CN206413354U - Chip electromagnetic shielding encapsulation - Google Patents
Chip electromagnetic shielding encapsulation Download PDFInfo
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- CN206413354U CN206413354U CN201621321611.7U CN201621321611U CN206413354U CN 206413354 U CN206413354 U CN 206413354U CN 201621321611 U CN201621321611 U CN 201621321611U CN 206413354 U CN206413354 U CN 206413354U
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Abstract
The utility model is related to electronic technology field.Chip electromagnetic shielding encapsulation, including an IC chip, IC chip are arranged on a circuit board, and a barrier shield being made up of absorbing material is fixed with circuit board；Covered with a conductive material layer above barrier shield, conductive material layer, barrier shield and circuit board surround a closed cavity, and IC chip is arranged in closed cavity.The barrier shield that the utility model is made up of absorbing material, isolates electromagnetic interference；Reflection loss is carried out to electromagnetic interference by conductive material layer, using structure of the present utility model, electromagnetic interference can effectively be prevented, while radiofrequency signal around IC chip is completely cut off by absorbing material, conductive material layer shields electromagnetic interference by RF reflection loss square on an integrated circuit die for IC chip.
Description
Technical field
The utility model is related to electronic technology field, more particularly to electromagnetic screen.
Background technology
Smart mobile phone with IC chip or for other product systems with radio frequency component, can produce electromagnetism
Interference causes circuit function to be affected by electromagnetic interference.
Utility model content
The purpose of this utility model is to encapsulate there is provided chip electromagnetic shielding, to solve at least one above-mentioned technical problem.
The technical problem that the utility model is solved can be realized using following technical scheme：
Chip electromagnetic shielding encapsulation, including an IC chip, the IC chip are arranged on a circuit board,
Characterized in that, being fixed with a barrier shield being made up of absorbing material on the circuit board, the barrier shield is around described integrated
Circuit chip is set；
Covered with a conductive material layer above the barrier shield, the conductive material layer, the barrier shield and the circuit
Plate surrounds a closed cavity, and the IC chip is arranged in the closed cavity.
The barrier shield that the utility model is made up of absorbing material, isolates electromagnetic interference；By conductive material layer to electromagnetism
Interference carries out reflection loss, using structure of the present utility model, can effectively prevent around electromagnetic interference, IC chip
Radiofrequency signal while completely cut off by absorbing material, conductive material layer passes through RF reflection loss square on an integrated circuit die
Electromagnetic interference is shielded for IC chip.
The conductive material layer is the conductive material layer being made up of conducing composite material.
The conductive material layer is the conductive material layer being made up of aluminium plate.While shielding electromagnetic interference can be realized,
The effect of radiating can also be realized.
The conductive material layer is the conductive material layer being made up of conductive fabric.Realize the effect of shielding electromagnetic interference.
The upper surface of the conductive material layer is connected with a heat dissipating layer being made up of heat sink material.
Thermal diffusion is realized by heat dissipating layer, so avoid by IC chip heat up caused by focus.
The heat dissipating layer is a heat dissipating layer being made up of graphite.Graphite radiating effect is good.
The barrier shield is in circular or rectangular ring.
The barrier shield is by the die cut barrier shield being made of absorbing material.
As a kind of preferred scheme, the conductive material layer is the conductive material layer being made up of copper foil, the conductive material
The thickness of layer is 7~15 microns；
The heat dissipating layer is the heat dissipating layer that a graphite flake is made, and the thickness of the heat dissipating layer is 20~30 microns.
The upper surface of the heat dissipating layer is also associated with a PET protection film, and the thickness of the PET protection film is 4~7 microns.
It the experiment proved that, using said structure, on the premise of cost is controlled, heat dispersion is excellent, and service life is long.
The electromagnetic shielding of IC chip of this kind of structure suitable for smart mobile phone.
It is fixed with the IC chip above a heat conductive pad, the heat conductive pad and props up the conductive material layer.
It is easy to pass the heat of IC chip through conductive material layer.The structure is more suitable in barrier shield being provided with least two
The structure of individual IC chip.
The conductive material layer is connected by a pressure sensitive adhesive with the Xi Bo mechanisms.Realize conductive material layer and Xi Bo mechanisms
Form non-conductive connection.
The Xi Bo mechanisms pass through circuit board described in a pressure-sensitive gemel connection.Realize that circuit board forms non-conductive with Xi Bo mechanisms
Connection.
The conductive material layer is connected by a pressure sensitive adhesive with the IC chip.It is easy to IC chip
Heat is passed through conductive material layer.
The absorbing material is a radio frequency absorbing material.So as to resist electromagnetic interference.
The barrier shield is provided with a ground metal layer, and the upper end of the ground metal layer connects the conductive material layer,
The lower end of the ground metal layer is provided with ground terminal, and the ground terminal connects the circuit board.
And then realize conductive material layer electrical grounding to the circuit board.Improve the effectiveness of conductive material layer.
That is, described conductive material layer connects the GND ends on the circuit board by the ground metal layer.GND ends are
Earth terminal on the circuit board.The GND ends can be the GND holes of a setting on circuit boards.It is easy to by ground terminal
Insertion GND holes are grounded.
The ground metal layer is the ground metal layer being made up of conducting foam material or conductive rubber material.Ground connection gold
Category layer has compressibility, by that can strengthen the ground connection between circuit board by compression.
A ground metal layer is provided with the closed cavity, the upper end of the ground metal layer connects the conductive material
Layer, the lower end of the ground metal layer is provided with ground terminal, and the ground terminal connects the circuit board.Realize conductive material layer
Electrical grounding.
That is, described conductive material layer connects the GND ends on the circuit board by the ground metal layer.GND ends are
Earth terminal on the circuit board.The GND ends can be the GND holes of a setting on circuit boards.It is easy to by ground terminal
Insertion GND holes are grounded.
The ground metal layer is screw or sleeve.
Realize conductive material layer electrical grounding to the circuit board.
Brief description of the drawings
Fig. 1 is a kind of structural representation of the present utility model；
Fig. 2 is a kind of structural representation of the present utility model；
Fig. 3 is a kind of a kind of perspective view of use Fig. 1 structures of the present utility model；
Fig. 4 is another structural representation of the present utility model；
Fig. 5 is another structural representation of the present utility model.
Embodiment
In order that technological means, creation characteristic, reached purpose and effect that the utility model is realized are easy to understand, under
Face, which combines to be specifically illustrating, is expanded on further the utility model.
Referring to Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, chip electromagnetic shielding encapsulation, including an IC chip 110, integrated electricity
Road chip 110 is arranged on a circuit board 120, and a barrier shield 104 being made up of absorbing material is fixed with circuit board 120；Screen
Cover the top of wall 104 and be connected with a conductive material layer 102 being made of an electrically conducting material, conductive material layer 102, barrier shield 104 and electricity
Road plate 120, which is surrounded, is equipped with IC chip 110 in a closed cavity, closed cavity.The utility model passes through absorbing material
The barrier shield 104 of composition, isolates electromagnetic interference；Reflection loss is carried out to electromagnetic interference by conductive material layer 102, using this reality
With new structure, can effectively prevent radiofrequency signal around electromagnetic interference, IC chip 110 by absorbing material every
While absolutely, conductive material layer 102 is IC chip by the RF reflection loss in the top of IC chip 110
110 shield electromagnetic interference.The cross section of conductive material layer is in a rectangle, and the cross section of barrier shield is in a ring-type rectangle, rectangle
Length be equal to the length of ring-type rectangle outer shroud, the width of rectangle is equal to the width of ring-type rectangle outer shroud.Realize conductive material layer
It is covered in the top of barrier shield.
Barrier shield 104 is in circular or rectangular ring.Absorbing material can be chosen for the AB5010R of 3M companies,
AB5020R.Barrier shield is by the die cut barrier shield being made of absorbing material.
Conductive material layer 102 is the conductive material layer 102 being made up of aluminium plate.The same of shielding electromagnetic interference can be realized
When, moreover it is possible to realize the effect of radiating.
Conductive material layer 102 is the conductive material layer 102 being made up of conductive fabric.Realize the effect of shielding electromagnetic interference.Lead
The upper surface of material layer 102 is connected with a heat dissipating layer being made up of heat sink material.Thermal diffusion is realized by heat dissipating layer, and then kept away
Exempt from by IC chip 110 heat up caused by focus.
Heat dissipating layer 108 is a heat dissipating layer 108 being made up of graphite.Graphite radiating effect is good.It is used as a kind of preferred scheme, ginseng
See Fig. 4, conductive material layer 102 is the conductive material layer 102 being made up of copper foil, and the thickness of conductive material layer 102 is micro- for 7~15
Rice；Heat dissipating layer 108 is the heat dissipating layer that a graphite flake is made, and the thickness of heat dissipating layer is 20~30 microns.This kind of structure is applied to intelligence
The electromagnetic shielding of IC chip in energy mobile phone.The upper surface of heat dissipating layer is also associated with a PET protection film, PET protection film
Thickness be 4~7 microns.It the experiment proved that, using said structure, on the premise of cost is controlled, heat dispersion is excellent, and makes
Use long lifespan.
Absorbing material is a radio frequency absorbing material.So as to resist electromagnetic interference.Absorbing material is adhesive.By inhaling ripple material
While material isolation electromagnetic interference, being fixedly connected for conductive material layer 102 and circuit board 120 can also be realized.
Referring to Fig. 1, Fig. 2, barrier shield 104 is provided with a ground metal layer 106, and the upper end connection of ground metal layer 106 is led
Material layer 102, the lower end of ground metal layer is provided with ground terminal, ground terminal connection circuit board.And then realize conductive material
Layer electrical grounding is to circuit board.Improve the effectiveness of conductive material layer.That is, circuit board 120 is provided with ground wire；It is conductive
Material layer 102 is connected to ground wire by a ground metal layer 106.And then realize the electrical grounding of conductive material layer 102 to circuit
Plate 120.Improve the effectiveness of conductive material layer 102.That is, conductive material layer 102 connects electricity by ground metal layer 106
GND ends on road plate 120.GND ends are the earth terminal on circuit board 120.GND ends can one be arranged on circuit board 120
GND holes.
Ground metal layer 106 is the ground metal layer 106 being made up of conducting foam material or conductive rubber material.Ground connection
Metal level 106 has compressibility, by that can strengthen the ground connection between circuit board 120 by compression.Barrier shield 104 is provided with one
Breach for dead earth metal level 106.Ground metal layer 106 is easy to implement to be fixed on barrier shield 104, and and conduction material
The bed of material 102 is connected.
A ground metal layer, the upper end connection conductive material layer of ground metal layer, ground metal layer are provided with closed cavity
Lower end be provided with ground terminal, ground terminal connection circuit board.Ground metal layer 106 is screw or sleeve.Realize conduction material
The electrical grounding of the bed of material 102 is to circuit board 120.
Referring to Fig. 5, conductive material layer 102 is connected by a heat conductive pad 422 with IC chip 110.Being easy to will be integrated
The heat of circuit chip is passed through conductive material layer.The structure is more suitable in barrier shield being provided with least two integrated circuits
The structure of chip.Ground metal layer is sleeve 420.Fig. 5 structure is applied to the electromagnetism of the IC chip of radio module
Shielding.Conductive material layer 102 is connected by a pressure sensitive adhesive with IC chip 110.It is easy to the heat of IC chip 110
Amount is passed through conductive material layer 102.
IC chip includes an encapsulating housing being made up of epoxy resin, and the top of encapsulating housing is used to hold provided with one
Put and liquid metal is filled with the groove of gallium, groove；IC chip is additionally provided with a steel radiator, steel radiator
Including a steel lid, radiating fin is provided with above steel lid；Heat exchange sheet metal is provided with below steel lid；Steel radiates
The steel lid of device covers groove, realizes sealing；In liquid metal in heat exchange sheet metal insertion groove.Radiating fin is contacted
Connect the lower surface of conductive material layer.Liquid metal is liquid at high temperature (such as more than 40 degree).Needing to dissipate chip
When hot, liquid conversion is completed.The mobility of liquid, under upper and lower temperature difference effect, can produce convection current, thermal diffusivity is far longer than solid-state
Metal.The heat loss through convection of liquid metal, and the radiator that solid metallic is made are combined by this patent, both ensure that liquid metal
The heat exchange performance of intensity, realizes the sealing to liquid metal again, it is ensured that the security of circuit.In addition, special in this patent
The steel radiator that Cai Yong be formed from steel, rather than using conventional aluminium radiator.The dissolving for avoiding same phase metal is rotten
Erosion.Liquid metal can be gallium alloy.Gallium alloy can be indium gallium alloy.
General principle of the present utility model and principal character and advantage of the present utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the utility model is not restricted to the described embodiments, described in above-described embodiment and specification
Simply illustrate principle of the present utility model, on the premise of the utility model spirit and scope are not departed from, the utility model is also
Various changes and modifications are had, these changes and improvements are both fallen within the range of claimed the utility model.The utility model
Claimed scope is by appended claims and its equivalent thereof.
Claims (10)
1. chip electromagnetic shielding encapsulation, including an IC chip, the IC chip are arranged on a circuit board, its
It is characterised by, a barrier shield being made up of absorbing material is fixed with the circuit board, and the barrier shield surrounds the integrated electricity
Road chip is set；
Covered with a conductive material layer above the barrier shield, the conductive material layer, the barrier shield enclose with the circuit board
Into a closed cavity, the IC chip is arranged in the closed cavity.
2. chip electromagnetic shielding encapsulation according to claim 1, it is characterised in that the conductive material layer is by aluminium plate
Or the conductive material layer that conductive fabric is constituted.
3. chip electromagnetic shielding encapsulation according to claim 1, it is characterised in that the upper surface of the conductive material layer connects
It is connected to a heat dissipating layer being made up of heat sink material.
4. chip electromagnetic shielding encapsulation according to claim 3, it is characterised in that the conductive material layer is by copper foil structure
Into conductive material layer, the thickness of the conductive material layer is 7~15 microns；
The heat dissipating layer is the heat dissipating layer that a graphite flake is made, and the thickness of the heat dissipating layer is 20~30 microns.
5. chip electromagnetic shielding encapsulation according to claim 4, it is characterised in that the upper surface of the heat dissipating layer is also connected with
There is a PET protection film, the thickness of the PET protection film is 4~7 microns.
6. chip electromagnetic shielding encapsulation according to claim 1, it is characterised in that the conductive material layer passes through a heat conduction
Pad is connected with the IC chip.
7. chip electromagnetic shielding encapsulation according to claim 1, it is characterised in that the barrier shield is provided with a ground connection gold
Belong to layer, the upper end of the ground metal layer connects the conductive material layer, and the lower end of the ground metal layer is provided with ground terminal,
The ground terminal connects the circuit board.
8. chip electromagnetic shielding encapsulation according to claim 7, it is characterised in that the ground metal layer is by conduction bubble
The ground metal layer that cotton material or conductive rubber material are made.
9. chip electromagnetic shielding encapsulation according to claim 1, it is characterised in that provided with a ground connection in the closed cavity
Metal level, the upper end of the ground metal layer connects the conductive material layer, and the lower end of the ground metal layer is provided with earth terminal
Son, the ground terminal connects the circuit board.
10. chip according to claim 9 electromagnetic shielding encapsulation, it is characterised in that the ground metal layer be screw or
Person's sleeve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621321611.7U CN206413354U (en) | 2016-12-05 | 2016-12-05 | Chip electromagnetic shielding encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621321611.7U CN206413354U (en) | 2016-12-05 | 2016-12-05 | Chip electromagnetic shielding encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206413354U true CN206413354U (en) | 2017-08-15 |
Family
ID=59550441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621321611.7U Active CN206413354U (en) | 2016-12-05 | 2016-12-05 | Chip electromagnetic shielding encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206413354U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110224081A (en) * | 2019-06-24 | 2019-09-10 | 京东方科技集团股份有限公司 | A kind of display module and display equipment |
| CN110827694A (en) * | 2019-11-29 | 2020-02-21 | 上海天马有机发光显示技术有限公司 | Display panel and display device |
| CN111917433A (en) * | 2020-06-22 | 2020-11-10 | 安徽派斯客网络科技有限公司 | Communication terminal |
-
2016
- 2016-12-05 CN CN201621321611.7U patent/CN206413354U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110224081A (en) * | 2019-06-24 | 2019-09-10 | 京东方科技集团股份有限公司 | A kind of display module and display equipment |
| CN110224081B (en) * | 2019-06-24 | 2022-04-12 | 京东方科技集团股份有限公司 | Display module assembly and display device |
| CN110827694A (en) * | 2019-11-29 | 2020-02-21 | 上海天马有机发光显示技术有限公司 | Display panel and display device |
| CN111917433A (en) * | 2020-06-22 | 2020-11-10 | 安徽派斯客网络科技有限公司 | Communication terminal |
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| GR01 | Patent grant |