CN116940098A - Shielding device heat conduction interface processing technology, shielding device and electronic equipment - Google Patents
Shielding device heat conduction interface processing technology, shielding device and electronic equipment Download PDFInfo
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- CN116940098A CN116940098A CN202311189302.3A CN202311189302A CN116940098A CN 116940098 A CN116940098 A CN 116940098A CN 202311189302 A CN202311189302 A CN 202311189302A CN 116940098 A CN116940098 A CN 116940098A
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- 238000005516 engineering process Methods 0.000 title claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims description 38
- 239000003292 glue Substances 0.000 claims description 31
- 238000002347 injection Methods 0.000 claims description 27
- 239000007924 injection Substances 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 12
- 239000000499 gel Substances 0.000 description 60
- 230000000694 effects Effects 0.000 description 10
- 230000005672 electromagnetic field Effects 0.000 description 6
- 230000002452 interceptive effect Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000005555 metalworking Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The application discloses a shielding device heat conduction interface processing technology, a shielding device and electronic equipment, and relates to the technical field of electronic device heat dissipation, wherein the shielding device is applied to the electronic equipment, and the electronic equipment comprises at least one electronic device to be heat-dissipated; the shielding device comprises a shielding cover and a heat-conducting interface material; the shielding cover is provided with at least one first through hole, and the first through hole is used for injecting heat-conducting gel into a gap between the shielding cover and the electronic device to be cooled so as to form the heat-conducting interface material in the gap between the shielding cover and the electronic device to be cooled. The application solves the technical problem of high cost for placing the heat conduction gasket between the electronic device and the shielding case in the related technology.
Description
Technical Field
The application relates to the technical field of electronic equipment heat dissipation, in particular to a shielding device heat conduction interface processing technology, a shielding device and electronic equipment.
Background
In order to prevent an external electric field, a magnetic field or an electromagnetic field from interfering with electronic devices inside the electronic device or prevent an electromagnetic field generated by the electronic devices inside the electronic device from interfering with other electronic devices, a shielding cover is generally used for electromagnetic shielding of the electronic devices inside the electronic device. In the thickness direction, a certain gap exists between the electronic device and the shielding cover so as to facilitate the assembly and the mounting, and the gap can enable the thermal resistance between the electronic device and the shielding cover to be larger, so that the heat dissipation of the electronic device is affected, if the electronic device is not dissipated in a reasonable heat dissipation mode, the temperature of the electronic device is increased, the working stability, the reliability and the service life of the electronic device are greatly reduced, and even the thermal deformation and the damage of the electronic device are caused. Heat dissipation is currently commonly achieved by placing a thermally conductive gasket between the electronic device and the shield.
However, the electronic device needs to be wrapped in the shielding case, and if a better heat conducting effect is to be achieved, the heat conducting gasket needs to be compressed to a certain extent, that is, the volume of the heat conducting gasket in a natural state is larger than the volume of the gap between the electronic device and the shielding case, so that the heat conducting gasket is accurately and firmly placed in the gap between the electronic device and the shielding case, which tends to increase the complexity of the process and the processing cost.
Disclosure of Invention
The application mainly aims to provide a processing technology of a heat conduction interface of a shielding device, the shielding device and electronic equipment, and aims to solve the technical problem that the cost for placing a heat conduction gasket between an electronic device and a shielding cover is high in the related art.
In order to achieve the above object, the present application provides a shielding device applied to an electronic apparatus including at least one electronic device to be heat-dissipated;
the shielding device comprises a shielding cover and a heat-conducting interface material; the shielding cover is provided with at least one first through hole, and the first through hole is used for injecting heat-conducting gel into a gap between the shielding cover and the electronic device to be cooled so as to form the heat-conducting interface material in the gap between the shielding cover and the electronic device to be cooled.
Optionally, the first through hole is disposed corresponding to a geometric center of the electronic device to be heat-dissipated;
and/or, each first through hole is distributed in the region corresponding to the electronic device to be radiated at equal intervals;
and/or the first through holes comprise at least one of strip holes, waist-shaped holes and a group of round holes which are arranged in a straight line, and each first through hole is arranged corresponding to at least one edge line of the electronic device to be radiated.
Optionally, the edge line includes a first edge line and two second edge lines intersecting end points of the first edge line;
the first through hole comprises a strip hole, and the strip hole is arranged corresponding to a first edge line of the electronic device to be radiated;
and at least one retaining wall structure is further arranged on the shielding cover, and each retaining wall structure is arranged corresponding to the second edge line of the electronic device to be radiated.
Optionally, at least one second through hole is further formed in the shielding case, and the second through hole is disposed corresponding to an edge line of the electronic device to be heat-dissipated.
Optionally, the aperture of the second through hole is smaller than 1mm.
Optionally, the shielding device further comprises at least one layer of heat-conducting shielding film, and the heat-conducting shielding film is arranged on the surface of the side, far away from the electronic device, of the shielding cover.
Optionally, the heat conductive shielding film includes at least one of copper foil, aluminum foil, and graphite sheet.
Optionally, the aperture of the first through hole is smaller than 2mm.
Optionally, the thermally conductive gel comprises a one-component thermally conductive gel.
The application also provides a processing technology of the heat conduction interface of the shielding device, which comprises the following steps:
acquiring a main board and a shielding cover, wherein an electronic device to be shielded is processed on the main board, and at least one first through hole is formed in the shielding cover;
the shielding cover is arranged at a position on the main board corresponding to the electronic device to be radiated;
and injecting heat-conducting gel into a gap between the shielding cover and the electronic device to be cooled from each first through hole, and forming a heat-conducting interface material in the gap between the shielding cover and the electronic device to be cooled.
Optionally, the first through holes are correspondingly arranged with the geometric center of the electronic device to be cooled, and/or each first through hole is distributed in a region corresponding to the electronic device to be cooled at equal intervals;
the step of injecting the heat-conducting gel into the gap between the shielding cover and the electronic device to be radiated from each first through hole comprises the following steps:
and vertically inserting the glue injection needle heads into the first through holes, and injecting heat conduction gel into a gap between the shielding cover and the electronic device to be cooled.
Optionally, the first through holes include at least one of a strip hole, a waist hole and a group of circular holes arranged in a straight line, and each first through hole is arranged corresponding to at least one edge line of the electronic device to be heat-dissipated;
the step of injecting the heat-conducting gel into the gap between the shielding cover and the electronic device to be radiated from each first through hole comprises the following steps:
and bending and inserting the glue injection needle into each first through hole, enabling a glue outlet of the glue injection needle to be parallel to the electronic device to be cooled and face to a gap between the shielding cover and the electronic device to be cooled, and injecting heat conduction gel into the gap between the shielding cover and the electronic device to be cooled.
The application also provides electronic equipment comprising the shielding device.
The application provides a processing technology of a heat conduction interface of a shielding device, the shielding device and electronic equipment, wherein the shielding device is applied to the electronic equipment, and the electronic equipment comprises at least one electronic device to be cooled; the shielding device comprises a shielding cover and a heat-conducting interface material; the shielding cover is provided with at least one first through hole, and the first through hole is used for injecting heat-conducting gel into a gap between the shielding cover and the electronic device to be cooled so as to form the heat-conducting interface material in the gap between the shielding cover and the electronic device to be cooled. By arranging the first through hole on the shielding cover, the heat conduction gel can be injected into the gap between the shielding cover and the electronic device to be radiated. The heat conducting gel is injected, so that on one hand, gaps between the shielding cover and the electronic device to be cooled can be fully filled, and a good heat conducting effect is achieved; on the other hand, the process of forming the first through hole on the shielding cover can be synchronously completed in the process of processing and forming the shielding cover, the process is simple and low in cost, and the process of injecting the heat conduction gel into the gap between the shielding cover and the electronic device to be radiated is equivalent to the process of forming the original heat conduction gasket, and an additional forming die is not needed, so that the process flow is simplified, and the processing cost is reduced. Therefore, the technical defect that the process complexity and the processing cost are increased due to the fact that the heat conduction gasket is accurately and firmly placed in a gap between the electronic device and the shielding cover is overcome, and the shielding device which has stable and reliable heat conduction performance, stable structure, simplicity in processing and low cost is provided.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the application or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, and it will be obvious to a person skilled in the art that other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic structural diagram of a related art shielding device according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a shielding device according to another related art in an embodiment of the present application;
FIG. 3 is a schematic structural view of a shielding device according to another related art in an embodiment of the present application;
FIG. 4 is a schematic view of an embodiment of a shielding device according to the present application;
FIG. 5 is a schematic view of a structure of a first through hole according to an embodiment of the present application;
FIG. 6 is a schematic view of another alternative embodiment of the first via hole according to an embodiment of the present application;
FIG. 7 is a schematic view of a further alternative embodiment of the first via in accordance with an embodiment of the present application;
FIG. 8 is a schematic view of an alternative embodiment of an elongate aperture according to an embodiment of the present application;
FIG. 9 is a schematic diagram of a construction of one possible implementation of a second via in accordance with an embodiment of the present application;
FIG. 10 is a schematic structural view of one possible implementation of the heat conductive shielding film according to the embodiment of the present application;
FIG. 11 is a flow chart of a thermal interface process for a shielding device according to an embodiment of the application;
fig. 12 is a schematic view of a scenario of one possible implementation of the injection of thermally conductive gel involved in an embodiment of the present application.
Description of the embodiments reference numerals:
the achievement of the objects, functional features and advantages of the present application will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
In order to make the above objects, features and advantages of the present application more comprehensible, the following description of the embodiments accompanied with the accompanying drawings will be given in detail. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In order to prevent an external electric field, a magnetic field or an electromagnetic field from interfering with electronic devices inside the electronic device or prevent an electromagnetic field generated by the electronic devices inside the electronic device from interfering with other electronic devices, a shielding cover is generally used for electromagnetic shielding of the electronic devices inside the electronic device. In the thickness direction, a certain gap exists between the electronic device and the shielding cover so as to facilitate the assembly and the mounting, and the gap can enable the thermal resistance between the electronic device and the shielding cover to be larger, so that the heat dissipation of the electronic device is affected, if the electronic device is not dissipated in a reasonable heat dissipation mode, the temperature of the electronic device is increased, the working stability, the reliability and the service life of the electronic device are greatly reduced, and even the thermal deformation and the damage of the electronic device are caused. Heat dissipation is currently commonly achieved by placing a thermally conductive gasket between the electronic device and the shield.
In the related art, referring to fig. 1, the shielding can be divided into two parts, namely a shielding can bracket 222 and a shielding can cover 223, and the shielding can bracket 222 can be fixed on the motherboard 1 first, then the heat conduction interface material 21 is attached to the electronic device 11 to be heat-dissipated on the motherboard 1, and then the shielding can cover 223 is matched and fixed with the shielding can bracket 222. Thus, two structural members of the shield bracket 222 and the shield cover 223, which can be used in cooperation, are required, and the process is complicated and the processing cost is high. Referring to fig. 2, the clamping jaw 12 may be fixed at a corresponding position on the motherboard 1, and then the thermal interface material 21 is attached to the electronic device 11 to be cooled on the motherboard 1, so as to clamp the shielding case 22 on the clamping jaw 12. Therefore, on one hand, the processing or purchasing of the clamping jaw also needs to increase certain cost, and on the other hand, the firmness of the clamping jaw for fixing the shielding cover is lower, and the loosening phenomenon is easy to occur. Referring to fig. 3, a shielding case 22 having a window may be processed, and then the shielding case 22 is fixed on the motherboard 1, and the window is disposed corresponding to the electronic device 11 to be cooled, and then the heat-conducting interface material 21 is attached to the electronic device 11 to be cooled through the window, and then the copper foil 31 is attached to the heat-conducting interface material 21. In this way, because the copper foil 31 is thinner and has lower strength, it is often difficult to compress the thermal interface material 21, the thermal interface material 21 is not tightly attached to the electronic device 11 to be cooled, so that the thermal resistance is larger, the thermal conductivity is worse, and the copper foil 31 attached to the thermal interface material 21 is easy to fall off during the processing and use processes, so that the electromagnetic shielding effect is affected. It can be found that, if a better heat conducting effect is to be achieved, the heat conducting pad needs to be compressed to a certain extent, that is, the volume of the heat conducting pad in a natural state is larger than the volume of the gap between the electronic device and the shielding case, in this case, the heat conducting pad is to be accurately and firmly placed in the gap between the electronic device and the shielding case, which tends to increase the complexity of the process and the processing cost.
Based on the above, the application provides a heat conduction interface processing technology of a shielding device, the shielding device and electronic equipment, wherein the shielding device is applied to the electronic equipment, and the electronic equipment comprises at least one electronic device to be cooled; the shielding device comprises a shielding cover and a heat-conducting interface material; the shielding cover is provided with at least one first through hole, and the first through hole is used for injecting heat-conducting gel into a gap between the shielding cover and the electronic device to be cooled so as to form the heat-conducting interface material in the gap between the shielding cover and the electronic device to be cooled. By arranging the first through hole on the shielding cover, the heat conduction gel can be injected into the gap between the shielding cover and the electronic device to be radiated. The heat conducting gel is injected, so that on one hand, gaps between the shielding cover and the electronic device to be cooled can be fully filled, and a good heat conducting effect is achieved; on the other hand, the process of forming the first through hole on the shielding cover can be synchronously completed in the process of processing and forming the shielding cover, the process is simple and low in cost, and the process of injecting the heat conduction gel into the gap between the shielding cover and the electronic device to be radiated is equivalent to the process of forming the original heat conduction gasket, and an additional forming die is not needed, so that the process flow is simplified, and the processing cost is reduced. Therefore, the technical defect that the process complexity and the processing cost are increased due to the fact that the heat conduction gasket is accurately and firmly placed in a gap between the electronic device and the shielding cover is overcome, and the shielding device which has stable and reliable heat conduction performance, stable structure, simplicity in processing and low cost is provided.
In an embodiment of the shielding device according to the present application, referring to fig. 4, the shielding device is applied to an electronic apparatus, and the electronic apparatus includes at least one electronic device 11 to be heat-dissipated;
the shielding means comprises a shielding cage 22 and a thermally conductive interface material 21; the shielding case 22 is provided with at least one first through hole 221, and the first through hole 221 is used for injecting heat-conducting gel into a gap between the shielding case 22 and the electronic device 11 to be cooled, so as to form the heat-conducting interface material 21 in the gap between the shielding case 22 and the electronic device 11 to be cooled.
In this embodiment, the shielding device refers to a device with electromagnetic shielding performance, the shielding device is applied to an electronic device, at least one electronic device is processed on a motherboard of the electronic device, and the shielding device is used for electromagnetic shielding of the electronic device in the electronic device, so as to prevent an external electric field, a magnetic field or an electromagnetic field from interfering with the electronic device in the electronic device, and prevent an electromagnetic field generated by the electronic device in the electronic device from interfering with other electronic devices. In the thickness direction, a certain gap exists between the electronic device and the shielding cover so as to facilitate the assembly and the mounting, and the gap can enable the thermal resistance between the electronic device and the shielding cover to be larger, so that the heat dissipation of the electronic device is affected, the electronic device in the electronic equipment can easily generate heat in the operation process, if the electronic device is not cooled in a reasonable heat dissipation mode, the temperature of the electronic device can be increased, the working stability, the reliability and the service life of the electronic device can be greatly reduced, and even the thermal deformation and the damage of the electronic device can be caused. The electronic device to be cooled may include part or all of the electronic device to be cooled, in each electronic device in the electronic apparatus, there may be less power consumption of part of the electronic device, heat may be better dissipated without adding a heat-conducting interface material, and there may also be greater power consumption of part of the electronic device, if no heat-conducting interface material is added, the working stability, reliability and service life of the electronic device may be greatly reduced, even thermally deformed and damaged, so that the heat-conducting interface material may be processed only between the electronic device to be cooled and the shielding case, and the specific determination mode of the electronic device to be cooled may be determined according to the actual situation and the actual test result, which is not limited in this embodiment.
The shielding device comprises a shielding cover 22 and a heat-conducting interface material 21, wherein the shielding cover 22 is a shell structure with electromagnetic shielding performance, and the shielding cover 22 can be made of metal, nonmetal or composite material, and can be specifically determined according to actual needs, and the embodiment is not limited to the above; the thermal interface material 21 is a material for reducing contact thermal resistance between the electronic device and the shielding case 22, and includes at least one of silicone grease, silica gel, a thermal pad, a phase change material, a phase change metal sheet, a thermal adhesive, etc., where the thermal interface material 21 is located on a surface of the shielding case 22, which is close to the electronic device 11 to be cooled, and fills a gap between the shielding case 22 and the electronic device 11 to be cooled.
The shielding cover 22 is provided with at least one first through hole 221, the first through hole 221 is used for injecting heat-conducting gel into a gap between the shielding cover 22 and the electronic device 11 to be cooled, the heat-conducting gel can be injected from the first through hole and filled into the gap between the shielding cover 22 and the electronic device 11 to be cooled, and then curing treatment or not curing treatment is performed, so that a heat-conducting interface material 21 which can be fully attached to and contacted with the electronic device to be cooled and the shielding cover is formed in the gap between the shielding cover 22 and the electronic device 11 to be cooled, the contact thermal resistance is reduced, and the heat-conducting performance is improved. The number of the first through holes 221 may be one or more; the first through hole 221 may include at least one of a rectangular hole, a waist-shaped hole, and a circular hole, wherein the circular hole refers to a circular, oval, or irregular circular-like hole; the first through hole 221 may be located at a position convenient for injecting the heat conductive gel. The number, shape, position, etc. of the first through holes 221 may be determined according to actual needs, which is not limited in this embodiment.
Optionally, the aperture of the first through hole is smaller than 2mm.
In this embodiment, the larger the aperture of the through hole on the shielding cover, the larger the influence on the electromagnetic shielding effect is, so the aperture of the first through hole should be as small as possible under the condition that the glue outlet of the glue injection needle can pass through, and thus the aperture of the first through hole is determined to be smaller than 2mm, for example, may be 1.8mm, 1.5mm, 1.2mm, 1mm, 0.8mm, etc.
Optionally, the thermally conductive gel comprises a one-component thermally conductive gel.
In this embodiment, the single-component heat conductive gel is simple to use, does not require mixing, does not require post-curing treatment after the injection of the gel, and can provide excellent heat conductive properties and lower thermal resistance.
Optionally, the first through hole is disposed corresponding to a geometric center of the electronic device to be heat-dissipated;
and/or, each first through hole is distributed in the region corresponding to the electronic device to be radiated at equal intervals;
and/or the first through holes comprise at least one of strip holes, waist-shaped holes and a group of round holes which are arranged in a straight line, and each first through hole is arranged corresponding to at least one edge line of the electronic device to be radiated.
In this embodiment, the number of the first through holes may be one, and in the case where the number of the first through holes is one, referring to fig. 5, the first through holes 221 are disposed corresponding to the geometric center of the electronic device 11 to be cooled, that is, after the shielding case 22 is mounted on the electronic device, the first through holes 221 on the shielding case 22 overlap with the geometric center of the electronic device 11 to be cooled, and in fig. 5, in order to facilitate viewing of the relative positional relationship, the shielding case 22 is displayed transparently, and it is to be noted that the first through holes 221 are opened on the shielding case 22. In this way, when the heat conducting gel is injected into the gap between the shielding cover and the electronic device to be cooled through the first through hole, the heat conducting gel can spread from the geometric center of the electronic device to be cooled to the outside, so that the uniformity and compactness of the heat conducting interface material can be improved, and the filling efficiency can be improved.
The number of the first through holes may be plural, and in the case that the number of the first through holes is plural, each of the first through holes is distributed at equal intervals in an area corresponding to the electronic device to be cooled, where the equal interval distribution includes at least one of a transverse equal interval distribution, a longitudinal equal interval distribution, and an oblique equal interval distribution, referring to fig. 6, each of the first through holes is distributed at equal intervals in a transverse and longitudinal direction in an area corresponding to the electronic device to be cooled, and referring to fig. 7, each of the first through holes is distributed at equal intervals in an oblique direction in an area corresponding to the electronic device to be cooled. In fig. 6 and fig. 7, the shielding case 22 is shown transparent for easy viewing of the relative positional relationship, and it should be noted that the first through hole 221 is formed in the shielding case 22. In this way, when the heat conducting gel is injected into the gap between the shielding cover and the electronic device to be cooled through each first through hole, the heat conducting gel can be uniformly spread on the surface of the electronic device to be cooled, the uniformity and compactness of the heat conducting interface material can be improved, and the filling efficiency can be improved.
The first through hole may include a long hole or a plurality of long holes with long sides arranged in a straight line, or may include a waist hole or a plurality of waist holes with long axes arranged in a straight line, or may include a group of round holes arranged in a straight line. Each first through hole is arranged corresponding to at least one edge line of the electronic device to be cooled, namely, after the shielding cover is mounted on the electronic equipment, each first through hole on the shielding cover is overlapped or connected with at least one edge line of the electronic device to be cooled. At least one retaining wall structure can be arranged along the injection direction of the heat conducting gel so as to guide and limit the flow direction of the heat conducting gel in the process of injecting the heat conducting gel, so that the heat conducting gel can be prevented from flowing to other areas outside the electronic device to be cooled, raw material waste can be reduced, and filling efficiency can be improved. Referring to fig. 8, the region filled with the cross-hatching is a region 224 corresponding to the electronic device to be cooled, that is, after the shielding case 22 is mounted on the electronic device, the region 224 corresponding to the electronic device to be cooled on the shielding case 22 overlaps with the upper surface of the electronic device 11 to be cooled, and the elongated hole 221 is opened at the edge line of the region 224 corresponding to the electronic device to be cooled. In this way, when the heat conducting gel is injected into the gap between the shielding cover and the electronic device to be heat-dissipated through the first through hole, the heat conducting gel can be uniformly spread and distributed on the surface of the electronic device to be heat-dissipated along the same direction from the first through hole, and the uniformity and compactness of the heat conducting interface material can be improved.
Optionally, the edge line includes a first edge line and two second edge lines intersecting end points of the first edge line;
the first through hole comprises a strip hole, and the strip hole is arranged corresponding to a first edge line of the electronic device to be radiated;
and at least one retaining wall structure is further arranged on the shielding cover, and each retaining wall structure is arranged corresponding to the second edge line of the electronic device to be radiated.
In the present embodiment, referring to fig. 8, the region filled with the hatching is the electronic device corresponding region 224 to be heat-dissipated, that is, after the shielding case 22 is mounted on the electronic device, the electronic device corresponding region 224 to be heat-dissipated on the shielding case 22 overlaps with the upper surface of the electronic device 11 to be heat-dissipated. The edge lines of the electronic device to be heat-dissipated include a first edge line and two second edge lines intersecting with two end points of the first edge line, respectively, and the electronic device corresponding region 224 to be heat-dissipated includes a third edge line 2241 corresponding to the first edge line and a fourth edge line 2242 corresponding to the second edge line, that is, after the shield case 22 is mounted on the electronic device, the first edge line overlaps the third edge line 2241, and the second edge line overlaps the fourth edge line 2242. The first through hole includes a strip hole 221, where the strip hole 221 is disposed corresponding to a first edge line of the electronic device to be heat-dissipated, that is, the strip hole 221 is disposed at the third edge line 2241. The shielding cover is further provided with at least one retaining wall structure 225, and each retaining wall structure 225 is disposed corresponding to the second edge line of the electronic device to be cooled, that is, the retaining wall structure 225 is disposed at the fourth edge line 2242 to guide and limit the flowing direction of the heat-conducting gel in the process of injecting the heat-conducting gel, so that the heat-conducting gel can be prevented from flowing to other areas outside the electronic device to be cooled, not only raw material waste can be reduced, but also filling efficiency can be improved. In one embodiment, the retaining wall structure 225 may be formed on the shielding case by sheet metal working, so that a process hole 226 is formed at the junction of the retaining wall structure 225, and the process hole may be used for heat dissipation.
Optionally, at least one second through hole is further formed in the shielding case, and the second through hole is disposed corresponding to an edge line of the electronic device to be heat-dissipated.
In this embodiment, the material of the shield can is generally opaque, so that the structure of the portion covered by the shield can not be observed through the shield can after the shield can is mounted on the electronic device. Therefore, referring to fig. 9, at least one second through hole 227 may be formed in the shielding case at a position corresponding to an edge line of the electronic device to be heat-dissipated, so as to check whether the thermally conductive gel completely covers the surface area of the electronic device.
Optionally, the aperture of the second through hole is smaller than 1mm.
In this embodiment, the larger the aperture of the through hole on the shield case, the larger the influence on the electromagnetic shielding effect, and thus the aperture of the second through hole is determined to be smaller than 1mm, for example, 0.9mm, 0.8mm, 0.5mm, or the like.
Optionally, the shielding device further comprises at least one layer of heat-conducting shielding film, and the heat-conducting shielding film is arranged on the surface of the side, far away from the electronic device, of the shielding cover.
In this embodiment, when the shielding device is processed, in consideration of the practical requirements in terms of light weight, cost, processing convenience and the like of the product, the heat conducting performance of the material of the shielding case may be poor, in this case, referring to fig. 10, at least one layer of heat conducting shielding film 3 may be attached to the surface of the side, far away from the electronic device 11, of the shielding 22, so as to improve the heat conducting performance and speed up the heat dissipation, and meanwhile, the heat conducting shielding film may cover the through hole on the shielding case, so as to improve the electromagnetic shielding effect, where the heat conducting shielding film refers to a film with relatively excellent heat conducting performance, such as a metal film, a graphite film and the like.
Optionally, the heat conductive shielding film includes at least one of copper foil, aluminum foil, and graphite sheet.
In this embodiment, the copper foil, aluminum foil and graphite flake are excellent in heat conductive property and good in electromagnetic shielding effect.
In this embodiment, the shielding device is applied to an electronic device, where the electronic device includes at least one electronic component to be cooled; the shielding device comprises a shielding cover and a heat-conducting interface material; the shielding cover is provided with at least one first through hole, and the first through hole is used for injecting heat-conducting gel into a gap between the shielding cover and the electronic device to be cooled so as to form the heat-conducting interface material in the gap between the shielding cover and the electronic device to be cooled. By arranging the first through hole on the shielding cover, the heat conduction gel can be injected into the gap between the shielding cover and the electronic device to be radiated. The heat conducting gel is injected, so that on one hand, gaps between the shielding cover and the electronic device to be cooled can be fully filled, and a good heat conducting effect is achieved; on the other hand, the process of forming the first through hole on the shielding cover can be synchronously completed in the process of processing and forming the shielding cover, the process is simple and low in cost, and the process of injecting the heat conduction gel into the gap between the shielding cover and the electronic device to be radiated is equivalent to the process of forming the original heat conduction gasket, and an additional forming die is not needed, so that the process flow is simplified, and the processing cost is reduced. Therefore, the technical defect that the process complexity and the processing cost are increased due to the fact that the heat conduction gasket is accurately and firmly placed in a gap between the electronic device and the shielding cover is overcome, and the shielding device which has stable and reliable heat conduction performance, stable structure, simplicity in processing and low cost is provided.
In an embodiment of the heat conduction interface processing process for a shielding device according to the present application, referring to fig. 11, the heat conduction interface processing process for a shielding device includes the following steps:
step S10, a main board and a shielding cover are obtained, wherein an electronic device to be shielded is processed on the main board, and at least one first through hole is formed in the shielding cover;
in this embodiment, it should be noted that, the thermal interface material is the thermal interface material in the shielding device described in the foregoing embodiment, and the same or similar content as that in the foregoing embodiment may be referred to the foregoing description, and will not be repeated herein.
Illustratively, the step S10 includes: a motherboard, on which an electronic device to be shielded has been processed, and a shielding can, on which at least one first through hole has been opened, are obtained.
Step S20, the shielding cover is installed on the position, corresponding to the electronic device to be radiated, on the main board;
illustratively, the step S20 includes: after the shielding cover is installed on the main board, the electronic components to be cooled on the main board can be at least wrapped in the shielding cover, and other electronic components except the electronic components to be cooled on the main board can be wrapped in the shielding cover.
And S30, injecting heat-conducting gel into a gap between the shielding cover and the electronic device to be cooled from each first through hole, and forming a heat-conducting interface material in the gap between the shielding cover and the electronic device to be cooled.
Illustratively, the step S30 includes: after the glue outlet of the glue injection needle passes through the first through hole, heat conduction gel is injected and filled into a gap between the shielding cover and the electronic device to be cooled through the glue injection needle, and then curing treatment or not is carried out, so that the gap between the shielding cover and the electronic device to be cooled can be formed, a heat conduction interface material which can be fully attached and contacted with the electronic device to be cooled and the shielding cover is formed, the contact thermal resistance is reduced, and the heat conduction performance is improved. In the case that the number of the first through holes is plural, the number of the glue injection needles may be plural, so that the heat conductive gel may be simultaneously injected into each of the first through holes.
Optionally, the first through holes are correspondingly arranged with the geometric center of the electronic device to be cooled, and/or each first through hole is distributed in a region corresponding to the electronic device to be cooled at equal intervals;
the step of injecting the heat-conducting gel into the gap between the shielding cover and the electronic device to be radiated from each first through hole comprises the following steps:
and vertically inserting the glue injection needle heads into the first through holes, and injecting heat conduction gel into a gap between the shielding cover and the electronic device to be cooled.
In this embodiment, it should be noted that, the number of the first through holes may be one or more, and in the case that the number of the first through holes is one, the first through holes may be disposed corresponding to the geometric center of the electronic device to be heat-dissipated, that is, after the shielding case is mounted on the electronic device, the first through holes on the shielding case overlap with the geometric center of the electronic device to be heat-dissipated; and under the condition that the number of the first through holes is a plurality of, the first through holes can be distributed in the region corresponding to the electronic device to be cooled at equal intervals, wherein the equidistant distribution comprises at least one of horizontal equidistant distribution, longitudinal equidistant distribution and oblique equidistant distribution. In both cases, the heat-conducting gel can be filled in all directions around each first through hole at a nearly constant speed, so that the glue injection needle can be vertically inserted into each first through hole.
The first through holes may be vertically inserted with a glue injection needle, and the heat-conducting gel may be injected and filled into a gap between the shielding case and the electronic device to be heat-dissipated through the glue injection needle, so that the heat-conducting interface material capable of being fully attached to and contacted with the electronic device to be heat-dissipated and the shielding case may be formed in the gap between the shielding case and the electronic device to be heat-dissipated by performing or not performing the curing process.
Optionally, the first through holes include at least one of a strip hole, a waist hole and a group of circular holes arranged in a straight line, and each first through hole is arranged corresponding to at least one edge line of the electronic device to be heat-dissipated;
the step of injecting the heat-conducting gel into the gap between the shielding cover and the electronic device to be radiated from each first through hole comprises the following steps:
and bending and inserting the glue injection needle into each first through hole, enabling a glue outlet of the glue injection needle to be parallel to the electronic device to be cooled and face to a gap between the shielding cover and the electronic device to be cooled, and injecting heat conduction gel into the gap between the shielding cover and the electronic device to be cooled.
In this embodiment, it should be noted that the first through hole may include one elongated hole or a plurality of elongated holes with long sides arranged in a straight line, or may include one waist-shaped hole or a plurality of waist-shaped holes with long axes arranged in a straight line, or may include a group of round holes arranged in a straight line. Each first through hole is arranged corresponding to at least one edge line of the electronic device to be cooled, namely, after the shielding cover is mounted on the electronic equipment, each first through hole on the shielding cover is overlapped or connected with at least one edge line of the electronic device to be cooled. At least one retaining wall structure can be arranged along the injection direction of the heat conducting gel so as to guide and limit the flow direction of the heat conducting gel in the process of injecting the heat conducting gel, so that the heat conducting gel can be prevented from flowing to other areas outside the electronic device to be cooled, raw material waste can be reduced, and filling efficiency can be improved. In this case, the heat conductive gel is filled from the edge to the center and further to the other side edge, so that the flow direction of the heat conductive gel can be guided by adjusting the direction of the tip of the injection needle.
For example, referring to fig. 12, the glue injection needle 4 may be bent and inserted into each of the first through holes 221, so that the glue outlet of the glue injection needle 4 is parallel to the electronic device 11 to be cooled and faces the gap between the shielding case 22 and the electronic device 11 to be cooled, and the gap between the shielding case 22 and the electronic device 11 to be cooled is injected with and filled with the heat-conducting gel, so that the gap between the shielding case 22 and the electronic device 11 to be cooled may be formed into a heat-conducting interface material capable of being fully attached to and contacted with both the electronic device 11 to be cooled and the shielding case 22.
In an implementation manner, the glue outlet of the glue injection needle head can be a flat glue outlet, and the flat glue outlet can synchronously realize the glue injection with a larger area, so that the glue injection efficiency is improved, the repeated glue injection area is fewer, the filling of the heat conduction gel is more uniform and compact, and the heat conduction performance of the heat conduction interface material is better.
The processing technology of the heat conduction interface of the shielding device solves the technical problem of high cost for placing the heat conduction gasket between the electronic device and the shielding cover in the related technology. Compared with the prior art, the heat conduction interface processing technology of the shielding device provided by the embodiment of the application has the same beneficial effects as those of the shielding device of the embodiment, and is not repeated herein.
Further, the application also provides electronic equipment, which comprises the shielding device.
The electronic equipment provided by the application solves the technical problem of high cost for placing the heat conduction gasket between the electronic device and the shielding case in the related technology. Compared with the prior art, the electronic equipment provided by the embodiment of the application has the same beneficial effects as the shielding device of the embodiment, and the description is omitted herein.
The foregoing description is only of the preferred embodiments of the present application, and is not intended to limit the scope of the application, but rather is intended to cover any equivalents of the structures or equivalent processes disclosed herein, or any application, directly or indirectly, within the scope of the application.
Claims (11)
1. A shielding device, characterized in that the shielding device is applied to an electronic apparatus comprising at least one electronic device to be heat-dissipated;
the shielding device comprises a shielding cover and a heat-conducting interface material; the shielding cover is provided with at least one first through hole, and the first through hole is used for injecting heat-conducting gel into a gap between the shielding cover and the electronic device to be cooled so as to form the heat-conducting interface material in the gap between the shielding cover and the electronic device to be cooled.
2. The shielding apparatus of claim 1, wherein the first through hole is disposed corresponding to a geometric center of the electronic device to be heat-dissipated;
and/or, each first through hole is distributed in the region corresponding to the electronic device to be radiated at equal intervals;
and/or the first through holes comprise at least one of strip holes, waist-shaped holes and a group of round holes which are arranged in a straight line, and each first through hole is arranged corresponding to at least one edge line of the electronic device to be radiated.
3. The shielding apparatus of claim 2, wherein the edge lines comprise a first edge line and two second edge lines intersecting end points of the first edge line;
the first through hole comprises a strip hole, and the strip hole is arranged corresponding to a first edge line of the electronic device to be radiated;
and at least one retaining wall structure is further arranged on the shielding cover, and each retaining wall structure is arranged corresponding to the second edge line of the electronic device to be radiated.
4. The shielding device of claim 1, wherein the shielding case is further provided with at least one second through hole, and the second through hole is disposed corresponding to an edge line of the electronic device to be heat-dissipated.
5. The shielding device of claim 4, wherein the aperture of the second through hole is less than 1mm.
6. The shielding apparatus of claim 1, further comprising at least one thermally conductive shielding film disposed on a surface of the shield case on a side thereof remote from the electronic device; the heat conductive shielding film includes at least one of copper foil, aluminum foil and graphite sheet.
7. The shielding device according to any one of claims 1-6, wherein the aperture of the first through hole is smaller than 2mm.
8. The processing technology of the heat conduction interface of the shielding device is characterized by comprising the following steps of:
acquiring a main board and a shielding cover, wherein an electronic device to be shielded is processed on the main board, and at least one first through hole is formed in the shielding cover;
the shielding cover is arranged at a position on the main board corresponding to the electronic device to be radiated;
and injecting heat-conducting gel into a gap between the shielding cover and the electronic device to be cooled from each first through hole, and forming a heat-conducting interface material in the gap between the shielding cover and the electronic device to be cooled.
9. The process of claim 8, wherein the first through holes are disposed corresponding to a geometric center of the electronic device to be cooled, and/or the first through holes are distributed in an area corresponding to the electronic device to be cooled at equal intervals;
the step of injecting the heat-conducting gel into the gap between the shielding cover and the electronic device to be radiated from each first through hole comprises the following steps:
and vertically inserting the glue injection needle heads into the first through holes, and injecting heat conduction gel into a gap between the shielding cover and the electronic device to be cooled.
10. The process of claim 8, wherein the first through holes comprise at least one of a strip hole, a waist hole and a group of circular holes arranged in a straight line, and each of the first through holes is arranged corresponding to at least one edge line of the electronic device to be cooled;
the step of injecting the heat-conducting gel into the gap between the shielding cover and the electronic device to be radiated from each first through hole comprises the following steps:
and bending and inserting the glue injection needle into each first through hole, enabling a glue outlet of the glue injection needle to be parallel to the electronic device to be cooled and face to a gap between the shielding cover and the electronic device to be cooled, and injecting heat conduction gel into the gap between the shielding cover and the electronic device to be cooled.
11. An electronic device, characterized in that the electronic device comprises a shielding arrangement according to any of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311189302.3A CN116940098A (en) | 2023-09-15 | 2023-09-15 | Shielding device heat conduction interface processing technology, shielding device and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311189302.3A CN116940098A (en) | 2023-09-15 | 2023-09-15 | Shielding device heat conduction interface processing technology, shielding device and electronic equipment |
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| JP2002299652A (en) * | 2001-04-04 | 2002-10-11 | Auto Network Gijutsu Kenkyusho:Kk | Optical element holding structure of shield case |
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| CN111123291A (en) * | 2020-03-31 | 2020-05-08 | 深圳市汇顶科技股份有限公司 | Time-of-flight emission module, time-of-flight detection device and electronic equipment |
| WO2021195978A1 (en) * | 2020-03-31 | 2021-10-07 | 深圳市汇顶科技股份有限公司 | Time of flight transmission module, time of flight measurement device, and electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002299652A (en) * | 2001-04-04 | 2002-10-11 | Auto Network Gijutsu Kenkyusho:Kk | Optical element holding structure of shield case |
| CN111123292A (en) * | 2020-03-31 | 2020-05-08 | 深圳市汇顶科技股份有限公司 | Time-of-flight emission module, time-of-flight detection device and electronic equipment |
| CN111123291A (en) * | 2020-03-31 | 2020-05-08 | 深圳市汇顶科技股份有限公司 | Time-of-flight emission module, time-of-flight detection device and electronic equipment |
| WO2021195978A1 (en) * | 2020-03-31 | 2021-10-07 | 深圳市汇顶科技股份有限公司 | Time of flight transmission module, time of flight measurement device, and electronic device |
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