CN107221765A - Electronic component ground structure - Google Patents
Electronic component ground structure Download PDFInfo
- Publication number
- CN107221765A CN107221765A CN201710485587.3A CN201710485587A CN107221765A CN 107221765 A CN107221765 A CN 107221765A CN 201710485587 A CN201710485587 A CN 201710485587A CN 107221765 A CN107221765 A CN 107221765A
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- CN
- China
- Prior art keywords
- electronic component
- conductive fabric
- ground structure
- earthing member
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/64—Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
Abstract
The present embodiments relate to electronic component mounting technology field, more particularly to a kind of electronic component ground structure.Electronic component ground structure provided in an embodiment of the present invention, including：Electronic component, conductive fabric and the earthing member with earth point；Conductive fabric is the fiber cloth that surface is coated with conductive metal layer；Conductive fabric is connected respectively with electronic component and earth point, also, electronic component is electrically conducted by conductive fabric with earthing member.Compared with prior art, electronic component ground structure provided in an embodiment of the present invention, optimizes contact effect of the electronic component with earthing member, so as to optimize the ground connection of electronic component, shielding interference effect, also improves its RF index.
Description
Technical field
The present embodiments relate to electronic component mounting technology field, more particularly to a kind of electronic component ground structure.
Background technology
Because electronic equipment operationally has the voltage current transformation of intermittent or continuation, quick voltage transformation
Cause to produce electromagnetic energy in different frequency bands, i.e. electromagnetic interference.With the development of technology, the frequency range of electronic equipment drastically increases
Plus, the electromagnetic interference between different electronic components is also increasingly severe.
In the prior art, by setting several earth points in electronic component, and these earth points are directly contacted into ground connection
Region, to realize the ground connection of electronic component, to solve electromagnetic interference problem.
But this kind of mode is limited to structure and interference source, its earthing effect and shield effectiveness have much room for improvement.
The content of the invention
The embodiment of the present invention provides a kind of electronic component ground structure, can optimize ground connection, shielding and disturb and improve radio frequency
Index.
The embodiment of the present invention provides a kind of electronic component ground structure, including：Electronic component, conductive fabric and with earth point
Earthing member；
The conductive fabric is the fiber cloth that surface is coated with conductive metal layer；
The conductive fabric is connected respectively with the electronic component and the earth point, also, the electronic component passes through institute
Conductive fabric is stated to electrically conduct with the earthing member.
In one embodiment, the electronic component is sticked in the side of the conductive fabric；
The earthing member is sticked in the opposite side of the conductive fabric.
In one embodiment, electronic component ground structure also includes nonmetallic framework；
The nonmetallic framework is sticked in the earthing member side；
The nonmetallic framework is provided with ground hole, and the ground hole extends to the earthing member from outside；
The conductive fabric passes through the ground hole.
Further, the electronic component is embedded in the ground hole.So as to which relative adds space availability ratio, make
Electronic component ground structure is more close.
In one embodiment, conductive metal foil is enclosed with the outside of the electronic component, also, the conductive fabric is wrapped in institute
State outside conductive metal foil.
Further, the electronic component is CCD camera assembly.
In one embodiment, the electronic component is flexible PCB；
The conductive fabric is wrapped on the outside of the flexible PCB.
Further, the earthing member is fitted on the outside of the conductive fabric.
In one embodiment, the electronic component has grounding elastic part, and the conductive fabric is wrapped on the grounding elastic part.
In one embodiment, the electronic component has leakage copper conductive region, is sticked described to the conductive fabric covering
Leak on copper conductive region.
Electronic component ground structure provided in an embodiment of the present invention, by electronic component, conductive fabric and with earth point
The mutual cooperation of earthing member, wherein, conductive fabric is connected respectively with electronic component and earth point, also, electronic component passes through conduction
Cloth electrically conducts with earthing member, electronic component is grounded by conductive fabric, because of the characteristic of conductive fabric, adds electronic component
With the contact area of earthing member, optimize contact effect of the electronic component with earthing member, thus optimize the ground connection of electronic component,
Interference effect is shielded, its RF index is also improved.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are this hairs
Some bright embodiments, for those of ordinary skill in the art, without having to pay creative labor, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the electronic component ground structure stereogram in the embodiment of the present invention one；
Fig. 2 is the electronic component ground structure schematic diagram in the embodiment of the present invention one；
Fig. 3 is the electronic component ground structure stereogram in the embodiment of the present invention two；
Fig. 4 is the electronic component ground structure schematic diagram in the embodiment of the present invention two；
Fig. 5 is the electronic component ground structure stereogram in the embodiment of the present invention three；
Fig. 6 is the electronic component ground structure schematic diagram in the embodiment of the present invention three；
Fig. 7 is the electronic component ground structure stereogram in the embodiment of the present invention four；
Fig. 8 is the electronic component ground structure schematic diagram in the embodiment of the present invention four；
Fig. 9 is the electronic component ground structure schematic diagram in the embodiment of the present invention five；
Figure 10 is the electronic component ground structure schematic diagram in the embodiment of the present invention six；
Figure 11 is the electronic component ground structure schematic diagram in the embodiment of the present invention seven.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
A part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
Technical scheme is described in detail with specifically embodiment below.These specific implementations below
Example can be combined with each other, and may be repeated no more for same or analogous concept or process in some embodiments.
Fig. 1 is the electronic component ground structure stereogram in the embodiment of the present invention one, and Fig. 2 is in the embodiment of the present invention one
Electronic component ground structure schematic diagram, as depicted in figs. 1 and 2, the electronic component ground structure in the present embodiment include：Electronics member
Part 1, conductive fabric 2 and the earthing member 3 with earth point.
What deserves to be explained is, electronic component 1 can be CCD camera assembly, controller module component, loudspeaker, fingerprint module group
Any one element or integration module in the terminal devices such as part, as long as it operationally produces electromagnetic interference, can be regarded as
The signified electronic component 1 of the present embodiment.During earthing member 3 in the present embodiment can also be metallic conduction part, such as mobile phone metal
Frame, or be the mainboard with Lu Tong areas, as long as it can play ground connection effect, it can be regarded as the signified ground connection of the present embodiment
Part.Conductive fabric 2 is the fiber cloth that surface is coated with conductive metal layer, and its thickness range can be 0.05mm to 0.15mm, conductive fabric 2
In flake, with two sides supported or opposed.
Conductive fabric 2 is connected respectively with electronic component 1 and earth point, also, electronic component 1 passes through conductive fabric 2 and earthing member 3
Electrically conduct.
Electronic component ground structure provided in an embodiment of the present invention, by electronic component, conductive fabric and with earth point
The mutual cooperation of earthing member, wherein, conductive fabric is connected respectively with electronic component and earth point, also, electronic component passes through conduction
Cloth electrically conducts with earthing member, electronic component is grounded by conductive fabric, because of the characteristic of conductive fabric, adds electronic component
With the contact area of earthing member, optimize contact effect of the electronic component with earthing member, thus optimize the ground connection of electronic component,
Interference effect is shielded, its RF index is also improved.
Specifically, in the present embodiment, electronic component 1 is sticked in the side of conductive fabric 2, and earthing member 3 is sticked in conduction
The opposite side of cloth 2.Or, the both sides that conductive fabric 2 is supported or opposed are respectively provided with viscosity, the side of conductive fabric 2 is sticked in electronic component 1
On, and opposite side is sticked on earthing member 3, can similarly realize that electronic component 1 is sticked in the side of conductive fabric 2 and earthing member
3 are sticked in the effect of the opposite side of conductive fabric 2.
Fig. 3 is the electronic component ground structure stereogram in the embodiment of the present invention two, and Fig. 4 is in the embodiment of the present invention two
Electronic component ground structure schematic diagram, embodiment two is the improvement project based on embodiment one, as shown in Figure 3 and Figure 4, this implementation
Electronic component ground structure in example includes：Electronic component 1, conductive fabric 2, earthing member 3 and nonmetallic framework 4.Wherein, conductive fabric
2 are connected respectively with electronic component 1 and earth point, also, electronic component 1 is electrically conducted by conductive fabric 2 with earthing member 3.Non- gold
Category framework 4 is sticked in the side of earthing member 3, and nonmetallic framework 4 is provided with ground hole 41, and ground hole 41 extends to earthing member 3 from outside, and
Conductive fabric 2 passes through ground hole 41.More specifically, nonmetallic framework 4 is located on the top of earthing member 3, nonmetallic framework 4 and offered
One ground hole 41, ground hole 41 is extending vertically into the upper surface of earthing member 3,1, electronic component downwards from the nonmetallic upper table of framework 4
In on nonmetallic framework 4, the two ends of conductive fabric 2 are connected with electronic component 1 and earthing member 3 respectively, and conductive fabric 2 is in zigzag
Ground passes through ground hole 41.
By the above it is seen that, electronic component ground structure provided in an embodiment of the present invention, by electronic component,
The mutual cooperation of conductive fabric, nonmetallic framework and earthing member, wherein, conductive fabric is connected respectively with electronic component and earth point, and
And, electronic component is electrically conducted by conductive fabric with earthing member, and nonmetallic framework is sticked in earthing member side, and nonmetallic framework is set
There is ground hole, ground hole extends to earthing member from outside, and conductive fabric passes through ground hole, electronic component is realized by conductive fabric and connect
Ground, solves the obstruction that nonmetallic framework is present, and because of the characteristic of conductive fabric, add the contact surface of electronic component and earthing member
Product, optimizes contact effect of the electronic component with earthing member, so as to optimize the ground connection of electronic component, shielding interference effect, also
Improve its RF index.This kind of structure is particularly suitable for use in electronic component for loudspeaker, and earthing member is the situation of mobile terminal platelet,
The scheme being grounded by conductive fabric can generally optimize 2~3dB of Radio frequency interference, and conductive fabric contact area is big, and shield effectiveness is good, valency
Lattice are low, and conductive fabric softness adapts to the grounding scheme under various structures, and relevance factor is high.
Fig. 5 is the electronic component ground structure stereogram in the embodiment of the present invention three, and Fig. 6 is in the embodiment of the present invention three
Electronic component ground structure schematic diagram, embodiment three is the improvement project based on embodiment two, as shown in Figure 5 and Figure 6, this implementation
Electronic component ground structure in example includes：Electronic component 1, conductive fabric 2, earthing member 3 and nonmetallic framework 4.Wherein, conductive fabric
2 are connected respectively with electronic component 1 and earth point, also, electronic component 1 is electrically conducted by conductive fabric 2 with earthing member 3.Non- gold
Category framework 4 is sticked in the side of earthing member 3, and nonmetallic framework 4 is provided with ground hole 41, and ground hole 41 extends to earthing member 3 from outside, and
Conductive fabric 2 passes through ground hole 41, and electronic component 1 is directly embedded in ground hole 41.More specifically, nonmetallic framework 4
Positioned at the top of earthing member 3, offer a ground hole 41 on nonmetallic framework 4, ground hole 41 from the nonmetallic upper table of framework 4 downwards
The upper surface of earthing member 3 is extending vertically into, electronic component 1 is located on nonmetallic framework 4, the two ends of conductive fabric 2 are first with electronics respectively
Part 1 and earthing member 3 are connected, and conductive fabric 2 passes through ground hole 41 in zigzag, and electronic component 1 is directly embedded in ground connection
In hole 41, so as to improve space availability ratio, make electronic component ground structure more compact.
Fig. 7 is the electronic component ground structure stereogram in the embodiment of the present invention four, and Fig. 8 is in the embodiment of the present invention four
Electronic component ground structure schematic diagram, example IV is the improvement project based on embodiment one, as shown in Figure 7 and Figure 8, this implementation
Electronic component ground structure in example includes：Electronic component 1, conductive fabric 2, earthing member 3.Wherein, conductive fabric 2 and electronic component 1
Connected respectively with earth point, also, electronic component 1 is electrically conducted by conductive fabric 2 with earthing member 3.It is worthy of note that, this reality
Apply in example, electronic component 1 is CCD camera assembly, and the outside of electronic component 1 is enclosed with conductive metal foil 5, such as copper foil, also, leads
Electric cloth 2 is wrapped in outside conductive metal foil 5.
What deserves to be explained is, electronic component 1 is not limited to CCD camera assembly, can also be controller module component, loudspeaker
, any one element or integration module in the terminal device such as fingerprint module component, done as long as it operationally produces electromagnetism
Disturb, can be regarded as the signified electronic component 1 of the present embodiment.
By the above it is seen that, electronic component ground structure provided in an embodiment of the present invention, by electronic component,
The mutual cooperation of conductive fabric and earthing member with earth point, wherein, conductive fabric is connected respectively with electronic component and earth point, and
And, electronic component is electrically conducted by conductive fabric with earthing member, electronic component is grounded by conductive fabric, utilizes conductive fabric
Electric conductivity, the problem of solving poorly conductive at conductive metal foil viscose glue.Simultaneously as conductive metal foil and earthing member matter
Ground is hard, easy loose contact, using the flex capability of conductive fabric, adds the contact area of electronic component and earthing member, optimization
Contact effect of the electronic component with earthing member, so as to optimize the ground connection of electronic component, shielding interference effect, also improves it
RF index.
Fig. 9 is the electronic component ground structure schematic diagram in the embodiment of the present invention five, and embodiment five is to be based on embodiment one
Improvement project, as shown in figure 9, the electronic component ground structure in the present embodiment includes：Electronic component 1, conductive fabric 2 and ground connection
Part 3, conductive fabric 2 is connected respectively with electronic component 1 and earth point, also, electronic component 1 is electrical by conductive fabric 2 and earthing member 3
Conducting, wherein, electronic component 1 is flexible PCB, the specially flexible PCB in fingerprint module, and conductive fabric 2 is wrapped in soft
Property circuit board on the outside of.It is noted that conductive fabric 2 is wrapped on the outside of flexible PCB, and conductive fabric 2 be completely covered by it is soft
Property circuit board outer surface.
In order to further optimize earthing effect, and the stable connection degree of flexible PCB is improved, earthing member 3, which is fitted in, leads
The electric outside of cloth 2, is rocked to prevent it.
By the above it is seen that, electronic component ground structure provided in an embodiment of the present invention, by electronic component,
The mutual cooperation of conductive fabric and earthing member with earth point, wherein, conductive fabric is connected respectively with electronic component and earth point, and
And, flexible PCB is electrically conducted by conductive fabric with earthing member, flexible PCB is grounded by conductive fabric, because of conduction
The characteristic of cloth, adds the contact area of electronic component and earthing member, optimizes contact effect of the electronic component with earthing member, from
And the ground connection of electronic component, shielding interference effect are optimized, also improve its RF index.Also, the conduction in this kind of structure
Cloth farthest shields the interference radiated by flexible PCB while flexible PCB bending property is ensured.
Figure 10 is the electronic component ground structure schematic diagram in the embodiment of the present invention six, and embodiment six is to be based on embodiment one
Improvement project, as shown in Figure 10, the electronic component ground structure in the present embodiment includes：Electronic component 1, conductive fabric 2 and connect
Ground part 3, conductive fabric 2 is connected respectively with electronic component 1 and earth point, also, electronic component 1 passes through conductive fabric 2 and the electricity of earthing member 3
Property conducting, wherein, electronic component 1 has grounding elastic part 6, and conductive fabric 2 is wrapped on grounding elastic part 6.
By the above it is seen that, electronic component ground structure provided in an embodiment of the present invention, by electronic component,
The mutual cooperation of conductive fabric and earthing member with earth point, wherein, conductive fabric is connected respectively with electronic component and earth point, and
And, electronic component is electrically conducted by conductive fabric with earthing member, and electronic component has grounding elastic part, and conductive fabric is wrapped in ground connection bullet
On piece, electronic component is grounded by conductive fabric, because of the characteristic of conductive fabric, add contact of the electronic component with earthing member
Area, optimizes contact effect of the electronic component with earthing member, so that the ground connection of electronic component, shielding interference effect are optimized,
Also improve its RF index.
Figure 11 is the electronic component ground structure schematic diagram in the embodiment of the present invention seven, and embodiment seven is to be based on embodiment one
Improvement project, as shown in figure 11, the electronic component ground structure in the present embodiment includes：Electronic component 1, conductive fabric 2 and connect
Ground part 3, conductive fabric 2 is connected respectively with electronic component 1 and earth point, also, electronic component 1 passes through conductive fabric 2 and the electricity of earthing member 3
Property conducting, wherein, electronic component 1 has leakage copper conductive region 7, and the covering of conductive fabric 2 ground is sticked on copper conductive region 7 is leaked.
By the above it is seen that, electronic component ground structure provided in an embodiment of the present invention, by electronic component,
The mutual cooperation of conductive fabric and earthing member with earth point, wherein, conductive fabric is connected respectively with electronic component and earth point, and
And, electronic component is electrically conducted by conductive fabric with earthing member, and electronic component has leakage copper conductive region, conductive fabric covering ground patch
Be located at Lou copper conductive region, electronic component is grounded by conductive fabric, because of the characteristic of conductive fabric, add electronic component with
The contact area of earthing member, optimizes contact effect of the electronic component with earthing member, so as to optimize the ground connection of electronic component, screen
Interference effect is covered, its RF index is also improved.
Finally it should be noted that：Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations；To the greatest extent
The present invention is described in detail with reference to foregoing embodiments for pipe, it will be understood by those within the art that：Its according to
The technical scheme described in foregoing embodiments can so be modified, or which part or all technical characteristic are entered
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (10)
1. a kind of electronic component ground structure, it is characterised in that including：Electronic component, conductive fabric and the ground connection with earth point
Part；
The conductive fabric is the fiber cloth that surface is coated with conductive metal layer；
The conductive fabric is connected respectively with the electronic component and the earth point, also, the electronic component is led by described
Electric cloth electrically conducts with the earthing member.
2. electronic component ground structure according to claim 1, it is characterised in that the electronic component is sticked and led described
The side of electric cloth；
The earthing member is sticked in the opposite side of the conductive fabric.
3. electronic component ground structure according to claim 1, it is characterised in that also including nonmetallic framework；
The nonmetallic framework is sticked in the earthing member side；
The nonmetallic framework is provided with ground hole, and the ground hole extends to the earthing member from outside；
The conductive fabric passes through the ground hole.
4. electronic component ground structure according to claim 3, it is characterised in that the electronic component is embedded in described connect
In ground hole.
5. electronic component ground structure according to claim 1, it is characterised in that be enclosed with and lead on the outside of the electronic component
Electric metal paper tinsel, also, the conductive fabric is wrapped in outside the conductive metal foil.
6. electronic component ground structure according to claim 5, it is characterised in that the electronic component is camera group
Part.
7. electronic component ground structure according to claim 1, it is characterised in that the electronic component is flexible circuit
Plate；
The conductive fabric is wrapped on the outside of the flexible PCB.
8. electronic component ground structure according to claim 7, it is characterised in that the earthing member is fitted in the conduction
On the outside of cloth.
9. electronic component ground structure according to claim 1, it is characterised in that the electronic component has ground connection bullet
Piece, the conductive fabric is wrapped on the grounding elastic part.
10. electronic component ground structure according to claim 1, it is characterised in that there is the electronic component leakage copper to lead
Electric region, is sticked on the leakage copper conductive region to the conductive fabric covering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710485587.3A CN107221765A (en) | 2017-06-23 | 2017-06-23 | Electronic component ground structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710485587.3A CN107221765A (en) | 2017-06-23 | 2017-06-23 | Electronic component ground structure |
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| CN107221765A true CN107221765A (en) | 2017-09-29 |
Family
ID=59950968
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| CN201710485587.3A Pending CN107221765A (en) | 2017-06-23 | 2017-06-23 | Electronic component ground structure |
Country Status (1)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2020000421A1 (en) * | 2018-06-29 | 2020-01-02 | 华为技术有限公司 | Electrical connection assembly and mobile terminal |
| CN113177492A (en) * | 2021-05-08 | 2021-07-27 | 江西欧迈斯微电子有限公司 | Ultrasonic fingerprint identification assembly and intelligent terminal |
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| CN106603765A (en) * | 2016-12-20 | 2017-04-26 | 广东欧珀移动通信有限公司 | Support assembly and mobile terminal |
| CN106686963A (en) * | 2016-12-20 | 2017-05-17 | 广东欧珀移动通信有限公司 | Functional device and terminal equipment |
| CN106850900A (en) * | 2017-03-31 | 2017-06-13 | 西安易朴通讯技术有限公司 | A kind of electronic equipment |
| CN206931720U (en) * | 2017-06-23 | 2018-01-26 | 上海传英信息技术有限公司 | Electronic component ground structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020000421A1 (en) * | 2018-06-29 | 2020-01-02 | 华为技术有限公司 | Electrical connection assembly and mobile terminal |
| CN113177492A (en) * | 2021-05-08 | 2021-07-27 | 江西欧迈斯微电子有限公司 | Ultrasonic fingerprint identification assembly and intelligent terminal |
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