CN110283551A - A kind of graphene composite film of high thermal conductivity - Google Patents

A kind of graphene composite film of high thermal conductivity Download PDF

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Publication number
CN110283551A
CN110283551A CN201910467539.0A CN201910467539A CN110283551A CN 110283551 A CN110283551 A CN 110283551A CN 201910467539 A CN201910467539 A CN 201910467539A CN 110283551 A CN110283551 A CN 110283551A
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CN
China
Prior art keywords
layer
film
release film
component
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201910467539.0A
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Chinese (zh)
Inventor
不公告发明人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Xinluo Technology Co Ltd
Original Assignee
Shanghai Xinluo Technology Co Ltd
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Filing date
Publication date
Application filed by Shanghai Xinluo Technology Co Ltd filed Critical Shanghai Xinluo Technology Co Ltd
Priority to CN201910467539.0A priority Critical patent/CN110283551A/en
Publication of CN110283551A publication Critical patent/CN110283551A/en
Withdrawn legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention discloses a kind of graphene composite films of high thermal conductivity, including heat dissipation membrane body, which is characterized in that the thermally conductive membrane body successively includes release film, adhesive layer, buffer layer, heat dissipating layer and PET film layer from bottom to up;The release film is divided into the small release film of muti-piece by dotted line shape breakpoint;It is equipped between the release film and adhesive layer and easily tears component, it is described easily to tear component and the cohesive force of adhesive layer is stronger than the cohesive force for easily tearing component and release film;It is described easily to tear component at least one end and extend to outside adhesive layer.Structure of the invention is compact, it is easy to use, heat conduction and heat radiation film is pasted on heat generating components, it is thermally conductive using graphene, there is excellent heating conduction, simultaneously, it is equipped between release layer and adhesive layer and easily tears component, release layer is divided into multiple small release films compositions, in this way can accurate laminated film and fever original part bonding location and tear replacement.

Description

A kind of graphene composite film of high thermal conductivity
Technical field
The present invention relates to a kind of graphene composite films of high thermal conductivity.
Background technique
Currently, market portioned product carries out heat conduction and heat radiation, especially copper and aluminium by metal group material, but the weight of copper Greatly, oxidizable to limit its application, and the capacity of heat transmission of aluminium is difficult meet the needs of existing product is to heat conduction and heat radiation.And graphite Alkene is the carbon atomic layer of monoatomic thickness, and thinner thickness, rigid, heat transmitting is good, in terms of have it is good Good application prospect.Graphene processing film forming is come to electronic product heat radiation performance, and existing graphene heat dissipation film is using When, it is difficult meet the needs of to electronic product heat conduction and heat radiation, leading to existing graphene heat dissipation film, heat dissipation effect is not when in use It is good.Moreover, when current graphene film and heat generating components are viscous glutinous, be difficult it is accurately viscous bond to desired position, and it is viscous it is glutinous after Both ends are Nian Jie with heat generating components too tight, can be very troublesome when film, which goes wrong, to be needed to tear.
Summary of the invention
The purpose of the present invention is to solve the above the deficiencies in the prior art, provide a kind of graphene THIN COMPOSITE of high thermal conductivity Film is easy to paste and conveniently tears replacement.
The technical scheme adopted by the invention is as follows a kind of graphene composite film of high thermal conductivity, including heat dissipation membrane body, institute The thermally conductive membrane body stated successively includes release film, adhesive layer, buffer layer, heat dissipating layer and PET film layer from bottom to up;Described is release Film is divided into the small release film of muti-piece by dotted line shape breakpoint;It is equipped between the release film and adhesive layer and easily tears component, described is easy The cohesive force for tearing component and adhesive layer is stronger than the cohesive force for easily tearing component and release film;It is described easily to tear component at least one end and prolong It extends to outside adhesive layer.
Preferably, the heat dissipating layer is made of upper heat conduction silicone and lower heat conduction silicone, the upper heat conductive silica gel Layer lower surface is identical as lower heat conduction silicone surface structure, and equal spaced array is provided with protrusion and recess portion, Graphene powder filling Between the upper and lower heat conduction silicone.For the heat transfer of heat generating components to heat dissipating layer, heat dissipating layer has concaveconvex structure, recessed It is covered with graphene in male structure, increases the contact area of graphene, accelerates heat conduction and heat radiation.
Preferably, the recess portion is rectangular or trapezoidal, depth 5um-10um;It is led under upper heat conduction silicone lower surface Spacing distance between hot layer of silica gel upper surface is 20um-30um.
Preferably, the buffer layer is wavy copper foil.
Preferably, the quantity of the small release film is 4-5 block.
Preferably, the component that easily tears is linear or band-like.
The utility model has the advantages that
Structure of the invention is compact, easy to use, and release film is divided into the small release film of muti-piece by dotted line shape easy-torn line, in release layer It is equipped between adhesive layer and easily tears component, be not only readily susceptible to laminated film and the bonding of original part of generating heat in this way, but also be easy to tear replacement.
Detailed description of the invention
Fig. 1 is a kind of graphene composite film the schematic diagram of the section structure of high thermal conductivity.
Fig. 2 is the bottom view of release film.
2. buffer layer of 1.PET film layer, 3. heat dissipating layer, 4. adhesive layer 5. easily tears 6. release film of component
Specific embodiment
As shown in Figure 1, a kind of graphene composite film of high thermal conductivity, the thermally conductive membrane body successively include from bottom to up Release film 6, adhesive layer 4, waveform copper foil buffer layer 2, heat dissipating layer 3 and PET film layer 1;The release film is easily torn by dotted line shape Line is divided into the small release film of muti-piece, preferably 4-5 block;It is equipped between the release film and adhesive layer and easily tears component 5, it is preferably soft Material matter is linear or band-like;The cohesive force of the cohesive force than easily tearing component 5 Yu release film 6 for easily tearing component 5 Yu adhesive layer 4 By force;It is described easily to tear at least one end of component 5 and extend to outside adhesive layer 4, the heat dissipating layer 3 by upper heat conduction silicone and under lead Hot layer of silica gel composition, the upper heat conduction silicone lower surface is identical as lower heat conduction silicone surface structure, equal spaced array It is provided with protrusion and recess portion, Graphene powder is filled between the upper and lower heat conduction silicone, it is preferable that the recess portion is It is rectangular or trapezoidal, depth 5um-10um;Interval distance between upper heat conduction silicone lower surface and lower heat conduction silicone upper surface From for 20um-30um.
Working condition:
The release film is divided into the small release film of muti-piece by dotted line shape breakpoint, when stickup, can first remove it is one of it is small from Type film is held and easily tears component, after being accurately positioned accurately, then carries out corresponding stickup, then successively removes other small release films and carries out It pastes, preparation is facilitated to position, the deformation for the component that avoids being stuck;When the thermally conductive function of the heat dissipation of laminated film goes wrong needs more When changing, then it can pull straight up and easily tear component, can easily tear off film.
Structure of the invention is compact, easy to use, and the heat transfer of heat generating components is to heat dissipating layer, and heat dissipating layer is with concave-convex knot Structure, graphene are set in concaveconvex structure, increase the heat-conducting area of graphene, convenient for leading rapidly for graphene heat conduction and heat radiation film Heat and installation are stablized, and the purpose of heat dissipation can be rapidly achieved, and the copper foil for the undaform being in addition arranged above heat dissipating layer can be further Play thermally conductive and buffer function, strong applicability.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.

Claims (6)

1. a kind of graphene composite film of high thermal conductivity, including thermally conductive membrane body, which is characterized in that the thermally conductive membrane body from Under it is supreme successively include release film, adhesive layer, heat dissipating layer, buffer layer and PET film layer;The release film is by dotted line shape breakpoint point At the small release film of muti-piece;It is equipped between the release film and adhesive layer and easily tears component, described component and the adhesive layer of easily tearing Cohesive force is stronger than the cohesive force for easily tearing component and release film, described easily to tear component at least one end and extend to outside adhesive layer.
2. a kind of graphene composite film of high thermal conductivity according to claim 1, which is characterized in that the heat dissipating layer by Upper heat conduction silicone and lower heat conduction silicone composition, the upper heat conduction silicone lower surface and lower heat conduction silicone upper surface are tied Structure is identical, and equal spaced array is provided with protrusion and recess portion, and Graphene powder is filled between the upper and lower heat conduction silicone.
3. a kind of graphene composite film of high thermal conductivity according to claim 2, which is characterized in that the recess portion is side Shape is trapezoidal.
4. a kind of graphene composite film of high thermal conductivity according to claim 1, which is characterized in that the small release film Quantity be 4-5 block.
5. a kind of graphene composite film of high thermal conductivity according to claim 1, which is characterized in that the buffer layer is Wavy copper foil.
6. a kind of graphene composite film of high thermal conductivity according to claim 1, which is characterized in that described easily tears component It is linear or band-like.
CN201910467539.0A 2019-05-31 2019-05-31 A kind of graphene composite film of high thermal conductivity Withdrawn CN110283551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910467539.0A CN110283551A (en) 2019-05-31 2019-05-31 A kind of graphene composite film of high thermal conductivity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910467539.0A CN110283551A (en) 2019-05-31 2019-05-31 A kind of graphene composite film of high thermal conductivity

Publications (1)

Publication Number Publication Date
CN110283551A true CN110283551A (en) 2019-09-27

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CN201910467539.0A Withdrawn CN110283551A (en) 2019-05-31 2019-05-31 A kind of graphene composite film of high thermal conductivity

Country Status (1)

Country Link
CN (1) CN110283551A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113698885A (en) * 2021-09-01 2021-11-26 深圳市动盈先进材料有限公司 High-stability heat-conducting graphite film for signal transmission
CN116042187A (en) * 2022-12-30 2023-05-02 常州富烯科技股份有限公司 Flexible graphite composite heat conducting film and preparation method thereof
WO2023197380A1 (en) * 2022-04-12 2023-10-19 武汉华星光电半导体显示技术有限公司 Composite functional film, manufacturing method therefor, and display device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113698885A (en) * 2021-09-01 2021-11-26 深圳市动盈先进材料有限公司 High-stability heat-conducting graphite film for signal transmission
WO2023197380A1 (en) * 2022-04-12 2023-10-19 武汉华星光电半导体显示技术有限公司 Composite functional film, manufacturing method therefor, and display device
CN116042187A (en) * 2022-12-30 2023-05-02 常州富烯科技股份有限公司 Flexible graphite composite heat conducting film and preparation method thereof

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Application publication date: 20190927