CN204634156U - Circuit protection structure and electronic installation - Google Patents
Circuit protection structure and electronic installation Download PDFInfo
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- CN204634156U CN204634156U CN201520332844.6U CN201520332844U CN204634156U CN 204634156 U CN204634156 U CN 204634156U CN 201520332844 U CN201520332844 U CN 201520332844U CN 204634156 U CN204634156 U CN 204634156U
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- ground path
- path frame
- conductive shell
- conducting foam
- protection structure
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Abstract
Present disclosure discloses a kind of circuit protection structure, comprising: printing board PCB, it has circuit unit and enclose the ground path frame in described circuit unit; Conductive shell, has the accommodating cavity of accommodating described circuit unit; Conducting foam, is arranged between described ground path frame and described conductive shell and is electrically connected for described ground path frame and described conductive shell.The circuit unit of protection is needed by the compound mode of the ground path frame on conductive shell, conducting foam and PCB to form faraday's basket structure in the disclosure; realize the object that electromagnetic radiation shielding disturbs circuit unit to eliminate or to reduce electromagnetic radiation; and avoid the weight and volume increasing product by adding screening conductive face shield, thus improve product competition advantage.
Description
Technical field
The disclosure relates to telecommunication circuit technical field, particularly relates to a kind of circuit protection structure and electronic installation of electromagnetic radiation shielding.
Background technology
" noise " in circuit makes a general reference the unnecessary electric signal that those can make the degree of purity distortion of desired signal usually.Noise has two kinds of circulation ways: conduction and radiation, and noise is transmitted to another place from one by conductor by the former, such as: the components and parts etc. in a joint wire, a section of printed circuit, equipment metal shell, equipment metal machine frame or circuit; Noise is then transmitted to another place from one by means of air or other dielectric by the latter.In addition, radiated noise (i.e. electromagnetic radiation) can be usually converted into when conducted noise runs into an adaptive antenna.
Shielding, filtering, design of Grounding Connections and integral layout etc. are several effective ways reducing noise.Wherein, conducted noise utilizes traditional circuit engineering to be leached usually; Radiated noise then utilizes screen method to be minimized.For conducted noise, owing to usually knowing that conducted noise is present in system where, therefore just can solve by increasing filter circuit as required.But be but difficult to do to radiated noise, because it fills the air usually among whole system, in prior art, for radiated noise, usually can by the radiated noise of additional screening conductive face shield control system, but add the weight and volume that screening conductive face shield can increase product, and add the extra cost of product, reduce the competitive advantage of product.
Utility model content
In view of this, the disclosure proposes a kind of circuit protection structure and electronic installation of new structure, to solve the problems of the technologies described above.
In order to arrive above-mentioned purpose, the technical scheme that the disclosure adopts is:
According to the first aspect of disclosure embodiment, propose a kind of circuit protection structure, comprising:
Printing board PCB, it has circuit unit and encloses the ground path frame in described circuit unit;
Conductive shell, has the accommodating cavity of accommodating described circuit unit;
Conducting foam, is arranged between described ground path frame and described conductive shell and is electrically connected for described ground path frame and described conductive shell.
Optionally, described circuit protection structure also comprises: the electric silica gel fitting in described conducting foam, and wherein, described conductive silicon is gluing to be sticked in described ground path frame, and described conducting foam is sticky to be sticked in described conductive shell.
Optionally, described conducting foam and described ground path frame coincide.
Optionally, the outer rim of described conducting foam and described conductive shell coincides.
Optionally, the live width of described ground path frame is not more than 5mm.
According to the second aspect of disclosure embodiment, propose a kind of electronic installation, comprise housing and be installed at least one circuit protection structure in described housing, described circuit protection structure comprises:
Printing board PCB, it has circuit unit and encloses the ground path frame in described circuit unit;
Conductive shell, has the accommodating cavity of accommodating described circuit unit;
Conducting foam, is arranged between described ground path frame and described conductive shell and is electrically connected for described ground path frame and described conductive shell.
Optionally, described circuit protection structure also comprises: the electric silica gel fitting in described conducting foam, and wherein, described conductive silicon is gluing to be sticked in described ground path frame, and described conducting foam is sticky to be sticked in described conductive shell.
Optionally, described conducting foam and described ground path frame coincide.
Optionally, the outer rim of described conducting foam and described conductive shell coincides.
Optionally, the live width of described ground path frame is not more than 5mm.
Compared with prior art; the circuit unit of protection is needed by the compound mode of the ground path frame on conductive shell, conducting foam and PCB to form faraday's basket structure in the disclosure; realize the object that electromagnetic radiation shielding disturbs circuit unit to eliminate or to reduce electromagnetic radiation; and avoid the weight and volume increasing product by adding screening conductive face shield, thus improve product competition advantage.
Should be understood that, it is only exemplary and explanatory that above general description and details hereinafter describe, and can not limit the disclosure.
Accompanying drawing explanation
Accompanying drawing to be herein merged in specification and to form the part of this specification, shows and meets embodiment of the present disclosure, and is used from specification one and explains principle of the present disclosure.
Fig. 1 is the part-structure schematic diagram of disclosure circuit protection structure one angle;
Fig. 2 is the overall structure schematic diagram of the another angle of disclosure circuit protection structure;
Fig. 3 is the decomposition texture schematic diagram of disclosure circuit protection structure one embodiment;
Fig. 4 is the decomposition texture schematic diagram of the another embodiment of disclosure circuit protection structure.
Embodiment
Below with reference to embodiment shown in the drawings, the disclosure is described in detail.But these execution modes do not limit the disclosure, the structure that those of ordinary skill in the art makes according to these execution modes, method or conversion functionally are all included in protection range of the present disclosure.
The term used in the disclosure is only for the object describing specific embodiment, and the not intended to be limiting disclosure." one ", " described " and " being somebody's turn to do " of the singulative used in disclosure and the accompanying claims book is also intended to comprise most form, unless context clearly represents other implications.It is also understood that term "and/or" used herein refer to and comprise one or more project of listing be associated any or all may combine.
Although should be appreciated that the disclosure may adopt term first, second etc. various information is described, these information should not be limited to these terms.These terms are only used for the information of same type to be distinguished from each other out.Such as, when not departing from disclosure scope, the first information also can be called as the second information, and similarly, the second information also can be called as the first information.Depend on linguistic context, word as used in this " if " can be construed as into " ... time " or " when ... time " or " in response to determining ".
As depicted in figs. 1 and 2, Fig. 1 is the part-structure schematic diagram of disclosure circuit protection structure one angle; Fig. 2 is the overall structure schematic diagram of the another angle of disclosure circuit protection structure.Circuit protection structure of the present disclosure utilizes Faraday cage principle to PCB (Printed Circuit Board; printed circuit board (PCB)) circuit unit 111 on 11 carries out closed encapsulation; to make electromagnetic radiation to external world shield, avoid electromagnetic radiation to the interference of circuit unit 111.Wherein, this circuit unit 111 can be CPU element, voicefrequency circuit unit, video circuit unit etc.
Particularly, according to the first aspect of disclosure embodiment, circuit protection structure of the present disclosure comprises: PCB11, ground path frame 12, conductive shell 14 and conducting foam 13.Wherein, the ground path frame 12 this PCB11 having circuit unit 111 and enclose in circuit unit 111, this ground path frame 12 is formed on PCB11, is the printed portions circuit on PCB11, this ground path frame 12 can be connected with the main ground path on PCB11, also can directly be connected to the ground.In embodiment of the present disclosure, the live width of this ground path frame 12 is not more than 5mm, and preferably, the width of this ground path frame 12 is about 2mm.
Further, this ground path frame 12 is a closing structure and is positioned at all sides of this circuit unit 111.In addition; this conductive shell 14 has the accommodating cavity of this circuit unit 111 accommodating; the degree of depth (namely conductive shell 14 is towards the size of the assembly direction of circuit unit 111) of this accommodating cavity is not less than the height of the highest components and parts in circuit unit 111; preferably; in order to make the electronic installation with this circuit protection structure have thinner size, the degree of depth of this accommodating cavity equals or slightly larger than the height of the highest components and parts in circuit unit 111.
Further; disclosure conductive shell 14 is sealed on ground path frame 12 by conducting foam 13; certainly; later stage can also be fixed this conductive shell 14 further by screw etc.; this conducting foam 13 is arranged between ground path frame 12 and conductive shell 14 and is electrically connected for ground path frame 12 and conductive shell 14; thus make this protective circuit structure forming method draw basket structure, avoid this circuit unit 111 to be subject to electromagnetic radiation.Optionally, conducting foam 13 of the present disclosure coincides with ground path frame 12, and namely the profile of this conducting foam is identical with the profile of ground path frame 12.Further, this conducting foam 13 coincides with the outer rim of conductive shell 14.The contact shape of surface and the shape of size and ground path frame 12 and size of this conductive shell 14 and conducting foam 13 is all consistent, setting like this not only can reach effect attractive in appearance, and conducting foam 13 and ground path frame 14 can be made to reach a best line transmission effect, avoid wide being connected with the All other routes on PCB11 of the width because of this conducting foam 13 to cause connection chaotic or because of the narrow effect affecting electric signal and transmit of width of conducting foam 13.
As shown in Figure 1 to Figure 3, in embodiment of the present disclosure, the relative two sides of this conducting foam 13 are sticky respectively to be sticked between conductive shell 14 and ground path frame 12, wherein, the relative two sides of this conducting foam 13 comprise conductive double sided adhesive tape, with make this conducting foam 13 can by conductive shell 14 and ground path frame 12 bonding and realize electrical connection.In this embodiment, by a side of conducting foam 13 is fitted on ground path frame 12, and by conducting foam 13 another side is fitted on conductive shell 14, to form closed Faraday cage structure, the more important thing is, conducting foam 13 is utilized to have satisfactory electrical conductivity and the large feature of elasticity, can effectively fill up the minim gap of leading between conductive shell 14 and PCB11, conductive shell 14 is contacted fully with between PCB11, thus the distortion of PCB11 in PCB11 installation process can be effectively overcomed and the conductive shell 14 caused contacts insufficient problem that shield effectiveness is deteriorated with the ground of PCB11.
Optionally, in another embodiment of the present disclosure, as shown in Figure 4, this circuit protection structure also comprises: electric silica gel 15; This electric silica gel 15 and conducting foam 13 bonded to each other, wherein, this electric silica gel 15 is sticky to be sticked in ground path frame 12, this conducting foam 13 glues and sticks in conductive shell 14, in this embodiment, need to design rigorous processing step, avoid there is gap between conductive shell 14 and ground path frame 12.
Optionally, in other embodiments of the present disclosure, this conducting foam 13 can also replace with electric silica gel, conductive fabric or conductive double sided adhesive tape, namely directly can be sticky in by this conductive shell 14 on ground path frame 12 to form closed Faraday cage structure by utilizing conductive rubber.
Further, according to the second aspect of disclosure embodiment, a kind of electronic installation is also proposed, comprise housing and be installed at least one circuit protection structure in housing, this circuit protection structure is the circuit protection structure in above-mentioned any one embodiment, particularly, as shown in Figures 1 to 4, this circuit protection structure comprises: printing board PCB 11, ground path frame 12, conductive shell 14 and being arranged between described ground path frame 12 and described conductive shell 14 for the conducting foam 13 that ground path frame 12 and conductive shell 14 are electrically connected, wherein, the ground path frame 12 PCB11 having circuit unit 111 and enclose in circuit unit 111.Preferably, this conducting foam 13 coincides with the orthographic projection of ground path frame 12 on PCB11, and namely conducting foam 13 and ground path frame 12 coincide.Further, this conducting foam 13 coincides with the outer rim of conductive shell 14.In the present embodiment, structure and the selection of this conducting foam and the conducting foam 13 in foregoing circuit operator guards are all identical, just repeat no more at this.Optionally, this circuit protection structure also comprises: electric silica gel 15; Electric silica gel 15 and conducting foam 13 bonded to each other, wherein, electric silica gel 15 is sticky to be sticked in ground path frame 12, and conducting foam 13 is sticky to be sticked in conductive shell 14.
The circuit unit of protection is needed by the compound mode of conductive shell, conducting foam and ground path frame to form faraday's basket structure in the disclosure; realize the object that electromagnetic radiation shielding disturbs circuit unit to eliminate or to reduce electromagnetic radiation; and avoid the weight and volume increasing product by adding screening conductive face shield, thus improve product competition advantage.
Those skilled in the art, at consideration specification and after putting into practice disclosed herein disclosing, will easily expect other embodiment of the present disclosure.The application is intended to contain any modification of the present disclosure, purposes or adaptations, and these modification, purposes or adaptations are followed general principle of the present disclosure and comprised the undocumented common practise in the art of the disclosure or conventional techniques means.Specification and embodiment are only regarded as exemplary, and true scope of the present disclosure and spirit are pointed out by the claim of the application.
Should be understood that, the disclosure is not limited to precision architecture described above and illustrated in the accompanying drawings, and can carry out various amendment and change not departing from its scope.The scope of the present disclosure is only limited by appended claim.
Claims (10)
1. a circuit protection structure, is characterized in that, comprising:
Printing board PCB, it has circuit unit and encloses the ground path frame in described circuit unit; Conductive shell, has the accommodating cavity of accommodating described circuit unit;
Conducting foam, is arranged between described ground path frame and described conductive shell and is electrically connected for described ground path frame and described conductive shell.
2. circuit protection structure according to claim 1; it is characterized in that, described circuit protection structure also comprises: the electric silica gel fitting in described conducting foam, wherein; described conductive silicon is gluing to be sticked in described ground path frame, and described conducting foam is sticky to be sticked in described conductive shell.
3. circuit protection structure according to claim 1, is characterized in that, described conducting foam and described ground path frame coincide.
4. circuit protection structure according to claim 1 and 2, is characterized in that, the outer rim of described conducting foam and described conductive shell coincides.
5. circuit protection structure according to claim 1, is characterized in that, the live width of described ground path frame is not more than 5mm.
6. an electronic installation, comprise housing and be installed at least one circuit protection structure in described housing, it is characterized in that, described circuit protection structure comprises:
Printing board PCB, it has circuit unit and encloses the ground path frame in described circuit unit;
Conductive shell, has the accommodating cavity of accommodating described circuit unit;
Conducting foam, is arranged between described ground path frame and described conductive shell and is electrically connected for described ground path frame and described conductive shell.
7. electronic installation according to claim 6; it is characterized in that, described circuit protection structure also comprises: the electric silica gel fitting in described conducting foam, wherein; described conductive silicon is gluing to be sticked in described ground path frame, and described conducting foam is sticky to be sticked in described conductive shell.
8. electronic installation according to claim 6, is characterized in that, described conducting foam and described ground path frame coincide.
9. the electronic installation according to claim 6 or 7, is characterized in that, the outer rim of described conducting foam and described conductive shell coincides.
10. circuit protection structure according to claim 6, is characterized in that, the live width of described ground path frame is not more than 5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520332844.6U CN204634156U (en) | 2015-05-21 | 2015-05-21 | Circuit protection structure and electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520332844.6U CN204634156U (en) | 2015-05-21 | 2015-05-21 | Circuit protection structure and electronic installation |
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| Publication Number | Publication Date |
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| CN204634156U true CN204634156U (en) | 2015-09-09 |
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| CN201520332844.6U Active CN204634156U (en) | 2015-05-21 | 2015-05-21 | Circuit protection structure and electronic installation |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104837327A (en) * | 2015-05-21 | 2015-08-12 | 小米科技有限责任公司 | Circuit protection structure and electronic device |
| WO2017096818A1 (en) * | 2015-12-09 | 2017-06-15 | 乐视控股（北京）有限公司 | Pcb device for soldering electrically conductive heat sink plate, electrically conductive heat sink plate and soldering method |
| CN107221765A (en) * | 2017-06-23 | 2017-09-29 | 上海传英信息技术有限公司 | Electronic component ground structure |
| CN108110401A (en) * | 2016-11-24 | 2018-06-01 | 英业达(重庆)有限公司 | Anneta module |
| CN114599189A (en) * | 2022-03-30 | 2022-06-07 | 青岛歌尔智能传感器有限公司 | Sealing structure, sealing method, and electronic apparatus |
-
2015
- 2015-05-21 CN CN201520332844.6U patent/CN204634156U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104837327A (en) * | 2015-05-21 | 2015-08-12 | 小米科技有限责任公司 | Circuit protection structure and electronic device |
| WO2017096818A1 (en) * | 2015-12-09 | 2017-06-15 | 乐视控股（北京）有限公司 | Pcb device for soldering electrically conductive heat sink plate, electrically conductive heat sink plate and soldering method |
| CN108110401A (en) * | 2016-11-24 | 2018-06-01 | 英业达(重庆)有限公司 | Anneta module |
| CN108110401B (en) * | 2016-11-24 | 2020-04-03 | 英业达(重庆)有限公司 | Antenna module |
| CN107221765A (en) * | 2017-06-23 | 2017-09-29 | 上海传英信息技术有限公司 | Electronic component ground structure |
| CN114599189A (en) * | 2022-03-30 | 2022-06-07 | 青岛歌尔智能传感器有限公司 | Sealing structure, sealing method, and electronic apparatus |
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