CN205789936U - A kind of flexible insulation heat dissipation film - Google Patents
A kind of flexible insulation heat dissipation film Download PDFInfo
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- CN205789936U CN205789936U CN201620471936.7U CN201620471936U CN205789936U CN 205789936 U CN205789936 U CN 205789936U CN 201620471936 U CN201620471936 U CN 201620471936U CN 205789936 U CN205789936 U CN 205789936U
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- heat dissipation
- dissipation film
- flexible insulation
- insulation heat
- boron nitride
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Abstract
This utility model provides a kind of flexible insulation heat dissipation film, and including the composite bed being made up of boron nitride sheet, carborundum line and polyvinyl alcohol, the one side of described composite bed is coated with adhesive layer.This flexible insulation heat dissipation film has outstanding heat dispersion, and there is good flexibility and electrical insulation capability, any plane or curved surface can be attached at, described flexible insulation heat dissipation film is fitted in and can use on electronic device, can be widely applied in the electronic products such as smart mobile phone, panel computer and LED screen.
Description
[technical field]
This utility model relates to a kind of flexible insulation heat dissipation film.
[background technology]
Along with miniaturization and the development of Electronic Encapsulating Technology of electronic product, the integration density of electronic device chips is drastically
Improve, the problem bringing heat radiation therewith.During electronic device work, quite a few power attenuation is converted into the form of heat, and
The dissipation heat of electronic device can directly result in the rising of electronic equipment temperature and the increase of thermal stress, the work to electronic device
Reliability and service life cause serious threat.Therefore, the heat radiation of electronic product becomes distinct issues.
Existing market portioned product carries out heat conduction and heat radiation, such as copper, aluminum, Graphene etc. by metal, material with carbon element, they
Though heat conductivity the highest (> 100W/m K), they have good electric conductivity simultaneously.During using, if
They directly contact with circuit devcie, it is possible to can cause line short, the hidden danger such as on fire.In some specific cases, need
Heat dissipation film is wanted to have a good electrical insulation capability, the universal heat conductivity of insulating radiation film in the market relatively low (< 5W/m K),
Therefore the insulating radiation film with good heat conductive performance that exploitation is new it is badly in need of.Additionally, developing rapidly along with flexible electronic, to leading
The flexibility of hotting mask it is also proposed higher requirement.
[utility model content]
The technical problems to be solved in the utility model is to provide a kind of flexible insulation heat dissipation film, has good heat radiation energy
Power, can be that electronic device provides heat dissipation interface.
This utility model adopts the following technical scheme that
A kind of flexible insulation heat dissipation film, including the composite bed being made up of boron nitride sheet, carborundum line and polyvinyl alcohol and
It is coated on the adhesive layer on described composite bed one surface.
In the present embodiment, described adhesive layer is insulating heat-conductive glue-line.
In the present embodiment, described boron nitride sheet and carborundum line all contain load Argent grain.
In the present embodiment, the diameter of described Argent grain is in 20～40 nanometers.
In the present embodiment, the boron nitride of described composite bed component by mass percentage: 50-80% load Argent grain
Sheet, the carborundum line of 10-30% load Argent grain, 5-15% polyvinyl alcohol.
In the present embodiment, the size of described boron nitride sheet is at 1～2 micron, and thickness is in 10～15 nanometers.
In the present embodiment, the diameter of described carborundum line is in 200～300 nanometers, and length is at 10～40 microns.
In the present embodiment, the preferred thickness of described composite bed is 80 microns.
Compared to existing technology, this utility model has the advantages that this flexible insulation heat dissipation film has outstanding dissipating
Hot property, and there is good flexibility and electrical insulation capability, it is possible to it is attached at any plane or curved surface, by described soft
Property insulating radiation film fits in and can use on electronic device, can be widely applied to smart mobile phone, panel computer and LED screen etc.
In electronic product.
[accompanying drawing explanation]
Fig. 1 is the structural representation of flexible insulation heat dissipation film of the present utility model.
[detailed description of the invention]
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing and enforcement
Example, is further elaborated to this utility model.Should be appreciated that specific embodiment described herein is only in order to explain
This utility model, is not used to limit this utility model.
As long as additionally, technical characteristic involved in each embodiment of this utility model disclosed below each other it
Between do not constitute conflict just can be mutually combined.
As it is shown in figure 1, a kind of flexible insulation heat dissipation film, combine including by boron nitride sheet, carborundum line and polyvinyl alcohol
Composite bed 1.
Specifically, boron nitride superhigh temperature resistant, the most still keep preeminent greasy property, nontoxic, pollution-free, epipodium
Protecting, high chemical inertness, coefficient of friction is extremely low, high pressure resistant, high resistance, anti-thermal shock, corrosion resistance, and heat conductivity is good.Concrete real at this
Executing in example, the size of boron nitride sheet is at 1～2 micron, and thickness is in 10～15 nanometers.
Specifically, due to the stable chemical performance of carborundum, heat conductivity is high, thermal coefficient of expansion is little, anti-wear performance good, can
Improve its wearability and increase the service life 1～2 times；In order to the high grade refractory made, resistance to thermal shock, volume are little, lightweight
And intensity is high, good energy-conserving effect.And carborundum line has high chemical purity, in addition to may be used for composite, the suitableeest
Conjunction is applied to the most advanced and sophisticated neck such as catalysis, photoelectricity, quasiconductor.In this specific embodiment, the diameter of described carborundum line 200～
300 nanometers, length is at 10～40 microns.
Meanwhile, described boron nitride sheet and carborundum line all contain load Argent grain, and the diameter of load Argent grain is 20～40
Nanometer.
Specifically, polyvinyl alcohol is nontoxic and to human body skin nonirritant, is a kind of safety film former.Concrete real at this
Execute in example, composite bed 1 component by mass percentage: the mass fraction of the boron nitride sheet of load Argent grain is 50-80%, more
It is preferably 60-70%；The mass fraction of the carborundum line of load Argent grain is 10-30%, more preferably 15-25%；Polyethylene
The mass fraction of alcohol is 5-15%, more preferably 5%.
Further, the adhesive layer 2 being coated on composite bed 1 is also included.Adhesive layer 2 is insulating heat-conductive glue-line, existing leads
The function of heat, the most conveniently makes described composite bed 1 be attached on electronic device, it is possible to be conducted to be combined by the heat on electronic original part
Layer 1.Insulating heat-conductive glue-line is preferably acrylic acid glue-line or polyurethane glue-line.Will be understood ground, adhesive layer 2 can use third
Olefin(e) acid or silica gel pressure sensitive adhesive adhesive layer, thickness is 3-30 micron, is wherein advisable with 10-20 micron.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, all at this
Any amendment, equivalent and the improvement etc. made within the spirit of utility model and principle, should be included in this utility model
Protection domain within.
Claims (7)
1. a flexible insulation heat dissipation film, including heat dissipating layer, it is characterised in that described heat dissipating layer is boron nitride sheet, carborundum line
And the composite membrane that polyvinyl alcohol is combined as a whole, the one side of described heat dissipating layer is coated with adhesive layer.
2. flexible insulation heat dissipation film as claimed in claim 1, it is characterised in that described adhesive layer is insulating heat-conductive glue-line.
3. flexible insulation heat dissipation film as claimed in claim 1, it is characterised in that described boron nitride sheet and carborundum line all contain
Load Argent grain.
4. flexible insulation heat dissipation film as claimed in claim 3, it is characterised in that the diameter of described Argent grain is received in 20～40
Rice.
5. flexible insulation heat dissipation film as claimed in claim 1, it is characterised in that the size of described boron nitride sheet is micro-in 1～2
Rice, thickness is in 10～15 nanometers.
6. flexible insulation heat dissipation film as claimed in claim 1, it is characterised in that the diameter of described carborundum line is 200～300
Nanometer, length is at 10～40 microns.
7. flexible insulation heat dissipation film as claimed in claim 1, it is characterised in that the preferred thickness of described heat dissipating layer is 80 micro-
Rice.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620471936.7U CN205789936U (en) | 2016-05-23 | 2016-05-23 | A kind of flexible insulation heat dissipation film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620471936.7U CN205789936U (en) | 2016-05-23 | 2016-05-23 | A kind of flexible insulation heat dissipation film |
Publications (1)
| Publication Number | Publication Date |
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| CN205789936U true CN205789936U (en) | 2016-12-07 |
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| CN201620471936.7U Active CN205789936U (en) | 2016-05-23 | 2016-05-23 | A kind of flexible insulation heat dissipation film |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109575456A (en) * | 2018-10-26 | 2019-04-05 | 福建师范大学 | A kind of preparation method of multi-component hybridization anisotropy thermal diffusion film |
-
2016
- 2016-05-23 CN CN201620471936.7U patent/CN205789936U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109575456A (en) * | 2018-10-26 | 2019-04-05 | 福建师范大学 | A kind of preparation method of multi-component hybridization anisotropy thermal diffusion film |
| CN109575456B (en) * | 2018-10-26 | 2022-04-26 | 福建师范大学 | Preparation method of multi-element hybrid anisotropic thermal diffusion film |
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