CN203120368U - Cooling device for electronic device - Google Patents
Cooling device for electronic device Download PDFInfo
- Publication number
- CN203120368U CN203120368U CN 201320109967 CN201320109967U CN203120368U CN 203120368 U CN203120368 U CN 203120368U CN 201320109967 CN201320109967 CN 201320109967 CN 201320109967 U CN201320109967 U CN 201320109967U CN 203120368 U CN203120368 U CN 203120368U
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- CN
- China
- Prior art keywords
- heat
- heater members
- electronic equipment
- conducting strip
- metal shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a cooling device for an electronic device. The cooling device for the electronic device is characterized by comprising a metal outer shell (10) and at least one heat conducting piece (20). At least one protruding portion (11) is arranged on the inner surface of the metal outer shell (10). The metal outer shell (10) covers at least one heat emitting component arranged on the electronic device. The protruding portion (11) is aligned to the at least one heat emitting component. The heat conducting piece (20) is filled between the outer surface of the at least one heat emitting component and the protruding portion (11). According to the cooling device for the electronic device, the temperature of the heat emitting component is reduced, meanwhile the temperature inside a chassis is effectively reduced, and noise is avoided through heat conducting connection of the cooling device for the electronic device; soft heat conducting materials are adopted by the cooling device for the electronic device so that the vibration resistant performance of the cooling device for the electronic device can be further enhanced and the service life of the cooling device for the electronic device can be prolonged; and the cooling device for the electronic device is convenient to produce and easy to assemble.
Description
Technical field
The utility model relates to the heat dissipation technology field, relates in particular to a kind of heat abstractor for electronic equipment.
Background technology
Heat abstractor such as fin, fan is widely used in the electronic equipment.But existing fin and fan exist extensively that volume own is big, complex structure and be not easy to the heat that electronic equipment internal produces such as is discharged outside the electronic equipment chassis rapidly at shortcoming.In addition, existing fin is installed inconvenience, can't reduce the machine intimate temperature, and easy disassembling breaks, and fan has noise, and very big to the influence of audio frequency HIFI product, this all can cause the heat dispersion of electronic equipment to affect adversely.
The utility model content
The technical problems to be solved in the utility model is, at above-mentioned defective of the prior art, provide a kind of simple in structure, heat radiation is convenient and possess the anti-heat abstractor that hits function of seismic resistance.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of heat abstractor for electronic equipment, it is characterized in that, described heat abstractor comprises metal shell and at least one heat-conducting piece, and described metal shell inner surface is provided with at least one lug boss; Described metal shell covers at least one heater members of electronic equipment, and described lug boss is aimed at described at least one heater members, and described heat-conducting piece is filled between the outer surface and described lug boss of described at least one heater members.
Preferably, described heat-conducting piece comprises conducting strip and the circuit board of mutual applying, described conducting strip contacts with described lug boss, and described circuit board contacts with the outer surface of described heater members, is used for that the heat that described heater members sends is transmitted to described metal shell and dispels the heat.
Preferably, described heat-conducting piece comprises conducting strip, described conducting strip respectively with the outer surface of described heater members and contacting of described lug boss, be used for that the heat that described heater members sends is transmitted to described metal shell and dispel the heat.
Preferably, described conducting strip is rubber-like.
Preferably, described conducting strip be the thermal conductive silicon film, through the heat conduction silicon sheet after softening and the insulation processing or through the heat conduction indium sheet after softening and the insulation processing.
Preferably, the thickness of described conducting strip is 2-6mm.
Preferably, the spacing between the outer surface of described heater members and the described lug boss is 2-5mm.
Implement heat abstractor of the present utility model, the heat that heater members produces can be transmitted to the external world rapidly by metal shell by the lug boss on the metal shell and heat-conducting piece, simple in structure and easy to use; The conducting strip of heat-conducting piece has elasticity, can the protective circuit plate and heater members avoid the infringement of extraneous collision and vibration, can further strengthen the anti-seismic performance of electronic equipment.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the overall structure schematic diagram of first embodiment of heat abstractor of the present utility model;
Fig. 2 is the structural representation of metal shell of first embodiment of heat abstractor of the present utility model;
Fig. 3 is the overall structure schematic diagram of second embodiment of heat abstractor of the present utility model.
Embodiment
Heat abstractor of the present utility model is applicable in the electronic equipment that comprises high power integrated ciruit chip or high power battery etc., its basic technical scheme is, heat abstractor comprises metal shell and heat-conducting piece, metal shell covers on the heater members of electronic equipment, the metal shell inner surface is provided with the lug boss towards heater members, to dwindle the relative distance between localized metallic shell and heater members, heat-conducting piece is filled between the outer surface and lug boss of heater members, this heat-conducting piece is Heat Conduction Material, to accelerate that the heat that heater members produces is transmitted to the electronic device outside.
In embodiment of the present utility model, preferred default spacing between the outer surface of heater members and the convex surface of lug boss is 2-5mm, heat-conducting piece can be an independent conducting strip, it also can be the combination of a conducting strip and circuit board, wherein conducting strip can be by the thermal conductive silicon film, make through the heat conduction silicon sheet after softening and the insulation processing or through the soft Heat Conduction Materials such as heat conduction indium sheet after softening and the insulation processing, for example, soft silica gel conducting strip, can reduce cost, reach better heat radiating effect.Soft silica gel conducting strip has good heat conduction and insulation property, good flexibility, and heat conduction, insulation, shockproof, the effect of filling up tolerance between various devices are played in high resilience, and the preferred thickness of conducting strip is 2-6mm.
Fig. 1 is the cross-sectional view of first embodiment of heat abstractor of the present utility model, and as shown in the figure, heat abstractor 100 of the present utility model comprises metal shell 10 and heat-conducting piece 20.This metal shell 10 can be the shell that arranges separately, also can be the part of the existing shell of electronic equipment, and its concrete structure as shown in Figure 2.This metal shell 10 is installed in heater members 40 outsides of electronic equipment, and its shape and size can change according to concrete needs, in order to be covered with one or more heater members 40.The heater members of mentioning in the utility model 40 mainly refers to existing various integrated circuit (IC) chip in the electronic equipment, and they can produce a large amount of heats when work.The inner surface of metal shell 10 is provided with one or more lug bosses 11 towards one or more positions of described heater members 40.This lug boss 11 is mainly used in shortening the distance between heater members 40 and the metal shell 10, to improve heat transfer efficiency.
Described heat-conducting piece 20 is filled between the convex surface of the outer surface of heater members 40 and lug boss 11, comprises conducting strip 21 and the circuit board 22 of mutual applying.Wherein conducting strip 21 contacts with the convex surface of lug boss 11, and circuit board 22 contacts with the outer surface of heater members 40, thereby is used for the 10 conduction heats from heater members 40 to metal shell.Conducting strip 21 in the present embodiment adopts the manufacturing of rubber-like Heat Conduction Material, it can be the thermal conductive silicon film, through the heat conduction silicon sheet after softening and the insulation processing or through the heat conduction indium sheet after softening and the insulation processing etc., have good heat transfer performance and buffering shockproof properties concurrently.
In other embodiments, if metal shell 10 inside comprise when a plurality of heater members 40 or this heater members 40 need the multiaspect heat radiation, then can at metal shell 10 a plurality of lug bosses 11 towards heater members 40 be set accordingly, correspondence arranges a plurality of heat-conducting pieces 20, this heat-conducting piece 20 is filled between the convex surface of the heating face of heater members 40 and respective bump portion 11, via the lug boss 11 on the metal shell 10 heat that heater members 40 produces is transmitted to the external world rapidly.Simultaneously, described conducting strip 20 has the buffering antihunt action.
In the above-described embodiments, circuit board 22 can be existing circuit board in the electronic equipment, and it is installed between conducting strip 21 and the heater members 40, not only can play to conduct heat and antihunt action, and be conducive to reduce the overall volume of electronic equipment.In other embodiments, circuit board 22 also can be installed in other positions in the electronic equipment.For example, Fig. 3 is the second embodiment cross-sectional view of heat abstractor of the present utility model, as shown in the figure, heat abstractor 200 of the present utility model comprise above-mentioned metal shell 10 and be filled in the outer surface of heater members 40 and the convex surface of lug boss 11 between heat-conducting piece 20, this heat-conducting piece 20 is an independent conducting strip 21a, and its thickness range and material ranges are all identical with above-mentioned conducting strip 21.This heat-conducting piece 20 contacts with the outer surface of the convex surface of lug boss 11 and heater members 40 respectively and is transmitted to metal shell 10 with the heat with heater members 40 and sheds, and plays antihunt action; And circuit board 22 is arranged at heater members 40 side of described heat-conducting piece 20 and described metal shell 10 dorsad.
The above is preferred embodiment of the present utility model only, is not limited to the utility model, and for a person skilled in the art, the utility model can have various changes and variation.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., all should be included within the claim scope of the present utility model.
Claims (7)
1. a heat abstractor that is used for electronic equipment is characterized in that described heat abstractor comprises metal shell (10) and at least one heat-conducting piece (20), and described metal shell (10) inner surface is provided with at least one lug boss (11); Described metal shell (10) covers at least one heater members of electronic equipment, described lug boss (11) is aimed at described at least one heater members, and described heat-conducting piece (20) is filled between the outer surface and described lug boss (11) of described at least one heater members.
2. the heat abstractor for electronic equipment according to claim 1, it is characterized in that, described heat-conducting piece (20) comprises the conducting strip (21) and circuit board (22) of mutual applying, described conducting strip (21) contacts with described lug boss (11), described circuit board (22) contacts with the outer surface of described heater members, is used for that the heat that described heater members sends is transmitted to described metal shell (10) and dispels the heat.
3. the heat abstractor for electronic equipment according to claim 1, it is characterized in that, described heat-conducting piece (20) comprises conducting strip (21), described conducting strip (21) respectively with the outer surface of described heater members and contacting of described lug boss (11), be used for that the heat that described heater members sends is transmitted to described metal shell (10) and dispel the heat.
4. according to claim 2 or 3 described heat abstractors for electronic equipment, it is characterized in that described conducting strip (21) is rubber-like.
5. the heat abstractor for electronic equipment according to claim 4 is characterized in that, described conducting strip (21) is the thermal conductive silicon film, through the heat conduction silicon sheet after softening and the insulation processing or through the heat conduction indium sheet after softening and the insulation processing.
6. according to claim 2 or 3 described heat abstractors for electronic equipment, it is characterized in that the thickness of described conducting strip (21) is 2-6mm.
7. the heat abstractor for electronic equipment according to claim 1 is characterized in that, the spacing between the outer surface of described heater members and the described lug boss (11) is 2-5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320109967 CN203120368U (en) | 2013-03-11 | 2013-03-11 | Cooling device for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320109967 CN203120368U (en) | 2013-03-11 | 2013-03-11 | Cooling device for electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203120368U true CN203120368U (en) | 2013-08-07 |
Family
ID=48900672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320109967 Expired - Lifetime CN203120368U (en) | 2013-03-11 | 2013-03-11 | Cooling device for electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203120368U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106686880A (en) * | 2016-12-30 | 2017-05-17 | 株洲中车时代电气股份有限公司 | Onboard electronic part device for rail transit |
| WO2018053871A1 (en) * | 2016-09-26 | 2018-03-29 | 深圳市大疆创新科技有限公司 | Heat dissipation mechanism, electronic governor provided with heat dissipation mechanism, and electronic device |
| CN110022668A (en) * | 2019-05-27 | 2019-07-16 | 重庆力华自动化技术有限责任公司 | A kind of power-type electronic product with multi-panel heat sinking function |
| CN111508536A (en) * | 2019-01-30 | 2020-08-07 | 株式会社东芝 | Disk device |
| CN112218049A (en) * | 2020-09-29 | 2021-01-12 | 北京环境特性研究所 | Video monitoring device |
-
2013
- 2013-03-11 CN CN 201320109967 patent/CN203120368U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018053871A1 (en) * | 2016-09-26 | 2018-03-29 | 深圳市大疆创新科技有限公司 | Heat dissipation mechanism, electronic governor provided with heat dissipation mechanism, and electronic device |
| CN106686880A (en) * | 2016-12-30 | 2017-05-17 | 株洲中车时代电气股份有限公司 | Onboard electronic part device for rail transit |
| CN111508536A (en) * | 2019-01-30 | 2020-08-07 | 株式会社东芝 | Disk device |
| CN110022668A (en) * | 2019-05-27 | 2019-07-16 | 重庆力华自动化技术有限责任公司 | A kind of power-type electronic product with multi-panel heat sinking function |
| CN112218049A (en) * | 2020-09-29 | 2021-01-12 | 北京环境特性研究所 | Video monitoring device |
| CN112218049B (en) * | 2020-09-29 | 2022-10-11 | 北京环境特性研究所 | Video monitoring device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130807 |