CN210328367U - Heat-conducting silica gel pad - Google Patents
Heat-conducting silica gel pad Download PDFInfo
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- CN210328367U CN210328367U CN201920690608.XU CN201920690608U CN210328367U CN 210328367 U CN210328367 U CN 210328367U CN 201920690608 U CN201920690608 U CN 201920690608U CN 210328367 U CN210328367 U CN 210328367U
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Abstract
The utility model relates to a heat conducting component, and discloses a heat conducting silica gel pad, which comprises an intermediate mixing layer made of silicone gel and ceramic powder, wherein the intermediate mixing layer comprises an upper heat conducting layer and a lower heat conducting layer, an anti-cracking metal wire is arranged between the upper heat conducting layer and the lower heat conducting layer, the upper heat conducting layer and the lower heat conducting layer are correspondingly provided with wire grooves, the anti-cracking metal wire is arranged in the wire grooves, and the clearance between the anti-cracking metal wire and the wire grooves is filled with the silicone gel; one surface of the middle mixed layer is provided with a surface skin, and the other surface is provided with silicone oil paper; the thickness of the middle mixing layer is 0.5-9 mm, and the heat conductivity coefficient is 45W/MK. The heat-conducting silica gel pad provided by the utility model has the advantages that the anti-cracking metal wire is arranged in the middle mixing layer, so that the mechanical property of the heat-conducting silica gel pad is improved, and the compression resistance and tensile resistance of the heat-conducting silica gel pad are improved; simultaneously, the middle mixing layer comprises an upper matching layer and a lower heat conducting layer, the thickness is large, the heat conducting efficiency is high, and the overall comprehensive performance of the heat conducting silica gel pad is better.
Description
Technical Field
The utility model relates to a heat-conducting component especially relates to a heat conduction silica gel pad.
Background
With the development of integration technology and the densification of microelectronic packages, the heat generated by electronic devices is rapidly accumulated and increased. The performance and reliability of the electronic components are directly reduced along with the temperature rise of the electronic components, so whether the electronic components can dissipate heat in time becomes an important factor influencing the service life of the electronic components. In order to ensure that the electronic components can still keep a normal working state at the temperature of the use environment, a layer of heat-conducting insulating film is usually arranged on a heat exchange interface of the related components to be used as a heat-conducting interface material, so that the heat of a heating element is rapidly transferred to heat dissipation equipment, and the normal operation of the electronic equipment is ensured. At present, the heat-conducting silica gel gasket is widely used as a gap filling material for electronic products, so that the heat-conducting silica gel gasket is required to have good mechanical strength besides heat conduction requirements. The heat-conducting insulating material provided in the current market mainly adopts a single-layer silicon rubber heat-conducting insulating gasket with a simple structure, most of silicon rubber gaskets have poor mechanical strength, the shock resistance is not enough, and the heat-conducting effect is not good.
In view of the fact that the existing heat-conducting silica gel pad cannot meet the requirements, a more reasonable technical scheme needs to be provided, and the technical problem existing in the prior art is solved.
SUMMERY OF THE UTILITY MODEL
The utility model provides a heat conduction silica gel pad, when aiming at improving heat conductivity of heat conduction silica gel pad, strengthen heat conduction silica gel pad's mechanical strength.
In order to realize the above effect, the utility model discloses the technical scheme who adopts does:
the heat-conducting silica gel pad comprises an intermediate mixing layer made of silicone gel and ceramic powder, wherein the intermediate mixing layer comprises an upper heat-conducting layer and a lower heat-conducting layer, an anti-cracking metal wire is arranged between the upper heat-conducting layer and the lower heat-conducting layer, the upper heat-conducting layer and the lower heat-conducting layer are correspondingly provided with wire grooves, the anti-cracking metal wire is arranged in the wire grooves, and a gap between the anti-cracking metal wire and the wire grooves is filled with the silicone gel; one surface of the middle mixed layer is provided with a surface skin, and the other surface is provided with silicone oil paper; the thickness of the middle mixing layer is 0.5-9 mm, and the heat conductivity coefficient is 45W/MK.
Further, the anti-crack metal wire disclosed in the above technical scheme is optimized, and the following concrete feasible schemes are given as follows: the anti-crack metal wire is a criss-cross metal wire mesh.
Further, the anti-crack metal wire disclosed in the above technical scheme is optimized, and the following concrete feasible schemes are given as follows: the anti-crack metal wire is spirally wound.
Further, the anti-crack metal wire disclosed in the above technical scheme is optimized, and the following concrete feasible schemes are given as follows: the anti-crack metal wire is made of a copper material, and the diameter of the anti-crack metal wire is 0.1-0.5 mm.
Further, the epidermis disclosed in the above technical solution is optimized, and the following concrete feasible solutions are given as follows: the thickness of the epidermis is 0.6 ~ 0.9 mm.
Further, the silicone oil paper disclosed in the above technical scheme is optimized, and the following concrete feasible schemes are given as follows: the thickness of the silicone oil paper is 0.8-0.9 mm.
Further, the intermediate mixed layer disclosed in the above technical solution is optimized, and the following concrete feasible solutions are given as follows: the thickness of the middle mixing layer is 2-4 mm.
Further, the intermediate mixed layer disclosed in the above technical solution is optimized, and the following concrete feasible solutions are given as follows: the softness of the middle mixed layer is 120 mN.
Further, the epidermis disclosed in the above technical solution is optimized, and the following concrete feasible solutions are given as follows: the skin is hot pressing silica gel skin.
Compared with the prior art, the beneficial effects of the utility model are that:
the heat-conducting silica gel pad provided by the utility model has the advantages that the anti-cracking metal wire is arranged in the middle mixing layer, so that the mechanical property of the heat-conducting silica gel pad is improved, and the compression resistance and tensile resistance of the heat-conducting silica gel pad are improved; simultaneously, the middle mixing layer comprises an upper matching layer and a lower heat conducting layer, the thickness is large, the heat conducting efficiency is high, and the overall comprehensive performance of the heat conducting silica gel pad is better.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view of the layer structure of the present invention;
FIG. 2 is a schematic top view of the structure of example 1;
fig. 3 is a schematic top view of the structure of embodiment 2.
The reference numerals in the above figures represent the meaning: 1-epidermis; 2-an upper heat conducting layer; 3-silicone gel; 4-crack resistant wire; 5-lower heat conducting layer; 6-silicone oil paper.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific embodiments. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. Specific structural and functional details disclosed herein are merely illustrative of example embodiments of the invention. The present invention may, however, be embodied in many alternate forms and should not be construed as limited to the embodiments set forth herein.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of example embodiments of the present invention.
It should be understood that the term "and/or" herein is merely one type of association relationship that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, B exists alone, and A and B exist at the same time, and the term "/and" is used herein to describe another association object relationship, which means that two relationships may exist, for example, A/and B, may mean: a alone, and both a and B alone, and further, the character "/" in this document generally means that the former and latter associated objects are in an "or" relationship.
It will be understood that when an element is referred to as being "connected," "connected," or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being "directly adjacent" or "directly coupled" to another element, there are no intervening elements present. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between … …" versus "directly between … …", "adjacent" versus "directly adjacent", etc.).
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes," and/or "including," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, and/or groups thereof.
It should also be noted that, in some alternative implementations, the functions/acts noted may occur out of the order noted in the figures. For example, two figures shown in succession may, in fact, be executed substantially concurrently, or the figures may sometimes be executed in the reverse order, depending upon the functionality/acts involved.
In the following description, specific details are provided to facilitate a thorough understanding of example embodiments. However, it will be understood by those of ordinary skill in the art that the example embodiments may be practiced without these specific details. For example, systems may be shown in block diagrams in order not to obscure the examples in unnecessary detail. In other instances, well-known processes, structures and techniques may be shown without unnecessary detail in order to avoid obscuring example embodiments.
Example 1
As shown in fig. 1 and fig. 3, the present embodiment discloses a heat-conducting silicone pad, which includes a silicone gel 3 and an intermediate mixing layer made of ceramic powder, where the intermediate mixing layer includes an upper heat-conducting layer 2 and a lower heat-conducting layer 5, an anti-crack metal wire 4 is disposed between the upper heat-conducting layer 2 and the lower heat-conducting layer 5, the upper heat-conducting layer 2 and the lower heat-conducting layer 5 are correspondingly provided with wire grooves, the anti-crack metal wire 4 is disposed in the wire grooves, and a gap between the anti-crack metal wire 4 and the wire grooves is filled with the silicone gel 3; one surface of the middle mixed layer is provided with a surface skin 1, and the other surface is provided with silicone oil paper 6; the thickness of the middle mixing layer is 0.5-9 mm, and the heat conductivity coefficient is 45W/MK.
The anti-crack metal wire 4 disclosed in the above technical scheme is optimized, and the following concrete feasible schemes are given as follows: the anti-crack metal wire 4 is a criss-cross metal wire mesh.
The anti-crack metal wire 4 disclosed in the above technical scheme is optimized, and the following concrete feasible schemes are given as follows: the anti-crack metal wire 4 is made of a copper material, and the diameter of the anti-crack metal wire 4 is 0.1-0.5 mm.
The skin 1 disclosed in the above technical solution is optimized, and the following concrete feasible solutions are given: the thickness of the skin 1 is 0.6-0.9 mm.
The silicone oil paper 6 disclosed in the above technical scheme is optimized, and the following concrete feasible schemes are given as follows: the thickness of the silicone oil paper 6 is 0.8-0.9 mm.
The intermediate mixed layer disclosed in the above technical scheme is optimized, and the following concrete feasible schemes are given as follows: the thickness of the middle mixing layer is 2-4 mm.
The intermediate mixed layer disclosed in the above technical scheme is optimized, and the following concrete feasible schemes are given as follows: the softness of the middle mixed layer is 120 mN.
The skin 1 disclosed in the above technical solution is optimized, and the following concrete feasible solutions are given: the surface skin 1 is a hot-pressing silica gel skin.
The heat conduction silica gel pad of this embodiment imitates the design from the engineering angle and how to make the irregular surface phase-match of material, adopts high performance heat conduction material, eliminates the air gap to improve holistic heat transfer ability, make the device work in lower temperature.
The heat-conducting silica gel pad of the embodiment has certain flexibility, excellent insulating property, compressibility and natural surface viscosity, is specially produced by a design scheme of utilizing gaps to transfer heat, can fill the gaps, completes heat transfer between a heating part and a radiating part, simultaneously has the effects of insulation, shock absorption, sealing and the like, can meet the design requirements of equipment miniaturization and ultra-thinness, has high manufacturability and usability, has wide thickness application range, is an excellent heat-conducting filling material and is widely applied to electronic and electrical products.
Example 2
As shown in fig. 1 and fig. 3, the present embodiment discloses a heat conductive silica gel pad, which is the same as that in embodiment 1: the anti-crack wire is characterized by comprising a middle mixing layer made of silicone gel 3 and ceramic powder, wherein the middle mixing layer comprises an upper heat conduction layer 2 and a lower heat conduction layer 5, an anti-crack metal wire 4 is arranged between the upper heat conduction layer 2 and the lower heat conduction layer 5, wire grooves are correspondingly arranged on the upper heat conduction layer 2 and the lower heat conduction layer 5, the anti-crack metal wire 4 is arranged in the wire grooves, and a gap between the anti-crack metal wire 4 and the wire grooves is filled with the silicone gel 3; one surface of the middle mixed layer is provided with a surface skin 1, and the other surface is provided with silicone oil paper 6; the thickness of the middle mixing layer is 0.5-9 mm, and the heat conductivity coefficient is 45W/MK.
Unlike in example 1, in this example, the crack-resistant wire 4 disclosed in the above technical solution is optimized, and the following concrete possible solutions are given: the anti-crack metal wire 4 is a spirally wound metal wire.
The above embodiments are just examples of the present invention, but the present invention is not limited to the above optional embodiments, and the above technical features can be arbitrarily combined to obtain a new technical solution without contradiction, and a person skilled in the art can obtain other various embodiments by mutually arbitrarily combining the above embodiments, and any person can obtain other various embodiments by the teaching of the present invention. The above detailed description should not be taken as limiting the scope of the invention, which is defined in the following claims, and which can be used to interpret the claims.
Claims (9)
1. Heat conduction silica gel pad, its characterized in that: the anti-cracking heat-conducting wire comprises an intermediate mixing layer made of silicone gel (3) and ceramic powder, wherein the intermediate mixing layer comprises an upper heat-conducting layer (2) and a lower heat-conducting layer (5), an anti-cracking metal wire (4) is arranged between the upper heat-conducting layer (2) and the lower heat-conducting layer (5), wire grooves are correspondingly formed in the upper heat-conducting layer (2) and the lower heat-conducting layer (5), the anti-cracking metal wire (4) is arranged in the wire grooves, and the silicone gel (3) is filled in gaps between the anti-cracking metal wire (4) and the wire grooves; one surface of the middle mixed layer is provided with a surface skin (1), and the other surface is provided with silicone oil paper (6); the thickness of the middle mixing layer is 0.5-9 mm, and the heat conductivity coefficient is 45W/MK.
2. A thermally conductive silicone pad as set forth in claim 1, wherein: the anti-crack metal wire (4) is a criss-cross metal wire mesh.
3. A thermally conductive silicone pad as set forth in claim 1, wherein: the anti-crack metal wire (4) is spirally wound.
4. The heat-conducting silica gel pad according to any one of claims 1 to 3, wherein: the anti-crack metal wire (4) is made of a copper material, and the diameter of the anti-crack metal wire (4) is 0.1-0.5 mm.
5. A thermally conductive silicone pad as set forth in claim 1, wherein: the thickness of the surface skin (1) is 0.6-0.9 mm.
6. A thermally conductive silicone pad as set forth in claim 1, wherein: the thickness of the silicone oil paper (6) is 0.8-0.9 mm.
7. A thermally conductive silicone pad as set forth in claim 1, wherein: the thickness of the middle mixing layer is 2-4 mm.
8. A thermally conductive silicone pad as set forth in claim 1, wherein: the softness of the middle mixed layer is 120 mN.
9. A thermally conductive silicone pad as set forth in claim 1, wherein: the surface skin (1) is a hot-pressing silica gel skin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920690608.XU CN210328367U (en) | 2019-05-13 | 2019-05-13 | Heat-conducting silica gel pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920690608.XU CN210328367U (en) | 2019-05-13 | 2019-05-13 | Heat-conducting silica gel pad |
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| CN210328367U true CN210328367U (en) | 2020-04-14 |
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| CN201920690608.XU Active CN210328367U (en) | 2019-05-13 | 2019-05-13 | Heat-conducting silica gel pad |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111746065A (en) * | 2020-07-23 | 2020-10-09 | 杨帆 | Heat-conducting silica gel pad |
| CN117870427A (en) * | 2024-03-11 | 2024-04-12 | 深圳大学 | Soaking plate with ceramic coating on surface and preparation method thereof |
-
2019
- 2019-05-13 CN CN201920690608.XU patent/CN210328367U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111746065A (en) * | 2020-07-23 | 2020-10-09 | 杨帆 | Heat-conducting silica gel pad |
| CN111746065B (en) * | 2020-07-23 | 2022-02-22 | 东莞市盛元新材料科技有限公司 | Heat-conducting silica gel pad |
| CN117870427A (en) * | 2024-03-11 | 2024-04-12 | 深圳大学 | Soaking plate with ceramic coating on surface and preparation method thereof |
| CN117870427B (en) * | 2024-03-11 | 2024-05-07 | 深圳大学 | Soaking plate with ceramic coating on surface and preparation method thereof |
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