CN112876757A - Ultrathin double-sided adhesive tape with heat conduction function in vertical direction and application method - Google Patents
Ultrathin double-sided adhesive tape with heat conduction function in vertical direction and application method Download PDFInfo
- Publication number
- CN112876757A CN112876757A CN202110062923.XA CN202110062923A CN112876757A CN 112876757 A CN112876757 A CN 112876757A CN 202110062923 A CN202110062923 A CN 202110062923A CN 112876757 A CN112876757 A CN 112876757A
- Authority
- CN
- China
- Prior art keywords
- sided tape
- double
- heat conduction
- ultra
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000002390 adhesive tape Substances 0.000 title claims description 43
- 230000017525 heat dissipation Effects 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000011148 porous material Substances 0.000 claims description 44
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 30
- 239000007787 solid Substances 0.000 claims description 26
- 239000000853 adhesive Substances 0.000 claims description 23
- 230000001070 adhesive effect Effects 0.000 claims description 23
- 239000011858 nanopowder Substances 0.000 claims description 23
- 229920000642 polymer Polymers 0.000 claims description 22
- 229910021389 graphene Inorganic materials 0.000 claims description 15
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 claims description 15
- 238000006116 polymerization reaction Methods 0.000 claims description 15
- 229920001971 elastomer Polymers 0.000 claims description 10
- 238000001125 extrusion Methods 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 8
- 125000004122 cyclic group Chemical group 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 12
- 238000013461 design Methods 0.000 abstract description 6
- 239000000919 ceramic Substances 0.000 description 22
- 229910002804 graphite Inorganic materials 0.000 description 17
- 239000010439 graphite Substances 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000000741 silica gel Substances 0.000 description 6
- 229910002027 silica gel Inorganic materials 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to an ultrathin double-sided tape with a vertical heat conduction function and an application method thereof. The ultrathin double-sided tape with the vertical heat conduction function and the application method thereof have the advantages that the total thickness is 15-30 mu m, the ultrathin double-sided tape belongs to a lower category in the existing double-sided tape, more space is saved for the internal design of an electronic product, the bonding force of the ultrathin double-sided tape is formed through atmospheric pressure, a plane heat dissipation material can be detachably fixed on the surface of an electronic component needing heat dissipation, the effects of repeatedly peeling and reusing the bonding force can be achieved, the vertical heat conduction function is increased, and the functions are diversified.
Description
Technical Field
The invention belongs to the technical field of ultrathin double-sided adhesive tapes, and particularly relates to an ultrathin double-sided adhesive tape with a heat conduction function in a vertical direction and an application method thereof.
Background
With the rapid expansion of the market of portable and wearable electronic products, the structures of electronic internal components and circuit boards are gradually becoming thinner and lighter, and smaller, and the design sizes of various critical ICs and chips are also rapidly reduced, so that heat dissipation becomes a difficult point while high-speed calculation and communication capabilities are brought. Taking a mobile phone CPU as an example, the working temperature of a conventional mobile phone CPU chip in the market at present can reach more than 70 ℃, part of the capacitance can reach more than 60 ℃, and the working temperature of a mobile phone liquid crystal screen can also reach 50-70 ℃, in addition, in recent years, a wireless charging module which is gradually popular is also very easy to cause energy conversion into extra heat energy in transmission current, the internal temperature of an electronic product can actually reach a higher degree completely, and the upper limit of the temperature which can be borne by the mobile phone chip, the battery and the like is generally only about 50 ℃, therefore, if the chip, the capacitance, the circuit and the peripheral elements of a heating core cannot be cooled down quickly, great damage can be caused to the performance and the service life of the electronic element and the electronic product, and even potential safety hazards can be caused.
In the conventional electronic internal component design thinking, what is the most common in the aspect of the heat dissipation is to increase the radiating graphite layer of plane direction, the radiating heat conduction silicone grease of line or heat conduction silica gel pad etc. of perpendicular defence of collocation are used jointly, this will cause radiating element to occupy the more problem of electronic product internal design space, also there is some graphite conducting strips directly to use on the cooling surface, and it is fixed through double-sided tape, just such application mode as being common in the wireless module of filling, and conventional PET film double-sided tape has latent influence to the heat-conduction of vertical direction equally.
There is still a need for a heat-conducting solution with a lower volume requirement, preferably with a certain heat-conducting capacity in the vertical direction.
Disclosure of Invention
In order to solve the problems in the prior art, the invention aims to provide an ultrathin double-sided adhesive tape with a vertical heat conduction function and an application method thereof.
In order to achieve the purpose and achieve the technical effect, the invention adopts the technical scheme that:
the utility model provides an ultra-thin double sticky tape with vertical direction heat conduction function, is obtained through adding the preparation of heat conduction nanometer powder in the polymerization process of the high polymer of non-gluing agent class, heat conduction nanometer powder is embedded into the high polymer of non-gluing agent class after the polymerization is accomplished, forms the loose structure that densely covers and have the hole, when receiving external pressure, the hole receives the extrusion force effect, and the air in the hole is discharged, forms the laminating force between the interface that atmospheric pressure leads to, makes ultra-thin double sticky tape form the bonding force between the interface through atmospheric pressure, after getting into the air in the hole, ultra-thin double sticky tape's bonding force reduces or even disappears, ultra-thin double sticky tape reforms the bonding force between the interface after the hole receives external pressure again, has cyclic usability and at the heat conductivity of vertical direction.
Further, the heat-conducting nano powder comprises heat-conducting nano ceramic solids, the heat-conducting nano ceramic solids are embedded into the non-adhesive high polymer after polymerization is completed to form a dense loose structure with pores, the weight of the non-adhesive high polymer accounts for 90% or more of the total amount, and the weight of the heat-conducting nano powder accounts for 10% or less of the total amount.
Further, the heat-conducting nano powder comprises heat-conducting nano ceramic solid and one or two of nano titanium dioxide and nano graphene, wherein the weight of the non-adhesive high polymer accounts for 90% or more of the total amount, and the weight of the heat-conducting nano powder accounts for 10% or less of the total amount.
Further, the heat-conducting nano powder comprises, by weight, 50-90% of heat-conducting nano ceramic solid, 9-40% of nano titanium dioxide and 1-10% of nano graphene, wherein the particle sizes of the heat-conducting nano ceramic solid, the nano titanium dioxide and the nano graphene are respectively 1-2 nm.
Furthermore, the thickness of the ultrathin double-sided adhesive tape is 15-30 mu m, and the heat conductivity coefficient of the ultrathin double-sided adhesive tape in the vertical direction is more than 10W/mK.
Further, the bonding force of the ultrathin double-sided tape is not less than 7N/cm.
Further, the pore diameter is 0.5 to 1 μm.
Further, the non-adhesive high polymer is high temperature resistant and elastic, and comprises rubber or polyurethane.
The invention discloses an application of an ultrathin double-sided adhesive tape with a vertical heat conduction function in a component needing heat dissipation.
The invention discloses an application method of an ultrathin double-sided adhesive tape with a vertical heat conduction function in a component needing heat dissipation, which comprises the following steps: the flat heat dissipation material is detachably fixed on the surface of the component needing heat dissipation through the ultrathin double-sided adhesive tape with the function of heat conduction in the vertical direction, when the pores of the ultrathin double-sided adhesive tape are acted by extrusion force, air in the pores is discharged to form the joint force between the interfaces caused by atmospheric pressure, the ultrathin double-sided adhesive tape forms the bonding force between interfaces through atmospheric pressure, the flat heat dissipation material is bonded to the surface of a component needing heat dissipation through the ultrathin double-sided adhesive tape, when air enters the pores, the bonding force of the ultrathin double-sided adhesive tape is reduced or even disappears, the plane heat dissipation material is partially or completely separated from the surface of the component needing heat dissipation, the ultrathin double-sided adhesive tape reforms the bonding force between interfaces after the pores are subjected to external pressure again, and the planar heat dissipation material is bonded to the surface of the component needing heat dissipation again, so that the device has the advantages of cyclic usability and heat conductivity in the vertical direction.
Compared with the prior art, the invention has the beneficial effects that:
the invention discloses an ultrathin double-sided adhesive tape with a vertical heat conduction function and an application method thereof, the heat conducting nano powder is prepared by adding heat conducting nano ceramic solid and the like into the polymerization process of the non-adhesive high polymer, the heat conducting nano powder is embedded into the polymerized non-adhesive high polymer to form a dense loose structure with pores, when the pressure is applied to the outside, the air in the pores is discharged under the action of extrusion force, the joint force between the interfaces caused by the atmospheric pressure is formed, the ultrathin double-sided adhesive tape forms the adhesive force between the interfaces through the atmospheric pressure, when air enters the pores, the bonding force of the ultrathin double-sided tape is reduced or even disappears, and the ultrathin double-sided tape reforms the bonding force between interfaces after the pores are subjected to external pressure again, so that the ultrathin double-sided tape has cyclic usability and thermal conductivity in the vertical direction. The invention provides an ultrathin double-sided tape with a vertical heat conduction function and an application method, which is an ultrathin double-sided tape with a vertical heat conduction function, is obviously different from the existing product, has the total thickness of 15-30 mu m and is obviously lower than the existing heat conduction silica gel pad, belongs to a lower category in the existing double-sided tape, saves more space for the internal design of electronic products, can detachably fix planar heat dissipation materials such as graphite sheets and the like on the surface of an electronic component needing heat dissipation through the bonding force provided by the ultrathin double-sided tape, simultaneously, the bonding force of the ultrathin double-sided tape is formed by atmospheric pressure instead of the interfacial molecular acting force of a common tape, has stable bonding force, can achieve the effect of repeatedly peeling and reusing the bonding force, and avoids using a heat conduction silica gel sheet with the thickness generally within the range of 0.3-1mm, compared with the conventional mode of directly fixing the graphite flake by using the double-sided adhesive tape, the invention also increases the heat conduction function in the vertical direction, the heat conduction coefficient is close to partial stainless steel materials and far exceeds the heat conduction coefficient of the conventional PET double-sided adhesive tape with the thickness of 15-30 mu m, the heat dissipation is effectively carried out on components such as electronic components and the like in the vertical direction, the double-sided adhesive tape can be used for adhering components of plane heat dissipation materials such as the graphite flake and the like on the surface needing heat dissipation, the quick heat dissipation effect is achieved, the functions are diversified, the daily various requirements of the components and the like are better met, the practicability is greatly improved, and the double-sided adhesive tape.
Detailed Description
The following detailed description of the embodiments of the present invention is provided to enable those skilled in the art to more easily understand the advantages and features of the present invention, and to clearly and clearly define the scope of the present invention.
An ultrathin double-sided tape with a heat conduction function in a vertical direction is prepared by adding heat conduction nano powder consisting of heat conduction nano ceramic solids and the like in the polymerization process of non-adhesive high polymers, wherein the weight of the non-adhesive high polymers accounts for 90% or more of the total amount, and the weight of the heat conduction nano powder accounts for 10% or less of the total amount, after the polymerization of the non-adhesive high polymers is finished, the heat conduction nano powder is uniformly embedded into the polymerized non-adhesive high polymers to form a dense loose structure with pores, the diameter of each pore is 0.5-1 mu m, the particle size of the heat conduction nano powder is 1-2nm, and the heat conduction capability in the vertical direction is provided by the heat conduction nano powder; when receiving external pressure, the hole receives the extrusion force effect, the air in the hole is discharged, thereby form the laminating force between the interface that atmospheric pressure leads to, make ultra-thin double-sided tape form the bonding force between the interface through atmospheric pressure, reach the effect that bonds between the interface, the change of external pressure size can influence the bonding force change of ultra-thin double-sided tape, the bonding force of ultra-thin double-sided tape is not less than 7N/cm, after getting into the air in the hole, the bonding force of ultra-thin double-sided tape reduces or even disappears, after the hole receives external pressure again, the air in the hole is discharged, ultra-thin double-sided tape reforms the bonding force between the interface, have the circulated nature and the heat conductivity in the vertical direction.
The heat conduction channel formed by the heat conduction nanometer powder is vertical, stable heat conductivity in the vertical direction is provided for the ultrathin double-sided adhesive tape through the heat conduction nanometer powder such as the heat conduction nanometer ceramic solid, the ultrathin double-sided adhesive tape can reach the heat conductivity coefficient of more than 10W/mK in the vertical direction, is close to partial stainless steel materials and far exceeds the conventional PET double-sided adhesive tape with the thickness of 15-30 mu m. It should be noted that the thermal conductivity of the ultra-thin double-sided tape of the present invention in the vertical direction is better after the air in the pores is completely discharged, and is better than the thermal conductivity that the air in the pores is only partially discharged.
The thickness of the ultrathin double-sided adhesive tape is 15-30 mu m, which is obviously lower than that of the conventional heat-conducting silica gel pad, and the ultrathin double-sided adhesive tape belongs to a lower category in the double-sided adhesive tape, so that more space is saved for structural design.
As a specific implementation manner, the ultrathin double-sided tape can be prepared by adding nano titanium dioxide and/or nano graphene except for the heat-conducting nano ceramic solid in the polymerization process of the non-adhesive high polymer, wherein the weight of the non-adhesive high polymer accounts for more than 90% of the total amount, including 90%, and the sum of the weights of the heat-conducting nano ceramic solid, the nano titanium dioxide and the nano graphite accounts for less than 10% of the total amount, including 10%.
As a more specific embodiment, the heat-conducting nano powder comprises 50-90% of heat-conducting nano ceramic solid, 9-40% of nano titanium dioxide and 1-10% of nano graphene by weight percentage, and the contribution of the heat-conducting nano ceramic solid in improving the heat conductivity of the product in the vertical direction is larger than that of the nano titanium dioxide and the nano graphene.
The non-adhesive high polymer is rubber, polyurethane and the like, has good high-temperature resistance and certain elasticity.
The invention discloses an application of an ultrathin double-sided adhesive tape with a vertical heat conduction function in a component needing heat dissipation.
The invention discloses an application method of an ultrathin double-sided adhesive tape with a vertical heat conduction function in a component needing heat dissipation, which comprises the following steps: the ultrathin double-sided adhesive tape with the vertical heat conduction function detachably fixes planar heat dissipation materials such as graphite flakes and the like on the surface of a component (mainly an electronic component) needing heat dissipation, when pores in the ultrathin double-sided adhesive tape are subjected to extrusion force, air in the pores is exhausted to form bonding force between interfaces caused by atmospheric pressure, the ultrathin double-sided adhesive tape forms bonding force between the interfaces through the atmospheric pressure to achieve the effect of interface bonding, the ultrathin double-sided adhesive tape has bonding property on the planar heat dissipation materials such as the graphite flakes and the component needing heat dissipation, the planar heat dissipation materials can be bonded to the surface of the component needing heat dissipation through the ultrathin double-sided adhesive tape, after air enters the pores, the bonding force of the ultrathin double-sided adhesive tape is reduced or even disappears, the planar heat dissipation materials are partially or completely separated from the surface of the component needing heat dissipation, and the air in the pores is exhausted after the pores are subjected to, the ultrathin double-sided tape reforms the adhesive force between interfaces, and reforms the plane heat dissipation material to the surface of the component needing heat dissipation, so that the ultrathin double-sided tape has the advantages of cyclic usability and heat conductivity in the vertical direction.
Example 1
An ultrathin double-sided adhesive tape with a vertical heat conduction function is 20 microns thick and is prepared by adding heat conduction nano ceramic solids with the particle size of 1-2nm in the polymerization process of rubber, wherein the weight ratio of the rubber to the heat conduction nano ceramic solids is 9: 1, after the polymerization of the rubber polymer is finished, a dense porous structure with pores is formed due to the uniform embedding of the heat-conducting nano ceramic solid, and the diameter of the pores is basically between 0.5 and 1 mu m. When the ultrathin double-sided tape is subjected to external pressure, the pores are extruded, air in the pores is discharged, so that the bonding force between interfaces caused by atmospheric pressure is formed, the bonding effect between the interfaces is achieved, the bonding force can reach over 7N/cm through tests, meanwhile, the heat-conducting nano ceramic solid body can provide stable heat conductivity in the vertical direction, and through tests, the ultrathin double-sided tape can reach the heat conductivity coefficient of over 10W/mK in the vertical direction, is close to a part of stainless steel materials, and far exceeds the conventional PET double-sided tape with the thickness of 15-30 mu m.
An application method of an ultrathin double-sided adhesive tape with a vertical heat conduction function in a component needing heat dissipation comprises the following steps:
the graphite flake is detachably fixed on the surface of the electronic component needing heat dissipation through the ultrathin double-sided tape with the thickness of 20 microns in the embodiment 1, when the pore in the ultrathin double-sided tape is acted by extrusion force, air in the pore is discharged to form the joint force between interfaces caused by atmospheric pressure, the ultrathin double-sided tape forms the bonding force between the interfaces through the atmospheric pressure to achieve the effect of interface bonding, the graphite flake and the component needing heat dissipation both have bonding property, and then the graphite flake can be bonded to the surface of the component needing heat dissipation through the ultrathin double-sided tape, after air enters the pore, the bonding force of the ultrathin double-sided tape is reduced or even disappears, the graphite flake is partially or completely separated from the surface of the component needing heat dissipation, the air in the pore is discharged after the pore is subjected to external pressure again, and the bonding force between the interfaces is formed again through the ultrathin double-sided tape, the ultrathin double-sided tape is formed by atmospheric pressure instead of interfacial molecular force of a common tape, has stable adhesive force, and can achieve the effects of repeated peeling and repeated use of the adhesive force.
Example 2
The ultrathin double-sided adhesive tape with the vertical heat conduction function is 20 micrometers in thickness, is prepared by adding heat conduction nanometer powder consisting of heat conduction nanometer ceramic solids, nanometer titanium dioxide and nanometer graphene in the polymerization process of rubber, and has the weight ratio of the rubber to the heat conduction nanometer powder of 9: 1, the heat-conducting nano powder comprises 50% of heat-conducting nano ceramic solid, 40% of nano titanium dioxide and 10% of nano graphene in percentage by weight.
An application method of an ultrathin double-sided adhesive tape with a vertical heat conduction function in a component needing heat dissipation comprises the following steps:
the graphite flake is detachably fixed on the surface of the electronic component needing heat dissipation through the ultrathin double-sided tape with the thickness of 20 microns in the embodiment 2, when the pore in the ultrathin double-sided tape is acted by extrusion force, air in the pore is discharged to form the joint force between interfaces caused by atmospheric pressure, the ultrathin double-sided tape forms the bonding force between the interfaces through the atmospheric pressure to achieve the effect of interface bonding, the graphite flake and the component needing heat dissipation both have bonding property, and then the graphite flake can be bonded to the surface of the component needing heat dissipation through the ultrathin double-sided tape, after air enters the pore, the bonding force of the ultrathin double-sided tape is reduced or even disappears, the graphite flake is partially or completely separated from the surface of the component needing heat dissipation, the air in the pore is discharged after the pore is subjected to external pressure again, and the ultrathin double-sided tape forms the bonding force between the interfaces again, and the graphite sheet is bonded to the surface of the component needing heat dissipation again, so that the device has the advantages of recycling and heat conductivity in the vertical direction.
The same as in example 1.
Example 3
The ultrathin double-sided adhesive tape with the heat conduction function in the vertical direction is 20 micrometers in thickness, and is prepared by adding heat conduction nano powder consisting of heat conduction nano ceramic solids, nano titanium dioxide and nano graphene in the polymerization process of rubber, wherein the heat conduction nano powder comprises 90% of the heat conduction nano ceramic solids, 9% of the nano titanium dioxide and 1% of the nano graphene in percentage by weight.
The same as in example 2.
Example 4
An ultrathin double-sided adhesive tape with a vertical heat conduction function is 20 microns thick and is prepared by adding heat conduction nano-ceramic solid, nano-titanium dioxide and nano-graphene to prepare heat conduction nano-powder in the polymerization process of rubber, wherein the heat conduction nano-powder comprises 80% of the heat conduction nano-ceramic solid, 14% of the nano-titanium dioxide and 6% of the nano-graphene in percentage by weight.
The same as in example 2.
Comparative example 1
Comparative example 1 a commercially available heat conductive silicone pad or sheet of 0.5mm thickness was used.
Comparative example 2
Comparative example 2 a commercially available 20 μm thick PET double-sided tape was used.
The ultra-thin double-sided tapes obtained in examples 1 to 4, the heat-conducting silica gel pads or heat-conducting silica gel sheets of comparative example 1 and the PET double-sided tapes of comparative example 2 were fixed on the same single-layer copper foils on a commercially available 80 ℃ flat plate heat source, respectively, and surface temperature test experiments were performed, and the experimental results showed that the surface temperature rise of the single-layer copper foils using the ultra-thin double-sided tapes obtained in examples 1 to 4 was significantly faster than that of comparative examples 1 to 2 at the same time and under the same conditions, thereby proving that the ultra-thin double-sided tapes have a stronger heat conductivity in the vertical direction.
The parts of the invention not specifically described can be realized by adopting the prior art, and the details are not described herein.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The ultrathin double-sided tape with the vertical heat conduction function is characterized in that heat conduction nanometer powder is added in the polymerization process of non-adhesive high polymers to prepare the ultrathin double-sided tape, the heat conduction nanometer powder is embedded into the non-adhesive high polymers after polymerization is completed to form a dense loose structure with pores, when the ultrathin double-sided tape is subjected to external pressure, the pores are subjected to extrusion force, air in the pores is discharged, the bonding force between interfaces caused by atmospheric pressure is formed, the ultrathin double-sided tape forms the bonding force between the interfaces through the atmospheric pressure, after the air enters the pores, the bonding force of the ultrathin double-sided tape is reduced or even disappears, the pores are subjected to the external pressure again, the ultrathin double-sided tape forms the bonding force between the interfaces again, and the ultrathin double-sided tape has cyclic usability and heat conduction in the vertical direction.
2. The ultra-thin double sided tape of claim 1, wherein the heat conducting nanopowder comprises heat conducting nanoceramic solids embedded in a non-adhesive high polymer after polymerization to form a dense porous structure with pores, the non-adhesive high polymer is 90% or more by weight, and the heat conducting nanopowder is 10% or less by weight.
3. The ultra-thin double sided tape of claim 1, wherein the heat conductive nanopowder comprises heat conductive nanoceramic solid and one or two of nano titanium dioxide and nano graphene, the non-adhesive high polymer accounts for 90% or more of the total weight, and the heat conductive nanopowder accounts for 10% or less of the total weight.
4. The ultrathin double-sided tape with the vertical heat conduction function as claimed in claim 3, wherein the heat conduction nanopowder comprises 50-90% by weight of heat conduction nanoceramic solid, 9-40% by weight of nano titanium dioxide and 1-10% by weight of nano graphene, and the particle sizes of the heat conduction nanoceramic solid, the nano titanium dioxide and the nano graphene are 1-2nm respectively.
5. The ultra-thin double-sided tape with the function of heat conduction in the vertical direction as claimed in claim 1, wherein the thickness of the ultra-thin double-sided tape is 15-30 μm, and the heat conductivity coefficient of the ultra-thin double-sided tape in the vertical direction is more than 10W/mK.
6. The ultra-thin double-sided tape with the function of vertically conducting heat according to claim 1, wherein the adhesion force of the ultra-thin double-sided tape is not less than 7N/cm.
7. The ultra-thin double sided tape with vertical direction heat conduction function as claimed in claim 1, wherein the pore diameter is 0.5-1 μm.
8. The ultra-thin double sided tape with vertical heat conduction function as claimed in claim 1, wherein the non-adhesive high polymer comprises rubber or polyurethane.
9. The application of the ultrathin double-sided adhesive tape with the vertical heat conduction function in the components needing heat dissipation according to any one of claims 1 to 8.
10. The application method of the ultrathin double-sided adhesive tape with the vertical heat conduction function in the component needing heat dissipation, as claimed in claim 9, is characterized by comprising the following steps: the ultra-thin double-sided tape with the vertical heat conduction function of any one of claims 1 to 8 is used for detachably fixing a planar heat dissipation material on the surface of a component to be cooled, when the pores of the ultra-thin double-sided tape are subjected to an extrusion force, air in the pores is exhausted to form an interfacial bonding force caused by atmospheric pressure, the ultra-thin double-sided tape forms an interfacial bonding force through the atmospheric pressure, the planar heat dissipation material is bonded to the surface of the component to be cooled through the ultra-thin double-sided tape, when air enters the pores, the bonding force of the ultra-thin double-sided tape is reduced or even disappears, the planar heat dissipation material is partially or completely separated from the surface of the component to be cooled, the ultra-thin double-sided tape reforms the interfacial bonding force after the pores are subjected to an external pressure again, and the planar heat dissipation material is bonded to the surface of the component to be, has cyclic usability and thermal conductivity in the vertical direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110062923.XA CN112876757B (en) | 2021-01-18 | 2021-01-18 | Ultrathin double-sided adhesive tape with heat conduction function in vertical direction and application method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110062923.XA CN112876757B (en) | 2021-01-18 | 2021-01-18 | Ultrathin double-sided adhesive tape with heat conduction function in vertical direction and application method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112876757A true CN112876757A (en) | 2021-06-01 |
| CN112876757B CN112876757B (en) | 2022-12-23 |
Family
ID=76049076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110062923.XA Active CN112876757B (en) | 2021-01-18 | 2021-01-18 | Ultrathin double-sided adhesive tape with heat conduction function in vertical direction and application method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112876757B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113801614A (en) * | 2021-10-19 | 2021-12-17 | 苏州翎慧材料科技有限公司 | Heat-conducting adhesive and heat-conducting double-sided adhesive tape |
| CN113943540A (en) * | 2021-10-19 | 2022-01-18 | 苏州翎慧材料科技有限公司 | Heat conducting gasket |
| CN113954483A (en) * | 2021-10-19 | 2022-01-21 | 苏州翎慧材料科技有限公司 | Wireless charging receiving terminal wafer module structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013118849A1 (en) * | 2012-02-08 | 2013-08-15 | 日東電工株式会社 | Thermal conductive sheet |
| US20190390926A1 (en) * | 2017-01-30 | 2019-12-26 | Sekisui Polymatech Co., Ltd. | Heat-dissipating sheet |
-
2021
- 2021-01-18 CN CN202110062923.XA patent/CN112876757B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013118849A1 (en) * | 2012-02-08 | 2013-08-15 | 日東電工株式会社 | Thermal conductive sheet |
| US20190390926A1 (en) * | 2017-01-30 | 2019-12-26 | Sekisui Polymatech Co., Ltd. | Heat-dissipating sheet |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113801614A (en) * | 2021-10-19 | 2021-12-17 | 苏州翎慧材料科技有限公司 | Heat-conducting adhesive and heat-conducting double-sided adhesive tape |
| CN113943540A (en) * | 2021-10-19 | 2022-01-18 | 苏州翎慧材料科技有限公司 | Heat conducting gasket |
| CN113954483A (en) * | 2021-10-19 | 2022-01-21 | 苏州翎慧材料科技有限公司 | Wireless charging receiving terminal wafer module structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112876757B (en) | 2022-12-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112876757B (en) | Ultrathin double-sided adhesive tape with heat conduction function in vertical direction and application method | |
| WO2018205924A1 (en) | Thermal interface material, and preparation and application thereof | |
| JP2019057731A (en) | Electromagnetic wave-absorbing composition coating material | |
| JP4459470B2 (en) | Electronic component heat dissipation structure and heat dissipation sheet used therefor | |
| JP5185582B2 (en) | Thermally conductive sheet | |
| WO2012016465A1 (en) | Heat-conductive insulating material, heat-conductive insulating sheet and methods for preparing same | |
| KR101603582B1 (en) | Thermal diffusion sheet having a flexible layer of ceramic-carbon composite | |
| CN105419667A (en) | Heat-conducting and high-viscosity double-sided tape adopting metal as base material | |
| JP2017092345A (en) | Heat conduction sheet and method of manufacturing the same, and semiconductor device | |
| CN213924617U (en) | Composite adhesive tape capable of shielding and absorbing electromagnetic waves | |
| CN108440964B (en) | Silicone rubber sheet with anti-static heat conduction function and preparation method thereof | |
| CN108368418B (en) | Two-dimensional heat conducting material and use thereof | |
| CN114181670A (en) | Flexible high-thermal-conductivity composite phase change film and preparation method thereof | |
| CN113980606A (en) | Multi-layer composite heat-conducting shielding adhesive tape | |
| WO2017136230A1 (en) | Compressible gasket, method for preparing same and electronic product comprising same | |
| JP4974609B2 (en) | Film-like electronic equipment | |
| CN210011437U (en) | Heat-conducting silica gel heat-dissipation composite film | |
| CN213522887U (en) | Heat dissipation structure for 5G communication equipment | |
| CN105889708B (en) | Smart machine thermal isolation film and smart machine comprising the thermal isolation film | |
| CN209602442U (en) | Heat conductive silica gel laminated film | |
| KR101583670B1 (en) | Thermal diffusion sheet having a flexible layer and a rigid layer of ceramic-carbon composite | |
| CN109866486B (en) | Heat-conducting silica gel sheet with composite cross laminated structure and preparation method thereof | |
| KR101550133B1 (en) | Funtional thermal diffusion sheet having ceramic-carbon composite | |
| CN113292933A (en) | High-thermal-conductivity-coefficient pressure-sensitive adhesive and high-thermal-conductivity-coefficient pressure-sensitive adhesive tape | |
| CN217103668U (en) | Foam copper base material conducting strip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240517 Address after: West side of Building 2, No. 6 Chunyao Road, Caohu Street, Suzhou City, Jiangsu Province, 215000 Patentee after: Suzhou Keguna New Materials Technology Co.,Ltd. Country or region after: China Address before: Room 352, unit 5, building 1, 688 Qiushi Road, Jinshanwei Town, Jinshan District, Shanghai Patentee before: Shanghai keguna New Material Technology Co.,Ltd. Country or region before: China |