CN106332439B - A kind of flexible circuit board, circuit connection structure and mobile device - Google Patents
A kind of flexible circuit board, circuit connection structure and mobile device Download PDFInfo
- Publication number
- CN106332439B CN106332439B CN201610797255.4A CN201610797255A CN106332439B CN 106332439 B CN106332439 B CN 106332439B CN 201610797255 A CN201610797255 A CN 201610797255A CN 106332439 B CN106332439 B CN 106332439B
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- Prior art keywords
- circuit board
- flexible circuit
- heat dissipation
- heat
- fixed
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of flexible circuit boards for having both heat dissipation and conducting function, and use the circuit connection structure and mobile device of the flexible circuit board.Flexible circuit board includes conductive layer and insulating layer, the surface of the conductive layer is divided into heat dissipation region and non-heat dissipation region, the non-heat dissipation region is covered with the insulating layer, the heat dissipation region is laid with heat radiating metallic layer, and the heat radiating metallic layer is electrically connected with the conductive layer of the heat dissipation region, the both ends of the flexible circuit board are conducting end.The both ends of flexible circuit board are as conducting end, the component for needing to be electrically connected can be connected to, realize conducting function, and heat sinking function had both may be implemented in the heat radiating metallic layer that heat dissipation region is laid with, conducting function may be implemented again, the electronic device being located on heat radiating metallic layer is electrically connected in the circuit of flexible circuit board, the integrated level of electronic device is improved, reduces the occupied space of electronic device.
Description
Technical field
The present invention relates to the technical field of flexible circuit board more particularly to a kind of flexible circuit board, circuit connection structure and
Mobile device.
Background technique
Currently, mobile device is all towards thin and light trend development, it is mobile in order to which the thickness of mobile device is made smaller
The arrangement of each electronic device in equipment is inevitable more and more compacter, and develops towards integrated direction.
In existing mobile device, the bottom of camera module is radiated by smearing heat conductive silica gel, increases camera shooting
The height of head mould group, the height for generally resulting in camera module increase, protrude from the shell of mobile device, influence user's body
It tests.The antenna of existing mobile device generally passes through the connection of elastic slice and mainboard, then be linked on mainboard mainly.These arrangements
It needs to occupy biggish space, can not integrate, cause the thickness of mobile device limited, cannot continue to do thin.
Summary of the invention
The first object of the present invention is to propose a kind of flexible circuit board for having both heat dissipation and conducting function, can be real simultaneously
Existing conductive and heat dissipation function.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of flexible circuit board, including conductive layer and insulating layer, the surface of the conductive layer be divided into heat dissipation region and it is non-dissipate
Thermal region, the non-heat dissipation region are covered with the insulating layer, and the heat dissipation region is laid with heat radiating metallic layer, and heat dissipation gold
Belong to layer and be electrically connected with the conductive layer for being located at the heat dissipation region, the both ends of the flexible circuit board are conducting end.
Wherein, the heat radiating metallic layer is real layers of copper.
Wherein, the non-heat dissipation region includes bending region, and grid copper is equipped with outside the bending region.
The second object of the present invention is to propose a kind of circuit connection structure, conductive and heat dissipation by can be realized simultaneously
The flexible circuit board of function improves the integrated level of electronic device, reduces the occupied space of electronic device.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of circuit connection structure, including fixed area, to heat dissipating electronic devices and above-mentioned flexible circuit board, the fixation
Be provided with the first electrical connection section and the second electrical connection section to be electrically connected in area, the both ends of the flexible circuit board it is fixed respectively and
It is electrically connected to first electrical connection section and second electrical connection section, it is described to be electrically connected to the heat dissipation to heat dissipating electronic devices
It metal layer and is radiated by the heat radiating metallic layer.
Wherein, the surface at the both ends of the heat radiating metallic layer and the flexible circuit board is provided with conductive fabric, and logical
The conductive fabric is crossed to be electrically connected with corresponding component.
Wherein, the end of the flexible circuit board is compacted compressing parts and/or is fixed on the fixed area by screw
Corresponding position.
Wherein, the first end of the flexible circuit board is fixed on the corresponding position of the fixed area by screw, and described
The obverse and reverse of one end is provided with conductive fabric and protection board from inside to outside, and the screw passes through the protection board, described leads
Electric cloth and the first end are simultaneously fixed on the fixed area.
The third object of the present invention is to propose a kind of mobile device, passes through above-mentioned circuit connection structure, improves electronics
The integrated level of device reduces the occupied space of electronic device.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of mobile device, including above-mentioned circuit connection structure.
Wherein, the fixed area includes the center with main being connected to and the metal frame that is connected to the feed point of antenna, it is described in
It is provided with first electrical connection section on frame, second electrical connection section is provided on the metal frame.
Wherein, it is described to heat dissipating electronic devices be camera module, the fixed area further includes fixed plate, the center and
The metal frame is both secured to the fixed plate, and the fixed plate is provided with the sky of the accommodating for accommodating the camera module
Between, the heat dissipation region is located at the bottom of the accommodating space, and the both ends of the flexible circuit board are located at the accommodating space
Outside, the bending region are located at the side-walls of the accommodating space.
The utility model has the advantages that the present invention provides a kind of flexible circuit board, and use the circuit connection knot of the flexible circuit board
Structure and mobile device.Flexible circuit board includes conductive layer and insulating layer, the surface of the conductive layer be divided into heat dissipation region and it is non-dissipate
Thermal region, the non-heat dissipation region are covered with the insulating layer, and the heat dissipation region is laid with heat radiating metallic layer, and heat dissipation gold
Belong to layer and be electrically connected with the conductive layer for being located at the heat dissipation region, the both ends of the flexible circuit board are conducting end.Flexible electrical
The both ends of road plate can be connected to the component for needing to be electrically connected as conducting end, realize conducting function, and what heat dissipation region was laid with dissipates
Heat sinking function not only may be implemented in metal layer, but also conducting function may be implemented, and will be located at the electricity of the electronic device on heat radiating metallic layer
It is connected in the circuit of flexible circuit board, improves the integrated level of electronic device, reduce the occupied space of electronic device.
Detailed description of the invention
Fig. 1 is the cross-sectional view for the flexible circuit board that the embodiment of the present invention 1 provides.
Fig. 2 is the top view for the flexible circuit board that the embodiment of the present invention 1 provides.
Fig. 3 is the structural schematic diagram one after the bending for the flexible circuit board that the embodiment of the present invention 2 provides.
Fig. 4 is the partial enlarged view at the A of Fig. 3.
Fig. 5 is the structural schematic diagram two after the bending for the flexible circuit board that the embodiment of the present invention 2 provides.
Fig. 6 is flexible circuit board provided by the invention assembling schematic diagram in a mobile device.
Fig. 7 is flexible circuit board provided by the invention assembling schematic diagram two in a mobile device.
Fig. 8 is the partial enlarged view at the B of Fig. 7.
Wherein:
1- flexible circuit board, 11- conductive layer, 111- heat dissipation region, the non-heat dissipation region of 112-, the bending region 1121-, 12-
Insulating layer, 13- heat radiating metallic layer, 2- fixed area, the first electrical connection section of 21-, the second electrical connection section of 22-, 23- center, 24- metal
Frame, 25- fixed plate, 251- accommodating space, 3- wait for heat dissipating electronic devices, 4- conductive fabric, 5- compacting part, 6- protection board.
Specific embodiment
To keep the technical problems solved, the adopted technical scheme and the technical effect achieved by the invention clearer, below
In conjunction with attached drawing and pass through specific embodiment to further illustrate the technical scheme of the present invention.
Embodiment 1
With reference to Fig. 1-Fig. 2, a kind of flexible circuit board for having both heat dissipation and conducting function, including conduction are present embodiments provided
Layer 11 and insulating layer 12.The surface of conductive layer 11 is divided into heat dissipation region 111 and non-heat dissipation region 112, and non-heat dissipation region 112 covers
There is insulating layer 12, heat dissipation region 111 is laid with heat radiating metallic layer 13, and heat radiating metallic layer 13 and the conduction for being located at heat dissipation region 111
Layer 11 is electrically connected, and the both ends of flexible circuit board 1 are conducting end.The both ends of flexible circuit board 1 can be connected to needs as conducting end
The component of electrical connection realizes conducting function, and heat sinking function had both may be implemented in the heat radiating metallic layer 13 that heat dissipation region 111 is laid with,
Conducting function may be implemented again, the electronic device being located on heat radiating metallic layer 13 is electrically connected in the circuit of flexible circuit board 1,
The integrated level for improving electronic device reduces the occupied space of electronic device.Specifically, the conductive layer in flexible circuit board
It is generally formed by more copper foils, is also possible to other conductive materials composition, insulating layer 12 can be PI film etc..Heat dissipation region 111
It only can be laid with heat radiating metallic layer 13 in heat dissipation region 111, another side on the other side is exposed or covers insulating layer 12.Heat dissipation
Region 111 can also all be laid with heat radiating metallic layer 13, two layers of heat radiating metallic layer in heat dissipation region 111 and the another side opposite with it
13 not only increase heat dissipation area and radiating rate, can reduce temperature rise, obtain better heat dissipation effect, also improve flexible electrical
The versatility of the obverse and reverse of road plate 1, heat dissipation region 111 need not distinguish between front or reverse side, can realize well
Heat dissipation effect.The quantity of heat dissipation region 111 can be to be multiple, can and heat dissipation conductive to multiple electronic devices simultaneously.Radiating area
The position in domain 111 can be positioned at the middle position of flexible circuit board, and flexible circuit board is realized by both ends and is electrically connected at this time, lead to
It crosses heat dissipation region 111 electronic device is connected into circuit；Its end that can also be located at flexible circuit board, directly as flexible electrical
One conducting end of road plate, while realizing heat dissipation and conducting function.
The heat radiating metallic layer 13 of the present embodiment is real layers of copper, is usually laid with big face outside exposed heat dissipation region 111
Long-pending real copper realizes conductive and heat sinking function using the good thermal conductivity of copper and electric conductivity.Heat radiating metallic layer 13 can also use
Other metals such as aluminium, as long as having good thermal conductivity and electric conductivity to be ok.
Flexible circuit board 1 may be bent in actual arrangement, flexible circuit board 1 due to bending number it is more or
When bending angle is larger, it can be easy to generate crack since edge, inwardly diffusion finally results in the fracture of conductive layer 11, so that flexible
Circuit board 1 is scrapped, therefore bending region 1121 can also be arranged in non-heat dissipation region 112, can be spread outside bending region 1121
If grid copper, reinforce the structural strength of bending region 1121, avoids bending from causing conductive layer damaged or open circuit, improve flexibility
The service life of circuit board, and grid copper has preferable amount of deflection, is convenient for bending.And at heat dissipation region 111, due to being laid with
Heat radiating metallic layer 13 has strengthened its structural strength, and the probability that crack occur in other non-bending regions is relatively low, can not spread
If grid copper, with save the cost.
Embodiment 2
With reference to Fig. 4-Fig. 8, present embodiments provide a kind of circuit connection structure, including fixed area 2, to heat dissipating electronic devices
3 and above-mentioned flexible circuit board 1, the first electrical connection section 21 and the second electrical connection section 22 to be electrically connected are provided on fixed area 2,
The both ends of flexible circuit board 1 are fixed respectively and are electrically connected to the first electrical connection section 21 and the second electrical connection section 22, to radiating electronic
Device 3 is electrically connected to heat radiating metallic layer 13 and is radiated by heat radiating metallic layer 13.The specifically region of fixed area 2,
There is two and more than two electrical connection sections for needing to be electrically connected on this region, fixed area 2 can be a determining component,
Such as mainboard has the first connecting portion 21 for needing to be electrically connected and the second electrical connection section 22 on mainboard；It is also possible to multiple portions
Part combines the region to be formed, if the antenna of the frame in mobile terminal and the antenna of center need to cooperate electrical connection, at this time
Mobile terminal in frame and center can be collectively regarded as fixed area 2, first connecting portion 21 and second connecting portion 22 can be
Pad or metal end etc..By flexible circuit board 1, the first electrical connection section 21 and the second electrical connection section 22 can be electrically connected,
Realize conducting function, to heat dissipating electronic devices 3 both can by the circuit communication in heat radiating metallic layer 13 and flexible circuit board 1,
It can also be radiated by heat radiating metallic layer 13, it is no longer necessary to heat conductive silica gel etc. be separately provided, saved arrangement space, improve electricity
The integrated level of sub- device.
Conductive fabric 4 can be set on the surface at the both ends of heat radiating metallic layer 13 and flexible circuit board 1, and pass through conduction
Cloth 4 is electrically connected with corresponding component.I.e. one end of flexible circuit board 1 is connected by conductive fabric 4 and the first electrical connection section 21, another
End is connected by conductive fabric 4 and the second electrical connection section 22, is connected to heat dissipating electronic devices 3 by conductive fabric 4 and heat radiating metallic layer 13
It connects.Be possible to all be copper foil or real copper due to the end of flexible circuit board 1 and the end of heat radiating metallic layer 13, directly with it is corresponding
When component connects, there may be certain gap, lead to poor contact, conductive fabric 4 is since itself is softer, 4 two sides of conductive fabric
Component mutual extrusion when, it is ensured that contact is good.
Specifically, the end of flexible circuit board 1 can be compacted the corresponding position that component 5 is pressed in fixed area 2.In reality
In the assembly of border, the outside of flexible circuit board 1 is provided with shell or other component, will be soft by applying pressure to compacting part 5
The end of property circuit board 1 is pressed in fixed area 2.Compacting part 5, which can be, compresses the flexible material that foam etc. has certain elasticity,
It can also be other such as rubber pads.Flexible material can be to avoid shell when compressing flexible circuit board 1, to flexible circuit board
1 causes the damage of hardness, while fully ensuring that and compressing flexible circuit board 1, guarantees flexible circuit board 1 and the first electrical connection section 21/
The good contact of second electrical connection section 22.
The end of flexible circuit board 1 can also be fixed on the corresponding position of fixed area 2 by screw.It is by screw fixation
Very reliable connection type, generally as fixed form first, but when some regions are not easy to setting screw fixation,
It can be fixed by the way of being compressed by compacting part 5.The first end of flexible circuit board 1 is fixed on fixed area 2 by screw
Corresponding position when, the obverse and reverse of first end can be provided with conductive fabric 4 and protection board 6 from inside to outside, and screw passes through
Protection board 6, conductive fabric 4 and first end are simultaneously fixed on fixed area 2.Conductive fabric 4 can guarantee that first end and fixed area 2 well connect
Touching, when due to being fixed by screw, during tightening screw, it is possible to it will drive the first end rotation of flexible circuit board 1,
It relatively rotates with fixed area 2 or screw itself relatively rotates with first end, all may result in inside first end
Conductive fault rupture, first end are damaged, and can protect flexible electrical well from the obverse and reverse of first end using protection board 6
Road plate 1, screw and fixed area 2 all only relatively rotate with protection board 6, will not damage its internal flexible circuit board.Tool
For body, protection board 6 can be steel plate, be also possible to plastic plate or other plate structures with certain structural strength.
As shown in fig. 7, one end of flexible circuit board 1 is pressed in the first electrical connection section by compacting part 5 in the present embodiment
21, the other end is fixed on the second electrical connection section 22 by screw.When practical set, the both ends of flexible circuit board 1 can also all be adopted
With the mode that compacting part 5 compresses or adopts the mode being screwed and fix.
Embodiment 3
With reference to Fig. 6-Fig. 8, a kind of mobile device is present embodiments provided, including above-mentioned circuit connection structure, is saved
Arrangement space improves the integrated level of electronic device, can be with reduced thickness.The fixed area 2 of the present embodiment includes with main connecting
Logical center 23 and the metal frame 24 being connected to the feed point of antenna are provided with the first electrical connection section 21, metal frame 24 on center 23
On be provided with the second electrical connection section 22.By above-mentioned circuit connection structure, the connection of antenna and main ground is realized, is also achieved
Ground connection and heat dissipation to heat dissipating electronic devices 3 greatly improve antenna and the integrated level to heat dissipating electronic devices 3, save
Arrangement space.
It can be camera module to heat dissipating electronic devices 3, fixed area 2 further includes fixed plate 25, center 23 and metal frame
24 are both secured to fixed plate 25, and fixed plate 25 is provided with the accommodating space 251 for accommodating camera module, heat dissipation region 111
Positioned at the bottom of accommodating space 251, the both ends of flexible circuit board 1 are located at the outside of accommodating space 251, and bending region 1121 is located at
The side-walls of accommodating space 251.Camera module directly passes through heat radiating metallic layer 13 and is grounded and radiates, and does not need to be arranged again thermally conductive
Silica gel reduces the thickness of camera module, also simplify the electric connection structure of camera module, greatly improves integrated
Degree reduces thickness.It is provided with grid copper on bending region 1121, reinforces the structural strength of bending region 1121, avoids
Bending causes conductive layer damaged or open circuit, and grid copper has preferable amount of deflection, is convenient for bending.The heat radiating metal of the present embodiment
The real copper that layer 13 is laid with for large area, and it is equipped with real copper in the obverse and reverse of heat dissipation region 111, improve heat dissipation speed
Degree, temperature rise are slow.It is also possible to other electronic devices to heat dissipating electronic devices 3, as long as also needing the electricity for being grounded and radiating
Sub- device.
The above is only a preferred embodiment of the present invention, for those of ordinary skill in the art, according to the present invention
Thought, there will be changes in the specific implementation manner and application range, and the content of the present specification should not be construed as to the present invention
Limitation.
Claims (5)
1. a kind of mobile device, which is characterized in that including circuit connection structure comprising fixed area (2), to heat dissipating electronic devices
(3) and flexible circuit board (1), the flexible circuit board (1) include conductive layer (11) and insulating layer (12), the conductive layer (11)
Surface be divided into heat dissipation region (111) and non-heat dissipation region (112), the non-heat dissipation region (112) is covered with the insulating layer
(12), the heat dissipation region (111) is laid with heat radiating metallic layer (13), and the heat radiating metallic layer (13) be located at the radiating area
The conductive layer (11) in domain (111) is electrically connected, and the both ends of the flexible circuit board (1) are conducting end；
The first electrical connection section (21) and the second electrical connection section (22) to be electrically connected are provided on the fixed area (2), it is described soft
Property circuit board (1) both ends it is fixed respectively and be electrically connected to first electrical connection section (21) and second electrical connection section
(22), described to be electrically connected to the heat radiating metallic layer (13) to heat dissipating electronic devices (3) and pass through the heat radiating metallic layer (13)
Heat dissipation；
The fixed area (2) includes the center (23) with main being connected to and the metal frame (24) being connected to the feed point of antenna, described
It is provided with first electrical connection section (21) on center (23), is provided with second electrical connection section on the metal frame (24)
(22)；
The non-heat dissipation region (112) includes bending region (1121), is equipped with grid copper outside the bending region (1121)；
It is described to heat dissipating electronic devices (3) be camera module, the fixed area (2) further includes fixed plate (25), the center
(23) it is both secured to the fixed plate (25) with the metal frame (24), the fixed plate (25) is provided with for accommodating described take the photograph
As the accommodating space (251) of head module, the heat dissipation region (111) is located at the bottom of the accommodating space (251), the flexibility
The both ends of circuit board (1) are located at the outside of the accommodating space (251), and the bending region (1121) is located at the accommodating space
(251) side-walls.
2. mobile device as described in claim 1, which is characterized in that the heat radiating metallic layer (13) and the flexible circuit board
(1) surface at both ends is provided with conductive fabric (4), and is electrically connected by the conductive fabric (4) with corresponding component.
3. mobile device as claimed in claim 2, which is characterized in that the end of the flexible circuit board (1) is compacted component
(5) compress and/or be fixed on by screw the corresponding position of the fixed area (2).
4. mobile device as claimed in claim 3, which is characterized in that the first end of the flexible circuit board (1) passes through screw
It is fixed on the corresponding position of the fixed area (2), the obverse and reverse of the first end is provided with conductive fabric (4) from inside to outside
With protection board (6), the screw is across the protection board (6), the conductive fabric (4) and the first end and is fixed on described solid
Determine area (2).
5. mobile device as described in claim 1, which is characterized in that the heat radiating metallic layer (13) is real layers of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610797255.4A CN106332439B (en) | 2016-08-31 | 2016-08-31 | A kind of flexible circuit board, circuit connection structure and mobile device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610797255.4A CN106332439B (en) | 2016-08-31 | 2016-08-31 | A kind of flexible circuit board, circuit connection structure and mobile device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106332439A CN106332439A (en) | 2017-01-11 |
| CN106332439B true CN106332439B (en) | 2019-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610797255.4A Active CN106332439B (en) | 2016-08-31 | 2016-08-31 | A kind of flexible circuit board, circuit connection structure and mobile device |
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| Country | Link |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107221765A (en) * | 2017-06-23 | 2017-09-29 | 上海传英信息技术有限公司 | Electronic component ground structure |
| WO2020087409A1 (en) * | 2018-10-31 | 2020-05-07 | 北京比特大陆科技有限公司 | Circuit board and supercomputing device |
| WO2024120099A1 (en) * | 2022-12-06 | 2024-06-13 | 华为技术有限公司 | Cold plate assembly, electronic device, and liquid cooling system |
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| CN202121861U (en) * | 2011-06-16 | 2012-01-18 | 湖北奕宏精密制造有限公司 | Enhanced flexible circuit board |
| CN202178915U (en) * | 2011-07-15 | 2012-03-28 | 昆山雅森电子材料科技有限公司 | Blind hole double-face heat conducting circuit board |
| CN104284533A (en) * | 2008-09-28 | 2015-01-14 | 华为技术有限公司 | Multilayer circuit board, manufacturing method of multilayer circuit board and communication device |
| CN105407638A (en) * | 2015-12-01 | 2016-03-16 | 杨小荣 | High-thermal-conductivity low-cost flexible circuit board and production method thereof |
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|---|---|---|---|---|
| CN104284533A (en) * | 2008-09-28 | 2015-01-14 | 华为技术有限公司 | Multilayer circuit board, manufacturing method of multilayer circuit board and communication device |
| CN202121861U (en) * | 2011-06-16 | 2012-01-18 | 湖北奕宏精密制造有限公司 | Enhanced flexible circuit board |
| CN202178915U (en) * | 2011-07-15 | 2012-03-28 | 昆山雅森电子材料科技有限公司 | Blind hole double-face heat conducting circuit board |
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| CN106332439A (en) | 2017-01-11 |
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