CN206743753U - Electronic product radiating structure and electronic product - Google Patents
Electronic product radiating structure and electronic product Download PDFInfo
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- CN206743753U CN206743753U CN201720489800.3U CN201720489800U CN206743753U CN 206743753 U CN206743753 U CN 206743753U CN 201720489800 U CN201720489800 U CN 201720489800U CN 206743753 U CN206743753 U CN 206743753U
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- heat
- electronic product
- conducting base
- heater members
- spring leaf
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Abstract
It the utility model is related to a kind of electronic product radiating structure and electronic product, the electronic product radiating structure includes printed circuit board (PCB), metal shell, radiate spring leaf and heat-conducting base, the printed circuit board (PCB) is arranged in the metal shell, the top of the heat-conducting base is fixed on the printed circuit board, the bottom of the heat-conducting base is connected on the metal shell, heater members are provided with the printed circuit board (PCB), the top surface of the heater members is provided with thermal insulation layer, one end of the radiating spring leaf is fixed on the top of the heat-conducting base, it is pressed on the thermal insulation layer constantly to apply compression elastic force to the heater members other end elastically deformable of the radiating spring leaf, the heat of the heater members is transferred to the metal shell via the radiating spring leaf and heat-conducting base.The electronic product radiating structure of the utility model embodiment, can avoid coming off for thermal insulation layer, improve the anti-seismic performance of electronic product.
Description
Technical field
The utility model belongs to electronic product radiating technical field, more particularly to a kind of electronic product radiating structure and electricity
Sub- product.
Background technology
At present, conventional electronic product radiating structure, including component, metal shell and heat conduction on printed circuit board (PCB), plate
Insulating materials, component part is heater members on plate.Metal shell covers printed circuit board (PCB), defines a printed circuit board (PCB)
Accommodation space, heat-conducting insulation material is arranged between heater members and metal shell, connection the two.In such radiator structure,
The insulating properties of heat-conducting insulation material can completely cut off heater members and metal shell in terms of electrical resistance, avoid short circuit and outside
Electrostatic impact, while the thermal conductivity of heat-conducting insulation material can make to form effective heat between heater members and metal shell it is logical
Road, by squeezing the air between heater members and metal-back, the heat in heater members can be more easily by heat conductive insulating material
Material enters metal shell, and finally the external loss heat of the surface area using metal shell in itself, obtains good radiating effect.
But in process of the present invention is realized, it is as follows that inventor has found that existing electronic product radiating structure is at least present
Problem：The radiator structure of this form has significant limitation under the circuit structure of complexity, when multiple on printed circuit board (PCB)
Heater members height for the moment, because the surface of multiple heater members and metal shell face is smooth, does not cause multiple heatings
Device is different from a distance from metal shell, and the requirement for the thickness precision of each piece of heat-conducting insulation material uprises, each
Block heat-conducting insulation material is excessively thin or blocked up all the heat dispersion of itself or other heat-conducting insulation materials can be had an impact.Together
When, some electronic products (such as automobile electronics) require higher to the anti-seismic performance of product, if polylith heat conductive insulating material
Size between material is uncoordinated, it is easy to falls off.
Utility model content
Technical problem to be solved in the utility model is：Led for polylith existing for existing electronic product radiating structure
Size between heat insulator is uncoordinated, it is easy to falls off, can not meet the problem of anti-seismic performance requires, there is provided be a kind of
Electronic product radiating structure and electronic product.
In order to solve the above technical problems, on the one hand, the utility model embodiment provides a kind of electronic product radiating structure, bag
Include printed circuit board (PCB), metal shell, radiating spring leaf and heat-conducting base, the printed circuit board (PCB) and be arranged on the metal shell
In, the top of the heat-conducting base is fixed on the printed circuit board, and the bottom of the heat-conducting base is connected to the metal
On shell, heater members are provided with the printed circuit board (PCB), the top surface of the heater members is provided with thermal insulation layer, described
One end of radiating spring leaf is fixed on the top of the heat-conducting base, presses the other end elastically deformable of the radiating spring leaf
Tightly so that the heater members are constantly applied with compression elastic force on the thermal insulation layer, the heats of the heater members via
The radiating spring leaf and heat-conducting base are transferred to the metal shell.
Alternatively, the radiating spring leaf includes connection sheet, compressing piece and is connected between the connection sheet and compressing piece
Arch piece, the connection sheet is fixed on the top of the heat-conducting base, is pressed on described the compressing piece elastically deformable
Constantly to apply compression elastic force to the heater members on thermal insulation layer.
Alternatively, the projected direction of the arch piece and the compressing piece are applied to the compression elastic force of the heater members
In the opposite direction.
Alternatively, the part that the connection sheet contacts with heat-conducting base is formed as contact chip, and the width of the contact chip is big
Width in the part being located in the connection sheet beyond the contact chip, the both ends of the contact chip width pass through respectively
Screw is fixed on the top of the heat-conducting base.
Alternatively, put down on the metal shell with the surface that the bottom of the heat-conducting base contacts and the printed circuit board (PCB)
OK, the heat-conducting base is perpendicular to the printed circuit board (PCB).
Alternatively, the thermal insulation layer is coated on the top surface of the heater members.
Alternatively, the heater members are chip or IGBT module.
Alternatively, the heat-conducting base is metal cartridge.
Alternatively, the radiating spring leaf is metallic spring.
According to the electronic product radiating structure of the utility model embodiment, the one end for the spring leaf that radiates is fixed on heat-conducting base
Top, be pressed on thermal insulation layer constantly to apply to heater members the other end elastically deformable for the spring leaf that radiates
Elastic force is compressed, the heat of heater members is transferred to metal shell via radiating spring leaf and heat-conducting base.So, the bullet that radiates is passed through
Reed, can be external by the surface area of metal shell in itself efficiently by heat transfer caused by heater members to metal shell
Loss heat, and less temperature difference is produced between heater members and metal shell, effectively reduce the loss to temperature budget.
In addition, the other end of radiating spring leaf constantly applies compression elastic force to heater members so that in the situation of electronic product vibration
Under, radiating spring leaf remains good contact with thermal insulation layer, and radiating spring leaf compresses thermal insulation layer and hair all the time
Thermal device, coming off for thermal insulation layer is avoided, improve the anti-seismic performance of electronic product.
On the other hand, the utility model embodiment provides a kind of electronic product, and it includes above-mentioned electronic product radiating knot
Structure.
Brief description of the drawings
Fig. 1 is the side view for the electronic product radiating structure that the embodiment of the utility model one provides；
Fig. 2 is the top view for the electronic product radiating structure that the embodiment of the utility model one provides.
Reference in Figure of description is as follows：
1st, printed circuit board (PCB)；
2nd, metal shell；
3rd, radiate spring leaf；31st, connection sheet；311st, contact chip；32nd, compressing piece；33rd, arch piece；
4th, heat-conducting base；
5th, heater members；
6th, thermal insulation layer；
7th, screw.
Embodiment
In order that technical problem, technical scheme and beneficial effect that the utility model solves are more clearly understood, below
With reference to drawings and Examples, the utility model is described in further detail.It is it should be appreciated that described herein specific real
Example is applied only to explain the utility model, is not used to limit the utility model.
As shown in Figures 1 and 2, the electronic product radiating structure that the embodiment of the utility model one provides, including printed circuit
Plate 1, metal shell 2, radiating spring leaf 3 and heat-conducting base 4, the printed circuit board (PCB) 1 are arranged in the metal shell 2, institute
The top for stating heat-conducting base 4 is fixed on the printed circuit board (PCB) 1.The bottom of the heat-conducting base 4 is connected to outside the metal
On shell 2, heater members 5 are provided with the printed circuit board (PCB) 1, the top surface of the heater members 5 is provided with thermal insulation layer 6,
One end of the radiating spring leaf 3 is fixed on the top of the heat-conducting base 4, and the other end of the radiating spring leaf 3 can elasticity
Deformation it is pressed on the thermal insulation layer 6 and compresses elastic force, the heater members constantly to apply to the heater members 5
5 heat is transferred to the metal shell 2 via the radiating spring leaf 3 and heat-conducting base 4.
In the present embodiment, the heater members 5 are chip or IGBT module etc..Generally, the top surface of heater members 5 is smooth
Surface.
In the present embodiment, heat conductive silicon grease material can be selected in the thermal insulation layer 6, and thermal insulation layer 6 is coated on the hair
The top surface of thermal device 5.
In the present embodiment, the heat-conducting base 4 is metal cartridge.However, in other embodiments, it can also use other
It can be replaced with the column of heat conduction.
In the present embodiment, the radiating spring leaf 3 is metallic spring.However, in other embodiments, it can also use
It is other to be substituted with the nonmetallic shell fragment of heat conduction.
In the embodiment of the utility model one, as shown in figure 1, the radiating spring leaf 3 includes connection sheet 31, compressing piece 32
And the arch piece 33 between the connection sheet 31 and compressing piece 32 is connected to, the connection sheet 31 is fixed on the heat-conducting base 4
Top, be pressed on the thermal insulation layer 6 elastically deformable of compressing piece 32 with to the heater members 5 constantly
Apply and compress elastic force.
In the embodiment of the utility model one, as shown in figure 1, the projected direction of the arch piece 33 and the compressing piece 32
It is applied to the in opposite direction of the compression elastic force of the heater members 5.So that in the generation elastic deformation of compressing piece 32 and to the hair
When thermal device 5 constantly applies compression elastic force, the arch piece 33 provides the deformation space of compressing piece 32.
In the embodiment of the utility model one, as shown in Fig. 2 the part shape that the connection sheet 31 contacts with heat-conducting base 4
As contact chip 311, the width of the contact chip 311 is more than the portion being located in the connection sheet 31 beyond the contact chip 311
The width divided, so, the area of contact chip 311 and the tip contact of heat-conducting base 4 is larger, reduces contact chip 311 and heat conduction
Thermal resistance between base 4.
In the embodiment of the utility model one, as shown in Fig. 2 the both ends of the width of the contact chip 311 pass through respectively
Screw 7 is fixed on the top of the heat-conducting base 4, to realize that radiating spring leaf 3 is fixed on the top of heat-conducting base 4.Use two
Radiating spring leaf 3 is fixed for screw 7, and the spring leaf 3 that can effectively prevent from radiating shifts in vibration so that
In the case that electronic product vibrates, radiating spring leaf 3 remains good contact with thermal insulation layer 6.
In the embodiment of the utility model one, as shown in figure 1, the bottom on the metal shell 2 with the heat-conducting base 4
The surface of contact is parallel with the printed circuit board (PCB) 1, and the heat-conducting base 4 is perpendicular to the printed circuit board (PCB) 1.
, can be efficiently by hair by the spring leaf 3 that radiates according to the electronic product radiating structure of the utility model embodiment
Heat transfer caused by thermal device 5 is to metal shell 2, by the external loss heat of the surface area of metal shell 2 itself, and heating element
Less temperature difference is produced between part 5 and metal shell 2, effectively reduces the loss to temperature budget.In addition, radiating spring leaf
3 other end constantly applies to heater members 5 compresses elastic force so that in the case where electronic product vibrates, radiate spring leaf 3
Good contact is kept with thermal insulation layer 6, radiating spring leaf 3 compresses thermal insulation layer 6 and heater members 5, avoided absolutely all the time
Edge heat-conducting layer 6 comes off, and improves the anti-seismic performance of electronic product.
On the other hand, the embodiment of the utility model one provides a kind of electronic product, and it includes the electronics production of above-described embodiment
Product radiator structure.
The electronic product of the present embodiment, can be automobile electronics.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (10)
1. a kind of electronic product radiating structure, it is characterised in that including printed circuit board (PCB), metal shell, radiating spring leaf and lead
Hot base, the printed circuit board (PCB) are arranged in the metal shell, and the top of the heat-conducting base is fixed on the printing electricity
On the plate of road, the bottom of the heat-conducting base is connected on the metal shell, and heater members are provided with the printed circuit board (PCB),
The top surface of the heater members is provided with thermal insulation layer, and one end of the radiating spring leaf is fixed on the top of the heat-conducting base
End, it is pressed on the thermal insulation layer to be held to the heater members other end elastically deformable of the radiating spring leaf
Apply compression elastic force continuously, the heat of the heater members is transferred to the metal via the radiating spring leaf and heat-conducting base
Shell.
2. electronic product radiating structure according to claim 1, it is characterised in that the radiating spring leaf includes connection
Piece, compressing piece and the arch piece being connected between the connection sheet and compressing piece, the connection sheet are fixed on the heat-conducting base
Top, be pressed on the thermal insulation layer constantly to apply to the heater members compressing piece elastically deformable
Compress elastic force.
3. electronic product radiating structure according to claim 2, it is characterised in that the projected direction of the arch piece and institute
State compressing piece be applied to the heater members compression elastic force it is in opposite direction.
4. electronic product radiating structure according to claim 2, it is characterised in that the connection sheet contacts with heat-conducting base
Part be formed as contact chip, the width of the contact chip is more than the part being located in the connection sheet beyond the contact chip
Width, the both ends of the contact chip width are screwed in the top of the heat-conducting base respectively.
5. electronic product radiating structure according to claim 1, it is characterised in that on the metal shell with the heat conduction
The surface of the bottom contact of base is parallel with the printed circuit board (PCB), and the heat-conducting base is perpendicular to the printed circuit board (PCB).
6. electronic product radiating structure according to claim 1, it is characterised in that the thermal insulation layer is coated on described
The top surface of heater members.
7. electronic product radiating structure according to claim 1, it is characterised in that the heater members are chip or IGBT
Module.
8. electronic product radiating structure according to claim 1, it is characterised in that the heat-conducting base is metal cartridge.
9. electronic product radiating structure according to claim 1, it is characterised in that the radiating spring leaf is metal spring
Piece.
10. a kind of electronic product, it is characterised in that including the electronic product radiating structure described in claim 1-9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720489800.3U CN206743753U (en) | 2017-04-28 | 2017-04-28 | Electronic product radiating structure and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720489800.3U CN206743753U (en) | 2017-04-28 | 2017-04-28 | Electronic product radiating structure and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206743753U true CN206743753U (en) | 2017-12-12 |
Family
ID=60563882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720489800.3U Active CN206743753U (en) | 2017-04-28 | 2017-04-28 | Electronic product radiating structure and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206743753U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111867344A (en) * | 2019-04-30 | 2020-10-30 | 安波福技术有限公司 | Radar unit with heat transfer via radome |
-
2017
- 2017-04-28 CN CN201720489800.3U patent/CN206743753U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111867344A (en) * | 2019-04-30 | 2020-10-30 | 安波福技术有限公司 | Radar unit with heat transfer via radome |
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