CN107105596A - Radiating subassembly - Google Patents

Radiating subassembly Download PDF

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Publication number
CN107105596A
CN107105596A CN201610100015.4A CN201610100015A CN107105596A CN 107105596 A CN107105596 A CN 107105596A CN 201610100015 A CN201610100015 A CN 201610100015A CN 107105596 A CN107105596 A CN 107105596A
Authority
CN
China
Prior art keywords
radiator
pcb board
chip
conducting
radiating subassembly
Prior art date
Application number
CN201610100015.4A
Other languages
Chinese (zh)
Inventor
马光明
於明剑
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Priority to CN201610100015.4A priority Critical patent/CN107105596A/en
Publication of CN107105596A publication Critical patent/CN107105596A/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans, caps, conformal shields

Abstract

The invention discloses a kind of radiating subassembly, radiating subassembly includes pcb board, the chip on pcb board, conducting connecting part and radiator, radiator filler cap is at the top of chip, conducting connecting part is enclosed around chip, and the earth signal layer and radiator of conducting connecting part connection pcb board, conducting connecting part, pcb board and radiator collectively form a shielding cavity, and chip is located inside the shielding cavity.The present invention collectively forms a shielding cavity more closed by conducting connecting part, pcb board and radiator, and chip is located inside the shielding cavity, and radiator and conducting connecting part receive electromagnetic interference and produce interference electric current;Interference electric current can not be reached inside shielding cavity due to the shielding action of shielding cavity, so that the normal work of chip can not be interfered with.

Description

Radiating subassembly
Technical field
The present invention relates to communication electronic device technical field, more particularly to a kind of radiating subassembly.
Background technology
Radiator is one of high-power communication or the indispensable part of electronic equipment, can improve equipment big The heat-sinking capability of power device, effectively reduces the operating temperature of these devices, is that equipment steady operation is created Good condition.
The heat that radiator avoids high power device gathers soaring with temperature, but brings simultaneously new Problem.Radiator is made up of conductive metal material mostly, can be done as the electromagnetism of antenna reception space Disturb to form larger interference electric current.And in order to preferably radiate, the distance between radiator and chip are very It is small, only a thin layer of heat-conducting silicone grease in many cases, heat spreader metals body and chip internal circuits it Between very close to this just further has influence on chip normal work wound for the space interference that receives on radiator Condition is made.Substantial amounts of EMC (Electro Magnetic Compatibility, Electro Magnetic Compatibility) experiment Electromagnetic interference caused by this point, particularly static discharge is also demonstrated, day " is received by radiator Line " effect, in chip surface formation interference electric current, ultimately results in chip error code or even reset.
The content of the invention
It is a primary object of the present invention to provide a kind of radiating subassembly, it is intended to solve existing radiator and easily connect Spatial electromagnetic interference is received, the technical problem of chip normal work is influenceed.
To achieve the above object, the embodiment of the present invention provides a kind of radiating subassembly, and the radiating subassembly includes Pcb board, the chip on the pcb board, conducting connecting part and radiator, the radiator filler cap are set At the top of the chip, the conducting connecting part is enclosed around the chip, and the conducting connecting part Connect the earth signal layer and the radiator, the conducting connecting part, pcb board and radiating of the pcb board Device collectively forms a shielding cavity, and the chip is located inside the shielding cavity.
Preferably, the ground via for connecting the earth signal layer, the ground connection are offered on the pcb board Via be it is multiple and set around the arrangements of chips, the conducting connecting part connect the ground via and The radiator.
Preferably, the conducting connecting part is conductive gasket, and the conductive gasket is located in the radiator Between pcb board, the conductive gasket side is fitted with the ground via, opposite side and the radiating Device is fitted.
Preferably, the track for being connected in series each described ground via is additionally provided with the pcb board Road, the distribution of the conductive gasket is adapted to the printed wiring topological shape, the conductive gasket and institute State printed wiring laminating.
Preferably, the radiator is provided with towards the side of the pcb board and is laid out shape with the printed wiring The groove of shape adaptation, the conductive gasket part is caught in the groove.
Preferably, the radiator includes the base fitted with the chip and deviates from institute located at the base The radiating fin of pcb board side is stated, the base is provided with and the track towards the side of the pcb board The groove of road topological shape adaptation.
Preferably, the conductive gasket is elastic component, and the width of the groove is less than the conductive gasket Width, the depth of the groove is less than the thickness of the conductive gasket, the conductive gasket and the groove Interference fit.
Preferably, the conducting connecting part is the pin being connected with the radiator, the pcb board direction The side of the radiator is provided with welding structure corresponding with the Pin locations, and the pin is welded in institute State in welding structure to connect the pcb board and the radiator.
Preferably, the welding structure is the ground via for connecting the earth signal layer.
Preferably, the radiator is fitted and connected with the chip by chill bar or heat-conducting silicone grease.
The present invention collectively forms a shielding more closed by conducting connecting part, pcb board and radiator Cavity, and chip is inside the shielding cavity, and radiator and conducting connecting part receive electromagnetic interference production Raw interference electric current;Interference electric current can not be reached inside shielding cavity due to the shielding action of shielding cavity, from And the normal work of chip can not be interfered with, and then it is dry to solve the easy reception space electromagnetism of existing radiator Disturb, influence the technical problem of chip normal work.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to reality The accompanying drawing used required for applying in example or description of the prior art is briefly described, it should be apparent that, below Accompanying drawing in description is only some embodiments of the present invention, for those of ordinary skill in the art, On the premise of not paying creative work, it can also obtain other according to the structure shown in these accompanying drawings Accompanying drawing.
Fig. 1 is the cross section structure diagram of the embodiment of radiator structure one of the present invention;
Fig. 2 is the overlooking the structure diagram of Fig. 1 radiator structures;
Fig. 3 is the cross section structure diagram of another embodiment of radiator structure of the present invention;
Fig. 4 is the overlooking the structure diagram of Fig. 3 radiator structures.
Drawing reference numeral explanation:
Pcb board 1 Ground via 11 Groove 43 Chip 2
Conducting connecting part 3 Conductive gasket 31 Pin 32 Radiator 4
Base 41 Radiating fin 42
The realization, functional characteristics and advantage of the object of the invention will be done further referring to the drawings in conjunction with the embodiments Explanation.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the present invention, Rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not having The every other embodiment obtained under the premise of creative work is made, the scope of protection of the invention is belonged to.
It is to be appreciated that in the embodiment of the present invention institute it is directional indicate (such as upper and lower, left and right, it is preceding, It is only used for explaining the relative position under a certain particular pose (as shown in drawings) between each part afterwards ...) Relation, motion conditions etc. are put, if the particular pose changes, directionality indicates also corresponding Ground changes therewith.
In addition, the description for being related to " first ", " second " etc. in the present invention is only used for describing purpose, And it is not intended that indicating or implying its relative importance or the implicit number for indicating indicated technical characteristic Amount.Thus, " first " is defined, the feature of " second " can be expressed or implicitly include at least One this feature.In addition, the technical scheme between each embodiment can be combined with each other, but must be Can be implemented as basis with those of ordinary skill in the art, when technical scheme combination occur it is conflicting or It will be understood that the combination of this technical scheme is not present when can not realize, also not in the protection of application claims Within the scope of.
The present invention proposes a kind of radiating subassembly, and the radiating subassembly is mainly used in communication apparatus or electronic equipment In, in the embodiment of radiating subassembly one of the present invention, referring to Figures 1 and 2, the radiating subassembly includes PCB Plate 1 (Printed Circuit Board, printed circuit board), the chip 2 on pcb board 1, conduction are even Fitting 31 and radiator 4, radiator 4 are covered on the top of chip 2, and conducting connecting part 31 is enclosed located at chip Around 2, and the conducting connecting part 31 connects the earth signal layer (not shown) of pcb board 1 and dissipated Hot device 4, conducting connecting part 31, pcb board 1 and radiator 4 collectively form a shielding cavity, and Chip 2 is located inside the shielding cavity.
Chip 2 is mounted on the surface of pcb board 1, and chip 2 is away from the side of pcb board 1 and radiator 4 Laminating, the i.e. top of chip 2 is fitted with radiator 4 close to the side of pcb board 1, alternatively, radiator 4 are fitted and connected with chip 2 by chill bar or heat-conducting silicone grease.Radiator 4 and conducting connecting part 31 are excellent Elect metallic conduction part as, conducting connecting part 31 is enclosed on pcb board around chip 2.
In the present embodiment, conducting connecting part 31, pcb board 1 and radiator 4 collectively form one more The shielding cavity of closing, and chip 2 is inside the shielding cavity, radiator 4 and conducting connecting part 31 because " reception antenna effect " (i.e. as the electromagnetic interference formation interference electric current of antenna reception space) connects Receive electromagnetic interference and produce interference electric current, interference electric current can not reach screen due to the shielding action of shielding cavity Intracavitary portion is covered, so that the normal work of chip 2 can not be interfered with, and then it is easy to solve existing radiator Reception space electromagnetic interference, influences the technical problem of chip normal work.Meanwhile, using present invention radiating The electronic equipment or communication apparatus of structure, the electromagnetic interference resistivity to chip have no special requirements, it is impossible to The strong chip of electromagnetic interference resistivity is chosen by test of many times, many time costs and money is saved Golden cost;The route of transmission of electromagnetic interference need not be cut off or dampening measures, without spending people Power physics removes the technical barrier that the route of transmission for overcoming cut-out or decay electromagnetic interference is brought and attaches bad Influence.
Further, referring to Figures 1 and 2, communicatively signals layer (i.e. PCB is offered on pcb board 1 The stratum of plate 1) ground via 11, ground via 11 is multiple and around the spread configuration of chip 2, is led Electrical connector 31 connects ground via 11 and radiator 4.
When pcb board 1 is sandwich construction, the ground via 11 on pcb board 1 connects pcb board 1 Each Rotating fields, so as to avoid conducting connecting part 31 from only being contacted with the surface of pcb board and influence pcb board 1 Shield effectiveness.Also, ground via 11 is multiple, can be distributed in regular shape (such as rectangle) Around chip 2, it is easy to the processing of pcb board 2;Conducting connecting part 31 respectively with pcb board 1 On ground via 11, radiator 4 connect, with ensure conducting connecting part 31, ground via 11 and dissipate Circuit turn-on between hot device 4, so that radiator 4, conducting connecting part 31 and pcb board 1 constitute closing Shielding cavity, so that chip 2 is wrapped in inside shielding cavity to avoid interference electric current to chip 2 Influence.
Further, conducting connecting part 31 is conductive gasket (being represented below with 31), conductive gasket 31 It is located between radiator 4 and pcb board 1, the side of conductive gasket 31 is fitted, separately with ground via 11 Fitted with radiator 4 side.Certainly, conductive gasket 31 can also for conductive fabric, conductive rubber band etc. its Its electric-conductor.
Reference picture 2, the extension shape that conductive gasket 31 is fitted on pcb board is arranged with ground via 11 The topological shape adaptation constituted, alternatively, conductive gasket 31 encloses the strip around chip 2 for one Gap between part, and the closing radiator 4 of conductive gasket 31 and pcb board 1, so that conductive gasket 31 Contacted well with radiator 4, ground via 11, so that radiator 4, conductive gasket 31 and pcb board structure Into the conductive shield chamber of a receiving chip 2, due to Kelvin effect, the electricity in the reception space of radiator 4 The interference electric current that magnetic wave is formed flows through from the conductive shield chamber surface, and can not close to chip 2, to prevent Only interference electric current influences the normal work of chip 2.
Further, it is additionally provided with the printed wiring for being connected in series each ground via 11 on pcb board 1 (not shown), the distribution of conductive gasket 31 is adapted to printed wiring topological shape, conductive gasket 31 Fitted with printed wiring.Printed wiring is the wire (such as scolding tin) for being covered in pcb board surface, track Each ground via 11 is connected on road, and (such as printed wiring connects ground via 11, common structure for conducting Rectangular conductive pane), increase the contact area of ground via 11 and conductive gasket 31, it is to avoid due to connecing The contact area of ground via 11 and conductive gasket 31 is too small and causes loose contact, so as to avoid because of ground connection Via 11 and the loose contact of conductive gasket 31 and cause radiator 4, conductive gasket 31 and pcb board to constitute Conductive shield chamber shield effectiveness.
Alternatively, reference picture 1, radiator 4 is provided with towards the side of pcb board 1 and is laid out with printed wiring The groove 43 of shape adaptation, the part of conductive gasket 31 is caught in groove 43;The size of groove 43 and conduction Pad 31 is adapted to, and conductive gasket 31 can be clamped in groove 43, and conductive gasket 31 leaves part and existed Groove 43 is outer to be contacted with the ground via 11 and printed wiring on pcb board 1, it is ensured that radiator 4, Good contact between conductive gasket 31, pcb board 1, so that radiator 4, conductive gasket 31, PCB The completely enclosed conductive shield cavity of the formation of plate 1, both can guarantee that the good heat of radiator 4 and chip 2 connect Touch, reach good radiating effect, good shield effectiveness can be played to chip 2 again.
Preferably, conductive gasket 31 is elastic component, and the width of groove 43 is less than the width of conductive gasket 31, The depth of groove 43 is less than the thickness of conductive gasket 31, and conductive gasket 31 is interference fitted with groove 43. The width of groove 43 is embedded in by can accommodate conductive gasket 31 just and has certain interference fit to be defined, ditch The depth of groove 43 is determined by the height of conductive gasket 31 and the height of chip, and it is kept making conductive gasket Premised on appropriate compression required by specifications, while after conductive gasket 31 is caught in groove 43, should Conductive gasket 31 can block the gap between radiator 4 and pcb board 1, so that with a kind of simple and easy In the structure of realization, conductive gasket 31 is set to consolidate and be connected with radiator 4, pcb board, to form complete envelope The conductive shield cavity closed, so as to avoid chip 2 from being interfered the influence of electric current.
Further, reference picture 1, radiator 4 includes the base 42 fitted with chip 2 and located at base 42 deviate from the radiating fin 41 of the side of pcb board 1, and base 42 is provided with and printing towards the side of pcb board 1 The groove 43 of configuration shape adaptation.Radiator 4 is made up of the good metal of thermal conductivity, radiator 4 Radiating fin 41 be parallel to base 42 deviate from pcb board 1 side, base 42 be plate-like piece, The area of dissipation of radiator 4 is increased, the radiating efficiency of radiator 4 is improved;Base 42 passes through simultaneously Chill bar or heat-conducting silicone grease are fitted and connected with chip 2, make base 42 with chip 2 there is good heat to connect Touch, it is ensured that the heat that chip 2 is produced can be dispersed into air in time by radiator 4.
In addition, in another embodiment of radiating subassembly of the present invention, reference picture 3 and Fig. 4, conducting connecting part 3 pin 32 to be connected with radiator 4, pcb board 1 is provided with and pin 32 towards the side of radiator 4 The corresponding welding structure in position, pin 32 is welded in welding structure to connect pcb board and radiator 4. Welding structure can be the structures such as the pad, the welding hole that are arranged on pcb board 1, and pin 32 can be with radiating Device 4 is fixedly connected or is integrally formed, and the spacing between pin 32 is generally no greater than 10mm, pin 32 After being welded with welding structure, the height of pin 32 not should be greater than between pcb board 1 and the bottom of radiator 4 Spacing (radiator 4 is covered on state when on chip 2), it is ensured that radiator 4 can be served as a contrast by heat conduction Pad or heat-conducting silicone grease and the good contact of chip 2, so that pin 32 connects the earth signal layer of pcb board 1 and dissipated Hot device 4, and then radiator 4, pin 32, pcb board are collectively forming the shielding cavity of base closed, when quiet When discharge of electricity is disturbed or other electromagnetic interferences arrive in the form of an electromagnetic wave, although radiator 4 is received These disturb and form electromagnetic interference electric current, but because there is Kelvin effect, these electromagnetic interferences are only It can be flowed in shielding cavity outer surface, and chip 2 is in the inside of shielding cavity, will not be interfered, It can effectively radiate so as to reach and can prevent the purpose of outside electromagnetic interference.
Meanwhile, using the electronic equipment or communication apparatus of radiator structure of the present invention, to the electromagnetic interference of chip Resistivity has no special requirements, the chip strong without choosing electromagnetic interference resistivity by test of many times, Save many time costs and fund cost;The route of transmission of electromagnetic interference need not be cut off or be declined Subtract measure, the route of transmission institute band of cut-out or decay electromagnetic interference is overcome without spending manpower physics to go The technical barrier come and subsidiary harmful effect.
Alternatively, welding structure for connection pcb board earth signal layer ground via 11, without Special welding structure is set up on pcb board in addition, pin can be achieved merely with conventional ground via 11 Electrical connection between 31 and pcb board 1, so as to reduce the manufacture of radiating subassembly of the present invention to a certain degree Technology difficulty and manufacturing cost.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the scope of the invention, It is every the present invention inventive concept under, the equivalent structure made using description of the invention and accompanying drawing content Conversion, or directly/the patent protection model that other related technical fields are included in the present invention is used in indirectly In enclosing.

Claims (10)

1. a kind of radiating subassembly, it is characterised in that the radiating subassembly includes pcb board, located at described Chip, conducting connecting part and radiator on pcb board, the radiator filler cap are located at the top of the chip, The conducting connecting part is enclosed around the chip, and the conducting connecting part connects the pcb board Earth signal layer and the radiator, the conducting connecting part, pcb board and radiator collectively form a screen Cavity is covered, and the chip is located inside the shielding cavity.
2. radiating subassembly as claimed in claim 1, it is characterised in that offered on the pcb board The ground via of the earth signal layer is connected, the ground via is multiple and set around the arrangements of chips Put, the conducting connecting part connects the ground via and the radiator.
3. radiating subassembly as claimed in claim 2, it is characterised in that the conducting connecting part is conduction Pad, the conductive gasket is located between the radiator and pcb board, the conductive gasket side with The ground via laminating, opposite side are fitted with the radiator.
4. radiating subassembly as claimed in claim 3, it is characterised in that also set up on the pcb board There are the printed wiring for being connected in series each ground via, the distribution of the conductive gasket and the print Configuration shape adaptation processed, the conductive gasket is fitted with the printed wiring.
5. radiating subassembly as claimed in claim 4, it is characterised in that the radiator is described in The side of pcb board is provided with the groove being adapted to the printed wiring topological shape, the conductive gasket part It is caught in the groove.
6. radiating subassembly as claimed in claim 5, it is characterised in that the radiator include with it is described The base of chip laminating and the radiating fin for deviating from the pcb board side located at the base, the base court The groove being adapted to the printed wiring topological shape is provided with to the side of the pcb board.
7. radiating subassembly as claimed in claim 5, it is characterised in that the conductive gasket is elastic component, The width of the groove is less than the width of the conductive gasket, and the depth of the groove is less than the conductive liner The thickness of pad, the conductive gasket is interference fitted with the groove.
8. radiating subassembly as claimed in claim 1, it is characterised in that the conducting connecting part for institute The pin of radiator connection is stated, the pcb board is provided with and pin position towards the side of the radiator Corresponding welding structure is put, the pin is welded in the welding structure to connect the pcb board and institute State radiator.
9. radiating subassembly as claimed in claim 8, it is characterised in that the welding structure is connection institute State the ground via of earth signal layer.
10. the radiating subassembly as described in claim 1 to 9 any one, it is characterised in that described to dissipate Hot device is fitted and connected with the chip by chill bar or heat-conducting silicone grease.
CN201610100015.4A 2016-02-23 2016-02-23 Radiating subassembly CN107105596A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610100015.4A CN107105596A (en) 2016-02-23 2016-02-23 Radiating subassembly

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610100015.4A CN107105596A (en) 2016-02-23 2016-02-23 Radiating subassembly
PCT/CN2017/073948 WO2017143941A1 (en) 2016-02-23 2017-02-17 Heat dissipation component

Publications (1)

Publication Number Publication Date
CN107105596A true CN107105596A (en) 2017-08-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
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WO (1) WO2017143941A1 (en)

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CN110531838A (en) * 2019-07-31 2019-12-03 苏州浪潮智能科技有限公司 A kind of radiator structure and server
CN111933593A (en) * 2020-10-12 2020-11-13 山东天瑞重工有限公司 Magnetic bearing power amplification module
WO2020257996A1 (en) * 2019-06-24 2020-12-30 华为技术有限公司 Shielding device and base station

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Publication number Priority date Publication date Assignee Title
WO2020257996A1 (en) * 2019-06-24 2020-12-30 华为技术有限公司 Shielding device and base station
CN110531838A (en) * 2019-07-31 2019-12-03 苏州浪潮智能科技有限公司 A kind of radiator structure and server
CN111933593A (en) * 2020-10-12 2020-11-13 山东天瑞重工有限公司 Magnetic bearing power amplification module

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Application publication date: 20170829

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