CN107484403A - Radome, circuit board assemblies and electronic equipment - Google Patents
Radome, circuit board assemblies and electronic equipment Download PDFInfo
- Publication number
- CN107484403A CN107484403A CN201710852851.2A CN201710852851A CN107484403A CN 107484403 A CN107484403 A CN 107484403A CN 201710852851 A CN201710852851 A CN 201710852851A CN 107484403 A CN107484403 A CN 107484403A
- Authority
- CN
- China
- Prior art keywords
- radome
- screening cover
- framework
- circuit board
- boss
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
Abstract
The present invention is applied to technical field of electronic equipment, there is provided a kind of radome, circuit board assemblies and electronic equipment.Wherein, circuit board assemblies include substrate and radome, electronic module are provided with the surface of substrate, for radome housing on electronic module, substrate inside has the conductive layer being used as with reference to main ground.Jack is offered on substrate, there is electric-conductor on the hole wall of jack, electric-conductor is electrically connected with conductive layer；The bottom of radome is provided with plug-in unit, and plug-in unit is inserted in jack, and is electrically connected with electric-conductor.Because electric-conductor inside substrate directly with being used as being electrically connected with reference to the conductive layer on main ground, so, the radiation interference signals on radome, which need to only pass through electric-conductor, can be importing directly into the main ground of reference inside substrate.It can be seen that the circuit board assemblies of the present embodiment are by shortening radome and with reference to the loop between main ground, reducing impedance, improve the ability of radome radiation-screening interference signal.
Description
Technical field
The invention belongs to technical field of electronic equipment, more particularly to a kind of radome, circuit board assemblies and electronic equipment.
Background technology
As the intelligentized continuous development of electronic equipment, the function of electronic equipment are also more and more.At the same time, electronics is set
Electronic module in putting is also more and more and densely distributed.Because electronic module can outwards give off e-mail at work
Number, if nearer at a distance of obtaining between electronic module, the signal between electronic module will necessarily interfere, and then influence electronics and set
Standby performance.
Radome is mainly used in the fields such as communication terminal, GPS, for preventing the interference between module, or secondary mould
Block radiation interference is to other signals, and when module work has radiation interference, radiation interference can imported into electricity again by radome
In the main ground of reference of road plate, the impedance in this loop is smaller, and radiation interference signals are smaller, and the effect of radiation-screening interference signal is got over
It is good.At present, radome is fixed by welding on the surface of circuit board, and is referred to and be then arranged inside circuit board mainly, so,
Loop between radome and the main ground of reference is longer, and impedance is larger, so as to have impact on the effect of radiation-screening interference signal.
The content of the invention
Embodiments of the invention can solve the impedance for reducing radome loop, improve radome radiation-screening interference signal
Ability.
In order to solve the above technical problems, the present embodiment provides a kind of circuit board assemblies, including substrate and radome, it is described
Electronic module is provided with the surface of substrate, the radome housing has use on the electronic module inside the substrate
Make the conductive layer with reference to main ground；Jack is offered on the substrate, there is electric-conductor, the electric-conductor on the hole wall of the jack
It is electrically connected with the conductive layer；The bottom of the radome is provided with plug-in unit, and the plug-in unit is inserted in the jack, and
And the plug-in unit is electrically connected with the electric-conductor.
Further, the radome includes shielding framework and screening cover, the screening cover cover at the mask frame
The top of body, the shielding framework have mutually chimeric concaveconvex structure with the junction of screening cover.
Further, the electric-conductor is the copper sheet being covered on the jack hole wall.
The present embodiment is in order to solve the above technical problems, additionally provide a kind of radome, including shielding framework and screening cover,
The screening cover covers at the top of the shielding framework, and the bottom of the shielding framework is provided with for inserting in circuit board
Plug-in unit.
Further, the shielding framework has mutually chimeric concaveconvex structure with the junction of screening cover.
Further, the bottom surface of the screening cover has first boss, and the top surface of the shielding framework has the first groove,
In first groove of the first boss insertion shielding framework of the screening cover.
Further, the bottom surface of the screening cover has the first groove, and the top surface of the shielding framework has first boss,
The first boss of the shielding framework is embedded in the first groove of the screening cover
Further, the edge of the screening cover bottom surface extends the side wall of protrusion bottom surface, and the medial surface of the side wall is set
Second boss is equipped with, correspondingly, the lateral surface at the top of the shielding framework is provided with the second groove, and the second of the screening cover is convex
Platform and the second groove of the shielding framework are mutually chimeric.
Further, the edge of the screening cover bottom surface extends the side wall of protrusion bottom surface, and the medial surface of the side wall is set
The second groove is equipped with, correspondingly, the lateral surface at the top of the shielding framework is provided with second boss, and the second of the screening cover is recessed
Groove and the second boss of the shielding framework are mutually chimeric.
The present embodiment in order to solve the above technical problems, also provide a kind of electronic equipment again, including it is above-mentioned in circuit board
Component.
Compared with prior art, beneficial effect is the present embodiment：The bottom for the radome that the present embodiment provides is provided with
Plug-in unit, jack is offered on the substrate of circuit board, electric-conductor is provided with the hole wall of jack, after radome installation, radome
Plug-in unit is inserted in the jack of substrate.Plug-in unit realizes electrical connection after being contacted with the electric-conductor in jack.Because electric-conductor is direct
With inside substrate be used as with reference to it is main ground conductive layer be electrically connected, so, the radiation interference signals on radome only need by
Electric-conductor can be importing directly into the main ground of reference inside substrate.And the conductive path between plug-in unit and conductive layer only has conduction
The length of part, it is seen then that the circuit board assemblies of the present embodiment are by shortening radome and with reference to the loop between main ground, reducing resistance
It is anti-, improve the ability of radome radiation-screening interference signal.
Brief description of the drawings
One or more embodiments are illustrative by the picture in corresponding accompanying drawing, these exemplary theorys
The bright restriction not formed to embodiment, the element for having same reference numbers label in accompanying drawing are expressed as similar element, removed
Non- have a special statement, and composition does not limit the figure in accompanying drawing.
Fig. 1 is a kind of dimensional structure diagram for circuit board assemblies that the embodiment of the present invention one provides；
Fig. 2 is the decomposition texture schematic diagram of circuit board assemblies shown in Fig. 1；
Fig. 3 is longitudinal schematic cross-sectional view of circuit board assemblies shown in Fig. 1；
Fig. 4 is the dimensional structure diagram of the part of circuit board assemblies shown in Fig. 1；
Fig. 5 is the internal structure schematic diagram for a kind of electronic equipment that the embodiment of the present invention one provides；
Fig. 6 is a kind of longitudinal schematic cross-sectional view for circuit board assemblies that the embodiment of the present invention two provides；
Fig. 7 is the longitudinal schematic cross-sectional view for another circuit board assemblies that the embodiment of the present invention two provides；
Fig. 8 is a kind of longitudinal schematic cross-sectional view for circuit board assemblies that the embodiment of the present invention three provides.
Embodiment
In order that technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Drawings and Examples are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
Embodiment one：
Refer to Fig. 1 to Fig. 4, present embodiments provide a kind of circuit board assemblies 100, including substrate 1, electronic module 2 with
And radome 3.
Electronic module 2 is arranged on the surface of substrate 1, and the housing of radome 3 is on electronic module 2.The inside of substrate 1, which has, to be used
Make the conductive layer 10 with reference to main ground, meanwhile, capture pad 11 is provided with the surface of the substrate 1, corresponding to capture pad 11
Region in offer jack 12, there is electric-conductor 13, in the present embodiment, electric-conductor 13 is is covered on the hole wall of jack 12
The copper sheet on the hole wall of jack 12 is stated, electric-conductor 13 is contacted with conductive layer 11 so as to realize electrical connection.
Radome 3 includes shielding framework 31 and screening cover 32, and screening cover 32 covers at the top of shielding framework 31, shielding
The bottom of framework 31 is provided with plug-in unit 311, and after radome 3 is installed, plug-in unit 311 is inserted in jack 12, also, plug-in unit 311 with
Electric-conductor 13 is contacted so as to realize electrical connection.
Fig. 5 is referred to, the present embodiment additionally provides a kind of electronic equipment 200, and it includes housing 300 and above-mentioned circuit
Board component 100.
The bottom for the radome 3 that the present embodiment provides is provided with plug-in unit 311, and jack 12 is offered on the substrate 1 of circuit board,
Electric-conductor 13 is provided with the hole wall of jack 12, after radome 3 is installed, the plug-in unit 311 of radome 3 is inserted in the jack of substrate 1
In 12.Plug-in unit 311 realizes electrical connection after being contacted with the electric-conductor 13 in jack 12.Due to electric-conductor 13 directly with substrate 1
Portion is used as being electrically connected with reference to the conductive layer 11 on main ground, so, the radiation interference signals on radome 3 need to only pass through electric-conductor
13 can be importing directly into the main ground of reference inside substrate 1.And the conductive path between plug-in unit 311 and conductive layer 10 is only led
The length of electric part 13, it is seen then that the circuit board assemblies 100 of the present embodiment by shortening radome 3 and with reference to the loop between main ground,
Impedance is reduced, improves the ability of the radiation-screening interference signal of radome 3.
Optimally, in the present embodiment, the junction of screening cover 32 is provided with mutually chimeric bumps in shielding framework 31
Structure.Because the contact structures of bumps have larger contact area relative to the contact structures of plane, so, can further it subtract
Impedance between small screening cover 32 and shielding framework 31.
Specifically, there is first boss 321, the top surface tool of shielding framework 31 continuing with the bottom surface referring to Fig. 3, screening cover 32
There is the first groove 312, the insertion of first boss 321 of screening cover 32 is shielded in the first groove 312 of framework 31.In practical application
In, the concrete shape of the groove 312 of first boss 321 and first is not limited, for example, it may be zigzag or wavy.
Embodiment two：
The present embodiment and the difference of embodiment one are that the position of the concaveconvex structure of the present embodiment is changed.
Fig. 6 is referred to, the edge of the bottom surface of screening cover 32 extends the side wall 322 of protrusion bottom surface, and the medial surface of side wall 322 is provided with second
Boss 323, correspondingly, the lateral surface at the top of shielding framework 31 are provided with the second groove 313, the second boss 323 of screening cover 32
It is mutually chimeric with the second groove 313 for shielding framework 31.
It is easily understood that above-mentioned second boss 323, the position of the second groove 313 can exchange.Fig. 7 is referred to, for this
The structure for another radome that embodiment provides.Extend the side wall 322 of protrusion bottom surface, side wall in the edge of the bottom surface of screening cover 32
322 medial surface is provided with the second groove 324, and correspondingly, the lateral surface in the top of shielding framework 31 is provided with second boss
314, the second groove 324 of screening cover 32 and the second boss 314 for shielding framework 31 are mutually chimeric.
Compared with embodiment one, embodiment adds the contact surface of the medial surface of screening cover 32 and the shielding lateral surface of framework 31
Product, so as to further increase screening cover 32 and shield the contact area between framework 31.
Embodiment three：
The present embodiment and the difference of embodiment one are that the present embodiment adds implementation on the basis of embodiment one
The structure of example two, Fig. 8 is referred to, the bottom surface of screening cover 32 is provided with first boss 321, and the edge of the bottom surface of screening cover 32 extends
The side wall 322 of bottom surface is protruded, the medial surface of side wall 322 is provided with the second groove 324.The top surface of shielding framework 31 is provided with first
Groove 312, meanwhile, the lateral surface at the top of shielding framework 31 is provided with second boss 314.When screening cover 32 and the shielding knot of framework 31
After conjunction, in the first groove 312 of the insertion shielding framework 31 of first boss 321 of screening cover 32, the second boss of framework 31 is shielded
In second groove 324 of 314 insertion screening covers 32.
Compared with embodiment one and two, there is bigger contact surface between the screening cover and shielding framework in the present embodiment
Product.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
1. a kind of circuit board assemblies, including substrate and radome, electronic module, the screen are provided with the surface of the substrate
Cover housing is covered on the electronic module, and the substrate inside has the conductive layer being used as with reference to main ground；It is characterized in that, described
Jack is offered on substrate, there is electric-conductor on the hole wall of the jack, the electric-conductor is electrically connected with the conductive layer；Institute
The bottom for stating radome is provided with plug-in unit, and the plug-in unit is inserted in the jack, also, the plug-in unit and electric-conductor electricity
Gas connects.
2. circuit board assemblies as claimed in claim 1, it is characterised in that the radome includes shielding framework and shielding
Lid, the screening cover cover at the top of the shielding framework, and the junction for shielding framework and screening cover is with mutually embedding
The concaveconvex structure of conjunction.
3. circuit board assemblies as claimed in claim 1 or 2, it is characterised in that the electric-conductor is to be covered in the jack hole
Copper sheet on wall.
4. a kind of radome, including shielding framework and screening cover, the screening cover covers at the top of the shielding framework, its
It is characterised by, the bottom of the shielding framework is provided with for inserting the plug-in unit in circuit board.
5. radome as claimed in claim 4, it is characterised in that the junction of the shielding framework and screening cover has mutual
Chimeric concaveconvex structure.
6. radome as claimed in claim 5, it is characterised in that the bottom surface of the screening cover has first boss, the screen
Covering the top surface of framework has the first groove, and the first boss of the screening cover is embedded in the first groove of the shielding framework.
7. radome as claimed in claim 5, it is characterised in that the bottom surface of the screening cover has the first groove, the screen
Covering the top surface of framework has first boss, and the first boss of the shielding framework is embedded in the first groove of the screening cover.
8. radome as claimed in claims 6 or 7, it is characterised in that extend protrusion bottom in the edge of the screening cover bottom surface
The side wall in face, the medial surface of the side wall are provided with second boss, and correspondingly, the lateral surface at the top of the shielding framework is provided with
Second groove, the second boss of the screening cover and the second groove of the shielding framework are mutually chimeric.
9. the radome as described in claim 6 or 8, it is characterised in that extend protrusion bottom in the edge of the screening cover bottom surface
The side wall in face, the medial surface of the side wall are provided with the second groove, and correspondingly, the lateral surface at the top of the shielding framework is provided with
Second boss, the second groove of the screening cover and the second boss of the shielding framework are mutually chimeric.
10. a kind of electronic equipment, it is characterised in that it is included such as the circuit board assemblies of any one in claims 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710852851.2A CN107484403B (en) | 2017-09-19 | 2017-09-19 | Shielding case, circuit board assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710852851.2A CN107484403B (en) | 2017-09-19 | 2017-09-19 | Shielding case, circuit board assembly and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107484403A true CN107484403A (en) | 2017-12-15 |
| CN107484403B CN107484403B (en) | 2020-02-14 |
Family
ID=60587125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710852851.2A Active CN107484403B (en) | 2017-09-19 | 2017-09-19 | Shielding case, circuit board assembly and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107484403B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108513515A (en) * | 2018-06-11 | 2018-09-07 | Oppo广东移动通信有限公司 | Housing unit and electronic device |
| CN111050534A (en) * | 2019-12-19 | 2020-04-21 | Oppo广东移动通信有限公司 | Substrate assembly and network device |
| RU2791302C1 (en) * | 2019-07-29 | 2023-03-07 | Хонор Дивайс Ко., Лтд. | Shielding housing and electronic device |
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| CN1083655A (en) * | 1992-08-28 | 1994-03-09 | 汤姆森消费电子有限公司 | The printed circuit board shield assembly of tuner etc. |
| CN1086950A (en) * | 1992-10-29 | 1994-05-18 | 西门子公司 | The rear wall printed substrate of frame parts |
| CN1430466A (en) * | 2001-12-11 | 2003-07-16 | 日本碍子株式会社 | Set-up structure of shield casing of circuit base plate or flat aerial |
| CN101083897A (en) * | 2006-05-29 | 2007-12-05 | 华硕电脑股份有限公司 | Electromagnetic shielding device and method for making the same |
| CN101378647A (en) * | 2007-08-31 | 2009-03-04 | 莱尔德技术股份有限公司 | Electromagnetic interference shields and related manufacturing methods |
| CN102858144A (en) * | 2010-07-21 | 2013-01-02 | 保罗·道格拉斯·科克拉内 | Three-dimensional shapes with multiple parametric geometries and surfaces formed in electronics enclosures for providing electromagnetic interference (EMI) shielding |
| CN104936425A (en) * | 2014-03-17 | 2015-09-23 | 三星电子株式会社 | Shield can, electronic device, and manufacturing method thereof |
| CN205196229U (en) * | 2015-10-10 | 2016-04-27 | 上海与德通讯技术有限公司 | Two formula shield cover supports, two formula shield covers and electronic equipment |
| CN205987701U (en) * | 2016-08-31 | 2017-02-22 | 广州海格智能科技有限公司 | Block structure of shield cover |
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2017
- 2017-09-19 CN CN201710852851.2A patent/CN107484403B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1083655A (en) * | 1992-08-28 | 1994-03-09 | 汤姆森消费电子有限公司 | The printed circuit board shield assembly of tuner etc. |
| CN1086950A (en) * | 1992-10-29 | 1994-05-18 | 西门子公司 | The rear wall printed substrate of frame parts |
| CN1430466A (en) * | 2001-12-11 | 2003-07-16 | 日本碍子株式会社 | Set-up structure of shield casing of circuit base plate or flat aerial |
| CN101083897A (en) * | 2006-05-29 | 2007-12-05 | 华硕电脑股份有限公司 | Electromagnetic shielding device and method for making the same |
| CN101378647A (en) * | 2007-08-31 | 2009-03-04 | 莱尔德技术股份有限公司 | Electromagnetic interference shields and related manufacturing methods |
| CN102858144A (en) * | 2010-07-21 | 2013-01-02 | 保罗·道格拉斯·科克拉内 | Three-dimensional shapes with multiple parametric geometries and surfaces formed in electronics enclosures for providing electromagnetic interference (EMI) shielding |
| CN104936425A (en) * | 2014-03-17 | 2015-09-23 | 三星电子株式会社 | Shield can, electronic device, and manufacturing method thereof |
| CN205196229U (en) * | 2015-10-10 | 2016-04-27 | 上海与德通讯技术有限公司 | Two formula shield cover supports, two formula shield covers and electronic equipment |
| CN205987701U (en) * | 2016-08-31 | 2017-02-22 | 广州海格智能科技有限公司 | Block structure of shield cover |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108513515A (en) * | 2018-06-11 | 2018-09-07 | Oppo广东移动通信有限公司 | Housing unit and electronic device |
| CN108513515B (en) * | 2018-06-11 | 2020-10-02 | Oppo广东移动通信有限公司 | Shell assembly and electronic device |
| RU2791302C1 (en) * | 2019-07-29 | 2023-03-07 | Хонор Дивайс Ко., Лтд. | Shielding housing and electronic device |
| CN111050534A (en) * | 2019-12-19 | 2020-04-21 | Oppo广东移动通信有限公司 | Substrate assembly and network device |
| CN111050534B (en) * | 2019-12-19 | 2022-02-18 | Oppo广东移动通信有限公司 | Substrate assembly and network device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107484403B (en) | 2020-02-14 |
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| CB02 | Change of applicant information |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant before: Guangdong Opel Mobile Communications Co., Ltd. |
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