CN108110401B - Antenna module - Google Patents
Antenna module Download PDFInfo
- Publication number
- CN108110401B CN108110401B CN201611052185.6A CN201611052185A CN108110401B CN 108110401 B CN108110401 B CN 108110401B CN 201611052185 A CN201611052185 A CN 201611052185A CN 108110401 B CN108110401 B CN 108110401B
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- Prior art keywords
- antenna
- conductive foam
- module
- metal
- electrically connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Support Of Aerials (AREA)
- Telephone Set Structure (AREA)
- Details Of Aerials (AREA)
Abstract
The invention discloses an antenna module which is suitable for being installed on a metal shell and comprises an antenna body, an antenna grounding circuit and a conductive foam, wherein the antenna grounding circuit is electrically connected with the antenna body, and the conductive foam surrounds the module, is electrically connected with the antenna grounding circuit and surrounds one side of the antenna body. The conductive foam surrounds the module and is more electrically connected with the metal shell. The invention can improve the communication capability of the wireless antenna of the electronic device with the metal shell.
Description
Technical Field
The invention discloses an antenna module. Particularly, the invention discloses an antenna module used for a metal shell.
Background
Electronic devices are increasingly thin, light, small, and have ever-increasing capabilities for data processing and communication. Therefore, various types of electronic devices are applied to daily life of people and become an indispensable part of the daily life of people.
In recent years, electronic devices, such as computer mainframe, tablet computer, display, keyboard, tv box, and mobile phone, have increasingly large functions, and have been designed and applied to combine different functions. In order to meet the communication requirement between electronic devices, and achieve the purpose of mutual communication, even expanding the functions of the electronic devices, wireless communication is gradually becoming the standard equipment of the electronic devices.
However, when the antenna required for wireless communication is embedded in these electronic devices, the transceiving capability of the antenna is often affected due to the existence of the circuit board or other metal housing of the electronic device. It is particularly noteworthy that, due to the demands of the design of the electronic devices and the strength requirements of the housings of the electronic devices, more and more electronic devices adopt the design of all-metal housings. Therefore, the ability of the antenna to receive signals is shielded by the metal shell, which is prone to poor reception.
How to improve the receiving capability of the antenna of the electronic device with wireless communication capability will effectively improve the usage space and range of the electronic device with wireless communication capability.
Disclosure of Invention
In view of the above, the present invention discloses an antenna module, which can improve the communication capability of a wireless antenna of an electronic device having a metal housing.
An embodiment of the present invention relates to an antenna module suitable for being mounted on a metal housing, the antenna module including an antenna body, an antenna ground line electrically connected to the antenna body, and a conductive foam surrounding the module and electrically connected to the antenna ground line and surrounding one side of the antenna body. The conductive foam surrounds the module and is more electrically connected with the metal shell.
In one embodiment, the metal housing further includes a non-metal cover, the antenna body is located inside the non-metal cover, and the conductive foam surrounding module also surrounds inside of the non-metal cover.
In one embodiment, the non-metallic cover is a plastic cover. In another embodiment, the non-metallic cover is a ceramic cover.
In one embodiment, the conductive foam surrounding module further includes a first conductive foam, a second conductive foam, and a third conductive foam, which surround the antenna body and the non-metal cover together. The first conductive foam, the second conductive foam and the third conductive foam are respectively and electrically connected with the antenna grounding circuit and the metal casing.
In an embodiment, the metal housing further includes a first surface, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface, which are made of metal materials.
In one embodiment, the first surface, the second surface, the third surface, the fourth surface and the sixth surface are integrally formed by a metal material.
In an embodiment, the non-metal cover is located on the first surface, and the conductive foam surrounds the module and is located on the inner sides of the first surface, the second surface, the third surface and the fourth surface, and is electrically connected to the sixth surface, so that the conductive foam surrounds the module, the sixth surface, the antenna body and the antenna ground circuit to form a space together.
In summary, the antenna module disclosed in the present invention can electrically connect the antenna ground circuit and the metal housing in the metal housing through the conductive foam surrounding the module, so as to enhance the wireless signal receiving and transmitting capabilities of the antenna module and the electronic device using the antenna module. In addition, the antenna body, the antenna grounding circuit, the conductive foam surrounding module and the metal shell form a space together, so that the wireless signal receiving and transmitting capacity of the antenna module and the electronic device using the antenna module can be further enhanced.
Drawings
The foregoing and other objects, features, advantages and embodiments of the disclosure will be more readily understood from the following description taken in conjunction with the accompanying drawings in which:
fig. 1 is a schematic diagram of an antenna module according to an embodiment of the invention.
Fig. 2 is a schematic diagram of an antenna module according to another embodiment of the invention.
100: metal casing
110: first surface
120: second surface
130: third surface
140: the fourth surface
150: fifth surface
160: the sixth surface
200: non-metal cover
300: antenna module
310: antenna body
320: antenna grounding circuit
400: conductive foam surrounding module
410: first conductive foam
420: second conductive foam
430: third conductive foam
440: first gap
450: second gap
Detailed Description
The following detailed description of the embodiments with reference to the drawings is provided for the purpose of limiting the scope of the invention, and the description of the structure and operation is not intended to limit the order of execution, any arrangement of components which results in a device with equivalent functionality, or any combination thereof. In addition, the drawings are for illustrative purposes only and are not drawn to scale. For ease of understanding, the same or similar components will be described with the same reference numerals in the following description.
Further, the terms (terms) used throughout the specification and claims have the ordinary meaning as commonly understood by one of ordinary skill in the art, in the context of this invention, and in the context of a particular application, unless otherwise indicated. Certain terms used to describe the invention are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the invention.
The terms "first," "second," and the like, as used herein, are not intended to be limited to the specific order or sequence presented, nor are they intended to be limiting, but rather are intended to distinguish one element from another or from another element or operation described by the same technical term.
Furthermore, as used herein, the terms "comprising," "including," "having," "containing," and the like are open-ended terms that mean including, but not limited to.
Fig. 1 is a schematic diagram of an antenna module according to an embodiment of the invention. As shown, the antenna module 300 is configured to be mounted in a metal housing 100 to increase the wireless signal receiving and transmitting capability of the electronic device.
The metal housing 100 includes a non-metal cover 200, and the antenna module 300 includes an antenna body 310, an antenna ground circuit 320 electrically connected to the antenna body 310 and a conductive foam surrounding module 400.
The antenna body 310 is generally located on an inner side of the non-metal cover 200, and the conductive foam surrounding module 400 surrounds the antenna body 310 and the inner side of the non-metal cover 200, i.e., located inside the metal casing 100. As shown, the conductive foam surrounds the module 400 from the non-metal cover 200 and one end of the antenna body 310, extends toward the inside of the metal casing 100, and forms a U-shaped appearance. In addition, the conductive foam surrounds one end of the module 400 and is electrically connected to the antenna ground line 320, and the conductive foam surrounds the other end of the module 400 and is electrically connected to the metal chassis 100. Therefore, the antenna body 310, the conductive foam surrounding the module 400, the antenna ground circuit 320 and the metal casing 100 together form a space, which can effectively increase the capability of receiving and transmitting wireless signals.
Taking fig. 1 as an example, the metal casing 100 includes a first surface 110, a second surface 120, a third surface 130, a fourth surface 140, a fifth surface 150 and a sixth surface 160, which are preferably made of metal materials. Any of the adjacent surfaces may be formed separately or integrally without departing from the spirit and scope of the present invention.
For example, the first surface 110, the second surface 120, the third surface 130, the fourth surface 140 and the sixth surface 160 may be integrally formed by a metal material, or the sixth surface 160 is separately formed and then joined to the first surface 110, the second surface 120, the third surface 130 and the fourth surface 140, without departing from the spirit and scope of the present invention.
In one embodiment, the non-metal cover 200 is located on the first surface 110, and the conductive foam surrounding module 400 is located inside the first surface 110, the second surface 120, the third surface 130 and the fourth surface 140, and is clamped between the fifth surface 150 and the sixth surface 160, contacts the sixth surface 160 through the conductive foam surrounding module 400, and is electrically connected to the sixth surface 160. In addition, the conductive foam surrounding the module 400 is also electrically connected to the antenna ground line 320, so that the conductive foam surrounding the module 400, the sixth surface 160, the antenna body 310 and the antenna ground line 320 together form a space to further enhance the signal receiving and transmitting capability of the antenna module 300.
In one embodiment, the non-metallic cover 200 is a plastic cover, and in another embodiment, the non-metallic cover 200 is a ceramic cover, although the invention is not limited thereto.
Fig. 2 is a schematic diagram of an antenna module according to another embodiment of the present invention. The conductive foam surrounding module 400 further includes a first conductive foam 410, a second conductive foam 420, and a third conductive foam 430, which surround the antenna body 310 and the inner side of the non-metal cover 200. A first gap 440 and a second gap 450 are formed between the first conductive foam 410, the second conductive foam 420 and the third conductive foam 430, respectively, so that the first conductive foam 410, the second conductive foam 420 and the third conductive foam 430 are independent conductive foams, which can be electrically connected to the antenna ground line 320, respectively, and contact the sixth surface 160 and electrically connected to the sixth surface 160, respectively. Therefore, the first conductive foam 410, the second conductive foam 420, the third conductive foam 430, the sixth surface 160, the antenna body 310 and the antenna ground line 320 together form a space to further enhance the signal receiving and transmitting capability of the antenna module 300.
In summary, the antenna module disclosed in the present invention can electrically connect the antenna ground circuit and the metal housing in the metal housing through the conductive foam surrounding the module, so as to enhance the wireless signal receiving and transmitting capabilities of the antenna module and the electronic device using the antenna module. In addition, a space is formed by the antenna body, the antenna grounding circuit, the conductive foam surrounding module and the metal shell together, so that the wireless signal receiving and transmitting capacity of the antenna module and the electronic device using the antenna module can be further enhanced.
While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (3)
1. An antenna module adapted to be mounted to a metal chassis, the antenna module comprising:
an antenna body;
an antenna grounding circuit electrically connected to the antenna body; and
the conductive foam surrounding module is electrically connected with the antenna grounding circuit and surrounds one side of the antenna body, wherein the conductive foam surrounding module is electrically connected with the metal shell;
the metal casing further comprises a non-metal cover, the antenna body is positioned on one inner side of the non-metal cover, and the conductive foam surrounds the module and surrounds the inner side of the non-metal cover;
the conductive foam surrounding module further comprises a first conductive foam, a second conductive foam and a third conductive foam which surround the antenna body and the inner side of the non-metal cover together;
the first conductive foam, the second conductive foam and the third conductive foam are respectively and electrically connected with the antenna grounding circuit and the metal shell;
the metal casing further comprises a first surface, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface which are all made of metal materials;
the first surface, the second surface, the third surface, the fourth surface and the sixth surface are integrally formed by metal materials;
the non-metal cover is positioned on the first surface;
the conductive foam surrounding module is positioned on the inner sides of the first surface, the second surface, the third surface and the fourth surface and is electrically connected with the sixth surface, so that the conductive foam surrounding module, the sixth surface, the antenna body and the antenna grounding circuit form a space together;
the first conductive foam, the second conductive foam and the third conductive foam are independent conductive foams, are respectively electrically connected with the antenna grounding circuit, and are respectively contacted with the sixth surface and electrically connected with the sixth surface.
2. The antenna module of claim 1, wherein the non-metallic cover is a plastic cover.
3. The antenna module of claim 1, wherein the non-metallic cover is a ceramic cover.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611052185.6A CN108110401B (en) | 2016-11-24 | 2016-11-24 | Antenna module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611052185.6A CN108110401B (en) | 2016-11-24 | 2016-11-24 | Antenna module |
Publications (2)
Publication Number | Publication Date |
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CN108110401A CN108110401A (en) | 2018-06-01 |
CN108110401B true CN108110401B (en) | 2020-04-03 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201611052185.6A Active CN108110401B (en) | 2016-11-24 | 2016-11-24 | Antenna module |
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CN (1) | CN108110401B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201207645Y (en) * | 2008-05-08 | 2009-03-11 | 英华达(南京)科技有限公司 | Card interposing radio communication module |
CN201966972U (en) * | 2011-02-24 | 2011-09-07 | 惠州卡美欧通讯有限公司 | Flip phone capable of improving performance of antenna |
CN202085212U (en) * | 2011-06-10 | 2011-12-21 | 深圳市广信技术有限公司 | Flip-lid handset |
CN204634156U (en) * | 2015-05-21 | 2015-09-09 | 小米科技有限责任公司 | Circuit protection structure and electronic installation |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7580004B1 (en) * | 2005-01-25 | 2009-08-25 | Location & Tracking Technologies, Llc | System and method for position or range estimation, tracking and selective interrogation and communication |
US7522108B2 (en) * | 2005-08-04 | 2009-04-21 | Amphenol Corporation | Antenna ground structure |
-
2016
- 2016-11-24 CN CN201611052185.6A patent/CN108110401B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201207645Y (en) * | 2008-05-08 | 2009-03-11 | 英华达(南京)科技有限公司 | Card interposing radio communication module |
CN201966972U (en) * | 2011-02-24 | 2011-09-07 | 惠州卡美欧通讯有限公司 | Flip phone capable of improving performance of antenna |
CN202085212U (en) * | 2011-06-10 | 2011-12-21 | 深圳市广信技术有限公司 | Flip-lid handset |
CN204634156U (en) * | 2015-05-21 | 2015-09-09 | 小米科技有限责任公司 | Circuit protection structure and electronic installation |
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CN108110401A (en) | 2018-06-01 |
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