CN209184928U - A kind of heat-conducting pad - Google Patents

A kind of heat-conducting pad Download PDF

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Publication number
CN209184928U
CN209184928U CN201821637357.0U CN201821637357U CN209184928U CN 209184928 U CN209184928 U CN 209184928U CN 201821637357 U CN201821637357 U CN 201821637357U CN 209184928 U CN209184928 U CN 209184928U
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China
Prior art keywords
silicon rubber
rubber piece
adhesive
heat
copper sheet
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Active
Application number
CN201821637357.0U
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Chinese (zh)
Inventor
周宪鹏
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Kunshan Bosway Electronics Co Ltd
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Kunshan Bosway Electronics Co Ltd
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Priority to CN201821637357.0U priority Critical patent/CN209184928U/en
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Abstract

The utility model discloses a kind of heat-conducting pads, including lower silicon rubber piece, upper silicon rubber piece and adhesive, the top of lower silicon rubber piece is connected with copper sheet by adhesive, the top of copper sheet is connected with steel mesh layer by adhesive, the top of steel mesh layer is connected to the bottom of upper silicon rubber piece by adhesive, silica gel piece, copper sheet, the outer end of steel mesh layer and upper silicon rubber piece is connected with iron hoop by adhesive, the utility model is by being connected with copper sheet and steel mesh layer by adhesive between lower silicon rubber piece and upper silicon rubber piece, and periphery is provided with iron hoop, pass through copper sheet, steel mesh layer and iron hoop can increase whole mechanical strength and shock resistance, and whole soften can be reduced, creep, the degree of stress relaxation, and copper sheet has good heating conduction, lower silicon rubber piece and upper silicon rubber piece can be cooperated, keep the heat-conductive characteristic of insulation spacer more prominent.

Description

A kind of heat-conducting pad
Technical field
The utility model relates to heat-conducting pad field, specifically a kind of heat-conducting pad.
Background technique
Along with the development of the assembling densification of integrated technology and microelectronics, heat caused by electronic equipment is also with increasing Add, in order to radiate to component, needs to attach heat-conducting pad on component, it is common at present to achieve the purpose that heat dissipation Heat-conducting pad be one layer of heat-conducting silica gel sheet, intensity is weaker, and shock resistance is poor, and with over time, and silica gel piece is easy There is gasket material and softening, creep, stress relaxation phenomenon occurs, mechanical strength such as can also decline at the situations, for this purpose, it is proposed that one Kind heat-conducting pad.
Utility model content
In view of the deficiencies of the prior art, the purpose of the utility model is to provide a kind of heat-conducting pad, the utility model passes through Copper sheet and steel mesh layer are connected with by adhesive between lower silicon rubber piece and upper silicon rubber piece, and periphery is provided with iron hoop, is passed through Copper sheet, steel mesh layer and iron hoop can increase whole mechanical strength and shock resistance, and can reduce it is whole occur softening, creep, The degree of stress relaxation, and copper sheet has good heating conduction, can cooperate lower silicon rubber piece and upper silicon rubber piece, make insulation spacer Heat-conductive characteristic is more prominent.
The technical scheme adopted by the utility model to solve the technical problem is as follows: a kind of heat-conducting pad, including lower silicon rubber piece, The top of upper silicon rubber piece and adhesive, the lower silicon rubber piece is connected with copper sheet by adhesive, and the top of the copper sheet passes through viscous Mixture is connected with steel mesh layer, and the top of the steel mesh layer is connected to the bottom of upper silicon rubber piece, the silica gel piece, copper by adhesive The outer end of piece, steel mesh layer and upper silicon rubber piece is connected with iron hoop by adhesive.
Further, described adhesive includes organosilicon joint sealant, is filled in the organosilicon joint sealant Aluminium oxide.
Further, heat collecting sheet and thermally conductive sheet are respectively equipped in the lower silicon rubber piece and upper silicon rubber piece.
Further, the bottom of the lower silicon rubber piece is equipped with the first convex block.
Further, the bottom of the copper sheet is equipped with the second convex block.
The beneficial effects of the utility model are:
1. the utility model is by being connected with copper sheet and steel mesh layer by adhesive between lower silicon rubber piece and upper silicon rubber piece, And periphery is provided with iron hoop, whole mechanical strength and shock resistance can be increased by copper sheet, steel mesh layer and iron hoop, and can Reduce it is whole occur softening, creep, stress relaxation degree, increase service life, and copper sheet is with good heating conduction, can Cooperate lower silicon rubber piece and upper silicon rubber piece, keeps the heat-conductive characteristic of insulation spacer more prominent.
2. the adhesive of the utility model is made of the aluminium oxide of organosilicon joint sealant and addition inside it, due to Aluminium oxide has outstanding heating conduction, can increase the heating conduction of adhesive.
Detailed description of the invention
Fig. 1 is the utility model structure diagram.
Fig. 2 is the utility model adhesive schematic diagram.
Description of symbols: 1 lower silicon rubber piece, 2 copper sheets, 3 steel mesh layers, 4 upper silicon rubber pieces, 5 iron hoops, 6 adhesives, 7 organosilicons Joint sealant, 8 aluminium oxide, 9 heat collecting sheets, 10 thermally conductive sheets, 11 first convex blocks, 12 second convex blocks.
Specific embodiment
The present invention will be further illustrated below in conjunction with specific embodiments, it should be appreciated that these embodiments are merely to illustrate this Utility model rather than limitation the scope of the utility model.In addition, it should also be understood that, in the content for having read the utility model instruction Later, those skilled in the art can make various changes or modifications the utility model, and such equivalent forms also fall within application The appended claims limited range.
It is the utility model structure diagram referring to Fig. 1 and Fig. 2, a kind of heat-conducting pad, including lower silicon rubber piece 1, upper silica gel The top of piece 4 and adhesive 6, lower silicon rubber piece 1 is connected with copper sheet 2 by adhesive 6, and copper sheet 2 is fine copper, the thermal coefficient of fine copper Top for 386.4w/ (m.k), copper sheet 2 is connected with steel mesh layer 3 by adhesive 6, can be increased by copper sheet 2 and steel mesh layer 3 Whole mechanical strength, the top of steel mesh layer 3 are connected to the bottom of upper silicon rubber piece 4, silica gel piece 1, copper sheet 2, steel by adhesive 6 The outer end of stratum reticulare 3 and upper silicon rubber piece 4 is connected with iron hoop 5 by adhesive 6, and iron hoop 5 can reduce lower silicon rubber piece 1 and upper silicon rubber piece 4 When lasting a long time, there is surface softening, creep, stress relaxation degree in lower silicon rubber piece 1 and upper silicon rubber piece 4.
Specifically, adhesive 6 includes organosilicon joint sealant 7, aluminium oxide is filled in organosilicon joint sealant 7 8, organosilicon joint sealant 7 is heat-conducting type viscose, and the time is long, and 7 hardness of organosilicon joint sealant becomes larger, and heat-conducting effect becomes Difference since aluminium oxide 8 has good thermal conductivity, and then can make up heat-conducting effect by aluminium oxide 8.
Specifically, being respectively equipped with heat collecting sheet 9 and thermally conductive sheet 10 in lower silicon rubber piece 1 and upper silicon rubber piece 4, pass through heat collecting sheet 9 It can accelerate the conduction of velocity of heat with thermally conductive sheet 10, increase heat dissipation effect.
Specifically, the bottom of lower silicon rubber piece 1 be equipped with the first convex block 11, the first convex block 11 be lower silicon rubber piece 1 one at Type structure can increase the contact area with component, receive more heat.
Specifically, the bottom of copper sheet 2 is equipped with the second convex block 12, the second convex block 12 is the integrated formed structure of copper sheet 2, the Two convex blocks 12 are embedded in the top of lower silicon rubber piece 1, for increasing by 2 being connected and fixed property of lower silicon rubber piece 1 and copper sheet.
When utility model works, the bottom of lower silicon rubber piece 1 is fixed on the surface of heat production original part, first device by adhesive 6 When part works, the heat of generation is conducted by lower silicon rubber piece 1, copper sheet 2, steel mesh layer 3 and upper silicon rubber piece 4, passes through heat collecting sheet 9 It can accelerate the conduction of velocity of heat with thermally conductive sheet 10, increase heat dissipation effect, copper sheet 2 and steel mesh layer 3 increase whole mechanical strength, Iron hoop 5 can reduce lower silicon rubber piece 1 and when upper silicon rubber piece 4 lasts a long time, and surface softening, compacted occur in lower silicon rubber piece 1 and upper silicon rubber piece 4 Become, stress relaxation degree.
The utility model by being connected with copper sheet and steel mesh layer by adhesive between lower silicon rubber piece and upper silicon rubber piece, and Periphery is provided with iron hoop, whole mechanical strength and shock resistance can be increased by copper sheet, steel mesh layer and iron hoop, and can subtract It is small it is whole occur softening, creep, stress relaxation degree, and copper sheet has good heating conduction, can cooperate lower silicon rubber piece with Upper silicon rubber piece keeps the heat-conductive characteristic of insulation spacer more prominent.

Claims (5)

1. a kind of heat-conducting pad, it is characterised in that: including lower silicon rubber piece, upper silicon rubber piece and adhesive, the top of the lower silicon rubber piece Portion is connected with copper sheet by adhesive, and the top of the copper sheet is connected with steel mesh layer, the top of the steel mesh layer by adhesive Be connected to the bottom of upper silicon rubber piece by adhesive, the silica gel piece, copper sheet, steel mesh layer and upper silicon rubber piece outer end pass through bonding Agent is connected with iron hoop.
2. a kind of heat-conducting pad according to claim 1, it is characterised in that: described adhesive includes organosilicon adhering and sealing Glue, the organosilicon joint sealant is interior to be filled with aluminium oxide.
3. a kind of heat-conducting pad according to claim 1, it is characterised in that: in the lower silicon rubber piece and upper silicon rubber piece respectively Equipped with heat collecting sheet and thermally conductive sheet.
4. a kind of heat-conducting pad according to claim 1, it is characterised in that: it is convex that the bottom of the lower silicon rubber piece is equipped with first Block.
5. a kind of heat-conducting pad according to claim 1, it is characterised in that: the bottom of the copper sheet is equipped with the second convex block.
CN201821637357.0U 2018-10-10 2018-10-10 A kind of heat-conducting pad Active CN209184928U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821637357.0U CN209184928U (en) 2018-10-10 2018-10-10 A kind of heat-conducting pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821637357.0U CN209184928U (en) 2018-10-10 2018-10-10 A kind of heat-conducting pad

Publications (1)

Publication Number Publication Date
CN209184928U true CN209184928U (en) 2019-07-30

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CN201821637357.0U Active CN209184928U (en) 2018-10-10 2018-10-10 A kind of heat-conducting pad

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112397245A (en) * 2020-09-29 2021-02-23 广东电网有限责任公司 Cable filler thermochromism color development device capable of developing color more quickly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112397245A (en) * 2020-09-29 2021-02-23 广东电网有限责任公司 Cable filler thermochromism color development device capable of developing color more quickly

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