CN206931720U - Electronic component ground structure - Google Patents
Electronic component ground structure Download PDFInfo
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- CN206931720U CN206931720U CN201720743589.3U CN201720743589U CN206931720U CN 206931720 U CN206931720 U CN 206931720U CN 201720743589 U CN201720743589 U CN 201720743589U CN 206931720 U CN206931720 U CN 206931720U
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- electronic component
- conductive fabric
- ground structure
- earthing member
- ground
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Abstract
The utility model embodiment is related to electronic component mounting technology field, more particularly to a kind of electronic component ground structure.The electronic component ground structure that the utility model embodiment provides, including：Electronic component, conductive fabric and the earthing member with earth point；Conductive fabric is the fiber cloth that surface is coated with conductive metal layer；Conductive fabric is connected respectively with electronic component and earth point, also, electronic component is electrically conducted by conductive fabric and earthing member.Compared with prior art, the electronic component ground structure that the utility model embodiment provides, optimizes contact effect of the electronic component with earthing member, so as to optimize the ground connection of electronic component, shielding interference effect, also improves its RF index.
Description
Technical field
The utility model embodiment is related to electronic component mounting technology field, more particularly to a kind of electronic component ground junction
Structure.
Background technology
Because electronic equipment has intermittent or continuation voltage current transformation, quick voltage transformation at work
Cause to produce electromagnetic energy in different frequency bands, i.e. electromagnetic interference.With the development of technology, the frequency range of electronic equipment drastically increases
Add, the electromagnetic interference between different electronic components is also increasingly severe.
In the prior art, by setting several earth points in electronic component, and these earth points are directly contacted into ground connection
Region, to realize the ground connection of electronic component, to solve electromagnetic interference problem.
But this kind of mode is limited to structure and interference source, its earthing effect and shield effectiveness have much room for improvement.
Utility model content
The utility model embodiment provides a kind of electronic component ground structure, can optimize ground connection, shielding is disturbed and improved
RF index.
The utility model embodiment provides a kind of electronic component ground structure, including：Electronic component, conductive fabric and with connecing
The earthing member in place；
The conductive fabric is the fiber cloth that surface is coated with conductive metal layer；
The conductive fabric is connected respectively with the electronic component and the earth point, also, the electronic component passes through institute
Conductive fabric is stated to electrically conduct with the earthing member.
In one embodiment, the electronic component is sticked in the side of the conductive fabric；
The earthing member is sticked in the opposite side of the conductive fabric.
In one embodiment, electronic component ground structure also includes nonmetallic framework；
The nonmetallic framework is sticked in the earthing member side；
The nonmetallic framework is provided with ground hole, and the ground hole extends to the earthing member from outside；
The conductive fabric passes through the ground hole.
Further, the electronic component is embedded in the ground hole.So as to which relative adds space availability ratio, make
Electronic component ground structure is more close.
In one embodiment, conductive metal foil is enclosed with the outside of the electronic component, also, the conductive fabric is wrapped in institute
State outside conductive metal foil.
Further, the electronic component is CCD camera assembly.
In one embodiment, the electronic component is flexible PCB；
The conductive fabric is wrapped on the outside of the flexible PCB.
Further, the earthing member is fitted on the outside of the conductive fabric.
In one embodiment, the electronic component has grounding elastic part, and the conductive fabric is wrapped on the grounding elastic part.
In one embodiment, the electronic component has leakage copper conductive region, is sticked described to the conductive fabric covering
Leak on copper conductive region.
The electronic component ground structure that the utility model embodiment provides, by electronic component, conductive fabric and with ground connection
The mutual cooperation of the earthing member of point, wherein, conductive fabric is connected respectively with electronic component and earth point, also, electronic component passes through
Conductive fabric electrically conducts with earthing member, electronic component is grounded by conductive fabric, because of the characteristic of conductive fabric, adds electronics
The contact area of element and earthing member, contact effect of the electronic component with earthing member is optimized, so as to optimize electronic component
Ground connection, shielding interference effect, also improve its RF index.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are
Some embodiments of the utility model, for those of ordinary skill in the art, do not paying the premise of creative labor
Under, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the electronic component ground structure stereogram in the utility model embodiment one；
Fig. 2 is the electronic component ground structure schematic diagram in the utility model embodiment one；
Fig. 3 is the electronic component ground structure stereogram in the utility model embodiment two；
Fig. 4 is the electronic component ground structure schematic diagram in the utility model embodiment two；
Fig. 5 is the electronic component ground structure stereogram in the utility model embodiment three；
Fig. 6 is the electronic component ground structure schematic diagram in the utility model embodiment three；
Fig. 7 is the electronic component ground structure stereogram in the utility model embodiment four；
Fig. 8 is the electronic component ground structure schematic diagram in the utility model embodiment four；
Fig. 9 is the electronic component ground structure schematic diagram in the utility model embodiment five；
Figure 10 is the electronic component ground structure schematic diagram in the utility model embodiment six；
Figure 11 is the electronic component ground structure schematic diagram in the utility model embodiment seven.
Embodiment
It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer
Accompanying drawing in type embodiment, the technical scheme in the embodiment of the utility model is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model part of the embodiment, rather than whole embodiments.Based on the implementation in the utility model
Example, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, is belonged to
The scope of the utility model protection.
The technical solution of the utility model is described in detail with specifically embodiment below.These are specific below
Embodiment can be combined with each other, and may be repeated no more for same or analogous concept or process in some embodiments.
Fig. 1 is the electronic component ground structure stereogram in the utility model embodiment one, and Fig. 2 is implemented for the utility model
Electronic component ground structure schematic diagram in example one, as depicted in figs. 1 and 2, the electronic component ground structure bag in the present embodiment
Include：Electronic component 1, conductive fabric 2 and the earthing member 3 with earth point.
What deserves to be explained is electronic component 1 can be CCD camera assembly, controller module component, loudspeaker, fingerprint module group
Any one element or integration module in the terminal devices such as part, as long as it produces electromagnetic interference at work, can be regarded as
The signified electronic component 1 of the present embodiment.Earthing member 3 in the present embodiment can also be in metallic conduction part, such as mobile phone metal
Frame, or be the mainboard with Lu Tong areas, as long as it can play ground connection effect, it can be regarded as the signified ground connection of the present embodiment
Part.Conductive fabric 2 is that surface is coated with the fiber cloth of conductive metal layer, and its thickness range can be 0.05mm to 0.15mm, conductive fabric 2
In flake, there are two sides supported or opposed.
Conductive fabric 2 is connected respectively with electronic component 1 and earth point, also, electronic component 1 passes through conductive fabric 2 and earthing member 3
Electrically conduct.
The electronic component ground structure that the utility model embodiment provides, by electronic component, conductive fabric and with ground connection
The mutual cooperation of the earthing member of point, wherein, conductive fabric is connected respectively with electronic component and earth point, also, electronic component passes through
Conductive fabric electrically conducts with earthing member, electronic component is grounded by conductive fabric, because of the characteristic of conductive fabric, adds electronics
The contact area of element and earthing member, contact effect of the electronic component with earthing member is optimized, so as to optimize electronic component
Ground connection, shielding interference effect, also improve its RF index.
Specifically, in the present embodiment, electronic component 1 is sticked is sticked in conduction in the side of conductive fabric 2, earthing member 3
The opposite side of cloth 2.Or the both sides that conductive fabric 2 is supported or opposed are respectively provided with viscosity, the side of conductive fabric 2 is set to be sticked in electronic component 1
On, and opposite side is sticked on earthing member 3, can similarly realize that electronic component 1 is sticked in the side of conductive fabric 2 and earthing member
3 are sticked in the effect of the opposite side of conductive fabric 2.
Fig. 3 is the electronic component ground structure stereogram in the utility model embodiment two, and Fig. 4 is implemented for the utility model
Electronic component ground structure schematic diagram in example two, embodiment two are the improvement projects based on embodiment one, such as Fig. 3 and Fig. 4 institutes
Show, the electronic component ground structure in the present embodiment includes：Electronic component 1, conductive fabric 2, earthing member 3 and nonmetallic framework 4.Its
In, conductive fabric 2 is connected respectively with electronic component 1 and earth point, also, electronic component 1 is electrical by conductive fabric 2 and earthing member 3
Conducting.Nonmetallic framework 4 is sticked is provided with ground hole 41 in the side of earthing member 3, nonmetallic framework 4, and ground hole 41 extends to from outside
Earthing member 3, and conductive fabric 2 passes through ground hole 41.More specifically, nonmetallic framework 4 is located at the top of earthing member 3, nonmetallic frame
A ground hole 41 is offered on frame 4, ground hole 41 is extending vertically into the upper surface of earthing member 3 downwards from the nonmetallic upper table of framework 4,
Electronic component 1 is located on nonmetallic framework 4, and the both ends of conductive fabric 2 are connected with electronic component 1 and earthing member 3 respectively, and conductive
Cloth 2 passes through ground hole 41 in zigzag.
Electronics it is seen that, the electronic component ground structure that the utility model embodiment provides, is passed through by the above
The mutual cooperation of element, conductive fabric, nonmetallic framework and earthing member, wherein, conductive fabric connects respectively with electronic component and earth point
Connect, also, electronic component is electrically conducted by conductive fabric and earthing member, nonmetallic framework is sticked in earthing member side, nonmetallic
Framework is provided with ground hole, and ground hole extends to earthing member from outside, and conductive fabric passes through ground hole, electronic component is passed through conductive fabric
It is grounded, solves that nonmetallic framework is existing to be hindered, and because of the characteristic of conductive fabric, adds electronic component and earthing member
Contact area, contact effect of the electronic component with earthing member is optimized, so as to optimize the ground connection of electronic component, shielding interference effect
Fruit, also improve its RF index.This kind of structure is loudspeaker especially suitable for electronic component, and earthing member is mobile terminal platelet
Situation, the scheme being grounded by conductive fabric can generally optimize 2~3dB of Radio frequency interference, and conductive fabric contact area is big, shield effectiveness
Good, price is low, the soft grounding scheme adapted under various structures of conductive fabric, and relevance factor is high.
Fig. 5 is the electronic component ground structure stereogram in the utility model embodiment three, and Fig. 6 is implemented for the utility model
Electronic component ground structure schematic diagram in example three, embodiment three are the improvement projects based on embodiment two, such as Fig. 5 and Fig. 6 institutes
Show, the electronic component ground structure in the present embodiment includes：Electronic component 1, conductive fabric 2, earthing member 3 and nonmetallic framework 4.Its
In, conductive fabric 2 is connected respectively with electronic component 1 and earth point, also, electronic component 1 is electrical by conductive fabric 2 and earthing member 3
Conducting.Nonmetallic framework 4 is sticked is provided with ground hole 41 in the side of earthing member 3, nonmetallic framework 4, and ground hole 41 extends to from outside
Earthing member 3, and conductive fabric 2 passes through ground hole 41, and electronic component 1 is directly embedded in ground hole 41.More specifically, it is non-
Metal framework 4 is located at the top of earthing member 3, offers a ground hole 41 on nonmetallic framework 4, and ground hole 41 is from nonmetallic framework 4
Upper table is extending vertically into the upper surface of earthing member 3 downwards, and electronic component 1 is located on nonmetallic framework 4, the both ends point of conductive fabric 2
It is not connected with electronic component 1 and earthing member 3, and conductive fabric 2 passes through ground hole 41 in zigzag, and electronic component 1 is direct
It is embedded in ground hole 41, so as to improve space availability ratio, makes electronic component ground structure more compact.
Fig. 7 is the electronic component ground structure stereogram in the utility model embodiment four, and Fig. 8 is implemented for the utility model
Electronic component ground structure schematic diagram in example four, example IV are the improvement projects based on embodiment one, such as Fig. 7 and Fig. 8 institutes
Show, the electronic component ground structure in the present embodiment includes：Electronic component 1, conductive fabric 2, earthing member 3.Wherein, conductive fabric 2 with
Electronic component 1 and earth point are connected respectively, also, electronic component 1 is electrically conducted by conductive fabric 2 and earthing member 3.It is worth pointing out
, in the present embodiment, electronic component 1 is CCD camera assembly, and the outside of electronic component 1 is enclosed with conductive metal foil 5, such as copper
Paper tinsel, also, conductive fabric 2 is wrapped in outside conductive metal foil 5.
What deserves to be explained is electronic component 1 is not limited to CCD camera assembly, controller module component, loudspeaker can also be
, any one element or integration module in the terminal device such as fingerprint module component, done as long as it produces electromagnetism at work
Disturb, can be regarded as the signified electronic component 1 of the present embodiment.
Electronics it is seen that, the electronic component ground structure that the utility model embodiment provides, is passed through by the above
The mutual cooperation of element, conductive fabric and the earthing member with earth point, wherein, conductive fabric connects respectively with electronic component and earth point
Connect, also, electronic component is electrically conducted by conductive fabric and earthing member, electronic component is grounded by conductive fabric, is utilized
The electric conductivity of conductive fabric, solves the problems, such as poorly conductive at conductive metal foil viscose glue.Simultaneously as conductive metal foil and connecing
Ground part quality is hard, easy loose contact, using the flex capability of conductive fabric, adds the contact surface of electronic component and earthing member
Product, optimizes contact effect of the electronic component with earthing member, so as to optimize the ground connection of electronic component, shielding interference effect, also
Improve its RF index.
Fig. 9 is the electronic component ground structure schematic diagram in the utility model embodiment five, and embodiment five is based on implementation
The improvement project of example one, as shown in figure 9, the electronic component ground structure in the present embodiment includes：Electronic component 1, the and of conductive fabric 2
Earthing member 3, conductive fabric 2 are connected respectively with electronic component 1 and earth point, also, electronic component 1 passes through conductive fabric 2 and earthing member 3
Electrically conduct, wherein, electronic component 1 is flexible PCB, and the specially flexible PCB in fingerprint module, conductive fabric 2 wraps up
On the outside of flexible PCB.It is noted that conductive fabric 2 is wrapped on the outside of flexible PCB, and conductive fabric 2 is completely covered
In flexible PCB outer surface.
In order to further optimize earthing effect, and the stable connection degree of flexible PCB is improved, earthing member 3, which is fitted in, leads
The electric outside of cloth 2, is rocked to prevent it.
Electronics it is seen that, the electronic component ground structure that the utility model embodiment provides, is passed through by the above
The mutual cooperation of element, conductive fabric and the earthing member with earth point, wherein, conductive fabric connects respectively with electronic component and earth point
Connect, also, flexible PCB is electrically conducted by conductive fabric and earthing member, flexible PCB is grounded by conductive fabric,
Because of the characteristic of conductive fabric, the contact area of electronic component and earthing member is added, optimizes contact of the electronic component with earthing member
Effect, so as to optimize the ground connection of electronic component, shielding interference effect, also improve its RF index.Also, in this kind of structure
Conductive fabric ensure flexible PCB bending property while, farthest shield what is radiated by flexible PCB
Interference.
Figure 10 is the electronic component ground structure schematic diagram in the utility model embodiment six, and embodiment six is based on implementation
The improvement project of example one, as shown in Figure 10, the electronic component ground structure in the present embodiment include：Electronic component 1, conductive fabric 2
With earthing member 3, conductive fabric 2 is connected respectively with electronic component 1 and earth point, also, electronic component 1 passes through conductive fabric 2 and ground connection
Part 3 electrically conducts, wherein, electronic component 1 has grounding elastic part 6, and conductive fabric 2 is wrapped on grounding elastic part 6.
Electronics it is seen that, the electronic component ground structure that the utility model embodiment provides, is passed through by the above
The mutual cooperation of element, conductive fabric and the earthing member with earth point, wherein, conductive fabric connects respectively with electronic component and earth point
Connect, also, electronic component is electrically conducted by conductive fabric and earthing member, and electronic component has grounding elastic part, and conductive fabric is wrapped in
On grounding elastic part, electronic component is grounded by conductive fabric, because of the characteristic of conductive fabric, add electronic component and earthing member
Contact area, optimize contact effect of the electronic component with earthing member, so as to optimize the ground connection of electronic component, shielding interference
Effect, also improve its RF index.
Figure 11 is the electronic component ground structure schematic diagram in the utility model embodiment seven, and embodiment seven is based on implementation
The improvement project of example one, as shown in figure 11, the electronic component ground structure in the present embodiment include：Electronic component 1, conductive fabric 2
With earthing member 3, conductive fabric 2 is connected respectively with electronic component 1 and earth point, also, electronic component 1 passes through conductive fabric 2 and ground connection
Part 3 electrically conducts, wherein, electronic component 1 has leakage copper conductive region 7, is sticked in leakage copper conductive region 7 to the covering of conductive fabric 2
On.
Electronics it is seen that, the electronic component ground structure that the utility model embodiment provides, is passed through by the above
The mutual cooperation of element, conductive fabric and the earthing member with earth point, wherein, conductive fabric connects respectively with electronic component and earth point
Connect, also, electronic component is electrically conducted by conductive fabric and earthing member, and electronic component has leakage copper conductive region, and conductive fabric covers
It is sticked in leakage copper conductive region lid, electronic component is grounded by conductive fabric, because of the characteristic of conductive fabric, add electronics
The contact area of element and earthing member, contact effect of the electronic component with earthing member is optimized, so as to optimize electronic component
Ground connection, shielding interference effect, also improve its RF index.
Finally it should be noted that：Various embodiments above is only to illustrate the technical solution of the utility model, rather than it is limited
System；Although the utility model is described in detail with reference to foregoing embodiments, one of ordinary skill in the art should
Understand：It can still modify to the technical scheme described in foregoing embodiments, either to which part or whole
Technical characteristic carries out equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from this practicality newly
The scope of each embodiment technical scheme of type.
Claims (10)
- A kind of 1. electronic component ground structure, it is characterised in that including：Electronic component, conductive fabric and the ground connection with earth point Part；The conductive fabric is the fiber cloth that surface is coated with conductive metal layer；The conductive fabric is connected respectively with the electronic component and the earth point, also, the electronic component is led by described Electric cloth electrically conducts with the earthing member.
- 2. electronic component ground structure according to claim 1, it is characterised in that the electronic component is sticked leads described The side of electric cloth；The earthing member is sticked in the opposite side of the conductive fabric.
- 3. electronic component ground structure according to claim 1, it is characterised in that also including nonmetallic framework；The nonmetallic framework is sticked in the earthing member side；The nonmetallic framework is provided with ground hole, and the ground hole extends to the earthing member from outside；The conductive fabric passes through the ground hole.
- 4. electronic component ground structure according to claim 3, it is characterised in that the electronic component is embedded in described connect In ground hole.
- 5. electronic component ground structure according to claim 1, it is characterised in that be enclosed with and lead on the outside of the electronic component Electric metal paper tinsel, also, the conductive fabric is wrapped in outside the conductive metal foil.
- 6. electronic component ground structure according to claim 5, it is characterised in that the electronic component is camera group Part.
- 7. electronic component ground structure according to claim 1, it is characterised in that the electronic component is flexible circuit Plate；The conductive fabric is wrapped on the outside of the flexible PCB.
- 8. electronic component ground structure according to claim 7, it is characterised in that the earthing member is fitted in the conduction On the outside of cloth.
- 9. electronic component ground structure according to claim 1, it is characterised in that the electronic component has ground connection bullet Piece, the conductive fabric are wrapped on the grounding elastic part.
- 10. electronic component ground structure according to claim 1, it is characterised in that there is the electronic component leakage copper to lead Electric region, it is sticked on the leakage copper conductive region to the conductive fabric covering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720743589.3U CN206931720U (en) | 2017-06-23 | 2017-06-23 | Electronic component ground structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720743589.3U CN206931720U (en) | 2017-06-23 | 2017-06-23 | Electronic component ground structure |
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| CN206931720U true CN206931720U (en) | 2018-01-26 |
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| CN201720743589.3U Active CN206931720U (en) | 2017-06-23 | 2017-06-23 | Electronic component ground structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107221765A (en) * | 2017-06-23 | 2017-09-29 | 上海传英信息技术有限公司 | Electronic component ground structure |
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2017
- 2017-06-23 CN CN201720743589.3U patent/CN206931720U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107221765A (en) * | 2017-06-23 | 2017-09-29 | 上海传英信息技术有限公司 | Electronic component ground structure |
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