TWM546039U - Flat cable structure - Google Patents

Flat cable structure Download PDF

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Publication number
TWM546039U
TWM546039U TW106202453U TW106202453U TWM546039U TW M546039 U TWM546039 U TW M546039U TW 106202453 U TW106202453 U TW 106202453U TW 106202453 U TW106202453 U TW 106202453U TW M546039 U TWM546039 U TW M546039U
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Taiwan
Prior art keywords
conductive adhesive
adhesive layer
layer
cable structure
insulating
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TW106202453U
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Chinese (zh)
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Chih-Jung Chen
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Bing Xu Precision Co Ltd
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Application filed by Bing Xu Precision Co Ltd filed Critical Bing Xu Precision Co Ltd
Priority to TW106202453U priority Critical patent/TWM546039U/en
Priority to CN201720402063.9U priority patent/CN206991808U/en
Publication of TWM546039U publication Critical patent/TWM546039U/en

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  • Insulated Conductors (AREA)
  • Communication Cables (AREA)

Description

排線結構 Cable structure

本創作涉及一種排線結構,尤指一種加強排線結構穩定度同時可以降低電磁干擾的排線結構。 The present invention relates to a cable structure, and more particularly to a cable structure that enhances the stability of the cable structure while reducing electromagnetic interference.

排線是一種數據傳輸線纜,用來傳輸兩個電子設備間的數據,一般排線都是由數條導線平行排列組合而成,每一條導線都有一層絕緣層來獨立傳輸訊號。在一些排線結構的設計上,會再以兩條以上的排線為一組,傳統的軟性排線結構具有複數個金屬傳輸線,每個傳輸線由一絕緣內被包覆,兩條金屬傳輸線為一傳輸線組,每一傳輸線組由一金屬屏蔽層包覆。 The cable is a data transmission cable used to transmit data between two electronic devices. The general cable is composed of a plurality of wires arranged in parallel, and each wire has an insulating layer for independently transmitting signals. In the design of some cable structure, there will be more than two cable lines. The traditional flexible cable structure has a plurality of metal transmission lines, each of which is covered by an insulation, and the two metal transmission lines are A transmission line group, each transmission line group being covered by a metal shielding layer.

然而在這類的排線結構中,傳輸線的絕緣外套與金屬屏蔽層間具有空隙,傳輸線容易晃動而造成接觸不良甚至脫落,使得排線的傳輸品質下降。一般解決的方法是在空隙中,透過焊接的方法用焊錫填滿空隙,然而這樣的做法需要逐一焊接各個空隙,相法費工。 However, in this type of cable structure, there is a gap between the insulating jacket of the transmission line and the metal shield layer, and the transmission line is easily shaken to cause poor contact or even fall off, so that the transmission quality of the cable is degraded. The general solution is to fill the gap with solder in the gap by soldering. However, this method requires soldering each gap one by one, which is labor-intensive.

此外電子產品的資料傳輸速度朝向高速化,對傳輸線的高速訊號傳輸品質要求也越來越高,為了提高傳輸線的品 質,必須降低訊號線間的干擾與改善訊號傳輸時產生的電磁干擾(Electromagnetic Disturbance,EMI)問題。 In addition, the data transmission speed of electronic products is moving toward higher speed, and the high-speed signal transmission quality of transmission lines is also becoming higher and higher, in order to improve the transmission line products. Quality, it is necessary to reduce the interference between the signal lines and improve the electromagnetic interference (EMI) problem generated when the signal is transmitted.

鑒於此,本創作的目的在於提供一種排線結構,利用導電膠層以填充導線與屏蔽層間的空隙以及填充屏蔽層外的空間,以減少導線晃動或脫落的可能。如此不但可以簡化填充步驟,並同時可以提供更好的遮蔽效果以改善EMI。 In view of this, the purpose of the present invention is to provide a cable structure, which utilizes a conductive adhesive layer to fill the gap between the wire and the shield layer and fill the space outside the shield layer to reduce the possibility of wire sway or fall off. This not only simplifies the filling step, but also provides better shielding to improve EMI.

本創作實施例提供一種排線結構,包括複數條訊號導線、複數個絕緣內被、一屏蔽層、一內導電膠層、一接地線、一絕緣外被以及一外導電膠層。複數個該訊號導線彼此平行設置,用來傳輸資料訊號。每一複數個該絕緣內被包覆其中之一訊號導線。該屏蔽層環繞複數個該絕緣內被,用來避免電磁干擾效應。該內導電膠層填充於該屏蔽層與複個數該絕緣內被之間。該接地線設置於該屏蔽層的一側,用來傳輸接地電壓。該絕緣外被包覆該屏蔽層和該接地線。該外導電膠層貼附於該絕緣外被與該屏蔽層之間,使該屏蔽層與該接地線電性連接。 The present invention provides a cable structure including a plurality of signal wires, a plurality of insulating inner layers, a shielding layer, an inner conductive adhesive layer, a grounding wire, an insulating outer layer, and an outer conductive adhesive layer. A plurality of the signal wires are arranged in parallel with each other for transmitting data signals. Each of the plurality of insulations is covered with one of the signal wires. The shielding layer surrounds a plurality of the insulating inner layers to avoid electromagnetic interference effects. The inner conductive adhesive layer is filled between the shielding layer and a plurality of the insulating inner layers. The ground line is disposed on one side of the shielding layer for transmitting a ground voltage. The insulating outer layer is covered with the shielding layer and the grounding wire. The outer conductive adhesive layer is attached between the outer insulating layer and the shielding layer, and the shielding layer is electrically connected to the grounding wire.

本創作排線結構還包括一連接器、一金屬箔以及一附屬導電膠層。該連接器包含一金屬殼體以及複數個端子焊接部,複數個該端子焊接部電性連接複數條該訊號導線。該金屬箔用來電性連接該連接器之金屬殼體與該外導電膠層,使該連接器之金屬殼體與該外導電膠層電性連接。該附屬導電膠層貼附於該連接器之金屬殼體,該金屬箔透過該附屬導電膠層與該外導電膠層電性連接,使該金屬殼體、該金屬箔、該附屬導電膠層、外導 電膠層接地。 The creation cable structure further includes a connector, a metal foil and an auxiliary conductive adhesive layer. The connector comprises a metal housing and a plurality of terminal soldering portions, and the plurality of terminal soldering portions are electrically connected to the plurality of signal wires. The metal foil is used for electrically connecting the metal casing of the connector and the outer conductive adhesive layer, so that the metal casing of the connector is electrically connected to the outer conductive adhesive layer. The auxiliary conductive adhesive layer is attached to the metal shell of the connector, and the metal foil is electrically connected to the outer conductive adhesive layer through the auxiliary conductive adhesive layer to make the metal shell, the metal foil and the auxiliary conductive adhesive layer External guidance The glue layer is grounded.

因此可以使屏蔽層具有良好的遮蔽效果。同時本實施例尚有一絕緣層,用來使該連接器之端子焊接部/電路板與該附屬導電膠層絕緣,藉此保護該端子焊接部以及該電絡板。 Therefore, the shielding layer can have a good shielding effect. At the same time, the embodiment further has an insulating layer for insulating the terminal soldering portion/circuit board of the connector from the auxiliary conductive adhesive layer, thereby protecting the terminal soldering portion and the electrical board.

依據本創作之實施例,該排線結構在該屏蔽層與複個數該絕緣內被之間填充一內導電膠層,使得訊號導線不易晃動,藉此提高排線結構的穩定度。該外導電膠層填充於該屏蔽層與該絕緣外被之間,使得絕緣內被包覆之複數條該導線以及接地線不易晃動或脫落,並且該外導電膠層使該屏蔽層與該接地線電性連接,使得屏蔽層具有良好的遮蔽效果,如此不但可以提高排線結構的穩定度,同時也藉此結構改善EMI。 According to the embodiment of the present invention, the cable structure is filled with an inner conductive adhesive layer between the shielding layer and the plurality of the insulating inner portions, so that the signal wires are not easily shaken, thereby improving the stability of the cable structure. The outer conductive adhesive layer is filled between the shielding layer and the insulating outer cover, so that the plurality of wires and the grounding wire coated in the insulating layer are not easy to shake or fall off, and the outer conductive adhesive layer makes the shielding layer and the grounding layer The electrical connection of the wires makes the shielding layer have a good shielding effect, so that not only the stability of the cable structure can be improved, but also the structure is used to improve EMI.

此外,該連接器之金屬殼體、該金屬箔與該外導電膠層電性連接。換言之,該金屬殼體、該金屬箔以及該外導電膠層皆與接地線等電位,因此該金屬殼體以及該金屬箔具有良好的屏蔽效果,如此不但可以提高排線結構的穩定度,同時也藉此結構改善EMI。 In addition, the metal casing of the connector and the metal foil are electrically connected to the outer conductive adhesive layer. In other words, the metal casing, the metal foil and the outer conductive adhesive layer are all equipotential with the grounding wire, so that the metal casing and the metal foil have a good shielding effect, so that not only the stability of the cable structure can be improved, but also This structure is also used to improve EMI.

此外,習知技術中通常以焊接的方法在金屬導線與屏蔽層之間的空隙填上焊錫,如此相當費工,會提高生產成本。而本創作實施例的排線結構利用內導電膠層填充該空隙,可以省去操作上的麻煩。 In addition, in the prior art, solder is usually used to fill the gap between the metal wire and the shield layer by soldering, which is quite laborious and increases the production cost. However, the cable structure of the present embodiment can fill the gap with the inner conductive adhesive layer, which can save the operation trouble.

為讓本創作之上述內容能更明顯易懂,下文特舉較佳實施例,並配合所附圖式,作詳細說明如下: In order to make the above content of the present invention more obvious and understandable, the preferred embodiments are described below, and the detailed description is as follows:

10‧‧‧排線結構 10‧‧‧ cable structure

12‧‧‧訊號導線 12‧‧‧ Signal wire

120‧‧‧絕緣內被 120‧‧‧Insulated inner

14‧‧‧屏蔽層 14‧‧‧Shield

16‧‧‧接地線 16‧‧‧Grounding wire

18‧‧‧絕緣外被 18‧‧‧Insulated outer jacket

20‧‧‧內導電膠層 20‧‧‧Inner conductive layer

22‧‧‧外導電膠層 22‧‧‧External conductive adhesive layer

24‧‧‧附屬導電膠層 24‧‧‧Attach conductive adhesive layer

30‧‧‧絕緣層 30‧‧‧Insulation

40‧‧‧連接器 40‧‧‧Connector

42‧‧‧金屬殼體 42‧‧‧Metal housing

44‧‧‧端子焊接部 44‧‧‧Terminal welding department

440‧‧‧電路板 440‧‧‧ boards

46‧‧‧金屬箔 46‧‧‧metal foil

第1圖繪示本創作的排線結構。 Figure 1 shows the structure of the cable.

第2圖為第1圖將金屬箔拆開後之構造圖。 Fig. 2 is a structural view showing the metal foil taken apart in Fig. 1.

第3圖繪示將第2圖之外導電膠層、附屬導電膠層以及絕緣層移開後的排線結構的構造圖。 FIG. 3 is a structural view showing a wiring structure after removing the conductive adhesive layer, the auxiliary conductive adhesive layer, and the insulating layer in FIG. 2 .

第4圖是第2圖沿切線A-A’縱切之剖面圖。 Fig. 4 is a cross-sectional view taken along line 2A-A' of Fig. 2;

本創作實施例目的的實現、功能特點及優點將結合實施例,參照附圖做進一步說明。 The implementation, functional features, and advantages of the present embodiments will be further described with reference to the accompanying drawings.

以下各實施例的說明是參考附加的圖式,用以例示本創作可用以實施之特定實施例。本創作所提到的方向用語,例如「上」、「下」、「前」、「後」、「左」、「右」、「頂」、「底」、「水平」、「垂直」等,僅是參考附加圖式的方向。因此,使用的方向用語是用以說明及理解本創作,而非用以限制本創作。 The following description of the various embodiments is provided to illustrate the specific embodiments in which the present invention may be practiced. Directional terms mentioned in this creation, such as "upper", "lower", "before", "after", "left", "right", "top", "bottom", "horizontal", "vertical", etc. , just refer to the direction of the additional schema. Therefore, the directional terminology used is used to describe and understand the creation, and is not intended to limit the creation.

請參考第1圖,第1圖繪示本創作的排線結構10。排線結構10包含一連接器40、一金屬箔46以及一絕緣外被18。連接器40用來插入電子裝置(未圖示),以使排線結構10傳輸該電子裝置的資料訊號。排線結構10的架構可用於符合HDMI/USB3.0/USB3.1/Display Port/SATA等資料率(Data Rate)大於1Gb/s之排線。金屬箔46則包覆於連接器40與絕緣外被18之間。金屬箔46可以是鋁箔或銅箔。 Please refer to FIG. 1 , which illustrates the cable structure 10 of the present invention. The cable structure 10 includes a connector 40, a metal foil 46, and an insulating outer jacket 18. The connector 40 is used to insert an electronic device (not shown) to cause the cable structure 10 to transmit the data signal of the electronic device. The structure of the cable structure 10 can be used to comply with the HDMI/USB3.0/USB3.1/Display Port/SATA data rate (Data Rate) greater than 1Gb/s. The metal foil 46 is wrapped between the connector 40 and the insulating outer jacket 18. The metal foil 46 may be an aluminum foil or a copper foil.

請參考第2圖,第2圖為第1圖所示之排線結構10將金屬箔46拆開後之構造圖。排線結構10另包含複數個外導電膠層22、一附屬導電膠層24以及一絕緣層30。外導電膠層22、 附屬導電膠層24以及絕緣層30結構及功能將於第4圖一併說明。 Please refer to FIG. 2, which is a structural view of the wire structure 10 shown in FIG. 1 with the metal foil 46 removed. The cable structure 10 further includes a plurality of outer conductive adhesive layers 22, an auxiliary conductive adhesive layer 24, and an insulating layer 30. External conductive adhesive layer 22, The structure and function of the auxiliary conductive adhesive layer 24 and the insulating layer 30 will be described in FIG.

請參考第3圖,第3圖繪示將第2圖之外導電膠層22、附屬導電膠層24以及絕緣層30移開後的排線結構10的構造圖。連接器40包含一金屬殼42、複數個端子焊接部44以及一電路板440。複數個端子焊接部44設置於電路板440上,每一端子焊接部44與訊號導線12或是接地線16接觸。電路板440置於金屬殼42之內,因此金屬殼42不僅用來保護電路板440,也可以形成金屬屏蔽以防止電磁干擾。當連接器40插入電子裝置時,電子裝置的資料可通過電路板440和複數條訊號導線12進行傳輸。絕緣層30貼附在複數個端子焊接部44、訊號導線12、接地線16以及電路板440上,且位於附屬導電膠層24與訊號導線12之間,以避免訊號導線12與附屬導電膠層24接觸。在本創作中,絕緣層30材質為UV膠,然UV膠只是本創作其中之一實施例,舉凡能貼附於本創作之複數個端子焊接部44和電路板440,並將兩者絕緣以達到保護電路目的之材質,均為本創作之範疇。 Referring to FIG. 3, FIG. 3 is a structural view showing the wiring structure 10 after the conductive paste layer 22, the auxiliary conductive adhesive layer 24, and the insulating layer 30 are removed from FIG. The connector 40 includes a metal case 42, a plurality of terminal soldering portions 44, and a circuit board 440. A plurality of terminal soldering portions 44 are disposed on the circuit board 440, and each of the terminal soldering portions 44 is in contact with the signal wires 12 or the grounding wires 16. The circuit board 440 is placed inside the metal case 42, so that the metal case 42 is not only used to protect the circuit board 440, but also a metal shield to prevent electromagnetic interference. When the connector 40 is inserted into the electronic device, the data of the electronic device can be transmitted through the circuit board 440 and the plurality of signal wires 12. The insulating layer 30 is attached to the plurality of terminal soldering portions 44, the signal wires 12, the grounding wires 16, and the circuit board 440, and is disposed between the auxiliary conductive adhesive layer 24 and the signal wires 12 to avoid the signal wires 12 and the auxiliary conductive adhesive layer. 24 contacts. In the present creation, the insulating layer 30 is made of UV glue, but the UV glue is only one embodiment of the present invention, and can be attached to the plurality of terminal soldering portions 44 and the circuit board 440 of the present invention, and the two are insulated. The materials that achieve the purpose of protecting the circuit are all within the scope of this creation.

請一併參閱第3圖和第4圖,第4圖是第2圖沿切線A-A’縱切之剖面圖。 Please refer to Fig. 3 and Fig. 4 together. Fig. 4 is a cross-sectional view of Fig. 2 taken along the line A-A'.

排線結構10包含複數條訊號導線12、複數個絕緣內被120、一屏蔽層14、一內導電膠層20、一接地線10、一絕緣外被18以及一外導電膠層22。複數條訊號導線12用來傳輸資料訊號,每一絕緣內被120用來包覆複數條訊號導線12中之一條訊號導線12。屏蔽層14環繞複數個絕緣內被120,於本創作實施例中, 屏蔽層14環繞其中二個相鄰之絕緣內被120。在其它實施例中,屏蔽層14可用來環繞二個以上的絕緣內被120。屏蔽層14可以是金屬薄膜或是金屬網,用來避免電磁干擾。接地線16設置於屏蔽層14之一側。絕緣外被18使用電性絕緣材料,用來包覆屏蔽層14以及接地線16,換句話說,絕緣外被18包覆了被屏蔽層14環繞之複數條訊號導線12以及接地線16,以保護訊號導線12和接地線16。外導電膠層22可貼附於接地線16與屏蔽層14之間,因此外導電膠層22、屏蔽層14與接地線16電性連接。 The cable structure 10 includes a plurality of signal wires 12, a plurality of insulating inner layers 120, a shielding layer 14, an inner conductive adhesive layer 20, a grounding wire 10, an insulating outer layer 18, and an outer conductive adhesive layer 22. A plurality of signal conductors 12 are used to transmit data signals, and each of the insulation layers 120 is used to cover one of the plurality of signal conductors 12. The shielding layer 14 surrounds a plurality of insulating inner dies 120, in the present embodiment, The shield layer 14 surrounds two of the adjacent insulating inner layers 120. In other embodiments, the shield layer 14 can be used to surround more than two insulating inner layers 120. The shielding layer 14 can be a metal film or a metal mesh to avoid electromagnetic interference. The ground line 16 is disposed on one side of the shield layer 14. The insulating outer layer 18 is made of an electrically insulating material for covering the shielding layer 14 and the grounding wire 16. In other words, the insulating outer layer 18 covers the plurality of signal wires 12 and the grounding wire 16 surrounded by the shielding layer 14 to The signal conductor 12 and the ground line 16 are protected. The outer conductive adhesive layer 22 can be attached between the grounding wire 16 and the shielding layer 14 , so that the outer conductive adhesive layer 22 and the shielding layer 14 are electrically connected to the grounding wire 16 .

金屬箔46與連接器40之金屬殼體42以及外導電膠層22接觸,使連接器40之金屬殼體42以及外導電膠層22電性連接。如此一來,外導電膠層22、金屬殼體42以及金屬箔46即等電位,外導電膠層22又與接地線16電性連接,因此外導電膠層22、連接器之金屬殼體42以及金屬箔46皆接地,藉此便可增強遮蔽交果以改善電磁干擾。 The metal foil 46 is in contact with the metal casing 42 of the connector 40 and the outer conductive adhesive layer 22 to electrically connect the metal casing 42 of the connector 40 and the outer conductive adhesive layer 22. As a result, the outer conductive adhesive layer 22, the metal casing 42 and the metal foil 46 are equipotential, and the outer conductive adhesive layer 22 is electrically connected to the grounding wire 16, so that the outer conductive adhesive layer 22 and the metal casing 42 of the connector are connected. And the metal foil 46 is grounded, thereby enhancing the shielding effect to improve electromagnetic interference.

本創作之另一實施例包含有附屬導電膠層24貼附於連接器40之金屬殼體42,同時金屬箔46連接附屬導電膠層24以該外導電膠層22。如此一來,外導電膠層22、連接器40之金屬殼體42、金屬箔46以及附屬導電膠層24即等電位,外導電膠層22又與接地線16電性連接,因此外導電膠層22、連接器40之金屬殼體42、金屬箔46以及附屬導電膠層24皆接地。 Another embodiment of the present invention includes an attached conductive adhesive layer 24 attached to the metal housing 42 of the connector 40, while the metal foil 46 is attached to the auxiliary conductive adhesive layer 24 to the outer conductive adhesive layer 22. As a result, the outer conductive adhesive layer 22, the metal shell 42 of the connector 40, the metal foil 46 and the auxiliary conductive adhesive layer 24 are equipotential, and the outer conductive adhesive layer 22 is electrically connected to the grounding wire 16, so the outer conductive adhesive The layer 22, the metal casing 42 of the connector 40, the metal foil 46 and the auxiliary conductive adhesive layer 24 are all grounded.

如此,依據本創作的實施例,排線結構10在屏蔽層14與複數個絕緣內被120之間填充一內導電膠層20,使得複數條 訊號導線12不易晃動。外導電膠層22填充於屏蔽層14與絕緣外被18之間,使得絕緣內被120包覆之複數條導線12以及接地線16不易晃動或脫落。由於外導電膠層22電性連接於屏蔽層14和接地線16,連接器40之金屬殼體42和金屬箔46電性連接於外導電膠層22和附屬導電膠層24,因此外導電膠層22、附屬導電膠層24、金屬殼體42以及金屬箔46實質上與接地線16處於相同的接地電壓。如此一來,外導電膠層22、附屬導電膠層24、金屬殼體42以及金屬箔46形成另一個屏蔽層,因此可以更有效地屏蔽電磁干擾。因此本創作的排線結構10不但可以提高訊號線12的穩定度,同時也改善EMI。此外,習知技術中通常以焊接的方法在空隙填上焊錫,如此相當費工,會提高成產成本。而本創作實施例的排線結構利用導電膠層填充空隙,可以省去操作上的麻煩。 Thus, in accordance with an embodiment of the present invention, the cable structure 10 is filled with an inner conductive adhesive layer 20 between the shield layer 14 and the plurality of insulating inner layers 120, such that a plurality of strips The signal wire 12 is not easily shaken. The outer conductive adhesive layer 22 is filled between the shielding layer 14 and the insulating outer layer 18, so that the plurality of wires 12 and the grounding wire 16 covered by the insulating layer 120 are not easily shaken or fall off. Since the outer conductive adhesive layer 22 is electrically connected to the shielding layer 14 and the grounding wire 16, the metal casing 42 and the metal foil 46 of the connector 40 are electrically connected to the outer conductive adhesive layer 22 and the auxiliary conductive adhesive layer 24, so the outer conductive adhesive Layer 22, subsidiary conductive adhesive layer 24, metal housing 42 and metal foil 46 are substantially at the same ground voltage as ground line 16. As a result, the outer conductive adhesive layer 22, the auxiliary conductive adhesive layer 24, the metal casing 42 and the metal foil 46 form another shielding layer, so that electromagnetic interference can be shielded more effectively. Therefore, the cable structure 10 of the present invention can not only improve the stability of the signal line 12, but also improve EMI. In addition, in the prior art, solder is usually filled in the void by soldering, which is quite laborious and increases the production cost. The wiring structure of the present embodiment uses the conductive adhesive layer to fill the gap, which can save the operation trouble.

雖然本創作已用較佳實施例揭露如上,然其並非用以限定本創作,任何熟習此技藝者,在不脫離本創作之精神和範圍內,當可作各種之更動與修改,因此本創作之保護範圍當視後附之申請專利範圍所界定者為准。 Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. The scope of protection is subject to the definition of the scope of the patent application.

12‧‧‧訊號導線 12‧‧‧ Signal wire

14‧‧‧屏蔽層 14‧‧‧Shield

16‧‧‧接地線 16‧‧‧Grounding wire

18‧‧‧絕緣外被 18‧‧‧Insulated outer jacket

20‧‧‧內導電膠層 20‧‧‧Inner conductive layer

22‧‧‧外導電膠層 22‧‧‧External conductive adhesive layer

120‧‧‧絕緣內被 120‧‧‧Insulated inner

Claims (20)

一種排線結構,其包括:複數條訊號導線,用來傳輸資料訊號;複數個絕緣內被,每一絕緣內被包覆其中至少之一訊號導線;一屏蔽層,環繞複數個該絕緣內被,用來避免電磁干擾效應;以及一內導電膠層,填充該屏蔽層與複數個該絕緣內被之間。 A cable structure comprising: a plurality of signal wires for transmitting data signals; a plurality of insulating inner layers, each of which is covered with at least one of the signal wires; a shielding layer surrounding a plurality of the insulating inner layers For avoiding electromagnetic interference effects; and an inner conductive adhesive layer filling the shielding layer and a plurality of the insulating inner layers. 如申請專利範圍第1項所述之排線結構,其另包含:一接地線,設置於該屏蔽層的一側,用來傳輸接地電壓;一絕緣外被,包覆該屏蔽層和該接地線;以及一外導電膠層,貼附該接地線與該屏蔽層之間,使該屏蔽層與該接地線電性連接。 The cable structure according to claim 1, further comprising: a grounding wire disposed on one side of the shielding layer for transmitting a ground voltage; an insulating outer covering covering the shielding layer and the grounding And an outer conductive adhesive layer attached between the grounding wire and the shielding layer to electrically connect the shielding layer to the grounding wire. 如申請專利範圍第2項所述之排線結構,其另包含一連接器,該連接器包含一金屬殼體以及複數個端子焊接部,其中複數個該端子焊接部電性連接複數條該訊號導線。 The cable structure of claim 2, further comprising a connector, the connector comprising a metal housing and a plurality of terminal soldering portions, wherein the plurality of terminal soldering portions electrically connect the plurality of the signals wire. 如申請專利範圍第3項所述之排線結構,其另包含一金屬箔,連接該連接器之金屬殼體與該外導電膠層,用來使該連接器之金屬殼體與該外導電膠層電性連接。 The cable structure according to claim 3, further comprising a metal foil, the metal shell connecting the connector and the outer conductive adhesive layer for making the metal shell of the connector and the outer conductive The glue layer is electrically connected. 如申請專利範圍第3項所述之排線結構,其另包含:一附屬導電膠層,貼附於該連接器之金屬殼體;以及一金屬箔,連接該附屬導電膠層與該外導電膠層,用來使該附屬導電膠層與該外導電膠層電性連接。 The cable structure according to claim 3, further comprising: an auxiliary conductive adhesive layer attached to the metal casing of the connector; and a metal foil connecting the auxiliary conductive adhesive layer and the external conductive a glue layer for electrically connecting the auxiliary conductive adhesive layer to the outer conductive adhesive layer. 如申請專利範圍第5項所述之排線結構,其另包含一絕緣層,位於該附屬導電膠層與複數個該訊號導線之間,使該附屬導電膠層與複數個該訊號導線絕緣。 The cable structure of claim 5, further comprising an insulating layer between the auxiliary conductive adhesive layer and the plurality of signal wires to insulate the auxiliary conductive adhesive layer from the plurality of signal wires. 如申請專利範圍第6項所述之排線結構,其中該絕緣層材質為UV膠。 The cable structure according to claim 6, wherein the insulating layer is made of UV glue. 一種排線結構,其包括:複數條訊號導線,用來傳輸資料訊號;複數個絕緣內被,每一絕緣內被包覆其中至少之一訊號導線;一屏蔽層,環繞複數個該絕緣內被,用來避免電磁干擾效應;一接地線,設置於該屏蔽層的一側,用來傳輸接地電壓;一絕緣外被,包覆該屏蔽層和該接地線;以及一外導電膠層,貼附於該絕緣外被與該屏蔽層之間,使該屏蔽層與該接地線電性連接。 A cable structure comprising: a plurality of signal wires for transmitting data signals; a plurality of insulating inner layers, each of which is covered with at least one of the signal wires; a shielding layer surrounding a plurality of the insulating inner layers For avoiding electromagnetic interference effects; a grounding wire is disposed on one side of the shielding layer for transmitting a grounding voltage; an insulating outer covering, covering the shielding layer and the grounding wire; and an outer conductive adhesive layer, pasting Attached between the insulating outer layer and the shielding layer, the shielding layer is electrically connected to the grounding wire. 如申請專利範圍第8項所述之排線結構,其另包含一內導電膠層,貼附於該屏蔽層內。 The cable structure according to claim 8 , further comprising an inner conductive adhesive layer attached to the shielding layer. 如申請專利範圍第8項所述之排線結構,其另包含一連接器,包含一金屬殼體以及複數個端子焊接部,其中複數個該端子焊接部電性連接複數條該訊號導線。 The cable structure of claim 8, further comprising a connector comprising a metal housing and a plurality of terminal soldering portions, wherein the plurality of terminal soldering portions are electrically connected to the plurality of signal wires. 如申請專利範圍第10項所述之排線結構,其另包含一金屬箔,用來電性連接該連接器之金屬殼體與該外導電膠層,使該連接器之金屬殼體與該外導電膠層電性連接。 The cable structure according to claim 10, further comprising a metal foil for electrically connecting the metal shell of the connector and the outer conductive adhesive layer, so that the metal shell of the connector and the outer shell The conductive adhesive layer is electrically connected. 如申請專利範圍第10項所述之排線結構,其另包含:一附屬導電膠層,貼附於該連接器之金屬殼體;以及一金屬箔,用來電性連接該附屬導電膠層與該外導電膠層,使該連接器之金屬殼體與該外導電膠層電性連接。 The cable structure according to claim 10, further comprising: an auxiliary conductive adhesive layer attached to the metal casing of the connector; and a metal foil for electrically connecting the auxiliary conductive adhesive layer with The outer conductive adhesive layer electrically connects the metal shell of the connector to the outer conductive adhesive layer. 如申請專利範圍第12項所述之排線結構,其中另包含絕緣層,位於該附屬導電膠層與複數個該訊號導線之間,使該附屬導電膠層與複數個該訊號導線絕緣。 The cable structure of claim 12, further comprising an insulating layer between the auxiliary conductive adhesive layer and the plurality of signal wires to insulate the auxiliary conductive adhesive layer from the plurality of signal wires. 如申請專利範圍第13項所述之排線結構,其中該絕緣層材質為UV膠。 The cable structure according to claim 13, wherein the insulating layer is made of UV glue. 一種排線結構,其包括:複數條訊號導線,用來傳輸資料訊號;複數個絕緣內被,每一絕緣內被包覆其中至少之一訊號導線;一屏蔽層,環繞複數個該絕緣內被,用來避免電磁干擾效應;一接地線,設置於該屏蔽層的一側,用來傳輸接地電壓;一絕緣外被,包覆該屏蔽層和該接地線;一外導電膠層,貼附於該絕緣外被與該屏蔽層之間,使該屏蔽層與該接地線電性連接;一連接器,包含一金屬殼體以及複數個端子焊接部,複數個該端子焊接部電性連接複數條該訊號導線;以及一金屬箔,用來電性連接該連接器之金屬殼體與該外導電膠層,使該連接器之金屬殼體與該外導電膠層電性連接。 A cable structure comprising: a plurality of signal wires for transmitting data signals; a plurality of insulating inner layers, each of which is covered with at least one of the signal wires; a shielding layer surrounding a plurality of the insulating inner layers Used to avoid the electromagnetic interference effect; a grounding wire is disposed on one side of the shielding layer for transmitting the grounding voltage; an insulating outer covering, covering the shielding layer and the grounding wire; an outer conductive adhesive layer, attached The shielding layer is electrically connected to the grounding line between the insulating outer layer and the shielding layer; a connector comprises a metal shell and a plurality of terminal soldering portions, and the plurality of terminal soldering portions are electrically connected to each other And the metal foil is electrically connected to the metal shell of the connector and the outer conductive adhesive layer, so that the metal shell of the connector is electrically connected to the outer conductive adhesive layer. 如申請專利範圍第15項所述之排線結構,其另包含一內導電膠層,貼附於該屏蔽層內。 The cable structure according to claim 15, further comprising an inner conductive adhesive layer attached to the shielding layer. 如申請專利範圍第15項所述之排線結構,其另包含一附屬導電膠層,貼附於該連接器之金屬殼,使該附屬導電膠層與該外導電膠層電性連接。 The cable structure of claim 15 further comprising an auxiliary conductive adhesive layer attached to the metal shell of the connector to electrically connect the auxiliary conductive adhesive layer to the outer conductive adhesive layer. 如申請專利範圍第17項所述之排線結構,其中另包含絕緣層,位於該附屬導電膠層與複數個該訊號導線之間,使該附屬導電膠層與複數個該訊號導線絕緣。 The cable structure of claim 17, wherein the insulating layer is disposed between the auxiliary conductive layer and the plurality of signal wires to insulate the auxiliary conductive layer from the plurality of signal wires. 如申請專利範圍第18項所述之排線結構,其中該絕緣層材質為UV膠。 The cable structure according to claim 18, wherein the insulating layer is made of UV glue. 如申請專利範圍第15項所述之排線結構,其另包含一電路板與複數個該端子焊接部連接,用來處理複數條該訊號導線傳輸之資料訊號。 The cable structure of claim 15, further comprising a circuit board connected to the plurality of terminal soldering portions for processing a plurality of data signals transmitted by the signal wires.
TW106202453U 2017-02-20 2017-02-20 Flat cable structure TWM546039U (en)

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