tx module is not conducive to maintenance. Any damage will cause the entire TOF module to be scrapped, and subsequent maintenance costs are high. On the contrary, adopting Rx module and Tx module group design to realize the functions of Rx module and Tx module respectively, which is more flexible and can overcome the heat dissipation, parasitic inductance, mass production yield, Cost and other issues, for example, Rx module and Tx module group design is conducive to split heat dissipation, can reduce mass production and maintenance costs. The Tx module 100 in the embodiment of the present application may refer to a Tx module in a combined design or a separate design, and the embodiment of the present application is not limited thereto.
在本申请实施例中,如图1所示,该Tx模组100包括:发光组件(图1中未示出)和驱动组件110。具体地,发光组件用于发射TOF检测所需的光;驱动组件110包括驱动单元111、第一屏蔽罩112和导热凝胶113,该驱动单元111用于驱动该发光组件发光,该驱动单元111位于该第一屏蔽罩112内,该导热凝胶113填充在该驱动单元111与该第一屏蔽罩112之间,以使得该导热凝胶113能够将该驱动单元111产生的热量传导至该第一屏蔽罩112之外。In the embodiment of the present application, as shown in FIG. 1, the Tx module 100 includes a light-emitting component (not shown in FIG. 1) and a driving component 110. Specifically, the light emitting component is used to emit light required for TOF detection; the driving component 110 includes a driving unit 111, a first shielding cover 112, and a thermally conductive gel 113. The driving unit 111 is used to drive the light emitting component to emit light, and the driving unit 111 Located in the first shielding cover 112, the thermally conductive gel 113 is filled between the driving unit 111 and the first shielding cover 112, so that the thermally conductive gel 113 can conduct the heat generated by the driving unit 111 to the second A shield 112 outside.
可选地,如图1所示,导热凝胶113在工艺上可以采用针头从第一屏蔽罩112上的预留孔内注入,利用凝胶流动特性填充到驱动单元111上表面与第一屏蔽罩112之间,或者利用凝胶流动性充满第一屏蔽罩112内部空间,即可以通过在该第一屏蔽罩112上设置第一开孔114,以通过该第一开孔114注入该导热凝胶113。Optionally, as shown in FIG. 1, the thermally conductive gel 113 can be injected from the reserved hole on the first shielding cover 112 by using a needle in the process, and the gel flow characteristic is used to fill the upper surface of the driving unit 111 and the first shielding cover. The space between the covers 112, or the fluidity of the gel is used to fill the inner space of the first shielding cover 112, that is, the first opening 114 can be provided on the first shielding cover 112 to inject the thermally conductive condensation through the first opening 114.胶 113.
可选地,该导热凝胶113可以位于驱动单元111的上表面与第一屏蔽罩112之间,例如,如图1所示,可以通过在第一屏蔽罩112的顶部设置第一开孔114,也就是在第一屏蔽罩112的与驱动单元111相对的表面设置第一开孔114,通过该第一开孔114注入导热凝胶,使得该导热凝胶113填充在驱动单元111的上表面与第一屏蔽罩112之间。或者还可以进一步将导热凝胶113填充在驱动单元111侧面与第一屏蔽罩112之间,例如,可以如图1所示,同样在第一屏蔽罩112的顶部设置第一开孔114,但与图1不同的是,可以利用凝胶流动特性,使得导热凝胶113填满驱动单元111与第一屏蔽罩112之间的全部上面和侧面空隙;或者,也可以在第一屏蔽罩112的其它位置开孔,例如在第一屏蔽罩112的侧壁开孔,利用凝胶流动特性,使得导热凝胶113填满驱动单元111与第一屏蔽罩112之间全部空隙,但本申请实施例并不限于此。Optionally, the thermally conductive gel 113 may be located between the upper surface of the driving unit 111 and the first shielding cover 112. For example, as shown in FIG. 1, a first opening 114 may be provided on the top of the first shielding cover 112. , That is, a first opening 114 is provided on the surface of the first shielding cover 112 opposite to the driving unit 111, and the thermally conductive gel is injected through the first opening 114, so that the thermally conductive gel 113 is filled on the upper surface of the driving unit 111 Between and the first shield 112. Alternatively, the thermally conductive gel 113 can be further filled between the side of the driving unit 111 and the first shielding cover 112. For example, as shown in FIG. 1, a first opening 114 is also provided on the top of the first shielding cover 112, but The difference from FIG. 1 is that the flow characteristics of the gel can be used to make the thermally conductive gel 113 fill all the upper and side gaps between the driving unit 111 and the first shielding cover 112; or, it can also be in the first shielding cover 112. Holes are opened in other positions, for example, holes are opened on the side wall of the first shielding cover 112, and the flow characteristics of the gel are used to make the thermally conductive gel 113 fill up all the gaps between the driving unit 111 and the first shielding cover 112. However, the embodiment of the present application It is not limited to this.
考虑到Tx模组上的驱动单元111的热量很集中,器件很小无法直接加散热器,而且为了屏蔽外部其他元器件产生的电磁干扰,驱动单元111通常需要设置屏蔽罩,采用导热垫散热又存在导热垫无法过回流焊的技术问题(如果采用导热垫散热方案的话,需要先将导热垫贴到驱动芯片上,再将屏蔽罩过回流焊焊接在驱动芯片上方,但过回流焊焊接过程温度过高,会使得导热垫在厚度方向上膨胀,从而导致屏蔽罩无法焊接到驱动芯片上),因此 目前市场上Tx模组的驱动单元与屏蔽罩之间一般采用留空处理,通过空气散热达到最低散热要求,但在这样的散热结构下,会对系统的其他参数进行更多的平衡,比如会考虑将驱动单元的发光功率限制在某个量之下(也就是发光功率的设计受限于模组散热情况),而发光功率会影响到系统的检测范围(检测距离),所以散热问题也是影响目前TOF检测或识别系统在更大检测距离的场景中应用的原因之一。而本案创造性的采用在驱动单元111与第一屏蔽罩112之间注入导热凝胶的方法,可以规避普通导热垫无法过回流焊的工艺难题,可以在屏蔽罩过回流焊焊接后,通过屏蔽罩预留孔注入导热凝胶,该导热凝胶能够填充驱动单元111与第一屏蔽罩112之间,使得驱动单元111与第一屏蔽罩112之间不存在空气间隙,通过该导热凝胶能够快速将热量传导到外部空间,实现驱动芯片快速降温,解决了驱动芯片和屏蔽罩之间空气层阻挡散热的问题,提高芯片的散热效率。进一步的也可以提升系统设计的灵活性,可以适用于更多不同检测距离要求的系统。Considering that the heat of the drive unit 111 on the Tx module is very concentrated, the device is small and cannot be directly added with a heat sink, and in order to shield the electromagnetic interference generated by other external components, the drive unit 111 usually needs to be equipped with a shielding cover, and a thermal pad is used to dissipate heat. There is a technical problem that the thermal pad cannot pass reflow soldering (if the thermal pad heat dissipation solution is adopted, the thermal pad needs to be attached to the driver chip first, and then the shielding cover is soldered on top of the driver chip by reflow soldering, but the temperature of the reflow soldering process Too high will cause the thermal pad to expand in the thickness direction, and the shielding cover cannot be welded to the drive chip). Therefore, currently the driver unit of the Tx module on the market and the shielding cover are generally left blank, and the heat dissipation is achieved through air. Minimum heat dissipation requirements, but with such a heat dissipation structure, other parameters of the system will be more balanced. For example, consideration will be given to limiting the luminous power of the drive unit to a certain amount (that is, the design of luminous power is limited by The heat dissipation of the module), and the luminous power will affect the detection range (detection distance) of the system, so the heat dissipation problem is also one of the reasons that affect the current TOF detection or recognition system in scenarios with larger detection distances. However, this case creatively adopts the method of injecting thermally conductive gel between the driving unit 111 and the first shielding cover 112, which can avoid the process problem that the ordinary thermal pad cannot pass the reflow soldering. The reserved holes are filled with thermally conductive gel. The thermally conductive gel can fill between the driving unit 111 and the first shielding cover 112, so that there is no air gap between the driving unit 111 and the first shielding cover 112, and the thermally conductive gel can quickly Conduct heat to the external space to achieve rapid cooling of the drive chip, solve the problem of heat dissipation blocked by the air layer between the drive chip and the shield, and improve the heat dissipation efficiency of the chip. Furthermore, the flexibility of system design can be improved, and it can be applied to more systems with different detection distance requirements.
另外,为了进一步提高散热效率,如图1所示,还可以在第一屏蔽罩112之外设置散热器件130,例如,在第一屏蔽罩112的外表面设置散热器件130。例如,该散热器件130可以包括导热垫和/或散热铜片。这样,在第一屏蔽罩112外设置散热器件130,可以实现热量通过导热凝胶再经过散热器件向外传输,相比于不设置散热器130,只靠第一屏蔽罩112上表面的空气进行散热的情况,有利于提升散热速度;并且,驱动单元111发出的小面积的集中热量经过导热凝胶再经过大面积的散热器件,可以进一步加大散热面积。In addition, in order to further improve the heat dissipation efficiency, as shown in FIG. 1, a heat sink 130 may be provided outside the first shielding cover 112, for example, a heat sink 130 may be provided on the outer surface of the first shielding cover 112. For example, the heat dissipating device 130 may include a thermal pad and/or a heat dissipation copper sheet. In this way, arranging the heat sink 130 outside the first shielding cover 112 can realize the heat transfer through the heat-conducting gel and then through the heat sinking device. Compared with not providing the heat sink 130, it only depends on the air on the upper surface of the first shielding cover 112. The heat dissipation is beneficial to increase the heat dissipation speed; and the small area of concentrated heat emitted by the drive unit 111 passes through the thermally conductive gel and then passes through the large area heat sink, which can further increase the heat dissipation area.
在本申请实施例中,如图1所示,该TOF发射模组100还可以包括:电路板120,用于固定发光组件和驱动组件110,并且该发光组件与该驱动组件110之间可以通过该电路板120实现电连接。可选地,该发光组件与驱动组件110可以分别设置于电路板120的不同位置,下面将结合不同的电路板120的实施例,进行详细描述。In the embodiment of the present application, as shown in FIG. 1, the TOF emission module 100 may further include: a circuit board 120 for fixing the light-emitting component and the driving component 110, and the light-emitting component and the driving component 110 can pass through The circuit board 120 realizes electrical connection. Optionally, the light-emitting component and the driving component 110 may be respectively disposed at different positions of the circuit board 120. The following will describe in detail in combination with different embodiments of the circuit board 120.
可选地,作为一种实施例,可以将发光组件与驱动组件110设置在该电路板120的同一侧。例如,图2示出了本申请实施例的TOF发射模组100的另一剖视图,图3为图2所示的TOF发射模组100的立体分解图,其中,图1仅示出了Tx模组100的一部分,而图2和图3可以为该Tx模组100的一种可能的形态,将图3所示的TOF发射模组组装之后,图2所示的剖视图是沿图3虚线AB所示的方向、从上至下切割形成的截面图。如图2或 者图3所示,该电路板120包括上下两个表面,这里分别称为第一表面和第二表面,其中,该发光组件与该驱动单元111分别固定在该电路板120的第一表面,也就是该发光组件与驱动单元111通过第一表面的导电器件实现电连接;而该电路板120的第二表面与所在电子设备的主板200电连接,例如,第二表面与主板200之间可以通过贴片的方式电连接。Optionally, as an embodiment, the light-emitting component and the driving component 110 may be arranged on the same side of the circuit board 120. For example, FIG. 2 shows another cross-sectional view of the TOF transmitter module 100 according to an embodiment of the present application, and FIG. 3 is a three-dimensional exploded view of the TOF transmitter module 100 shown in FIG. 2, wherein FIG. 1 only shows the Tx module 2 and 3 may be a possible form of the Tx module 100. After the TOF transmitter module shown in FIG. 3 is assembled, the cross-sectional view shown in FIG. 2 is along the dashed line AB in FIG. 3 A cross-sectional view cut from top to bottom in the direction shown. As shown in FIG. 2 or FIG. 3, the circuit board 120 includes two upper and lower surfaces, which are referred to herein as a first surface and a second surface, respectively. Among them, the light-emitting assembly and the driving unit 111 are respectively fixed on the first surface of the circuit board 120. One surface, that is, the light-emitting assembly and the driving unit 111 are electrically connected through the conductive devices on the first surface; and the second surface of the circuit board 120 is electrically connected to the main board 200 of the electronic device, for example, the second surface is connected to the main board 200 They can be electrically connected by means of patches.
应理解,本申请中的发光组件可以具体包括发光单元141以及第二屏蔽罩,发光单元141设置在该第二屏蔽罩内,该第二屏蔽罩可以屏蔽外部其他元器件产生的电磁干扰,避免对发光单元141的影响。在如图2或者图3所示的实施例中,由于可以将驱动单元111与发光组件设置在电路板120的同一侧,也就是可以将驱动单元111和发光单元141设置在电路板120的第一表面,此时,该发光单元141可以与驱动单元111可以位于同一屏蔽罩内,也就是驱动组件110与发光组件共用一个屏蔽罩,比如,将发光单元141也设置在第一屏蔽罩112之内,即令第一屏蔽罩与第二屏蔽罩为同一个屏蔽罩,这样可以节省空间。此时,如图2所示,可以将该第一屏蔽罩112看作位于左右两侧的两个部分,左侧对应设置驱动单元111与导热凝胶113,右侧对应设置发光单元141。It should be understood that the light-emitting assembly in this application may specifically include a light-emitting unit 141 and a second shielding cover. The light-emitting unit 141 is disposed in the second shielding cover. The second shielding cover can shield electromagnetic interference generated by other external components and avoid Impact on the light-emitting unit 141. In the embodiment shown in FIG. 2 or FIG. 3, since the driving unit 111 and the light-emitting assembly can be arranged on the same side of the circuit board 120, that is, the driving unit 111 and the light-emitting unit 141 can be arranged on the second side of the circuit board 120. At this time, the light-emitting unit 141 and the driving unit 111 can be located in the same shielding cover, that is, the driving assembly 110 and the light-emitting assembly share a shielding cover. For example, the light-emitting unit 141 is also disposed in the first shielding cover 112. Inside, even if the first shielding case and the second shielding case are the same shielding case, space can be saved. At this time, as shown in FIG. 2, the first shielding cover 112 can be regarded as two parts on the left and right sides, the driving unit 111 and the thermally conductive gel 113 are arranged on the left side, and the light-emitting unit 141 is arranged on the right side.
具体地,该发光单元141位于该第一屏蔽罩112内,该发光单元141与电路板120的第一表面电连接,该发光单元141用于发光;该第一屏蔽罩112对应于发光单元141的部分可以具有开孔,这里称为第二开孔143,该第二开孔143用于露出该发光单元141发出的光;或者,在第一屏蔽罩112的对应发光单元141的发光位置处,设置透明材料,以使得该发光单元141发出的光能发射出去到达检测对象或成像目标。Specifically, the light-emitting unit 141 is located in the first shielding cover 112, the light-emitting unit 141 is electrically connected to the first surface of the circuit board 120, and the light-emitting unit 141 is used for light-emitting; the first shielding cover 112 corresponds to the light-emitting unit 141 The part of may have an opening, here called a second opening 143, the second opening 143 is used to expose the light emitted by the light-emitting unit 141; or, at the light-emitting position of the first shielding cover 112 corresponding to the light-emitting unit 141 , A transparent material is provided so that the light emitted by the light-emitting unit 141 can be emitted to reach the detection object or imaging target.
可选地,在驱动单元111和发光单元141位于同一屏蔽罩的情况下,为了便于散热,可以在驱动单元111与发光单元141之间填充导热凝胶,但本申请实施例并不限于此。Optionally, when the driving unit 111 and the light emitting unit 141 are located in the same shielding cover, in order to facilitate heat dissipation, a thermally conductive gel may be filled between the driving unit 111 and the light emitting unit 141, but the embodiment of the present application is not limited thereto.
应理解,本申请实施例中的发光单元141可以用于发射不可见光,例如,该发光单元141可以为红外激光发射器,对应的,Rx模组可以包括感光传感器,该感光传感器可以为红外传感器。It should be understood that the light-emitting unit 141 in the embodiment of the present application may be used to emit invisible light. For example, the light-emitting unit 141 may be an infrared laser transmitter. Correspondingly, the Rx module may include a photosensitive sensor, and the photosensitive sensor may be an infrared sensor. .
在本申请实施例中,该发光单元141具体可以为垂直腔面发射激光器(Vertical-Cavity Surface-Emitting Laser,VCSEL),但本申请实施例并不限于此。In the embodiment of the present application, the light-emitting unit 141 may specifically be a vertical-cavity surface-emitting laser (VCSEL), but the embodiment of the present application is not limited thereto.
可选地,该发光组件还可以包括其他元件,驱动组件110也可以包括其他元件。例如,如图3所示,在该第一屏蔽罩112内还可以设置该发光组件和/或驱动组件包括的其他元件,例如电感、电容或者电阻等,用于配合或者辅助驱动单元产生驱动发光单元所需的驱动信号。Optionally, the light-emitting assembly may also include other elements, and the driving assembly 110 may also include other elements. For example, as shown in FIG. 3, the light-emitting assembly and/or other elements included in the driving assembly, such as inductors, capacitors, or resistors, may also be provided in the first shielding cover 112, for cooperating with or assisting the driving unit to generate driving light. The drive signal required by the unit.
可选地,在该第一屏蔽罩112对应于发光单元141的外表面或者说上表面,还可以设置有硅胶套150,以用于密封,并且该硅胶套150可以露出该发光单元141发出的光。例如,如图2或者图3所示,在该第一屏蔽罩112与该电子设备(比如手机)的后盖300之间还可以设置有该硅胶套150,考虑到后盖300和第一屏蔽罩112均为硬质材料,二者直接抵靠,会存在空隙,而硅胶套150相对比较软,使得该硅胶套150可以在后盖300与第一屏蔽罩112之间起到密封的作用,同时也具有防尘防水的作用。具体地,如图2或者图3所示,该硅胶套150可以具有第三开孔151,以露出该发光单元141发出的光,而后盖300中与发光单元发光位置对应部分通常为透明材料,例如玻璃,这样,在可以露出发光单元141发出的光的同时,后盖300、硅胶套150和第一屏蔽罩112三者之间没有空隙,具有防尘防水的作用,以保护发光单元141。可选地,也可以通过将硅胶套150对应发光单元141的发光位置设置透明材料,露出该发光单元141发出的光。其中,该硅胶套150可以通过双面胶粘贴在第一屏蔽罩112上表面的相应位置和/或后盖300的表面,或者直接抵靠在后盖300的表面,本申请实施例并不限于此。Optionally, the outer surface or upper surface of the first shielding cover 112 corresponding to the light-emitting unit 141 may also be provided with a silicone sleeve 150 for sealing, and the silicone sleeve 150 can expose the light emitted by the light-emitting unit 141 Light. For example, as shown in FIG. 2 or FIG. 3, the silicone sleeve 150 may also be provided between the first shielding cover 112 and the back cover 300 of the electronic device (such as a mobile phone), considering that the back cover 300 and the first shield The cover 112 is made of hard material, and the two directly abut against each other, and there will be a gap. The silicone sleeve 150 is relatively soft, so that the silicone sleeve 150 can play a role of sealing between the back cover 300 and the first shielding cover 112. At the same time, it also has the function of dustproof and waterproof. Specifically, as shown in FIG. 2 or FIG. 3, the silicone sleeve 150 may have a third opening 151 to expose the light emitted by the light-emitting unit 141, and the part of the back cover 300 corresponding to the light-emitting position of the light-emitting unit is usually made of transparent material. For example, glass, while exposing the light emitted by the light-emitting unit 141, there is no gap between the back cover 300, the silicone sleeve 150 and the first shielding cover 112, which has the function of dust and water resistance to protect the light-emitting unit 141. Optionally, it is also possible to expose the light emitted by the light-emitting unit 141 by arranging the silicone sleeve 150 corresponding to the light-emitting position of the light-emitting unit 141 with a transparent material. Wherein, the silicone sleeve 150 can be pasted on the corresponding position on the upper surface of the first shielding cover 112 and/or the surface of the back cover 300 by double-sided tape, or directly abuts against the surface of the back cover 300. The embodiment of the present application does not Limited to this.
可选地,第二开孔143和第三开孔151的尺寸和形状可以根据实际应用进行设置,并且第二开孔143和第三开孔151的形状和尺寸可以相同或者不同。例如,如图2和图3所示,第二开孔143和第三开孔151的形状可以均设置为矩形,也可以将第三开孔151的尺寸设置为大于第二开孔143。Optionally, the size and shape of the second opening 143 and the third opening 151 can be set according to actual applications, and the shape and size of the second opening 143 and the third opening 151 can be the same or different. For example, as shown in FIGS. 2 and 3, the shapes of the second opening 143 and the third opening 151 may both be set to be rectangular, or the size of the third opening 151 may be set to be larger than that of the second opening 143.
另外,对应于图1中描述的散热器件130,如图2或者图3所示,在该第一屏蔽罩112对应于驱动单元111的外表面或者说上表面,可以设置散热器件130,以将经过导热凝胶113传输的热量继续向外传输,相比于不设置散热器130,只靠第一屏蔽罩112上表面的空气进行散热的情况,有利于提升散热速度;并且,驱动单元111发出的小面积的集中热量经过导热凝胶再经过大面积的散热器件,可以进一步加大散热面积。In addition, corresponding to the heat sink 130 described in FIG. 1, as shown in FIG. 2 or FIG. The heat transferred through the thermally conductive gel 113 continues to be transferred outwards. Compared with the case where the heat sink 130 is not provided, only the air on the upper surface of the first shielding cover 112 is used for heat dissipation, which is beneficial to increase the heat dissipation speed; and the driving unit 111 sends out The small area of concentrated heat passes through the thermally conductive gel and then through the large-area heat sink, which can further increase the heat dissipation area.
具体地,如图2或者图3所示,在该第一屏蔽罩112的外表面与该电子设备的后盖300之间可以设置散热器件130,该散热器件可以包括导热垫131 和/或散热铜片132,或者也可以包括铝片等其他金属热良导体。其中,该散热器件130可以通过粘贴与后盖300之间固定,或者也可以直接抵靠在后盖300;类似的,该散热器件130与下方的第一屏蔽罩112之间可以通过粘贴固件,例如可以通过双面胶粘贴,或者也可以采用其他方式固定,本申请实施例并不限于此。Specifically, as shown in FIG. 2 or FIG. 3, a heat sink 130 may be provided between the outer surface of the first shielding cover 112 and the back cover 300 of the electronic device. The heat sink may include a thermal pad 131 and/or a heat sink. The copper sheet 132 may also include aluminum sheets and other metal good thermal conductors. Wherein, the heat sink 130 can be fixed to the back cover 300 by pasting, or it can directly abut against the back cover 300; similarly, the heat sink 130 and the lower first shielding cover 112 can be pasted with firmware, For example, it can be pasted by double-sided tape, or can also be fixed in other ways, and the embodiments of the present application are not limited to this.
将驱动组件111与发光组件141设置在电路板的同一侧可以减少该Tx模组的厚度,但是这样会使得驱动组件111与发光组件141的热量更为集中。通过在驱动组件111内设置导热凝胶,以及在其上方设置的散热器件,可以将热量传输到电子设备的后盖及外部空间,进而显著提高Tx模组的散热能力,降低使用问题,提高模组使用寿命。Arranging the driving component 111 and the light-emitting component 141 on the same side of the circuit board can reduce the thickness of the Tx module, but this will make the heat of the driving component 111 and the light-emitting component 141 more concentrated. By arranging the thermal conductive gel in the driving assembly 111 and the heat dissipating component above it, the heat can be transferred to the back cover and external space of the electronic device, thereby significantly improving the heat dissipation capacity of the Tx module, reducing usage problems, and improving the mold Group service life.
可选地,作为另一实施例,该驱动组件和发光组件也可以分别设置在电路板120的上下两个表面。具体地,例如,图4示出了本申请实施例的TOF发射模组100的再一剖视图,图5为图4所示的TOF发射模组100的立体分解图,其中,图1仅示出了Tx模组100的一部分,而图4和图5可以为该Tx模组100的一种可能的形态,且该图4和图5所示的Tx模组100不同于图2和图3所示的该Tx模组100的形态。将图5所示的TOF发射模组组装之后,图4所示的剖视图是沿图5虚线AB所示的方向、从上至下切割形成的截面图。如图4或者图5所示,该电路板120可以为软硬结合板120。具体地,该软硬结合板120包括:第一硬性电路板121、第二硬性电路板122、第三硬性电路板123和U型柔性电路板(Flexible Printed Circuit,FPC)125,其中,U型FPC 125用于电连接该第一硬性电路板121、该第二硬性电路板122和该第三硬性电路板123。具体地,该第一硬性电路板121和该第二硬性电路板122分别设置在该U型FPC 125一端的上下表面,也就是该第一硬性电路板121、该U型FPC 125的一端和该第二硬性电路板122形成叠层结构。并且,发光组件140设置于该第一硬性电路板121的上方,与该第一硬性电路板121电连接;而驱动组件110设置于该第二硬性电路板122的下方,与该第二硬性电路板122电连接。Optionally, as another embodiment, the driving component and the light-emitting component may also be provided on the upper and lower surfaces of the circuit board 120, respectively. Specifically, for example, FIG. 4 shows another cross-sectional view of the TOF emission module 100 according to an embodiment of the present application, and FIG. 5 is a three-dimensional exploded view of the TOF emission module 100 shown in FIG. 4, wherein FIG. 1 only shows A part of the Tx module 100 is shown, and FIGS. 4 and 5 may be a possible form of the Tx module 100, and the Tx module 100 shown in FIGS. 4 and 5 is different from that shown in FIGS. 2 and 3. The form of the Tx module 100 is shown. After the TOF transmitter module shown in FIG. 5 is assembled, the cross-sectional view shown in FIG. 4 is a cross-sectional view formed by cutting from top to bottom along the direction indicated by the dashed line AB in FIG. 5. As shown in FIG. 4 or FIG. 5, the circuit board 120 may be a rigid-flex board 120. Specifically, the rigid-flex board 120 includes: a first rigid circuit board 121, a second rigid circuit board 122, a third rigid circuit board 123, and a U-shaped flexible printed circuit (FPC) 125, where U-shaped The FPC 125 is used to electrically connect the first rigid circuit board 121, the second rigid circuit board 122, and the third rigid circuit board 123. Specifically, the first rigid circuit board 121 and the second rigid circuit board 122 are respectively arranged on the upper and lower surfaces of one end of the U-shaped FPC 125, that is, the first rigid circuit board 121, one end of the U-shaped FPC 125, and the The second rigid circuit board 122 forms a laminated structure. In addition, the light-emitting component 140 is disposed above the first rigid circuit board 121 and is electrically connected to the first rigid circuit board 121; and the driving component 110 is disposed below the second rigid circuit board 122 and is connected to the second rigid circuit board. The board 122 is electrically connected.
另外,该第三硬性电路板123设置在该U型FPC 125另一端的下表面;该第三硬性电路板123可以包括用于将Tx模组100贴片安装到电子设备的主板200的导电端子126,即在该第三硬性电路板123的下表面设置有导电端子126,以使得该第三硬性电路板123通过贴片的方式与该电子设备的主 板200电连接,从而实现该TOF发射模组与电子设备主板200之间的电连接。In addition, the third rigid circuit board 123 is arranged on the bottom surface of the other end of the U-shaped FPC 125; the third rigid circuit board 123 may include conductive terminals for mounting the Tx module 100 to the motherboard 200 of the electronic device. 126, that is, conductive terminals 126 are provided on the lower surface of the third rigid circuit board 123, so that the third rigid circuit board 123 is electrically connected to the main board 200 of the electronic device by means of a patch, thereby realizing the TOF emission module Electrical connection between the group and the main board 200 of the electronic device.
可选地,本申请实施例中的贴片方式可以包括表面贴装技术(Surface Mounted Technology,SMT)。例如,可以通过在下层的第三硬性电路板123的下表面设置焊盘阵列,即导电端子126可以为焊盘阵列,通过该焊盘阵列将第三硬性电路板123焊接到电子设备的主板200上,从而实现以包括该第三硬性电路板123的软硬结合板120为载体而形成的TOF发射模组100和电子设备的主板200之间的连接,进而实现二者之间的功能通讯。Optionally, the patching method in the embodiment of the present application may include Surface Mounted Technology (SMT). For example, a pad array can be provided on the lower surface of the lower third rigid circuit board 123, that is, the conductive terminal 126 can be a pad array, through which the third rigid circuit board 123 is soldered to the main board 200 of the electronic device. As a result, the connection between the TOF transmitter module 100 formed by using the rigid-flex board 120 including the third rigid circuit board 123 as the carrier and the main board 200 of the electronic device is realized, thereby realizing the functional communication between the two.
因此,本申请实施例的Tx模组,可以采用软硬结合板的折叠结构,该结构可以分为上半部分和下半部分,二者之间通过FPC电连接;该上半部分的上下表面分别用于设置发光组件和驱动组件,并实现发光组件和驱动组件之间的通信,而该下半部分能够通过最下表面的焊盘实现将Tx模组整体直接贴片到主板上。这样通过贴片的方式安装到电子设备的主板上的Tx模组有利于自动化贴片生产,便于大批量生产,降低生产成本,比采用BTB的方案节省空间和成本。Therefore, the Tx module of the embodiment of the present application can adopt a folding structure of a flexible and hard board. The structure can be divided into an upper half and a lower half, and the two are electrically connected by an FPC; the upper and lower surfaces of the upper half They are used to set the light-emitting component and the driving component respectively, and realize the communication between the light-emitting component and the driving component, and the lower part can realize the direct mounting of the Tx module on the main board through the pad on the lowermost surface. In this way, the Tx module mounted on the main board of the electronic device through the patch method is conducive to automated patch production, facilitates mass production, reduces production costs, and saves space and cost compared with the BTB solution.
可选地,如图4或者图5所示,对应于软硬结合板120的下半部分的结构,软硬结合板120还可以包括第四硬性电路板124,该第四硬性电路板124位于该U型FPC 125另一端的上表面,与第三硬性电路板123相背设置,但本申请实施例并不限于此。Optionally, as shown in FIG. 4 or FIG. 5, corresponding to the structure of the lower half of the rigid-flex board 120, the rigid-flex board 120 may further include a fourth rigid circuit board 124 located at The upper surface of the other end of the U-shaped FPC 125 is arranged opposite to the third rigid circuit board 123, but the embodiment of the present application is not limited to this.
应理解,本申请实施例中的硬性电路板可以为印制电路板(Printed Circuit Board,PCB)。例如,软硬结合板120中的第一硬性电路板121、第二硬性电路板122、第三硬性电路板123和第四硬性电路板124都可以为PCB。另外,对于本申请实施例中的第一硬性电路板121、第二硬性电路板122、第三硬性电路板123和第四硬性电路板124中的任意一个电路板而言,可以是一个单层的电路板,或者也可以是一个多层电路板,或者也可以是一个多层电路板中的任意一层或者多层。It should be understood that the rigid circuit board in the embodiment of the present application may be a printed circuit board (Printed Circuit Board, PCB). For example, the first rigid circuit board 121, the second rigid circuit board 122, the third rigid circuit board 123, and the fourth rigid circuit board 124 in the rigid-flex board 120 may all be PCBs. In addition, for any one of the first rigid circuit board 121, the second rigid circuit board 122, the third rigid circuit board 123, and the fourth rigid circuit board 124 in the embodiment of the present application, it may be a single layer The circuit board may also be a multilayer circuit board, or it may be any one or more layers of a multilayer circuit board.
例如,第一硬性电路板121和第二硬性电路板122可以为独立的两个电路板;或者第一硬性电路板121、中间柔性电路板125和第二硬性电路板122也可以为同一个多层电路板中的三部分,其中,该多层电路板中包括的柔性电路板为本申请实施例中的柔性电路板125,该多层电路板中位于柔性电路板上部分的一层或者多层电路板为本申请实施例中的第一硬性电路板121, 该多层电路板中位于柔性电路板下部分的一层或者多层电路板为本申请实施例中的第二硬性电路板122。与之类似的,第三硬性电路板123与第四硬性电路板124也可以为独立的两个电路板,或者,第三硬性电路板123、中间柔性电路板125和第四硬性电路板124也可以为同一个多层电路板中的三部分,在此不再赘述。For example, the first rigid circuit board 121 and the second rigid circuit board 122 can be two independent circuit boards; or the first rigid circuit board 121, the middle flexible circuit board 125, and the second rigid circuit board 122 can also be the same. The three parts in the multi-layer circuit board, where the flexible circuit board included in the multi-layer circuit board is the flexible circuit board 125 in the embodiment of the application, and one or more layers of the multi-layer circuit board are located on the flexible circuit board. The layer circuit board is the first rigid circuit board 121 in the embodiment of the application, and one or more layers of the circuit board located in the lower part of the flexible circuit board in the multilayer circuit board is the second rigid circuit board 122 in the embodiment of the application . Similarly, the third rigid circuit board 123 and the fourth rigid circuit board 124 can also be two independent circuit boards, or the third rigid circuit board 123, the middle flexible circuit board 125, and the fourth rigid circuit board 124 can also be It can be three parts in the same multilayer circuit board, which will not be repeated here.
可选地,本申请实施例中的软硬结合板120上半部分的第一硬性电路板121和第二硬性电路板122的形状和面积均可以设置为相同的,例如,设置为尺寸完全相同的矩形;类似的,软硬结合板120下半部分的第三硬性电路板123和第四硬性电路板124的形状和面积也可以设置为相同的,例如,设置为尺寸完全相同的矩形。另外,该上半部分的两个硬性电路板与下半部分的两个硬性电路板的形状与面积也可以均设置为相同的;该上半部分与下半部分可以平行设置,并且二者保持正对,即上半部分的两个硬性电路板沿着竖直方向在下半部分的两个硬性电路板所在表面上的投影,与该下半部分的两个硬性电路板完全重合,以使得在竖直空间上,上下两部分的硬性电路板占用的空间大小一致,不会造成下半部分的硬性电路板占用空间更大的问题。Optionally, the shape and area of the first rigid circuit board 121 and the second rigid circuit board 122 on the upper half of the flexible and rigid combined board 120 in the embodiment of the present application can be set to be the same, for example, set to have the same size. Similarly, the shape and area of the third rigid circuit board 123 and the fourth rigid circuit board 124 in the lower half of the rigid-flex board 120 can also be set to be the same, for example, set to be rectangular with the same size. In addition, the shape and area of the two rigid circuit boards of the upper half and the two rigid circuit boards of the lower half can also be set to be the same; the upper half and the lower half can be arranged in parallel, and both remain Right, that is, the projections of the two rigid circuit boards in the upper half on the surface where the two rigid circuit boards in the lower half are located along the vertical direction are completely overlapped with the two rigid circuit boards in the lower half, so that the In the vertical space, the rigid circuit boards of the upper and lower parts occupy the same size, which will not cause the problem of the rigid circuit boards of the lower half occupying more space.
应理解,如图4或者图5所示,本申请实施例中的发光组件140可以具体包括发光单元141和屏蔽罩142,为了便于区别,这里将该发光组件140中包括的屏蔽罩142称为第二屏蔽罩142,发光单元141设置在该第二屏蔽罩142内,该第二屏蔽罩142可以屏蔽外部其他元器件产生的电磁干扰,避免对发光单元141的影响。具体地,该发光单元141位于该第二屏蔽罩142内,该发光单元141与该第一硬性电路板121电连接,该发光单元141用于发光;该第二屏蔽罩142可以具有开孔144,这里称为第四开孔144,该第四开孔用于露出该发光单元141发出的光;或者,在第二屏蔽罩142的对应发光单元141的发光位置处,设置透明材料,以露出该发光单元141发出的光。It should be understood that, as shown in FIG. 4 or FIG. 5, the light-emitting assembly 140 in the embodiment of the present application may specifically include a light-emitting unit 141 and a shielding cover 142. To facilitate distinction, the shielding cover 142 included in the light-emitting assembly 140 is referred to herein as The second shielding cover 142 in which the light-emitting unit 141 is disposed, and the second shielding cover 142 can shield electromagnetic interference generated by other external components and avoid the influence on the light-emitting unit 141. Specifically, the light-emitting unit 141 is located in the second shielding cover 142, the light-emitting unit 141 is electrically connected to the first rigid circuit board 121, and the light-emitting unit 141 is used to emit light; the second shielding cover 142 may have an opening 144 , Here referred to as the fourth opening 144, the fourth opening is used to expose the light emitted by the light-emitting unit 141; or, at the light-emitting position of the second shielding cover 142 corresponding to the light-emitting unit 141, a transparent material is provided to expose The light emitted by the light emitting unit 141.
其中,图4或者图5所示的发光单元141与图2和图3中描述的发光单元141类似,适用于图2和图3中描述的发光单元141的相关描述,例如,该图4和图5中的发光单元可以为VCSEL,为了简洁,在此不再赘述。Wherein, the light-emitting unit 141 shown in FIG. 4 or FIG. 5 is similar to the light-emitting unit 141 described in FIGS. 2 and 3, and is applicable to the related description of the light-emitting unit 141 described in FIGS. The light-emitting unit in FIG. 5 may be a VCSEL, which is not repeated here for the sake of brevity.
可选地,该发光组件140还可以包括其他元件,例如,如图4或者图5所示,在该第二屏蔽罩142内还可以设置该发光组件140包括的其他元件, 例如电感、电容或者电阻等,用于配合或者辅助发光单元发光。Optionally, the light-emitting assembly 140 may also include other elements. For example, as shown in FIG. 4 or FIG. 5, other elements included in the light-emitting assembly 140, such as inductors, capacitors or Resistor, etc., used to coordinate or assist the light-emitting unit to emit light.
可选地,在该第二屏蔽罩112的外表面或者说上表面,还可以设置有硅胶套150,以用于密封,并且该硅胶套150可以露出该发光单元141发出的光。例如,如图4或者图5所示,在该第二屏蔽罩142与该电子设备(比如手机)的后盖300之间还可以设置有该硅胶套150,考虑到后盖300和第二屏蔽罩142均为硬质材料,二者直接抵靠,会存在空隙,而硅胶套150相对比较软,该硅胶套150可以在后盖300与第二屏蔽罩142之间起到密封的作用,同时也具有防尘防水的作用。具体地,如图4或者图5所示,该硅胶套150可以具有第五开孔152,以露出该发光单元141发出的光,而后盖300中与发光单元发141光位置对应部分通常为透明材料,例如玻璃,这样,在可以露出发光单元141发出的光的同时,后盖300、硅胶套150和第二屏蔽罩142三者之间没有空隙,具有防尘防水的作用,以保护发光单元141。可选地,也可以通过将硅胶套150对应发光单元141的发光位置设置透明材料,露出该发光单元141发出的光。其中,该硅胶套150可以通过双面胶粘贴在第二屏蔽罩142上表面和/或后盖300的表面,或者直接抵靠在后盖300的表面,本申请实施例并不限于此。Optionally, a silicone sleeve 150 can be provided on the outer surface or upper surface of the second shielding cover 112 for sealing, and the silicone sleeve 150 can expose the light emitted by the light-emitting unit 141. For example, as shown in FIG. 4 or FIG. 5, the silicone sleeve 150 may also be provided between the second shielding cover 142 and the back cover 300 of the electronic device (such as a mobile phone), considering that the back cover 300 and the second shield The cover 142 is made of hard material, and the two directly abut against each other, there will be a gap, while the silicone sleeve 150 is relatively soft. The silicone sleeve 150 can play a role of sealing between the back cover 300 and the second shielding cover 142, and at the same time It also has the function of dustproof and waterproof. Specifically, as shown in FIG. 4 or FIG. 5, the silicone sleeve 150 may have a fifth opening 152 to expose the light emitted by the light-emitting unit 141, and the part of the back cover 300 corresponding to the light-emitting position of the light-emitting unit 141 is usually transparent Material, such as glass, so that while the light emitted by the light-emitting unit 141 can be exposed, there is no gap between the back cover 300, the silicone sleeve 150 and the second shielding cover 142, which is dust-proof and waterproof to protect the light-emitting unit. 141. Optionally, it is also possible to expose the light emitted by the light-emitting unit 141 by arranging the silicone sleeve 150 corresponding to the light-emitting position of the light-emitting unit 141 with a transparent material. Wherein, the silicone sleeve 150 can be pasted on the upper surface of the second shielding cover 142 and/or the surface of the back cover 300 by double-sided tape, or directly abuts against the surface of the back cover 300, the embodiment of the present application is not limited to this.
可选地,第四开孔144和第五开孔152的尺寸和形状可以根据实际应用进行设置,并且第四开孔144和第五开孔152的形状和尺寸可以相同或者不同。例如,如图4和图5所示,第四开孔144和第五开孔152的形状可以均设置为矩形,也可以将第五开孔152的尺寸设置为大于第四开孔144。Optionally, the size and shape of the fourth opening 144 and the fifth opening 152 can be set according to actual applications, and the shape and size of the fourth opening 144 and the fifth opening 152 can be the same or different. For example, as shown in FIGS. 4 and 5, the shapes of the fourth opening 144 and the fifth opening 152 may both be set to be rectangular, or the size of the fifth opening 152 may be set to be larger than that of the fourth opening 144.
可选地,在竖直方向上,该驱动单元111与发光单元141可以对齐设置,也就是将驱动单元111设置于发光单元141的正下方,这样可以尽可能的减小该Tx模组100的厚度,进而减小Tx模组100的体积,但这样会是的该驱动单元111与发光单元141的热量较为集中,不利于散热。相反的,在竖直方向上,如图4或者图5所示,该驱动单元111与发光单元141也可以错开设置,也就是将驱动单元111设置在该发光单元141的斜下方,这样虽然使得Tx模组100的厚度不能达到最小,但是可以有利于驱动单元111与发光单元141的散热,使得二者散热较为分散。Optionally, in the vertical direction, the driving unit 111 and the light-emitting unit 141 can be arranged in alignment, that is, the driving unit 111 is arranged directly below the light-emitting unit 141, so that the Tx module 100 can be reduced as much as possible. The thickness further reduces the volume of the Tx module 100, but in this way, the heat of the driving unit 111 and the light-emitting unit 141 is relatively concentrated, which is not conducive to heat dissipation. On the contrary, in the vertical direction, as shown in FIG. 4 or FIG. 5, the driving unit 111 and the light-emitting unit 141 can also be staggered, that is, the driving unit 111 is arranged obliquely below the light-emitting unit 141. The thickness of the Tx module 100 cannot be minimized, but it can facilitate the heat dissipation of the driving unit 111 and the light emitting unit 141, so that the heat dissipation of the two is relatively dispersed.
在本申请实施例中,驱动单元111与发光单元141分别设置在软硬结合板120的一端的上下两个硬性电路板的表面,两个硬性电路板之间通过FPC实现电气与信号通讯,这样能够灵活应用软硬结合板,并且,在空间上拉近 了驱动单元111与发光单元141之间的距离,即驱动单元111与发光单元141之间的通信线路的距离为二者垂直方向的距离,该距离可以缩短到1mm以内,这样能够大大减小驱动单元111与发光单元141之间通讯线路上的寄生电感,从而提高驱动单元111与发光单元141的总体性能。例如,对于如图2或者图3所示的方案,将驱动单元111与发光单元141并排放置的方案,驱动单元111与发光单元141之间的通信线路的距离取决于二者之间的水平间隔距离,但是考虑干扰以及散热等问题,驱动单元111与发光单元141之间的距离不宜过近;再例如,对于将驱动单元111设置在第四硬性电路板124的方案,驱动单元111与发光单元141之间的通信线路的距离则增加为从驱动单元111所在的U型FPC 125的一端到达发光单元141所在的U型FPC 125的另一端,驱动单元111与发光单元141之间通信距离的增加会使得寄生电感明显增大,也就是降低了驱动单元111与发光单元141的总体性能。In the embodiment of the present application, the driving unit 111 and the light-emitting unit 141 are respectively arranged on the surface of the upper and lower rigid circuit boards at one end of the flexible and hard combined board 120, and the electrical and signal communication between the two rigid circuit boards is realized through FPC. Flexible application of the soft and hard board, and shorten the distance between the driving unit 111 and the light-emitting unit 141 in space, that is, the distance of the communication line between the driving unit 111 and the light-emitting unit 141 is the distance between the two in the vertical direction The distance can be shortened to less than 1 mm, which can greatly reduce the parasitic inductance on the communication line between the driving unit 111 and the light-emitting unit 141, thereby improving the overall performance of the driving unit 111 and the light-emitting unit 141. For example, for the solution shown in FIG. 2 or FIG. 3, in which the driving unit 111 and the light emitting unit 141 are placed side by side, the distance of the communication line between the driving unit 111 and the light emitting unit 141 depends on the horizontal interval between the two However, considering the problems of interference and heat dissipation, the distance between the driving unit 111 and the light-emitting unit 141 should not be too close; for another example, for a solution where the driving unit 111 is arranged on the fourth rigid circuit board 124, the driving unit 111 and the light-emitting unit The distance of the communication line between 141 increases from one end of the U-shaped FPC 125 where the drive unit 111 is located to the other end of the U-shaped FPC 125 where the light-emitting unit 141 is located, and the communication distance between the drive unit 111 and the light-emitting unit 141 increases. This will significantly increase the parasitic inductance, that is, reduce the overall performance of the driving unit 111 and the light-emitting unit 141.
可选地,对应于图1中描述的散热器件130,如图4或者图5所示,为了提高驱动组件110和发光组件140的散热能力,可以在驱动组件110的第一屏蔽罩112与下方第四硬性电路板124之间设置散热器件130,以将经过导热凝胶113传输的热量继续向外传输,相比于不设置散热器130,只靠第一屏蔽罩112外表面的空气进行散热的情况,有利于提升散热速度;并且,驱动单元111发出的小面积的集中热量经过导热凝胶再经过大面积的散热器件,有利于加大散热面积,提高散热效率;而且在最下方的第三硬性电路板123通过焊盘焊接到主板200上时,还能够充分利用主板200良好散热功能,将上方的驱动组件110和发光组件140上热量传导到主板200上,实现良好散热功能。Optionally, corresponding to the heat sink 130 described in FIG. 1, as shown in FIG. 4 or FIG. A heat sink 130 is arranged between the fourth rigid circuit board 124 to continue to transfer the heat transmitted through the thermally conductive gel 113 to the outside. Compared with no heat sink 130, only the air on the outer surface of the first shielding cover 112 is used for heat dissipation. Circumstances, it is conducive to increase the heat dissipation speed; and the small area of concentrated heat emitted by the drive unit 111 passes through the heat-conducting gel and then passes through the large-area heat sink, which is beneficial to increase the heat dissipation area and improve the heat dissipation efficiency; When the tri-rigid circuit board 123 is soldered to the main board 200 through pads, the good heat dissipation function of the main board 200 can also be fully utilized to conduct heat from the upper driving component 110 and the light emitting component 140 to the main board 200 to achieve a good heat dissipation function.
在本申请实施例的该散热器件130可以包括导热铜片134,或者也可以为其他热的良导体器件,利用其具有导热、均热效果,能够将芯片小面积的热量迅速传导到大面积的散热器件130上,再传导到下方的硬性电路板,再传递到主板200或者中框等外围空间,起到迅速散热和降温效果。The heat dissipating device 130 in the embodiment of the present application may include a thermally conductive copper sheet 134, or may also be other good thermal conductor devices. With its heat conduction and heat equalization effects, it can quickly conduct heat from a small area of the chip to a large area. On the heat sink 130, it is conducted to the rigid circuit board below, and then to the peripheral space such as the main board 200 or the middle frame to achieve rapid heat dissipation and cooling effects.
可选地,如图4或者图5所示,本申请实施例的该导热铜片134的一个表面可以通过导热背胶133与第一屏蔽罩112贴合;和/或,该导热铜片134的另一个表面可以通过另一导热背胶135与该第四硬性电路板124的上表面贴合。Optionally, as shown in FIG. 4 or FIG. 5, one surface of the thermally conductive copper sheet 134 of the embodiment of the present application may be bonded to the first shielding cover 112 through a thermally conductive adhesive 133; and/or, the thermally conductive copper sheet 134 The other surface of the fourth rigid circuit board 124 can be attached to the upper surface of the fourth rigid circuit board 124 through another thermally conductive adhesive 135.
因此,本申请实施例的Tx模组,包括发光组件和驱动组件,通过在驱 动组件包括的驱动单元与屏蔽罩之间注入导热凝胶的方法,将芯片热量主要通过导热凝胶传导屏至蔽罩外,再由屏蔽罩传导到散热器、电子设备的主板或者后盖,再充分利用主板或者后盖的良好散热功能,起到迅速散热、降温效果。Therefore, the Tx module of the embodiment of the present application includes a light-emitting component and a driving component. By injecting a thermally conductive gel between the driving unit included in the driving component and the shielding cover, the heat of the chip is mainly conducted through the thermally conductive gel to the shield. Outside the cover, the shielding cover is then conducted to the radiator, the motherboard or the back cover of the electronic device, and then makes full use of the good heat dissipation function of the motherboard or the back cover to achieve rapid heat dissipation and cooling effects.
本领域普通技术人员可以意识到,结合本文中所公开的实施例描述的各示例的单元及算法步骤,能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行,取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能,但是这种实现不应认为超出本申请的范围。A person of ordinary skill in the art may realize that the units and algorithm steps of the examples described in combination with the embodiments disclosed herein can be implemented by electronic hardware or a combination of computer software and electronic hardware. Whether these functions are executed by hardware or software depends on the specific application and design constraint conditions of the technical solution. Professionals and technicians can use different methods for each specific application to implement the described functions, but such implementation should not be considered beyond the scope of this application.
所属领域的技术人员可以清楚地了解到,为描述的方便和简洁,上述描述的系统、装置和单元的具体工作过程,可以参考前述方法实施例中的对应过程,在此不再赘述。Those skilled in the art can clearly understand that, for the convenience and conciseness of description, the specific working process of the system, device and unit described above can refer to the corresponding process in the foregoing method embodiment, which will not be repeated here.
在本申请所提供的几个实施例中,应该理解到,所揭露的系统、装置和方法,可以通过其它的方式实现。例如,以上所描述的装置实施例仅仅是示意性的,例如,所述单元的划分,仅仅为一种逻辑功能划分,实际实现时可以有另外的划分方式,例如多个单元或组件可以结合或者可以集成到另一个系统,或一些特征可以忽略,或不执行。另一点,所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口,装置或单元的间接耦合或通信连接,可以是电性,机械或其它的形式。In the several embodiments provided in this application, it should be understood that the disclosed system, device, and method can be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components may be combined or It can be integrated into another system, or some features can be ignored or not implemented. In addition, the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical, mechanical or other forms.
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的,作为单元显示的部件可以是或者也可以不是物理单元,即可以位于一个地方,或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments.
另外,在本申请各个实施例中的各功能单元可以集成在一个处理单元中,也可以是各个单元单独物理存在,也可以两个或两个以上单元集成在一个单元中。In addition, the functional units in the various embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit.
所述功能如果以软件功能单元的形式实现并作为独立的产品销售或使用时,可以存储在一个计算机可读取存储介质中。基于这样的理解,本申请的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的部分可以以软件产品的形式体现出来,该计算机软件产品存储在一个存储介质中,包括若干指令用以使得一台计算机设备(可以是个人计算机,服务器, 或者网络设备等)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括:U盘、移动硬盘、只读存储器(read-only memory,ROM)、随机存取存储器(random access memory,RAM)、磁碟或者光盘等各种可以存储程序代码的介质。If the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium. Based on this understanding, the technical solution of the present application essentially or the part that contributes to the existing technology or the part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including Several instructions are used to make a computer device (which may be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the methods described in the various embodiments of the present application. The aforementioned storage media include: U disk, mobile hard disk, read-only memory (read-only memory, ROM), random access memory (random access memory, RAM), magnetic disks or optical disks and other media that can store program codes. .
以上所述,仅为本申请的具体实施方式,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本申请揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本申请的保护范围之内。因此,本申请的保护范围应以所述权利要求的保护范围为准。The above are only specific implementations of this application, but the protection scope of this application is not limited to this. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in this application. Should be covered within the scope of protection of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.
Claims (19)
- 一种电子设备中的飞行时间TOF发射模组,其特征在于,包括:A time-of-flight TOF transmitting module in an electronic device, which is characterized in that it comprises:发光组件;Light-emitting component驱动组件(110),包括驱动单元(111)、第一屏蔽罩(112)和导热凝胶(113),所述驱动单元(111)用于驱动所述发光组件发光,所述驱动单元(111)位于所述第一屏蔽罩(112)内,所述导热凝胶(113)填充在所述驱动单元(111)与所述第一屏蔽罩(112)之间。The driving assembly (110) includes a driving unit (111), a first shielding cover (112) and a thermally conductive gel (113). The driving unit (111) is used to drive the light-emitting assembly to emit light, and the driving unit (111) ) Is located in the first shielding cover (112), and the thermally conductive gel (113) is filled between the driving unit (111) and the first shielding cover (112).
- 根据权利要求1所述的TOF发射模组,其特征在于,所述第一屏蔽罩(112)具有第一开孔(114),以通过所述第一开孔注入所述导热凝胶(113)。The TOF transmitter module according to claim 1, wherein the first shielding cover (112) has a first opening (114) for injecting the thermally conductive gel (113) through the first opening. ).
- 根据权利要求2所述的TOF发射模组,其特征在于,所述第一开孔(114)位于所述第一屏蔽罩(112)的与所述驱动单元(111)相对的表面。The TOF transmitter module according to claim 2, wherein the first opening (114) is located on a surface of the first shielding cover (112) opposite to the driving unit (111).
- 根据权利要求1至3中任一项所述的TOF发射模组,其特征在于,还包括:The TOF transmitting module according to any one of claims 1 to 3, further comprising:电路板(120),用于固定所述发光组件和所述驱动组件(110),所述发光组件与所述驱动组件(110)之间通过所述电路板(120)电连接。The circuit board (120) is used for fixing the light-emitting component and the driving component (110), and the light-emitting component and the driving component (110) are electrically connected through the circuit board (120).
- 根据权利要求4所述的TOF发射模组,其特征在于,The TOF transmitter module of claim 4, wherein:所述发光组件与所述驱动单元(111)分别固定在所述电路板(120)的第一表面,所述电路板(120)的第二表面与所述电子设备的主板通过贴片的方式电连接。The light-emitting assembly and the driving unit (111) are respectively fixed on the first surface of the circuit board (120), and the second surface of the circuit board (120) and the main board of the electronic device are attached by means of patches Electric connection.
- 根据权利要求5所述的TOF发射模组,其特征在于,还包括:The TOF transmitting module according to claim 5, further comprising:散热器件(130),设置在所述第一屏蔽罩(112)的外表面与所述电子设备的后盖之间。The heat sink (130) is arranged between the outer surface of the first shielding cover (112) and the back cover of the electronic device.
- 根据权利要求6所述的TOF发射模组,其特征在于,所述散热器件(130)包括导热垫(131)和/或散热铜片(132)。The TOF transmitter module according to claim 6, wherein the heat dissipating device (130) comprises a thermal pad (131) and/or a heat dissipation copper sheet (132).
- 根据权利要求5至7中任一项所述的TOF发射模组,其特征在于,所述发光组件包括:发光单元(141),The TOF emission module according to any one of claims 5 to 7, wherein the light-emitting assembly comprises: a light-emitting unit (141),所述发光单元(141)位于所述第一屏蔽罩(112)内,所述发光单元(141)与所述第一表面电连接,The light emitting unit (141) is located in the first shielding cover (112), and the light emitting unit (141) is electrically connected to the first surface,所述发光单元(141)上方的所述第一屏蔽罩(112)具有第二开孔,以露出所述发光单元(141)发出的光。The first shielding cover (112) above the light emitting unit (141) has a second opening to expose the light emitted by the light emitting unit (141).
- 根据权利要求8所述的TOF发射模组,其特征在于,所述发光单元 (141)上方的所述第一屏蔽罩(112)与所述电子设备的后盖之间设置有硅胶套(150),所述硅胶套(150)具有第三开孔,以露出所述发光单元(141)发出的光。The TOF emission module according to claim 8, wherein a silicone sleeve (150) is provided between the first shield (112) above the light-emitting unit (141) and the back cover of the electronic device. ), the silicone sleeve (150) has a third opening to expose the light emitted by the light-emitting unit (141).
- 根据权利要求4所述的TOF发射模组,其特征在于,所述电路板(120)为软硬结合板,所述软硬结合板包括:第一硬性电路板(121)、第二硬性电路板(122)、第三硬性电路板(123)和U型柔性电路板(125),The TOF transmitter module according to claim 4, wherein the circuit board (120) is a rigid-flex board, and the rigid-flex board comprises: a first rigid circuit board (121), a second rigid circuit Board (122), third rigid circuit board (123) and U-shaped flexible circuit board (125),所述第一硬性电路板(121)和所述第二硬性电路板(122)分别设置在所述U型柔性电路板(125)一端的上下表面,所述第三硬性电路板(123)设置在所述U型柔性电路板(125)另一端的下表面,U型柔性电路板(125)用于电连接所述第一硬性电路板(121)、所述第二硬性电路板(122)和所述第三硬性电路板(123);The first rigid circuit board (121) and the second rigid circuit board (122) are respectively arranged on the upper and lower surfaces of one end of the U-shaped flexible circuit board (125), and the third rigid circuit board (123) is arranged On the lower surface of the other end of the U-shaped flexible circuit board (125), the U-shaped flexible circuit board (125) is used to electrically connect the first rigid circuit board (121) and the second rigid circuit board (122) And the third rigid circuit board (123);所述发光组件设置于所述第一硬性电路板(121)的上方,且与所述第一硬性电路板(121)电连接;The light-emitting component is arranged above the first rigid circuit board (121) and is electrically connected to the first rigid circuit board (121);所述驱动组件(110)设置于所述第二硬性电路板(122)的下方,且所述驱动单元(111)与所述第二硬性电路板(112)电连接,以用于驱动所述发光组件发光;The driving component (110) is arranged under the second rigid circuit board (122), and the driving unit (111) is electrically connected to the second rigid circuit board (112) for driving the The light-emitting component emits light;所述第三硬性电路板(123)通过贴片的方式与所述电子设备的主板电连接。The third rigid circuit board (123) is electrically connected to the main board of the electronic device by means of a patch.
- 根据权利要求10所述的TOF发射模组,其特征在于,所述软硬结合板还包括第四硬性电路板(124),所述第四硬性电路板(124)设置在所述U型柔性电路板(125)另一端的上表面,The TOF transmitter module according to claim 10, wherein the rigid-flex board further comprises a fourth rigid circuit board (124), and the fourth rigid circuit board (124) is arranged on the U-shaped flexible circuit board (124). The upper surface of the other end of the circuit board (125),所述TOF发射模组还包括:The TOF transmitting module also includes:散热器件(130),位于所述第一屏蔽罩(112)与所述第四硬性电路板(124)之间。The heat sink (130) is located between the first shielding cover (112) and the fourth rigid circuit board (124).
- 根据权利要求11所述的TOF发射模组,其特征在于,所述散热器件(130)包括导热铜片(134)。The TOF transmitter module according to claim 11, wherein the heat dissipating device (130) comprises a thermally conductive copper sheet (134).
- 根据权利要求12所述的TOF发射模组,其特征在于,所述导热铜片(134)的一个表面通过导热背胶与所述第一屏蔽罩(112)贴合;和/或,The TOF transmitter module according to claim 12, wherein one surface of the thermally conductive copper sheet (134) is attached to the first shielding cover (112) through a thermally conductive adhesive; and/or,所述导热铜片(134)的另一个表面通过另一导热背胶与所述第四硬性电路板(124)的表面贴合。The other surface of the thermally conductive copper sheet (134) is attached to the surface of the fourth rigid circuit board (124) through another thermally conductive adhesive.
- 根据权利要求10至13中任一项所述的TOF发射模组,其特征在于,所述发光组件包括:发光单元(141)和第二屏蔽罩(142),The TOF emission module according to any one of claims 10 to 13, wherein the light-emitting assembly comprises: a light-emitting unit (141) and a second shield (142),所述发光单元(141)位于所述第二屏蔽罩(142)内,所述发光单元与所述第一硬性电路板(121)电连接,The light emitting unit (141) is located in the second shielding cover (142), and the light emitting unit is electrically connected to the first rigid circuit board (121),所述第二屏蔽罩(142)具有第四开孔,以露出所述发光单元(141)发出的光。The second shielding cover (142) has a fourth opening to expose the light emitted by the light emitting unit (141).
- 根据权利要求1至14中任一项所述的TOF发射模组,其特征在于,所述驱动组件(110)还包括:The TOF transmitting module according to any one of claims 1 to 14, wherein the driving assembly (110) further comprises:辅助器件,用于辅助所述驱动单元(111)产生用于驱动发光组件的驱动信号。An auxiliary device is used to assist the driving unit (111) to generate a driving signal for driving the light-emitting component.
- 一种电子设备中的飞行时间TOF检测装置,其特征在于,包括:A TOF detection device for time-of-flight in electronic equipment, which is characterized in that it comprises:如权利要求1至15中任一项所述的TOF发射模组;和The TOF transmitting module according to any one of claims 1 to 15; andTOF接收模组,TOF receiving module,其中,所述TOF发射模组用于发射光信号,所述TOF接收模组用于接收由所述光信号照射物体后的返回光信号。Wherein, the TOF transmitting module is used for transmitting light signals, and the TOF receiving module is used for receiving the return light signals after the object is illuminated by the light signals.
- 根据权利要求16所述的TOF检测装置,其特征在于,所述TOF接收模组通过板对板连接器BTB与所述电子设备的主板电连接。The TOF detection device according to claim 16, wherein the TOF receiving module is electrically connected to the main board of the electronic device through a board-to-board connector BTB.
- 一种电子设备,其特征在于,包括:如权利要求1至15中任一项所述的TOF发射模组。An electronic device, characterized by comprising: the TOF transmitting module according to any one of claims 1 to 15.
- 根据权利要求18所述的电子设备,其特征在于,所述电子设备还包括:The electronic device according to claim 18, wherein the electronic device further comprises:硅胶套(150),设置在所述TOF发射模组与所述电子设备的后盖之间,所述硅胶套(150)具有第五开孔,以露出所述发光单元(141)发出的光。The silicone sleeve (150) is arranged between the TOF emission module and the back cover of the electronic device, and the silicone sleeve (150) has a fifth opening to expose the light emitted by the light emitting unit (141) .
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