CN211860937U - Composite structure heat conducting pad - Google Patents
Composite structure heat conducting pad Download PDFInfo
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- CN211860937U CN211860937U CN202020844008.7U CN202020844008U CN211860937U CN 211860937 U CN211860937 U CN 211860937U CN 202020844008 U CN202020844008 U CN 202020844008U CN 211860937 U CN211860937 U CN 211860937U
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- heat conduction
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- cushion layer
- heat
- conduction cushion
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Abstract
The utility model discloses a composite construction heat conduction pad, including the metal level, be stained with the heat conduction bed course on the upper surface of metal level, be stained with down the heat conduction bed course on the lower surface of metal level, be provided with the bond line on the upper surface of going up the heat conduction bed course and the lower surface of lower heat conduction bed course respectively, it has the silicon oil ply to adhere to on the surface of bond line. The utility model relates to a simple structure, connection structure is firm, composite construction heat conduction pad that heat conductivility is good.
Description
Technical Field
The utility model relates to a heat conduction pad field specifically is a composite construction heat conduction pad.
Background
The heat conducting pad is a heat conducting medium material synthesized by a special process, is also called a heat conducting silica gel pad, a heat conducting silica gel sheet, a soft heat conducting pad, a heat conducting silica gel gasket and the like in the industry, is specially produced by a design scheme of utilizing gaps to transfer heat, can fill the gaps, and can open a heat channel between a heating part and a radiating part to effectively improve the heat transfer efficiency, simultaneously has the effects of insulation, shock absorption, sealing and the like, can meet the design requirements of equipment miniaturization and ultra-thinness, and has the advantages of manufacturability, usability, wide thickness application range and excellent heat conducting filling material. However, the thermal conductivity of a single-material thermal pad decreases with increasing thickness, and therefore, a new composite-structure thermal pad is needed to overcome the above-mentioned drawbacks.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a composite construction heat conduction pad to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the composite structure heat-conducting pad comprises a metal layer, wherein an upper heat-conducting pad layer is adhered to the upper surface of the metal layer, a lower heat-conducting pad layer is adhered to the lower surface of the metal layer, bonding layers are respectively arranged on the upper surface of the upper heat-conducting pad layer and the lower surface of the lower heat-conducting pad layer, and a silicone oil paper layer is adhered to the outer surface of each bonding layer.
Preferably, be provided with the joint groove of cockscomb structure on the upper surface of metal level and the lower surface, go up the heat conduction bedding course and be provided with the joint piece of cockscomb structure on the surface of heat conduction bedding course orientation metal level down, joint groove and joint piece joint cooperation.
Preferably, a gap adhesive is filled between the clamping groove and the clamping block.
Preferably, be provided with buffer structure in last heat conduction bed course and the lower heat conduction bed course, buffer structure includes a set of horizontal align to grid's vertical buffer hole and a set of vertical align to grid's horizontal buffer hole.
Preferably, the surfaces of the peripheral side walls of the metal layer, the upper heat conducting cushion layer and the lower heat conducting cushion layer are connected with heat insulating layers.
Preferably, the heat insulation layer is fixedly connected with the side walls of the metal layer, the upper heat conduction cushion layer and the lower heat conduction cushion layer through lateral adhesives.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model adopts the composite structure of the metal layer, the upper heat conducting cushion layer and the lower heat conducting cushion layer, thereby not only improving the heat conductivity coefficient of the single heat conducting cushion layer, but also avoiding the defect of poor insulation of the metal heat conducting material; the adhesive layer is used when being adhered to the mounting part during mounting, and the silicone paper layer is used for protecting the adhesive layer. The joint groove and the joint block joint matched structure improve the connection strength between the metal layer and the upper heat conducting cushion layer and between the metal layer and the lower heat conducting cushion layer. The horizontal buffer holes and the longitudinal buffer holes are deformed when the heat conducting pad is pressed, so that the compression resistance of the heat conducting pad is improved. The heat insulating layer prevents heat from being dissipated from the side surface, and the accuracy of heat transfer is guaranteed. The utility model relates to a simple structure, connection structure is firm, composite construction heat conduction pad that heat conductivility is good.
Drawings
FIG. 1 is a schematic structural view of a composite-structured thermal pad;
fig. 2 is a partially enlarged view of fig. 1 at K.
In the figure: the heat-insulating layer comprises a metal layer 1, a clamping groove 2, a clamping block 3, an upper heat-conducting cushion layer 4, a lower heat-conducting cushion layer 5, a buffer structure 6, a longitudinal buffer hole 7, a transverse buffer hole 8, a heat-insulating layer 9, an interval adhesive 10, a lateral adhesive 11, an adhesive layer 12 and a silicone oil paper layer 13.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution:
the composite structure heat-conducting pad comprises a metal layer 1, wherein an upper heat-conducting pad layer 4 is adhered to the upper surface of the metal layer 1, a lower heat-conducting pad layer 5 is adhered to the lower surface of the metal layer 1, bonding layers 12 are respectively arranged on the upper surface of the upper heat-conducting pad layer 4 and the lower surface of the lower heat-conducting pad layer 5, and silicone oil paper layers 13 are adhered to the outer surfaces of the bonding layers 12.
The composite structure of the metal layer 1, the upper heat conducting cushion layer 4 and the lower heat conducting cushion layer 5 is adopted, so that the heat conducting coefficient of a single heat conducting cushion layer is improved, and the defect of poor insulation of metal heat conducting materials is avoided; the adhesive layer 12 is used when adhering to a mounting member at the time of mounting, and the silicone paper layer 13 is used to protect the adhesive layer 12.
Preferably, be provided with the joint groove 2 of cockscomb structure on the upper surface of metal level 1 and the lower surface, go up heat conduction cushion 4 and heat conduction cushion 5 down and be provided with the joint piece 3 of cockscomb structure on the surface towards metal level 1, joint groove 2 cooperates with the joint of joint piece 3 joint.
The joint groove 2 and the joint block 3 joint matched structure improves the connection strength between the metal layer 1 and the upper heat conducting cushion layer 4 and the lower heat conducting cushion layer 5.
Preferably, a gap adhesive 10 is filled between the clamping groove 2 and the clamping block 3.
The gap adhesive 10 is used to connect the metal layer 1 with the upper and lower thermal pad layers 4 and 5.
Preferably, a buffer structure 6 is arranged in the upper heat conduction cushion layer 4 and the lower heat conduction cushion layer 5, and the buffer structure 6 comprises a group of transverse buffer holes 7 which are transversely uniformly arranged and a group of transverse buffer holes 8 which are longitudinally uniformly arranged.
The heat conducting pad deforms when being pressed through the transverse buffer holes 8 and the longitudinal buffer holes 7, and the compression resistance of the heat conducting pad is improved.
Preferably, the metal layer 1, the upper heat conducting cushion layer 4 and the lower heat conducting cushion layer 5 are connected with a heat insulating layer 9 on the peripheral side wall surface.
The heat insulating layer 9 prevents heat from being dissipated from the side surface, and the accuracy of heat transfer is guaranteed.
Preferably, the thermal insulation layer 9 is fixedly connected with the side walls of the metal layer 1, the upper thermal conductive pad layer 4 and the lower thermal conductive pad layer 5 through a lateral adhesive 11.
The utility model discloses a theory of operation is: the composite structure of the metal layer 1, the upper heat conducting cushion layer 4 and the lower heat conducting cushion layer 5 is adopted, so that the heat conducting coefficient of a single heat conducting cushion layer is improved, and the defect of poor insulation of metal heat conducting materials is avoided; the adhesive layer 12 is used when adhering to a mounting member at the time of mounting, and the silicone paper layer 13 is used to protect the adhesive layer 12. The joint groove 2 and the joint block 3 joint matched structure improves the connection strength between the metal layer 1 and the upper heat conducting cushion layer 4 and the lower heat conducting cushion layer 5. The gap adhesive 10 is used to connect the metal layer 1 with the upper and lower thermal pad layers 4 and 5. The heat conducting pad deforms when being pressed through the transverse buffer holes 8 and the longitudinal buffer holes 7, and the compression resistance of the heat conducting pad is improved. The heat insulating layer 9 prevents heat from being dissipated from the side surface, and the accuracy of heat transfer is guaranteed. Lateral adhesive 11 is used to attach the insulation layer 9.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. A composite structure heat conduction pad, includes metal level (1), its characterized in that: an upper heat conduction cushion layer (4) is adhered to the upper surface of the metal layer (1), a lower heat conduction cushion layer (5) is adhered to the lower surface of the metal layer (1), adhesive layers (12) are respectively arranged on the upper surface of the upper heat conduction cushion layer (4) and the lower surface of the lower heat conduction cushion layer (5), and a silicone oil paper layer (13) is adhered to the outer surface of each adhesive layer (12).
2. A composite structural thermal pad according to claim 1, wherein: be provided with joint groove (2) of cockscomb structure on the upper surface and the lower surface of metal level (1), go up heat conduction bed course (4) and lower heat conduction bed course (5) and be provided with joint piece (3) of cockscomb structure on the surface towards metal level (1), joint groove (2) and joint piece (3) joint cooperation.
3. A composite structural thermal pad according to claim 2, wherein: and a gap adhesive (10) is filled between the clamping groove (2) and the clamping block (3).
4. A composite structural thermal pad according to claim 1, wherein: the heat conduction cushion is characterized in that a buffer structure (6) is arranged in the upper heat conduction cushion layer (4) and the lower heat conduction cushion layer (5), and the buffer structure (6) comprises a group of longitudinal buffer holes (7) which are transversely and uniformly arranged and a group of transverse buffer holes (8) which are longitudinally and uniformly arranged.
5. A composite structural thermal pad according to claim 1, wherein: and the surfaces of the peripheral side walls of the metal layer (1), the upper heat conduction cushion layer (4) and the lower heat conduction cushion layer (5) are connected with a heat insulation layer (9).
6. A composite structural thermal pad according to claim 5, wherein: the heat insulation layer (9) is fixedly connected with the side walls of the metal layer (1), the upper heat conduction cushion layer (4) and the lower heat conduction cushion layer (5) through lateral adhesives (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020844008.7U CN211860937U (en) | 2020-05-19 | 2020-05-19 | Composite structure heat conducting pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020844008.7U CN211860937U (en) | 2020-05-19 | 2020-05-19 | Composite structure heat conducting pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211860937U true CN211860937U (en) | 2020-11-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020844008.7U Active CN211860937U (en) | 2020-05-19 | 2020-05-19 | Composite structure heat conducting pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211860937U (en) |
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2020
- 2020-05-19 CN CN202020844008.7U patent/CN211860937U/en active Active
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