CN207185099U - A kind of radome with heat sinking function - Google Patents
A kind of radome with heat sinking function Download PDFInfo
- Publication number
- CN207185099U CN207185099U CN201721178733.XU CN201721178733U CN207185099U CN 207185099 U CN207185099 U CN 207185099U CN 201721178733 U CN201721178733 U CN 201721178733U CN 207185099 U CN207185099 U CN 207185099U
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- Prior art keywords
- heat
- radome
- cpu
- conducting
- sinking function
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Abstract
The utility model discloses a kind of radome with heat sinking function, including CPU, thermally conductive gel layer, heat-conducting pad, heat-conducting glue layer and radome from left to right；Heat-conducting pad is provided between CPU and radome；Heat-conducting pad is bonded with radome using heat-conducting glue layer；Heat-conducting pad is bonded with CPU using compressible thermally conductive gel layer.This has the radome of heat sinking function reasonable in design, pass through flexible, compressible binding agent or heat-conducting medium, used with the material fit of firm type high thermal conductivity, low heat conductivity portion of material only acts on filling and the bonding of the microscopic gaps of highly heat-conductive material, packed layer is very thin, so that the conduction of velocity of CPU heats obtains the lifting of nearly ten times of levels, heat caused by CPU can quickly be conducted to the temperature for metallic shield surface, effectively reducing CPU.
Description
Technical field
A kind of radome is the utility model is related to, specifically a kind of radome with heat sinking function.
Background technology
Digital cell phone electronic product is more and more frivolous, and no image of Buddha large electric appliances class product sets big radiator or radiating
Device, therefore CPU heat generally requires to enter by metallic shield on the digital products such as existing smart mobile phone, tablet personal computer
Row radiating, and metallic shield and CPU belong to rigid material, can not be directly linked together and effectively carry out heat transfer.Existing skill
The structure of art uses upper strata radome, Intermediate Gray heat conduction soft silica gel pad, bottom as CPU mode, CPU：Mobile phone or flat board electricity
Brain central processing unit, substantial amounts of heat can be produced, it is necessary to radiate；Thermal conductive silicon rubber cushion：It is clipped between CPU and radome, plays filling
Radome and CPU spaces and conductive force, heat transfer power is in 3-5W, thickness 0.3mm-1mm（Thickness is thicker, heat conductivility
Difference）；Radome：Radome is metal material, and area is big, thermolysis；That is heat is led by heat conductive silica gel dig pass caused by CPU
To metallic shield, heat is distributed.Its defect is：Because present electronic product function is stronger and stronger, cause to CPU
Performance requirement more and more higher, CPU caloric values are increasing, so the area that needs make radome is bigger, it is bigger what is done
Simultaneously because electronics main board elements have height difference, radome is caused to be raised with CPU intermediate altitudes, it is necessary to which to use comparison thick
Thermal conductive silicon rubber cushion fill up middle space, most thin also to need more than 0.2mm, thick reaches 1mm or so.Due to current thermal conductive silicon
For rubber cushion thermal conductivity factor generally at 3 watts or so, thermal resistance is excessive, and the thicker thermal conduction effect of silica gel mat thickness can be poorer, easily causes CPU
Temperature is too high, and the overload that electronic equipment easily occurs crashes or damage.Therefore, the utility model provides a kind of for electronic product
Radome with heat sinking function.
Utility model content
The purpose of this utility model is to provide a kind of radome with heat sinking function, to solve in above-mentioned background technology
The problem of proposition.
To achieve the above object, the utility model provides following technical scheme：
A kind of radome with heat sinking function, including CPU, thermally conductive gel layer, heat-conducting pad, heat-conducting glue from left to right
Layer and radome；Heat-conducting pad is provided between CPU and radome；Heat-conducting pad is bonded with radome using heat-conducting glue layer；Heat conduction
Pad is bonded with CPU using compressible thermally conductive gel layer.
As further program of the utility model：The heat-conducting pad is made of the high hard material of thermal conductivity factor.
As further program of the utility model：The heat-conducting pad is using aluminium, copper, tin, stainless steel or heat conduction pottery
Porcelain is made.
As further program of the utility model：Thermally conductive gel layer is replaced using uncured preceding compressible binding agent.
As further program of the utility model：The thickness 0.002-0.005mm of the thermally conductive gel layer.
As further program of the utility model：The thickness of the heat-conducting glue layer is 0.002-0.005mm.
As further program of the utility model：The radome is metal material.
Compared with prior art, the beneficial effects of the utility model are：
This has that the radome of heat sinking function is reasonable in design, by flexible, compressible binding agent or heat-conducting medium, with firm type
The material fit of high thermal conductivity uses, low heat conductivity portion of material only act on the microscopic gaps of highly heat-conductive material filling and
Bond, packed layer can be compressed to extremely thin so that the conduction of velocity of CPU heats obtains the lifting of nearly ten times of levels, can be quick
Heat caused by CPU is conducted to metallic shield surface, effectively reduce CPU temperature.
Brief description of the drawings
Fig. 1 is the structural representation of existing radome.
Fig. 2 is structural representation of the present utility model.
Wherein：1-CPU；2- thermally conductive gel layers；3- heat-conducting pads；4- heat-conducting glue layers；5- radomes；101- originals CPU；102-
Former thermal conductive silicon rubber cushion；103- original radomes.
Embodiment
The technical scheme of this patent is described in more detail with reference to embodiment.
Fig. 1 is existing radome, includes the former CPU101 in left side, middle former thermal conductive silicon rubber cushion 102 and right side original
Radome 103；CPU is mobile phone or tablet personal computer central processing unit, can produce substantial amounts of heat, it is necessary to radiate；Heat conductive silica gel
Pad is clipped between CPU and radome, plays filling radome and CPU spaces and conductive force, heat transfer power is in 3-5W, thickness
0.3mm-1mm（Thickness is thicker, and heat conductivility is poor）；Radome is metal material, and area is big, thermolysis；That is it is hot caused by CPU
Amount is directed at metallic shield by heat conductive silica gel dig pass, and heat is distributed.Its defect is：Due to present electronic product function
It is stronger and stronger, cause to cpu performance requirement more and more higher, CPU caloric values are increasing, so needing the face that radome is done
Product it is bigger, do it is bigger while because electronics main board elements have height difference, cause radome and CPU intermediate altitudes
Raise, it is necessary to use the thick thermal conductive silicon rubber cushion of comparison to fill up middle space, most thin also to need more than 0.2mm, thick reaches 1mm
Left and right.Because current thermal conductive silicon rubber cushion thermal conductivity factor is generally at 3 watts or so, thermal resistance is excessive, the thicker heat transfer effect of silica gel mat thickness
Fruit can be poorer, easily causes cpu temperature too high, and the overload that electronic equipment easily occurs crashes or damage.
Referring to Fig. 2, a kind of radome with heat sinking function, including CPU1 from left to right, thermally conductive gel layer 2, lead
Heat pad piece 3, heat-conducting glue layer 4 and radome 5；Heat-conducting pad 3 is provided between CPU1 and radome 5, the heat-conducting pad 3 uses
The high hard material of other thermal conductivity factors such as aluminium, copper, tin, stainless steel or thermal conductive ceramic is made；Heat-conducting pad 3 and radome 5
Bonded using heat-conducting glue layer 4, the thickness of heat-conducting glue layer 4 can be as thin as 0.002mm；Heat-conducting pad 3 and CPU1 is led using compressible
Heat setting glue-line 2 bonds, and can also use other uncured preceding compressible binding agents to bond and replace thermally conductive gel layer 2, in CPU and lead
Ultra-thin heat-conducting layer is formed between heat pad, the conduction of the heat allow is quickly conducted to metallic shield.
CPU1 is mobile phone or tablet personal computer central processing unit, can produce substantial amounts of heat, it is necessary to radiate；And CPU peripheries
There is the obstruction of other electronic components, it is necessary to fill up gap with some heat-conducting mediums；Thermally conductive gel layer 2 is used to fill heat conductive pad
Piece and CPU gaps, thickness 0.002-0.005mm, good heat conductivity；Thermally conductive gel is mainly characterized by：It is stream before uncured
It body, can be extruded, form thin and compact gel layer, after solidification, the gap between CPU and heat-conducting pad can be filled up, by
It is weaker in the viscosity ratio of gel, so can be removed；Heat-conducting pad 3 is clipped between CPU and radome, plays filling
Radome and CPU spaces and conductive force（Good heat conductivity）, it is bonded together with CPU by thermally conductive gel layer 2, with radome
It is bonded together by heat-conducting glue layer；The heat-conducting glue layer 4 is used to fill heat-conducting pad and radome gap, thickness 0.002-
0.005mm, good heat conductivity, heat-conducting glue layer are mainly characterized by：It is uncured before be fluid, can be extruded, formed it is thin and
Fine and close glue-line, can securely fix radome and heat-conducting pad after solidification, and be not easy to be disassembled；The radome 5 is gold
Belong to material, area is big, good heat dissipation effect.
Operation principle of the present utility model is：Rigid highly heat-conductive material is used among radome and CPU（Metal is led
Thermal Ceramics class high thermal conductivity material）With the technique and structure of the combination of the relatively low Heat Conduction Material of flexibility, reach high conduction effect
Rate.When preparing the device, first, heat-conducting glue layer will be coated on heat-conducting pad, be bonded on radome, by physical impact, made
One layer of very thin heat-conducting glue layer is formed before heat-conducting pad and radome；Heat-conducting glue layer after solidification is very firm, not easy to remove.
The radome with heat insulating mattress assembled can be with standby, when needing to be applied on CPU, then the another side of heat-conducting pad applied
Upper thermally conductive gel, is bonded on CPU, by physical impact, makes to form one layer of very thin thermally conductive gel before heat-conducting pad and CPU
Layer；Heat-conducting glue layer after solidification is firm, but can dismantle.Heat comes out from CPU, passes sequentially through thermally conductive gel layer, leads
Heat pad piece, heat-conducting glue layer, is finally reached radome；The coefficient of heat conduction can reach hundreds of watts, can ensure CPU fast coolings.
In order to lift radome heat sinking function, it is too thick and cause thermal resistance mistake that the present invention focuses on solving thermal conductive silicon rubber cushion in CPU heat sources
The defects of big, hundreds of watts of material is up to using the coefficient of heat conduction among CPU and metallic shield, such as aluminium, copper, tin, no
The high hard material of rust other thermal conductivity factors such as steel or thermal conductive ceramic, which is made, serves as heat-conducting pad, in heat-conducting pad 3 and metal
The bonding process of radome uses heat conduction gluing knot, and heat-conducting glue has good compressibility before uncured in processing procedure, can be with gold
Category radome forms the fine and close bonding interface to compact, and thickness can be as thin as the ultra-thin tack coats of 0.002mm, and perfect filling heat conductive pad
Microscopic gaps between metallic shield, avoid the formation of cavity.Heat transfer between heat-conducting pad 3 and CPU is using compressible
Heat conduction Silica hydrogel or other uncured preceding compressible binding agents bond, ultra-thin heat-conducting layer is formed between CPU and heat conductive pad,
The conduction of the heat allow is quickly conducted to metallic shield.No matter CPU and metallic shield gap, which have, much can adjust
The heat conduction mat thickness of whole high thermal conductivity conducts to reach good connection.
This has that the radome of heat sinking function is reasonable in design, by flexible, compressible binding agent or heat-conducting medium, with firm type
The material fit of high thermal conductivity uses, low heat conductivity portion of material only act on the microscopic gaps of highly heat-conductive material filling and
Bond, packed layer can be compressed to extremely thin so that the conduction of velocity of CPU heats obtains the lifting of nearly ten times of levels, can be quick
Heat caused by CPU is conducted to metallic shield surface, effectively reduce CPU temperature.
, it is necessary to illustrate in the description for the radome that this has heat sinking function, unless otherwise clear and definite regulation and limit
Fixed, term " setting ", " connected " and " connection " should be interpreted broadly, for example, it may be being fixedly connected or detachably connecting
Connect, or be integrally connected；Can be joined directly together, can also be indirectly connected by intermediary, can be two element internals
Connection.For the ordinary skill in the art, it can understand above-mentioned term in the utility model with concrete condition
Concrete meaning.
The better embodiment of this patent is explained in detail above, but this patent is not limited to above-mentioned embodiment party
Formula, can also be on the premise of this patent objective not be departed from one skilled in the relevant art's possessed knowledge
Various changes can be made.
Claims (7)
1. a kind of radome with heat sinking function, it is characterised in that including CPU from left to right（1）, thermally conductive gel layer（2）、
Heat-conducting pad（3）, heat-conducting glue layer（4）And radome（5）；CPU（1）With radome（5）Between be provided with heat-conducting pad（3）；Heat conduction
Pad（3）With radome（5）Using heat-conducting glue layer（4）Bond；Heat-conducting pad（3）With CPU（1）Using compressible thermally conductive gel
Layer（2）Bond.
2. the radome according to claim 1 with heat sinking function, it is characterised in that the heat-conducting pad（3）Using
The high hard material of thermal conductivity factor is made.
3. the radome according to claim 2 with heat sinking function, it is characterised in that the heat-conducting pad（3）Using
Aluminium, copper, tin, stainless steel or thermal conductive ceramic are made.
4. the radome according to claim 1 with heat sinking function, it is characterised in that using uncured preceding compressible
Binding agent replaces thermally conductive gel layer（2）.
5. according to any described radomes with heat sinking function of claim 1-3, it is characterised in that the thermally conductive gel layer
（2）Thickness 0.002-0.005mm.
6. according to any described radomes with heat sinking function of claim 1-4, it is characterised in that the heat-conducting glue layer
（4）Thickness be 0.002-0.005mm.
7. according to any described radomes with heat sinking function of claim 1-4, it is characterised in that the radome（5）
For metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721178733.XU CN207185099U (en) | 2017-09-14 | 2017-09-14 | A kind of radome with heat sinking function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721178733.XU CN207185099U (en) | 2017-09-14 | 2017-09-14 | A kind of radome with heat sinking function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207185099U true CN207185099U (en) | 2018-04-03 |
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ID=61747409
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721178733.XU Expired - Fee Related CN207185099U (en) | 2017-09-14 | 2017-09-14 | A kind of radome with heat sinking function |
Country Status (1)
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| CN (1) | CN207185099U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109609040A (en) * | 2018-12-11 | 2019-04-12 | 苏州鸿凌达电子科技有限公司 | A method of it being bonded double-layer graphite piece using graphene nano gel as adhesive layer |
| WO2021000880A1 (en) * | 2019-07-02 | 2021-01-07 | 华为技术有限公司 | Electronic device |
-
2017
- 2017-09-14 CN CN201721178733.XU patent/CN207185099U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109609040A (en) * | 2018-12-11 | 2019-04-12 | 苏州鸿凌达电子科技有限公司 | A method of it being bonded double-layer graphite piece using graphene nano gel as adhesive layer |
| WO2021000880A1 (en) * | 2019-07-02 | 2021-01-07 | 华为技术有限公司 | Electronic device |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180403 Termination date: 20200914 |
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| CF01 | Termination of patent right due to non-payment of annual fee |