CN203968555U - Strengthen heat conductive silica gel pad - Google Patents
Strengthen heat conductive silica gel pad Download PDFInfo
- Publication number
- CN203968555U CN203968555U CN201420300564.2U CN201420300564U CN203968555U CN 203968555 U CN203968555 U CN 203968555U CN 201420300564 U CN201420300564 U CN 201420300564U CN 203968555 U CN203968555 U CN 203968555U
- Authority
- CN
- China
- Prior art keywords
- silica gel
- conductive silica
- heat conductive
- gel pad
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a kind of heat conductive silica gel pad of strengthening, and comprises at least two-layer heat-conducting layer, is provided with a PI reinforced layer between described adjacent heat-conducting layer; The thickness of described pad is 0.1～0.3mm; Described pad is circular or square.After having adopted above-mentioned reinforcement heat conductive silica gel pad, there is good stretch-proof performance, be highly resistant to the heat conductive silica gel pad deformation causing because of external force, do not make heat conductive silica gel pad lose efficacy, can play good infilling, reduce Surface Contact thermal resistance, improve heat-conducting effect, the temperature that can effectively reduce electronic devices and components, improves its reliability and useful life; It can effectively reduce the damage of external vibrations to electronic devices and components, has improved the security performance of electronic devices and components.
Description
Technical field
The utility model relates to electronic devices and components heat conduction technical field, especially relates to a kind of heat conductive silica gel pad of strengthening.
Background technology
Along with industrial production and scientific and technical development, people constantly propose new requirement to material.In field of electronics, due to developing rapidly of integrated technology and packaging technology, electronic component, logical circuit are to light, thin, little future development, caloric value also increases thereupon, thereby need the insulating material of high heat conduction, effectively remove the heat that electronic equipment produces, this is related to the useful life of product and the reliability of quality.
Conventional cooling means had in the past: naturally cooling, ventilate or use larger casing.Along with heating region is more and more wider, the heat of generation is also increasing, forces electronic equipment manufacturer to have to take more efficiently cooling measure.Heat conductive silica gel pad is exactly the most frequently used a kind of auxiliary heat dissipation material.
Heat conductive silica gel pad extensively as sealant for electronic product, therefore to heat conductive silica gel pad except heat conduction requires, also need heat conductive silica gel pad to there is good mechanical strength.And the mechanical strength of large logarithm heat conductive silica gel pad is poor.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of reinforcement heat conductive silica gel pad with higher mechanical strength.
The technical scheme in the invention for solving the technical problem is: a kind of heat conductive silica gel pad of strengthening, comprise at least two-layer heat-conducting layer, and between described adjacent heat-conducting layer, be provided with a PI reinforced layer.
Further concrete, the thickness of described pad is 0.1～0.3mm.
Further concrete, described pad is circular or square.
The beneficial effects of the utility model are: after having adopted above-mentioned reinforcement heat conductive silica gel pad, there is good stretch-proof performance, be highly resistant to the heat conductive silica gel pad deformation causing because of external force, do not make heat conductive silica gel pad lose efficacy, can play good infilling, reduce Surface Contact thermal resistance, improve heat-conducting effect, the temperature that can effectively reduce electronic devices and components, improves its reliability and useful life; It can effectively reduce the damage of external vibrations to electronic devices and components, has improved the security performance of electronic devices and components.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
1,3, heat-conducting layer in figure:; 2, PI reinforced layer.
Embodiment
Below in conjunction with accompanying drawing, the utility model is explained in detail.
A kind of heat conductive silica gel pad of strengthening, comprises at least two-layer heat-conducting layer 1,3 as shown in Figure 1, is provided with a PI reinforced layer 2 between described adjacent heat-conducting layer 1,3; The thickness of described pad is 0.1～0.3mm; Described pad is circular or square, can be made into as required other shape, oval etc.
It has good stretch-proof performance when in use, be highly resistant to the heat conductive silica gel pad deformation causing because of external force, do not make heat conductive silica gel pad lose efficacy, can play good infilling, reduce Surface Contact thermal resistance, improve heat-conducting effect, can effectively reduce the temperature of electronic devices and components, improve its reliability and useful life; It can effectively reduce the damage of external vibrations to electronic devices and components, has improved the security performance of electronic devices and components.
It is emphasized that: be only preferred embodiment of the present utility model above, not the utility model is done to any pro forma restriction, any simple modification, equivalent variations and modification that every foundation technical spirit of the present utility model is done above embodiment, all still belong in the scope of technical solutions of the utility model.
Claims (3)
1. strengthen a heat conductive silica gel pad, it is characterized in that, comprise at least two-layer heat-conducting layer (1,3), between described adjacent heat-conducting layer (1,3), be provided with a PI reinforced layer (2).
2. reinforcement heat conductive silica gel pad according to claim 1, is characterized in that, the thickness of described pad is 0.1～0.3mm.
3. reinforcement heat conductive silica gel pad according to claim 1, is characterized in that, described pad is circular or square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420300564.2U CN203968555U (en) | 2014-06-09 | 2014-06-09 | Strengthen heat conductive silica gel pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420300564.2U CN203968555U (en) | 2014-06-09 | 2014-06-09 | Strengthen heat conductive silica gel pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203968555U true CN203968555U (en) | 2014-11-26 |
Family
ID=51929088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420300564.2U Expired - Fee Related CN203968555U (en) | 2014-06-09 | 2014-06-09 | Strengthen heat conductive silica gel pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203968555U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107353432A (en) * | 2017-08-07 | 2017-11-17 | 苏州佰旻电子材料科技有限公司 | A kind of compound polyimide film heat conductive silica gel pad |
-
2014
- 2014-06-09 CN CN201420300564.2U patent/CN203968555U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107353432A (en) * | 2017-08-07 | 2017-11-17 | 苏州佰旻电子材料科技有限公司 | A kind of compound polyimide film heat conductive silica gel pad |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhao Zhongxiang Inventor before: Wang Yanfen |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170915 Address after: 523570, D building, litchi garden village, Lu Village, Changping Town, Dongguan, Guangdong Patentee after: Dongguan Huayue heat conduction technology Co., Ltd. Address before: Suzhou City, Jiangsu province 215300 Kunshan Development Zone No. 25 king Xiulu Patentee before: Easy access Tiancheng new material technology (Suzhou) Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141126 Termination date: 20200609 |