CN204104280U - The heat-conducting silica gel sheet of high strength - Google Patents
The heat-conducting silica gel sheet of high strength Download PDFInfo
- Publication number
- CN204104280U CN204104280U CN201420523320.0U CN201420523320U CN204104280U CN 204104280 U CN204104280 U CN 204104280U CN 201420523320 U CN201420523320 U CN 201420523320U CN 204104280 U CN204104280 U CN 204104280U
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- Prior art keywords
- silica gel
- heat
- layer
- conducting
- high strength
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- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a kind of heat-conducting silica gel sheet of high strength, comprise silica gel heat-conducting layer, described silica gel heat-conducting layer is two-layer, in the middle of two-layer described silica gel heat-conducting layer, be provided with a netted fiberglass layer, and it is an entirety that two-layer described silica gel heat-conducting layer connects through mesh.After have employed said structure, there is good stretch-proof performance, be highly resistant to the heat conductive silica gel pad deformation caused because of external force, heat conductive silica gel pad is not made to lose efficacy, good infilling can be played, reduce surface contact thermal resistance, improve heat-conducting effect, effectively can also reduce the temperature of electronic devices and components, improve its reliability and useful life; It effectively can reduce the damage of external vibrations to electronic devices and components, improves the security performance of electronic devices and components.
Description
Technical field
The utility model relates to the heat dissipation technology of electronic devices and components, especially relates to a kind of heat-conducting silica gel sheet of high strength.
Background technology
Along with industrial production and scientific and technical development, people constantly propose new requirement to material.In field of electronics, due to developing rapidly of integrated technology and packaging technology, electronic component, logical circuit are to light, thin, little future development, caloric value also increases thereupon, thus need the insulating material of high heat conduction, the heat that effective removal electronic equipment produces, this is related to the useful life of product and the reliability of quality.
Cooling means conventional in the past has: naturally cool, ventilate or use larger casing.Along with heating region is more and more wider, the heat of generation is also increasing, forces electronic equipment manufacturer to have to take more efficiently cooling measure.Heat conductive silica gel pad is exactly the most frequently used a kind of auxiliary heat dissipation material.
Heat conductive silica gel pad is widely used as sealant in electronic product, therefore to heat conductive silica gel pad except heat transfer require except, also need heat conductive silica gel pad to have good mechanical strength.And the mechanical strength of most of heat conductive silica gel pad is poor.
Summary of the invention
Technical problem to be solved in the utility model is to provide the heat-conducting silica gel sheet of the high high strength of a kind of mechanical strength.
The technical scheme in the invention for solving the technical problem is: a kind of heat-conducting silica gel sheet of high strength, comprise silica gel heat-conducting layer, it is characterized in that, described silica gel heat-conducting layer is two-layer, in the middle of two-layer described silica gel heat-conducting layer, be provided with a netted fiberglass layer, it is an entirety that two-layer described silica gel heat-conducting layer connects through mesh.
Concrete further, the thickness of described netted fiberglass layer is at 0.04mm ~ 0.08mm.
Concrete further, described silica gel heat-conducting layer is provided with diaphragm.
Concrete further, the mesh equal and opposite in direction of described netted fiberglass layer.
Concrete further, described mesh is 0.4mm × 0.4mm.
The beneficial effects of the utility model are: after have employed said structure, there is good stretch-proof performance, be highly resistant to the heat conductive silica gel pad deformation caused because of external force, heat conductive silica gel pad is not made to lose efficacy, good infilling can be played, reduce surface contact thermal resistance, improve heat-conducting effect, effectively can also reduce the temperature of electronic devices and components, improve its reliability and useful life; It effectively can reduce the damage of external vibrations to electronic devices and components, improves the security performance of electronic devices and components.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure: 1, silica gel heat-conducting layer; 2, netted fiberglass layer; 3, mesh.
Embodiment
Below in conjunction with accompanying drawing, the utility model is explained in detail.
A kind of heat-conducting silica gel sheet of high strength as shown in Figure 1, comprise silica gel heat-conducting layer 1, described silica gel heat-conducting layer 1 is two-layer, in the middle of two-layer described silica gel heat-conducting layer 1, be provided with a netted fiberglass layer 2, and it is an entirety that two-layer described silica gel heat-conducting layer 1 connects through mesh 3; The thickness of described netted fiberglass layer 2, at 0.04mm ~ 0.08mm, can reach high-performance when thickness is at 0.04mm, can reach high strength when thickness is at 0.08mm; Described silica gel heat-conducting layer 1 is provided with diaphragm; Mesh 3 equal and opposite in direction of described netted fiberglass layer 2; Described mesh 3 is 0.4mm × 0.4mm.
It is emphasized that: be only preferred embodiment of the present utility model above, not any pro forma restriction is done to the utility model, every above embodiment is done according to technical spirit of the present utility model any simple modification, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
Claims (5)
1. the heat-conducting silica gel sheet of a high strength, comprise silica gel heat-conducting layer, it is characterized in that, described silica gel heat-conducting layer (1) is for two-layer, in the middle of two-layer described silica gel heat-conducting layer (1), be provided with a netted fiberglass layer (2), it is an entirety that two-layer described silica gel heat-conducting layer (1) connects through mesh (3).
2. the heat-conducting silica gel sheet of high strength according to claim 1, is characterized in that, the thickness of described netted fiberglass layer (2) is at 0.04mm ~ 0.08mm.
3. the heat-conducting silica gel sheet of high strength according to claim 1, is characterized in that, described silica gel heat-conducting layer (1) is provided with diaphragm.
4. the heat-conducting silica gel sheet of high strength according to claim 1, is characterized in that, the mesh equal and opposite in direction of described netted fiberglass layer (2).
5. the heat-conducting silica gel sheet of high strength according to claim 4, is characterized in that, described mesh (3) is 0.4mm × 0.4mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420523320.0U CN204104280U (en) | 2014-09-12 | 2014-09-12 | The heat-conducting silica gel sheet of high strength |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420523320.0U CN204104280U (en) | 2014-09-12 | 2014-09-12 | The heat-conducting silica gel sheet of high strength |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204104280U true CN204104280U (en) | 2015-01-14 |
Family
ID=52272672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420523320.0U Expired - Fee Related CN204104280U (en) | 2014-09-12 | 2014-09-12 | The heat-conducting silica gel sheet of high strength |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204104280U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105495880A (en) * | 2016-01-07 | 2016-04-20 | 李文华 | Wireless charging intelligent bracelet capable of being charged by body heat |
-
2014
- 2014-09-12 CN CN201420523320.0U patent/CN204104280U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105495880A (en) * | 2016-01-07 | 2016-04-20 | 李文华 | Wireless charging intelligent bracelet capable of being charged by body heat |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhao Zhongxiang Inventor before: Li Kuili |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170912 Address after: 523570, D building, litchi garden village, Lu Village, Changping Town, Dongguan, Guangdong Patentee after: DONGGUAN HUAYUE THERMAL TECHNOLOGY CO.,LTD. Address before: Suzhou City, Jiangsu province 215300 Jingde Development Zone of Kunshan City Road 68, room 3 Patentee before: 'EMITAC NEW MATERIAL TECHNOLOGY (SUZHOU) CO.,LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150114 Termination date: 20210912 |