CN110325019B

CN110325019B - Electronic equipment

Info

Publication number: CN110325019B
Application number: CN201910588860.4A
Authority: CN
Inventors: 杜白; 虞学犬; 李得亮
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2019-07-02
Filing date: 2019-07-02
Publication date: 2020-12-04
Anticipated expiration: 2039-07-02
Also published as: WO2021000880A1; CN110325019A

Abstract

The application provides an electronic device, including: the circuit board is provided with an electronic heating element; the shielding frame is arranged on the circuit board and surrounds the side wall surface of the electronic heating element, and an opening is formed in the shielding frame; the heat dissipation part is arranged above the opening, the heat dissipation part is connected with the electronic heating element sequentially through a first elastic heat conduction layer, a first ultrathin conducting layer and a second elastic heat conduction layer, and the first elastic heat conduction layer and the second elastic heat conduction layer are in a compressed state; the area of first ultra-thin conducting layer is greater than or equal to open-ended area, first ultra-thin conducting layer with shielding frame electrical connection, shielding frame, first ultra-thin conducting layer and circuit board form and hold electron heating element's electromagnetic shield cavity. The application provides an electronic equipment can strengthen electronic heating element's heat-sinking capability when guaranteeing electronic heating element's shielding effect.

Description

Electronic equipment

Technical Field

The application relates to the technical field of chip heat dissipation, in particular to an electronic device.

Background

With the progress of science and technology and the change of communication modes of people, the terminal equipment is favored by consumers more and more by virtue of the dominant position, and meanwhile, the requirements of people on the terminal equipment are higher and higher, such as high performance, high reliability, ultra-thinning and the like.

Many high power chips, such as an Application Processor (AP), a radio frequency amplifier (rf amp), etc., exist in the terminal device, and these high power chips are both a high heat generation source and an electromagnetic interference (EMI) source. EMI shielding is a key factor affecting the performance of each module such as an antenna of a terminal device, and the performance of a chip and the direct experience of a customer are also determined by the quality of heat dissipation.

In the related art, a chip of a terminal device is fixed on a circuit board, a shielding frame fixed on the circuit board is arranged outside the chip, and a shielding cover is arranged on the shielding frame to form a closed space, so that the requirement on the EMI shielding of the chip is met. In order to dissipate heat of the chip, heat conducting gel can be respectively filled between the chip and the shielding case, and between the shielding case and the middle frame, and heat generated by the chip is transmitted to the middle frame sequentially through three layers of heat conducting media, namely the heat conducting gel, the shielding case and the heat conducting gel.

Generally, the thickness of each layer of heat-conducting gel is usually about 0.1 mm, and the thickness of the shielding case is also 0.1-0.15 mm, so that the path for transmitting heat from the chip to the middle frame is longer, the heat transfer resistance is larger, and the heat dissipation capacity of the chip is insufficient. In addition, the structure is not beneficial to the ultra-thin design of the terminal equipment.

Disclosure of Invention

The application provides an electronic device, when guaranteeing the shielding effect to electron heating element, can strengthen electron heating element's heat-sinking capability.

In a first aspect, an electronic device is provided, including: the circuit board is provided with an electronic heating element; the shielding frame is arranged on the circuit board and surrounds the side wall surface of the electronic heating element, and an opening is formed in the shielding frame; the heat dissipation part is arranged above the opening, the heat dissipation part is connected with the electronic heating element sequentially through the first elastic heat conduction layer, the first ultrathin conducting layer and the second elastic heat conduction layer, and the first elastic heat conduction layer and the second elastic heat conduction layer are in a compressed state; the area of the first ultrathin conducting layer is larger than or equal to that of the opening, the first ultrathin conducting layer is electrically connected with the shielding frame, and the shielding frame, the first ultrathin conducting layer and the circuit board form an electromagnetic shielding cavity for accommodating the electronic heating element.

In this application, the radiating piece loops through first elasticity heat-conducting layer, first ultra-thin conducting layer, second elasticity heat-conducting layer is connected with electron heating element, and first elasticity heat-conducting layer and second elasticity heat-conducting layer all are in the state of compressed, thereby can realize with the radiating piece, electron heating element's reliable connection and infiltration, form low thermal resistance heat conduction passageway, the heat-sinking capability of electron heating element has been reinforceed, the heat that electron heating element produced can loop through first elasticity heat-conducting layer, first ultra-thin conducting layer, second elasticity heat-conducting layer transmits to the radiating piece rapidly and dispels. Meanwhile, reliable low-impedance electric connection between the first ultrathin conducting layer and the shielding frame can be achieved under the action of the compression force of the first elastic heat-conducting layer, and a closed electromagnetic shielding cavity is formed, so that the screen effect and the screen effect consistency are improved. In addition, the electronic equipment electronic heating element of this application and the interval between the radiating piece is littleer, has not only reduced the length of heat transmission route, has reduced heat transfer resistance, has also made things convenient for electronic equipment's ultra-thin design simultaneously.

Alternatively, the circuit board may be a printed circuit board.

Alternatively, the electronic heating element may be a main heating chip of the electronic device, such as an application processor, a radio frequency amplifier, a power management chip, and the like.

Alternatively, the material of the shielding frame may be a metal material, such as stainless steel, cupronickel, magnesium aluminum alloy, and the like, which is not limited in this application.

Alternatively, the first elastic heat conduction layer and the second elastic heat conduction layer may be made of the same heat conduction material or different heat conduction materials, and the thicknesses of the first elastic heat conduction layer and the second elastic heat conduction layer may be the same or different. In addition, the compression ratios of the first elastic heat conduction layer and the second elastic heat conduction layer may be the same or different, and the compression ratios of different areas of the first elastic heat conduction layer and/or the second elastic heat conduction layer may be the same or different, which is not limited in this application.

Optionally, the first and/or second elastic heat conducting layers may be elastic heat conducting pads.

Optionally, the first elastic heat conduction layer and/or the second elastic heat conduction layer may be made of heat conductive silicone, heat conductive silicone grease, high heat conduction material, phase change heat conduction material, or the like.

In one possible design, the area of the second elastic heat conduction layer is larger than that of the upper wall surface of the electronic heating element, and the second elastic heat conduction layer is pressed on the upper wall surface of the electronic heating element and is in contact with part of the side wall surface of the electronic heating element. Through the arrangement, the heat conduction area (namely the contact area) between the second elastic heat conduction layer and the electronic heating element can be increased, and the heat dissipation capacity of the electronic heating element is enhanced.

In a possible design, a second ultrathin conducting layer is further arranged on the lower wall surface of the first ultrathin conducting layer and is annularly arranged on the outer side of the second elastic heat conducting layer, and the first ultrathin conducting layer is electrically connected with the shielding frame through the second ultrathin conducting layer. Through above setting, can improve the reliability of electric connection between first ultra-thin conducting layer and the shield frame.

Optionally, the thicknesses of the first ultra-thin conductive layer and the second ultra-thin conductive layer may be the same or different, and the materials of the first ultra-thin conductive layer and the second ultra-thin conductive layer may be the same or different, which is not limited in this application.

In one possible design, the electronic heating elements comprise a plurality and are not all identical in height. In order to connect the second elastic heat conduction layer with the electronic heating element with different heights, the thicknesses of the second elastic heat conduction layer in different areas can be set correspondingly according to the height of the electronic heating element. Through the arrangement, the application range of the application is wider.

In one possible design, the first and/or second elastic heat conductive layers have electrical conductivity. That is to say, the first elastic heat conduction layer and/or the second elastic heat conduction layer can conduct heat and conduct electricity, so that the electromagnetic shielding effect can be further improved.

Optionally, the first elastic heat conduction layer and/or the second elastic heat conduction layer may be made of a heat conductive and electric conductive composite material, the electric conductive material in the composite material may be gold, silver, copper, various alloy particles or fibers, graphite, graphene, carbon nanotubes, and the like, and the composite material has electric conductivity at least in the thickness direction. The heat conducting base material in the composite material can be graphite, heat conducting gel filler, gold, silver, copper and various alloy particles, carbon fiber, metal fiber and the like, and has higher heat conductivity coefficient (more than 3W/m.K) and lower heat transfer resistance.

In one possible design, the first ultra-thin conductive layer has at least one through hole. Because the first elastic heat conduction layer and/or the second elastic heat conduction layer have electric conduction capability and enough electromagnetic shielding capability, at least one through hole can be formed in the first ultrathin conductive layer. The advantage of setting up above is, through having seted up at least one through-hole on first ultra-thin conducting layer, can make the compressibility of first elasticity heat-conducting layer and second elasticity heat-conducting layer better, is favorable to the compression of the two, and simultaneously, above-mentioned two direct contact also is favorable to reducing the thermal resistance of whole heat transfer route, has improved the radiating effect to electron heating element.

Alternatively, the through hole may be any one of a circle, a triangle, a rectangle, and a diamond.

Alternatively, the first ultra-thin conductive layer may be a grid-like structure.

In one possible design, the first ultra-thin conductive layer is any one of a metal foil, a conductive fiber layer, and a graphite layer.

For example, the first ultra-thin conductive layer may be a copper foil or an aluminum foil.

Optionally, the thickness of the first ultrathin conducting layer is not more than 30um, so that the distance between the radiating piece and the electronic heating element is favorably reduced, the transmission path of heat is reduced, and the radiating capacity is improved.

For example, the thickness of the first ultra-thin conductive layer may be 8um, 10um, or 12 um.

In one possible design, the heat dissipation member is any one of a metal middle frame, a non-metal support structure member, and a heat pipe.

Alternatively, the metal bezel may be a battery within the electronic device or a metal support component of the screen.

Alternatively, the metal middle frame may be a magnesium aluminum alloy middle frame.

In one possible design, the second resilient heat conductive layer is embedded within the opening by an interference fit. The area of second elasticity heat-conducting layer slightly is greater than the open-ended area, can imbed second elasticity heat-conducting layer through interference fit in the opening, like this, the (side wall face) of second elasticity heat-conducting layer will contact with the shielding frame, and the heat that electron heating element produced also can be transmitted to the shielding frame on (the heat can further be transmitted to the circuit board through the shielding frame), has strengthened electron heating element's heat-sinking capability equally.

In one possible design, the shielding frames comprise a plurality of shielding frames, each shielding frame comprises an electronic heating element, and the heat dissipation member is connected with the electronic heating element in each shielding frame sequentially through the first elastic heat conduction layer, the first ultrathin conductive layer and the second elastic heat conduction layer.

In one possible design, the electronic device is any one of a mobile phone, a tablet computer, a router, a set-top box, a television, a modem, a laptop computer, and a desktop computer.

Drawings

Fig. 1 is a front view of an example of an electronic device provided in the present application.

Fig. 2 is a front view of a partial structure of an electronic device provided in an embodiment of the present application.

Fig. 3 is a top view of a portion of the structure of fig. 2.

Fig. 4 is a side view of an example of an electronic device provided in the present application.

Fig. 5 is a front view of a partial structure of another example of the electronic device provided in the present application.

Fig. 6 is a top view of the first ultra-thin conductive layer of fig. 5.

Fig. 7 is a front view of a partial structure of still another example of the electronic device according to the present application.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description of the present application, it is to be understood that the terms "upper", "lower", "side", "inner", "outer", "left", "right", and the like indicate orientations or positional relationships based on installation, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.

In the description of the present application, it should be noted that the term "and/or" is only one kind of association relationship describing an associated object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone.

The embodiment of the present application provides an electronic device, which may be, but is not limited to, a mobile phone, a tablet computer, a router, a set-top box, a television, a modem, a notebook computer, a desktop computer, and the like.

Referring to fig. 1, fig. 1 is a front view of an electronic device according to an embodiment of the present disclosure. By way of example and not limitation, in fig. 1, electronic device 500 is a cell phone and includes housing 100 and display 200, display 200 being mounted on housing 100.

The housing 100 may be a metal housing, such as a metal such as magnesium alloy, stainless steel, etc. In addition, the housing may be a plastic housing, a glass housing, a ceramic housing, or the like, but is not limited thereto.

The display panel 200 may be a Light Emitting Diode (LED) display panel, a Liquid Crystal Display (LCD) display panel, or an Organic Light Emitting Diode (OLED) display panel, but is not limited thereto.

The electronic device 500 further includes a circuit board 1 disposed inside the housing 100 and behind the display screen 200, and the circuit board 1 is provided with an electronic heating element 2.

The circuit board 1 may be a Printed Circuit Board (PCB) or the like, but is not limited thereto.

The electronic heating element 2 may be a main heating chip of an electronic device, such as, but not limited to, an application processor, a radio frequency amplifier, a Power Management IC (PMIC), and the like.

In addition, other electronic components, such as, but not limited to, a camera, a flash, a microphone, a sensor, a battery, etc., may also be disposed within the electronic device 500.

As will be readily understood, the electronic heating element 2 is both a high heat generating source and an electromagnetic interference source when in operation. The electronic device 500 provided by the embodiment of the application can enhance the heat dissipation capability of the electronic heating element while ensuring the shielding effect on the electronic heating element. The electronic device 500 provided in the present embodiment will be described with reference to the drawings.

Fig. 2 is a front view of a partial structure of an electronic device provided in an embodiment of the present application, and fig. 3 is a top view of a partial structure in fig. 2, as shown in fig. 2 and fig. 3, an electronic device 500 provided in this embodiment includes:

the circuit board comprises a circuit board 1, wherein an electronic heating element 2 is arranged on the circuit board 1;

a shield frame 3 provided on the circuit board 1 and surrounding a side wall surface of the electronic heating element 2, the shield frame 3 having an opening 31;

the heat dissipation member 4 is positioned on the opening 31, the heat dissipation member 4 is connected with the electronic heating element 2 sequentially through the first elastic heat conduction layer 5, the first ultrathin conducting layer 6 and the second elastic heat conduction layer 7, and the first elastic heat conduction layer 5 and the second elastic heat conduction layer 7 are in a compressed state;

the area of the first ultra-thin conducting layer 6 is larger than or equal to the area of the opening 31, the first ultra-thin conducting layer 6 is electrically connected with the shielding frame 3, and the shielding frame 3, the first ultra-thin conducting layer 6 and the circuit board 1 form an electromagnetic shielding cavity for accommodating the electronic heating element 2.

As shown in fig. 3, in the present embodiment, since the opening 31 is opened on the shielding frame 3, external electromagnetic interference will interfere with the electronic heating element 2 in the shielding frame 3 through the opening 31, and an electromagnetic field generated when the electronic heating element 2 operates will also interfere with an external component (e.g., an antenna) through the opening 31. In order to avoid the electromagnetic interference, in this embodiment, the first ultra-thin conductive layer 6 is disposed, and the first ultra-thin conductive layer 6 is disposed to be electrically connected to the shielding frame 3 (that is, the first ultra-thin conductive layer 6 and the shielding frame 3 are kept in a state of being electrically conducted with each other), so that the shielding frame 3, the first ultra-thin conductive layer 6 and the circuit board 1 form an electromagnetic shielding cavity for accommodating the electronic heating element 2, and further the electronic heating element 2 is isolated from an external component, thereby shielding the electromagnetic interference of the electronic heating element 2 to other components outside the shielding frame 3, and simultaneously avoiding the external electromagnetic field from interfering the electronic heating element 2.

Further, the heat sink 4 is connected with the electronic heating element 2 sequentially through the first elastic heat conduction layer 5, the first ultrathin conductive layer 6 and the second elastic heat conduction layer 7, and the first elastic heat conduction layer 5 and the second elastic heat conduction layer 7 are both in a compressed state, so that reliable connection and infiltration with the heat sink 4 and the electronic heating element 2 can be realized, a low-thermal-resistance heat conduction channel is formed, the heat dissipation capability of the electronic heating element 2 is enhanced, and heat generated by the electronic heating element 2 can be rapidly transmitted to the heat sink 4 and dissipated sequentially through the first elastic heat conduction layer 5, the first ultrathin conductive layer 6 and the second elastic heat conduction layer 7. Meanwhile, reliable low-impedance electric connection between the first ultrathin conducting layer 6 and the shielding frame 3 can be realized under the action of the compression force of the first elastic heat-conducting layer 5, and a closed electromagnetic shielding cavity is formed, so that the screen effect and the screen effect consistency are improved. In addition, the electronic device provided by the embodiment has smaller distance between the electronic heating element 2 and the heat dissipation member 4, thereby not only reducing the length of a heat transmission path and reducing heat transfer resistance, but also facilitating the ultra-thin design of the electronic device.

In the present embodiment, it is preferred that,

the shielding frame 3 can shield electromagnetic waves and may be made of a conductive material, for example, a metal material such as stainless steel, cupronickel, magnesium aluminum alloy, and the like, which is not limited in this application.

The heat dissipation member 4 has a sufficiently high thermal conductivity to function as a heat sink, for example, to transfer heat to the housing 100 and/or the display screen 200 through the heat dissipation member 4.

As an example, the heat sink 4 may be a metal holder for some components of the electronic device, for example a battery or a metal support part of a screen. In other embodiments, the heat dissipation element 4 may be a metal middle frame of an electronic device, such as a magnesium aluminum alloy middle frame, and the like, and the heat dissipation element 4 may also be a heat pipe, and the like, but is not limited thereto.

With the development of material science, some non-metallic materials can also have a sufficiently large heat conductivity coefficient and have a strong heat conductivity. Therefore, in other embodiments, the heat dissipation member 4 may also be a non-metallic support structure, for example, a non-metallic support frame made of graphite material, thereby widening the application range of the present embodiment.

In the present embodiment, the first ultra-thin conductive layer 6 has a relatively high conductive capability and a relatively low thickness, and the first ultra-thin conductive layer 6 may be any one of a metal foil, a conductive fiber layer, and a graphite layer. For example, it may be a copper foil or an aluminum foil. The thickness of the first ultrathin conducting layer 6 is not more than 30um, so that the distance between the radiating piece 4 and the electronic heating element 2 is favorably reduced, the transmission path of heat is reduced, and the radiating capacity is improved. For example, the thickness of the first ultra-thin conductive layer 6 may be 8um, 10um, or 12 um.

In other embodiments, the first ultra-thin conductive layer 6 may include at least one of gold, silver, copper, alloy, fiber, graphite, graphene, carbon nanotube, and other conductive particles, so that the conductive particles may pierce an oxide layer possibly existing on the surface of the shield frame 3, thereby ensuring a reliable low-impedance electrical connection and good shielding.

The area of the first ultra-thin conductive layer 6 may be larger than the area of the opening 31 so that the entire opening 31 can be covered, and as an example, the size and shape of the first ultra-thin conductive layer 6 may be the same as the size and shape of the upper wall surface of the shield frame 3 so that the entire upper wall surface of the shield frame 3 can be completely covered.

The first elastic heat conducting layer 5 and the second elastic heat conducting layer 7 are flexible and compressible, can absorb the tolerance in the vertical direction, and realize reliable overlapping and infiltration. The first and second elastic heat conducting layers 5, 7 have a high thermal conductivity (greater than 3W/m · K) and a high compressibility (greater than 10%).

In this embodiment, after the assembly, the first elastic heat conduction layer 5 and the second elastic heat conduction layer 7 are compressed, in other words, after the assembly, the distance between the electronic heating element 2 and the heat dissipation member 4 is smaller than the whole original thickness (i.e. the thickness before being compressed) of the first elastic heat conduction layer 5, the first ultra-thin conductive layer 6 and the second elastic heat conduction layer 7. For example, the overall original thickness of the first elastic heat conduction layer 5, the first ultra-thin electric conduction layer 6 and the second elastic heat conduction layer 7 is 0.3mm, and after the assembly is completed, the distance between the electronic heating element 2 and the heat dissipation member 4 can be 0.2mm (i.e. the thickness after being compressed is 0.2 mm).

Through the above arrangement, on the one hand, the first elastic heat conduction layer 5, the second elastic heat conduction layer 7, the heat dissipation piece 4, and the reliable lap joint and infiltration of the electronic heating element 2 can be realized, the contact thermal resistance is reduced, a low thermal resistance heat conduction path is formed, the heat dissipation effect of the electronic heating element 2 is improved, meanwhile, the reliable low-impedance electric connection between the first ultrathin conductive layer 6 and the shielding frame 3 can also be realized under the action of the compression force of the first elastic heat conduction layer 5, and a closed electromagnetic shielding cavity is formed, so that the screen effect and the screen effect consistency are improved.

In this embodiment, the first elastic heat conduction layer 5 and the second elastic heat conduction layer 7 may be made of the same heat conduction material or different heat conduction materials, and the thicknesses of the two layers may be the same or different. In addition, the compression ratios of the first elastic heat conduction layer 5 and the second elastic heat conduction layer 7 may be the same or different, and the compression ratios of different areas of the first elastic heat conduction layer 5 and/or the second elastic heat conduction layer 7 may be the same or different, which is not limited in this application.

Alternatively, the first and/or second elastic heat conducting layers 5, 7 may be elastic heat conducting pads.

Alternatively, the first elastic heat conduction layer 5 and/or the second elastic heat conduction layer 7 may be made of heat conductive silicone, heat conductive silicone grease, high heat conduction material, phase change heat conduction material, or the like.

In this embodiment, the first elastic heat conducting layer 5 and the second elastic heat conducting layer 7 may be attached to two sides of the first ultra-thin conducting layer 6 in advance to form a heat-conducting and electrically-conducting composite laminated structure, and during assembly, the composite laminated structure may be attached to a predetermined position of the heat sink 4 first, and then press-fitted and fixed on the shielding frame 3, thereby simplifying the assembly process.

The shape of the second elastic heat conduction layer 7 can be matched with the shape of the upper wall surface of the electronic heating element 2, and the area of the second elastic heat conduction layer 7 is larger than that of the upper wall surface of the electronic heating element 2, so that the whole upper wall surface of the electronic heating element 2 can be completely covered. In addition, as shown in fig. 1, the second elastic heat conduction layer 7 is press-fit connected to the upper wall surface of the electronic heating element 2 and contacts with a part of the side wall surface of the electronic heating element 2, so that the heat conduction area between the second elastic heat conduction layer 7 and the electronic heating element 2 can be increased, and the heat dissipation capability of the electronic heating element 2 is enhanced.

As shown in fig. 2, in the present embodiment, the shape of the second elastic heat conduction layer 7 may be adapted to the shape of the opening 31, the area of the second elastic heat conduction layer 7 is slightly larger than the area of the opening 31, and the second elastic heat conduction layer 7 may be embedded into the opening 31 through interference fit, so that (the side wall surface of) the second elastic heat conduction layer 7 will contact with the shielding frame 3, and the heat generated by the electronic heating element 2 may also be transmitted to the shielding frame 3 (the heat may be further transmitted to the circuit board 1 through the shielding frame 3), which also enhances the heat dissipation capability of the electronic heating element 2.

Fig. 4 is a side view of an electronic device provided in an embodiment of the present application. Referring to fig. 2 and 4, heat generated by the electronic heating element 2 on the circuit board 1 during operation is transferred to the heat sink 4 through the second elastic heat conducting layer 7, the first ultra-thin conducting layer 6, and the first elastic heat conducting layer 5 in sequence (in this case, the heat sink 4 may be a metal supporting component of the display panel 200), and the heat is dissipated to the display panel 200 (and the housing 100) through the heat sink 4.

Fig. 5 is a front view of a partial structure of an electronic device according to another embodiment of the present application, and as shown in fig. 5, the electronic device according to this embodiment is substantially the same in structure as the electronic device according to the foregoing embodiment shown in fig. 2, and only differences are described here.

In fig. 5, a second ultra-thin conductive layer 8 surrounding the second elastic thermal conductive layer 7 is further disposed on the lower wall surface of the first ultra-thin conductive layer 6, and the first ultra-thin conductive layer 6 is electrically connected to the shielding frame 3 through the second ultra-thin conductive layer 8.

Specifically, the lower surface of the first ultra-thin conducting layer 6 may be connected to the second elastic heat conducting layer 7 and the second ultra-thin conducting layer 8 at the same time, the second ultra-thin conducting layer 8 is disposed around the second elastic heat conducting layer 7, and the first ultra-thin conducting layer 6 is electrically connected to the shielding frame 3 through the second ultra-thin conducting layer 8, so as to improve the reliability of the electrical connection between the first ultra-thin conducting layer 6 and the shielding frame 3.

The thicknesses of the first ultra-thin conductive layer 6 and the second ultra-thin conductive layer 8 may be the same or different, and the materials of the two layers may be the same or different, which is not limited in this application.

The electronic heating elements 2 may be composed of a plurality of and not all the same height. As shown in fig. 5, in the present embodiment, two electronic heating elements 2 are provided, and the heights of the two electronic heating elements are different, so that the second elastic heat conduction layer 7 can be connected with the electronic heating elements 2 with different heights, and the thicknesses of the second elastic heat conduction layer 7 in different areas can be set to be different according to the height of the electronic heating elements 2. For example, the left electronic heating element 2 in fig. 5 may have a smaller height, and the area corresponding to the second elastic heat conducting layer 7 may have a thicker thickness, while the right electronic heating element 2 may have a larger height, and the area corresponding to the second elastic heat conducting layer 7 may have a thinner thickness. Therefore, the application range of the present embodiment is wider.

In this embodiment the first elastic heat conducting layer 5 and/or the second elastic heat conducting layer 7 have electrical conductivity. That is, the first elastic heat conduction layer 5 and/or the second elastic heat conduction layer 7 can conduct heat as well as electricity, so that the electromagnetic shielding effect can be further improved.

For example, the second elastic heat conduction layer 7 may be configured to have an electric conduction capability, and the second elastic heat conduction layer 7 is embedded into the opening 31 through interference fit, so that (the side wall surface of) the second elastic heat conduction layer 7 will contact with the shielding frame 3, and thus a closed electromagnetic shielding cavity may be formed by the circuit board 1, the shielding frame 3, and the second elastic heat conduction layer 7, and the electromagnetic shielding effect may be improved.

The first elastic heat conduction layer 5 and/or the second elastic heat conduction layer 7 can be made of a heat-conducting and electric-conducting composite material, the electric-conducting material in the composite material can be gold, silver, copper and various alloy particles or fibers, graphite, graphene, carbon nanotubes and the like, and the composite material has electric conductivity at least in the thickness direction. The heat conducting base material in the composite material can be graphite, heat conducting gel filler, gold, silver, copper and various alloy particles, carbon fiber, metal fiber and the like, and has higher heat conductivity coefficient (more than 3W/m.K) and lower heat transfer resistance.

Fig. 6 shows a top view of the first ultra-thin conductive layer 6 provided in the present embodiment. In this embodiment, since the first elastic heat conduction layer 5 and/or the second elastic heat conduction layer 7 have electric conduction capability and sufficient electromagnetic shielding capability, as shown in fig. 6, at least one through hole 61 may be opened on the first ultra-thin electric conduction layer 6 in this embodiment. The advantage of setting up above is, through having seted up at least one through-hole 61 on first ultra-thin conducting layer 6, can make the compressibility of first elasticity heat-conducting layer 5 and second elasticity heat-conducting layer 7 better, is favorable to the compression of the two, and simultaneously, above-mentioned two direct contact also is favorable to reducing the thermal resistance of whole heat transfer route, has improved the radiating effect to electron heating element 2.

Alternatively, the through hole 61 may be any one of a circle, a triangle, a rectangle, and a diamond.

Alternatively, the first ultra-thin conductive layer 6 may be a grid-like structure.

Fig. 7 is a front view of a partial structure of an electronic device according to still another embodiment of the present application, and as shown in fig. 7, the electronic device according to this embodiment is substantially the same in structure as the electronic device according to the embodiment shown in fig. 2, and only differences will be described here.

In the present embodiment, the shielding frame 3 includes a plurality of (two are shown in fig. 7), the electronic heating element 2 is included in each of the shielding frames 3, and the heat sink 4 is connected to each of the electronic heating elements 2 included in each of the shielding frames 3 through the first elastic heat conduction layer 5, the first ultrathin conductive layer 6, and the second elastic heat conduction layer 7 in sequence.

Specifically, in fig. 7, a plurality of shielding frames 3 may be disposed to surround the electronic heating elements 2 according to the number and distribution of the electronic heating elements 2, and heat generated by the electronic heating elements 2 in different shielding frames 3 may be transmitted to the same heat sink 4 sequentially through the second elastic heat conduction layer 7, the first ultrathin conductive layer 6, and the first elastic heat conduction layer 5.

As shown in fig. 7, a plurality of electronic heating elements 2 may be located on the same circuit board 1. In other embodiments, a plurality of electronic heating elements 2 may also be located on different circuit boards 1.

As shown in fig. 7, the first elastic heat conduction layer 5 and the first ultra-thin heat conduction layer 6 disposed on the left shield frame 3 and the right shield frame 3 may be connected to each other (i.e., the first elastic heat conduction layer 5 and the first ultra-thin heat conduction layer 6 are also disposed between the two shield frames 3). In other embodiments, the first elastic thermal conductive layer 5 and the first ultra-thin conductive layer 6 disposed on the left shield frame 3 and the right shield frame 3 may not be connected to each other.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An electronic device, comprising:

the circuit board (1), wherein an electronic heating element (2) is arranged on the circuit board (1);

the shielding frame (3) is arranged on the circuit board (1) and surrounds the side wall surface of the electronic heating element (2), and an opening (31) is formed in the shielding frame (3);

the heat dissipation member (4) is arranged above the opening (31), the heat dissipation member (4) is connected with the electronic heating element (2) sequentially through a first elastic heat conduction layer (5), a first ultrathin conducting layer (6) and a second elastic heat conduction layer (7), and the first elastic heat conduction layer (5) and the second elastic heat conduction layer (7) are in a compressed state;

the area of the first ultrathin conducting layer (6) is larger than or equal to that of the opening (31), the first ultrathin conducting layer (6) is electrically connected with the shielding frame (3), and the shielding frame (3), the first ultrathin conducting layer (6) and the circuit board (1) form an electromagnetic shielding cavity for accommodating the electronic heating element (2);

the area of the second elastic heat conduction layer (7) is larger than that of the upper wall surface of the electronic heating element (2), and the second elastic heat conduction layer (7) is pressed on the upper wall surface of the electronic heating element (2) and is in contact with part of the side wall surface of the electronic heating element (2).

2. The electronic device according to claim 1, wherein a second ultra-thin conductive layer (8) is further disposed on a lower wall surface of the first ultra-thin conductive layer (6) and surrounds the second elastic conductive layer (7), and the first ultra-thin conductive layer (6) is electrically connected to the shielding frame (3) through the second ultra-thin conductive layer (8).

3. Electronic device according to claim 1 or 2, characterized in that the electronic heating element (2) comprises a plurality of and is not completely identical in height.

4. An electronic device according to claim 1 or 2, characterized in that the first elastic heat conducting layer (5) and/or the second elastic heat conducting layer (7) has electrical conducting capabilities.

5. The electronic device according to claim 4, wherein the first ultra-thin conductive layer (6) has at least one through hole (61) formed therein.

6. An electronic device according to claim 1 or 2, characterized in that the first ultra-thin conductive layer (6) is any one of a metal foil, a layer of conductive fibres, a layer of graphite.

7. The electronic device according to claim 1 or 2, wherein the heat sink (4) is any one of a metal middle frame, a non-metal support structure, and a heat pipe.

8. An electronic device according to claim 1 or 2, characterized in that the second elastic heat conducting layer (7) is embedded in the opening (31) by interference fit.

9. The electronic device according to claim 1 or 2, wherein the shielding frame (3) comprises a plurality of shielding frames, the electronic heating element (2) is included in each shielding frame (3), and the heat sink (4) is connected to the electronic heating element (2) included in each shielding frame (3) sequentially through a first elastic heat conduction layer (5), a first ultrathin conductive layer (6) and a second elastic heat conduction layer (7).

10. The electronic device according to claim 1 or 2, wherein the electronic device is any one of a mobile phone, a tablet computer, a router, a set-top box, a television, a modem, a notebook computer, and a desktop computer.